TWI237687B - Computer control measuring center - Google Patents
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第7頁 立、發明說明(2) 【發明所屬之技術領域】 -個數位影J ::應::利用-個多軸機構平台、 動或手動換測頭的機構,送操取系統的設備,由自 影像導引穿罟,收—、、至失取測頭的裝置,配合數位 置來進行檢測,不:^ί待分進行檢測。利用此裝 變因的量測,更U: 多項參數’並對具耗合性 一個資料擷取车=1。發明因為共用一個多軸平台及 效,可大幅少佔地面積及降低㈣ 檢測%間,及增加檢測精度。 【先前技術】 型電:著nm;;發展與不斷的進步之下,掌上 斷要求精緻、“化t ”影機、隨身聽等電子產品不 體電路、元件等二p疋§兒’基板組裝上的晶片、積 一就是檢測技術# ^ $越小越好,而關鍵技術之 雜性提高,互】l::在近數年間,產品功能的複 品質管制必然成為下一個主^也獒阿,這顯示檢測技術和 11。,傳一先:檢Ί儀器如圖-所示’具有-個檢測的平台 時,待测物,“頭112,一個資料擷取的系統114。檢洌Page 7 of the invention description (2) [Technical field to which the invention belongs]-A digital image J :: shall: use a multi-axis mechanism platform, move or manually change the probe, and send the equipment to the manipulating system , It is guided by the self-image, and the device that receives-,, and loses the probe, cooperates with the number of positions to perform the detection, and does not: ^ 待 to be divided for detection. Utilizing the measurement of this variable, more U: multiple parameters ’and a consumable data acquisition vehicle = 1. The invention because of sharing a multi-axis platform and efficiency, can greatly reduce the footprint, reduce the detection time, and increase the detection accuracy. [Previous technology] Type-electricity: nm; Under the development and continuous progress, handheld devices require delicate, “chemical” movie cameras, walkmans and other electronic products without circuit, components, etc. On the chip, product one is the detection technology # ^ $ The smaller the better, and the complexity of the key technology is improved, and each other] l :: In recent years, the complex quality control of product functions will inevitably become the next master ^ This shows the detection technology and 11. First, the first: the inspection instrument is shown in the picture-shown, with a detection platform, the object to be measured, "head 112, a data acquisition system 114. Inspection
了彳奶i 1 1置於檢測平合n 曰 你/只J 測得的資料藉由進订篁測,量測探頭所 讀。於實際應用:ί下傳;1到貧料榻取系統114内作解 ("只能作軍 有以下的缺點: 1乍早—功能的檢測 1237687彳 Mi milk i 1 1 is placed in the test level n. You / J only The measured data can be read by ordering and measuring the probe. For practical applications: 下 Download; 1 to the poor material extraction system 114 (" can only serve as an army has the following disadvantages: 1 early-function test 1237687
2) 2器佔地面積,無法作有效的空間利用 (3 )無法作具有耦合性變因的量測 多種物理量之量測的需求,就需要多台不同單- 增加購置成本。 佔用夕口的地表面積,並且 眾所皆知,在生產技術 工件不必拿離開工作台、不 有切削工作,其精度因為參 加。此外也不需要多個床台 平台,刀具放在刀具庫,利 於量測技術方面,本發明提 台與資料擷取系統都可共用 機多用的功能,以改善以上 中,切削加工中心的優點在於 必重新對準,即可一次完成所 考同一基準,因此會大大增 ,所有加工皆利用同一組三軸 用換刀模組來換刀。基於此, 出量測中心機的概念,機械平 ’只需要更換探測頭,達到一 之問題。 【發明内容】 本發明之主要目的係提供一共用的多軸運動檢測平台 以縮減設備的占地面積,增加有效空間的利用。 本發明之另一目的係提供一共用的資料擷取系統, 擷取的資料能很精確地作後續的整合處理,可 二:: 變因的量測。 了作具耗合性 本發明之另一目的係提供一共用的影像導弓丨 品η、 或位置量測,使量測位置更精準,並且可在间、疋區域 耦合性變因的量測。 本發明之另一目的係提昇量測設備的多 々^,達成一2) The floor space of 2 devices cannot be used for effective space utilization. (3) The measurement with coupling variables cannot be performed. The measurement of multiple physical quantities requires multiple different units-increasing the purchase cost. It occupies the surface area of Xikou, and it is well-known that in production technology, the workpiece does not have to be taken off the workbench and there is no cutting work. The accuracy is because of the participation. In addition, there is no need for multiple bed platforms, and the tools are placed in the tool magazine, which is conducive to measurement technology. Both the platform and the data acquisition system of the present invention can share the multi-purpose functions of the machine to improve the above. The advantage of the cutting machining center is that It must be realigned to complete the same benchmark at the same time, so it will increase greatly. All processing uses the same set of three-axis tool change modules to change tools. Based on this, the concept of the measurement center machine, the mechanical plane only needs to replace the detection head, to achieve a problem. [Summary of the Invention] The main purpose of the present invention is to provide a common multi-axis motion detection platform to reduce the equipment footprint and increase the use of effective space. Another object of the present invention is to provide a shared data acquisition system. The acquired data can be accurately processed for subsequent integration. The second aspect is: measurement of variables. In order to make consumable, another object of the present invention is to provide a common image guide, product η, or position measurement, so that the measurement position is more accurate, and the coupling variable measurement can be performed in the middle and 疋 regions. . Another object of the present invention is to improve the measurement equipment and achieve
1237687 五、發明說明(4) 機多用的目的,降低檢測設備的成本。 為使貴審查委員對本發明之目的、特徵及功效能夠 有更進一步的瞭解與認識,茲配合下列圖示詳細說明於 後· 圖號對照表 圖號 名稱 110 檢測平台 111 待測工件 112 檢測探頭 113 訊號傳輸線 114 資料擷取系統 圖號 名稱 210 三轴機械平台 211 探頭夾取裝置 212 探頭庫 213 共同的資料擷取系統 214 個人電腦 圖號 名稱 310 量測探針 311 攝影機鏡頭1237687 V. Description of the invention (4) The purpose of multi-purpose machine, reducing the cost of testing equipment. In order to allow your reviewers to further understand and understand the purpose, features, and effects of the present invention, the following diagrams are explained in detail with the following diagrams. Figure number comparison table Figure number name 110 Inspection platform 111 Workpiece to be tested 112 Detection probe 113 Signal transmission line 114 Data acquisition system drawing name 210 Three-axis mechanical platform 211 Probe gripping device 212 Probe library 213 Common data acquisition system 214 Personal computer drawing name 310 Measuring probe 311 Camera lens
第10頁 1237687 五、發明說明(5) 312 待測工件 313 探針與工件間垂直距離 314 探針位置 315 使用者設定的起始點位置 316 探針位置與使用者設定之起始點的水平距離 317 探針位置與使用者設定之起始點的垂直距離 圖號 名稱 410 Y軸線性移動機構 411 X軸線性移動機構 412 Z軸線性移動機構 413 待測物件放置平台 414 伺服馬達 415 探頭夾取裝置 圖號 名稱 510 標準化探頭 511 探頭夾取機構Page 10 1237687 V. Description of the invention (5) 312 Work piece to be measured 313 Vertical distance between the probe and the work piece 314 Probe position 315 The starting point position set by the user 316 The level of the probe position and the starting point set by the user Distance 317 Vertical distance between the position of the probe and the starting point set by the user Figure name 410 Y-axis linear movement mechanism 411 X-axis linear movement mechanism 412 Z-axis linear movement mechanism 413 Placement platform for test object 414 Servo motor 415 Probe gripping Device drawing number name 510 Standardized probe 511 Probe gripping mechanism
512 探頭夾取機構旋轉軸心X512 Probe gripping mechanism rotation axis X
513 探頭夾取機構旋轉軸心Y 圖號名稱 圖號 名稱 610 光源 615 第二個光圈 611 第一個光圈 616 影像接收器513 Rotary axis Y of the probe holding mechanism Drawing No. Name Drawing No. Name 610 Light source 615 Second aperture 611 First aperture 616 Image receiver
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612 分光鏡 613物鏡 617光投射於非共焦面的行經路徑 614光線聚焦面 618光投射於共焦面的行經路徑 圖號 名稱 710 外側探針 711 外側探針 712 内部探針 713 内側探針 圖號 810 811 812 813 814 815 816 名稱 Cx軸 Cy軸 放置取像模組 晶片取放裝置 基材放置平台 影像擷取卡 電荷耦合元件 圖號 817 818 的平台819 820 821 822 (CCD ) 名稱 電源供應器 低失真無同軸照落型鏡頭 測试晶片 測試基材 立體分光鏡組 光源 台210,-個放置測、不意圖,有一共用的三軸機械 測用探頭,—個探頭^碩的探頭庫212,其中放置各種 測頭的動作。還有-個::裝置211,可作自動的轉換揭 的功能除作資料擷取解ς用的資料擷取系統213,此裝置 ^卜,還可作資料傳輪介面的整612 Beamsplitter 613 Objective lens 617 Path of light projected on non-confocal plane 614 Path of light focusing surface 618 Path of light projected on confocal plane Figure No. 710 Outer Probe 711 Outer Probe 712 Inner Probe 713 Inner Probe No. 810 811 812 813 814 815 816 Name Cx axis Cy axis placement camera module wafer pick and place device substrate placement platform image capture card charge-coupled element Figure 817 818 platform 819 820 821 822 (CCD) Name power supply Low-distortion non-coaxial down-light lens test wafer test substrate three-dimensional beam splitter group light source stage 210, a placement test, not intended, a common three-axis mechanical measurement probe, a probe ^ a large probe library 212, The movements of various probes are placed therein. There is one :: Device 211, which can be used for automatic conversion and exposing. In addition to the data acquisition system 213 for data extraction and resolution, this device can also be used to integrate the data transfer interface.
麵 第12頁 1237687 五、發明說明(7) ^ 合’最後再由資料擷取系統連接到電腦2 1 4作資料的統整 分析等。測試中心機因有了測頭庫的概念,故有以下的優 點: i (1)多軸平台可共用; (2 )電腦可共用(只要介面更換,訊號處理軟體更換即 可); (3 )機台可共用; (4 )可視工作所需決定探頭庫的測頭項目; (5 )不佔空間; (6 )特別適合實驗室及研究單位使用; (7 ) Μ機電系統特別適合’因為體積小,且精密; (8)具有耦合性的參數,可配合感測器融合(sens〇r fusion)的軟體運算技術量測出來。 的硬5IΪ為:測中心設備作詳細的說明,包含機構平台 ^ Μ _ 同傳輸介面的轉換、探測頭夾取裝置的設 。十、抓頭擷取資料修正與人機介面的設計。 的-(一)傳輪介面的整合: USB1 1二目、Ϊ =間資料傳輸介面可採用早期的RS232、 介面不二ΙΓΓ料。i3曰94也等大傳+輸方式,近年來傳輸 資料傳送的時 專k机里也大幅的增加,可減少量測 測量。吖β 2./a a作更精確的資料取樣,達成快速正確的 48〇MbPs的高傳輸速以市=上取普及的傳輪介面,其 、…、…、插拔、容許不同頻寬的設備同 1237687 五、發明說明(8) 時連接且可同時工作是USB 2 〇吉尸曰乂 + 原因’許多新的電腦周邊產品已^ =優勢的主要 (printer port) ^ RS-232 、 棄卩表機埠 機、印表機、滑鼠等=二產面,如數據 展,目前USB 2. 0介面已成為電;1已k杈的往USB發 性高、價格便宜。 成為^的-個標準配備,擴充 本發明採用USB 2. 0作為;^1 佳實施例,其多層架構如圖:V亍的=傳輸介面的較 與裝置間的連結,“有_作為主機 之連結與脫離偵測。再下一電源的管理與裝置 (可向下相容)的探測頭,接連接標準USB2.〇規格 面,可經由USB/Serial或是USB=M f入疋非標準的USB介 料格式的轉換,以達成:::」1 二介面轉換電路,作資 頭使用無線傳輸介面(wireless) n。二未來若感測探 性將更為提高。 了佈線的問題’本發明的普及 (二)修正探頭擷取資料: 電腦透過傳輸介面取得的資 e ,匕 戶斤值m u t 貝°凡有兩組,一疋機械平台 料s山他 ^ 、、且為探頭的擷取資料,兩組資 料疋由獨立的擷取系統取得,仏泰 ^ Χ 訊作敕人 〃 ^ 系將這兩組獨立取得的資 Λ作整合、修正處理後,才 ^ 析伟^ , 成為有效的資料供後續的分 祈使用。可用一數學式來說明: 刀 D(X,y,Z)二f(X,y,z,d)Page 12 1237687 V. Description of the invention (7) ^ 'Finally, the data acquisition system is connected to the computer 2 1 4 for data analysis and analysis. The test center has the following advantages due to the concept of a probe library: i (1) Multi-axis platforms can be shared; (2) Computers can be shared (as long as the interface is replaced and the signal processing software is replaced); (3) Machines can be shared; (4) Probe items needed to determine the probe library required for visual work; (5) Does not occupy space; (6) Particularly suitable for use in laboratories and research units; (7) Μ Electromechanical systems are particularly suitable for 'because of the volume Small and precise; (8) Coupling parameters, which can be measured in conjunction with software calculation technology of sensor fusion. The hard 5I is as follows: the test center equipment is described in detail, including the mechanism platform ^ Μ _ conversion with the transmission interface, the setting of the probe head gripping device. X. Grabbing data retrieval and design of man-machine interface. -(I) Integration of the transmission interface: USB1 1 2 head, Ϊ = data transmission interface can use the early RS232, interface Fuji II ΓΓ materials. i3 and 94 also wait for the big transmission + transmission method. In recent years, the transmission time of data transmission has also increased greatly in the special machine, which can reduce the measurement and measurement. Acryl β 2./aa is used for more accurate data sampling to achieve a fast and accurate high transmission speed of 48 Mbps. The market = universal access to the wheel interface. Its, ..., ..., pluggable, and equipment that allows different bandwidths. Same as 1237687 V. Description of the invention (8) It is USB 2 when connected and can work at the same time. + Reason 'Many new computer peripheral products have been ^ = advantage port (printer port) ^ RS-232, abandoned table Port machine, printer, mouse, etc. = second-generation surface, such as data exhibition, the current USB 2.0 interface has become electric; 1 has been developed to USB with high performance and low price. Become a standard equipment, expand the present invention to use USB 2.0 as; ^ 1 A preferred embodiment, its multi-layer architecture is shown in the figure: V 亍 = the connection between the transmission interface and the device, "has _ as the host Connection and disconnection detection. The next head of the power management and device (downward compatible) is connected to the standard USB 2.0 standard, which can be connected to non-standard via USB / Serial or USB = M f The conversion of the USB interface format to achieve :: "1. 2 interface conversion circuit, using wireless transmission interface (wireless) as the funding head. Second, if the detection is more probable in the future. The problem of wiring 'The popularity of the present invention (2) Correction of the probe to retrieve data: The data obtained by the computer through the transmission interface, the value of the user's weight is mut, where there are two groups, and the mechanical platform material is stan ^, and For the acquisition of data by the probe, two sets of data are obtained by independent acquisition systems. 仏 ^ Χ 敕 敕 敕 敕 敕 敕 Integrate and correct the two sets of independently acquired data Λ before analyzing ^ Wei ^, Become valid information for subsequent sharing. It can be illustrated by a mathematical formula: knife D (X, y, Z) and f (X, y, z, d)
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五、發明說明(9) jx,’ y^z)表不探頭於機械座標(X,幻上探頭所擷取到的 函數〜、我們最後欲取得的資料,而丨^^乙“是一個數學 盥π二ΐ過這函數的運算,可將機台座標傳回值(x,y,z) ”木頭傳回信Η你敕人A - 一所需的有效資料D ,y π丨又紙机侍的資料,而 由數,透過這函數的 鱼撰涵神、山数的運异,可將機 f頭傳回值d作整合修正,才可得釗 多正 的测量值格式與單位會不相同,所以需用 的單位或格式修正,使全部的傳回資料格 ((Ά而函數的修正内容G (1 )資料格式修正 不同板頭其傳回 軟〜七伯 丨哥w π w I值格式與單 双體作傳回貧料的輩 式都相同。 早位或格式修正 /(2 )取樣頻率的修正 =里'則日守,電腦會讀入兩組數據,一是機械平台傳回 右t彳示值’另一個是探頭的傳回值,兩組數據的取樣頻率 蚪無法調整為相等, 對 ,所以 需使用軟體作内插法修:使兩、、且貝十 以雷射量测為例: =X·’ y’z)表不某一特定時間所取得的(X,y,z)座標資料,V. Description of the invention (9) jx, 'y ^ z) represents the probe at the mechanical coordinates (X, the function captured by the magic probe ~, the data we want to obtain last, and ^^ B "is a mathematical After the calculation of this function, the coordinates of the machine can be returned to the value (x, y, z). The wood returns the letter Η you 敕 A-a valid data D, y π and the paper machine. The data of the police, but by the number, through the function of the fish to compose the difference between the god and the mountain number, the machine head f can return the value d for integration and correction. Only then can the zhaoduozheng measurement value format and unit be different. The same, so the unit or format that needs to be modified, so that all the returned data cells ((and the correction content of the function G (1)) data format correction for different board headers will return soft ~ Qibo 丨 brother w π w I value The format is the same as that of the single generation for returning poor materials. Early position or format correction / (2) Correction of sampling frequency = li 'then the day guard, the computer will read two sets of data, one is the mechanical platform returns The right t shows the value 'the other is the return value of the probe, the sampling frequency of the two sets of data cannot be adjusted to be equal, yes, so you need to use software for Interpolation repair: ,, and that the two shell to ten laser measurement Example: = X · 'y'z) table is not a (X, y, z) coordinate data for a specific time obtained,
Xi,Yi 機械座標的取樣週期為△ 回的取樣值為 =i 〜η ; 告#卩 7週翊為△ T,傳回的取樣值為dj,j = 1〜 田日寻間為Q* = i △十 以始地免& τ日寻’所對應的機械座標為(Xi,κ ) 以線性内差法,炎山 出捋間為σ時所對應的雷射頭取樣值diThe sampling period of Xi and Yi mechanical coordinates is △. The sampling value returned is = i ~ η; 卩 # 翊 7 周 翊 is △ T, the returned sampling value is dj, j = 1 ~ Tian Ri Xunjian is Q * = i △ The starting point of the & τ-day search 'is corresponding to the mechanical coordinate (Xi, κ). According to the linear internal difference method, the corresponding value of the laser head sampling value di when the interval between Yanshan exit and 捋 is σ
第15頁 1237687 五、發明說明(10)Page 15 1237687 V. Description of the invention (10)
AT ( + · 其中卜1ηΐ[σ/ΔΤ], )為雷射頭的第j個取樣值 二雷射頭的第〇·+1 )個取樣值 故D(x/y—z)常Λ,可作為單位修正用 之值即為(Xi,yi,φ ) ,i = 1〜n (三)量測導引裝置 頭,中:經常需要能針對特定的位置下探 事先將待測特定位位影像導引裝置,亦即一攝影機,可 攝影機取像標定探頭所—待掃描量測的區域,藉由 具有此種導引裝、 置,一般市售的量測設備較少 真正量測到的特定位此來本發明的使用者得以確定他 的結果,也可減少量測的=只是大約的位置或只是統計 加裝顯微攝影機,最::變觸式探頭的磨耗。 調定其焦距與視野。一 :1式,可依觀測範圍來 樑式,否則常常容二碩夕半為垂直式,❺非是懸臂 野J不到探頭底下的;測與:擋’使鏡頭的視 〇 } " i«i r ^ ^ ^ 相隔一段υ知距離'機由與匕頭的軸向平行,並於水平方向 使用者利用滑鼠圈選範觀測範圍的影像, 後糸、、充將操頭移至所圈選的 第16頁 1237687 五、發明說明(11) 範圍進行掃描量測。 (2) 同軸式··攝影機與探頭的軸向相同,並於 使探頭與待測物表面相隔一段已知距離,由攝向 供觀测範圍的影像,使用者利用滑鼠圈選範圍,之 將攝影機移出,探頭下移至所圈選的範圍進行掃描測、,先 (3) 光纖束導引影像式··利用類似胃鏡的光纖束^引⑨ 像的攝影機,f置於探頭的側面極靠近處,可即時取得〜 測物表面接觸的影像,可說是最直接的方 : 像有角度扭曲的現象,須做後續處理修正。 一〜 二統TU!明採用同軸式的量測導引方式為實施 3 η Λ 探頭與待測物之間如圖四所示,盆中 體分光1上探針::置;311為一攝影機,攝影機内裝有立 光的折射反射原理可使攝影機同時取得 =離潘直方向使探頭與待側物表面相隔-段已 的ίΓ使用者上機先,待測物31 點或範圍s五兔旦用π鼠於待測物影像圈選欲量測起始 並φ同圍。圖為4像導引装置中攝影機所取得的影像, =二:置“:=得之探頭位置影像,31心 使用者所選定:量待:物表面影像為 五-b重疊後的影像,從中 汁圖五—C為圖五—a與圖 定的起始點315間的位置偏移日抓頭位置314與使用者指 這兩個距離之德Λ 夏316、317,經軟體計算出 糸統即將攝影機311移出,經3 16與31 7 1237687 五、發明說明(12) 的位置偏移量修正後,攘_ 使用者所選的起始點位置^310下移,即可確實的量測到 探頭時也可作探頭的自我5。利用引像導引裝置於變更 的位置是否有偏位,軸向^正,更換探頭時,需考慮探頭 用夾頭,即能解決此一問=否有偏轉,利用自我對準的共 攝影機作量測作校正,亦=。或將裝置好的探頭移至顯微 再者因為本發明係共^,到更佳的精度。 料能很精確地作後續的整人一資料擷取系統,使擷取的資 引特定區域或位置量測,]處理,當使用此共用的影像導 一位置換測頭做多次量^ K測位置更精準,所以可在同 ’、设’作具有耦合性變因的量測。 (四)共用機械平台硬體規格 圖/、為機械平台的 立 411,γ軸線性移動裝in,包含了χ軸線性移動裝置 軸線性移動裝置°,2軸線性移動裝置412 ’於ΧΥ 360度的轉動;另外二7牛放置平台413 ’此平台可作 <另外运有一個探測頭夾取裝置41 5。 >1祠服邑採用四個1^11^01^。MSM系列2〇〇W*含剎車 n ”、、達14,定格轉速3〇〇〇RPM,定格輸出扭力為 从β ,伺服馬達的驅動器採ffiPanasonic MINAS系列 I,為,輪出能力2〇〇w,AB相基式的編碼器信號輸出, 敢大不失真分解能可達1 0 0 0 0分割。 珠導螺杯採S N K的產品’螺桿間距為1 〇 hi in,所以X γ z 三轴的機械解析度為1 //m (10mm / 1 0 0 00 ),而旋轉解批 度為 〇· 036 度( 36 0 / 1 0 0 0 0 )。AT (+ · where 1ηΐ [σ / ΔΤ],) is the j-th sampling value of the laser head and the 0 · + 1) th sampling value of the laser head, so D (x / y-z) is often Λ, The value that can be used for unit correction is (Xi, yi, φ), i = 1 ~ n (3) Measuring guide head, middle: often need to be able to drill down to a specific position to test a specific bit in advance An image guiding device, that is, a camera, can be used by the camera to take the image calibration probe-the area to be scanned and measured. By having such a guiding device, the commercially available measuring equipment has less real measurement. Since the user of the present invention can determine his result at a specific position, the measured position can be reduced or only the approximate position or the statistical installation of the micro camera, and the wear of the touch probe can be reduced. Set its focal length and field of view. One: 1 type, the beam type can be used according to the observation range, otherwise it is often allowed to be vertical, and it is not possible that the cantilever field J is not under the probe; test and: block 'make the lens look 0} " i «Ir ^ ^ ^ is separated by a distance of 'knowing distance'. The machine is parallel to the axis of the dagger, and in the horizontal direction, the user selects the image using the mouse circle to observe the range. The selected page 16 1237687 V. Description of the invention (11) The range is scanned and measured. (2) Coaxial… The camera and the probe have the same axial direction, and the probe is separated from the surface of the object by a known distance, and the image is taken to the observation range. The user uses the mouse to circle the range. Move the camera out, and move the probe down to the circled area for scanning. First, (3) fiber-optic-guided image type .. · Use a fiber optic beam similar to a gastroscope ^ to introduce an image. F is placed on the side of the probe. It can be obtained immediately when it is close to the surface of the object to be measured. It can be said that it is the most direct way: The phenomenon of angular distortion needs to be corrected afterwards. One-to-two TU! Ming adopts a coaxial measurement guidance method to implement the 3 η Λ probe between the probe and the object to be measured, as shown in Figure 4, the probe on the body beam splitter 1 :: set; 311 is a camera The camera is equipped with the principle of refraction and reflection of standing light, which can make the camera simultaneously = to separate the probe from the surface of the object to be measured in the direction of the pan-the user already has 31 points or range of the object to be measured. Once the π mouse is selected in the image of the object to be measured, start the measurement and φ is the same circle. The picture shows the image obtained by the camera in the 4-image guidance device, = 2: set ": = the position image of the probe, selected by the 31-heart user: amount to be treated: the surface image of the object is a 5-b superimposed image, from which Figure 5—C is the position deviation between Figure 5—a and the starting point 315 of the chart. The head position 314 and the user refer to the distance between these two points Λ Xia 316 and 317. The software calculates the system. That is, the camera 311 is removed, and after the correction of the position offset of 3 16 and 31 7 1237687 V. Description of the invention (12), 攘 _ The starting point position selected by the user is moved down ^ 310, and it can be reliably measured. The probe can also be used as the probe's self. 5. Is there any misalignment at the changed position by using the image guide device, and the axial direction is positive? When changing the probe, you need to consider the probe chuck, which can solve this question. Deflection, using self-aligned co-camera for measurement and correction, also =. Or move the well-equipped probe to the microscope, or because the present invention is common, to better accuracy. The material can be accurately followed up Whole-person-data-retrieval system that enables the captured data to be used to measure specific areas or locations,] processing, Use this shared image to guide a single displacement probe for multiple measurements ^ K measurement position is more accurate, so it can be used for measurement with coupling variables at the same location. (IV) Hardware specification diagram of shared mechanical platform /, Stand 411 for the mechanical platform, γ axis linear moving device in, including χ axis linear moving device axis linear moving device °, 2-axis linear moving device 412 '360 ° rotation of XY; another two 7 cattle placed platform 413 'This platform can be used < An additional probe head gripping device 41 5 is used. ≫ 1 temple clothing Yi uses four 1 ^ 11 ^ 01 ^. MSM series 2000W * with brake n ", up to 14 , Fixed-frame rotation speed 3000RPM, fixed-frame output torque is from β, servo motor driver ffiPanasonic MINAS series I, for the wheel output capacity of 2000w, AB phase-based encoder signal output, dare not distortion Decomposition can reach 1 00 0 0 divisions. The bead guide screw cup adopts SNK's product. The screw pitch is 1 〇hi in, so the mechanical resolution of the X γ z triaxial is 1 // m (10mm / 1 00 00), and the rotation resolution is 0.036. Degrees (36 0/1 0 0 0 0).
1237687 五、發明說明(13) 運動控制卡選用工研 含軸運動控制及數位式與類比式1/〇功、&列的控制卡,内 給、歸零、慢速寸動、多 ^ ’此,可作移位進 雙調式奈米平台,亦夕專功能。另外也可使用 度提昇至奈米範广加…致動奈米平台,使系統精 (五)共用夾頭部份 圖七a為共用失頭命;(^淮4穴-π 的探頭,外觀包穿成;I二1外里的設計圖,將現成購買 我欣準的外型5 1 0,蔣夕伊〜儿 各種探頭上感測元件本身 ^杈、、且化。配合 間的接合方式,設計出!俨車二匕有裱測頭與探頭夾具 511為探頭夾且,^準的檢測探頭外型510。圖中 '休頭又具具有兩個軸向的旋轉自由度512 夾八與檢測探頭是利用滑槽的 後示意圖。 月槽的方式作接合,圖七-b為接合 【實施方式】 件,=匕機Ϊ平台搭配各種不同型式的感測器或測量元 可使攻個置測設備變得更多樣化、多功能化、更呈强 十。以下將提出各種可實施的案例。 八 〔本發明實施例一〕 雷射掃描量測 測枯2广程是將既有的工件、模型或樣品經過三次元量 測技術及CAD/CAM軟體重建3_D^AD模型,並藉此方=1237687 V. Description of the invention (13) The motion control card is selected from Industrial Research Institute's control card with axis motion control and digital and analog type 1/0 power, & column, internal feed, return to zero, slow jog, multi-^^ Therefore, it can be shifted into a dual-mode nano platform, and has special functions. In addition, the degree of use can also be increased to nano Fan Guangjia ... actuate the nano platform to make the system fine (five) shared chuck part Figure 7a is a shared loss of life; (^ Huai 4 hole -π probe, appearance The package is made in; I 2 1 exterior design drawing, will buy ready-made appearance 5 1 0, Jiang Xi Yi ~ the sensing element on various probes itself, and the integration. The connection method between the mating Designed! The car's second dagger has a mounted probe and probe holder 511 as the probe holder, and the standard detection probe shape 510. The 'Hugh head in the picture has two axial degrees of freedom 512 clips and The detection probe is a schematic diagram of the rear of the chute. The way of the moon groove is used to join, Figure VII-b is used to join [Embodiment] pieces, = Dagger platform with various types of sensors or measuring elements can be set The measurement equipment has become more diversified, more versatile, and more powerful. The following will present a variety of feasible cases. [Embodiment 1 of the present invention] Laser scanning measurement and measurement The 3_D ^ AD model of the workpiece, model or sample is reconstructed by three-dimensional measurement technology and CAD / CAM software.
第19頁 1237687Page 12 1237687
五、發明說明(14) 回溯原設計資料以進行修改或再設計的重要工作。 非接接觸式量測的優點為不需人為逐點量測,量測速 度快、可量取細小或易變形之物件、無接觸力,不會對物 體表面造成傷害,於量測中心機的探頭庫中置入雷射探 頭,即可作雷射測距的功能。雷射探頭發出雷射光打^物 體上經反射後由探頭上的位置感測元件接收,可作單點的 距離量測。配合標準化的機械平台藉由機構的位移作線择 描、面掃描的量測等功能,經軟體運算後可作3-D外型重 建。圖八為一個表面經電鍍的陶瓷材料作線掃描的結果, 其標不單位為_,採用NAIS LM3〇〇的量測探頭設備 等級雷射源,波長780nm,探頭最高解析度〇 。 〔本發明實施例二〕 超音波掃描檢 超音波檢 以檢測材料表 除用於檢測缺 用音波在材料 用於分析材料 學研究貢獻甚 振動的原理, 不論是金屬或 檢測方法中應 -Scan) 測係利用高頻振動的音波導入材料内部,藉 面或内部缺陷之非破壞檢測方法。此^ 陷外,尚可用於量測試件厚纟,進一步 内部的穿透性差異或音速改變情形,可輔助 物理性質、晶粒尺寸或顯微組織等,對材料 〇。此外,由於超音波檢測係利用音波高頻 因此只要音波能量能完全穿透檢測物厚度, Ϊ Ϊ:試件皆可檢測"匕特點使其在非:壞 用更為廣泛。 农 超音波頻率約在〇 ·5ΜΗζ至25MHz之間 而其中尤以V. Description of the invention (14) The important work of tracing back the original design information for modification or redesign. The advantages of non-contact measurement are that point-by-point measurement is not required, and the measurement speed is fast, small or deformable objects can be measured, and there is no contact force, which will not cause damage to the surface of the object. A laser probe is placed in the probe library to perform the laser ranging function. The laser probe emits laser light to hit the object. After being reflected on the object, it is received by the position sensing element on the probe, which can be used for single-point distance measurement. With the standardized mechanical platform, the functions of line selection, surface scanning measurement, etc. can be used to reconstruct the 3-D shape after software calculation. Figure 8 shows the results of a line scan of an electroplated ceramic material. The standard unit is _, and the measuring probe equipment using NAIS LM300 is a laser source with a wavelength of 780nm and the highest resolution of the probe. [Embodiment 2 of the present invention] Ultrasonic scanning inspection Ultrasonic inspection is used to detect the material table. Except for detecting the lack of sound waves, the principle of vibration in materials used in the analysis of materials research is very viable, whether it is metal or the detection method should -Scan) The measurement system uses non-destructive detection methods of high-frequency vibration sound waves to be introduced into the material. In addition, it can also be used to measure the thickness of the test piece. Further internal penetrating differences or changes in sound velocity can assist physical properties, grain size, or microstructure. In addition, since the ultrasonic detection system uses the high frequency of the sound wave, as long as the sound energy can completely penetrate the thickness of the detection object, 特点 Ϊ: the test piece can be detected " Dagger features make it non-use: more extensive use. Agricultural ultrasound frequencies range from 0.5 MHz to 25 MHz, and especially
1237687 五、發明說明(15) 1MHz至5MHz最為常用。此等壓 外加一正負交變的電壓訊號時 化而產生壓縮震盪的現象,於 波傳送進入檢測物内部時,若 此時超音波脈波正負交變的$ 受正負交變的壓縮力。壓縮力 的電壓愈大,此電壓訊號經檢 於顯示為上。超音波訊號顯示 (1 ) A-can : 此為超音波檢測最普遍的 式超音波檢測。探頭在檢測物 方一條線的訊息。顯示螢幕上 間或音波回波之路徑長度,利 算出回波反射體之位置。垂直 在沒有人工缺陷規塊的校準比 度判定缺陷大小。 (2 ) B-scan : 板頭在檢測物上沿直線移 截面的訊息。水平顯示表示掃 顯示表示檢測物内之通過時間 可顯示受測物某一截面上缺陷 (3 ) C-scan : 板頭在檢測物表面上來回 此面下方一個整體的訊息,此 電材料製成之晶體薄片,當· ’貝1丨晶體薄片會形成厚薄變· 疋便形成超音波。當超音 碰觸到界面而被反射回來, 〔形會使得壓電晶體薄片承 愈大則晶體薄片兩面所產生 ’則儀電路增幅放大後而呈現 及表示方式有三種 方法’通常應用於脈波反射φ· 上一點,所記錄的是此點下 之水平軸表示訊號出現的時 用此長度及音束方向即可推 車由表示訊號高度(振幅), 對下’不能斷然地以訊號高 動所§己錄的是此線下方一 描移動方向的位置,而垂直 ’即缺陷深度,因此B掃描❸ 分佈的大致情形。 掃描整個表面,所記錄的是 方法之顯示與射線照相結果1237687 V. Description of the invention (15) 1MHz to 5MHz is most commonly used. This isobaric pressure plus a positive and negative alternating voltage signal is timed to generate a compression oscillation phenomenon. When the wave is transmitted into the detection object, if the $ of the ultrasonic pulse wave undergoes a positive and negative alternating compression force at this time. The greater the compressive force voltage, the voltage signal is checked to show up. Ultrasonic signal display (1) A-can: This is the most common type of ultrasonic detection for ultrasonic detection. Message that the probe is detecting a line on the object. Display the path length of the echo on the screen or the sound wave to calculate the position of the echo reflector. Vertical Determine the size of the defect at a calibration ratio without artificial defect gauges. (2) B-scan: The message that the cross section of the head moves linearly on the object to be detected. The horizontal display indicates that the scan display indicates that the passing time in the test object can show defects on a certain section of the test object. (3) C-scan: The board head moves back and forth on the surface of the test object to a whole message below this surface. This electrical material is made of The crystal flakes will become thicker and thinner when they are formed. When the supersonic touches the interface and is reflected back, [the shape will make the piezoelectric crystal sheet larger and larger, and the two sides of the crystal sheet will be generated. 'There are three ways to display and express the instrument circuit after amplification and amplification.' Usually applied to pulse waves Reflected φ. The previous point is recorded. The horizontal axis below this point indicates that when the signal appears, use this length and the direction of the sound beam to indicate the signal height (amplitude). If it is facing down, you cannot move with the signal. What has been recorded is the position where the moving direction is traced below this line, and the vertical direction is the depth of the defect, so the general situation of the B-scan ❸ distribution. Scanning the entire surface, recording the method display and radiograph results
第21頁 1237687 五、發明說明(16) j似,可看出缺陷的分佈情形及形狀,但無法得知其深 於量測中心機的探頭庫中置入超音波 號處理器例如使用超音波檢測機( ' -γ超曰波訊 USIP12主機附USH100高頻放大器)即可作超Ut^r =二, J J用的機械平台’使待測物作平面的位移:即;:超: 波的A-scan、B-Scan與C_scan功能。 卩了作超曰 〔本發明實施例三〕 三次元量測 選摆測儀之探頭有非常多的種類,依不同的場合 圓、柱形頭等機常用探頭包括球形、錐形、 方向…頭的特色是無論在任何位置 门 要其如針偏離中心位置至某一程度 個檢測一信號。而接觸式測量的優點為: p曰產 精度高適合於尺寸量測與產品檢驗。 vz)可量曲面及圓角之物件。 (3 )成本較低。 (4 )便於待測物件特徵較多處之取點資料。 頭,2 f測中心機的探頭庫中,置入三維量測的檢測探 的觸Ξί使用英國RENISHAW公司PH1型之探頭,偵測信號 生,& 可在任何方向藉由一個相同大小的量測力而產 點值^以允許在工件曲線表面上進行量測,並將所得之個 電知進行運异。再透過量測中心機的機構平台與電 m 第22頁 1237687 五、發明說明(17) 腦資料處理,即可遠占丞;危 量測。 P了達成+面度、真直度、真圓纟、曲面等 〔本發明貫施例四〕 共輛^像掃描(―㈣&。⑴Η 隹面的3微Ϊ下所觀察的影像,都有來自聚焦面及非聚 所提供的影像品質解析較差、較為模糊, 利用通過:心入樣品作顯微觀察。共輛焦顯微技術 =通過先學針孔光圈(pinhole) t集來自樣品聚隹面Page 21 1237687 V. Description of the invention (16) Similar to j, the distribution and shape of the defect can be seen, but it is not known that it is deeper than the measuring center. The ultrasonic sensor processor is placed in the probe library, for example, using ultrasonic waves. Detector ('-γ Ultra-Best USIP12 host with USH100 high-frequency amplifier) can be used for ultra-Ut ^ r = two, JJ's mechanical platform' to make the object to be measured in plane displacement: namely; A-scan, B-Scan and C_scan functions. There are many types of probes used in three-dimensional measurement and selection of pendulum testers. According to different occasions, common probes such as round and cylindrical heads include spherical, tapered, direction ... heads. The characteristic is that the door should detect a signal such as the needle deviating from the center position to a certain degree at any position. The advantages of contact measurement are as follows: p is accurate and suitable for dimensional measurement and product inspection. vz) can measure curved and rounded objects. (3) The cost is low. (4) It is convenient to obtain point data of many features of the object to be measured. Head, 2 f test center machine probe library, 3D measurement touch probe is installed using the British RENISHAW company PH1 type probe, detection signal generation, & can be in any direction by a same size The force is measured to produce a point value of ^ to allow measurement on the curved surface of the workpiece, and the obtained electrical knowledge is transferred. Then through the measurement platform of the central machine and electrical m Page 22 1237687 V. Description of the invention (17) Brain data processing, you can occupy a long way; critical measurement. P reached + face, straightness, true circle, curved surface, etc. [the fourth embodiment of the present invention] A total of ^ image scan (―㈣ &. The image quality provided by the focusing surface and non-convergence is poor and fuzzy. Use pass through: focus on the sample for microscopic observation. Co-focus microscopy technology = by learning the pinhole t set from the sample gathering surface
:=形成的影像’將非同一聚焦面的光排除於光學針孔 夕’因此所形成的影像只剩下聚焦面影像稱為共概焦 點影像(confocal image),去除傳統顯微鏡影像的迷光 能提供S高的光^學解析,提供更佳的轴向及側面解析( point spread function )。 如圖九所示。打於聚焦面的光源行經路徑如圖中里色實線 618所示,610為光源,經過第一道光圈(s〇urce Pinhole) 611,透過分光鏡(dichr〇ic mirr〇r) 6i2 分光: = The formed image 'excludes light that is not on the same focal plane from the optical pinhole'. Therefore, the only image formed on the focused surface is called the confocal image. The removal of the stray light of the traditional microscope image can provide S-high optical analysis provides better axial and side analysis (point spread function). As shown in Figure IX. The path of the light source hitting the focusing surface is shown by the solid line 618 in the figure, 610 is the light source, passes through the first aperture (source pinhole) 611, and passes through the dichróic mirrór 6i2.
後,投射到物鏡6 1 3的方向,物鏡6丨3將光線聚焦使焦點落 於聚焦面614上,再反射經光圈615之後,由影像接^器/ 616接收,而圖中虛線部份617為光投射於非共焦面的&經 路徑,其反射的影像會被光圈6丨5所阻隔,影像不會由影 像接收器616接收。618為光投射於共焦面的行經路S徑,其 投射到物體後反射的光會通過光圈6丨5,而由影相接收器 616接收,所以觀測者只會取得物體於共焦面上的影相:After that, it is projected in the direction of the objective lens 6 1 3. The objective lens 6 丨 3 focuses the light so that the focus falls on the focusing surface 614, and then reflects through the aperture 615 and is received by the image connector / 616. The dashed part 617 in the figure For the & path of light projected on a non-confocal plane, the reflected image will be blocked by the aperture 6, 5 and the image will not be received by the image receiver 616. 618 is the path S of the path of light projected on the confocal plane. The reflected light after it is projected onto the object will pass through the aperture 6 丨 5 and be received by the shadow receiver 616, so the observer will only obtain the object on the confocal plane. Photo of:
1237687 五、發明說明(18) 共軛焦(Confocal)檢測技術,也可應用於量測中心機,將 探測頭置於夾取測頭的裝置,檢測物置於χγ平台上,利用 探頭作取像,逐次的改變Z軸的高度,改變一次取一次影 像’類似斷層掃描的概念,之後再作影像的重組建立分 析0 〔本發明實施 四點探針電性 於微機電 一。因為半導 及純度等有關 量測的基本原 量測,其可用 測的基本原理 對移動中的電 一邊,而當兩 磁場所產生的 堆積,此時就 的平板導體最 為霍爾效應。 四點探針 進行量測時, 示。已知的電 二支探針7 1 2、 例五〕 量測 系統中 體中的 ,故電 理是利 來測定 是當電 何載子 側累積 磁力方 會在導 常發生 ,電阻率是 載子活動能 阻率成為檢 用霍爾效應 載子的活動 流流過一施 產生橫向力 的正負電荷 向相反而抵 體兩則產生 。這種可量 檢驗成 力與溫 驗的重 (Hall 能力高 加磁場 ’造成 越來越 銷,如 電位差 測出橫 品瑕疵*的 度、晶體 要指標。 effect ) 低。而霍 的導體中 載子被推 多時,最 此一來電 ’這種現 向電位的 指數之 瑕疵密度 四點探針 來進行 爾效應量 ,磁場會 向導體的 後就會和 荷就不再 象在細長 現象就稱 包3四支線性排列日士p 】 這此探斜合垃鎚α相§大細的鎢探針。在 針會接觸待测樣品表面,如圖十所 /瓜I 過外側兩支禊7·η夕叫妨兩r又知針710、711,而内側 Π 3之開路電壓V可 、、、1由夏測而得。理想1237687 V. Description of the invention (18) Confocal detection technology can also be applied to the measuring center, the probe is placed on the device that clamps the probe, the test object is placed on the χγ platform, and the probe is used to take the image Change the height of the Z-axis one by one, change the concept of taking one image at a time, similar to the concept of tomography, and then reconstruct and analyze the image. [The four-point probe of the present invention is electrically implemented on the micro-electromechanical one. Because of the basic principles of measurement, such as semiconductivity and purity, the basic principles of measurement can be used to move the electrical side, and when the two magnetic fields are stacked, the plate conductor at this time is the Hall effect. The four-point probe is displayed during measurement. Known two electric probes 7 1 2. Example 5] Measurement in the body of the system, so electrical theory is beneficial to determine when the accumulated magnetic force on the carrier side will occur normally, the resistivity is the load The active energy resistivity of the sub-movement becomes the active flow of the Hall-effect carrier for detection. The positive and negative charges of the lateral force generated by one application flow are opposite to each other, while the opposite two are generated. This kind of measurable testing force and temperature testing (high Hall capacity and magnetic field ′ cause more and more sales, such as potential difference, the degree of flaws measured in horizontal products, and the crystal index. Effect) are low. When the carrier in Huo ’s conductor is pushed too much, the most recent call is the defect density index of the present potential index. As in the phenomenon of slenderness, it is called a pack of three four linearly arranged Japanese ships.] This probe is obliquely combined with the α phase of the hammer. The needle will contact the surface of the sample to be tested, as shown in Figure 10 / Melon I. The two outer branches · 7 · η are called 两 and r, and the needles 710 and 711 are known, and the open-circuit voltage V on the inner Π 3 can be Measured. ideal
!237687 五、發明說明(19) = 影:f本電流1之大小。假設待! 237687 V. Description of the invention (19) = Shadow: f this current 1 magnitude. Suppose to be
’則此-半無限體4測;距離均相等為S /^0^2 π sV/ I 四點探針於實@ 探針與移動檢測物^上,也是利用一個多軸平台作下 不同的你¥ a、”的動作。於檢測物上,通常都是於很多 F〇1 ^ 下棟針量測的動作,下探針的位置與對準的 視檢測物而定,可於控制軟體中作修正,二 || s 配口放置檢測物平台的位移,將可達成全自動大 軏圍的四點探針量測。 〔本發明實施例六〕 表面粗度儀(alpha-step pr〇filometer)'Then this-semi-infinite body 4 measurements; the distances are all equal to S / ^ 0 ^ 2 π sV / I. The four-point probe is on the real @ probe and the moving object ^, and a multi-axis platform is also used to make the difference. You ¥ a, "action. On the test object, it is usually measured by a lot of F0 ^ under the needle. The position and alignment of the lower probe depends on the test object, which can be used in the control software. As a correction, the displacement of the platform where the detection object is placed on the second || s port can achieve a full-automatic four-point probe measurement of the large circle. [Embodiment 6 of the present invention] Surface roughness meter (alpha-step pr? Filometer )
品之5 :粗度儀是用來量測物體的表面輪廓,Μ斷製作成 去搞Γ又良莠。表面粗度儀是利用鑽石所製作的尖頭探針 探針2,表® ’以得到表面輪靡的資訊。與所有的尖頭 是右κ、相同,此一探針與掃描物體相互作用的掃描區域 導辨艮的。探針掃描的運動軌跡橫過物體表面並且利用一 生的感f器記錄了針尖的垂直運動變化。經由針尖運動產 、A就’可以顯示待測物體的二維表面輪廓。 上,,之方式可知,待測物件置於可作XY二維運動的平台 即可探頭固定於一固定高度,用軟體去規劃掃描的路徑: 作物體的表面精度量測或是表面特徵的量測。Product No. 5: The roughness meter is used to measure the surface contour of an object. The surface roughness meter is a sharp-pointed probe made of diamond. As all the pointed tips are right κ, the scanning area where this probe interacts with the scanning object is guided. The motion trajectory scanned by the probe traverses the surface of the object and the change in vertical motion of the needle tip is recorded with a lifetime sensor. Through the motion of the needle tip, A can be used to display the two-dimensional surface contour of the object to be measured. In this way, the method can be known, the object to be measured is placed on a platform capable of XY two-dimensional movement, the probe can be fixed at a fixed height, and the scanning path is planned by software: the surface accuracy measurement of the object or the amount of surface features Measurement.
第25頁 1237687 五、發明說明(20) " ' ^ 〔本發明實施例七〕 晶片置放結合 雖說晶片的放置不算是量測技術的一環,但也是利用 外加模組與共用平台的觀念,達成晶片放置結合的動作。 =個完整的積體電路需從晶圓廠將電路部份製作完成後, 运到封裝測試廠進行晶圓切割、黏晶、銲線、封膠、去渔 去〜、電鑛、彎腳成型、切單及最終測試才送到使用著手 f 行電路板元件實裝工作。但是覆晶技術不需如此大Page 25 1237687 V. Description of the invention (20) " ^ [Seventh embodiment of the present invention] Although the chip placement is not a part of the measurement technology, it is also the concept of using additional modules and a common platform. Achieve wafer placement and bonding. = A complete integrated circuit needs to be manufactured from the wafer factory and then shipped to the packaging and testing factory for wafer cutting, die bonding, wire bonding, sealing, de-fishing, power mining, bent foot molding , Cut order and final test before sending to the f-line circuit board component mounting work. But flip chip technology need not be so large
、周章’晶圓只需在送到封裝廠前直接製作凸塊,待送到 封裝廠進行測試並切割後即可送到使用者手上。實裝時, 由於晶片不透明且凸接點位於晶片下方,因此需透過特定 方式進行精密對位工作,才能準確地將晶片置放於基板 上’最後再送到迴烊爐進行固定後才算真正完成。另外, 於微機電封裝技術中,有時需要晶圓對晶圓面對面 (a c e t 〇 F a c e )進行精密對位結合,因此所需使用的對 位技術和覆晶技術解決不透明物體對位的方式是類似的。 為使此系統能作對準放置的功能,硬體部份加裝影像 2取系統如圖十一所示,機械部份除了原本共用的機構平 1:1外,多加了 Cx軸8 1 0與Cy軸811,還有一個放置取像模"Zhouzhang" wafers need only be made directly before being sent to the packaging factory. After being sent to the packaging factory for testing and cutting, they can be delivered to users. During installation, because the wafer is opaque and the convex contacts are located below the wafer, precise alignment work needs to be performed in a specific way to accurately place the wafer on the substrate. Finally, it is sent to the oven for fixing. . In addition, in the micro-electro-mechanical packaging technology, wafer-to-wafer face-to-face (acet ocace) precision alignment is sometimes required. Therefore, the alignment technology and flip-chip technology required to solve the opaque object alignment method are: akin. In order to make this system perform the function of alignment and placement, the hardware part is equipped with an image 2 taking system as shown in Figure 11. The mechanical part is added with the Cx axis 8 1 0 and Cy axis 811, there is also a camera
組的平台812,814作為基材放置平台,813作為晶片的取 放裝置。 —加入的取像組,如圖十二所示,包含了有1 / 2英吋的 ,何合元件(CCD ) 8 1 6、光學倍率兩倍的低失真無同軸照 落型鏡碩818、立體分光鏡組821、影像擷取卡815、自製The sets of platforms 812, 814 serve as substrate placement platforms, and 813 serve as wafer pick-and-place devices. —The added image acquisition group, as shown in Figure 12, includes a 1 / 2-inch Ho-Held element (CCD) 8 1 6. Low-distortion non-coaxial lens-type mirrors with double optical magnification 818, Stereo beamsplitter group 821, image capture card 815, self-made
1237687 五、發明說明(21) 光職2另外還有CCD的電源供應器m ;㈣部份 Visual Basic作為軟體開發平a 木用 函式庫作影像處理。於標準::機;的影像處理 …統,可作穿透式對:::: = =對;=影像 穿透式對準可行,換句話說穿透式如非 時的方式可#,而加裂的取像模組可以同 二的二:取像:利用此特點提出一直觀、快速的對準二 “對;的;:8:門將立f分光鏡的裝置821置於晶片81 9 ”欲1丰的基材820間,此時於電荷合元件(c 可同時取得晶片8 1 9底部影像愈基材8 处 比對調整之後,將⑽鏡頭移象開ί材8:二晶進行相關/ 驗的測試片如圖十三所示,圖 曰日 此貝 片表面製作黑色㈣,錫球】;不透明的晶片’於晶 ,"右為-透明:=;2表°°:; = ^ 焊塾直徑為30 0 ,焊塾間距為5〇。_ 置 於玻璃後黏合’翻轉過來後即可看 的= 四所示’ ®中可看出,玻璃上的白色焊塾完 的黑色錫球,可知對準放置的結果是正確的。者底下 人機介面設計: 量測中心機的人機介面設計主要包含 (1 )機構參數設定:設定此用機抒平了//幾個部份 疋”用機械千台參數,比如說運 第27頁 12376871237687 V. Description of the invention (21) Light duty 2 In addition, there is a CCD power supply m; ㈣ Part of Visual Basic is used for software development and a function library for image processing. Based on the standard :: machine; image processing ... system, can be used for penetrating pairing :::: = = pair; = image penetrating alignment is feasible, in other words, penetrating as non-timely mode can be #, and The cracked image acquisition module can be the same as the two: image acquisition: use this feature to propose an intuitive and fast alignment of two "pairs;": 8: the goalkeeper standing f beam splitter device 821 is placed on the wafer 81 9 ” 1 base material 820, at this time, at the charge combining device (c, the wafer 8 1 9 can be obtained at the same time, the bottom image and the base material 8 are compared and adjusted, then the lens is shifted to open the material 8: two crystals for correlation / The tested test piece is shown in Figure 13. The figure shows that the surface of the shell is made of black tincture and tin balls]; the opaque wafer 'Yu Jing,' and the right is-transparent: =; 2 table °° :; = ^ The diameter of the welding pad is 30 0, and the spacing between the welding pads is 50. _ Bonded after placing on the glass, 'can be seen after turning over = four shown' ® can be seen, the white solder balls on the glass are finished with black tin balls It can be seen that the result of the alignment is correct. The design of the human-machine interface below: The design of the human-machine interface of the measuring center mainly includes (1) mechanism parameter settings : Set this machine with a flat // express some part of the Cloth "Thousands mechanical parameters, such as transport on 27 1237687
動座標的選用、 開關設定、機構 儲存為一 ini檔, 新的設定。 馬達最大轉速設定、安全系數設定、極限 回歸原點模式設定等;可將所設定的參數 於下次開機時載入此i n i檔即可,不需重The selection of moving coordinates, switch settings, and mechanism are stored as an ini file. New settings. Motor maximum speed setting, safety factor setting, limit return-to-origin mode setting, etc .; the set parameters can be loaded into this i n i file at the next boot, no need to repeat
I y 2 )里—測抓頭參數設定:量測中心機使用多種量測探 U:組:頭所需設定參數不㈤,故在此設計-下拉式 Ϊ二數τϊί頭對應一個選單’於選單内可設定不同 參數’可將所設定的參數儲存為一ini槽,於 開機犄載入此ini檔即可,不需重新的設定。 二3通)η新:為一類似軟體升級動作,每當置入新的 :頭時’必有新的驅動程式來驅動這個探頭,使量、 組探頭;而軟體的部份亦需加入這個探頭的: 關δ又疋&項、控制選項。所以購入探頭時,會提供— 升級程式,執行後就可使用新的探頭I夺' ^: 很彈性化,很輕易的升級。 里利使糸統變得 (4)資料管理部份:於探頭上擷取的資料經軟體 後,可即時的顯系於視窗中供使用者灸者 ^ 料作儲存,以利於作資料的比對;也;:二:將所得資 以便於建播用。 也了將所得資料作列印 (5 )控制部份:也就是量測行程的規劃,包 用、機台移動路狡規劃、移動速度等一金 、、、 糸列的排程規劃。 圖十五-a為系統人機介面的功能表, 理、參數設定、與軟體更新三部份;圖十 ±要分為標案管 五一b為共用機械I y 2)-the parameter setting of the measuring head: the measuring center uses a variety of measuring probes U: group: the required setting parameters of the head are not bad, so here is designed-the pull-down type (second number τϊ) corresponds to a menu 'on Different parameters can be set in the menu. 'The set parameters can be saved as an ini slot, and this ini file can be loaded at boot time, without re-setting. (2 3 links) η New: For a similar software upgrade action, whenever a new: head is inserted, there must be a new driver to drive this probe, so that the volume and group of probes; and the software part also needs to add this Probe: Off δ and 疋 & items, control options. Therefore, when you purchase a probe, you will be provided with-an upgrade program, after which you can use the new probe I ^: very flexible and easy to upgrade. Lili makes the system become (4) the data management part: after the data acquired on the probe is software, it can be displayed in the window for users to moxibustion ^ material for storage, in order to facilitate comparison of data Yes; also: Second: The proceeds will be used for construction and broadcasting. It also prints the obtained data as the control part (5): it is the planning of the measurement trip, including the planning, the planning of the moving path of the machine, the planning of the moving speed, and so on. Figure 15-a is the function table of the system's man-machine interface, which includes the three parts: management, parameter setting, and software update.
1237687 五、發明說明(23) -------—^-—— 乎台的控制介 五-C是為γ ^ ’有直線移動、原點回歸等功能;圖十 探頭的量二參:制介面’ 4-多選單的模式’玎個別設定 用Λν軟體的使用流程如圖十六所示: 系统數設定··也就是系統的初始化設定,包含了 ΐ以裁入弈、:機構參數設定、各組探頭參數設定等,或是 可以載θ入先珂記錄的參數設定值。 (2 )量測路徑規劃:機構平台的移動 探測頭的選用等在此完成 i辛多動速度 頭一定是作原點復歸和_的==的設定,排程的開 (3 )啟動排程··開始執行先 修正參數)步驟,確保量測值的準確】抆正(取得探頭的 (4 )資料處理:此為軟體内部運算。 所擷取資料,作資料的型式轉換,乍,是將取得探頭 作相關性的建立,之後會將經處理 ^取得的機構座標 中。 後的資料顯示於視窗 (5) f料管理:可作資料的存槽、列印 功能1237687 V. Description of the invention (23) ----------- ^ -—— The control of Hutai V-C is for γ ^ 'with linear movement, origin return and other functions; Figure 10 probe two parameters : Manufacturing interface '4-Multi-menu mode' 玎 The flow of using the Λν software for individual settings is shown in Figure 16: System number setting, which is also the initial setting of the system, which includes: Settings, parameter settings of each group of probes, etc., or θ can be loaded into the parameter setting values recorded by Senko. (2) Measurement path planning: selection of the mobile platform's mobile probes, etc. Here, i Simultaneous multi-speed head must be set to return to origin and _ == settings, schedule open (3) start schedule ·· Start to execute the step of correcting the parameters first to ensure the accuracy of the measured value.] 抆 (Get the probe's (4) data processing: This is the internal calculation of the software. The acquired data is used for data type conversion. At first, it will be Obtain the probe for correlation establishment, and then process the ^ obtained mechanism coordinates. The later data will be displayed in the window (5) f Material management: data storage and printing functions can be used
第29頁 1237687Page 121237687
1237687 圖式簡單說明 圖一 習知之傳統檢測設備,用一個多軸平台,及一個 資料擷取系統的設備 圖二 本發明之量測中心機示意圖,含一共用的檢測平 台,一個共用的資料擷取裝置及多組量測探頭 圖三 本發明之探頭傳輸介面整合示意圖 圖四 本發明之影像導引裝置的示意圖 圖五 本發明之透過影像導引裝置所取得的影像 圖六 本發明之共用機械平台示意圖 圖七 本發明之探頭夾具與標準探頭外型示意圖 圖八 本發明之雷射掃描表面重建結果 圖九 習知之共軛焦影像掃描示意圖 圖十 習知之四點探針量測示意圖 圖十一本發明之晶片取放對準機台示意圖 圖十二 本發明之晶片取放機台的攝影機模組示意圖 圖十三 本發明之晶片取放測式片 圖十四 本發明之晶片取放結果 圖十五 本發明之人機介面設計圖 圖十六 本發明之系統使用流程圖1237687 The diagram briefly illustrates the conventional equipment used in a conventional test, which uses a multi-axis platform and a data acquisition system. Figure 2 Schematic diagram of the measurement center of the present invention, including a common detection platform and a common data acquisition. Take device and multiple sets of measuring probes Figure 3 Schematic diagram of the probe transmission interface integration of the present invention Figure 4 Schematic diagram of the image guiding device of the invention Figure 5 Image obtained by the image guiding device of the invention Figure 6 Common machine of the invention Schematic diagram of the platform Fig. 7 Schematic diagram of the probe fixture and standard probe of the present invention Fig. 8 Reconstruction results of the laser scanning surface of the present invention Fig. 9 Schematic diagram of conjugate focus image scanning Fig. 10 Schematic diagram of four-point probe measurement Schematic diagram of the wafer pick-and-place alignment machine of the present invention. Figure 12. Schematic diagram of the camera module of the wafer pick-and-place machine of the present invention. Fifteen human-machine interface design diagrams of the present invention
第31頁Page 31
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Cited By (6)
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TWI383126B (en) * | 2009-12-11 | 2013-01-21 | ||
TWI396825B (en) * | 2007-10-09 | 2013-05-21 | Panasonic Corp | Method of measuring three-dimensional shape |
TWI398651B (en) * | 2008-05-02 | 2013-06-11 | Qcept Technologies Inc | Method and system of determining the contact potential difference of a surface of a material to characterize properties of the surface, semiconductor wafer prepared for use in an electronic component, and method of w determining the contact potential dif |
CN106768051A (en) * | 2016-12-26 | 2017-05-31 | 海克斯康测量技术(青岛)有限公司 | A kind of real-time on-machine measurement device and method |
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TWI396825B (en) * | 2007-10-09 | 2013-05-21 | Panasonic Corp | Method of measuring three-dimensional shape |
TWI398651B (en) * | 2008-05-02 | 2013-06-11 | Qcept Technologies Inc | Method and system of determining the contact potential difference of a surface of a material to characterize properties of the surface, semiconductor wafer prepared for use in an electronic component, and method of w determining the contact potential dif |
TWI383126B (en) * | 2009-12-11 | 2013-01-21 | ||
CN106768051A (en) * | 2016-12-26 | 2017-05-31 | 海克斯康测量技术(青岛)有限公司 | A kind of real-time on-machine measurement device and method |
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