TWI237687B - Computer control measuring center - Google Patents

Abstract

This invention disclosed a computer control measuring center including multiple fully modular and functional measuring probes, a common multi-axis motion platform, a common digital image guiding device, and a common data acquisition and processing module. The device under test (DUT) is fixed in the fixture of the said motion platform. According to the desired measuring items, the corresponding required measuring probes are installed into a probe fetching-fixture by a probe-changing-mechanism automatically or manually. The said probe fetching-fixture can rotate in three directions, such as pitch, roll, and yaw. Combining with the said digital image guiding device the probe can align and measure the specific point or area of the DUT. In this way the invention can measure more than one parameter of the DUT, especially the coupling parameters. A wireless communication module can be incorporated helping the measuring data storing into the data acquisition and processing module more conveniently in addition to using a conventional cable connection.

Description

1237687

Page 7 of the invention description (2) [Technical field to which the invention belongs]-A digital image J :: shall: use a multi-axis mechanism platform, move or manually change the probe, and send the equipment to the manipulating system , It is guided by the self-image, and the device that receives-,, and loses the probe, cooperates with the number of positions to perform the detection, and does not: ^ 待 to be divided for detection. Utilizing the measurement of this variable, more U: multiple parameters ’and a consumable data acquisition vehicle = 1. The invention because of sharing a multi-axis platform and efficiency, can greatly reduce the footprint, reduce the detection time, and increase the detection accuracy. [Previous technology] Type-electricity: nm; Under the development and continuous progress, handheld devices require delicate, “chemical” movie cameras, walkmans and other electronic products without circuit, components, etc. On the chip, product one is the detection technology # ^ $ The smaller the better, and the complexity of the key technology is improved, and each other] l :: In recent years, the complex quality control of product functions will inevitably become the next master ^ This shows the detection technology and 11. First, the first: the inspection instrument is shown in the picture-shown, with a detection platform, the object to be measured, "head 112, a data acquisition system 114. Inspection

彳 Mi milk i 1 1 is placed in the test level n. You / J only The measured data can be read by ordering and measuring the probe. For practical applications: 下 Download; 1 to the poor material extraction system 114 (" can only serve as an army has the following disadvantages: 1 early-function test 1237687

2) The floor space of 2 devices cannot be used for effective space utilization. (3) The measurement with coupling variables cannot be performed. The measurement of multiple physical quantities requires multiple different units-increasing the purchase cost. It occupies the surface area of Xikou, and it is well-known that in production technology, the workpiece does not have to be taken off the workbench and there is no cutting work. The accuracy is because of the participation. In addition, there is no need for multiple bed platforms, and the tools are placed in the tool magazine, which is conducive to measurement technology. Both the platform and the data acquisition system of the present invention can share the multi-purpose functions of the machine to improve the above. The advantage of the cutting machining center is that It must be realigned to complete the same benchmark at the same time, so it will increase greatly. All processing uses the same set of three-axis tool change modules to change tools. Based on this, the concept of the measurement center machine, the mechanical plane only needs to replace the detection head, to achieve a problem. [Summary of the Invention] The main purpose of the present invention is to provide a common multi-axis motion detection platform to reduce the equipment footprint and increase the use of effective space. Another object of the present invention is to provide a shared data acquisition system. The acquired data can be accurately processed for subsequent integration. The second aspect is: measurement of variables. In order to make consumable, another object of the present invention is to provide a common image guide, product η, or position measurement, so that the measurement position is more accurate, and the coupling variable measurement can be performed in the middle and 疋 regions. . Another object of the present invention is to improve the measurement equipment and achieve

1237687 V. Description of the invention (4) The purpose of multi-purpose machine, reducing the cost of testing equipment. In order to allow your reviewers to further understand and understand the purpose, features, and effects of the present invention, the following diagrams are explained in detail with the following diagrams. Figure number comparison table Figure number name 110 Inspection platform 111 Workpiece to be tested 112 Detection probe 113 Signal transmission line 114 Data acquisition system drawing name 210 Three-axis mechanical platform 211 Probe gripping device 212 Probe library 213 Common data acquisition system 214 Personal computer drawing name 310 Measuring probe 311 Camera lens

Page 10 1237687 V. Description of the invention (5) 312 Work piece to be measured 313 Vertical distance between the probe and the work piece 314 Probe position 315 The starting point position set by the user 316 The level of the probe position and the starting point set by the user Distance 317 Vertical distance between the position of the probe and the starting point set by the user Figure name 410 Y-axis linear movement mechanism 411 X-axis linear movement mechanism 412 Z-axis linear movement mechanism 413 Placement platform for test object 414 Servo motor 415 Probe gripping Device drawing number name 510 Standardized probe 511 Probe gripping mechanism

512 Probe gripping mechanism rotation axis X

513 Rotary axis Y of the probe holding mechanism Drawing No. Name Drawing No. Name 610 Light source 615 Second aperture 611 First aperture 616 Image receiver

Page 11 丨 1237687

612 Beamsplitter 613 Objective lens 617 Path of light projected on non-confocal plane 614 Path of light focusing surface 618 Path of light projected on confocal plane Figure No. 710 Outer Probe 711 Outer Probe 712 Inner Probe 713 Inner Probe No. 810 811 812 813 814 815 816 Name Cx axis Cy axis placement camera module wafer pick and place device substrate placement platform image capture card charge-coupled element Figure 817 818 platform 819 820 821 822 (CCD) Name power supply Low-distortion non-coaxial down-light lens test wafer test substrate three-dimensional beam splitter group light source stage 210, a placement test, not intended, a common three-axis mechanical measurement probe, a probe ^ a large probe library 212, The movements of various probes are placed therein. There is one :: Device 211, which can be used for automatic conversion and exposing. In addition to the data acquisition system 213 for data extraction and resolution, this device can also be used to integrate the data transfer interface.

Page 12 1237687 V. Description of the invention (7) ^ 'Finally, the data acquisition system is connected to the computer 2 1 4 for data analysis and analysis. The test center has the following advantages due to the concept of a probe library: i (1) Multi-axis platforms can be shared; (2) Computers can be shared (as long as the interface is replaced and the signal processing software is replaced); (3) Machines can be shared; (4) Probe items needed to determine the probe library required for visual work; (5) Does not occupy space; (6) Particularly suitable for use in laboratories and research units; (7) Μ Electromechanical systems are particularly suitable for 'because of the volume Small and precise; (8) Coupling parameters, which can be measured in conjunction with software calculation technology of sensor fusion. The hard 5I is as follows: the test center equipment is described in detail, including the mechanism platform ^ Μ _ conversion with the transmission interface, the setting of the probe head gripping device. X. Grabbing data retrieval and design of man-machine interface. -(I) Integration of the transmission interface: USB1 1 2 head, Ϊ = data transmission interface can use the early RS232, interface Fuji II ΓΓ materials. i3 and 94 also wait for the big transmission + transmission method. In recent years, the transmission time of data transmission has also increased greatly in the special machine, which can reduce the measurement and measurement. Acryl β 2./aa is used for more accurate data sampling to achieve a fast and accurate high transmission speed of 48 Mbps. The market = universal access to the wheel interface. Its, ..., ..., pluggable, and equipment that allows different bandwidths. Same as 1237687 V. Description of the invention (8) It is USB 2 when connected and can work at the same time. + Reason 'Many new computer peripheral products have been ^ = advantage port (printer port) ^ RS-232, abandoned table Port machine, printer, mouse, etc. = second-generation surface, such as data exhibition, the current USB 2.0 interface has become electric; 1 has been developed to USB with high performance and low price. Become a standard equipment, expand the present invention to use USB 2.0 as; ^ 1 A preferred embodiment, its multi-layer architecture is shown in the figure: V 亍 = the connection between the transmission interface and the device, "has _ as the host Connection and disconnection detection. The next head of the power management and device (downward compatible) is connected to the standard USB 2.0 standard, which can be connected to non-standard via USB / Serial or USB = M f The conversion of the USB interface format to achieve :: "1. 2 interface conversion circuit, using wireless transmission interface (wireless) as the funding head. Second, if the detection is more probable in the future. The problem of wiring 'The popularity of the present invention (2) Correction of the probe to retrieve data: The data obtained by the computer through the transmission interface, the value of the user's weight is mut, where there are two groups, and the mechanical platform material is stan ^, and For the acquisition of data by the probe, two sets of data are obtained by independent acquisition systems. 仏 ^ Χ 敕 敕 敕 敕 敕 敕 Integrate and correct the two sets of independently acquired data Λ before analyzing ^ Wei ^, Become valid information for subsequent sharing. It can be illustrated by a mathematical formula: knife D (X, y, Z) and f (X, y, z, d)

1237687

V. Description of the invention (9) jx, 'y ^ z) represents the probe at the mechanical coordinates (X, the function captured by the magic probe ~, the data we want to obtain last, and ^^ B "is a mathematical After the calculation of this function, the coordinates of the machine can be returned to the value (x, y, z). The wood returns the letter Η you 敕 A-a valid data D, y π and the paper machine. The data of the police, but by the number, through the function of the fish to compose the difference between the god and the mountain number, the machine head f can return the value d for integration and correction. Only then can the zhaoduozheng measurement value format and unit be different. The same, so the unit or format that needs to be modified, so that all the returned data cells ((and the correction content of the function G (1)) data format correction for different board headers will return soft ~ Qibo 丨 brother w π w I value The format is the same as that of the single generation for returning poor materials. Early position or format correction / (2) Correction of sampling frequency = li 'then the day guard, the computer will read two sets of data, one is the mechanical platform returns The right t shows the value 'the other is the return value of the probe, the sampling frequency of the two sets of data cannot be adjusted to be equal, yes, so you need to use software for Interpolation repair: ,, and that the two shell to ten laser measurement Example: = X · 'y'z) table is not a (X, y, z) coordinate data for a specific time obtained,

The sampling period of Xi and Yi mechanical coordinates is △. The sampling value returned is = i ~ η; 卩 # 翊 7 周 翊 is △ T, the returned sampling value is dj, j = 1 ~ Tian Ri Xunjian is Q * = i △ The starting point of the & τ-day search 'is corresponding to the mechanical coordinate (Xi, κ). According to the linear internal difference method, the corresponding value of the laser head sampling value di when the interval between Yanshan exit and 捋 is σ

Page 15 1237687 V. Description of the invention (10)

AT (+ · where 1ηΐ [σ / ΔΤ],) is the j-th sampling value of the laser head and the 0 · + 1) th sampling value of the laser head, so D (x / y-z) is often Λ, The value that can be used for unit correction is (Xi, yi, φ), i = 1 ~ n (3) Measuring guide head, middle: often need to be able to drill down to a specific position to test a specific bit in advance An image guiding device, that is, a camera, can be used by the camera to take the image calibration probe-the area to be scanned and measured. By having such a guiding device, the commercially available measuring equipment has less real measurement. Since the user of the present invention can determine his result at a specific position, the measured position can be reduced or only the approximate position or the statistical installation of the micro camera, and the wear of the touch probe can be reduced. Set its focal length and field of view. One: 1 type, the beam type can be used according to the observation range, otherwise it is often allowed to be vertical, and it is not possible that the cantilever field J is not under the probe; test and: block 'make the lens look 0} " i «Ir ^ ^ ^ is separated by a distance of 'knowing distance'. The machine is parallel to the axis of the dagger, and in the horizontal direction, the user selects the image using the mouse circle to observe the range. The selected page 16 1237687 V. Description of the invention (11) The range is scanned and measured. (2) Coaxial… The camera and the probe have the same axial direction, and the probe is separated from the surface of the object by a known distance, and the image is taken to the observation range. The user uses the mouse to circle the range. Move the camera out, and move the probe down to the circled area for scanning. First, (3) fiber-optic-guided image type .. · Use a fiber optic beam similar to a gastroscope ^ to introduce an image. F is placed on the side of the probe. It can be obtained immediately when it is close to the surface of the object to be measured. It can be said that it is the most direct way: The phenomenon of angular distortion needs to be corrected afterwards. One-to-two TU! Ming adopts a coaxial measurement guidance method to implement the 3 η Λ probe between the probe and the object to be measured, as shown in Figure 4, the probe on the body beam splitter 1 :: set; 311 is a camera The camera is equipped with the principle of refraction and reflection of standing light, which can make the camera simultaneously = to separate the probe from the surface of the object to be measured in the direction of the pan-the user already has 31 points or range of the object to be measured. Once the π mouse is selected in the image of the object to be measured, start the measurement and φ is the same circle. The picture shows the image obtained by the camera in the 4-image guidance device, = 2: set ": = the position image of the probe, selected by the 31-heart user: amount to be treated: the surface image of the object is a 5-b superimposed image, from which Figure 5—C is the position deviation between Figure 5—a and the starting point 315 of the chart. The head position 314 and the user refer to the distance between these two points Λ Xia 316 and 317. The software calculates the system. That is, the camera 311 is removed, and after the correction of the position offset of 3 16 and 31 7 1237687 V. Description of the invention (12), 攘 _ The starting point position selected by the user is moved down ^ 310, and it can be reliably measured. The probe can also be used as the probe's self. 5. Is there any misalignment at the changed position by using the image guide device, and the axial direction is positive? When changing the probe, you need to consider the probe chuck, which can solve this question. Deflection, using self-aligned co-camera for measurement and correction, also =. Or move the well-equipped probe to the microscope, or because the present invention is common, to better accuracy. The material can be accurately followed up Whole-person-data-retrieval system that enables the captured data to be used to measure specific areas or locations,] processing, Use this shared image to guide a single displacement probe for multiple measurements ^ K measurement position is more accurate, so it can be used for measurement with coupling variables at the same location. (IV) Hardware specification diagram of shared mechanical platform /, Stand 411 for the mechanical platform, γ axis linear moving device in, including χ axis linear moving device axis linear moving device °, 2-axis linear moving device 412 '360 ° rotation of XY; another two 7 cattle placed platform 413 'This platform can be used < An additional probe head gripping device 41 5 is used. ≫ 1 temple clothing Yi uses four 1 ^ 11 ^ 01 ^. MSM series 2000W * with brake n ", up to 14 , Fixed-frame rotation speed 3000RPM, fixed-frame output torque is from β, servo motor driver ffiPanasonic MINAS series I, for the wheel output capacity of 2000w, AB phase-based encoder signal output, dare not distortion Decomposition can reach 1 00 0 0 divisions. The bead guide screw cup adopts SNK's product. The screw pitch is 1 〇hi in, so the mechanical resolution of the X γ z triaxial is 1 // m (10mm / 1 00 00), and the rotation resolution is 0.036. Degrees (36 0/1 0 0 0 0).

1237687 V. Description of the invention (13) The motion control card is selected from Industrial Research Institute's control card with axis motion control and digital and analog type 1/0 power, & column, internal feed, return to zero, slow jog, multi-^^ Therefore, it can be shifted into a dual-mode nano platform, and has special functions. In addition, the degree of use can also be increased to nano Fan Guangjia ... actuate the nano platform to make the system fine (five) shared chuck part Figure 7a is a shared loss of life; (^ Huai 4 hole -π probe, appearance The package is made in; I 2 1 exterior design drawing, will buy ready-made appearance 5 1 0, Jiang Xi Yi ~ the sensing element on various probes itself, and the integration. The connection method between the mating Designed! The car's second dagger has a mounted probe and probe holder 511 as the probe holder, and the standard detection probe shape 510. The 'Hugh head in the picture has two axial degrees of freedom 512 clips and The detection probe is a schematic diagram of the rear of the chute. The way of the moon groove is used to join, Figure VII-b is used to join [Embodiment] pieces, = Dagger platform with various types of sensors or measuring elements can be set The measurement equipment has become more diversified, more versatile, and more powerful. The following will present a variety of feasible cases. [Embodiment 1 of the present invention] Laser scanning measurement and measurement The 3_D ^ AD model of the workpiece, model or sample is reconstructed by three-dimensional measurement technology and CAD / CAM software.

Page 12 1237687

V. Description of the invention (14) The important work of tracing back the original design information for modification or redesign. The advantages of non-contact measurement are that point-by-point measurement is not required, and the measurement speed is fast, small or deformable objects can be measured, and there is no contact force, which will not cause damage to the surface of the object. A laser probe is placed in the probe library to perform the laser ranging function. The laser probe emits laser light to hit the object. After being reflected on the object, it is received by the position sensing element on the probe, which can be used for single-point distance measurement. With the standardized mechanical platform, the functions of line selection, surface scanning measurement, etc. can be used to reconstruct the 3-D shape after software calculation. Figure 8 shows the results of a line scan of an electroplated ceramic material. The standard unit is _, and the measuring probe equipment using NAIS LM300 is a laser source with a wavelength of 780nm and the highest resolution of the probe. [Embodiment 2 of the present invention] Ultrasonic scanning inspection Ultrasonic inspection is used to detect the material table. Except for detecting the lack of sound waves, the principle of vibration in materials used in the analysis of materials research is very viable, whether it is metal or the detection method should -Scan) The measurement system uses non-destructive detection methods of high-frequency vibration sound waves to be introduced into the material. In addition, it can also be used to measure the thickness of the test piece. Further internal penetrating differences or changes in sound velocity can assist physical properties, grain size, or microstructure. In addition, since the ultrasonic detection system uses the high frequency of the sound wave, as long as the sound energy can completely penetrate the thickness of the detection object, 特点 Ϊ: the test piece can be detected " Dagger features make it non-use: more extensive use. Agricultural ultrasound frequencies range from 0.5 MHz to 25 MHz, and especially

1237687 V. Description of the invention (15) 1MHz to 5MHz is most commonly used. This isobaric pressure plus a positive and negative alternating voltage signal is timed to generate a compression oscillation phenomenon. When the wave is transmitted into the detection object, if the $ of the ultrasonic pulse wave undergoes a positive and negative alternating compression force at this time. The greater the compressive force voltage, the voltage signal is checked to show up. Ultrasonic signal display (1) A-can: This is the most common type of ultrasonic detection for ultrasonic detection. Message that the probe is detecting a line on the object. Display the path length of the echo on the screen or the sound wave to calculate the position of the echo reflector. Vertical Determine the size of the defect at a calibration ratio without artificial defect gauges. (2) B-scan: The message that the cross section of the head moves linearly on the object to be detected. The horizontal display indicates that the scan display indicates that the passing time in the test object can show defects on a certain section of the test object. (3) C-scan: The board head moves back and forth on the surface of the test object to a whole message below this surface. This electrical material is made of The crystal flakes will become thicker and thinner when they are formed. When the supersonic touches the interface and is reflected back, [the shape will make the piezoelectric crystal sheet larger and larger, and the two sides of the crystal sheet will be generated. 'There are three ways to display and express the instrument circuit after amplification and amplification.' Usually applied to pulse waves Reflected φ. The previous point is recorded. The horizontal axis below this point indicates that when the signal appears, use this length and the direction of the sound beam to indicate the signal height (amplitude). If it is facing down, you cannot move with the signal. What has been recorded is the position where the moving direction is traced below this line, and the vertical direction is the depth of the defect, so the general situation of the B-scan ❸ distribution. Scanning the entire surface, recording the method display and radiograph results

Page 21 1237687 V. Description of the invention (16) Similar to j, the distribution and shape of the defect can be seen, but it is not known that it is deeper than the measuring center. The ultrasonic sensor processor is placed in the probe library, for example, using ultrasonic waves. Detector ('-γ Ultra-Best USIP12 host with USH100 high-frequency amplifier) can be used for ultra-Ut ^ r = two, JJ's mechanical platform' to make the object to be measured in plane displacement: namely; A-scan, B-Scan and C_scan functions. There are many types of probes used in three-dimensional measurement and selection of pendulum testers. According to different occasions, common probes such as round and cylindrical heads include spherical, tapered, direction ... heads. The characteristic is that the door should detect a signal such as the needle deviating from the center position to a certain degree at any position. The advantages of contact measurement are as follows: p is accurate and suitable for dimensional measurement and product inspection. vz) can measure curved and rounded objects. (3) The cost is low. (4) It is convenient to obtain point data of many features of the object to be measured. Head, 2 f test center machine probe library, 3D measurement touch probe is installed using the British RENISHAW company PH1 type probe, detection signal generation, & can be in any direction by a same size The force is measured to produce a point value of ^ to allow measurement on the curved surface of the workpiece, and the obtained electrical knowledge is transferred. Then through the measurement platform of the central machine and electrical m Page 22 1237687 V. Description of the invention (17) Brain data processing, you can occupy a long way; critical measurement. P reached + face, straightness, true circle, curved surface, etc. [the fourth embodiment of the present invention] A total of ^ image scan (―㈣ &. The image quality provided by the focusing surface and non-convergence is poor and fuzzy. Use pass through: focus on the sample for microscopic observation. Co-focus microscopy technology = by learning the pinhole t set from the sample gathering surface

: = The formed image 'excludes light that is not on the same focal plane from the optical pinhole'. Therefore, the only image formed on the focused surface is called the confocal image. The removal of the stray light of the traditional microscope image can provide S-high optical analysis provides better axial and side analysis (point spread function). As shown in Figure IX. The path of the light source hitting the focusing surface is shown by the solid line 618 in the figure, 610 is the light source, passes through the first aperture (source pinhole) 611, and passes through the dichróic mirrór 6i2.

After that, it is projected in the direction of the objective lens 6 1 3. The objective lens 6 丨 3 focuses the light so that the focus falls on the focusing surface 614, and then reflects through the aperture 615 and is received by the image connector / 616. The dashed part 617 in the figure For the & path of light projected on a non-confocal plane, the reflected image will be blocked by the aperture 6, 5 and the image will not be received by the image receiver 616. 618 is the path S of the path of light projected on the confocal plane. The reflected light after it is projected onto the object will pass through the aperture 6 丨 5 and be received by the shadow receiver 616, so the observer will only obtain the object on the confocal plane. Photo of:

1237687 V. Description of the invention (18) Confocal detection technology can also be applied to the measuring center, the probe is placed on the device that clamps the probe, the test object is placed on the χγ platform, and the probe is used to take the image Change the height of the Z-axis one by one, change the concept of taking one image at a time, similar to the concept of tomography, and then reconstruct and analyze the image. [The four-point probe of the present invention is electrically implemented on the micro-electromechanical one. Because of the basic principles of measurement, such as semiconductivity and purity, the basic principles of measurement can be used to move the electrical side, and when the two magnetic fields are stacked, the plate conductor at this time is the Hall effect. The four-point probe is displayed during measurement. Known two electric probes 7 1 2. Example 5] Measurement in the body of the system, so electrical theory is beneficial to determine when the accumulated magnetic force on the carrier side will occur normally, the resistivity is the load The active energy resistivity of the sub-movement becomes the active flow of the Hall-effect carrier for detection. The positive and negative charges of the lateral force generated by one application flow are opposite to each other, while the opposite two are generated. This kind of measurable testing force and temperature testing (high Hall capacity and magnetic field ′ cause more and more sales, such as potential difference, the degree of flaws measured in horizontal products, and the crystal index. Effect) are low. When the carrier in Huo ’s conductor is pushed too much, the most recent call is the defect density index of the present potential index. As in the phenomenon of slenderness, it is called a pack of three four linearly arranged Japanese ships.] This probe is obliquely combined with the α phase of the hammer. The needle will contact the surface of the sample to be tested, as shown in Figure 10 / Melon I. The two outer branches · 7 · η are called 两 and r, and the needles 710 and 711 are known, and the open-circuit voltage V on the inner Π 3 can be Measured. ideal

! 237687 V. Description of the invention (19) = Shadow: f this current 1 magnitude. Suppose to be

'Then this-semi-infinite body 4 measurements; the distances are all equal to S / ^ 0 ^ 2 π sV / I. The four-point probe is on the real @ probe and the moving object ^, and a multi-axis platform is also used to make the difference. You ¥ a, "action. On the test object, it is usually measured by a lot of F0 ^ under the needle. The position and alignment of the lower probe depends on the test object, which can be used in the control software. As a correction, the displacement of the platform where the detection object is placed on the second || s port can achieve a full-automatic four-point probe measurement of the large circle. [Embodiment 6 of the present invention] Surface roughness meter (alpha-step pr? Filometer )

Product No. 5: The roughness meter is used to measure the surface contour of an object. The surface roughness meter is a sharp-pointed probe made of diamond. As all the pointed tips are right κ, the scanning area where this probe interacts with the scanning object is guided. The motion trajectory scanned by the probe traverses the surface of the object and the change in vertical motion of the needle tip is recorded with a lifetime sensor. Through the motion of the needle tip, A can be used to display the two-dimensional surface contour of the object to be measured. In this way, the method can be known, the object to be measured is placed on a platform capable of XY two-dimensional movement, the probe can be fixed at a fixed height, and the scanning path is planned by software: the surface accuracy measurement of the object or the amount of surface features Measurement.

Page 25 1237687 V. Description of the invention (20) " ^ [Seventh embodiment of the present invention] Although the chip placement is not a part of the measurement technology, it is also the concept of using additional modules and a common platform. Achieve wafer placement and bonding. = A complete integrated circuit needs to be manufactured from the wafer factory and then shipped to the packaging and testing factory for wafer cutting, die bonding, wire bonding, sealing, de-fishing, power mining, bent foot molding , Cut order and final test before sending to the f-line circuit board component mounting work. But flip chip technology need not be so large

"Zhouzhang" wafers need only be made directly before being sent to the packaging factory. After being sent to the packaging factory for testing and cutting, they can be delivered to users. During installation, because the wafer is opaque and the convex contacts are located below the wafer, precise alignment work needs to be performed in a specific way to accurately place the wafer on the substrate. Finally, it is sent to the oven for fixing. . In addition, in the micro-electro-mechanical packaging technology, wafer-to-wafer face-to-face (acet ocace) precision alignment is sometimes required. Therefore, the alignment technology and flip-chip technology required to solve the opaque object alignment method are: akin. In order to make this system perform the function of alignment and placement, the hardware part is equipped with an image 2 taking system as shown in Figure 11. The mechanical part is added with the Cx axis 8 1 0 and Cy axis 811, there is also a camera

The sets of platforms 812, 814 serve as substrate placement platforms, and 813 serve as wafer pick-and-place devices. —The added image acquisition group, as shown in Figure 12, includes a 1 / 2-inch Ho-Held element (CCD) 8 1 6. Low-distortion non-coaxial lens-type mirrors with double optical magnification 818, Stereo beamsplitter group 821, image capture card 815, self-made

1237687 V. Description of the invention (21) Light duty 2 In addition, there is a CCD power supply m; ㈣ Part of Visual Basic is used for software development and a function library for image processing. Based on the standard :: machine; image processing ... system, can be used for penetrating pairing :::: = = pair; = image penetrating alignment is feasible, in other words, penetrating as non-timely mode can be #, and The cracked image acquisition module can be the same as the two: image acquisition: use this feature to propose an intuitive and fast alignment of two "pairs;": 8: the goalkeeper standing f beam splitter device 821 is placed on the wafer 81 9 ” 1 base material 820, at this time, at the charge combining device (c, the wafer 8 1 9 can be obtained at the same time, the bottom image and the base material 8 are compared and adjusted, then the lens is shifted to open the material 8: two crystals for correlation / The tested test piece is shown in Figure 13. The figure shows that the surface of the shell is made of black tincture and tin balls]; the opaque wafer 'Yu Jing,' and the right is-transparent: =; 2 table °° :; = ^ The diameter of the welding pad is 30 0, and the spacing between the welding pads is 50. _ Bonded after placing on the glass, 'can be seen after turning over = four shown' ® can be seen, the white solder balls on the glass are finished with black tin balls It can be seen that the result of the alignment is correct. The design of the human-machine interface below: The design of the human-machine interface of the measuring center mainly includes (1) mechanism parameter settings : Set this machine with a flat // express some part of the Cloth "Thousands mechanical parameters, such as transport on 27 1237687

The selection of moving coordinates, switch settings, and mechanism are stored as an ini file. New settings. Motor maximum speed setting, safety factor setting, limit return-to-origin mode setting, etc .; the set parameters can be loaded into this i n i file at the next boot, no need to repeat

I y 2)-the parameter setting of the measuring head: the measuring center uses a variety of measuring probes U: group: the required setting parameters of the head are not bad, so here is designed-the pull-down type (second number τϊ) corresponds to a menu 'on Different parameters can be set in the menu. 'The set parameters can be saved as an ini slot, and this ini file can be loaded at boot time, without re-setting. (2 3 links) η New: For a similar software upgrade action, whenever a new: head is inserted, there must be a new driver to drive this probe, so that the volume and group of probes; and the software part also needs to add this Probe: Off δ and 疋 & items, control options. Therefore, when you purchase a probe, you will be provided with-an upgrade program, after which you can use the new probe I ^: very flexible and easy to upgrade. Lili makes the system become (4) the data management part: after the data acquired on the probe is software, it can be displayed in the window for users to moxibustion ^ material for storage, in order to facilitate comparison of data Yes; also: Second: The proceeds will be used for construction and broadcasting. It also prints the obtained data as the control part (5): it is the planning of the measurement trip, including the planning, the planning of the moving path of the machine, the planning of the moving speed, and so on. Figure 15-a is the function table of the system's man-machine interface, which includes the three parts: management, parameter setting, and software update.

1237687 V. Description of the invention (23) ----------- ^ -—— The control of Hutai V-C is for γ ^ 'with linear movement, origin return and other functions; Figure 10 probe two parameters ： Manufacturing interface '4-Multi-menu mode' 玎 The flow of using the Λν software for individual settings is shown in Figure 16: System number setting, which is also the initial setting of the system, which includes: Settings, parameter settings of each group of probes, etc., or θ can be loaded into the parameter setting values recorded by Senko. (2) Measurement path planning: selection of the mobile platform's mobile probes, etc. Here, i Simultaneous multi-speed head must be set to return to origin and _ == settings, schedule open (3) start schedule ·· Start to execute the step of correcting the parameters first to ensure the accuracy of the measured value.] 抆 (Get the probe's (4) data processing: This is the internal calculation of the software. The acquired data is used for data type conversion. At first, it will be Obtain the probe for correlation establishment, and then process the ^ obtained mechanism coordinates. The later data will be displayed in the window (5) f Material management: data storage and printing functions can be used

Page 121237687

1237687 The diagram briefly illustrates the conventional equipment used in a conventional test, which uses a multi-axis platform and a data acquisition system. Figure 2 Schematic diagram of the measurement center of the present invention, including a common detection platform and a common data acquisition. Take device and multiple sets of measuring probes Figure 3 Schematic diagram of the probe transmission interface integration of the present invention Figure 4 Schematic diagram of the image guiding device of the invention Figure 5 Image obtained by the image guiding device of the invention Figure 6 Common machine of the invention Schematic diagram of the platform Fig. 7 Schematic diagram of the probe fixture and standard probe of the present invention Fig. 8 Reconstruction results of the laser scanning surface of the present invention Fig. 9 Schematic diagram of conjugate focus image scanning Fig. 10 Schematic diagram of four-point probe measurement Schematic diagram of the wafer pick-and-place alignment machine of the present invention. Figure 12. Schematic diagram of the camera module of the wafer pick-and-place machine of the present invention. Fifteen human-machine interface design diagrams of the present invention

Page 31

Claims (1)

1237687 6. Scope of patent application 1. A computer-controlled measurement center machine, 1-a variety of fully modularized detection probes; /, Xunyi has a common multi-axis motion platform; a common digital image guidance Device; a shared control system contains one or two communication interfaces, data acquisition modules and processing: 、 /, peripheral equipment, all kinds of principles are based on the principle of placing the test object in multi-axis motion △ so-called shared control system, According to the test items: =; two: through the private planning or user operation, from, and Chuantou M, and according to the device to clamp the probe, the mechanism to clamp two probes for change The device can be used for testing at any point of the object to be measured, and the digital image guide is used for detection. Use this 14 ° to align the probe with the parameters of the part to be measured, and dt: detect 'not only measurable-up to number Capture, you can hunt wired or wireless "wide-source capture module to complete.彡 丨 ® Xi Gongyida invested a capital 2. If the scope of patent application is the first! The items described in J and Lost Test, Motion Control, System-by-Common: Controller :::: Card: ===== Motor Driver, and Displacement Motion Control: Computer with 3D control software. 3 As stated in the patent declaration, the measurement center described in item 1 above, J: Zhongshen ^ = head, its standard appearance design can be designed for any A mechanism can be groove joints, circular joints, etc. 1E Page 32Ϊ237687 VI. Application for Patent Scope 4, such as the scope of patent application! Item described-the shell material extraction module can read each m 'its "the same format as the same weight" and send it to the computer for subsequent = return = shell material, converted into phases, such as the patent application scope item 丨The image guiding device is mainly for the user; the so-called person can see the recognition of the object to be measured through the image guiding device, and use the "image setting area to be measured on the image; Side-guided, coaxial, or fiber-optic beam-guided image type. 6. The measurement center as described in the first patent application, where the so-called communication interface refers to the unity between the probe and the data acquisition system The transmission interface ^ can be any transmission interface such as USB 'Wireless or IEEE 1394. 7. The measurement center as described in the first item of the scope of patent application, where the so-called modular detection probe means that it contains a complete The sensor head and corresponding signal processing and amplification, and has a transmission interface with the data acquisition system ^ ^ $ equipment. ， Li ',' 8, the measurement center as described in the scope of patent application item 1, The so-called shared control system can share one User software interface, use the ^ menu to switch the settings of each probe module.