CN214753399U - MLCC capacitor - Google Patents
MLCC capacitor Download PDFInfo
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- CN214753399U CN214753399U CN202023229975.1U CN202023229975U CN214753399U CN 214753399 U CN214753399 U CN 214753399U CN 202023229975 U CN202023229975 U CN 202023229975U CN 214753399 U CN214753399 U CN 214753399U
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- copper foil
- aluminum foil
- ceramic
- foil
- mlcc capacitor
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- 239000003990 capacitor Substances 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000002131 composite material Substances 0.000 claims abstract description 46
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 41
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011888 foil Substances 0.000 claims abstract description 36
- 238000005524 ceramic coating Methods 0.000 claims abstract description 24
- 229910002113 barium titanate Inorganic materials 0.000 claims abstract description 11
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 49
- 238000000034 method Methods 0.000 abstract description 9
- 238000005245 sintering Methods 0.000 abstract description 9
- 239000005030 aluminium foil Substances 0.000 abstract description 8
- 239000000843 powder Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 45
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000003475 lamination Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a MLCC capacitor, the MLCC capacitor includes multilayer composite ceramic body and the termination electrode that forms on the terminal surface of multilayer composite ceramic body both sides; the multilayer composite ceramic body is obtained by sequentially stacking a copper foil composite layer and an aluminum foil composite layer at intervals; the copper foil composite layer comprises a copper foil and a ceramic coating coated on the surface of the copper foil, and the aluminum foil composite layer comprises an aluminum foil and a ceramic coating coated on the surface of the aluminum foil. The utility model discloses a MLCC condenser has used copper foil, aluminium foil, ceramic coating preparation, has not only simplified the process, has saved the energy, has avoided the nickel powder and the barium titanate powder sintering that exist in the traditional handicraft always improper moreover, the short circuit of production with the quality problems such as open circuit.
Description
Technical Field
The utility model relates to a condenser technical field, concretely relates to MLCC condenser.
Background
Today, the electronic information industry is rapidly developing, various electronic information products such as notebook computers, mobile phones, liquid crystal televisions, video cameras and the like bring great convenience to life of people, and electric appliance products are smaller and smaller than before and have more and more complete functions. All of the functions are attributed to the fact that semiconductor components and numerous passive patch elements which are the core of electric products are increasingly miniaturized, have high precision and low power consumption, and information products such as household appliances and the like are miniaturized. This puts a higher demand on the metal sheet multilayer ceramic capacitor (MLCC capacitor), one of the main passive chip components in the whole machine.
Generally, in the manufacturing of the MLCC capacitor, a nickel internal electrode is printed on a ceramic sheet, then the barium titanate ceramic sheet printed with the internal electrode is mutually overlapped to a certain number of layers according to requirements, the barium titanate ceramic sheet is sintered into a whole at a high temperature, then copper paste is coated on two ends, electrodes at two ends are formed by sintering the ends, and finally a nickel layer and a tin layer are plated on copper, so that the MLCC capacitor is manufactured, wherein the schematic diagram of the MLCC capacitor is shown in fig. 1. The high-capacitance product generally has more than 100 layers, and some products even have 400-500 layers, so the thickness of each layer is required to be very thin, the thickness of a medium is required to be 1-3 mu m, the thickness of a printing layer is required to be 0.5-1 mu m, the requirement of the facing area between the inner electrode layers is larger and better due to the higher number of the layers, and the sintered MLCC capacitor is shown in figure 2.
The inner electrode of the traditional MLCC capacitor is made of silver paste containing noble metal palladium at first, and the price is very expensive, so that a plurality of manufacturers try to reduce the cost. The existing production method adopts superfine nickel powder to prepare nickel slurry to replace silver palladium slurry as an inner electrode material. At present, the method for preparing nickel powder mainly comprises the following steps: liquid phase reduction, spray pyrolysis, plasma, gas phase, solid phase decomposition, and the like. The particle size and distribution of the nickel powder determine the thickness of the electrode layer, and the uniform spherical nickel powder can form a smooth inner electrode layer, and the nickel powder should have the following properties: spherical, uniform and moderate granularity, high purity and high crystallinity. However, the current nickel powder and nickel slurry have the following problems:
(1) the metal powder of the MLCC nickel inner electrode is usually submicron to nanometer, has high surface activity and is easy to oxidize, so that the conductivity and weldability of the metal powder are influenced, and the nickel powder of the inner electrode is required to have higher oxidation resistance.
(2) When the nickel inner electrode layer is co-sintered with the barium titanate ceramic dielectric layer, the problem of sintering matching between the nickel inner electrode layer and the ceramic dielectric layer needs to be solved because the shrinkage characteristics of the ceramic medium and the nickel inner electrode layer are different.
(3) The problem of agglomeration of the ultrafine nickel powder needs to be solved. If the dispersibility of the nickel powder is poor, when the lamination and cutting operations of the MLCC lamination body are carried out, the nickel powder agglomeration part penetrates through the dielectric layer due to overlarge stress, so that the electrode layer and the dielectric layer are mixed into a whole, the lamination defect is not generated, the short circuit is formed between the inner electrodes, and the reliability of the MLCC is seriously influenced.
At present, MLCC capacitors are developing toward small size, high performance, low dielectric loss, large yield, low price, and the like, so that providing an MLCC capacitor with low cost, simple process, and environmental friendliness has become a technical problem to be solved in the art.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a MLCC capacitor, this MLCC capacitor has used copper foil, aluminium foil, ceramic coating preparation, has not only simplified the process, has saved the energy, has avoided the nickel powder and the barium titanate powder sintering that exist in the traditional handicraft always improper moreover, the short circuit of production with the quality problems such as open circuit.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides a MLCC capacitor, which comprises a multilayer composite ceramic body and end electrodes formed on the end surfaces of two sides of the multilayer composite ceramic body; the multilayer composite ceramic body is obtained by sequentially stacking a copper foil composite layer and an aluminum foil composite layer at intervals; the copper foil composite layer comprises a copper foil and a ceramic coating coated on the surface of the copper foil, and the aluminum foil composite layer comprises an aluminum foil and a ceramic coating coated on the surface of the aluminum foil.
In a preferred embodiment of the present invention, the copper foil and the aluminum foil are pure copper foil and pure aluminum foil, respectively, and the thickness is 6-20 μm.
In a preferred embodiment of the present invention, the ceramic particles in the ceramic coating are selected from one of barium titanate, aluminum oxide, zirconium oxide, aluminum nitride, boron nitride, and silicon nitride.
In a preferred embodiment of the present invention, the ceramic coating layer is formed by coating the ceramic adhesive composition on the surface of the copper foil/aluminum foil after curing.
In a preferred embodiment of the present invention, the thickness of the ceramic coating is 5 to 50 μm.
In a preferred embodiment of the present invention, the number of stacked layers of the copper foil composite layer and the aluminum foil composite layer in the multilayer composite ceramic body is 10 to 1000.
In a preferred embodiment of the present invention, the multilayer composite ceramic body has a thickness of 0.05 to 100 mm.
In a preferred embodiment of the present invention, the terminal electrode is formed by removing the copper foil/aluminum foil on both side end surfaces of the multilayer composite ceramic body and connecting the remaining aluminum foil/copper foil together by soldering tin.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model discloses creatively used copper foil, aluminium foil and ceramic coating to make the condenser, need not to use the nickel powder, left out the preparation technology and the high temperature sintering technology of nickel powder, not only simplified the process, saved the energy, avoided the nickel powder and the barium titanate powder sintering that exist in the traditional handicraft always improper moreover, the short circuit of production with the quality problems such as open circuit.
Drawings
FIG. 1 is a schematic diagram of a prior art MLCC capacitor;
FIG. 2 is a sintered MLCC capacitor;
fig. 3 is a schematic structural diagram of the MLCC capacitor of the present invention;
the reference numbers in the figures illustrate: 1. copper foil; 2. aluminum foil; 3. a copper electrode; 4. an aluminum electrode; 5. and (7) soldering tin.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used therein are commercially available without otherwise specified.
As described in the background art, at present, the MLCC capacitor mainly uses the ultrafine nickel powder to prepare the nickel paste, instead of the silver palladium paste, as the inner electrode material. However, the metal powder of the MLCC nickel inner electrode is usually submicron to nanometer, has high surface activity and is easy to oxidize, so that the conductivity and weldability of the metal powder are influenced, and the nickel powder of the inner electrode is required to have higher oxidation resistance; secondly, when the nickel inner electrode layer is co-sintered with the barium titanate ceramic dielectric layer, the problem of sintering matching between the nickel inner electrode layer and the ceramic dielectric layer needs to be solved because the shrinkage characteristics of the ceramic medium and the nickel inner electrode layer are different; thirdly, the problem of agglomeration of the ultrafine nickel powder needs to be solved. If the dispersibility of the nickel powder is poor, when the lamination and cutting operations of the MLCC lamination body are carried out, the nickel powder agglomeration part penetrates through the dielectric layer due to overlarge stress, so that the electrode layer and the dielectric layer are mixed into a whole, the lamination defect is not generated, the short circuit is formed between the inner electrodes, and the reliability of the MLCC is seriously influenced.
In order to solve the problem, the utility model provides a MLCC capacitor, this MLCC capacitor include the multilayer composite ceramic body and be formed at termination electrode on the terminal surface of multilayer composite ceramic body both sides.
Referring to fig. 3, the multilayer composite ceramic body is obtained by sequentially stacking a copper foil composite layer and an aluminum foil composite layer at intervals. Wherein, the stacking layer number of the copper foil composite layer and the aluminum foil composite layer can be set according to the requirement, and is generally 10-1000 layers; the multilayer composite ceramic body preferably has a thickness of 0.05 to 100 mm.
The utility model discloses in, the copper foil composite bed comprises copper foil 1 and the ceramic coating who coats copper foil 1 surface, and the aluminum foil composite bed comprises aluminium foil 2 and the ceramic coating who coats aluminium foil 2 surface. Wherein, the copper foil 1 and the aluminum foil 2 are pure copper foil and pure aluminum foil respectively, and the thickness thereof is preferably 6-20 μm. In the copper foil composite layer and the aluminum foil composite layer, the copper foil 1 and the aluminum foil 2 serve as internal electrodes, and the ceramic coating serves as a ceramic dielectric layer to perform a dielectric insulation function.
In the present invention, the thickness of the ceramic coating is preferably 5 to 50 μm. The ceramic particles in the ceramic coating are selected from one of barium titanate, aluminum oxide, zirconium oxide, aluminum nitride, boron nitride and silicon nitride. The ceramic coating can be processed by conventional methods, such as preparing ceramic particles into slurry, applying the slurry to the surface of the aluminum foil 2 or the copper foil 1 by spraying or coating, and performing heat treatment (refer to the method disclosed in CN 101278366).
In a preferred embodiment, the ceramic coating is formed by coating the ceramic adhesive composition on the surface of the copper foil 1/aluminum foil 2 and curing the coating. The ceramic coating is convenient to process, good in dielectric property and good in adhesion, can well adhere a copper foil composite layer and an aluminum foil composite layer together, and has good viscosity strength. The ceramic binder composition may be selected from ceramic binder compositions commonly used in the art, such as the ceramic binder composition disclosed in CN 107810172A.
The utility model discloses in, the end electrode will the back is got rid of to the copper foil 1 aluminium foil 2 of multilayer composite ceramic body both sides terminal surface, and remaining copper foil 1 aluminium foil 2 links together and obtains after getting together. Preferably, the terminal electrode is obtained by connecting the remaining copper foil 1/aluminum foil 2 with the copper electrode 3/aluminum electrode 4, and then connecting the terminal electrode with the external electrode in a tin soldering 5 mode.
To sum up, the utility model discloses a MLCC condenser has creatively used these several kinds of materials of copper foil, aluminium foil and ceramic coating to make the condenser, need not to use the nickel powder to save nickel powder preparation technology and high temperature sintering process in traditional MLCC condenser production process, not only simplified the process, saved the energy, avoided the nickel powder and the barium titanate powder sintering that exist all the time in the traditional handicraft improper, the short circuit of production and quality problems such as circuit breaking.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (8)
1. An MLCC capacitor, characterized in that, the MLCC capacitor comprises a multilayer composite ceramic body and end electrodes formed on the end faces of two sides of the multilayer composite ceramic body; the multilayer composite ceramic body is obtained by sequentially stacking a copper foil composite layer and an aluminum foil composite layer at intervals; the copper foil composite layer comprises a copper foil and a ceramic coating coated on the surface of the copper foil, and the aluminum foil composite layer comprises an aluminum foil and a ceramic coating coated on the surface of the aluminum foil.
2. The MLCC capacitor according to claim 1, wherein the copper foil and the aluminum foil are pure copper foil and pure aluminum foil, respectively, and have a thickness of 6-20 μm.
3. The MLCC capacitor according to claim 1, wherein the ceramic particles in the ceramic coating are selected from the group consisting of barium titanate, aluminum oxide, zirconium oxide, aluminum nitride, boron nitride, and silicon nitride.
4. The MLCC capacitor according to claim 1, wherein the ceramic coating is formed by coating the surface of the copper foil/aluminum foil with the ceramic adhesive composition and curing the ceramic adhesive composition.
5. The MLCC capacitor according to claim 1, wherein the thickness of the ceramic coating is 5-50 μm.
6. The MLCC capacitor according to claim 1, wherein the multilayer composite ceramic body comprises 10-1000 stacked layers of the copper foil composite layer and the aluminum foil composite layer.
7. The MLCC capacitor according to claim 1, wherein the thickness of the multilayer composite ceramic body is between 0.05 and 100 mm.
8. The MLCC capacitor according to claim 1, wherein the terminal electrodes are formed by removing the copper foil/aluminum foil from the end surfaces of the multilayer composite ceramic body on both sides and connecting the remaining aluminum foil/copper foil to each other by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023229975.1U CN214753399U (en) | 2020-12-28 | 2020-12-28 | MLCC capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023229975.1U CN214753399U (en) | 2020-12-28 | 2020-12-28 | MLCC capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214753399U true CN214753399U (en) | 2021-11-16 |
Family
ID=78635106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023229975.1U Expired - Fee Related CN214753399U (en) | 2020-12-28 | 2020-12-28 | MLCC capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214753399U (en) |
-
2020
- 2020-12-28 CN CN202023229975.1U patent/CN214753399U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211116 |
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| CF01 | Termination of patent right due to non-payment of annual fee |