TWI246377B - Multilayer circuit board with high heat dissipation and manufacture method thereof - Google Patents

Abstract

A multilayer circuit board with high heat dissipation and manufacture method includes a substrate, a multilayer circuit structure and an electronic component. The multilayer circuit structure includes a plurality of combinations of insulation layers and circuit layers, which are laminated on the surface of the substrate. The circuit layers are attached to the surface of the insulation layers. The multilayer circuit structure includes a thermal via filled with thermal adhesive. The thermal via penetrates through the multilayer circuit structure to contact the substrate. The electronic component is connected to the opening of the thermal via on top of the circuit layer surface and contacts with the thermal via.

Description

1246377 V. Description of the invention (1) ^ -------- This: is about a kind of multilayer circuit board and its manufacturing method, especially about a kind of heat dissipation multilayer φ ^ ^. [Prior art] Xi 4 Road board and manufacturing method thereof.

Ik is gradually developing electronic products in the direction of high performance, high frequency, high speed and thinness. Under the design concept of "light, thin, short, small, and multifunctional", various electronic related parts such as central processing units (Cpu), chipset (Chipset), etc. are all researching and developing in the direction of high speed, multifunction, high power, and small size. As a result, the heat generated in the unit volume of the component is constantly increasing, and the heat dissipation problem of the component has become the key to improving the performance of the electronic component. Ann, circuit board is a good solution to increase the density of electronic components and circuits. The structure and manufacturing process of square-shaped multilayer circuit boards are usually based on a flat substrate 2 and then an adhesive layer or The insulating layer is a circuit layer. Alternatively, a first layer of metal circuit is formed on the substrate. Two μ1, ΐ = glue process, a plurality of circuit layers and an adhesive layer are added, and the multilayer printed circuit board is manufactured after processing. The relative density of the lines also leads to the problem of poor heat dissipation efficiency. The electric type: i! Needs air as the heat conduction medium. However, the policy of air conduction components has been reduced, and even the I circuit board with fewer components is more serious. In the development trend of multi-layer electrical packaging design, 0I-can not dissipate the heat of many sentences, it must be through the packaging design of the circuit. Therefore, in order to prevent the multilayer circuit board, the heat dissipation function is enhanced.

The 6th stomach accumulates, and the thermal conductivity 1246377 is produced. (2) ^ The circuit layer is a bonding layer. The method is to coat the thermal conductive adhesive to increase the amount of metal and substrate. This increases the manufacturing cost of the circuit board. [Summary of the Invention] To solve the problems of the known technology, the present invention provides a high heat dissipation circuit board and its manufacturer. Its purpose is to use the heat dissipation, design, and structure design of the 0-layer circuit board to effectively improve its heat dissipation properties and reduce the use of thermal conductivity and reduce manufacturing costs. The high heat dissipation multi-layer circuit board of the present invention includes a substrate, a multi-layer circuit structure, and an electronic component. The multilayer circuit structure includes a combination of a plurality of insulating layers = circuit layers stacked on the surface of the substrate. The t circuit layer is attached to the surface of the insulation layer and includes a heat conduction hole in the multilayer circuit structure, which penetrates the multilayer circuit structure to the substrate. Contact, the thermal conductive hole is filled with thermal conductive glue. The electronic component is connected to the opening of the conductive via on the top surface of the circuit layer and is in contact with the heat :: hole, which makes the electronic component operate, and the heat is conducted to the substrate through the heat conduction hole, so that the surface where the heat is dissipated is increased. . With the above structure, the manufacturing method of the layered circuit board of the present invention is first stacked on the surface of the substrate, and then a heat conduction hole is formed in a predetermined electro-perforation method; then the hole is connected to the topmost opening and connected to the heat conduction hole. contact. Or circuit layer, each circuit layer has another purpose in order to provide high heat dissipation, a plurality of joints between the insulation layer and the circuit layer group member, with a laser or thereafter, filled with a thermally conductive adhesive on the thermally conductive end The heat conduction hole on the surface of the circuit layer is to first provide a substrate and a plurality of reserved vias;

Page 7 1246377 V. Description of the invention (3) The layer is connected with the insulating adhesive layer ^^ | 4 Conducting each other to form a heat conduction hole ^^^ At the via hole of the circuit layer, it is in contact with the heat conduction hole ... The conduction on the surface of the road layer A hole is opened for t to understand the purpose, structural features and functions of the invention of i-step-by-step, and the diagram of the a is detailed as follows: [Embodiment] The college entrance examination order disclosed by the present invention provides a Xixi a ... Structure The design of the multi-layer circuit board of the multi-layer circuit board is based on the use of the substrate. The circuit cooling speed of the circuit board becomes faster, and the heat-conducting glue is reduced. The 2-layer circuit board structure is designed in accordance with the structure of the substrate. The combination of an insulating layer and a circuit layer uses the connection produced during operation. The heat provides the transfer wheel, ... to be comprehensive ten: = = followed by the base, the insulation layer and the circuit layer. Its characteristics are: conduction of the heat of electrons: pieces of heat to the entire substrate, increasing the surface area for heat dissipation by σ. The embodiment of the substrate structure design is disclosed as follows: Said: Figure 1 of the green reference process, which is a schematic cross-sectional view of the embodiment of the present invention: 'The integrated circuit chip is used as an electronic component. It mainly includes aluminum metal base = 0, multilayer circuit structure 20 and integrated circuit wafer 3Q. The multi-layer circuit #] 20 includes three insulating layers 2 stacked on the surface of the aluminum metal substrate 10. The combination of :: 22 'the circuit layer 22 is attached to the surface of the insulating layer ", and is in the :: I channel? F I :, contains a heat conduction hole 23, is connected to the multilayer circuit, and the structure 20 is up to the metal substrate 1Q Contact, the heat conduction hole 23 is filled into the guide

Page 8 1246377 V. Description of the invention (4) '= 2 The second one is connected to the opening of the heat transfer V hole 23 on the surface of the topmost circuit layer 22 and contacts the heat transfer hole. The design of the structure can make the integrated circuit chip 30 operate in a more convenient way, and the area of the circuit is increased, and the amount of thermal conductive adhesive is saved. Month, ^ Please refer to Figure 2 to Figure 4, which are schematic diagrams of the present invention. ^ The production process of column K on the 7th day of the month As shown in Figure 2, first, provide an aluminum gold insulation layer 2 1 and a circuit sound 2 2 into the & The multilayer circuit structure formed by the Yu Ming metal substrate Π) Π group is shown in Figure 3, and a multilayer circuit is formed through a predetermined integrated electric and radiation method. 2 η ># 日 日 口 处 ， ® ® q The heat conduction hole 23 of the private road and the village gate structure 20. As shown in Figure 4, fill in the thermally conductive adhesive 23 to connect the topmost circuit layer 22 to the top metal circuit, and the body circuit chip 30 to the topmost circuit;] :: Value: Place the opening of the product and attach it to the 埶 conduction 丨The heat transfer ν hole 23 W μ Β on the surface of θ 22 forms the structure as shown in FIG. 1. It becomes a thermal contact hole, and then the circuit layer is pre-fitted with a V through hole and then connected to the process to produce insulation adhesion: ί: process, so that the circuit layer is through the glued thermal contact hole pair; 妾 2; -Steps such as circuit layer and bonding integrated circuit wafers.仃 Fill the thermal contact hole in the thermal contact hole "^ =: 明 3; ^ disclosed as mentioned above, but it is not within the spirit and scope, when: Π 蛰, without departing from the present invention And retouching, so this invention

* 9 pages of 1246377

Page ίο 1246377 Brief description of drawings Figure 1 is a schematic sectional view of the structure of the embodiment of the present invention; and Figure 2 to 4 are schematic diagrams of the manufacturing process of the embodiment of the present invention.

Page 11 [Explanation of Symbols] 10 Aluminum Metal Substrate 20 Multi-layer Circuit Structure 21 Insulation Layer 22 Circuit Layer 23 Thermally Conductive Hole 24 Conductive Gel 30 Integrated Circuit Chip

Claims (1)

1246377 VI. Application Patent Scope 1. A high-heat-dissipation multilayer circuit board comprising: a substrate; a multilayer circuit structure containing a combination of a plurality of insulating layers and circuit layers, each of which is attached to each of the insulation Layer surface, the combination of the insulating layer and the circuit layer is further stacked on the substrate. The multilayer circuit structure includes a heat conduction hole that penetrates the multilayer circuit structure until it contacts the substrate. The heat conduction hole is filled with a heat conduction. Glue; and an electronic component 'are connected to the opening of the heat conduction hole on the topmost surface of the circuit layer and contact the heat conduction hole, so that the heat emitted by the electronic component during operation is guided to the heat conduction hole through the heat conduction hole. Substrate. 2. The high heat dissipation multi-layer circuit board as described in item 1 of the scope of patent application, wherein the substrate is a metal substrate. 3. The high-heat-dissipation multilayer circuit board as described in item 1 of the scope of patent application, wherein the electronic component is an integrated circuit chip. 4. A method for manufacturing a high-heat-dissipation multilayer circuit board, comprising the steps of: providing a substrate; and stacking a multilayer circuit structure on the surface of the substrate, the multilayer circuit structure including a combination of a plurality of insulating layers and circuit layers, each of which The circuit layer is attached to the surface of each of the insulating layers; a heat conduction hole penetrating through the multilayer circuit structure is formed from a predetermined one of the electronic component junctions on the surface of the circuit layer at the top of the multilayer circuit structure; a thermally conductive adhesive is filled in the Heat conduction hole; and connecting the electronic component to the joint of the electronic component so that the electron Page 12 1246377, patent scope of Shenyan All parts are in contact with the heat conduction hole. 5. The high heat dissipation manufacturing method as described in item 4 of the scope of patent application, wherein the substrate is a metal substrate. Circuit board manufacturing system • The southern heat dissipation method as described in item 4 of Shenqiao's patent scope, wherein the electronic component is a integrated circuit chip ^ circuit board system 7 • As described in item 4 of the scope of patent application A high-heat-dissipation manufacturing method, wherein the step of forming the H-circuit board through the multilayer circuit is to form one of the heat-conducting heat-conducting holes 8 through laser perforation. A substrate is provided. The steps include: providing a plurality of circuit layers, each circuit layer containing and once connecting each of the circuit layers with two through-holes with insulating adhesive chips, and sub-conducting the conduction of each of the circuit layers. The holes are electrically connected to each other; a thermally conductive adhesive is filled in the thermally conductive hole on the base plate; and an electronic component is connected to the topmost hole of the electrical hole so that the electronic component and the thermally conductive hole are connected to each other on the surface 9 · The high heat dissipation as described in item 8 of the scope of patent application ". The manufacturing method, wherein the substrate is a heterometallic substrate. Θ t circuit board manufacturing I 〇 The high heat dissipation manufacturing method as described in item 8 of the patent application scope, wherein the electronic component is a integrated circuit chip. Circuit board system II · The high heat dissipation / dry method as described in item 8 of the scope of patent application, wherein the step of making each circuit layer on the substrate with an insulating circuit board is The adhesive layer is then bonded to the substrate through a gluing process. Connected to this circuit layer page 13