1245903 五、發明說明u) 本發明係有關於，^種具有晶圓採針之測试糸統及其 顯微對準方法。 發明背景 第1圖係概要地顯示測試系統的主要部位之剖面圖 式。如第1圖所示，已知的測試系統的主要部分包括：一 平台（X-Y table)10、一馬達11、一 夾治具（chuck)12、一 可旋轉測試裝置（rotatable test head)13、一探針卡 (probe card)15以及一對準機構16。 於半導體製程中，當晶圓W完成製造但是尚未切割成 個別晶片（d i e )之前，一般係利用此測試系統來測試晶 圓。進一步，評估晶圓上的各晶片之功能是否正常。 根據第1圖所示，當晶圓完成製造後，晶圓W藉由上述1245903 V. Description of the invention u) The present invention relates to ^ a test system with a wafer picking needle and its micro-alignment method. BACKGROUND OF THE INVENTION Fig. 1 is a cross-sectional view schematically showing a main part of a test system. As shown in Figure 1, the main parts of the known test system include: a table (XY table) 10, a motor 11, a chuck 12, a rotatable test head 13, A probe card 15 and an alignment mechanism 16. In the semiconductor process, before the wafer W is completed but not cut into individual wafers (d i e), this test system is generally used to test the wafer. Further, evaluate whether the function of each wafer on the wafer is normal. As shown in Figure 1, after the wafer is manufactured,
夾治具1 2承載，並設置於上述平台丨〇上。藉由上述馬達i J 及轉動機構（未顯示）改變上述平台1〇 ΚΧ_Υ座標上的位 ，，使侍晶圓W亦可以於χ-γ方向移動及轉動。此外，測試 系統亦可以調整晶圓w '承載晶圓之夾治具丨2及平台丨〇於2 方向上的位置；再藉由上述對準機構丨6使得設置於上述可 旋轉測試裝置13的探針卡15與晶圓w調整至適當位置進行 測試。 目前若要使用顯微裝置觀察晶圓表面的晶片，則需要 將晶圓自測試系統中；^ i μ $ τ凡甲取出再放置於顯微裝置觀察。然 而，此過程耗費時問γ φ 土 不買于間興人力，再者，亦容易污染晶圓。 發明概要 有4α於此’為了改進昔知技術的缺點及其所遭遇的困The jigs 12 are carried on the platform 〇. By the above motor i J and the rotation mechanism (not shown), the position on the platform 10 KK_Υ coordinate is changed, so that the wafer W can also move and rotate in the χ-γ direction. In addition, the test system can also adjust the position of the wafer w 'wafer holding fixture 丨 2 and the platform 丨 0 in the direction of 2; and then the above-mentioned alignment mechanism 丨 6 is provided to the rotatable test device 13 The probe card 15 and the wafer w are adjusted to appropriate positions for testing. At present, if a microscopic device is used to observe the wafer on the wafer surface, the wafer needs to be self-tested in the system; ^ i μ $ τ Fan Jia is taken out and placed in the microscopic device for observation. However, this process takes time to ask for γ φ soil. It is not bought by Xingxing labor, and it is easy to contaminate the wafer. SUMMARY OF THE INVENTION There are 4α here ’in order to improve the shortcomings of the prior art and its difficulties
第4頁 1245903 五、發明說明（2) 難，本發明之 統，其中，此 統，可以探針 根據上迷 台、一馬達、 一對準機構、 藉由定位臂與 之間的相對足巨 觀察晶圓上白勺 本發明之 裝置連接，且 機構包括一攝 裝置及夾治具 本發明之 由一GPIB介 央處理裝置控 根據上迷 治具與指標之 之間的距離C3 根據上迷 微對準方法包 试裝置上且將 裝置之物鏡與 測得此攝像| 面 目的在 _試系 剛試或 目的， 一夾治 一定位 可旋轉 離可藉 晶片之 一特徵 顯微裝 像裝置 上。 另一特 與此測 制此測 特徵， 間的距 於提出 統更包 以顯微 具有晶 具、一 臂以及 測試裝 由對準 顯微影 在於， 置與此 與一指 徵在於 試系統 試系統 當設置 離時， 一種具有 括—顯微 裝置觀察 圓探針之 可旋轉測 一顯微裝 置連接， 機構獲得 像。 上述定位 定位臂固 標，且分 ’更包括 電性連接 〇 於夾治具 同時可換 晶圓探針之測試系 裝置。藉由此測試系 晶圓上的晶片。 測試系統包括：一平 試裝置、一探針卡、 置。其中，顯微裝置 使得顯微裝置與晶圓 進 步，可清楚的 目的與特徵， 括下列步驟： 暴貝微裝置固 〜指標之間的 置與指標之間 臂與上述可旋轉測試 定；牝外，上述對準 別設置於可旋轉測試 一中央處理骏置，藉 。進一步，可藉由中 亡的攝像裝置獲得夾 算得顯微裝置與晶圓 板針之測試系統的顯 《固定於一可旋轉測 位臂上；獲得此顯微 丄藉由一攝像裝置量 藉由一中央處理系統 具有晶圓 將一定位 定於此定 相對距離 的距離；Page 4 1245903 V. Description of the invention (2) Difficult, the system of the present invention, in which, the system can probe according to the upper platform, a motor, an alignment mechanism, the relative foot giant between the positioning arm and the Observe the connection of the device of the present invention on a wafer, and the mechanism includes a camera and a fixture. The GPIB central processing device of the present invention controls the distance between the fixture and the index based on the C3. The quasi-method includes a test device and the objective lens of the device and the measurement of the camera. The purpose is just to test or aim, one clamp and one position can be rotated away from one of the features of the loanable microscopic imaging device. Another special feature of this test system is the distance between the proposed system and the microscope, which has a crystal, an arm, and a test device. When the system is set off, a rotatable micro-device with a micro-device observation circle probe is connected, and the mechanism obtains an image. The above positioning positioning arm is fixed, and it also includes a test system that is electrically connected to the fixture and the wafer probe can be changed at the same time. By this test the wafer on the wafer. The test system includes: a test device, a probe card, and a test device. Among them, the microscopic device enables the microscopic device and the wafer to progress, and the purpose and characteristics can be clearly defined, including the following steps: The microbeam device is fixed to the index and the index arm is rotatable with the above-mentioned rotatable test; The above-mentioned alignment is set in a central processing unit that can be rotated for testing, and borrowed. Further, the display of the test system of the microscope device and the wafer pin can be obtained by the dead camera device and fixed on a rotatable positioning arm; this microscope can be obtained by a camera device and a The central processing system has a distance at which the wafer is positioned at this fixed relative distance;
0532-7640twf(n) ； pt.apl〇3 ； Jasper.ptd 第5頁 1245903 五、發明說明（3) 汁^r日日圓與顯微裝置之間的距離，以便獲得最佳距離以顯 微裝置觀察晶圓。 ^ …本毛明之一優點在於，藉由使用此具有晶圓探針之測 試系統’可以探針測試或以顯微裝置觀察晶圓上的晶片。 進一步^ s可避免晶圓被污損。 本毛明之另—優點在於，藉由使用此具有晶圓探針之 測試系統，可以獲得顯微裝置與晶圓之間的距離。進— 步’於觀察晶圓時，可避免晶圓與顯微裝置碰撞。 實施例說明： 第2圖係根據本發明之實施例，概要地顯示一具有晶 ，採針之測試系統。如第2圖所示，此測試系統之測試腔 室内具有一平台1 0，其與一馬達11耦接以便將此平台丨〇於 X,、J、Z方向移動。一夾治具12設置於此平台1〇上，與此、 平台1 〇 一同移動；此外，此夾治具1 2係用以承載一曰、 ¥。一可旋轉測試裝置1 3與此平台1 0相對設置； 可旋轉測試裝置13上’設置一探針卡15。此外 明4 測試系統具有—對準機構17，且此 毛月之 失治具12與探針卡15之間的相對位】丰用以量測 一攝像裝置（Camera)171與一指標172，^準機構17包括 安裝於夾治具1 2以及指標1 72安裂於/、中攝像裝置1 71 上。 於了疑轉測試裝置13 再者，如第2圖所示，此測試系 1 8，藉由一定位臂丨9與上述可旋轉測壯括一顯微裝置 微裝置1 8係以高放大倍率，例如〜千j衣置1 3連接。此顯 倍玫大倍率，觀察設0532-7640twf (n); pt.apl03; Jasper.ptd page 5 1245903 V. Description of the invention (3) The distance between the Japanese yen and the microscopic device in order to obtain the optimal distance to the microscopic device Observe the wafer. ^… One of the advantages of Ben Maoming is that by using this test system with a wafer probe, it is possible to probe the wafer or observe the wafer on the wafer with a microscopic device. Further ^ s can prevent the wafer from being contaminated. This Maoming has another advantage: By using this test system with a wafer probe, the distance between the microscopic device and the wafer can be obtained. Further, when the wafer is observed, collision between the wafer and the microscopic device can be avoided. Description of the embodiment: Fig. 2 is a schematic view showing a test system with crystals and needles according to an embodiment of the present invention. As shown in Figure 2, the test chamber of the test system has a platform 10, which is coupled to a motor 11 to move the platform in the X, J, and Z directions. A clamp 12 is set on the platform 10, and moves with the platform 10; In addition, the clamp 12 is used to carry a ¥, ¥. A rotatable test device 13 is disposed opposite to the platform 10; a probe card 15 is provided on the rotatable test device 13 '. In addition, the Ming 4 test system has an alignment mechanism 17 and the relative position between the Mao Yue's fixture 12 and the probe card 15] Feng is used to measure a camera 171 and an index 172, ^ The quasi-mechanism 17 includes a fixture 12 and an index 1 72 mounted on the middle camera device 71. The test device 13 is suspected. Furthermore, as shown in Fig. 2, this test system is 18, with a positioning arm, 9 and the above rotatable measurement, a micro-device, micro-device, 18 series with high magnification. For example, ~ 1000 j 衣 置 1 3 connections. This display doubles the magnification, observes the design
1245903 五、發明說明（4) 置於夾治具1 2上的一曰 由-GPIB介面2〇與：二一之表面。此外，此測試系統藉 中央處理系統2 1控制;、十、一中央處理系統2 1連接。藉由此 控制上述可旋轉測試,4二台10於X、Y、Z方向移動以及 針卡15可探測晶圓w表衣 轉^與移動；進—步，使得探 第3圖係根據本發明：：,測位置處的晶片。 機構對準顯微裝置。\ _貝靶例，概要地顯示利用對準 端與上述指』Γ;2置之一如端弟所示，此顯微裝置之物鏡 外，此顯微裝置18利用一 爲是里DZ。此 旋轉測試裝置1 3上 ^ 口疋於此測試系統之可 習知技術：i匕構=明與習知技術另一不同處在於， 對準機構1 7係使用一攝傻^個攝像襄置’然而本發明之 I用攝像裝置171與一指標172。 其料與；測攝像裝置，使 由中央處理系统控制上^ Γ 此外，同時藉 X、Υ、ζ方Θ &叙工 述馬達，以便將夾治具與晶圓於 方向移動。於本發明之實施 糸統透過GPIB介面，抑fli B m # 稭由中央處理 進一步， 曰曰囫與指標之間的距離及位置； 此，顯二ΐ 顯微裝置之間的距離及位置。因 片，= ί距處清晰地觀察晶圓表面上的晶 .、、、貝极裝置不會碰觸晶圓表面之晶片。 以限Si:明：厂較佳實施例揭露如1，然其並非用 乂丨艮疋本發明，任何熟 神和範圍，當可作歧許之更輪在不脫離本發明之精 鉻ifl A# 一 f之更動與潤飾，因此本發明之伴鳟 耗圍當視後附之申請專利範圍所界定者為準μ月之保4 1245903 圖式簡早說明 為讓本發明之上述目的、特徵、和優點能更明顯易 懂，下文特舉一實施例，並配合附加圖式，作詳細說明如 下： 第1圖係概要地顯示測試系統的主要部位之剖面圖 式； 第2圖係根據本發明之實施例，概要地顯示一具有晶 圓探針之測試系統； 第3圖係根據本發明之實施例，概要地顯示利用對準 機構對準顯微裝置。 符號說明 10〜平台； 1 1〜馬達； 1 2〜夾治具； 1 3〜可旋轉測試裝置； 1 5〜探針卡； 1 6、1 7〜對準機構； 1 7 1〜攝像裝置； 1 7 2〜指標； 1 8〜顯微裝置； 1 9〜定位臂； 20〜GPIB介面； 2 1〜中央處理系統。1245903 V. Description of the invention (4) The one placed on the jig 12 is -GPIB interface 20 and the surface of two one. In addition, this test system is controlled by the central processing system 21; 10, a central processing system 21 is connected. By controlling the above-mentioned rotatable test, four or two sets of 10 are moved in the X, Y, and Z directions, and the pin card 15 can detect the rotation and movement of the wafer and the watch; further, the third picture is made according to the present invention. ::, Wafer at the measurement position. The mechanism is aligned with the microscopy device. \ _ Shell target example, the outline shows the use of the alignment end and the above-mentioned finger "Γ; 2 set as shown in Duandi, outside the objective lens of this microscope, this microscope device 18 is a DZ. The rotating test device 13 is ^ known about the known technology of this test system: i = structure = another difference between the known technology and the conventional technology is that the alignment mechanism 17 uses a camera to set up a camera 'However, the imaging device 171 and an index 172 of the present invention. The camera device is controlled by the central processing system. In addition, the X, Υ, and ζ side Θ & description motors are used to move the clamp and the wafer in the same direction. In the implementation of the present invention, through the GPIB interface, the fli B m # straw is processed centrally. Further, the distance and position between the target and the indicator are displayed. Therefore, the distance and position between the two microscopic devices are displayed. Because of the wafer, = Clearly observe the crystals on the wafer surface at a distance, and the pole device will not touch the wafer on the wafer surface. To limit Si: Ming: The preferred embodiment of the factory is disclosed as 1, but it is not used in the present invention. Any familiarity and scope can be changed without departing from the fine chromium of the present invention ifl A # The changes and retouching of the f, therefore, the consumption of the trout of the present invention shall be determined by the scope of the appended patents as defined in the following. The month is guaranteed. 4 1245903 Schematic illustrations are provided for the purpose, characteristics, and The advantages can be more obvious and easy to understand. An example is given below in conjunction with additional drawings, which are described in detail as follows: Fig. 1 is a cross-sectional view schematically showing the main parts of the test system; Fig. 2 is a diagram according to the present invention. In the embodiment, a test system with a wafer probe is shown in outline; FIG. 3 is a diagram showing the alignment of a micro-device with an alignment mechanism according to an embodiment of the present invention. Symbol description 10 ~ platform; 1 1 ~ motor; 1 2 ~ clamp; 1 3 ~ rotatable test device; 15 ~ probe card; 16、17 ~ alignment mechanism; 7 1 ~ camera device; 1 7 2 ~ indicator; 1 8 ~ microscope device; 19 ~ positioning arm; 20 ~ GPIB interface; 2 1 ~ central processing system.
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