TWI247827B - Electrolytic stripping agent for silver - Google Patents

Electrolytic stripping agent for silver Download PDF

Info

Publication number
TWI247827B
TWI247827B TW93103705A TW93103705A TWI247827B TW I247827 B TWI247827 B TW I247827B TW 93103705 A TW93103705 A TW 93103705A TW 93103705 A TW93103705 A TW 93103705A TW I247827 B TWI247827 B TW I247827B
Authority
TW
Taiwan
Prior art keywords
silver
peeling
acid
salt
stripping agent
Prior art date
Application number
TW93103705A
Other languages
Chinese (zh)
Other versions
TW200424367A (en
Inventor
Akihiro Aiba
Tomoharu Mimura
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200424367A publication Critical patent/TW200424367A/en
Application granted granted Critical
Publication of TWI247827B publication Critical patent/TWI247827B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00Electrolytic stripping of metallic layers or coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Detergent Compositions (AREA)

Abstract

This invention provides an electrolytic stripping agent for silver, which is a silver stripping agent of non-cyano series, with a long life, a highly side stripping ability, and can inhibit the unevenness occurring on the necessary silver side after silver stripping and the luster arising. An electrolytic stripping agent for silver of this invention comprises a hydantoin compound and aminocarboxylic acid or their salts as major ingredients. The preferable hydantoin compound are hydantoin, 5,5-dimethylhydantoin, 5,5-dimethylhydantoin-3-hydromethyl and allantoin, and preferable aminocarboxylic acid of their salts are aspartic acid, glutamic acid or their salts.

Description

1247827 玖、發明說明: 【發明所屬之技術領域】 本發明係關於銀之電解剝離劑,尤其是關於將鑛銀薄 膜之不要部分經電解剝離之理想銀電解剝離劑。 【先前技術】 非氰系之銀剝離劑揭示有琥珀醯亞胺、或酞醯亞胺 (例如參1日本專利特開平2_1〇4699號公報)、具有比 之5、6員環化合物(例如參照特開平2_175825號公報)、 2-m酮i緩酸(例如參照特開平6_4 i 8〇〇號公奸乙 内醯脲化合物(例如參照特開平7_243 i 〇〇號公報)等,而 前三者因在電解液中之分解激劇,因而消耗量大而且有 電解液之使用壽命短之問題。 另方面,乙内醯脲化 合物因在電鍍液中之分解少,消耗量少而為長壽命者, 但為了要提高生產性而以高電流密度進行銀剝離時,便 !=二需要部分的銀面上發生色斑以及光澤度易於升 為了解決該問題’在特開平9_491〇〇號( 29391 81號)公報中揭示: 在乂乙内鲶脲、氰尿酸等作為主 :成…鏟液中添加作為副成分之蝴系化合物,可使, 命長且在⑤電流密度中不會造成銀面的色斑。 ^ 【發明内容】 希堂銀剝離劑應用於導線架時,依目前的需求,則 希莫此長:南溢出於導魂&彳日I & 、 V線木側面不要部分之銀 以及將不要部分經銀剝離 此力 J雕J處理後旎抑制必要部分之 3] 5532修正本 1247827 &先澤度上升1著導線架的小型化,便有溢出側面之銀 ㈣成污染之原因的說法。而且’光澤度過高時,便有造 成引線接合時之影像識別的不良影響之說。 本發明係提供一種能滿足此等需要之銀電解剝離劑, :、目的係在非氰系之銀剝離劑中,提供一種壽命長、側面 剝離能力冑、且能抑制銀剝離劑後必要部分之銀色 的發生以及光澤度的升高者。 ' 本案發明人等經專心致志研究結果,發現藉由下述構 成之銀電解剝離劑便能解決上述問題。亦即,本發明係如 下所述者。 ’ (1) 一種銀電解剝離劑,係以乙内醯脲化合物與胺基羧 酸或其鹽為主要成分者。 (2) 如上述(1)之銀電解剝離劑,其中,上述胺基羧酸係 單胺基二繞酸者。 (3) 如上述(1)或(2)之銀電解剝離劑,其中,上述乙内 醯脲化合物係以5,5_二曱基乙内醯脲、3_羥曱基_5,5_二曱 基乙内醯脲、尿囊素或該等之鹽為其主要成分;上述胺基 羧酸或其鹽係以天冬胺酸、谷胺酸或該等之鹽為其主要成 分者。 本發明之銀電解剝離液係以乙内醯脲化合物與胺基羧 酸或其鹽為主要成分。#、因發現經使用乙内酿脲化合物則 電解液壽命變長,更經使用胺基羧酸或其鹽,則可提高不 要的鑛銀部分之剝離能力,並可抑制在剝離不要的鍍銀部 分後,其必要部分之鍍銀面之光澤度的提高以及色斑的產 3】5532修正本 1247827 生 【實施方式】 (發明貫施之最佳形態) 本發明之銀電解剝離劑之 合物,係以使用下列化學 要成分之-之乙内醯脲化 乙内醯脲、3-羥曱基_5〔:所不之乙内醯脲、5,5-二甲基 之鹽者為佳。鹽係鹽::二内酸脲、尿囊素或該等 風鉀鹽等為佳。 Η 乙内醯脲 h3c h3c 0’ 5, 5'1247827 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明[Prior Art] A non-cyanide-based silver stripper is disclosed as a succinimide or a quinone imine (for example, Japanese Patent Laid-Open Publication No. Hei. No. Hei. JP-A-2-175825), 2-m ketone i-acid (for example, refer to the serotonin 6_4 i 8 公 公 乙 醯 醯 化合物 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( , , , , , , , Because of the decomposition in the electrolyte, the consumption is large and the service life of the electrolyte is short. On the other hand, the carbendazole compound has a small decomposition in the plating solution and consumes less, which is a long life. However, in order to improve productivity, silver peeling is performed at a high current density, and it is necessary to have a color spot on the silver surface and a glossiness to be easily raised in order to solve the problem' in the special Kaiping 9_491 nickname (29391 81 No.) in the bulletin: In the 乂 鲶 鲶 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Color spots. ^ [Invention content] Xitang When the stripping agent is applied to the lead frame, according to the current demand, it is so long: the south overflows in the lead soul & the next day I &, the V-line wood side does not have part of the silver and the part will not be stripped by silver. After the carving J treatment, the necessary part of the suppression is 3] 5532 Correction 1247827 & first Zedu rise 1 The miniaturization of the lead frame, there is a saying that the silver on the side (four) is contaminated. And when the gloss is too high The present invention provides a silver electrolytic stripping agent that satisfies such needs, and aims to provide a long life in a non-cyanide silver stripper. The side peeling ability is 胄, and it is possible to suppress the occurrence of silver in the necessary portion after the silver stripping agent and the increase in gloss. The inventors of the present invention have found that the silver electrolytic stripping agent can be formed by the following. The above problem is solved. That is, the present invention is as follows. ' (1) A silver electrolytic stripping agent which is mainly composed of an intramethylene urea compound and an aminocarboxylic acid or a salt thereof. (1 And a silver electrolysis stripping agent according to the above (1) or (2), wherein the above-mentioned ethyl uret urea compound is a silver electrolysis stripping agent. Taking 5,5-dimercaptoindolide, 3-hydroxyindole-5,5-dimercaptoinouramide, allantoin or the salt thereof as a main component; the above aminocarboxylic acid or The salt of the present invention is mainly composed of aspartic acid, glutamic acid or the like. The silver electrolytic stripping solution of the present invention is mainly composed of an intramethylene urea compound and an aminocarboxylic acid or a salt thereof. Since it is found that the electrolyte life is prolonged by using the urea compound in the B, and the use of the aminocarboxylic acid or its salt, the exfoliation ability of the unnecessary ore portion can be improved, and the silver plating portion which is not peeled off can be suppressed. After that, the glossiness of the silver-plated surface of the necessary portion is improved and the color of the pigment is produced. 3,5532 Correction 1247827 [Embodiment] (The best form of the invention) The silver electrolytic stripper composition of the present invention, Is the use of the following chemical constituents - the internal carbamide carbendazim, 3-hydroxyindole _5 [: not the carbendazim Salt of 5,5-methyl is preferred. Salt salts: urea, allantoin or such potassium salts are preferred.乙 醯 内醯urea h3c h3c 0’ 5, 5'

Η Ν ^>=0 Η 曱基乙内醯脲 h3c H3C 0sΗ Ν ^>=0 曱 曱 乙 乙 h h h3c H3C 0s

Η Ν y=====^〇 ‘Ν’ h2n〇cnh、 Η CHjOH 3-羥曱基-5, 5-二曱基乙内Η Ν y=====^〇 ‘Ν’ h2n〇cnh, Η CHjOH 3-hydroxydecyl-5, 5-dimercapto-B

^=0 醯脲 尿囊素 該等成份在電解液中之濃度範圍為、至卿L,以 至尋為佳。濃度過低則易發生銀的鈍化;另一方面 濃度過局時則剝離劑(剝離液)有不易汲出的問題因而不 佳0 315532修正本 1247827 本發明之銀電解剥離劑之主^=0 醯Urea Allantoin The concentration of these components in the electrolyte range is as high as that of Zhiqing L. When the concentration is too low, silver passivation is liable to occur; on the other hand, when the concentration is too small, the stripping agent (peeling liquid) has a problem that it is difficult to be ejected, and thus it is not good. 0 315 532 Revision 1247827 The main body of the silver electrolytic stripping agent of the present invention

鹽、钟鹽為佳。 nh2 HOOC - CH2-6h-C〇〇h 天冬胺酸 nh2Salt and bell salt are preferred. Nh2 HOOC - CH2-6h-C〇〇h Aspartic acid nh2

HOOCH3H2-CH2-0h-COOH 谷胺酸 該等成份在電解液中之濃度範圍為1至5〇〇g/L,以5 至200g/L為佳。濃度過低則側面剝離能力以及抑制必要部 分之銀面上的色斑與光澤度的提高之效果較低;另一方 面,濃度過高時則效果飽和而不佳。 在本舍明之銀電解剝離劑中,更可因應必要而添加pH 緩衝劑、界面活性劑、銅變色防止劑、環氧防滲劑等。該 等之pH緩衝劑、界面活性劑、防銅變色劑、環氧防滲劑 等皆可使用所有習知者。 使用上述之剝離劑在規定的條件下進行銀的電解剝 離。剝離劑可經如氫氧化鈉等鹼金屬氫氧化物或鹼土金屬 氮氧化物等PH調整劑調整pH在7以上,最好成為9至 1 2。pH過低則剝離速度緩慢,在不要部分經剝離處理後之 必要部分的銀面上易於形成色斑,選擇剝離性差。另一方 面pH即便過高亦無好處。 又’本發明係以在銅、銅合金、如4 2合金之鐵-鎳合 金、不錢鋼、鎳合金等被處理物之各種金屬底材上經鍍銀、 8 315532修正本 1247827 烊銀而形成之銀薄膜為剥離對象。 士此#表面上形成銀薄膜的被處理物浸潰在如上述 經調整的電解剝㈣溶以,將㈣處理物料陽極進行 電解。陰極材質並無特別限制,但通f使用不銹鋼。電流 的雄度係相對於剝離銀之面積為〇 ]至5〇Α/-2,以〇5 至20 A/dm2為佳。電流密度過低則剝離速度缓慢,另—方 面’電流密度過高則銀易於引起鈍化,因而不佳。而且, 電解液溫度以在代以上為宜,最好在1〇至峨下進行電 ”電解液溫度過低則剝離速度缓慢,另一方面,過高時 、二n ~ ’夜不女疋而不i。另外,在電解中最好進行電解 ::Γ:好:其是在電流密度高時…不引起純化,授 并迷度取好加快。 吏被處理物之部分鍍銀薄膜被剝離劑溶液剝離時, L私用對亲,J _之必要部分的鐘銀薄膜施行遮罩處理, 對需要剝離的部位施行局部性浸潰之方法。而且,如 =部分之㈣薄膜报厚、與需要剝離之不要部分經同 理。2、釗離處理亦無影響的話,亦可將全體進行浸潰處 要 且將導線架料被處理物時,ϋ底架、導線等必 簿:::鍍銀膜报厚,@導線側面等不要部分之鍍銀膜較 電解制離,卩使必要部分之鑛銀部分*加遮罩而直接進行 —^ ,亦可以只剝離不要部分之鍍銀膜。 (貫施例) 、 以下依貫施例更詳細說明本發明。 實施例1至8、比較例〗至3 315532修正本 9 1247827 、裯衣如表1、1、表1 -2及表1-3所示組成之剝離溶液。 A木^ ‘使用鋼合金底材上全面直接鍵銅〇 · 〇 5 #瓜、並施以 局部鑛銀5 # m之28 _ s〇p型導線架,浸潰在上述剝離HOOCH3H2-CH2-0h-COOH Glutamine The concentration of these components in the electrolyte ranges from 1 to 5 〇〇g/L, preferably from 5 to 200 g/L. When the concentration is too low, the side peeling ability and the effect of suppressing the increase in color spots and gloss on the silver portion of the necessary portion are low; on the other hand, when the concentration is too high, the effect is not satisfactory. In the silver electrolytic stripper of the present invention, a pH buffer, a surfactant, a copper discoloration preventive agent, an epoxy anti-seepage agent, or the like may be added as necessary. Such pH buffers, surfactants, copper-blocking agents, epoxy barriers, and the like can be used by all of the above. Electrolytic stripping of silver was carried out under the specified conditions using the above-mentioned stripping agent. The release agent can be adjusted to have a pH of 7 or higher, preferably 9 to 12, by a pH adjusting agent such as an alkali metal hydroxide such as sodium hydroxide or an alkaline earth metal oxynitride. When the pH is too low, the peeling speed is slow, and it is easy to form a stain on the silver surface of a necessary portion after the portion is not subjected to the peeling treatment, and the peeling property is poorly selected. On the other hand, if the pH is too high, it is not good. Further, the present invention is based on copper, a copper alloy, a metal substrate such as an iron-nickel alloy such as a 4 2 alloy, a non-ferrous steel, a nickel alloy, or the like, which is silver plated, and 8 315 532 is used to modify the 1247827 silver. The formed silver film is a peeling object. The treated material on which the silver film is formed on the surface is impregnated in the electrolytic stripping (4) as described above, and the anode of the (4) treated material is electrolyzed. The cathode material is not particularly limited, but stainless steel is used. The maleity of the current is 〇] to 5〇Α/-2 with respect to the area of the stripped silver, preferably 〇5 to 20 A/dm2. If the current density is too low, the peeling speed is slow, and if the current density is too high, the silver is liable to cause passivation, which is not preferable. Further, the temperature of the electrolyte is preferably one or more, and it is preferable to carry out electricity at a temperature of 1 Torr to 峨. When the temperature of the electrolyte is too low, the peeling speed is slow. On the other hand, when the temperature is too high, the temperature is too high. In addition, it is preferable to carry out electrolysis in electrolysis:: Γ: good: when the current density is high... does not cause purification, and the degree of enlightenment is accelerated. 部分 Part of the silver-plated film of the treated object is stripped When the solution is peeled off, L privately applies masking to the silver film of the necessary part of the parent, J _, and performs a local impregnation method on the part to be peeled off. Moreover, if the film is thick, and the need is The part of the stripping is not the same. 2. If the disintegration treatment has no effect, the whole frame may be subjected to the impregnation and the lead frame is processed. The thickness of the film is reported, and the part of the wire is not partially electroplated, so that the necessary part of the silver part* is masked and directly carried out - ^, or only the part of the silver plated film can be peeled off. The present invention will be described in more detail in the following examples. 1 to 8, Comparative Example 〗 〖3 315532 Amendment 9 1247827, the peeling solution of the composition shown in Table 1, 1, Table 1-2 and Table 1-3. A wood ^ 'Use steel alloy substrate comprehensive Direct key copper 〇 · 〇 5 #瓜, and applied local mineral silver 5 # m of 28 _ s〇p type lead frame, impregnated in the above peeling

/合;文中在表丨、丨、表丨_2及表1 _3所示之剝離條件下進疒 電解剝離。 T 剝離後之試樣則如下述進行評估。 •銀面外觀以及底材面外觀·· 視以及_微鏡(X 5 0 )觀察色斑及缺點。如見不 到色斑及缺點則為良好。 •銀面光澤度: 以光澤度計(大日本screen DM-400)測定。數值愈大 絲員不光澤度愈向。銀剝離前之銀面光澤度為0.40。 •銀剝離速度: 經螢光X線膜厚計(精工電子工業SFT-3200)測定銀剝 離前後之鍍銀膜厚,求出銀剝離速度。 •側面剝離能力: 由# U鏡(X 5 〇)觀察側面之銀剝離狀態。側面之銀以 被剝離者為佳。 評估結果 示於表、表1-2及表1-3。 10 315532修正本 ,1247827/ 合; The article is subjected to electrolytic stripping under the peeling conditions shown in Table 丨, 丨, 丨_2 and Table 1 _3. The sample after T peeling was evaluated as follows. • Silver appearance and appearance of the substrate surface · · 视 and _ micro mirror (X 5 0) to observe the color spots and shortcomings. If you do not see the color spots and shortcomings, it is good. • Silver gloss: Determined by gloss meter (Greater Japan screen DM-400). The larger the value, the more the glossiness is. The silver gloss before silver peeling was 0.40. • Silver peeling speed: The silver plating film thickness before and after silver peeling was measured by a fluorescent X-ray film thickness meter (Seiko Electronics Industry SFT-3200) to determine the silver peeling speed. • Side peeling ability: The side silver peeling state was observed by #U mirror (X 5 〇). The silver on the side is preferably the one to be stripped. The evaluation results are shown in Table, Table 1-2 and Table 1-3. 10 315532 Amendment, 1247827

表 實施例 1 2 3 4 主成分1 乙内醯脲 二曱基乙内 3-羥曱基-5,5- 尿囊素 50g/L 醯脲40g/L 二甲基乙内 醯脲30g/L 20g/L 主成分2 天冬胺酸鈉 天冬胺酸鈉 天冬胺酸鈉 天冬胺酸鈉 50g/L 60g/L 7〇g/L 80g/L 電解液 組成 pH缓衝劑 - - 歸 硼酸 15g/L 界面活性劑 - - - 聚ll化乙烯壬 - - - 10mg/L 防銅變色劑 - - - 苯并三 - - - 〇坐 50mg/L 環氧防滲劑 - - - 十六烧硫醇 - - - 50mg/L PH 10.5 10.5 10.5 10.5 電流密度 (A/dm2) 10.0 10.0 10.0 10.0 剝離條件 浴溫(°C) 25 25 25 25 攪拌速度 (m/s) 0.5 0.5 0.5 0.5 時間⑻ 30 30 30 30 銀面外觀 良好 良好 良好 良好 銀面光澤度 0.41 0.38 0.36 0.34 底材面外觀 良好 良好 良好 良好 評估結果 銀剝離速度 (μ, m/min) 1.8 1.9 1.7 1.6 側面剝離能 力 良好 良好 良好 良好 銀剝離前之銀面光澤度為0.40(數值愈大光澤度愈高) 1] 315532修正本 、1247827Table Example 1 2 3 4 Main component 1 Intraquinoluridine dimercapto B 3-hydroxyindole-5,5-Allantoin 50 g/L guanidine 40 g/L Dimethyl carbendazim 30 g/L 20g/L main ingredient 2 sodium aspartate sodium aspartate sodium aspartate sodium aspartate 50g / L 60g / L 7〇g / L 80g / L electrolyte composition pH buffer - - return Boric acid 15g / L surfactant - - - Polycrystalline vinyl 壬 - - - 10mg / L copper color change agent - - - benzotriene - - - 〇 sitting 50mg / L epoxy anti-seepage agent - - - 16 burning Mercaptan - - - 50mg / L PH 10.5 10.5 10.5 10.5 Current density (A / dm2) 10.0 10.0 10.0 10.0 Stripping conditions Bath temperature (°C) 25 25 25 25 Stirring speed (m / s) 0.5 0.5 0.5 0.5 Time (8) 30 30 30 30 Silver appearance good and good Good good silver gloss 0.41 0.38 0.36 0.34 Good appearance of the substrate surface Good good evaluation results Silver peeling speed (μ, m/min) 1.8 1.9 1.7 1.6 Good side peeling ability Good good good good silver The silver gloss before peeling is 0.40 (the higher the value, the higher the gloss) 1] 315532 revision, 1247827

實之 包例 5 6 7 8 主成分1 乙内醯脲 二曱基乙内 3-羥曱基-5,5- 尿囊素 50g/L 醯脲40g/L 二曱基乙内 醯脲30g/L 20g/L 主成分2 谷胺酸鈉 谷胺酸鈉 谷胺酸鈉 谷胺酸鈉 50g/L 60g/L 7〇g/L 80g/L 電解液 組成 pH緩衝劑 - - 硼酸 15g/L 界面活性劑 - - - 聚氧化乙烯壬 ** - - 10mg/L 防銅變色劑 - - - 1,2,3-苯并三 - - - 〇坐 50mg/L 環氧防滲劑 - - • 月桂酸 - - - 50mg/L PH 10.5 10.5 10.5 10.5 電流密度 (A/dm2) 10.0 10.0 10.0 10.0 剝離條件 浴溫(°C) 25 25 25 25 攪拌速度 (m/s) 0.5 0.5 0.5 0.5 時間⑻ 30 30 30 30 銀面外觀 良好 良好 良好 良好 銀面光澤度 0.42 0.38 0.37 0.35 底材面外觀 良好 良好 良好 良好 評估結果 銀剝離速度 (// m/min) 1.8 1.9 1.7 1.6 側面剝離能 力 良好 良好 良好 良好 銀剝離前之銀面光澤度為0.40(數值愈大光澤度愈高) ]2 315532修正本 ,1247827Example 5 5 7 8 Ingredients 1 Intraquinoluridine Dimethyl Bine 3-hydroxyindolyl-5,5-Allantoin 50g/L Urea urea 40g/L Dimercaptoindolizine 30g/ L 20g/L Principal component 2 Sodium glutamate Sodium glutamate Sodium glutamate sodium glutamate 50g/L 60g/L 7〇g/L 80g/L Electrolyte composition pH buffer - Boric acid 15g/L interface Active agent - - - Polyoxyethylene 壬 ** - - 10mg / L copper-proof color changing agent - - - 1,2,3-benzotriene - - - 〇 sitting 50mg / L epoxy anti-seepage agent - - • lauric acid - - - 50mg/L PH 10.5 10.5 10.5 10.5 Current density (A/dm2) 10.0 10.0 10.0 10.0 Peeling condition Bath temperature (°C) 25 25 25 25 Stirring speed (m/s) 0.5 0.5 0.5 0.5 Time (8) 30 30 30 30 Silver surface is good and good Good good silver gloss 0.42 0.38 0.37 0.35 Good appearance of substrate surface Good good good evaluation result Silver peeling speed (// m/min) 1.8 1.9 1.7 1.6 Good side peeling ability Good good good before silver peeling The silver surface gloss is 0.40 (the higher the value, the higher the gloss)] 2 315532 revision, 1247827

比較例 1 2 3 電解液 組成 主成分1 琥珀醯亞胺 100g/L 二甲基乙内酷脲 100g/L 谷胺酸鈉 100g/L 主成分2 - - - pH緩衝劑 - - - 界面活性劑 - - - 防銅變色劑 - - - 環氧防滲劑 - - - 剝挺隹條件 PH 9.0 10.5 10.5 電流密度 (A/dm2) 10.0 10.0 10.0 浴溫(°C) 25 25 25 攪拌速度(m/s) 0.5 0.5 0.5 時間⑻ 30 30 30 5平估結果 銀面外觀 色斑 色斑 良好 銀面光澤度 0.45 0.66 0.44 底材面外觀 良好 良好 不良 銀剝離速度 (// m/min) 1.7 1.9 0.4 側面剝離能力 不良 不良 不良 銀剝離前之銀面光澤度為0.40(數值愈大光澤度愈高)Comparative Example 1 2 3 Electrolyte Composition Main Component 1 Amber succinimide 100 g/L Dimethyl acetyl carbamide 100 g/L Sodium glutamate 100 g/L Main component 2 - - - pH buffer - - - Surfactant - - - Anti-copper discoloration agent - - - Epoxy anti-seepage agent - - - Peeling off condition PH 9.0 10.5 10.5 Current density (A/dm2) 10.0 10.0 10.0 Bath temperature (°C) 25 25 25 Stirring speed (m/ s) 0.5 0.5 0.5 time (8) 30 30 30 5 flat evaluation result silver surface appearance stain spot color good silver surface gloss 0.45 0.66 0.44 good appearance of substrate surface good bad silver peeling speed (// m/min) 1.7 1.9 0.4 side Poor peeling ability, poor silver gloss before peeling is 0.40 (the higher the value, the higher the gloss)

以乙内醯脲化合物與胺基羧酸或其鹽為主要成分之本 發明之銀電解剝離劑,係壽命長、側面剝離能力高,且能 抑制銀剝離後之必要部分之銀面色斑的產生以及光澤度的 升高者。 (本案無圖式) 13 3] 5532修正本The silver electrolytic stripping agent of the present invention containing a uremium urea compound and an aminocarboxylic acid or a salt thereof as a main component has a long life, a high side peeling ability, and can suppress a silver stain of a necessary portion after silver peeling. Produced as well as elevated gloss. (There is no picture in this case) 13 3] 5532 amendment

Claims (1)

1247827 拾、申請專利範圍: •銀電解剝離用組成物,係以浴中濃度範圍為】至 5〇〇g/L之乙内醯脲及同樣濃度範圍為1至500g/L之胺 基羧酸或其鹽為主要成分,而pH為9至12者。 2·如申請專利範圍帛!項之銀電解剝離用組成物,其中, 上述胺基羧酸係單胺基二羧酸者。 3 ·如申凊專利® f 1項或第2項之銀電解剝離用組成 物,其中,上述乙内醯脲化合物係以乙内醯脲、二 甲基乙内酿脲、3·經曱基_5,5_二曱基乙内醯脲、尿囊素 或该等之鹽為主要成分,上述胺基叛酸或其鹽係以天冬 胺酸、谷胺酸或該等之鹽為主要成分者。 315532修正本 141247827 Pickup, patent application scope: • Silver electrolysis stripping composition, which is in the bath with a concentration range of 5 to 5 g/L, and an aminocarboxylic acid having the same concentration range of 1 to 500 g/L. Or its salt is the main component, and the pH is from 9 to 12. 2. If you apply for a patent range! The silver electroless stripping composition, wherein the aminocarboxylic acid monoamine dicarboxylic acid is used. 3. The composition for silver electrowinning of claim 1 or 2, wherein the above-mentioned carbendazim compound is urinyl urea, dimethyl eucommide, and ruthenium. _5,5_Dimercaptoin, allantoin or the salt as a main component, the above-mentioned amino acid or its salt is mainly aspartic acid, glutamic acid or the salt thereof Ingredients. 315532 Amendment 14
TW93103705A 2003-03-25 2004-02-17 Electrolytic stripping agent for silver TWI247827B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003082672 2003-03-25

Publications (2)

Publication Number Publication Date
TW200424367A TW200424367A (en) 2004-11-16
TWI247827B true TWI247827B (en) 2006-01-21

Family

ID=33094925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93103705A TWI247827B (en) 2003-03-25 2004-02-17 Electrolytic stripping agent for silver

Country Status (6)

Country Link
JP (1) JP4312201B2 (en)
KR (1) KR20050108413A (en)
CN (1) CN100580154C (en)
HK (1) HK1087158A1 (en)
TW (1) TWI247827B (en)
WO (1) WO2004085716A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104404611B (en) * 2014-11-28 2016-11-30 江门市瑞期精细化学工程有限公司 A kind of release agent for electrolytic of copper alloy surface coating and preparation method thereof
TWI755229B (en) * 2020-12-30 2022-02-11 力橋國際有限公司 Silver-plated layer electrolytically-stripping agent without cyanide, and method for electrolytically stripping silver-plated layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603800B2 (en) * 1994-03-08 1997-04-23 日本エレクトロプレイテイング・エンジニヤース株式会社 Silver electrolytic stripping solution and electrolytic stripping method using the same
JPH08337900A (en) * 1995-06-08 1996-12-24 N E Chemcat Corp Electrolytically stripping agent for silver
JPH1088398A (en) * 1996-09-11 1998-04-07 Okuno Chem Ind Co Ltd Electrolytic silver stripping agent, stripping solution and electrolytic stripping method
JP3225288B2 (en) * 1997-10-07 2001-11-05 奥野製薬工業株式会社 Silver electrolytic stripper

Also Published As

Publication number Publication date
CN100580154C (en) 2010-01-13
CN1761775A (en) 2006-04-19
TW200424367A (en) 2004-11-16
HK1087158A1 (en) 2006-10-06
KR20050108413A (en) 2005-11-16
WO2004085716A1 (en) 2004-10-07
JP4312201B2 (en) 2009-08-12
JPWO2004085716A1 (en) 2006-06-29

Similar Documents

Publication Publication Date Title
JP4249438B2 (en) Pyrophosphate bath for copper-tin alloy plating
JP2008291287A (en) Method for manufacturing copper-tin alloy plated product superior in continual-impact resistance
TWI385283B (en) Electrolytic copper-stripping liquid and electrolytic stripping method
JP4790191B2 (en) Electrolytic bath for electrochemical deposition of palladium or its alloys
TWI247827B (en) Electrolytic stripping agent for silver
CN113463148A (en) Method for electroplating gold on surface of titanium or titanium alloy substrate
JPH02104699A (en) Electrolytic peeling agent for silver and electrolytically peeling method
Blair Silver plating
FR2493349A1 (en) PROCESS FOR OBTAINING CORROSION-RESISTANT GOLD COATINGS ON A SUBSTRATE AND COATINGS OF GOLD HARDENED IN PARTICULAR BY COBALT
JP2010270374A (en) Copper-tin-zinc alloy electroplating bath, and method for producing alloy plating film using the same
JPH1088400A (en) Electrolytic silver stripping agent, stripping solution and electrolytic stripping method
JP5274817B2 (en) Copper-zinc alloy electroplating bath and plating method using the same
JP4447100B2 (en) Alkaline zinc and zinc alloy plating bath
JP3422595B2 (en) Zinc displacement bath for aluminum alloy
KR100251832B1 (en) Electrolytic desilvering agents and electrolytic desilvering method
JPH0350839B2 (en)
JPH1088399A (en) Electrolytic silver stripping agent, stripping solution and electrolytic stripping method
JP4480509B2 (en) Copper strike plating bath
CN111118559B (en) Composition for surface treatment of copper flexible connection
JPH1088398A (en) Electrolytic silver stripping agent, stripping solution and electrolytic stripping method
TWI755229B (en) Silver-plated layer electrolytically-stripping agent without cyanide, and method for electrolytically stripping silver-plated layer
JP3291386B2 (en) Silver plating bath
JPH10204697A (en) Electrochemical silver remover
JP2603800B2 (en) Silver electrolytic stripping solution and electrolytic stripping method using the same
JP2000345400A (en) Electrolytic peeling agent for silver and electrolytic peeling method therefor

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent