1240062 五、發明說明（1) 【發明所屬之技術領域】 本發明係關於一種熱導管及其製造方法，特別是關於 一種具高導熱效能的熱導管製造方法。 【先前技術】 隨著技術的進步，電子元件單位面積上的電晶體數量 越來越多，造成其工作時發熱量的增加。另一方面，電子 元件的工作頻率也越來越高，電晶體工作時on/of f轉換所 造成的熱量（switch loss)，亦是電子元件發熱量增加的 原因。近年來，由於半導體製程與I C構裝技術的快速發 展，晶片的計算速度獲得大幅度的提昇，相對的使得晶片 在運作時，熱耗隨著時脈頻率的增加而上升，若未能適當 的處理這些熱量，將會造成晶片運算速度的降低，嚴重者 甚至影響到晶片的壽命。 因此要如何有效的處理這些耗熱，現行的做法多是利 用外加風扇和散熱鰭片來維持晶片處於有效工作溫度内。 為了迅速的導出熱能，風扇運轉加快會使得耗電量與噪音 增加，且增加散熱鰭片的設置，雖可增進導熱效能，卻使 空間利用之經濟性變差。而由於熱導管（h e a t p i p e )可在 很小的截面積與溫度差之下，將大量的熱傳送一段可觀的 距離，且不需外加電源供應即可運作，在無須動力提供和 空間利用經濟性的考量之下，熱導管逐漸廣泛地被應用於 電子產品中。 請參照第1圖，其繪示乃習知熱導管製造方法的流程1240062 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a heat pipe and a method for manufacturing the same, and particularly to a method for manufacturing a heat pipe with high thermal conductivity. [Previous technology] With the advancement of technology, the number of transistors per unit area of electronic components is increasing, resulting in an increase in the amount of heat generated during operation. On the other hand, the operating frequency of electronic components is also getting higher and higher, and the heat (switch loss) caused by on / of f conversion during transistor operation is also the reason for the increase in the amount of heat generated by electronic components. In recent years, due to the rapid development of semiconductor manufacturing and IC assembly technology, the computing speed of wafers has been greatly improved. Relatively, when the wafers are in operation, the heat dissipation increases with the increase of the clock frequency. Dealing with this heat will cause the chip's computing speed to decrease, and in serious cases, it will even affect the life of the chip. Therefore, how to effectively deal with these heat dissipations, the current practice is to use an additional fan and cooling fins to maintain the chip at an effective operating temperature. In order to quickly dissipate thermal energy, speeding up the operation of the fan will increase the power consumption and noise, and increase the setting of the cooling fins. Although it can improve the thermal conductivity, it will make the economical use of space worse. And because the heatpipe can transfer a large amount of heat for a considerable distance under a small cross-sectional area and temperature difference, and can operate without external power supply, it is economical without power supply and space utilization. Under consideration, heat pipes are increasingly widely used in electronic products. Please refer to FIG. 1, which shows the flow of a conventional heat pipe manufacturing method.
1240062 五、發明說明 圖 般 先，於步 管之一端 導管中。 為中心外 頂端，藉 形成一具 鋼棒、石 然後 的間隙空 緊密。再 管壁上形 導管中抽 據所形成 空的執行 成之圓柱 應用於發 然而 需，必須 爲平狀的 或是被打 構遭受破 能力下降 響不容忽 ⑵ 傳統的熱 驟102中， 已先封口 由於空心 凸之椎狀 此定位。 有固定間 墨棒或其 ，於步驟 間中，依 來， 成一 出。 的毛 順序 狀熱 熱之 ，由 將原 熱導 扁成 壞， ，最 視。 於步 毛細 於步 細結 後， 導管 電子 於熱 來圓 管。 爲平 失去 南的 導管的製作方法包括以下的步驟。首 提供一空心銅管作為導管，此空心銅 。接著，於步驟1 0 4中，插入一棒材於 銅管之一端已先封口 ，一般而言封口為 ，故棒材之一端可置於外凸椎狀封口的 如此一來，使得導管的管壁與棒材之間 隙的空間。其所用的棒材例如是一不鏽 他材質之剛性棒材。 1 0 6中，填充銅粉於導管管壁與棒材間 據製程的需要，可另外再行壓縮使銅粉 驟1 0 8中，燒結使所填充的銅粉在導管 結構。之後，於步驟1 1 0中，將棒材自 驟1 1 2中，注入工作流體，。在此，依 構的不同，可對調注入工作流體與抽真 再封口。最後，於步驟1 1 4中，將已完 作彎曲或打扁成扁平狀，以符合後續所 元件散熱模組的形狀所需。 導管製造完成後，為了實際應用時所 而直的熱導管再加工，使成為彎曲狀或 如此一來，導管於被彎曲的局部區域， 狀的局部區域中，熱導管内部的毛細結 其導熱的功能，使得熱導管整體的導熱 損失甚至可達七成以上，其所造成之影1240062 V. Description of the invention First, in the catheter at one end of the step tube. For the top of the center, a steel rod, stone is formed, and the gap is tight. The hollow cylinder formed by drawing from the tube-shaped duct on the wall of the tube should be used for application. It must be flat or be damaged by the structure. It cannot be ignored. In the traditional thermal step 102, The seal is positioned due to the hollow convex vertebral shape. There are fixed rooms and ink sticks, and in the steps, they come out as one. The hairs in the order of heat are caused by the flattening of the original heat conduction, which is most important. After the capillarity and the fine knot in the step, the tube electrons heat to the tube. The method of making the catheter for the peace of mind includes the following steps. First, a hollow copper tube is provided as a conduit, this hollow copper. Next, in step 104, a rod is inserted and sealed at one end of the copper tube. Generally speaking, the sealing is such that one end of the rod can be placed in a convex cone seal so that the tube of the catheter The space between the wall and the bar. The rod used is, for example, a rigid rod made of stainless steel. In 106, the copper powder is filled between the pipe wall and the rod. According to the requirements of the manufacturing process, the copper powder can be compressed in step 108 to sinter to make the filled copper powder in the structure of the catheter. After that, in step 1 10, the rod is filled with working fluid from step 1 12. Here, depending on the structure, the working fluid can be injected and pumped and then sealed. Finally, in step 1 4, the finished bending or flattening is performed to meet the shape of the subsequent component heat dissipation module. After the completion of the manufacture of the pipe, the heat pipe straight for the practical application is re-processed to make it curved or in this way, the pipe is in the bent local area. In the shaped local area, the capillary knot inside the heat pipe conducts heat Function, the heat conduction loss of the heat pipe as a whole can even reach more than 70%.
第6頁 1240062 五、發明說明（3) 【發明内容】 因此，為解決上述問題，本發明係提出一種熱導管的 製造方法，先進行熱導管形狀加工，再形成熱導管内部之 毛細結構，避免習知導管内部的毛細結構因後續加工時而 受損，可保有完整的毛細結構，提高熱導管整體的導熱能 力。 根據本發明的目的，提出一種熱導管及其製造方法。 熱導管係應用於一電子元件散熱模組中，且依照電子元件 散熱模組之形狀需要塑形。此製造方法包括以下步驟： (a )提供一導管；（b )加工使導管成型；（c )插入一塑型棒材 於導管中；（d )形成一毛細結構；（e )分離塑型棒材與導 管；以及（f )注入一工作流體並形成一密閉空間。 根據本發明的再一目的，提出一種熱導管製造方法， 包括以下步驟：（a )提供一導管；（b )加工使導管成型；（c ) 插入一塑型棒材於導管中；（d )分離塑型棒材與導管；（e ) 形成一毛細結構；以及（f )注入一工作流體並形成一密閉 空間。 於加工使導管成型之步驟中，係利用彎曲或打扁導管 的方式以成型。塑型棒材之表面具有複數個突狀物，用以 使導管管壁與塑型棒材間的間隙一致。突狀物之材質可與 毛細結構相同，於形成毛細結構時作為毛細結構之原料之 一。或者，於分離塑型棒材與導管前，突狀物可被加熱後 直接汽化或液化。塑型棒材之材料係一具可撓性之材料，Page 6 1240062 V. Explanation of the invention (3) [Summary of the invention] Therefore, in order to solve the above problems, the present invention proposes a method for manufacturing a heat pipe, first performing a heat pipe shape processing, and then forming a capillary structure inside the heat pipe to avoid It is known that the capillary structure inside the catheter is damaged due to subsequent processing, can maintain a complete capillary structure, and improve the overall thermal conductivity of the heat pipe. According to the purpose of the present invention, a heat pipe and a manufacturing method thereof are proposed. The heat pipe is used in an electronic component cooling module, and is shaped according to the shape of the electronic component cooling module. This manufacturing method includes the following steps: (a) providing a catheter; (b) processing to shape the catheter; (c) inserting a molding rod into the catheter; (d) forming a capillary structure; (e) separating the molding rod Materials and ducts; and (f) injecting a working fluid and forming a closed space. According to still another object of the present invention, a method for manufacturing a heat pipe is provided, which includes the following steps: (a) providing a pipe; (b) processing to form the pipe; (c) inserting a plastic rod into the pipe; (d) Separating the shaped rod from the duct; (e) forming a capillary structure; and (f) injecting a working fluid and forming a closed space. In the process of forming the catheter, it is formed by bending or flattening the catheter. The surface of the molding rod has a plurality of protrusions for making the gap between the tube wall of the catheter and the molding rod consistent. The material of the protrusions can be the same as the capillary structure, and it can be used as one of the raw materials of the capillary structure when forming the capillary structure. Alternatively, the protrusions can be directly vaporized or liquefied after being heated before separating the shaped rod from the catheter. The material of the shaped bar is a flexible material.
1240062 五、發明說明（4) 可直接自導管中抽出。再者，塑型棒材係一相對於形成毛 細結構之材料為較低燃點之材料，於加熱後汽化或液化， 使與導管分離。又或者，塑型棒材之材料係一可被一有機 溶劑所溶解之材料，如高分子有機物，而塑型棒材係以被 有機溶劑溶解之方式，使與導管分離。有機溶劑例如是丙 酮0 為讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 【實施方式】 第一實施例 請參照第2圖，其繪示乃依照本發明第一實施例之熱 導管製造方法的流程圖。本實施例之熱導管製作方法包括 以下的步驟。首先，於步驟2 0 2中，提供一導管。導管的 材料例如是塑膠、金屬、合金、或非金屬材料。在本實施 例中，較佳地採用銅管為例。再來，於步驟2 0 4中，為了 後續所應用的發熱電子元件散熱模組的形狀所需，先將導 管以彎曲、打扁或其他方式，使導管成彎曲狀、扁平狀或 其他形狀。 接著，於步驟2 0 6中，插入一塑型棒材於導管中，使 得導管的管壁與塑型棒材之間形成一具有固定間隙的空 間。由於導管已被加工成彎曲或扁平狀，因此，所採用的 塑型棒材的材料，必須是一具可撓性之材料。並且，為了1240062 V. Description of the invention (4) It can be withdrawn directly from the catheter. Furthermore, the molding rod is a material with a lower ignition point than the material forming the capillary structure, and is vaporized or liquefied after heating to separate it from the duct. Alternatively, the material of the molding rod is a material that can be dissolved by an organic solvent, such as a high molecular organic substance, and the molding rod is separated from the catheter by being dissolved by an organic solvent. The organic solvent is, for example, acetone. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with the accompanying drawings as follows: [First Embodiment] Please refer to FIG. 2, which shows a flowchart of a method for manufacturing a heat pipe according to the first embodiment of the present invention. The heat pipe manufacturing method of this embodiment includes the following steps. First, in step 202, a catheter is provided. The material of the catheter is, for example, plastic, metal, alloy, or non-metallic material. In this embodiment, a copper pipe is preferably used as an example. Then, in step 204, in order to shape the shape of the heat-generating electronic component heat-receiving module to be applied later, the guide tube is first bent, flattened, or otherwise, so that the tube is bent, flattened, or other shapes. Next, in step 206, a molding rod is inserted into the catheter, so that a space having a fixed gap is formed between the tube wall of the catheter and the molding rod. Since the catheter has been processed into a curved or flat shape, the material of the molding rod used must be a flexible material. And, for
第8頁 1240062 五、發明說明（5) 維持導管的管壁與塑型棒材之間的間隙空間一致，於塑型 棒材的表面另外配置有多個突狀物，藉由突狀物的厚度一 致，恰作為導管管壁與塑型棒材之間的間隙空間，用以使 導管管壁與塑型棒材間的間隙一致。 然後，於步驟2 0 8中，填充銅粉於導管管壁與塑型棒 材之間的間隙空間。接著，於步驟2 1 0中，形成一毛細結 構。毛細結構可以是網狀毛細結構（in e s h w i c k )、纖維狀 毛細結構（f i b e r w i c k )、燒結毛細結構（s i n t e r w i c k )， 或是溝狀毛細結構（g r ο o v e w i c k )。而形成毛細結構的方 法有許多種，例如燒結、黏著、填充、沈積等。由於本實 施例採用銅管作為導管，故在此步驟中，採用銅粉或其他 金屬合金粉末，填充於導管管壁與塑型棒材之間的間隙空 間後，再加熱燒結，使所填充的銅粉在導管管壁上形成毛 細結構。另外，依據不同製程的需要，可於加熱燒結前， 另行壓縮銅粉，使銅粉緊密後，再加熱燒結，以形成不同 孔隙度或不同結構之毛細結構。在此，需特別注意的是， 若採用不同的材料作為填充物，則可能會附加使用相對應 之溶劑或結合劑，以增加銅粉緊密填充的作用，同時，在 加熱燒結前，會相對應地增加一乾燥的步驟或去結合劑的 步驟，以去除溶劑或結合劑。 之後，於步驟2 1 2中，分離塑型棒材與導管。最後， 於步驟2 1 4中，注入工作流體，並抽真空，將導管之另一 端封口後，便完成熱導管的製造流程。工作流體例如是無 機化合物、水、醇類、諸如汞的液態金屬、酮類、諸如Page 8 1240062 V. Description of the invention (5) Keep the gap between the tube wall of the catheter and the shaped bar consistent. There are multiple protrusions on the surface of the shaped bar. The thickness is the same, just as the gap space between the pipe wall of the catheter and the shaped bar, so as to make the gap between the pipe wall and the shaped bar consistent. Then, in step 208, the gap between the tube wall of the catheter and the molding rod is filled with copper powder. Next, in step 210, a capillary structure is formed. The capillary structure may be a mesh capillary structure (in e s h w i c k), a fibrous capillary structure (f i be r w i c k), a sintered capillary structure (s i n t e r w i c k), or a grooved capillary structure (g r ο o v e w i c k). There are many methods for forming capillary structures, such as sintering, adhesion, filling, and deposition. Since this embodiment uses a copper tube as a conduit, in this step, copper powder or other metal alloy powder is used to fill the gap between the tube wall of the conduit and the shaped bar, and then heating and sintering to make the filled Copper powder forms a capillary structure on the tube wall. In addition, according to the needs of different processes, copper powder can be compressed separately before heating and sintering to make the copper powder compact, and then heat sintering to form capillary structures with different porosities or different structures. Here, it is important to note that if different materials are used as fillers, a corresponding solvent or bonding agent may be additionally used to increase the effect of copper powder compact filling. At the same time, before heating and sintering, A step of drying or a step of removing the binding agent is added to remove the solvent or the binding agent. After that, in step 2 12, the molding rod and the catheter are separated. Finally, in step 2 1 4, the working fluid is injected and evacuated to seal the other end of the pipe, and then the manufacturing process of the heat pipe is completed. Working fluids are, for example, inorganic compounds, water, alcohols, liquid metals such as mercury, ketones, such as
1240062 五、發明說明（6) HFC-134a等的冷媒、或其他有機化合物。一般而言，較常 使用水作為工作流體。在此，依據所形成的毛細結構的不 同，所對應於工作流體之間的表面張力不同，可適時改變 對調注入工作流體與抽真空的執行順序後，再封口。一般 而言，若形成燒結毛細結構，則採取先注入工作流體再抽 真空的方式，可達到較佳效果。而若形成的毛細結構為網 狀毛細結構，或是溝狀毛細結構的話，則採取先抽真空再 注入工作流體的方式，可避免先抽真空時，工作流體被過 量抽取的缺點。 第二實施例 請參照第3圖，其繪示乃依照本發明第二實施例之熱 導管製造方法的流程圖。本實施例與第一實施例中所述的 製造方法相似，首先，於步驟3 0 2中，提供一導管，較佳 地係一銅管。再來，於步驟3 0 4中，為了後續所應用的發 熱電子元件散熱模組的形狀所需，先將導管以彎曲、打扁 或其他方式，使導管成彎曲狀、扁平狀或其他形狀。 接著，於步驟3 0 6中，插入一塑型棒材於導管中，使 得導管的管壁與塑型棒材之間形成一具有固定間隙的空 間。於步驟3 0 8中，填充銅粉於導管管壁與塑型棒材之間 的間隙空間。由於本實施例採用銅管作為導管，故在此步 驟中，採用銅粉或其他金屬合金粉末，填充於導管管壁與 塑型棒材之間的間隙空間中。另外，依據所使用的銅粉顆 粒大小及所欲形成的毛細結構的孔隙度大小，可另行設計1240062 V. Description of the invention (6) Refrigerants such as HFC-134a, or other organic compounds. In general, water is more commonly used as the working fluid. Here, according to the difference in the capillary structure formed, the corresponding surface tension between the working fluids can be changed, and the execution order of injecting the working fluid and evacuation can be changed in time, and then sealed. In general, if a sintered capillary structure is formed, a better effect can be achieved by first injecting a working fluid and then evacuating. If the capillary structure formed is a reticular capillary structure or a sulcus capillary structure, vacuuming and then injecting the working fluid can be adopted to avoid the disadvantage of excessive extraction of the working fluid when the vacuum is first evacuated. Second Embodiment Please refer to FIG. 3, which shows a flowchart of a method for manufacturing a heat pipe according to a second embodiment of the present invention. This embodiment is similar to the manufacturing method described in the first embodiment. First, in step 302, a conduit is provided, preferably a copper tube. Then, in step 304, in order to meet the shape of the heat-generating electronic component cooling module to be applied later, the conduit is first bent, flattened, or otherwise to make the conduit into a curved, flat, or other shape. Next, in step 306, a molding rod is inserted into the catheter, so that a space having a fixed gap is formed between the tube wall of the catheter and the molding rod. In step 308, the gap between the tube wall of the catheter and the shaped bar is filled with copper powder. Since the copper pipe is used as the pipe in this embodiment, in this step, copper powder or other metal alloy powder is used to fill the gap between the pipe wall and the shaped bar. In addition, according to the size of the copper powder used and the porosity of the capillary structure to be formed, it can be designed separately
1240062 五、發明說明（7) 不同的製程步驟。例如，可於填充銅粉後，再另行壓縮銅 粉，使銅粉成較緊密結合。在此，需特別注意的是，若採 用不同的材料作為填充物，則可能會附加使用相對應之溶 劑或結合劑，以增加銅粉緊密填充的作用，同時，在形成 毛細結構前，會相對應地增加一乾燥的步驟或去結合劑的 步驟，以去除溶劑或結合劑。 然後，於步驟3 1 0中，分離塑型棒材與導管。之後， 於步驟3 1 2中，形成一毛細結構。形成毛細結構的方法有 許多種，例如燒結、黏著、填充、沈積等。最後，於步驟 3 1 4中，注入工作流體，並抽真空，將導管之另一端封口 後，便完成熱導管的製造流程。在此，依據所形成的毛細 結構的不同，所對應於工作流體之間的表面張力不同，可 適時改變對調注入工作流體與抽真空的執行順序後，再封 口。一般而言，若形成燒結毛細結構，則採取先注入工作 流體再抽真空的方式，可達到較佳效果。而若形成的毛細 結構為網狀毛細結構，或是溝狀毛細結構的話，則採取先 抽真空再注入工作流體的方式，可避免先抽真空時，工作 流體被過量抽取的缺點。 與第一實施例所不同的是，本實施例係先將塑型棒材 與導管分離後，才加熱燒結，以形成毛細結構。此兩步驟 的實施順序，可依據不同製程的需要，來做調整。至於所 採用的塑型棒材的材料，除了是一具可撓性之材料，且於 塑型棒材的表面較佳地配置有多個突狀物之外，所採用的 塑型棒材的材料，可以是一相對於形成毛細結構之材料而1240062 V. Description of the invention (7) Different process steps. For example, after filling the copper powder, the copper powder can be compressed separately to make the copper powder more tightly combined. Here, it is important to note that if different materials are used as fillers, corresponding solvents or bonding agents may be additionally used to increase the effect of copper powder compact filling. At the same time, before forming a capillary structure, A step of drying or a step of removing the binding agent is correspondingly added to remove the solvent or the binding agent. Then, in step 3 10, the molding rod and the catheter are separated. Then, in step 3 12, a capillary structure is formed. There are many ways to form capillary structures, such as sintering, adhesion, filling, deposition, etc. Finally, in step 3 1 4, the working fluid is injected and evacuated to seal the other end of the pipe, and then the manufacturing process of the heat pipe is completed. Here, according to the different capillary structures formed, corresponding to the different surface tensions between the working fluids, the execution order of injecting the working fluid and evacuation can be changed in time, and then sealed. In general, if a sintered capillary structure is formed, a better effect can be achieved by first injecting a working fluid and then evacuating. If the capillary structure formed is a reticular capillary structure or a sulcus capillary structure, the method of vacuuming first and then injecting the working fluid can avoid the disadvantage of excessive extraction of the working fluid when the vacuum is first evacuated. What is different from the first embodiment is that in this embodiment, the molding rod is separated from the duct, and then heated and sintered to form a capillary structure. The implementation order of these two steps can be adjusted according to the needs of different processes. As for the material of the molding rod, in addition to being a flexible material, and preferably having a plurality of protrusions on the surface of the molding rod, The material can be a material relative to the capillary structure
五、發明說明（8) 言，具較低燃點之材 料，^可被有機溶劑所溶2 =所採用的塑型棒材的材 當塑型棒材之材 2之材枓。 可直接自該導管中抽出/具可撓性之材料時，塑型棒材 棒材之材料係一且可 與該導管分離。再者，當塑型 =置有多個突狀：時之；：物型棒材的表面較 田燒結形成毛細結 貝係與毛細結構相 毛細結構之原料之一。v J犬狀物可直接被燒結而作為 :成毛細結構之材料：：’突狀物之材質係-相對於 熱後汽化或液化。一 乂 _“、、點之材料，在燒結時可被加 之材。型：=棒：：成毛細結構之材料為較低燃點 管分離。或者；：；:加熱後直接汽化或液化，使與導 解之材料，因此，—可被-有機溶劑所溶 :管分離。例如，當“棒材劑所溶解後，與該 時，：採用的有機溶劑為丙酮。材枓採用-高分子有機物 先進行埶導管〔的：：^發明所揭露之熱導管製造方法，係 :。此-方法，避免習知導管内部之毛細結 而遭受破·，可保有完整：：f ::的毛細結制後續加卫 導熱能力。且利用此方法所製m提高熱導管整體的 凡件散熱模组中，且可依日2;的，導官，係應用於電子 要，事先做塑形，使教導管u::散熱模組之形狀需 進散熱效果。 …等s此充分接觸電子元件表面，增 1240062 五、發明說明（9) 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。V. Description of the invention (8) In other words, materials with a lower ignition point can be dissolved by organic solvents 2 = material used for molding rods 2 material used for molding rods 2 When the flexible material can be withdrawn directly from the catheter, the material of the shaped rod is one and can be separated from the catheter. In addition, when shaping = there are a plurality of protrusions: when ;: the surface of the object-shaped bar is sintered to form a capillary knot, which is one of the raw materials of the capillary structure and the capillary structure. v J-dog can be directly sintered and used as: Capillary-forming material :: ′ The material of the protrusion is relative to vaporization or liquefaction after heating. The material of "乂", "," can be added during sintering. Type: = rod :: The material with capillary structure is separated from the lower ignition point tube. Or :::: directly vaporize or liquefy after heating, so that The deconstructed material is, therefore,-soluble in-organic solvents: the tube is separated. For example, when the "rods are dissolved, and then: the organic solvent used is acetone. The material used is-polymer organic matter, and the tube is first performed. [:: ^ The method of manufacturing the heat pipe disclosed in the invention is :. This method prevents the capillary knots inside the catheter from being damaged, and can maintain the integrity of the ::: :: capillary knot system for subsequent heat transfer. And using this method to improve the overall heat pipe of the heat dissipation module, and can be used in accordance with the day 2 ;, the guide, is used in electronic applications, shape in advance, so that the teaching tube u :: cooling module The shape needs to have a cooling effect. ... wait for this to fully contact the surface of the electronic component, increase 1240062 V. Description of the invention (9) Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Anyone skilled in this art will not leave Within the spirit and scope of the present invention, various modifications and retouching can be made. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
第13頁 1240062 圖式簡單說明 第1圖繪示乃習知熱導管製造方法的流程圖。 第2圖繪示乃依照本發明第一實施例之熱導管製造方 法的流程圖。 第3圖繪示乃依照本發明第二實施例之熱導管製造方 法的流程圖。Page 13 1240062 Brief Description of Drawings Figure 1 shows a flowchart of a conventional method for manufacturing a heat pipe. Fig. 2 is a flowchart showing a method for manufacturing a heat pipe according to the first embodiment of the present invention. Fig. 3 is a flowchart showing a method for manufacturing a heat pipe according to a second embodiment of the present invention.
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