CN113178327A - MLCC copper-clad nickel alloy inner electrode slurry and application thereof - Google Patents
MLCC copper-clad nickel alloy inner electrode slurry and application thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention provides MLCC copper-clad nickel alloy inner electrode slurry, wherein a copper-clad nickel alloy material is used as a main raw material of a copper inner electrode, and according to a specific slurry proportion, 50-65 wt% of copper-clad nickel alloy powder is prepared; 5-15 wt% of an inorganic ceramic additive; 21-44 wt% of organic carrier. The copper inner electrode slurry prepared by the invention has the characteristics of low resistivity, good weldability and welding resistance, effectively improves the defects of cracking and the like of an inner electrode layer of a nickel inner electrode during sintering, and is a novel base metal copper inner electrode slurry with good dispersibility, uniform particle size distribution, good forming process and environmental protection.
Description
Technical Field
The invention relates to the technical field of base metal electronic paste, in particular to MLCC copper-clad nickel alloy inner electrode paste and application thereof.
Background
At present, according to the market demand, a nickel electrode multilayer ceramic capacitor (MLCC) is one of the most important electronic components, and is continuously developed toward miniaturization, high capacity and high reliability. Therefore, the number of silk-screen layers in the capacitor is promoted to be continuously increased, and the difficulty of the production technology is also continuously increased. This requires that each layer of electrode layer inside the MLCC electrode has good electrical conductivity and the sintered electrode is more continuous.
However, when the metal nickel and the ceramic medium are co-fired at high temperature in a reducing atmosphere, Ni is easy to be co-fired with BaTiO3In Ni-BaTiO3The interface forms a liquid phase alloy, which results in a discontinuity in the nickel electrode. At present, for the defects that the nickel inner electrode is easy to have discontinuity and the like in the sintering process, the commonly adopted method is to change the ceramic type or change the weight of ceramic powder, but the operation easily causes the problem that the contraction of the nickel and the ceramic powder is not matched in the sintering process, so that the electrode generates larger internal stress and the electrode cracks; furthermore, by changing the ratio of the components in the slurry, the method needs to consider the shrinkage ratio of the functional items to the additives and also the performance of the prepared MLCC product.
Therefore, it is necessary to provide a formulation of nickel inner electrode paste to solve the above problems.
Disclosure of Invention
According to the technical problems that the nickel powder and the ceramic powder are easy to crack and discontinuous in the sintering process and the MLCC product has better conductivity, the MLCC copper-clad nickel alloy inner electrode slurry and the preparation method thereof are provided. The invention mainly replaces nickel powder with copper-clad nickel alloy powder, utilizes copper metal to coat the surface of nickel particles to prevent the formation of an interface alloy layer, and simultaneously reduces the cracking and layering phenomena of the internal electrode chip after the copper-nickel electrode and the dielectric layer are fired due to the influence of internal stress by introducing the inorganic ceramic additive. The copper-clad nickel alloy inner electrode slurry prepared by the invention can be well combined with the terminal electrode slurry, namely, the contact area is increased, the combining force is enhanced, and the production process cost is saved to a great extent, so that the effects of good conductivity, more continuous sintered electrode, difficult cracking and the like are achieved.
The technical means adopted by the invention are as follows:
the MLCC copper-clad nickel alloy inner electrode slurry is characterized by comprising the following components in percentage by weight:
50-65 wt% of copper-clad nickel alloy powder;
5-15 wt% of an inorganic ceramic additive;
21-44 wt% of organic carrier.
Preferably, the weight percentage of the copper-clad nickel alloy powder is 55-59 percent; 7.5-14 wt% of inorganic ceramic additive; 27-35.5 wt% of organic carrier.
Furthermore, the particle size of the copper-clad nickel alloy powder is less than 1 μm.
Further, the inorganic ceramic additive is ZnO, BaO or SiO2、CaO、B2O3、Al2O3、K2O、Na2O、BaTiO3One or more of them.
Further, the organic carrier comprises an organic solvent and a polymer resin, wherein the content of the organic solvent is 22-31 wt%, and the content of the polymer resin is 4.5-5 wt%.
Further, the organic solvent is one or more of benzyl alcohol, terpineol, ethanol and propanol.
Further, the polymer resin is one or more of ethyl cellulose, epoxy resin, acrylic resin and polyurethane.
The invention also discloses a preparation method of the MLCC copper-clad nickel alloy inner electrode slurry, which is characterized in that the copper-clad nickel inner electrode slurry for the MLCC is prepared by burdening → stirring → vacuumizing → stirring → size mixing → finished product testing → packaging.
The invention also discloses a method for preparing the capacitor by using the MLCC copper-clad nickel alloy inner electrode slurry, which is characterized in that the capacitor adopts a co-firing sintering process, and the sintering temperature is controlled to be 800-1000 ℃.
Compared with the prior art, the invention has the following advantages:
the copper-clad nickel alloy material is used as the main raw material of the copper inner electrode, the nickel powder in the prior art is replaced, and the interface alloy layer can be prevented from being formed by coating the surface of the nickel particle with the metal copper. Thermodynamically, the copper atomic radius is similar to that of nickel atomic radius, the surface energy of the Cu-Ni alloy is different from that of pure nickel metal, and copper has higher thermal conductivity, strong adhesion with a substrate and good weldability; the nickel is not easy to be oxidized and has higher corrosion resistance, so that the internal electrode slurry prepared by the copper-nickel alloy can effectively improve the continuity of an internal electrode layer of the nickel internal electrode during co-firing and is not easy to crack and the like.
In addition, the inorganic ceramic additive adopted by the invention has the main function that in the sintering process, the shrinkage rate of the inorganic ceramic additive is matched with that of the copper-nickel inner electrode material at a certain temperature, so that the phenomenon of cracking and layering of the sintered inner electrode chip caused by the influence of internal stress of the copper-nickel electrode and the dielectric layer can be reduced. In particular ZnO, CaO, B2O3、Al2O3、K2O、Na2O, etc., which act as a flux during MLCC sintering, wherein Ca is introduced to make the ceramic material have resistance to reduction.
In addition, in the process of preparing the slurry, the conventional process is adopted, namely, mixing → finished product testing → packaging, and a vacuumizing and stirring process is added, so that the process aims at eliminating bubbles generated in the process of preparing the slurry and enabling the slurry to be dispersed more uniformly.
Moreover, when the capacitor is prepared, a co-firing process is adopted, and the sintering temperature is controlled to be 800-1000 ℃, which is greatly different from the prior art. On one hand, for the nickel inner electrode material, the sintering temperature in the prior art is generally controlled to be about 1300 ℃, and for the copper-coated nickel electrode slurry, the sintering temperature is reduced, and the operability and the process time are greatly improved. On the other hand, the terminal electrode of the nickel inner electrode is generally made of copper end paste, and the MLCC green body prepared from the nickel paste has to be good in connection performance with the copper end paste and consistent with the sintering temperature of the copper end paste to show excellent performance. However, by adopting the electrode slurry of copper-clad nickel alloy, the prepared MLCC green body can be easily increased in contact area with copper end slurry, the bonding force is enhanced, and the production process cost is saved to a great extent.
In conclusion, the copper inner electrode slurry prepared by the invention has the characteristics of low resistivity, good weldability and welding resistance, effectively improves the defects of cracking and the like of an inner electrode layer of a nickel inner electrode during sintering, and is a novel base metal copper inner electrode slurry with good dispersibility, uniform particle size distribution, good forming process and environmental protection.
Based on the reasons, the invention can be widely popularized in the field of base metal electronic paste preparation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is an electrode continuity diagram prepared by using MLCC copper-clad nickel alloy inner electrode slurry of the invention.
FIG. 2 is an SEM image of copper-coated nickel powder in the MLCC copper-coated nickel alloy inner electrode slurry of the invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. Any specific values in all examples shown and discussed herein are to be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The MLCC copper-clad nickel alloy inner electrode slurry is characterized by comprising the following components in percentage by weight:
50-65 wt% of copper-clad nickel alloy powder (shown in figure 2); 5-15 wt% of an inorganic ceramic additive; 21-44 wt% of organic carrier. Preferably, the weight percentage of the copper-clad nickel alloy powder is 55-59 percent; 7.5-14 wt% of inorganic ceramic additive; 27-35.5 wt% of organic carrier.
The particle size of the copper-clad nickel alloy powder is below 1 mu m.
The inorganic ceramic additive is ZnO, BaO or SiO2、CaO、B2O3、Al2O3、K2O、Na2O、BaTiO3One or more of them.
The organic carrier comprises an organic solvent and high polymer resin, wherein the content of the organic solvent is 22-31 wt%, and the content of the high polymer resin is 4.5-5 wt%.
The organic solvent is one or more of benzyl alcohol, terpineol, ethanol and propanol.
The high polymer resin is one or more of ethyl cellulose, epoxy resin, acrylic resin and polyurethane.
The invention adopts a special raw material, namely a copper-coated nickel alloy material, as a main raw material of the copper inner electrode, and obtains a novel copper inner electrode slurry by utilizing a conventional process method according to a specific slurry proportion. The paste has the characteristics of low resistivity, good weldability and welding resistance, and is a novel base metal copper inner electrode paste with good dispersibility, uniform particle size distribution, good forming process and environmental protection (as shown in figure 1, the continuity of an electrode prepared by the MLCC copper-clad nickel alloy inner electrode paste is good). In the process for preparing the MLCC product, a co-firing sintering process is adopted, and the temperature is controlled to be 800-1000 ℃.
According to the paste formulation of table 1, copper-coated nickel inner electrode paste for MLCC was prepared according to the conventional method for preparing paste, batching → stirring → evacuation → stirring → size mixing → inspection of finished product test → packaging. The inorganic ceramic additive is ZnO, BaO or SiO2、CaO、B2O3、Al2O3、K2O、Na2O、BaTiO3The organic solvent is one or more of benzyl alcohol, terpineol, ethanol and propanol; the high polymer resin is one or more of ethyl cellulose, epoxy resin, acrylic resin, polyurethane and rosin resin. The inner electrode slurry is prepared into the MLCC, and the process comprises the following steps: pulping and makingAnd preparing the corresponding MLCC by the processes of film forming, printing, stacking, pressure equalizing, cutting, burning, sintering, chamfering, end dipping, end burning, electroplating, testing and packaging. The process adopts a co-firing sintering process, and the temperature sintering is 800-1000 ℃. The resulting MLCC performance is shown in table 2.
Table 1 the components of the copper-clad nickel alloy inner electrode paste formulation of the present invention are as follows:
table 2 performance and product grade of capacitors made with the copper-clad nickel alloy inner electrode paste of the present invention:
finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The MLCC copper-clad nickel alloy inner electrode slurry is characterized by comprising the following components in percentage by weight:
50-65 wt% of copper-clad nickel alloy powder;
5-15 wt% of an inorganic ceramic additive;
21-44 wt% of organic carrier.
2. The MLCC copper-clad nickel alloy inner electrode slurry according to claim 1, wherein the copper-clad nickel alloy powder is 55-59 wt%; 7.5-14 wt% of inorganic ceramic additive; 27-35.5 wt% of organic carrier.
3. The MLCC copper-clad nickel alloy inner electrode slurry according to claim 2, wherein the particle size of the copper-clad nickel alloy powder is below 1 μm.
4. The MLCC copper-clad nickel alloy inner electrode paste as claimed in claim 2, wherein the inorganic ceramic additive is ZnO, BaO, SiO2、CaO、B2O3、Al2O3、K2O、Na2O、BaTiO3One or more of them.
5. The MLCC copper-clad nickel alloy inner electrode paste as claimed in claim 2, wherein the organic carrier comprises an organic solvent and a polymer resin, wherein the content of the organic solvent is 22-31 wt%, and the content of the polymer resin is 4.5-5 wt%.
6. The MLCC copper-clad nickel alloy inner electrode slurry according to claim 5, wherein the organic solvent is one or more of benzyl alcohol, terpineol, ethanol and propanol.
7. The MLCC copper-clad nickel alloy inner electrode paste as claimed in claim 5, wherein the polymer resin is one or more of ethyl cellulose, epoxy resin, acrylic resin and polyurethane.
8. The preparation method of the MLCC copper-clad nickel alloy inner electrode paste as claimed in any one of claims 1 to 7, characterized in that the copper-clad nickel alloy inner electrode paste for MLCC is prepared by batching → stirring → vacuumizing → stirring → mixing → finished product testing → packaging.
9. The method for preparing the capacitor by using the MLCC copper-clad nickel alloy inner electrode paste as claimed in any one of claims 1 to 7, wherein the capacitor adopts a co-firing sintering process, and the sintering temperature is controlled to be 800-1000 ℃.
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| CN114783770A (en) * | 2022-06-20 | 2022-07-22 | 西安宏星电子浆料科技股份有限公司 | External electrode slurry of multilayer ceramic capacitor and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101593622A (en) * | 2009-06-30 | 2009-12-02 | 广东风华高新科技股份有限公司 | A kind of MLCC copper inner electrode sizing |
| KR20190121150A (en) * | 2018-08-16 | 2019-10-25 | 삼성전기주식회사 | Multi-layered ceramic electronic component and method for manufacturing the same |
| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
-
2021
- 2021-03-30 CN CN202110339989.9A patent/CN113178327A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101593622A (en) * | 2009-06-30 | 2009-12-02 | 广东风华高新科技股份有限公司 | A kind of MLCC copper inner electrode sizing |
| KR20190121150A (en) * | 2018-08-16 | 2019-10-25 | 삼성전기주식회사 | Multi-layered ceramic electronic component and method for manufacturing the same |
| CN110838406A (en) * | 2018-08-16 | 2020-02-25 | 三星电机株式会社 | Multilayer ceramic electronic component and method of manufacturing multilayer ceramic electronic component |
| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783770A (en) * | 2022-06-20 | 2022-07-22 | 西安宏星电子浆料科技股份有限公司 | External electrode slurry of multilayer ceramic capacitor and preparation method thereof |
| CN114783770B (en) * | 2022-06-20 | 2022-12-13 | 西安宏星电子浆料科技股份有限公司 | External electrode slurry of multilayer ceramic capacitor and preparation method thereof |
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