TWI243397B - Process for improving electrode surface reliability - Google Patents

Abstract

This invention provides a process for improving electrode surface reliability of stack-typed electronic device. It includes the steps of: making a base body; making an insulated coating layer on the base body; making electrodes of two sides; and making the plating and soldering interface. By using nanoscale insulated sealing material to coat the six faces of the device body at a time to form an insulated coating layer, the insulated impedance of stack-typed electronic device can be increased. Furthermore, it can promote the reliability of the electrode surface. It can uniformly adhere to the device body surface by coating six faces of the base body and using high temperature sintering. It can solve the material limitation problem of device body as well as simplify the traditional machining process of device surface, thus saving the cost of special materials used for the electrode faces. The special device material body can promote the surface insulated impedance characteristics by using nanoscale insulated refined sealing material with high insulated impedance characteristics. It can also carry out electroplating process to increase the reliability and the applications of the electrode faces. Therefore, the cost of machining equipment and the consumption for special electrode materials can be reduced.

Description

1243397 V. Description of the invention (1) [Technical Field of Development] It refers to the invention of a multi-layer type lightning: product: manufacturing method of electronic components, especially. Method for improving the reliability of the electrode end face of the conventional electronic element f [prior art] At present 3 Q t should be used for all electronics and electricity. Seeing the booming trend and application, in order to have electronic components and to move towards Donu, there is no doubt that there is no consideration of space and scope, so two: ,, Xiandiankushi :: Two are more Huge and occupying space. And laminated electronics ::: electrical port = the main electronic components produced by the development of ":": == because of the former production: sensor, oxidized metal rheostat, thermistor · .., etc., can be used in a wide range of products It is easy to find that also ./4 Under the promotion and innovation of the eyes, such as the appearance of Shi Xiang from the Emperor 2 to produce a large number of products with continuous W functions. The electronic components of 1 are bound to be used in electronic equipment and metal production. For example, pin-type capacitors, resistors, oxidation leads, a negative (positive) temperature coefficient thermistors, etc., all need to be complicated. In addition, in addition to the production of laminated electronic components with relatively high manufacturing processes, such helmets are similar. In addition to similar helmets, the production volume and cost can also be relatively important. They will become the main force of the downstream electronics market. Of-. Low * is bound to be a material. The body material of such laminated components is nothing more than ceramic materials, gold oxide, etc. See the description of the manufacturing method of laminated electronic components below.

93〇329.PTD Page 5 1243397 V. Description of the invention (2) is as follows: The laminated electronic components made of the material of the main body, such laminated electric components (such as capacitor ULCC), resistance, inductance, etc., such as The first figure to Lei Suo, the laminated electronic component is composed of the body 10, the internal electrode Η, the end of the fresh wood 1 η Γ, and the fresh interface 13, and the manufacturing method is based on the internal electrode 11 ^ , And then completed by high temperature sintering, directly attached to the terminal electrode interface and then fast high temperature sintering to form the terminal electrode 丨 2, and then use the terminal electrode to form a ceramic welding interface project to form a power mineral welding interface 13 to complete the Tao Jing body Laminated electronic component components made of materials ★ φ2 · Laminated electronic components made of oxidized metal body material, this laminated 'sub-components such as varistors, negative (positive), degree coefficient Thermistors (NTC, PTC), etc., as shown in the fourth and fifth figures: ', the layered electronic components are composed of the main body 20, internal electricity, terminal electrodes 1 " plated soldering interface M, The insulating coating layer 24 is composed of 1 electrode 21 and After the body 20 is formed, the terminal electrode 22 process is directly performed, and then an insulation coating layer 24 is formed on the surrounding surface of the body 20 (one component is required for the insulation coating process), and the terminal electrode 22 is then subjected to the electroplating welding interface 23 ^ Industrial, complete the finished multilayer electronic components made of oxidized metal body material. However, in this multi-layer electronic component processing mode, components must be insulated one by one in a 25-layer coating method, so the speed is slow and the production capacity is low. If you need to respond to demand, you need to invest a lot of equipment to meet The amount of energy can be very high, so these manufacturing costs are extremely expensive, which does not meet the market demand of large output and low price. 3 · Another type of laminated electronic element made of oxidized metal bulk material

1243397 V. Description of the invention (3) Pieces of this laminated electronic component such as: Varistor (varistors), negative (positive) temperature coefficient thermistor (NTC, pTC), etc., as shown in Figure 6 As shown in FIG. 11, the laminated electronic component is composed of a main body 30, an end electrode 32 made of an internal electrode 31, a plating and soldering interface 33, and an insulating coating layer 34. The manufacturing method is based on the internal electrode 31 and the main body 3. 〇After molding, perform the 3, 4 and 3 coating process on the body 30 (the insulation coating process can be performed on the entire batch of components together). After completion, the insulation coating 34 on both sides of the body 30 is completed. After grinding, it becomes the two end electrode surfaces 3 5 (as shown in the eighth figure), and finally the interface material of the | end electrode 32 is adhered to it. In order to form the terminal electrode 32, and then use the terminal electrode 32 to perform the plating and welding interface 33 process, the metal body material is made into another-plug-in energy connector 4 ... then the m: t laminated electronic component product is finished. However, this laminated electronic component processing method, although improving the old one-layer coating process, but the later process is still very respectful 拄 拄 her retort, H stupid watch 枉 still want to mechanically grind two Waiting: The electrode surface 'still belongs to the manufacturing method of slow speed and low production capacity'. It still needs to invest in grinding equipment to add I, which also belongs to the ': expensive and low-efficiency manufacturing method. The above-mentioned method of manufacturing multilayer electronic components is the manufacturing method adopted, and there are still differences in the manufacturing methods of different component materials = Lisang. As can be seen from the above description, the physical advantages formed by Tao 5 are more obvious. For example, the negative product of the product itself has a high resistivity, can be directly processed after the process is high, and the product with an oxidized metal body has a weak advantage, such as special materials, relatively low, poor structural compactness, The electrode end surface completes the body resistivity and improves the reliability of the welding surface, so that the previous material characteristics.

930329.PTD Page 7 1243397 V. Description of the invention (4) Resistivity and electrical keying of terminal electrode welding surface. Taking the metal oxide varistor as an example, if the reliability and improvement of the extreme surface need to be invested, the insulation resistance can be used to achieve the mass production requirements, so this type of system: preparation and system space. The method of dressing is still very great [Content of the invention] " Generation = based: resistivity of the surface of laminated electronic component materials; the nature of nano-materials to enhance the electrical conductivity of the oxidized metal body, so that this material can pass Electroplating achieves good cuts, this 籀 s * electricity becomes the reliability of electrode welding surface

^〗 This method uses nano materials to solve this problem of reliability and applicability. Laminated electronic 7L The technical means adopted by the present invention, with its subtle characteristics, uses 7 to 5 nanometers to cover the body of the element with a special insulating nanomaterial / = u u, the second method = ▲ liquid phase melting flattening High Insulation :: The edge material is generated at the end of the electrode, so the outer electrode and Nai force are increased, and the relative L is increased. The inner electrode and the outer electrode are grasped at the end of the extremely thin and dense nano-scale insulating plugging material. Electrodes can also be electroplated to improve the degree of oxidation. In addition to the degree of crime and the scope of application of the product, it can be greatly reduced. In addition to solving the problem of the limit of the material of the component body, the method can be simplified. The surface processing of the mechanical parts and the use of end electrodes can be saved. The insulation resistance of the electronic components is improved, and it is necessary to improve the resistance and resistance of the Cheng Ren.

1243397 V. Description of the invention (5) Insulation material = ^ '及 # · The material material body edge resistance characteristics, and more; characteristics' to achieve the improvement of the component surface insulation and the applicable level, can also save "2, soil to improve the reliability of the electrode end face Consumption cost of materials, b * σ cost of labor and special terminal electrode [Embodiment] This is the main purpose of the research and development of the present invention. 1 Please refer to the twelfth figure. Electrical steps for improving electronic components 1-The body is manufactured. The two steps are as follows: | Insulation between internal electrodes 41-Gold oxide 2: Brush out multiple layers of internal electrodes 41, and the body of each layer of the component type 4〇 ( Such as ^ electric = material layer staggered stacking to make a product step 2-this system is extremely thin (as shown in the figure and the fourteenth figure). After 500 ~ 10000 sintering at high temperature, it is based on nanometers Insulating sealing material | Insulating coating layer 42 (such as +7 ^ phase ^ melted and coated on the six edges of the body 40, the coating layer 42 and the internal electrode 41 and :: =: shown in the six pictures), Moreover, in the legend shown in the figure 17, the insulation coating 42 is precipitating and fused (such as the first | rim coating 4 2 Inner contact 41 with the internal electrode 41, the electrode ^^, the impedance characteristic of the insulation. Among them: bu ::: fused connection to produce high u, one meter isometry, quartz ... etc. Those who are sealing materials, such as dishware, emulsified silicon, glass powder, step 3-make the two ends of the electrode, using the | electrical interface material, and then fast sintering at high temperature: directly attached to the two sides of the south lead Nano-insulation material with insulation coating layer 42 is coated on the body 40f terminal electrode 43 (as shown by the circle in Figure 18 and the nineteenth generation of the inclusive phenomenon of V, this produced end Electrode 930329. Page 9 1243397 ------- 5. Explanation of the invention (6) 43 can increase the grip of the inner electrode 41 and the outer electrode: the adhesion of the terminal electrode 43. Among them, the conductive interface material, gold · ·. Etc.: Step 4—Plating and welding interface is made by nickel or tin electroplating on the terminals and 3 surfaces to form a plated welding interface (as shown in Figure 20 and Figure 21). (), /, And then successfully complete the multilayer electronic component finished product., Tuoshan can know from the above description, the multilayer electronic component provided by the present invention improves electricity, 舄Surface reliability manufacturing method, with nanometer = technology to completely improve the habitual accumulation layer Lei Zao, a privateer, the river has full ,,, and marginal coatings

Features: & See all phenomena and problems of the layered electronic components, which have the following I

Lai (1) can simplify the manufacturing process of laminated electronic components, and it is not necessary to implement a processing process of covering an insulating coating layer. Y-mechanical polishing of the two electrode surfaces at the end of the electrode: Also. And into the processing

Manufacturing method with low capacity. It is reduced, and the speed is greatly improved. The I material is sintered in high temperature liquid phase. ^ The body has a low resistivity 'nano insulation sealing material on the surface of the surface. Layer, which can enhance the t-side of the element body to produce extremely thin parts. The nano-insulating sealing material of the temperature ^ phase melting can be applied to the surface of the component and the hole filling property, reducing the power consumption of the component body. ^ Said value Fan Duan 2) Λ ?: wood ==

930329.PTD Page 10 1243397 V. Description of the invention (7) The holding force of the inner electrode and the outer electrode, and the adhesion between the element body and the electrodes at both ends is further increased. (5) Because the surface of the element body is attached with a very thin and dense nano-level insulating material, for special electronic components (such as: oxidized metal varistors .., etc.), the electrode can also be directly plated at the terminal electrode to improve both ends. The reliability and application range of the electrode welding interface can greatly reduce the degree of electrode oxidation. In summary, the method for improving the reliability of the end surface reliability of the laminated electronic component provided by the present invention can indeed achieve the intended purpose and benefit, and is an inventor with industrial applicability.

930329.PTD Page 11 1243397

The appearance of the electronic component is simply explained. The first figure is a schematic diagram of a laminated body made of a conventional ceramic body material. The second figure shows a schematic longitudinal section of the first figure. Figure 22 shows a schematic cross-sectional view of the first figure. The fourth figure is a schematic longitudinal sectional view of a multilayer electronic component product made of a conventional metal oxide bulk material. The fifth figure is a schematic cross-sectional view of a multilayer electronic component made of a conventional metal oxide body material. Fig. 6 is a schematic longitudinal cross-sectional view of an insulating coating layer made of another type of laminated electronic component made of a conventional oxidized metal body material. The seventh figure shows a schematic cross-sectional view of an insulating coating layer made of another type of laminated electronic component made of a conventional metal oxide body material. FIG. 8 is a schematic longitudinal cross-sectional view of another type of laminated electronic component made of a conventional oxidized metal body material after lapping the electrode surface at the end. The ninth figure is a schematic side view of a conventional laminated metal component made of an oxidized metal body after lapping the electrode surface at the end. The tenth figure is a schematic longitudinal sectional view of a terminal electrode surface made of another type of laminated electronic component made of a conventional metal oxide body material. Fig. 11 is a schematic longitudinal sectional view of a terminal electrode surface made of another type of laminated electronic component made of a conventional oxide metal bulk material. FIG. 12 is a schematic flow chart of a method for improving the reliability of an electrode end surface of a laminated electronic component according to the present invention. The thirteenth figure is a schematic diagram of the longitudinal section of the multilayer component type of the present invention after the system was developed.

Page 12 1243397 Schematic description of the fourteenth figure Schematic diagram. Figure 15 Intent. Sixteenth figure Intention. 17th figure 18th figure 19th figure 20th figure Figure 0 shows the cross-section of the multilayer component of the present invention after the system is shown, and it shows the vertical cross-section of the insulating layer after the system of the present invention. The horizontal cross section after the insulation slope coating of the system of the present invention is shown in the enlarged schematic diagram at the circle in the fifteenth figure. Shown is a schematic diagram of the longitudinal section after the two-end electrode is manufactured according to the present invention. Shows a schematic diagram of the transverse section after the two-end electrode is manufactured according to the present invention. Shown is a schematic cross-sectional view of an electroplated welding interface prepared by the present invention. Symbol description Body ____ Internal electrode: Terminal electrode: Electroplated welding Insulation layer Overlying electrode End electrode Common contact interface layer ·· Surface · ·

10 > 1 b 12 ^ 13 ~ 24 > 35 A ^ B 20 21 22 23 34 30 ^ 40 31 ^ 41 32 33 42 43 44

930329.PTD Page 13

Claims (1)

1243397 々'Scope of patent application '-1 type of laminated electronic components to improve the reliability of the electrode end surface reliability method, its implementation steps include: The body clothing is used to print out multiple layers of internal electrodes, and each layer of internal electrodes The interlayers of isolated metal oxide dielectric material layers are stacked alternately to form a laminated element-type body; T i ^ the body f is an insulating layer, which is made of nano-insulating sealing material through 50 () 1 = = C is sintered to form a liquid-phase melted insulation layer covering the six sides of the body, and the insulation coating layer and the internal and external electrodes can be used to produce precipitated eutectic materials. The high-conductivity interface is directly affixed to the side surface after sintering to form a terminal electrode covering the two sides of the body for the phenomenon of precipitation and incorporation of the insulating material; i. In order to form a fresh electrical interface, and then successfully complete the lamination of the laminated electronic components described in item 1 of the laminated layer ^, the scope of the method for changing the electrode surface of the laminated electronic component, #The nano insulation sealing material in # Meter grade particle sizes of oxalates, quartz, etc. Uncle Glassy, 930329.PTD Page 14