TWI238768B - Fabricating method and structure of non-conducting metallization of plastic backing - Google Patents

Abstract

The present invention relates to a fabricating method and structure of non-conducting metallization of plastic backing. In the present invention, the surface of the plastic backing is coated with multiple metal films by evaporation. Because of the physical property of the metal, the metal evaporated plastic backing is still not conductive. Thus, the plastic backing of the present invention appears like metal, while electromagnetic waves can still pass it. Therefore if the present invention is used as shell of mobile phones, it will not interfere the transmission and reception of electromagnetic waves by absorption or reflection.

Description

1238768 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method and structure for manufacturing a non-conductive metallization of a plastic substrate, and more specifically, it relates to electronics, communication, information, and other related matters. Non-conductive metallization manufacturing technology for plastic casing or components of products. [Previous technology] With the evolution of personalization and popularization of the new generation of wireless communication mobile phone products, the demand for surface decoration with metal appearance has become more and more strong, although directly using metal or alloy materials can meet the demand; However, it is worth noting that if metal materials are used directly for the processing procedures of mechanical components, a is not only costly and time-consuming; in addition, it is limited by the conductive metal's shielding of electromagnetic waves (metal shielding effect), As a result, when the mobile phone with an internal antenna is applied, the metal casing will cause shielding interference to electromagnetic wave transmission and reception, which will affect the display of infeasible products. In addition, the uranium industry has also tried The injection-molded plastic components are used as: electricity: the product's shell, and then through traditional electricity money, resistance heating vacuum steamer, sputtering, electronic vacuum evaporation (Eiectrón ea ::, processing method 'Perform metal coating operations on the surface of plastic substrates; front ^ square ^, although it can achieve the effect of forming a metallic luster on the surface of plastic substrates If the layer has conductive properties, == for electromagnetic waves will cause the negative effect of interference, resulting in the wireless problem of the built-in antenna; the deduction should 'will cause poor reception quality such as communication interruption or interference. Metal layer & formed on the surface of plastic substrate

Page 6 1238768 V. Description of the invention (2), the problem of wave interference, | The industry has developed a number of controls as follows to achieve the non-conducting or electromagnetic wave-free range of effects ^ ί = i The film thickness of this effect is only In terms of the technique of <200 angstr0 | n, the thickness of the nickel-copper-nickel film it produces is greater than or equal to r (reter, and the electro-mineralization process originally uses the plastic knee substrate v to electrify the film layer. The non-conducting effect of 乂, 乂 ..., the vacuum evaporation can not be paid, but although it can pass through the membrane angstrom, but because of 暄; ^ * 丁., &Lt; 列 逆 巧 wuu Ze, and, fb pancreas; not enough to provide the market needs of metal light r: L ΐ glue module geometry is a three-dimensional change, it is also a great difficulty to achieve the uniform film thickness of each part. For = can be known, direct use Traditional technology cannot meet the needs of Renze at the same time, and can not ensure that all parts of the film can be maintained: the characteristics of V width does not interfere with electromagnetic waves. 诗 明 # To improve the overall competitiveness of the domestic mobile phone industry, And have :: 2 News Products Plastic The actual needs of the components, developed a metallization manufacturing method; technically, the present invention-Ding i *, including: its, non-conductive metallization of the surface of plastic components; multiple primer, middle and top coating spray painting technology. [Summary of the invention] The main purpose of the invention is to provide a kind of plastic substrate which is non-conductive and belongs to the shovel film; the method and the structure thereof, through the manufacturing method of the present invention, can be used to: Between the base coat and the middle coat of the plastic substrate, the outside is compatible: 1238768 V. The top coat of the description of the invention (3) 'makes the manufactured product not only have sufficient metallic luster, but also does not interfere or interrupt the electromagnetic wave transmission and reception In addition, the finished product manufactured by the present invention can meet the requirements of wear resistance, weather resistance, chemical resistance, beautiful appearance, etc. at the same time.

Regarding the technology, means and other effects adopted by the present invention to achieve the above-mentioned objectives, several preferred and feasible embodiments are described in detail with reference to the drawings. The above-mentioned objects, features, and other aspects of the present invention are described in detail below. The advantages, when can be obtained in-depth and specific understanding; First, the material physical principle applied by the technology of the present invention is described as follows: T One 'applies the resistance value calculation principle of a sample; for example, resistance value and sample length Proportionally, but inversely proportional to the conductivity of the material and the conduction area of the sample ', where the conduction area is the product of the conduction width and the conduction thickness, where the conduction thickness can be regarded as the film thickness of the metal film layer; it can be known from the aforementioned principle of resistance value calculation. Select the metal material with the lowest electrical conductivity. For the materials that are currently widely used in metal ore films, their electrical conductivity, melting point temperature, boiling point temperature during evaporation heat, etc. are described in detail in the following table: Physical properties of metal key film materials : Metal conductivity (1 / cm-W) Melting point temperature (° C) Evaporation heat (KJ / mole) Boiling point temperature (° 〇Ti 〇.0234x106 1660 421 3287

1238768 V. Description of the invention (4)

Mo 0. 187 2617 598 4612 W 0. 189 340 7 824 5 6 5 5 Sn 0.0917 232 295 22 70 A1 0. 377 660 293 2467 Cr 0. 0774 1857 344 2 672 Ni 0. 143 1453 370 2732 Zn 0. 166 419 1 15 907 Fe 0. 0993 1535 349 2 75 0 It is known from the table that T i, Sn and Cr have lower conductivity, that is, at a certain film thickness, they have higher resistance values; Therefore, Ti, Sn, and Cr are the preferred materials for non-conductive metal coatings. Secondly, by precisely controlling the thickness of the film layer to have the maximum resistance value, it is also necessary to consider the formation of metal non-conductive layers in plastic components. . Second, the principle of contact resistance between vaporized films is used to stack more than one layer of non-conductive film on a layer of non-conductive film in a spaced manner. Among them, each layer allows electromagnetic waves to enter and exit, and although the stacked metal film has sufficient Metal

Page 9 1238768 V. Description of the invention (5) Gloss, but still p 彳 metal coating side = ', hold non-conductive state' · In other words, the electromagnetic wave provided by the present invention is transmitted through OR technology: metal film made of, will not The communication quality of wireless communication equipment: 5 interference, so it can ensure the manufacture of wireless communication equipment: i hair: provided-a kind of plastic substrate non-conductive metallized lacquer operation, and on the bottom; on the plastic substrate After spraying the finished product and putting it into vacuum (it can be sprayed without primer), it can be used for air-steaming. The ^ * — · —, the plastic substrate (1〇) When the surface metal is really controlled or pressed ^ two Γ; the thickness of the metal film of the healer can be passed through the amount of metal raw material (20i), ', must match? Without V: without the transmission or reception of the first-layer metal film formed by evaporation, it will produce dry_ \ pairs of radio frequency M—freqUenCy), for example: wait for 3 to 30 seconds, and then, steam the machine first When paused for a while, the second metal film (202), after the metal layer is cured, and then, after evaporation, the surface of the plastic component can be seen ^ two non-conductive metal film layer; most organic, steam The third layer of metal film (20: as required), the conductive metal film can be paused in order, ... So far, its structural form can be used in this way, so that plastic base pine can not transmit and connect with electromagnetic waves. It has a metallic luster effect, but 'the ones used in the layers of the present invention: = m, etc .: the same. For example, the first layer can be rhenium; in practice, there is no restriction on the necessity of the fourth layer to be chromium, ... or the first layer to be: the first layer to be rhenium, the third layer to be tin, and the fourth layer to be chromium … Or other two cylinders, the second layer is chromium, the third layer is tin, and α; other metal materials, for example, page 10 1238768

Such as: νΛ? 太,: Record steel, copper, etc., can also be used together.士 一 士 &amp; 彳 r, ★ The mention is' the plastic component after the metal film is steamed, you can enter another two :::: "Middle-sequence spray paint abbreviation · · middle coating), which can be added with pigment to = , 果 果, 'and then topcoat spray painting; In addition, you can also perform topcoat spray paint without middle coating, or add pigment to the topcoat spray paint to produce a coloring effect. 0 The other metal layer provided by this invention is not conductive The manufacturing method of the steamed film / is between each non-conductive metal film layer, and an oxide layer (30) ^ ^ SiO (si 1 icon mono-〇xide) 'S i 02 (si 1 i con dioxide) ^ Ti02 (titanium dioxide) ^ Zr02 (Zirconium d ^ oxije), etc., and carry out its spaced hybrid reactor with metal film layer. These oxides can provide sufficient resistance to make all The vaporized laminated film layer has non-conductive characteristics (as shown in the second figure); for example, it can be a combination of a tin metal layer, a SiO layer, a tin metal layer, and a SiO layer. The manufacturing method of the vapor deposition film is to pass oxygen into the vapor deposition machine after each non-conductive film layer is formed, causing The surface of the metal film layer is oxidized, so that an oxide film (40) is formed on the metal surface, and then a &amp; 彳 ^ layer of metal film is stacked in sequence; in actual application, if no gas is passed in, another one will be vaporized. After the cavity is opened and then closed, it can also achieve the effect of direct surface oxidation without lightning. In addition, it belongs to the film surface. In addition, after completing the evaporation of each metal film, the oxygen introduced is Argon, He 1 ium, nitrogen, ... and other inert gases, the stacked metal film created can also achieve non-conductive, does not interfere with electromagnetic waves, the effect of production. To further clarify, if after completing each layer of metal film 1 —

1238768 V. Description of the invention (7) The non-conductive gold has non-conductive, non-principle material surface shielding properties as described in "These receipts or inverses. Through the metal film layer shot shown in the fourth figure, the market proposed to the charged and non-industrial industry. Any gas is only temporarily stopped. After that, the film is stacked, and the manufactured gold interferes with electromagnetic wave transmission and Receiving effect ... Second; Principle of contact resistance between vaporized films. ^ In this way, the plastic-based metal luster manufactured by the technology of the present invention can retain the characteristics of electromagnetic waves; therefore, in the application of communication equipment, for example, the casing of a mobile phone (50) ( 51) When the component is used = 2) It can achieve the characteristics of not causing electromagnetic wave transmission and reception disturbance, and thus can maintain high communication quality; this method of metal evaporation on a plastic substrate can not only have a metallic appearance The demand for plastic components, and the disturbance of electromagnetic wave transmission and reception quality limits, is a truly required manufacturing method. In summary, when the present invention is implemented, the metal film vaporized film of the present invention is steamed on the surface of the plastic component, and the paint is used to achieve the effect of metallic luster appearance, wave transmission and reception. For mobile phones such as personal communication The plastic case function of the invention. The "one method" proposed by the present invention is indeed in line with the industry's "structure with industry availability" which should have been disclosed. According to the manufacturing method, a high-gloss metal base coat spray paint, a middle coat spray paint and a top coat spray can be used, and the wireless communication equipment has non-conductive and does not interfere with the electromagnetic built-in antenna. For example, the surface is metallized. The actual requirements of metallized manufacturing; therefore, the present invention is beyond doubt; in addition, the publications of the embodiments of the present invention have not been used publicly.

1238768

Page 13 1238768 Brief description of the drawings [Explanation of the drawings] The first diagram is a schematic diagram of the metal plating structure of the first embodiment of the present invention. The second figure is a schematic diagram of a metal plating structure according to a second embodiment of the present invention. The third figure is a schematic diagram of a metal plating film structure according to a third embodiment of the present invention. The fourth figure is a schematic partial cross-sectional view of a mobile phone casing constituted by the present invention. [Illustration of drawing number] (10) Plastic substrate (201) First metal film (202) Second metal film (203) Third metal film (3 0) Oxide layer (4 0) Oxide film (5 0) Mobile phone (5 1) Metal shell of casing (52)

Page 14

Claims (1)

1238768 VI. The scope of the patent application is -1. Plastic: ί: glue; Γ metallization manufacturing method, which is mainly based on the thickness of the metal film layer is in line with the film layer 'and controlled, and then the above metal film sounds 、 求; / The temple metal film layer is cured and formed on a plastic substrate to form ^ 2, and another metal film layer is steamed in abundance, thereby having a multi-layer metal ore secondary electric metal ore film, and the plastic substrate 9 ^ Γ is maintained. Non-conductive state. Z · Manufacturing method based on the scope of patent application, where :; 1 film item / 2 of the plastic substrate non-conductive metal; for example: can be the first layer, θ Jin metal materials, can be different The layer is…; or the first layer is m one layer / tin, the third layer is tin, the fourth layer is chromium, or other people—the layer is chromium, the third layer is tin, the second one, nickel , Titanium, stainless steel, workmanship: ... method is also ㊁: of: a material, such as: 〇 ^ ^ 1 can also be used together. • Kind of non-conductive metallized surname structure of glue substrate, there are multiple layers of metal film steamed on the surface of 1φ i # material substrate, and the plastic film is continuously stacked, and each metal film layer is non-conductive; Film layer system 4. The manufacturing method according to item 1 of the scope of the patent application, in which the surface of the plastic substrate, the two substrates, and the surface of the metal glue substrate can be sprayed with a primer. Butyl metal ... w, plastic take-5 plastic non-conductive metallization manufacturing method, which mainly belongs to the film M 22 first, then a metal layer is steamed on the plastic substrate. : Belongs to = chemical formation = = another-metal film layer, which is used for plastic substrates :: shaped metal film layer, so that the plastic substrate is kept non-conductive and non-charged Page 15 1238768 6. Scope of Patent Application &quot; —-6 ) According to the method for manufacturing non-conductive metallization of a plastic substrate according to item 5 of the scope of the patent application, before the surface of the plastic substrate is subjected to metal evaporation, the surface of the plastic substrate may be sprayed with a primer. 7. The method for manufacturing non-conductive metallization of plastic substrates according to item 5 of the scope of the patent application, wherein the oxide layer is composed of Si 0 (si 1 icon mono-oxide). 8 According to the scope of the patent application The method for manufacturing a non-conductive metallization of a plastic substrate according to item 5, wherein the oxide layer may be composed of Si 02 (silicon dioxide). 9. According to the method for manufacturing non-conductive metallization of a plastic substrate according to item 5 of the scope of the patent application, the oxide layer may be composed of Zr02 (Zirconium dioxide). 10. The method for manufacturing a non-conductive metallization of a plastic substrate according to item 5 of the scope of the patent application, wherein the oxide layer 玎 is Ti〇2 (titanium dioxide) 〇1 1 The structure is mainly formed by a plurality of metal film layers and oxide layer structures on a surface of a plastic substrate, and the metal film layers and the oxide system are stacked alternately, and the metal film layers are non-conductive structures. 1 2 · —A method for manufacturing non-conductive metallization of a plastic substrate, which mainly comprises firstly taking a plastic substrate, and then evaporating a metal coating on the plastic substrate, controlling the thickness of the metal coating to meet the non-conductive condition, and passing in oxygen On the metal film layer, after the surface of the metal film layer is oxidized, another metal plating film is evaporated on the surface of the metal film layer, thereby forming a plurality of layers of non-conductive metal bond films on the plastic substrate, so that Page 16 1238768 --- VI. Patent application scope Plastic substrates remain non-conductive. _13, a kind of non-conductive metallization of plastic substrates 1 First take-plastic substrate, then plastic substrate ^ method 'its Mainly because the thickness of the metallurgical layer meets the non-conducting condition ^ —Metal * film, the control body is opened, and after the surface of the metal film layer is oxidized, the second step is to directly vaporize a metal plating film in the cavity of the machine, thereby cladding the plastic substrate. Another film is vaporized on the surface, which keeps the plastic substrate non-conductive. Several layers of non-conductive metal plating 14. A kind of plastic substrate non-conductive metallization = There are multiple metal film layers on the surface of the material: V ,; main / Λ are continuously stacked in a series, and each metal film layer = An oxide film is formed on the surface of each metal film layer. Keep electricity ,,,. And can be applied to various metal films. 5.—Manufacturing methods for non-conductive metallization of plastic substrates ^ First take the plastic substrate and then apply it on the plastic substrate, which mainly depends on the thickness of the metal film layer. The conductive conditions are connected to the Meng film layer, and the metal film layer is controlled after the metal film layer is formed. Then! Layer of a metal inert gas, thereby forming a plurality of metal films on the plastic substrate. The plastic substrate remains non-conductive. V electric metal film, and order page 17