TWI242298B - Light-emitting diode - Google Patents

Abstract

The present invention discloses a light-emitting diode (LED) device. The LED device has a foundation with a plurality of cup structures, a lead frame, a LED chip, and a transparent seal. The foundation utilizes at least one prominence structure or a plurality of fillister to form a plurality of cup structures. The foundation can be filled with more than one transparent seals with different materials. All of the transparent seals can firmly fix the LED device.

Description

1242298

V. Description of the invention ο) [Technical field] The present invention provides a light-emitting diode element, particularly a light-emitting diode element having a substrate with a cup-like structure. ^ [Previous technology] Since light emitting diodes (LEDs) have excellent electrical and mechanical characteristics such as | long life, small size, and power saving, they have been applied to many different fields. With the improvement of high-brightness light-emitting diode production technology, its application level has also expanded ^ full-color outdoor displays and traffic signals, etc. In the future, it can even replace tungsten filament lamps and mercury lamps, becoming a new lighting with both power saving and environmental protection concepts light source. FIG. 1 is a schematic structural diagram of a conventional surface mount device (SMD) light emitting diode device. As shown in FIG. 1, the light-emitting diode element 10 includes a base 12, a conductive frame 14, a light-emitting diode chip 16, a lead 18, and a glue 2. 0. Among them, the light-emitting diode wafer 16 is a semiconductor element that emits light by applying a voltage, and is electrically connected to the conductive support 14 through a wire 18, and the conductive support 14 is located in the substrate 12 and extends To the outer surface of the substrate 12 for use as a contact point in the subsequent surface adhesion process.

1242298 V. Description of the invention (2) ----- It is known that during the manufacturing process of SMD light-emitting diode elements, most of the flow colloid of transparent material is filled into the cup-shaped substrate 12 and covered. The light-emitting diode f and the lead M are then cured to form a sealant 20 with a protective function, so as to protect and fix the light-emitting diode wafer 16 and the lead 18. However, during the curing process of the sealant 20, stress and shape k will be generated inside the sealant 20 and the wire 18 will be pulled, which will often cause the wire 8 to break, which will seriously affect the production of light-emitting diode components. Yield. May > Consider Fig. 1. Fig. 2 shows the structure of a conventionally improved surface-adhesive light-emitting diode device. To prevent the sealant 20 from being pulled during the curing process

The lead 18 is pulled to affect the yield. The light-emitting diode element 30 in FIG. 2 first covers the light-emitting diode chip 16 and the lead 18 with a soft sealant 22 to avoid the phenomenon of stress pulling. The soft sealant 22 is covered with a hard sealant 24 to protect the light emitting diode chip 16 and the wires 18. Because the hard sealant 24 is not in contact with the light-emitting diode chip 16 and the wire 18, the wire i 8 will be pulled, in other words, the light-emitting diode element 3 can be fixed by the soft sealant 22 The body wafer 16 and the wires 18 = purpose, and the purpose of protecting the light emitting diode wafer 16 and the wires 18 can be achieved by the hard sealant 24. ^ ^ ί During the filling process, it is necessary to avoid the sealant 22 when filling the sealant. Φ-1 4 / benefit the substrate 12, so the structure of the sealants 2 2 and 2 4 will be as shown in Figure 2 ~ = 2ί is There is some contact between the hard sealant 24 and the substrate 12. Therefore, although the soft sealant 22 can avoid pulling the wire and cause 8

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It ’s broken, but the hard and soft sealant 22, which is subsequently filled, is the same. Therefore, this improved structure and quality sealant 2 4 can not adhere well to the molecular bonding factors between the tooth sealant. All the shortcomings of the sealant structure are easy to fall off. [Content], the main gist of the 11 invention is to provide a Multi-layered cup-shaped soil & so that each layer of sealant can be firmly attached to the substrate. In the scope of the patent application disclosed in the present invention, the light-emitting diode element includes a base having a plurality of cup-shaped structures, a conductive support, a light-emitting diode wafer, and a piece of glue. Wherein, the base is formed by a plurality of layers of protrusions, edge structures' or a plurality of grooves of different heights to form a plurality of cup-shaped structures. In addition, the scope of the patent application of the present invention also discloses a base structure of a light-emitting diode element. The base structure includes a first receiving slot, a second receiving slot, and a first receiving slot and the first receiving slot. Flange structure between two containing grooves. Wherein, the second receiving groove is located at the periphery of the first receiving groove ', and the first receiving groove and the second receiving groove may be grooves having different heights. 【method of execution】

Page 8 1242298 s _ _ 5. Description of the invention (4): Refer to FIG. 1 ′ FIG. 2 is a schematic diagram of a first embodiment of the present invention. The light emitting diode element 40 includes a substrate 42, a conductive support, and a diode wafer 46. , Wire 48, soft sealant 50, and hard 2. Like the conventional light-emitting diode elements 10, .30, the light-emitting chip 46 is also a semiconductor element that can emit light by applying an external voltage. It is electrically connected to the conductive support 44 through a wire 48. The conductive support is in the substrate 'and extends to the outer surface of the substrate 42. The contact of the process is adhered to the surface. Soft sealant 50 and hard sealant: a light-transmitting material for protecting and fixing the light-emitting diodes and wires 48. = It is particularly noted that, in this embodiment, the base 42 is composed of an inner layer and an outer layer. As shown in FIG. 3, a receiving space is formed inside the local f 4 2, and the flange structure 5 4 is separated into a first receiving groove 56 and a second receiving groove 58. The first groove is located in the center of the base 42 and the second receiving groove 58 is the periphery of each of the receiving grooves 56. Wherein, the second accommodation grooves 58 can be disposed on two sides of the periphery of the accommodation groove 56, and can also be disposed on the four sides of the first accommodation enclosure or around the periphery of the first accommodation groove 56 as required, and the soft and hard seals The glue 5 2 is filled into the first receiving grooves 56 and 58 respectively. In the process of filling the sealant, a soft sealant 50 is first filled in the slot 56, covering the light-emitting diode wafer 46 and the lead 48, and controlled. Figure 3. 44. The light-sealing glue light-emitting diode, the frame 44 of which is the rear 5 2 are all 46 wafers. The invention of this container is located in the first container 5 6 and the outer sealant 5 0 is in the second container. One-holding makes soft

1242298

V. Description of the invention (5) The quality sealant 5 0 will not overflow the flange structure 5 4, and then the hard sealant 5 2 will be filled into the second receiving groove 5 8 ′ and covered with the soft sealant 5 〇 and the flange Structure 5 4. In this embodiment, the soft encapsulant 50 is used to fix the positions of the light-emitting diode chip 46 and the lead 48, and the hard encapsulant 52 is used to protect the light-emitting diode chip 46 and the lead 48. 'Because both the soft sealant 50 and the hard sealant 52 are in contact with the inner wall of the substrate 42, the soft sealant 50 and the hard sealant 52 can be firmly attached to the substrate 42. Among them, the soft sealant 50 and the hard sealant 52 are both light-transmissive materials, and depending on the characteristics of the product, a fluorescent agent or an atomizer needs to be doped. For example, a blue light emitting diode chip can be used with a yellow phosphor to achieve the effect of emitting white light. The atomizer can scatter the light source and diffuse the light source evenly. Please refer to FIG. 4, which is a schematic diagram of a second embodiment of the present invention. The light emitting diode element 60 in FIG. 4 also includes a base 62, a conductive support 64, a light emitting diode chip 66, a lead 68, a soft sealant 70, and a hard sealant 72. It should be particularly noted that, in this embodiment, the base 62 is designed with different depths of the inner and outer layers to form a cup-shaped structure surrounded by the inner and outer layers. As shown in FIG. 4, the groove in the central portion of the base 62 is formed with a first receiving groove 76 due to its deepness, and at the periphery of the first receiving groove 76, a portion with a shallow groove depth is formed.一 second accommodation slot 7 8. As in the first embodiment, the second accommodation slots 78 can be disposed on two sides of the periphery of the first accommodation slot 76, and can also be disposed on four sides of the periphery of the first accommodation slot 76 or can surround the first accommodation as required. The periphery of the slot 76, and as shown in FIG. 4, the space of the second receiving slot 78 is not only at the periphery of the first receiving slot 76.

1242298 Fifth, the description of the invention (6), also includes the space above the first receiving slot 76. Second, similar to the second, the 78th is used to seal the ground. The internal solid ground 70 and or fog embodiment. Firstly, the encapsulant is filled with the soft encapsulant sheet 66 and the lead groove 76, and then the soft encapsulant is used to protect the soft touch of the embodiment, so the soft substrate 62 is used. One container ′ and covering to fix 7 2 is the second solid wall adhering to the hard sealant additive. Glue 72 is also filled with 70, 68, and then 70 ° wafer light. Two seals can be penetrated. In addition, they can pass through the first and enter the first and control the hard. The quality seal is in this real 66 and the conductor crystal. 70 and Glue 7 0 and, the second light material receiving groove enables the soft glue 7 2 to fill the sheet 6 8 in the middle of the example 6 6 and the quality sealant hard seal the quality of the embodiment, or 76 in the embodiment , The covering glue 70 does not enter the second volume, the soft sealing position, and the wires 68. 72 and the base glue 7 2 are soft and doped with the fluorescent process, the cover will overflow the groove glue 70, the same hard bottom 62 to seal the glue, compared with the conventional light-emitting diode, the multilayer cup structure The base material does not make the characteristics of the sealing material of the light-emitting diode element of the moon, and: a variety of different: polar element is used in the same, so it can be firmly attached to the light and reliability. The production yield description of the photo-polarization element is only a preferred embodiment of the present invention. Any equal changes and modifications made by Yi and Qianwei are as follows: p white should be covered by the invention patent

1242298 Brief description of the diagram Brief description of the diagram Figure 1 is a schematic diagram of a conventional light emitting diode element. FIG. 2 is a schematic diagram of another conventional light emitting diode device. FIG. 3 is a schematic diagram of the first embodiment of the present invention. FIG. 4 is a schematic diagram of a second embodiment of the present invention. Symbols of the drawings 10 '30 Light-emitting diode elements 12, 42, 62 Substrates 14, 44, 64 Conductive supports 1 6, 4 6, 6 6 Light-emitting diode chips 1 8, 4 8, 6 8 Wires 2 0 , 2 2, 2 4 Sealant 4 0, 6 0 Light-emitting diode element 5 0, 5 2 Sealant 5 4 Flange structure 56, 76 First receiving groove 58, 78 Second receiving groove 7 0, 7 2 Sealant

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Claims (1)

1242298 Case No. 92128340 / Monthly Amendment VI. Patent Application Scope 1. A light-emitting diode element includes: a substrate, and the substrate has an inner wall composed of a plurality of cup-shaped structures and surrounded by inner and outer layers. A conductive support is disposed in the substrate and extends to the outside of the substrate; a light emitting diode wafer is disposed on the substrate and is electrically connected to the conductive support for generating a light source; and a glue covering the The light-emitting diode wafer, and the sealant includes a plurality of layers of different adhesive materials, and each of the adhesive materials is in contact with the inner wall of the substrate; wherein the adhesive material in the cup-shaped structure of the inner layer is A soft sealant, and the glue material in the cup-like structure of the outer layer is a hard sealant. 2. For example, the light-emitting diode element of the first patent application scope, wherein the substrate is constructed with at least one flange To form a plurality of cup-like structures. 3. For example, the light-emitting diode element of the scope of patent application, wherein the substrate is formed with a plurality of cup-shaped structures with a plurality of grooves of different depths. 4. For the light-emitting diode element of the scope of the patent application, the glue material is a light-transmissive material. 5. For example, the light-emitting diode element of the scope of patent application, wherein each of the materials is doped with a fluorescent agent or an atomizer. Page 13 1242298 Case number 92128340? The scope of the patent application for amendment on the day of the month 6. A base structure of a light-emitting diode element includes: a first receiving groove; a second receiving groove located on the periphery of the first receiving groove; and a protrusion The edge structure is located between the first receiving slot and the second receiving slot. The depth term of 0 bottom id is the same as that of the 6th. There is a fan slot. If you want to accommodate it, please apply as the L and slot. Contents-Item 8. The base structure according to item 6 of the patent application scope, wherein the base structure is used to carry a conductive support, a light emitting diode wafer and at least one glue. 9. The base structure according to item 8 of the application, wherein the conductive support is disposed in the base structure and extends to the outside of the base structure, and the light emitting diode wafer is disposed on the base and is electrically connected to the base structure. The conductive support is used to generate a light source, and the sealing compound covers the light-emitting diode chip and the conductive support. Page 14