TWI240955B - Support structure of micro-sensing plate and its formation method - Google Patents

Support structure of micro-sensing plate and its formation method Download PDF

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TWI240955B
TWI240955B TW93100854A TW93100854A TWI240955B TW I240955 B TWI240955 B TW I240955B TW 93100854 A TW93100854 A TW 93100854A TW 93100854 A TW93100854 A TW 93100854A TW I240955 B TWI240955 B TW I240955B
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Taiwan
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micro
sensing
layer
sheet
plated
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TW93100854A
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TW200409199A (en
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Fu-Chu Chou
Chung-Hsien Huang
Chih-Pao Chang
Jenq-Yang Chang
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Univ Nat Central
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Abstract

The present invention is related to a micro-sensing plate for micro-liquid droplet evaporation and temperature sensing apparatus. In particular, the present invention is related to the support structure of micro-sensing plate and its formation method capable of increasing structure strength and elongating the application lifetime. Wet etching solution is used to perform anisotropic etching so as to form ""-"" shape or ""+"" shape support structure on the bottom of micro-sensing plate when viewed downwards. Thus, the entire support structure is capable of effectively sustaining the collision of micro-liquid droplet added to the micro-sensing plate. Therefore, the micro-sensing plate is not destroyed due to the collision of micro-odor liquid droplet, and the sensed temperature is not thermally conducted through the support structure so as to assure the sensing accuracy and reach the purpose of increasing structure strength and increasing application lifetime.

Description

1240955 L、發明說明(1) 【發明之技 本發明 度感測裝置 片底面形成 幅提升,且 感測的準確 【先前技術 按,傳 統、引擎之 撞擊技術, 關研究,此 互作用,而 彈及反彈後 氣味感官, 報公告第四 公告第四二 法」發明專 感測的裝置 而這些 係數之熱阻 其加熱至一 於熱源環境 付元件溫度 變微感測元 術領域】 係隸屬一種用於虛擬實境中之微液滴蒸發與溫 之微感測片的技術領域,藉由本發明於微感測 特殊支撐結構的設計,讓微感測片的強度可大 不會將熱傳開,而增長其使用壽命,且可確保 性。 ] 統工業如機械加工之喷霧冷卻、喷霧滅火系 喷霧燃燒...等,和高科技產業,常使用液滴 如1887年Worthington即提出有關液滴撞擊相 研究領域主要可分為單顆及液滴群與壁面之交 影響液滴衝擊後發生之飛濺、延展、回彈、反 之碎裂等現象,可用於目前虛擬實境所需求的-以作為微氣味模擬與溫度感測,> 我國專利公 九四二三三號「熱傳導感測器」〃發明專利案及 〇八二六號「熱阻式紅外線感測元件及製造方 利案等前案,均提到上述之微液滴蒸發與溫度 溫度感測器係利用導體感測元件,即一高溫度 材料,如白金,再透過金屬導線通以電流,使 所需溫度,而成為熱體,而此微感測元件放置 時,其上的微感測元入受到外來氣體熱導,使 改變,同時元件之熱阻值亦隨之改變,進而改 件的電壓值,而從電壓值與熱阻值間的關係,1240955 L. Description of the invention (1) [Invention technology] The bottom surface of the present invention's degree sensing device forms a substantial increase, and the sensing is accurate [previous technology, traditional, engine impact technology, related research, this interaction, and bomb And the odor sensation after the rebound, report the fourth announcement, the fourth announcement of the 42nd method "to invent a device specifically for sensing, and the thermal resistance of these coefficients will be heated to a temperature of the heat source environment, and the temperature of the element will change slightly. In the technical field of micro-droplet evaporation and temperature-sensing micro-sensing sheets in the virtual reality, the design of the special supporting structure of the micro-sensing of the present invention allows the intensity of the micro-sensing sheets to be large without transmitting heat away. And increase its service life and ensure reliability. ] Industrial industries such as spray cooling for mechanical processing, spray combustion for spray extinguishing, etc., and high-tech industries, which often use droplets, such as Worthington in 1887, proposed that the research field of droplet impact phases can be divided into single areas. The intersection of particles and droplet groups with the wall surface affects the phenomenon of splashing, spreading, rebounding, and fragmentation that occur after the impact of droplets. It can be used for the current virtual reality-for micro-odor simulation and temperature sensing, > China's Patent No. 9423 "Heat Conduction Sensor" 〃 Invention Patent Case and 0826 "Thermal Resistance Infrared Sensing Element and Manufacturer's Case" all mentioned the above-mentioned microfluid Drop evaporation and temperature temperature sensors use a conductor sensing element, that is, a high-temperature material, such as platinum, and then pass a current through a metal wire to make the required temperature become a hot body. When this micro-sensing element is placed, The micro-sensing element above is subject to the thermal conductivity of the external gas, which causes the change in the thermal resistance value of the component, and then changes the voltage value of the component. From the relationship between the voltage value and the thermal resistance value,

1240955 五、發明說明(2) 便可得知所需的 但目前現有 矽基材製成的微 並掏空成薄膜型 撐微感測片1 0 材’以碟保溫度 測片的結構不甚 1 0上時,由於 具有限支撐的狀 擊而崩毁的狀況 經由上述的 係採懸浮結構, 頂撐,當微感測 法負荷微液滴的 度及使用壽命。 緣是於此, 的問題深入探討 研究與開發,終 將熱導開的微感 結構,同時確保 效益。 【發明内容】 為此,本發 體實施上述的目 溫度值 之微感 感測片 態,讓 ,以避 感測器 穩固, 微感測 況下, ,大幅 說明可 僅單純 器用來 撞擊, ,並以 測元件 1〇底 支撐結 免微感 感測效 當微氣 片1 0 常會發 影響到 知,由 利用下 作氣味 而導致 此來作 ,係如 部設有 構1 5 測片1 果,然 味液滴 的厚度 生微感 其使用 於現有 方支撐 液滴蒸 崩毁, 各種需求® 第一圖所揭 支撐結構1 僅有兩側的 0之熱量傳 而伴隨而來 直接落於微 極薄,其在 測片1 0遭 的壽命。 微感測器之 結構兩側的 發時,微感 影響到整體 測; 示者,由 5 ,其間 側支點頂 導至底 的是微感 感測片 僅有兩側 微液滴撞 微感測片 側支點來. 測片因無 的結構強 本發明人乃針對現有微感測片之支撐結構 ,並積極尋求解決之方案,經長期努力之 於成功的開發出一種結構強度佳、且不致 測片之支撐結構,以提升微感測片之支撐 其感測之準確性,並可增進其整體的經濟 明主要係以下列的技術手段,來進一步具 的及效能:微感測器具有一微感測片及一1240955 V. Description of the invention (2) You can find the required but currently existing silicon substrate made of micro and hollowed out into a thin film type micro-sensing sheet 1 0 material 'The structure of the temperature measuring disc is not very good At 10, the situation of collapse due to the impact with limited support is obtained through the above-mentioned suspension structure and top support. When the micro-sensing method is used, the degree and service life of the micro-droplets are loaded. Because of this, the problem of in-depth research and development will eventually lead to the micro-sensing structure of heat conduction, while ensuring benefits. [Summary] To this end, the present body implements the above-mentioned micro-sensing sensing tablet state of the eye temperature value, so as to avoid the sensor being stable. In the case of micro-sensing, it is greatly explained that only a simple device can be used for impact, And the bottom of the measuring element is supported to prevent the micro-sensing effect. When the micro-gas sheet 10 is often affected, it is caused by the use of the operating odor, which is caused by the structure. However, the thickness of the scented droplets is slightly different. It is used in the existing square support droplets to evaporate and collapse. Various requirements ® The support structure 1 shown in the first picture has only the heat transfer of 0 on both sides, which directly accompanies the micro-drops. Extremely thin, its life on the test piece 10. When the two sides of the structure of the micro-sensor are sent, the micro-sense affects the overall measurement; it is shown that from 5 to the bottom of the side fulcrum is the micro-sensor. Only the two sides of the micro-droplet hit the micro-sensor. The fulcrum on the side of the film comes. The structure of the test film is strong due to the lack of structure. The inventor aimed at the support structure of the existing micro-sensing film and actively sought a solution. After long-term efforts, he successfully developed a structure with good structural strength and no test film. The supporting structure to enhance the accuracy of the micro-sensing film to support its sensing accuracy, and to improve its overall economy. The following technical methods are mainly used to further enhance the effectiveness of the micro-sensor: Film and one

第7頁 1240955 五、發明說明(3) 支樓結構, 結構係以侧 支撐結構中 端適抵頂於 構強度,不 藉此,讓整 撞擊,令微 測溫度時亦 的準確性, 目的。 同時進 其中微 邊的側 央形成 微感測 致因微 個支撐 感測片 不致於 同時可 感測片 支點頂 有一向 片底面 液滴撞 結構可 不致受 透過支 達到提 形成於支撐結構的頂端,且支撐 撐微感測片的側邊緣底面,再者 上收束的斜錐狀肋條,該肋條頂 中央,如此可增加微感測片的結 擊而崩毁,且亦不致將熱導開; 有效承受微感測片所受微液滴的 到微氣味液滴撞擊而崩毀,且感 撐結構將熱傳導開,以確保感測 升其結構強度及增長使用壽命之 步利用下列的成型方法形成,其包含有: A、鍍阻絕層 ^ 以一矽晶圓為微感測片之基底材料,並於該基底材料- 正背面鍍上 Β、鍍 並於阻 前先於阻絕 絕層與感測 C、 餘 接著於 元件的加熱 D、 鐘 接著並 成開口 ,讓 一層阻絕層; 严— 感測層 〃 絕層表面鍍上一層感測層,且於鍍上感測層之 層表面鍍上一層接著層,令接著層可以做為阻 層間之接著; 刻感測層 感測層上利用曝光及顯影的技術,蝕刻出感測 圖案,同時蝕掉增加附著用的多餘接著層; 保護層 於感測層表面鍍上一層保護層,並於保護層形 感測層局部露出,以供連接導電層;Page 7 1240955 V. Description of the invention (3) The structure of the branch building is structured to support the structural strength with the middle end of the side support structure. Do not use this to make the whole impact, so that the accuracy of the micro-temperature measurement is also aimed. Simultaneously enter the side of the micro-edge to form a micro-sensing because the small supporting sensing piece can not be sensed at the same time. The fulcrum of the supporting piece has a unidirectional bottom surface of the film. And support the bottom surface of the side edge of the micro-sensing piece, and then the oblique tapered ribs that converge, the top center of the rib, so that the micro-sensing piece will increase the knot and collapse, and will not lead the heat away ; Effectively withstand the impact of micro droplets to micro odor droplets and collapse, and the supporting structure will conduct heat to ensure that the step of increasing its structural strength and increasing its service life is achieved by using the following molding methods Formed, which includes: A. Plating barrier layer ^ A silicon wafer is used as the base material of the micro-sensing sheet, and B is plated on the front and back of the base material, and the barrier layer is formed before the barrier layer. Test C, Yu followed by heating of the component D, Bell then merged into an opening to allow a barrier layer; Strict-Sensing layer 〃 The surface of the insulating layer is plated with a sensing layer, and the surface of the layer coated with the sensing layer is plated Layer by layer The landing layer can be used as the adhesion between the resist layers; the exposure layer and the development technology are used to etch the sensing pattern on the sensing layer to etch the sensing pattern, and at the same time, the extra adhesive layer for increasing adhesion is etched; the protective layer is plated on the surface of the sensing layer A protective layer, and the protective layer-shaped sensing layer is partially exposed for connection to the conductive layer;

1240955 五、發明說明(4) E 、鍍導電層 接著於保護層頂面鍍上一層導電層,同時蝕刻出導電 線,且導電層周緣底面並可利用保護層的開口與感測層導 通; F、鍍保護層 再進一步於導電層表面鍛上一層保護層 G 最 進行非 Η 導線, 測片。 接 發明的 委員對 以實施 制本發 為本發 護之範 【實施 本 片之支 測片3 撐結構 、形成支撐結構 後以事先定義的光罩圖案,再經過曝光及顯影後, 等向性濕蝕刻,而將基底材料蝕刻出支撐結構。 、於保護層對應導電層之導電線處形成開口露出鋁 讓導電線可做為通入電訊號用,同時完成整個微感 下來列 其他目 本發明 ,以下 明之範 明任何 疇。 方式】 發明係 舉一較佳 的及效能 有更詳細 所述者僅 圍,故凡 形式的變 實施例,並配合圖式及圖號,對本-作進一步的說明,期能使 貴審查 广 - 的瞭解,並使熟悉該項技術者能據 在於解釋較佳實施例,而非在於限 有以本發明之創作精神為基礎,而 更或修飾,皆仍屬於本發明意圖保 撐結構^請參看 0及一支撐結構 4 0的頂端,且 一種結構強度佳、且不致將熱傳開的微感測 第二圖所示,微感測器具有一微感 4 0 ,其中微感測片3 0形成於支 支撐結構4 0係以側邊的侧支點1240955 V. Description of the invention (4) E. Conductive plating. Then, a conductive layer is plated on the top surface of the protective layer, and at the same time, conductive lines are etched, and the bottom surface of the peripheral edge of the conductive layer can be connected to the sensing layer through the opening of the protective layer; F 2. The protective layer is plated, and a protective layer G is further forged on the surface of the conductive layer. The members who followed the invention are the model for implementing hair-based hair care [implementing the test piece of this film 3 supporting structure, forming a supporting structure, using a predefined mask pattern, and then exposing and developing, isotropic The wet etch etches the base material out of the support structure. 2. An opening is formed at the conductive line corresponding to the conductive layer of the protective layer to expose aluminum, so that the conductive line can be used to pass through the electrical signal, and at the same time complete the entire micro-sensing. Mode] The invention is only a better one and its performance is described in more detail. Therefore, any form of modified embodiment, with the help of drawings and numbers, will further explain this-in the hope that it will make your review more widely- Understanding, and enable those skilled in the art to explain the preferred embodiments, rather than to be based on the creative spirit of the present invention, or more modified, still belong to the intent of the present invention to maintain the structure ^ see 0 and a top of a supporting structure 40, and a micro-sensing with good structural strength and not transmitting heat, as shown in the second figure, the micro-sensor has a micro-sensing 4 0, in which the micro-sensing sheet 30 forms For the support structure 40, the side fulcrum

第9頁 1240955 五、發明說明(5) 4 1頂撐微感測片3 0的側邊緣底面,再者支撐結構4 0 中央形成有一向上收束的斜錐狀肋條4 5 ,該肋條4 5頂 端適抵頂於微感測片3 0底面中央,如此可增加微感測片 3〇的結構強度,不致因微液滴撞擊而崩毁,且亦不致將 熱傳導開; 而其形成方法主要係利用微機電系統(Μ E M S )技 術來製作一具支撐結構的微液滴蒸發與溫度感測的微感測 器,其包括有: A、 鍍阻絕層 首先請參看第三圖所示,以一矽晶圓,其晶格方向 (1 0 0 )為微感測片3 0之基底材料5 0 ,並於該基底 材料5 0正背面鍍上一層阻絕層5 5 ,該阻絕層5 5可為 氮化石夕(Silicon Nitride),該阻絕層5 5的厚度為 ‘ 4000 A ; ‘ B、 鍍感測層 y 接著請參照第四圖所示,並於阻絕層5 5表面鍍上一 層感測層6 0 ,該感測層6 0可為翻金屬(P t ),厚度約 為1000A,且於鑛上感測層6 0之前先於阻絕層5 5表面 鍍上一層接著層6 5,該接著層6 5可為鈦金屬(Ti), 厚度約為3 0 0 A,令接著層6 5可以做為阻絕層5 5與感 測層6 0間之接著; C 、餘刻感測層 進一步參看第五圖所示,接著於感測層6 0上利用曝 光及顯影的技術,蝕刻出感測元件的加熱圖案,同時蝕掉Page 9 1240955 V. Description of the invention (5) 4 1 The bottom surface of the side edge of the top supporting micro-sensing piece 30, and the supporting structure 40 is formed with an obliquely tapered rib 4 5 in the center, and the rib 4 5 The top end is suitable to be against the center of the bottom surface of the micro-sensing sheet 30, so that the structural strength of the micro-sensing sheet 30 can be increased, and it will not collapse due to the impact of micro-droplets, and it will not cause heat conduction; The micro-electro-mechanical system (MEMS) technology is used to make a micro-sensor for micro-droplet evaporation and temperature sensing with a support structure. The micro-sensor includes: A. Plating barrier layer Please refer to the third figure first. For a silicon wafer, the lattice direction (100) is the base material 50 of the micro-sensing sheet 30, and a barrier layer 5 5 is plated on the front and back of the base material 50. The barrier layer 5 5 may be Silicon Nitride, the thickness of the barrier layer 5 5 is '4000 A;' B. Plated sensing layer y Please refer to the fourth figure, and apply a sensing layer on the surface of the barrier layer 5 5 6 0, the sensing layer 60 can be a turned metal (Pt), the thickness is about 1000A, and it is before the sensing layer 60 on the mine Prior to the surface of the barrier layer 5 5, a bonding layer 65 is plated. The bonding layer 65 can be titanium metal (Ti) and has a thickness of about 3 0 A, so that the bonding layer 6 5 can be used as the barrier layer 5 5 and the sense layer. Next, the detection layer 60 is followed; C, the remaining sensing layer is further referred to the fifth figure, and then the exposure pattern and the development technology are used to etch the heating pattern of the sensing element on the sensing layer 60 and etch away at the same time.

第10頁 1240955 五、發明說明(6) 增加附著用的多餘 D、鑛保護層 另請參閱第六 鍍上一層保護層7 為2000 A ’並於保 6 0 ,局部露出( E 、鍍導電層 接著於保護層 為銘金屬(A1), 8 5,(請參閱第 6 0導通; F、 鍍保護層 另請參閱第九 上一層保護層9 0 5000A,且於保護 開口 ,讓導電線8 微感測片3 0 ; G、 形成支撐 最後以事先定 再經過曝光及顯影 底材料5 0蝕刻出 及呈「十」形狀( 圖所揭示者); Η、於保護層Page 10 1240955 V. Description of the invention (6) Adding extra D and ore protection layer for adhesion See also the sixth plating with a protective layer 7 for 2000 A 'and guaranteeing 60 0, with partial exposure (E, conductive plating, then The protective layer is Ming metal (A1), 8 5, (refer to the 60th conduction; F. For the plating protection layer, please refer to the ninth upper layer of the protective layer 9 0 5000A, and in the protective opening, let the conductive wire 8 feel slightly. Test piece 3 0; G. Form a support and finally etch out and assume a “ten” shape (50) after exposure and development of the base material in advance (shown in the figure);

接著層6 5 ; 圖所顯示者,接著並於感測層6 0表面 0 ,該保護層7 0可為氮化矽,厚度約 護層7 0形成開口 7 5 ,讓感測層 如第七圖所示),以供連接導電層; 7 0頂面鍍上一層導電層,該導電層可 厚度約為5 0 0 0 A ,同時蝕刻出導電線 八圖所示),且使導電線8 5與感測層 圖所顯示者,再進一步於導電層表面鍵-’該保護層9 0可為氮化^發’厚度約為 層9 0對應導電層之導露線8 5處形成 5可做為通入電訊號用,同時完成整個 結構 義的光罩圖案,如第十、十二圖所示, 後,進行非等向性濕蝕刻,而分別將基 俯視呈「一」形狀(如第十一圖所示) 如第十三圖)之支撐結構4 0 (如第二 對應導電層之導電線處形成開口露出鋁Then the layer 6 5; as shown in the figure, and then on the surface 0 of the sensing layer 0, the protective layer 70 can be silicon nitride, the thickness of the protective layer 70 is about 7 5 to form an opening 7 5, so that the sensing layer is like the seventh (Shown in the figure) to connect the conductive layer; the top surface of the 70 is plated with a conductive layer, the conductive layer can have a thickness of about 50000 A, and the conductive line is etched at the same time (shown in Figure 8), and the conductive line 8 5 and the display of the sensing layer, and further bond to the surface of the conductive layer-'the protective layer 9 0 can be nitrided' and the thickness is about layer 9 0 corresponding to the conductive exposed layer of the conductive layer 8 5 can be formed at 5 For access to telecommunications signals, the photomask pattern of the entire structure is completed at the same time, as shown in Figures 10 and 12, and then anisotropic wet etching is performed. (Shown in Figure 11) as shown in Figure 13) supporting structure 40 (such as the opening of the conductive line of the second corresponding conductive layer to expose aluminum)

第11頁 1240955 五、發明說明(7.) 導線,讓導 測片。 藉此, 延長微感測 測片之支撐 至於本 供微感測片 進行微氣味 源,同時因 命亦隨之增 支撐結構4 歸納上 之支撐結構 效能與實用 發明確實為 見相同或近 的要件,乃 電線可做為通入電訊號用,同時完成整個微感 實際運用 佳的強度 發,提供 度的支撐 時可避免 有效確保 明,本發 的問題與 並可有效 極佳的發 品公開使 出申請, 支標結構 液滴的撞 需的嗅覺 感測片之 0的熱量 果。 決現有微 具有上述 濟,效益, 的/技術領 已符合發 發明專利 一可提升微感測片3 0結構強度,且可 之使用壽命與確保其感測準减性的微感 組構成 片3〇 結構者 發明於 3 0更 液滴蒸 該南強 長,同 0,可 述的說 所面臨 價值, 一創意 似的產 依法提 上,則 ,足以 虛擬實 結構4 將微感 溫度感 明除可 缺點外 提升整 明,且 用,故 並祈請 可利用 承受微 境中所 0,微 測片3 測之效 有效解 ,同時 體的經 在相同 本發明 賜准本 4 0提 擊,而 氣味來 使用壽 傳導至 感測片 眾多的· 因此本 域中未 明專利Page 11 1240955 V. Description of the invention (7.) Lead wire, let the test piece guide. As a result, the support of the micro-sensing film is extended. As for the micro-sensor for the micro-smell source, the supporting structure is also increased due to the life. 4 The supporting structure performance and practical invention of induction are indeed the same or near requirements. The electric wire can be used as an access signal, and at the same time, the entire micro-sensing can be used with good strength. At the same time, the support can be avoided to effectively ensure that the problem of the hair and the effective and excellent hair products are publicly used. Application, the impact of the impact of droplets on the structure of the olfactory sensing sheet 0. It is determined that the existing micro has the above-mentioned economic benefits, and the technical field has been in line with the issuance of the invention patent. The micro-sensing film can improve the structural strength of the micro-sensing film, and its service life can be guaranteed. 〇The structurer invented that the South strong growth was steamed by 30 droplets, the same as 0. It can be said that the value is facing. A creative production is added according to the law, which is enough to virtualize the structure 4 to remove the slight temperature sense. It can be improved and clear, and it is useful. Therefore, I hope that you can use the effective solution to withstand the effects of 0 and 3 in the micro-environment. Odors are transmitted to the sensor using a large number of odors.

第12頁 1240955 圖式簡單說明 (一)圖式說明 第一圖:係現有微感測片之斷面示意圖,用以說明現 有微感測片之支撐結構的構成及其相對關係。 第二圖:係本發明微感測片之斷面示意圖,藉以說明 本發明之構成及其對應關係。 第三圖:係本發明於基底材料上形成阻絕層之示意 圖。 第四圖:係本發明鍍上感測層之示意圖。 第五圖:係本發明對感測層進行钱刻之示意圖。 第六圖:係本發明塗飾保護層之示意圖。 第七圖:係本發明開啟感測層預留與鋁導線接點之示 意圖。 第八圖:係本發明鍍上鋁層形成導電線且令其與感測-層導通之示意圖。 β r - 第九圖:係本發明於鋁層上形成氮化确保護層之示意 圖。 第十圖:係本發明第一種光罩圖案之示意圖。 第十一圖:係本發明第一種光罩形成型之支撐結構俯 視示意圖。 第十二圖:係本發明第二種光罩圖案之示意圖。 第十三圖:係本發明第二種光罩形成型之支撐結構俯 視不意圖。 第十四圖:係本發明開啟導線接點的區域,以使露出 鋁導線作為通入電訊號之用示意圖。Page 12 1240955 Brief description of the drawings (I) Illustration of the drawings The first picture: is a schematic cross-sectional view of an existing micro-sensing piece, which is used to explain the structure and relative relationship of the supporting structure of the existing micro-sensing piece. The second figure is a schematic cross-sectional view of the micro-sensing sheet of the present invention, so as to explain the structure and corresponding relationship of the present invention. The third figure is a schematic view of forming a barrier layer on a base material according to the present invention. FIG. 4 is a schematic diagram of a sensing layer plated according to the present invention. Fifth figure: It is a schematic diagram of the present invention performing a money engraving on the sensing layer. FIG. 6 is a schematic diagram of a coating protective layer of the present invention. Fig. 7 is a schematic view showing that the sensing layer of the present invention is opened to reserve contacts with aluminum wires. FIG. 8 is a schematic diagram of forming a conductive line by plating an aluminum layer in the present invention and making it conductive with the sensing-layer. β r-Ninth diagram: It is a schematic diagram of the present invention to form a nitride-guaranteed protective layer on an aluminum layer. The tenth figure is a schematic diagram of the first photomask pattern of the present invention. Fig. 11 is a schematic plan view of the first photomask-forming supporting structure of the present invention. FIG. 12 is a schematic diagram of a second photomask pattern of the present invention. Thirteenth figure: The support structure of the second photomask forming type of the present invention is not intended to be viewed from the top. Fig. 14 is a schematic view of an area where the wire contacts are opened in the present invention, so that the aluminum wire is exposed as an electrical signal.

第13頁 1240955Page 13 1240955

第14頁Page 14

Claims (1)

1240955 申請專利範圍 測片及 端,且 底面, 條,該 微感測 致將熱 藉 微感測 撐結構 2 之支撐 A 以 正背面 B 並 前先於 絕層與 C 接 元件的 D 接 種 一支撐 支撐結 再者支 肋條頂 片的結 導開; 此,組 片之使 者。 、一種 結構的 、鍍阻 一矽晶 鍍上一 、鍍感 於阻絕 阻絕層 感測層 、餘刻 著於感 加熱圖 、鍍保 著並於 、一丨一 如申 成型 絕層 圓為 層阻 測層 層表 表面 間之 感測 測層 案, 護層 感測 微感測片之支撐結構,微感測器具有一微感 結構’其中微感測片形成於支撐結構的頂 構係以側邊的側支點頂撐微感測片的侧邊緣 撐結構中央形成有一向上收束的斜錐狀肋 端適抵頂於微感測片底面中央,如此可增加 構強度,不致因微液滴撞擊而崩毁,且亦不 / 構成一可提升微感測片結構強度,且可延長 用壽命與確保其感測準確性的微感測片之支 請專利範圍第1項所述之一種微感測片 方法,其包括有: 微感測片之基底材料,並/猃該基底材料· 絕層; 夕 面鍵上一層感測層,且於鐘上感測層之 鍍上一層接著層,令接著層可以做為阻 接著; 層 上利用曝光及顯影的技術,ϋ刻出感測 同時蝕掉增加附著用的多餘接著層; 層表面鍵上一層保護層,並於保護層形1240955 Patent application scope of the test piece and end, and the bottom surface, the strip, the micro-sensing causes the support A of the thermally borrowed micro-sensing support structure 2 to be front and back B and before the insulation layer and the D of the C-connecting component inoculate a support The knot that supports the knot and the top sheet of the rib guides away; therefore, the messenger of the piece. , A structure, plated-silicon-plated one, plated to resist the barrier layer sensing layer, engraved on the heating map, plated and kept, and as described in the forming the insulation circle is layer resistance The sensing layer between the surface of the stratified layer, the support layer senses the supporting structure of the micro-sensing sheet, and the micro-sensor has a micro-sensing structure, in which the micro-sensing sheet is formed on the top structure of the supporting structure to the side. The side fulcrum of the side-supporting micro-sensing sheet of the side supporting point is formed with an oblique cone-shaped rib end which closes upwards to fit against the center of the bottom surface of the micro-sensing sheet. This can increase the structural strength and prevent micro droplets from colliding. Collapse without forming / constructing a micro-sensing sheet that can enhance the structural strength of the micro-sensing sheet, and can extend its life and ensure its sensing accuracy The sheet method includes: a base material of the micro-sensing sheet, and / or the base material and an insulation layer; a sensing layer on the surface key, and a bonding layer on the sensing layer on the clock, so that Layers can be used as barriers; Exposure on layers A developing technology, ϋ carve sensed simultaneously etched off excess increase the adhesion with the adhesive layer; a protective coating layer on the surface of the key, and the protective layer is formed 第15頁Page 15
TW93100854A 2004-01-13 2004-01-13 Support structure of micro-sensing plate and its formation method TWI240955B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447369B (en) * 2007-07-26 2014-08-01 Nitta Corp Sensing pieces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447369B (en) * 2007-07-26 2014-08-01 Nitta Corp Sensing pieces

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