TWI242298B - Light-emitting diode - Google Patents
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- TWI242298B TWI242298B TW92128340A TW92128340A TWI242298B TW I242298 B TWI242298 B TW I242298B TW 92128340 A TW92128340 A TW 92128340A TW 92128340 A TW92128340 A TW 92128340A TW I242298 B TWI242298 B TW I242298B
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五、發明說明ο) 【技術領域】 本發明係提供一種發光二極體元件,尤指一種旦 層杯狀結構之基底的發光二極體元件。 ^ 【先前技術】 由於發光二極體(Light Emitting Device,LED)具有 | 命長、體積小、省電等的優良電氣和機械特徵,故已被 應用到許多不同的領域範圍,而近年來隨著高亮度發光 二極體製作技術的提昇’其應用層面也拓展^全彩色戶 外顯示和交通號諸等方面,未來甚至可取代鎢絲燈和水 銀燈,成為兼具省電和環保概念的新照明光源。 圖一為習知之表面黏著型(Surface Mount Device,SMD) 發光二極體元件的結構示意圖。如圖一所示,發光二極 體元件10包含有一基底(Foundation)12、一導電支架 (Lead Frame)14、一發光二極體晶片(LED chip)l6、一 導線1 8以及一封膠2 0。其中,發光二極體晶片1 6係為一 藉由外加電壓而發出光的半導體元件,其係經由導線1 8 而電連接至導電支架14,而導電支架14則是位於基底12 内,並延伸至基底1 2之外部表面,用以作為後續表面黏 著製程的接點。V. Description of the invention ο) [Technical field] The present invention provides a light-emitting diode element, particularly a light-emitting diode element having a substrate with a cup-like structure. ^ [Previous technology] Since light emitting diodes (LEDs) have excellent electrical and mechanical characteristics such as | long life, small size, and power saving, they have been applied to many different fields. With the improvement of high-brightness light-emitting diode production technology, its application level has also expanded ^ full-color outdoor displays and traffic signals, etc. In the future, it can even replace tungsten filament lamps and mercury lamps, becoming a new lighting with both power saving and environmental protection concepts light source. FIG. 1 is a schematic structural diagram of a conventional surface mount device (SMD) light emitting diode device. As shown in FIG. 1, the light-emitting diode element 10 includes a base 12, a conductive frame 14, a light-emitting diode chip 16, a lead 18, and a glue 2. 0. Among them, the light-emitting diode wafer 16 is a semiconductor element that emits light by applying a voltage, and is electrically connected to the conductive support 14 through a wire 18, and the conductive support 14 is located in the substrate 12 and extends To the outer surface of the substrate 12 for use as a contact point in the subsequent surface adhesion process.
1242298 五、發明說明(2) ----- 習知在進行SMD發光二極體元件丨〇的製程時,大多是利 一可透光材質之流動膠體填入杯狀基底12中,並覆蓋 發光^ ^ f晶片Μ和導線Μ上,再使其固化成具有保護 功能的封膠20,以保護及固定發光二極體晶片16和導線 1 8。然而在封膠2 0的固化過程中,封膠2 〇内部會產生應 力和形k而拉扯導線1 8,常容易導致導線丨8發生斷裂的 現象,嚴重影響發光二極體元件丨〇的製作良率。 5月 > 考圖一,圖二為一習知改良後之表面黏著型發光二 極體元件的結構示意圖。為避免封膠2〇在固化過程中拉1242298 V. Description of the invention (2) ----- It is known that during the manufacturing process of SMD light-emitting diode elements, most of the flow colloid of transparent material is filled into the cup-shaped substrate 12 and covered. The light-emitting diode f and the lead M are then cured to form a sealant 20 with a protective function, so as to protect and fix the light-emitting diode wafer 16 and the lead 18. However, during the curing process of the sealant 20, stress and shape k will be generated inside the sealant 20 and the wire 18 will be pulled, which will often cause the wire 8 to break, which will seriously affect the production of light-emitting diode components. Yield. May > Consider Fig. 1. Fig. 2 shows the structure of a conventionally improved surface-adhesive light-emitting diode device. To prevent the sealant 20 from being pulled during the curing process
扯導線1 8而影響良率,圖二中的發光二極體元件3〇係先 利用一軟質的封膠22覆蓋發光二極體晶片16和導線18, 以避免應力拉扯的現象,之後再於軟質封膠2 2上覆蓋一 硬質的封膠24,以保護發光二極體晶片16和導線18。因 為硬質封膠24未接觸到發光二極體晶片16和導線18,所 以=會拉扯導線i 8,換句話說,發光二極體元件3 〇便可 以藉由軟質封膠22達到固定發光二極體晶片16和導線18 =目的,而且又能藉由硬質封膠2 4達到保護發光二極體 晶片16和導線18的目的。 ^ ^ ί ΐ作過程中,於填入封膠時必須避免封膠22 Φ 一 4/益出基底1 2,所以封膠2 2和2 4的結構會如圖二中所 ~ =的2ί就是硬質封膠24與基底12之間幾“有接 觸。因此,雖然軟質封膠22可以避免拉扯導線丨8而造成 4The lead 18 is pulled to affect the yield. The light-emitting diode element 30 in FIG. 2 first covers the light-emitting diode chip 16 and the lead 18 with a soft sealant 22 to avoid the phenomenon of stress pulling. The soft sealant 22 is covered with a hard sealant 24 to protect the light emitting diode chip 16 and the wires 18. Because the hard sealant 24 is not in contact with the light-emitting diode chip 16 and the wire 18, the wire i 8 will be pulled, in other words, the light-emitting diode element 3 can be fixed by the soft sealant 22 The body wafer 16 and the wires 18 = purpose, and the purpose of protecting the light emitting diode wafer 16 and the wires 18 can be achieved by the hard sealant 24. ^ ^ ί During the filling process, it is necessary to avoid the sealant 22 when filling the sealant. Φ-1 4 / benefit the substrate 12, so the structure of the sealants 2 2 and 2 4 will be as shown in Figure 2 ~ = 2ί is There is some contact between the hard sealant 24 and the substrate 12. Therefore, although the soft sealant 22 can avoid pulling the wire and cause 8
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斷裂’但是後續填入的硬 軟質封膠2 2上,此係為二 致。所以此一改良結構又 質封膠2 4卻無法良好地附著 牙重封膠之間分子鍵結因素所 有封膠結構容易脫落的缺點 在 導 〇 【内容】 ,11發明之主要g的在於提供一種具有多層杯狀結構 土 & ’以使每一層封膠皆能’牢固附著於基底。 ,,本發明所揭露之申請專利範圍,該發光二極體元件 匕含有一具有複數層杯狀結構的基底、一導電支架、一 發光二極體晶片以及一封膠。其中該基底係以複數層突 、緣構造’或是以複數層不同高度之凹槽,來形成複數層 杯狀結構。 此外’本發明之申請專利範圍另揭露一種發光二極體元 件之基底結構,該基底結構包含有一第一容置槽、一第 二容置槽,以及一位於該第一容置槽與該第二容置槽之 間的突緣構造。其中,該第二容置槽係位於該第一容置 槽之外圍’而且該第一容置槽與該第二容置槽係可以是 具有不同高度的凹槽。 【實施方法】It ’s broken, but the hard and soft sealant 22, which is subsequently filled, is the same. Therefore, this improved structure and quality sealant 2 4 can not adhere well to the molecular bonding factors between the tooth sealant. All the shortcomings of the sealant structure are easy to fall off. [Content], the main gist of the 11 invention is to provide a Multi-layered cup-shaped soil & so that each layer of sealant can be firmly attached to the substrate. In the scope of the patent application disclosed in the present invention, the light-emitting diode element includes a base having a plurality of cup-shaped structures, a conductive support, a light-emitting diode wafer, and a piece of glue. Wherein, the base is formed by a plurality of layers of protrusions, edge structures' or a plurality of grooves of different heights to form a plurality of cup-shaped structures. In addition, the scope of the patent application of the present invention also discloses a base structure of a light-emitting diode element. The base structure includes a first receiving slot, a second receiving slot, and a first receiving slot and the first receiving slot. Flange structure between two containing grooves. Wherein, the second receiving groove is located at the periphery of the first receiving groove ', and the first receiving groove and the second receiving groove may be grooves having different heights. 【method of execution】
第8頁 1242298 s _ _ 五、發明說明(4) :參考圖一’圖二為本發明第一實施例的示意圖 的發光二極體元件40包含有基底42、導電支架 ,二極體晶片46、導線48、軟質封膠50以及硬質 2。如同習知的發光二極體元件1〇、. 3〇一般,發 -晶片4 6亦為可藉由外加電壓而發光的半導體元 糸經由導線4 8而被電連接至導電支架4 4。導電支 $於基底内’並延伸至基底42之外部表面,以 ^表面黏著製程的接點。軟質封膠5 0和硬質封膠 :一可透光之材質,用於保護及固定發光二極體 和導線48。 =特別注意的是,在本實施例中,基底42係為多 ^構以内外層圍繞方式而組成。如圖三所示,本 土 f 4 2内部形成一個容置空間,.而突緣結構5 4則 置空間區隔為第一容置槽5 6與.第二容置槽58。第 槽係位於基底42的中央,而第二容置槽58則是 —各置槽5 6外圍。其中,第二容置槽5 8可設置於 置槽5 6外圍的二邊,亦可視需要設置於第一容置 圍的四邊或環繞於第一容置槽56的外圍,而軟質 和硬質封膠5 2則被分別填充至第一容置槽5 6盥第 槽58中。 在填充封膠的過程中,是先將軟質封膠5 〇填入第 槽5 6中,覆蓋發光二極體晶片46與導線48,並控 。圖三 44、發 封膠 光二極 件,其 架44係 作為後 5 2均係 晶片46 個杯狀 發明之 將該容 一容置 位於第 第一容 槽5 6外 封膠5 0 二容置 一容置 制使軟Page 8 1242298 s _ _ 5. Description of the invention (4): Refer to FIG. 1 ′ FIG. 2 is a schematic diagram of a first embodiment of the present invention. The light emitting diode element 40 includes a substrate 42, a conductive support, and a diode wafer 46. , Wire 48, soft sealant 50, and hard 2. Like the conventional light-emitting diode elements 10, .30, the light-emitting chip 46 is also a semiconductor element that can emit light by applying an external voltage. It is electrically connected to the conductive support 44 through a wire 48. The conductive support is in the substrate 'and extends to the outer surface of the substrate 42. The contact of the process is adhered to the surface. Soft sealant 50 and hard sealant: a light-transmitting material for protecting and fixing the light-emitting diodes and wires 48. = It is particularly noted that, in this embodiment, the base 42 is composed of an inner layer and an outer layer. As shown in FIG. 3, a receiving space is formed inside the local f 4 2, and the flange structure 5 4 is separated into a first receiving groove 56 and a second receiving groove 58. The first groove is located in the center of the base 42 and the second receiving groove 58 is the periphery of each of the receiving grooves 56. Wherein, the second accommodation grooves 58 can be disposed on two sides of the periphery of the accommodation groove 56, and can also be disposed on the four sides of the first accommodation enclosure or around the periphery of the first accommodation groove 56 as required, and the soft and hard seals The glue 5 2 is filled into the first receiving grooves 56 and 58 respectively. In the process of filling the sealant, a soft sealant 50 is first filled in the slot 56, covering the light-emitting diode wafer 46 and the lead 48, and controlled. Figure 3. 44. The light-sealing glue light-emitting diode, the frame 44 of which is the rear 5 2 are all 46 wafers. The invention of this container is located in the first container 5 6 and the outer sealant 5 0 is in the second container. One-holding makes soft
12422981242298
五、發明說明(5) 質封膠5 0不會溢出突緣結構5 4,之後再將硬質封膠5 2填 入第二容置槽5 8中’並覆蓋軟質封膠5 〇與突緣結構5 4。 在本實施例中,軟質封膠5 0係用來固定發光二極體晶片 4 6與導線4 8的位置,而硬質封膠5 2則是用以保護發光二 極體晶片4 6與導線48’而且因為軟質封膠5 〇與硬質封膠 52皆與基底42的内壁接觸,所以軟質封膠50與硬質封膠 5 2可以牢固地附著於基底4 2上。其中,軟質封膠5 〇與硬 質封膠5 2均係為一可透光的材質,而且可視產品特性的 來需要摻雜螢光劑或霧化劑。例如藍光發光二極體晶片 可搭配使用黃色螢光劑,達到發出白光的效果。而霧化 劑則是可使光源散射,將光源均勻地發散出去。 請參考圖四,圖四為本發明第二實施例的示意圖。圖四 中的發光二極體元件6 0同樣包含有基底62、導電支架 64、發光二極體晶片66、導線68、軟質封膠70以及硬質 封膠7 2。需特別注意的是,在本實施例中,基底6 2係以 内 '外層凹槽深度不同的設計,來構成内、外層圍繞的 杯狀結構。如圖四所示,基底6 2中央部位的凹槽因其較 深,而形成一第一容置槽76,而在第一容置槽76的外 圍,凹槽深度較淺的部分,則形成一第二容置槽7 8。與 第一實施例相同地,第二容置槽7 8可設置於第一容置槽 76外圍的二邊,亦可視需要設置於第一容置槽76外圍的 四邊或環繞於第一容置槽7 6的外圍,而且如圖四中所 示,第二容置槽7 8的空間不但是在第一容置槽7 6的周V. Description of the invention (5) The quality sealant 5 0 will not overflow the flange structure 5 4, and then the hard sealant 5 2 will be filled into the second receiving groove 5 8 ′ and covered with the soft sealant 5 〇 and the flange Structure 5 4. In this embodiment, the soft encapsulant 50 is used to fix the positions of the light-emitting diode chip 46 and the lead 48, and the hard encapsulant 52 is used to protect the light-emitting diode chip 46 and the lead 48. 'Because both the soft sealant 50 and the hard sealant 52 are in contact with the inner wall of the substrate 42, the soft sealant 50 and the hard sealant 52 can be firmly attached to the substrate 42. Among them, the soft sealant 50 and the hard sealant 52 are both light-transmissive materials, and depending on the characteristics of the product, a fluorescent agent or an atomizer needs to be doped. For example, a blue light emitting diode chip can be used with a yellow phosphor to achieve the effect of emitting white light. The atomizer can scatter the light source and diffuse the light source evenly. Please refer to FIG. 4, which is a schematic diagram of a second embodiment of the present invention. The light emitting diode element 60 in FIG. 4 also includes a base 62, a conductive support 64, a light emitting diode chip 66, a lead 68, a soft sealant 70, and a hard sealant 72. It should be particularly noted that, in this embodiment, the base 62 is designed with different depths of the inner and outer layers to form a cup-shaped structure surrounded by the inner and outer layers. As shown in FIG. 4, the groove in the central portion of the base 62 is formed with a first receiving groove 76 due to its deepness, and at the periphery of the first receiving groove 76, a portion with a shallow groove depth is formed.一 second accommodation slot 7 8. As in the first embodiment, the second accommodation slots 78 can be disposed on two sides of the periphery of the first accommodation slot 76, and can also be disposed on four sides of the periphery of the first accommodation slot 76 or can surround the first accommodation as required. The periphery of the slot 76, and as shown in FIG. 4, the space of the second receiving slot 78 is not only at the periphery of the first receiving slot 76.
1242298 五、發明說明(6) 圍,亦包含了第一容置槽76上方的空間 第二 類似 光二 出第 78中 係用 封膠 地, 的内 固地 7 0與 或霧 實施例 。首先 體 曰曰 中的封膠填 將軟質封膠 片6 6與導線 槽7 6,之後 蓋軟質封膠 發光二極體 用以保護發 施例之軟質 觸,所以軟 基底6 2上。 一容置 ’並覆 來固定 7 2則是 第二實 壁相接 附著於 硬質封 化劑的添加物。 膠72亦為一 充過 7 0填 68, 再將 7 0° 晶片 光二 封膠 質封 此外 可透 程,與第一實 入第一 並控制 硬.質封 在本實 6 6與導 極體晶 7 0與碌 膠7 0與 ,第二 光的材 容置槽 使軟質 膠7 2填 施例中 線6 8的 片6 6與 質封膠 硬質封 實施例 質、或 施例中的 76中,覆 封膠7 0不 入第二容 ,軟質封 位置,而 導線6 8。 72皆與基 膠7 2便得 中的軟質 摻雜有螢 過程 蓋發 會溢 置槽 膠70 硬質 同樣 底62 以牢 封膠 光劑 相較於習知發光二極體, 的多層杯狀結構之基底,不作且^月之發光二極體元件 材質的封膠之特點,而且:同Ϊ使用多種不同 :極體元件,因此可皆可牢固附著於發光 及可靠度。 昇^光一極體元件的製作良率 述僅為本發明之較佳實施例,凡依 和乾圍所做之均等變化與修飾, :^申明專 蓋範圍。 p白應屬本發明專利之涵1242298 Fifth, the description of the invention (6), also includes the space above the first receiving slot 76. Second, similar to the second, the 78th is used to seal the ground. The internal solid ground 70 and or fog embodiment. Firstly, the encapsulant is filled with the soft encapsulant sheet 66 and the lead groove 76, and then the soft encapsulant is used to protect the soft touch of the embodiment, so the soft substrate 62 is used. One container ′ and covering to fix 7 2 is the second solid wall adhering to the hard sealant additive. Glue 72 is also filled with 70, 68, and then 70 ° wafer light. Two seals can be penetrated. In addition, they can pass through the first and enter the first and control the hard. The quality seal is in this real 66 and the conductor crystal. 70 and Glue 7 0 and, the second light material receiving groove enables the soft glue 7 2 to fill the sheet 6 8 in the middle of the example 6 6 and the quality sealant hard seal the quality of the embodiment, or 76 in the embodiment , The covering glue 70 does not enter the second volume, the soft sealing position, and the wires 68. 72 and the base glue 7 2 are soft and doped with the fluorescent process, the cover will overflow the groove glue 70, the same hard bottom 62 to seal the glue, compared with the conventional light-emitting diode, the multilayer cup structure The base material does not make the characteristics of the sealing material of the light-emitting diode element of the moon, and: a variety of different: polar element is used in the same, so it can be firmly attached to the light and reliability. The production yield description of the photo-polarization element is only a preferred embodiment of the present invention. Any equal changes and modifications made by Yi and Qianwei are as follows: p white should be covered by the invention patent
1242298 圖式簡單說明 圖式之簡單說明 圖一為習知發光二極體元件之示意圖。 圖二為另一習知發光二極體元件之示意圖。 圖三為本發明第一實施例之示意圖。 圖四為本發明第二實施例之示意圖。 圖式之符號說明 10' 30 發光二極體元件 12、42、62 基底 14、44、64 導電支架 1 6、4 6、6 6 發光二極體晶片 1 8、4 8、6 8 導線 2 0、2 2、2 4 封膠 4 0、6 0 發光二極體元件 5 0、5 2 封膠 5 4 突緣結構 56、76 第一容置槽 58、78 第二容置槽 7 0、7 2 封膠1242298 Brief description of the diagram Brief description of the diagram Figure 1 is a schematic diagram of a conventional light emitting diode element. FIG. 2 is a schematic diagram of another conventional light emitting diode device. FIG. 3 is a schematic diagram of the first embodiment of the present invention. FIG. 4 is a schematic diagram of a second embodiment of the present invention. Symbols of the drawings 10 '30 Light-emitting diode elements 12, 42, 62 Substrates 14, 44, 64 Conductive supports 1 6, 4 6, 6 6 Light-emitting diode chips 1 8, 4 8, 6 8 Wires 2 0 , 2 2, 2 4 Sealant 4 0, 6 0 Light-emitting diode element 5 0, 5 2 Sealant 5 4 Flange structure 56, 76 First receiving groove 58, 78 Second receiving groove 7 0, 7 2 Sealant
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TW92128340A TWI242298B (en) | 2003-10-13 | 2003-10-13 | Light-emitting diode |
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TW92128340A TWI242298B (en) | 2003-10-13 | 2003-10-13 | Light-emitting diode |
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