TWM375205U - Flat hot pipe - Google Patents

Flat hot pipe Download PDF

Info

Publication number
TWM375205U
TWM375205U TW098217637U TW98217637U TWM375205U TW M375205 U TWM375205 U TW M375205U TW 098217637 U TW098217637 U TW 098217637U TW 98217637 U TW98217637 U TW 98217637U TW M375205 U TWM375205 U TW M375205U
Authority
TW
Taiwan
Prior art keywords
pipe body
metal pipe
flat
heat
heat pipe
Prior art date
Application number
TW098217637U
Other languages
Chinese (zh)
Inventor
Iv George A Meyer
jian-hong Sun
jie-ping Chen
David Paul Bono
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to TW098217637U priority Critical patent/TWM375205U/en
Publication of TWM375205U publication Critical patent/TWM375205U/en
Priority to US12/793,726 priority patent/US20110067844A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

五、新型說明: 【新型所屬之技術領域】 [0001] 本創作涉及一種散熱裝置,尤其涉及一種薄形的平板狀 熱管。 【先前技術】 [0002] 各種工業設備、量測儀器設備、電腦設備中都具有積體 電路元件,隨著電子產業的迅速發展,積體電路元件的 運作速度越來越快,伴隨著其產生的熱量亦更增多,而 積體電路元件在最高工作溫度以下操作,才能確保正常 的運作,必需以散熱裝置將熱量逸散至外界,傳統的散 熱裝置為金屬板搭配散熱鰭片,但對於效能及熱量都增 加的積體電路元件,傳統的散熱裝置已不敷所求,因此 發展出採用熱管的散熱裝置,習知的熱管呈圓柱狀,為 金屬管體内密封裝入毛細組織及工作流體並抽至真空狀 態後所製成,以工作流體的相變化來吸收及散發熱量。 [0003] 然而,在力求輕量化、微小化設備的現代,許多設備的 尺寸愈來愈小,使得習知的圓柱狀熱管難以容納在微小 薄形的空間中,另外,熱管用以熱連接發熱源及散熱用 的元件,但發熱源及散熱用的元件距離一段空間且之間 尚有其他元件,此些元件阻擋了發熱源至散熱用的元件 的路徑,這些原因都讓散熱系統的設計因空間的制肘而 大受限制。 [0004] 有鑑於此,本創作人遂針對上述現有技術,特潛心研究 並配合學理的運用,盡力改善並增進效能,終能提出一 表單编號A0101 第3頁/共18頁 M375205 種設計合理且有效的本創作。 【新型内容】 [0005] 本創作的目的,在於提供一種薄形的平板狀熱管,其可 容納於薄型空間中而較不佔用立體空間,且可迴避所安 裝空間中的其他元件而使空間利用率更加完全。 [0006] 為了達到上述的目的,本創作提供一種平板狀熱管,包 括: [0007] 一金屬管體; [0008] 二扁平狀擴張結構,分別成型於該金屬管體的首、末兩 段; [0009] 以縮管方式製成的一中間結構,成型於該金屬管體的中 段且分別連接該二扁平狀擴張結構; [0010] 一毛細組織,佈設於該金屬管體的内部; [0011] —工作流體,填注於該金屬管體的内部並附著於該毛細 組織中;以及 [0012] —支撐元件,穿設於該金屬管體的内部,該支撐元件推 抵該毛細組織朝向並貼接該金屬管體的内壁。 [0013] 本創作的功效在於,二擴張結構分別可緊密貼附發熱源 並供外加散熱元件緊密貼合,而達到導熱及散熱效果良 好的功效,又二擴張結構可容納在薄型的空間中,不佔 用立體空間,另外,中間結構可迴避安裝的空間中的其 他元件,使整體的空間利用率更加完全。 表單編號A0101 第4頁/共18頁 M375205 【實施方式】 [0014] 有關本創作的詳細說明及技術内容,配合圖式說明如下 ,然而所附圖式僅提供參考與說明用,並非用來對本創 作加以限制者。 [0015] 本創作涉及一種平板狀熱管,請參照第一至六圖所示, 刀别為本創作的原始素材圖、第一圖的施以縮管方式後 的成型圖、第二圖的彎折並壓扁成型圖、第三圖的填充 入毛細組織圖、第四圖的穿設支撐元件的剖視圖、及第 五圖的封合開口圖,該平板狀熱管包括一金屬管體10、 二擴張結構11、12 一中間結構13、-毛細組織20、一 工作流體30、及一支撐元件4〇。 [_],參照第-圖所示,以圓管形狀的—金屬管體ι〇做為熱 管的原始素材’該金屬管體1〇為導熱性良好的材質製成 例如銅’但不以此種材質為限,以銅製作該金屬管體 10是因為銅是-種堅勒、柔軟、富有延展性而有光澤的 金屬’ 一克的銅可以拉成三千米長的細絲,或壓成十多 T方米幾乎透明的銅猪,銅的導電性和導熱性很高僅 次於銀,軸比銀要便宜得乡,料絲素材的該金屬 管體10的内部為中空且其兩端呈開放狀態,該金屬管體 _管壁需稍薄以利後續製程的進行,但仍具有足夠的 結構強度。 _請參照第二及三圖所示,該二擴張結構"、12呈扁平狀 且分別成型於該金屬管體10的首、末兩段,該中間結構 13成型於該金屬管體10的中段且分別連接該二擴張結構 11、1 2 〇 表單編號A0101 第5頁/共18頁 更進一步地說明其成型的方法及程序,該中間結構13由 將作為原始素材的該金料體1G財段㈣管方式拉長 亚縮小管徑而成型,此縮管方式為-種旋壓延伸加工法 处該中間結構U的徑向截面仍維持圓形,此時該二擴張 :。構11、12轉相同的管徑且徑域面仍料圓形,又 遠中間結構13的管徑縮小但其内部仍為中空狀態,在該 二擴張結構u、12分別與該中間結構13的連接處形成有 -漸縮部"卜12卜該二漸縮部⑴、121呈圓錐狀,其 營徑分別由該二擴張結構u、12向該中間結㈣漸縮。 [0019] 接著可以依照使用環境的實際需求,將該中間結構㈣ 折或不f折,在本實_中為彎折狀態,該中間結㈣ 於=折處形成-彎折部m,再將截面原本是圓形的該金 屬s體1G施以壓輾作業而成為平板狀,即該擴張結㈣ 、12、該漸縮部⑴、m、該中間結構^、該彎折部 131皆成型為平板狀,扁平的形狀可以讓整體的厚度較小 ’則可容納在一薄型的空間中,此即為平板化的效用。 闺參照第四、五及六圖所示,從該金屬管體_開口處 佈設該毛細組義以該金辭㈣的㈣並貼接該金 屬s體1G的内壁,且該金屬管體10的内部仍保留有氣體 通道的空間,該毛細組織2Q為多孔狀結構,其為燒結粉 末(sintered P〇wder)的毛細結構,而佈設該毛細組織 20的方法為習知,在此實施例中不多作敘述。 [_佈設完該毛細組織2〇後,將社作流刪由開口處填注 於該金屬管體1G的㈣,該工作流賴的特性為汽化熱 高、流動性好、化學性質穩定、沸點較低,如水、乙醇 表單編號Α0101 第6頁/共18胃 M375205 、丙酮等,但不以此些液體為限,又該毛細組織2 0透過 毛細現象吸收該工作流體30,該毛細組織20的結構充滿 孔隙使得該工作流體30能夠被吸收,而注入的該工作流 體30的容積相當於該毛細組織20的孔隙的總容積。 [0022] 因該金屬管體10整體呈扁平狀,將該支撐元件40穿設於 該金屬管體10的内部以防止該金屬管體10塌陷,該支撐 元件40推抵該毛細組織20朝向並貼接該金屬管體10的内 壁,而穿設該支撐元件40的方法為習知,在此實施例中 不多作敘述。 [0023] 接著必需將該金屬管體10内部抽真空並將兩端開口處密 封,因為該金屬管體10中若存在作動流體以外的雜質氣 體(如空氣),因這些雜質氣體並不參與相變化循環,而 被稱做不凝結氣體,不凝結氣體除了會造成啟動溫度升 高外,在該工作流體30的相變化循環作動時,會被氣相 作動流體壓縮至冷凝段,而佔據一定的空間,而嚴重影 響其導熱效能。 [0024] 請參照第七及八圖所示,分別為本創作用於散發熱量的 示意圖的及第七圖吸收發熱源熱量的剖視圖,使用時, 將該二擴張結構11、12的其中之一作為蒸發段來貼附一 發熱元件40,因其呈扁平狀可更緊密貼附所述發熱元件 40,另一則作為冷凝段來供一散熱鰭片組50貼附,且呈 扁平狀的外形讓所述散熱鰭片組50可更緊密地貼附,而 該中間結構13則作為絕熱段,其較細且彎曲的管徑可穿 梭閃避其他元件並可達到書送氣體及液體的功能。 表單編號Α0101 第7頁/共18頁 M375205 [0025] 更進一步地來說明本創作的運作情況,於蒸發段處的附 著於該毛細組織20中的該工作流體30受所述發熱元件40 產生的熱量加溫而受熱蒸發為氣體,蒸氣通過該中間結 構13流動至冷凝段,蒸氣透過所述散熱鰭片組50將熱量 散發至外界並冷凝為液體,冷凝的液體進入冷凝段處的 該毛細組織20的孔隙中並回流補充至蒸發段,如此形成 相變化的循環迴路以達成散熱效果。 [0026] 本創作的改良在於,扁平狀外形的該二擴張結構11、12 可緊密貼附所述發熱元件40並供所述散熱鰭片組50緊密 貼合,而達到導熱及散熱效果良好的功效,又扁平狀外 形的該二擴張結構11、12可容納在薄型的空間中,例如 訴求輕薄化的筆記型電腦中就非常地適用,另外,具有 該彎折部131的該中間結構13呈細長且彎曲狀,可迴避安 裝的空間中的其他元件,使整體的空間利用率更加完全 〇 [0027] 當然,本創作還可有其他多種實施例,在不背離本創作 精神及其實質的情況下,熟悉本領域的技術人員當可根 據本創作演化出各種相應的改變和變形,但這些相應的 改變和變形都應屬於本創作所附的申請專利的保護範圍 〇 【圖式簡單說明】 [0028] 第一圖為本創作的原始素材圖。 [0029] 第二圖為第一圖的施以縮管方式後的成型圖。 [0030] 第三圖為第二圖的彎折並壓扁成型圖。 表單編號A0101 第8頁/共18頁 M3752.05 [0031] 第四圖為第三圖的填充入毛細組織圖。 [0032] 第五圖為第四圖的穿設支撐元件的剖視圖 [0033] 第六圖為第五圖的封合開口圖。 [0034] 第七圖為本創作用於散發熱量的示意圖。 [0035] 第八圖為第七圖吸收發熱源熱量的剖視圖 【主要元件符號說明】 [0036] 金屬管體10 [0037] 漸縮部 111、121 [0038] 彎折部131 [0039] 毛細組織2 0 [0040] 工作流體30 [0041] 支撐元件50 [0042] 發熱元件40 [0043] 熱鰭片組50 [0044] 擴張結構11、12 [0045] 中間結構13 表單編號A0101 第9頁/共18頁V. New Description: [New Technology Field] [0001] The present invention relates to a heat sink, and more particularly to a thin flat heat pipe. [Prior Art] [0002] Various industrial equipment, measuring instruments, and computer equipment all have integrated circuit components. With the rapid development of the electronics industry, the operating speed of integrated circuit components is becoming faster and faster. The heat is also increased, and the integrated circuit components operate below the maximum operating temperature to ensure normal operation. The heat sink must be used to dissipate heat to the outside world. The traditional heat sink is a metal plate with heat sink fins, but for performance. As with the integrated circuit components with increased heat, the conventional heat sink has been insufficient. Therefore, a heat sink using a heat pipe has been developed. The conventional heat pipe has a cylindrical shape, and the capillary structure and the working fluid are filled in the metal pipe body. It is made after being pumped to a vacuum state to absorb and dissipate heat by the phase change of the working fluid. [0003] However, in the modernization of devices that strive to be lightweight and miniaturized, many devices are becoming smaller and smaller, making conventional cylindrical heat pipes difficult to accommodate in a thin and thin space, and heat pipes for heat connection. Source and heat-dissipating components, but the heat source and heat-dissipating components are separated by a space and there are other components between them. These components block the path from the heat source to the heat-dissipating component. The elbow of space is greatly limited. [0004] In view of this, the present creator has focused on the above-mentioned prior art, and has devoted himself to researching and coordinating the use of academics, trying to improve and enhance the performance, and finally can propose a form number A0101 page 3/18 pages of M375205 kinds of reasonable design And effective this creation. [New Content] [0005] The purpose of the present invention is to provide a thin flat heat pipe that can be accommodated in a thin space without occupying a three-dimensional space, and can avoid other components in the installed space to make space utilization. The rate is more complete. [0006] In order to achieve the above object, the present invention provides a flat heat pipe, comprising: [0007] a metal pipe body; [0008] two flat expansion structures, respectively formed in the first and last two sections of the metal pipe; [0009] An intermediate structure formed by shrinking is formed in a middle portion of the metal pipe body and respectively connected to the two flat expansion structures; [0010] a capillary structure disposed inside the metal pipe body; [0011 a working fluid filled in the interior of the metal pipe and attached to the capillary structure; and [0012] a support member penetrating inside the metal pipe body, the support member pushing against the capillary structure and The inner wall of the metal pipe body is attached. [0013] The effect of the present invention is that the two expansion structures can be closely attached to the heat source and closely adhere to the external heat dissipating component, thereby achieving good heat conduction and heat dissipation effects, and the second expansion structure can be accommodated in the thin space. It does not occupy the three-dimensional space. In addition, the intermediate structure can avoid other components in the installed space, making the overall space utilization more complete. Form No. A0101 Page 4 of 18 M375205 [Embodiment] [0014] The detailed description and technical contents of the present invention are as follows with reference to the drawings, but the drawings are provided for reference and explanation only, and are not intended to be used for this purpose. Creation is limited. [0015] The present invention relates to a flat heat pipe, as shown in the first to sixth figures, the original material map of the original creation, the molding diagram of the first figure after the shrinkage mode, and the bending of the second figure. a folded and flattened molding diagram, a filled capillary structure diagram of the third diagram, a cross-sectional view of the through-supporting member of the fourth figure, and a sealing opening diagram of the fifth figure, the flat-shaped heat pipe comprising a metal pipe body 10, two The expanded structure 11, 12 an intermediate structure 13, a capillary structure 20, a working fluid 30, and a support member 4A. [_], as shown in the figure, the metal tube body ι〇 in the shape of a circular tube is used as the original material of the heat pipe. The metal tube body 1 is made of a material having good thermal conductivity, for example, copper. The material is limited to copper. The metal pipe body 10 is made of copper because the copper is a kind of soft, ductile and lustrous metal. One gram of copper can be drawn into a three-kilometer long filament, or pressed into More than ten T square meters of almost transparent copper pigs, copper's conductivity and thermal conductivity is second only to silver, the axis is cheaper than silver, the inside of the metal body 10 of the wire material is hollow and its two ends In an open state, the metal tube body wall needs to be slightly thinner for subsequent processing, but still has sufficient structural strength. _Please refer to the second and third figures, the two expanded structures "12 are flat and respectively formed on the first and last two sections of the metal pipe body 10, and the intermediate structure 13 is formed on the metal pipe body 10 The middle section and the two expansion structures 11 and 12 respectively are connected to form No. A0101, page 5/18, and the method and program for molding thereof are further explained. The intermediate structure 13 is made of the gold material to be used as the original material. The section (four) tube method is formed by lengthening the diameter of the tube, and the tube shrinking method is a kind of spinning extension processing method. The radial section of the intermediate structure U is still circular, and the second expansion is: The structures 11 and 12 are rotated to the same diameter and the radial surface is still round, and the diameter of the distal intermediate structure 13 is reduced but the interior thereof is still hollow, and the two expanded structures u and 12 are respectively associated with the intermediate structure 13 The joint is formed with a - tapered portion. The two tapered portions (1) and 121 have a conical shape, and the pitch diameter thereof is gradually tapered from the two expanded structures u and 12 toward the intermediate joint (four). [0019] Then, according to the actual needs of the use environment, the intermediate structure (four) is folded or not folded, in the actual state, the bending state, the intermediate knot (four) is formed at the fold - the bending portion m, and then The metal s body 1G having a circular cross section is formed into a flat shape by a pressing operation, that is, the expanded joints (4), 12, the tapered portions (1), m, the intermediate structure, and the bent portion 131 are formed into The flat shape, the flat shape allows the overall thickness to be smaller', and can be accommodated in a thin space, which is the utility of flattening. Referring to the fourth, fifth and sixth figures, the capillary group is disposed from the metal pipe body_opening to the (4) of the gold word (4) and attached to the inner wall of the metal s body 1G, and the metal pipe body 10 is The space of the gas passage is still retained inside, and the capillary structure 2Q is a porous structure which is a sintered structure of a sintered powder, and a method of arranging the capillary structure 20 is conventional, and is not in this embodiment. Make more narratives. [_ After setting up the capillary structure 2, the social flow is filled by the opening (4) of the metal pipe body 1G. The characteristics of the working flow are high vaporization heat, good fluidity, stable chemical properties, and boiling point. Lower, such as water, ethanol form number Α 0101 page 6 / total 18 stomach M375205, acetone, etc., but not limited to these liquids, and the capillary structure 20 absorbs the working fluid 30 through capillary phenomenon, the capillary structure 20 The structure is filled with pores such that the working fluid 30 can be absorbed, and the volume of the injected working fluid 30 corresponds to the total volume of the pores of the capillary structure 20. [0022] Since the metal pipe body 10 has a flat shape as a whole, the support member 40 is bored inside the metal pipe body 10 to prevent the metal pipe body 10 from collapsing, and the support member 40 is pushed against the capillary structure 20 and The method of attaching the support member 40 to the inner wall of the metal pipe body 10 is known, and will not be described in this embodiment. [0023] Next, the inside of the metal pipe body 10 must be evacuated and sealed at both ends of the opening, because if there is an impurity gas (such as air) other than the working fluid in the metal pipe body 10, since the impurity gases do not participate in the phase The change cycle is called a non-condensing gas, and the non-condensing gas, in addition to causing an increase in the starting temperature, is compressed by the gas phase actuating fluid to the condensation section when the phase change cycle of the working fluid 30 is actuated, and occupies a certain amount. Space, which seriously affects its thermal conductivity. [0024] Please refer to the seventh and eighth figures, respectively, for the schematic diagram of the heat generation and the seventh diagram for absorbing the heat of the heat source, in use, one of the two expansion structures 11, 12 As the evaporation section, a heat generating component 40 is attached, because the flat shape can more closely attach the heat generating component 40, and the other serves as a condensation section for a heat sink fin group 50 to be attached, and has a flat shape. The heat dissipating fin set 50 can be attached more closely, and the intermediate structure 13 acts as a heat insulating section, and the thin and curved diameter of the tube can shuttle to evade other components and can achieve the functions of gas and liquid. Form No. 1010101 Page 7 of 18 M375205 [0025] Further explaining the operation of the present creation, the working fluid 30 attached to the capillary structure 20 at the evaporation section is generated by the heating element 40. The heat is heated and evaporated by heat into a gas. The vapor flows through the intermediate structure 13 to the condensation section. The vapor passes through the heat dissipation fin set 50 to dissipate heat to the outside and condenses into a liquid, and the condensed liquid enters the capillary structure at the condensation section. The pores of 20 are replenished to the evaporation section by reflux, thus forming a phase-changing circulation loop to achieve a heat dissipation effect. The improvement of the present invention is that the two expanded structures 11 and 12 of the flat shape can closely adhere to the heat generating component 40 and the heat radiating fin set 50 can be closely adhered to achieve good heat conduction and heat dissipation. The two expanded structures 11, 12 of the functional and flat shape can be accommodated in a thin space, for example, in a notebook computer that is thin and light, and the intermediate structure 13 having the bent portion 131 is Slim and curved, it can avoid other components in the installed space, making the overall space utilization more complete. [0027] Of course, there are many other embodiments of this creation, without departing from the spirit of this creation and its essence. Those skilled in the art can devise various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should belong to the scope of protection of the patent application attached to the present invention. [Simple description of the drawing] 0028] The first picture is the original material map of the creation. [0029] The second figure is a molding view of the first figure after the shrink tube method is applied. [0030] The third figure is a bent and flattened view of the second figure. Form No. A0101 Page 8 of 18 M3752.05 [0031] The fourth figure is the filled-in capillary structure of the third figure. [0032] FIG. 5 is a cross-sectional view of the piercing support member of the fourth figure. [0033] FIG. 6 is a seal opening view of the fifth figure. [0034] The seventh figure is a schematic diagram of the creation for dissipating heat. 8 is a cross-sectional view of the heat absorption source of the heat source in the seventh diagram [Description of main components] [0036] Metal pipe body 10 [0037] Tapered portion 111, 121 [0038] Bending portion 131 [0039] Capillary structure 2 0 [0040] Working Fluid 30 [0041] Supporting Element 50 [0042] Heating Element 40 [0043] Heated Foil Set 50 [0044] Expanded Structure 11, 12 [0045] Intermediate Structure 13 Form No. A0101 Page 9 / Total 18 pages

Claims (1)

M375205 六、申請專利範圍: 1. 一種平板狀熱管,包括: 一金屬管體; 二扁平狀擴張結構,分別成型於該金屬管體的首、末兩段; 以縮管方式製成的一中間結構,成型於該金屬管體的中段且 分別連接該二扁平狀擴張結構; 一毛細組織,佈設於該金屬管體的内部; 一工作流體,填注於該金屬管體的内部並附著於該毛細組織 中;以及 一支撐元件,穿設於該金屬管體的内部,該支撐元件推抵該 毛細組織朝向並貼接該金屬管體的内壁。 2. 如請求項第1項所述的平板狀熱管,其中該金屬管體由銅 材質製成。 3. 如請求項第1項所述的平板狀熱管,其中該扁平狀擴張結 構及該中間結構的連接處形成有一漸縮部。 4. 如請求項第1項所述的平板狀熱管,其中該中間結構彎折 成型有一彎折部。 5. 如請求項第1項所述的平板狀熱管,其中該中間結構呈扁 平狀。 6. 如請求項第1項所述的平板狀熱管,其中成型該中間結構 的縮管方式為旋壓延伸加工。 7. 如請求項第1項所述的平板狀熱管,其中該毛細組織為燒 結粉末結構。 3 098217637 表單編號A0101 第10頁/共18頁 0982055343-0M375205 VI. Patent application scope: 1. A flat heat pipe comprising: a metal pipe body; two flat expansion structures respectively formed on the first and last sections of the metal pipe body; and an intermediate pipe formed by shrinkage pipe a structure formed in the middle portion of the metal pipe body and respectively connected to the two flat expanded structures; a capillary structure disposed inside the metal pipe body; a working fluid filled in the interior of the metal pipe body and attached thereto In the capillary structure; and a supporting member penetrating inside the metal pipe body, the supporting member is pushed against the capillary structure toward and attached to the inner wall of the metal pipe body. 2. The flat heat pipe of claim 1, wherein the metal pipe body is made of copper. 3. The flat heat pipe according to claim 1, wherein the flat expansion structure and the joint of the intermediate structure form a tapered portion. 4. The flat heat pipe of claim 1, wherein the intermediate structure is bent to form a bent portion. 5. The flat heat pipe of claim 1, wherein the intermediate structure is flat. 6. The flat heat pipe according to claim 1, wherein the shrinkage tube forming the intermediate structure is a spin-extension process. 7. The flat heat pipe of claim 1, wherein the capillary structure is a sintered powder structure. 3 098217637 Form No. A0101 Page 10 of 18 0982055343-0
TW098217637U 2009-09-24 2009-09-24 Flat hot pipe TWM375205U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW098217637U TWM375205U (en) 2009-09-24 2009-09-24 Flat hot pipe
US12/793,726 US20110067844A1 (en) 2009-09-24 2010-06-04 Planar heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098217637U TWM375205U (en) 2009-09-24 2009-09-24 Flat hot pipe

Publications (1)

Publication Number Publication Date
TWM375205U true TWM375205U (en) 2010-03-01

Family

ID=43755614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098217637U TWM375205U (en) 2009-09-24 2009-09-24 Flat hot pipe

Country Status (2)

Country Link
US (1) US20110067844A1 (en)
TW (1) TWM375205U (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US20120325438A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan Heat pipe with flexible support structure
US20120325437A1 (en) * 2011-06-27 2012-12-27 Celsia Technologies Taiwan, I Flat heat pipe with capilllary structure
US8792238B2 (en) * 2012-02-03 2014-07-29 Celsia Technologies Taiwan, Inc. Heat-dissipating module having loop-type vapor chamber
CN103813695B (en) * 2012-11-13 2016-08-17 台达电子工业股份有限公司 Hydrocone type heat abstractor
US10077945B2 (en) * 2016-05-27 2018-09-18 Asia Vital Components Co., Ltd. Heat dissipation device
US10932393B2 (en) * 2019-03-30 2021-02-23 Intel Corporation Torsional heat pipe
TWI781679B (en) * 2021-07-07 2022-10-21 邁萪科技股份有限公司 Thermal conductivity structure with liquid-gas splitting mechanism
US11828537B2 (en) * 2021-07-27 2023-11-28 Asia Vital Components (China) Co., Ltd. Floating heat pipe assembly and clamp collar for using therewith

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3164518B2 (en) * 1995-12-21 2001-05-08 古河電気工業株式会社 Flat heat pipe
US6848499B1 (en) * 1998-02-23 2005-02-01 Intel Corporation Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
JP3376346B2 (en) * 2000-09-25 2003-02-10 株式会社東芝 Cooling device, circuit module having the cooling device, and electronic equipment
US20030024691A1 (en) * 2001-07-31 2003-02-06 Leu-Wen Tsay High efficiency heat sink
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US6802362B2 (en) * 2002-02-21 2004-10-12 Thermal Corp. Fin with elongated hole and heat pipe with elongated cross section
US6880626B2 (en) * 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
JP2005079325A (en) * 2003-08-29 2005-03-24 Toshiba Corp Heat pipe, cooling device having heat pipe and electronic apparatus equipped with the cooling device
US7275588B2 (en) * 2004-06-02 2007-10-02 Hul-Chun Hsu Planar heat pipe structure
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US7770631B2 (en) * 2008-03-19 2010-08-10 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Also Published As

Publication number Publication date
US20110067844A1 (en) 2011-03-24

Similar Documents

Publication Publication Date Title
TWM375205U (en) Flat hot pipe
US7472479B2 (en) Heat pipe and method of producing the same
US20070107878A1 (en) Heat pipe with a tube therein
US20090084526A1 (en) Heat pipe with composite wick structure
US20070114008A1 (en) Heat pipe
US20100263835A1 (en) Heat pipe
CN100529636C (en) Heat pipe and method for manufacturing same
TWI288224B (en) Manufacturing method of heat pipe
US20140054014A1 (en) Heat pipe and method for making the same
TW201945683A (en) Loop heat pipe with condensation section partially filled with capillary material including an evaporation cavity, a condensation section, a steam flow pipe and a liquid flow pipe, and characterized in ensuring a liquid working fluid to actually absorb and a return speed to be fast
US20070240851A1 (en) Heat pipe
JP5642836B2 (en) heat pipe
CN201540050U (en) Tabulate heat pipe
TWI407070B (en) Method of manufacturing flat plate heat pipe
US20060260786A1 (en) Composite wick structure of heat pipe
CN114485239A (en) Heat switch heat pipe and preparation method thereof
TWI335412B (en) Heat pipe
TWI530655B (en) Plate type heat pipe
TWI343986B (en) Heat pipe
TWI330250B (en) Heat pipe and methode of making the same
TWM412344U (en) Planar heat pipe having one expanded side
TW201423021A (en) Heat pipe and method of manufacturing the same
CN220250786U (en) Novel radiating pipe
TWI321646B (en) Heat pipe
CN216694604U (en) Heat switch heat pipe

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model