1236537 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種檢測方法及其裝置，特別是指一 種利用振盪的動態變化進行品質檢測之振盪檢測方法及 5 其裝置。 【先前技術】 如圖1所示，現有的電解電容器9包括一陽極鋁箔板 91、一陰極鋁箔板92，以及一夾設於該陽極鋁箔板91及 該陰極鋁箔板92間之電解紙93,陽極鋁箔板91通常被電 0 解氧化，在表面產生一層微米（//m)級三氧化二鋁薄膜之介 電層94。電解紙93則吸納飽含乙二醇、丙三醇、硼和氨 水等所組成的糊狀電解液，間隔設置於陽極鋁箔板91及 陰極鋁箔板92間；此種電解電容器9之優勢在於具有較 小之體積及較大之電容量。 5 在製作過程中，需切割夾成三明治狀的陽極鋁箔板 91、電解紙93、及陰極鋁箔板92，因此無可避免地將產 生為小的紹負碎屑（圖未示），部分碎屑將會殘留於捲妥之 電解電容器内。由於三氧化二鋁介電層94極薄，一旦部 份碎屑具有尖銳稜角，將會劃破或刺穿介電層94，更由於 〕 碎屑大小、尖銳程度、所在位置均不固定，而導致該電解 電容器9陰陽極間形成情況差異甚遠的各式短路現象，造 成電容值程度不-的劣化，嚴重威脅出品電容器之穩定 性，這種問題在電容器被安裝於電路板後，問題將更^重 地轉化為終知電子產品原設計功效無法順利達成。 I236537 最令業者頭疼的惡夢在於：若碎屑對介電層94造成 =傷害較為細微，在電解電容器9被通入電流後，陽極鋁 i板91 "電層94破損處將會於表面自然生成更薄的三氧 5 化二鋁膜。亦即，當對該電解電容器9通入電壓夠高之電 流進行量測時，將因介電層94破損處自然生成較薄之三 氧化二㈣膜，自動地完成該介電層94破損處之修補， 而無法確認檢查出該電解電容器9先前所發生之短路；然 而，由於當初破壞該介電層94之碎屑仍位於極具威脅之 1〇 鄰近位置，該電解電容器9 一旦被搖晃或擠壓，碎屑將再❿ 度傷害介電層94破損處，重現該短路現象。此種若有若 無、時隱時現之短路現象，一般稱之為『假性短路』。 此種因隱藏有結構瑕疵所造成之物理特性不穩定，不 僅使得該電解電容器9不定時地發生假性短路，也不定期 地自動於通足夠電能一段時間後消失，相當難於電解電容 15 器出廠時檢測出來。雖然依照目前技術水準，此類無法剔 退之不穩定不良品僅佔整體出貨量6〇〇 ppm(約萬分之 六），但正因為其難於被檢出，往往可以矇混通過各電路板鲁 廠、終端組裝廠之驗收；縱算是在組裝於電子產品後，消 費者發現電子產品性能不穩定而送廠維修，也相當難以藉 2〇 纟靜態的檢測發現。不僅讓消費者抱怨買到的終端產品品 質’也讓面對客戶的維修工程師不知從何下手。 如何順利檢驗出這類依照目前檢驗模式完全無法被 . 剔除淘汰之問題電容H，即成為製造廠商之莫大期盼。# 較之下，目前市面上之曰本廒商產品，僅將不穩定之不良 5 1236537 品比率降低至300 ppm(每一百萬顆成品中，少三百顆不穩 定產品），其單顆電容器市價即比國產品高出一倍，猶能廣 受下游廠商歡迎，可見此問題之嚴重性。 推而廣之，一般的電子設備在製作過程中，因懸浮之 灰塵附著，或本身材料結合之缺陷等諸多不確定因素，同 樣會導致各種電子元件發生類似假性短路之不穩定現 象，由於廷類「暫態失能」通常是導因於細微缺陷，較難 由-般品管常用之靜態檢測方法筛檢，·造成各零件供 應商與設備組裝廠間之糾紛與困擾；更難解的是，所有這 類「暫態失能」一旦影響電子裝置穩定性，都將損及消費 者權益，且送廠維修也相當難確實檢出故障原因而加以解 決，徒然損壞製造廠商名譽。 【發明内容】 本發明之主要目的在提供一種在振盪期間檢測電子 產品及元件暫態失能之振盪檢測方法。 本發明之另一目的在提供一種以自然振盪頻率之嚴 苛考驗#除具有隱性結構瑕疲之產品及元件的振盘檢測 方法。 本毛明之再一目的在提供一種檢測電解電容器假性 短路之振盪檢測方法。 本毛明之又一目的在提供一種檢測背光板發光特性 之振盪檢測方法。 本發明之更一目的在提供一種在振盪期間檢測電子 產品及兀件暫態失能之振盪檢測裝置。 1236537 本發明之又另一目的在提供一種以自然振盪頻率之 嚴苛考驗，排除具有隱性結構瑕疲之產品及元件的振盈檢 測裝置。 本發明之又再一目的在提供一種檢測電解電容器假 5 性短路之振盪檢測裝置。 本發明之又更一目的在提供一種檢測背光板發光特 性之振盪檢測裝置。 本發明振盪檢測方法是用以檢驗一待測元件之特 性，其包含下列步驟： 10 a)以至少一振動頻率振盪該待測元件； b) 在該待測元件振盪過程中，量測該待測元件之一物 理參數；及 c) 判斷該物理參數是否於一預設範圍内。 而依上述方法所設計並用以檢測該待測元件之該物 15 理參數是否於該預定範圍内之振盪檢測裝置，則包括一振 盪該待測元件之振動器，以及一量測該物理參數的量測 器；其特徵在於該振盪檢測裝置更包含一控制該振動器以 至少一振動頻率振盪該待測元件並控制該量測器於該待 測元件被振盪期間量測該物理參數的控制器。 20 本發明之功效，是能檢測出具有隱性結構瑕疵之產品 及元件，在生產過程即時剔除以提昇出產品品質。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二較佳實施例的詳細說明中，將可清 1236537 邊的呈現。在提出詳細說明之前，要注意的是，以下敘述 中，類似的元件是以相同的編號來表示。 如圖2所示，本發明振盪檢測方法及振盪檢測裝置1 的第一較佳實施例，是應用於檢測一待測元件8之一物理 參數是否位於一預定範圍内。在本實施例中，該待測元件 8為一 47eF之電解電容器81，該物理參數為該電解電容 器81之漏電流值，而該預定範圍則是設定為小於或等於 20/zA〇 ' 10 15 該振盪檢測裝置1包括一振盪該待測元件8之振動器 2' —夏測該物理參數的量測器3、一控制該振動器2與該 量測器3之控制器4，以及—接收與判斷該物理參衫否 於該預設範圍内之分析儀5。 碌微勁器2具有一基座 3沽勁地設置於該基座 21上之振動座22，以及—與該振動座_連接之驅動模 組（圖未示）°在本實_中’該驅動模組為-固接於該振 動座22上之振動馬達。該量測器3為-與該待測元件8 電性連接之電氣特性檢測儀器，在本實施例中，該量測器 MU由施加-㈣於該電解電容器81並進行該電解電容 器81之漏電流值量測。 ==元件8之振盪控制單元41，以及一控侧 測益3以複數相異測量頻率量測該待測 量測控制單元42,藉以使該 《物理參數备 «期間量_物財數。在本實施=婦測元件8朝 隹本實施例中’該控制器4 ^ 20 1236537 括 >可耘式之微處理單元（圖未示）及一儲存有該等振動頻 率及該等測量頻率資訊之資料庫（圖未示）。 该分析儀5包括一由該量測器3接收該物理參數之接 收早51、一比對該物理參數與該預設範圍之比對單元 52,以及一輸出該比對單元52之比對結果的輸出單元 $本實施例中’该比對單兀52為_具有健存媒體之微電 腦，而該輪出單it 53 W包含一顯示器（圖未示）及一印表機 ^圖未示）。目此，該分析儀5能於接收該量測_ 3量測所 传之該物理參數後，比對該物理參數與該預設範圍，以判 斷該物理參數是否於該預設範圍内，並將比對判斷結果以 該顯示器或印表機輸出。 以下便藉由上述之振盪檢測裝置丨及該待測元件8， 說明本發明之㈣檢測方法，如圖3所示，該㈣檢測方 法包含下列步驟： 步驟100 ’預設該等振動頻率，在本實施例中，該等 振動頻率是依序預設於該資料庫中’且通常至少包含該待 測元件8所具有之自然振動頻率。 步驟1〇2,以該等振動頻率其中之一振動頻率振盈該 待測元件8。在本實施例中是由該微處理單元依程式設定 選取該資料庫中該等振動頻率其中之一控制該振動座22 振動，並藉以帶動該待測元件8振盪。 步驟104,在該待測元件8振金過程中，量測該待測 元件8之該物理參數，在此步驟中是以該量測器3量測該 振盈中之待測元件8的該物理參數。該量測器3可以於該 1236537 待測元件8振盪過程中僅進行一次量測，當然也可以進行 夕次量測。在本實施例中，為求能測得該電解電容器81 於不同振動相位（位置與角度）之漏電流值，故是以一與該 振動頻率不同之測量頻率量測該電解電容器81之漏電流 值。如圖4所示，該振動頻率之數值與該測量頻率之數值 的最大公因數為1，以避免因該振動頻率與該測量頻率互 為因數或倍數時，發生量測結果集中於相同或特定振動相 位之狀況。 步驟106 ’判斷該物理參數是否於該預設範圍内，在 此步驟中，是由該比對單元52比對該物理參數與該預設 範圍藉以判斷量測所得之物理參數是否位於該預設範圍 内，並由該輸出單元53輸出對應於該物理參數與該預設 乾圍之比對結果的一訊號，藉以提供警示與紀錄。 ^步驟ι〇8，若步驟106中之該物理參數並未在該預設 乾圍内，也就是量測出如短路或斷路等之異常狀況時，即 表示該待測元件8不符合設計需求，因此便能篩檢出不良 品° 步驟110，若步驟1〇6中之該物理參數位於該預設範 圍内’則再以該等振動頻率其中另—振動頻率振盪該待測 一 此步驟雖非本發明振盪檢測方法之必要步驟，但 夕itj該待測元件8於不同環境下之狀況，因此以 多種振動料進行該制元件8之_，將能更仔細地筛 又口口。例如在本實施例中，該電解電容器81若存 有更貝碎屑，則其可能會在特定之振動頻率下產生移位， 1236537 導致該電解電容器 短路等異常現象 5 10 81於特疋的振動頻率振盪時，才發生 8二:广广重複步驟1〇4至步驟110,直到該待測元件 °亥等振動頻率振i過後，便進行下-步驟。 步驟m，該待測元件8通過本發明之振盪檢測方法。 在上述步驟1〇2及步驟ιι〇中，該振動器2施加之該 振動頻率順序已預先於步驟100中設定於該控制器4 中、’其並不需要特定順序之安排，均能實施本發明之振盈 S方法。但-般而言，測試時優先進行之振動頻率，通 韦疋.亥待測70件8之自然振動頻率、該待測元件8將應用 之工作環境（如飛機與車輛）所可能出現之環境振動頻率， 以及鄰近該自然振動頻率與該環境振動頻率之振動頻1236537 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a detection method and a device thereof, and more particularly to a vibration detection method and a device using the dynamic change of vibration for quality detection. [Previous Technology] As shown in FIG. 1, the existing electrolytic capacitor 9 includes an anode aluminum foil plate 91, a cathode aluminum foil plate 92, and an electrolytic paper 93 sandwiched between the anode aluminum foil plate 91 and the cathode aluminum foil plate 92. The anode aluminum foil plate 91 is usually electrolytically deoxidized, and a dielectric layer 94 of a micron (// m) level aluminum oxide thin film is generated on the surface. The electrolytic paper 93 absorbs a paste-like electrolyte saturated with ethylene glycol, glycerol, boron, and ammonia, and is arranged between the anode aluminum foil plate 91 and the cathode aluminum foil plate 92 at intervals. The advantage of this electrolytic capacitor 9 is that it has a Small size and large capacitance. 5 During the production process, the anode aluminum foil plate 91, electrolytic paper 93, and cathode aluminum foil plate 92 sandwiched into a sandwich shape need to be cut, so it is inevitable to produce small load-bearing debris (not shown in the figure), some of which are broken. Debris will remain in the rolled electrolytic capacitor. Due to the extremely thin aluminum oxide dielectric layer 94, once some debris has sharp edges, the dielectric layer 94 will be punctured or pierced, and moreover] the debris size, sharpness, and location are not fixed, and All kinds of short-circuit phenomena that cause the far difference between the anode and the anode of the electrolytic capacitor 9 are caused, resulting in non-degradation of the capacitance value, which seriously threatens the stability of the produced capacitor. This problem will be more serious after the capacitor is installed on the circuit board. ^ Seriously, the original design effect of the electronic product cannot be achieved smoothly. I236537 The most nightmare headache for the operator is that if the debris causes damage to the dielectric layer 94, the damage is slight. After the current is passed through the electrolytic capacitor 9, the anode aluminum i-plate 91 " electric layer 94 is damaged on the surface Naturally produces a thinner aluminum trioxide film. That is, when the current with a sufficiently high voltage applied to the electrolytic capacitor 9 is measured, a thin tritium oxide film is naturally generated due to the damaged portion of the dielectric layer 94, and the damaged portion of the dielectric layer 94 is automatically completed. Repair, it is impossible to confirm that the short circuit occurred in the electrolytic capacitor 9 was previously detected; however, because the debris that damaged the dielectric layer 94 was still located in a very threatening vicinity of 10, once the electrolytic capacitor 9 was shaken or Squeezing will again damage the damaged portion of the dielectric layer 94 and reproduce the short circuit phenomenon. This kind of short-circuit phenomenon, if it is absent from time to time, is generally called "false short circuit". This kind of unstable physical characteristics caused by hidden structural defects not only makes the electrolytic capacitor 9 false short circuit from time to time, but also does not automatically disappear after a sufficient period of time is passed, which is quite difficult for the electrolytic capacitor 15 to leave the factory. Detected. Although in accordance with the current technical level, such unstable and inconsistent defective products can only account for the entire shipment of 600 ppm (about 6 ten thousandths), but because they are difficult to be detected, they can often pass through various circuit boards. Acceptance of Lu plant and terminal assembly plant. Even after assembly in electronic products, consumers find that the performance of electronic products is unstable and send them to the factory for repair. It is also quite difficult to find them by 20 纟 static inspection. Not only do consumers complain about the quality of the end products they buy, but they also make it difficult for maintenance engineers facing customers to start. How to successfully detect this type of capacitor can not be completely eliminated according to the current inspection mode. Eliminating the problem of the capacitor H has become the great expectation of the manufacturer. # In contrast, the current Japanese marketplace products only reduce the unstable 5 1236537 product ratio to 300 ppm (300 million unstable products per million finished products). The market price of capacitors is double that of domestic products, and it is still welcomed by downstream manufacturers. This shows the seriousness of this problem. By extension, during the manufacturing process of ordinary electronic equipment, many uncertain factors such as the attachment of suspended dust or defects in the combination of materials, will also cause various electronic components to appear instability like pseudo short circuits. "Transient disability" is usually caused by small defects, which is more difficult to be screened by the static detection method commonly used by general quality control, which causes disputes and troubles between parts suppliers and equipment assembly plants; what is more difficult to solve is All such "transient disability" will affect the rights and interests of consumers once it affects the stability of the electronic device, and it will be quite difficult to send it to the factory for repairs to actually detect the cause of the failure and resolve it, damaging the reputation of the manufacturer in vain. [Summary of the Invention] The main object of the present invention is to provide an oscillation detection method for detecting transient disability of electronic products and components during an oscillation period. Another object of the present invention is to provide a method for detecting the vibration plate of products and components with hidden structural defects by using the severe test of natural oscillation frequency. Another objective of the present invention is to provide an oscillation detection method for detecting a pseudo short circuit of an electrolytic capacitor. Another object of the present invention is to provide an oscillation detection method for detecting the light-emitting characteristics of a backlight. A further object of the present invention is to provide an oscillation detection device for detecting transient disability of electronic products and components during oscillation. 1236537 Another object of the present invention is to provide a vibration detection device that eliminates products and components with hidden structural defects based on the rigorous test of natural oscillation frequency. Still another object of the present invention is to provide an oscillation detection device for detecting a pseudo short circuit of an electrolytic capacitor. Still another object of the present invention is to provide an oscillation detection device for detecting a light-emitting characteristic of a backlight panel. The oscillation detection method of the present invention is used to test the characteristics of a device under test, and includes the following steps: 10 a) oscillating the device under test at at least one vibration frequency; b) measuring the device under test during the oscillation of the device under test Measure a physical parameter of the component; and c) determine whether the physical parameter is within a preset range. An oscillation detection device designed according to the above method and used to detect whether the physical parameter of the component under test is within the predetermined range includes a vibrator that oscillates the component under test, and a device for measuring the physical parameter. A measuring device, characterized in that the oscillation detecting device further comprises a controller that controls the vibrator to oscillate the device under test at at least one vibration frequency and controls the measuring device to measure the physical parameter during the period when the device under test is oscillated . 20 The effect of the present invention is that products and components with hidden structural defects can be detected and eliminated immediately in the production process to improve product quality. [Embodiment] Regarding the foregoing and other technical contents, features, and effects of the present invention, in the following detailed description of the preferred embodiment with reference to the second drawing, the presentation of 1236537 will be clear. Before giving a detailed description, it should be noted that in the following description, similar elements are represented by the same reference numerals. As shown in FIG. 2, the first preferred embodiment of the oscillation detection method and the oscillation detection device 1 of the present invention is applied to detect whether a physical parameter of a component under test 8 is within a predetermined range. In this embodiment, the device under test 8 is a 47eF electrolytic capacitor 81, the physical parameter is the leakage current value of the electrolytic capacitor 81, and the predetermined range is set to less than or equal to 20 / zA〇 '10 15 The oscillation detection device 1 includes a vibrator 2 'that oscillates the device under test 8-a measuring device 3 that measures the physical parameter in summer, a controller 4 that controls the vibrator 2 and the measuring device 3, and-receiving And the analyzer 5 that determines whether the physical parameter is within the preset range. The Vibrator 2 has a base 3 vibrating base 22 disposed on the base 21, and a driving module (not shown) connected to the base_ The driving module is a vibration motor fixed on the vibration base 22. The measuring device 3 is an electrical characteristic testing instrument which is electrically connected to the device under test 8. In this embodiment, the measuring device MU is applied to the electrolytic capacitor 81 and leaks the electrolytic capacitor 81. Measurement of current value. == The oscillation control unit 41 of the element 8 and a control side Measure 3 measure the measurement control unit 42 to be measured at a complex number of different measurement frequencies, so as to make the "physical parameter preparation« period amount_material number ". In this implementation = women's measuring element 8 隹, in the present embodiment, 'the controller 4 ^ 20 1236537 including>> a micro-processing unit (not shown) and a storage of the vibration frequency and the measurement frequency Information database (not shown). The analyzer 5 includes an early reception 51 of the physical parameter received by the measuring device 3, a comparison unit 52 comparing the physical parameter with the preset range, and an output of the comparison result of the comparison unit 52. The output unit in this embodiment is' the comparison unit 52 is a microcomputer with a healthy storage medium, and the rotation order it 53 W includes a display (not shown) and a printer (not shown) . Therefore, the analyzer 5 can compare the physical parameter with the preset range after receiving the physical parameter transmitted by the measurement_3 measurement to determine whether the physical parameter is within the preset range, and The comparison judgment result is output on the display or printer. In the following, the above-mentioned oscillation detection device and the device under test 8 are used to describe the method for detecting tritium in the present invention. As shown in FIG. 3, the tritium detection method includes the following steps: Step 100 'preset the vibration frequencies in In this embodiment, the vibration frequencies are sequentially preset in the database, and generally include at least the natural vibration frequency of the device under test 8. Step 102: vibrate the DUT 8 at one of the vibration frequencies. In this embodiment, the micro processing unit is programmed to select one of the vibration frequencies in the database to control the vibration base 22 to vibrate, thereby driving the device under test 8 to oscillate. Step 104: In the process of vibrating the element 8 to be measured, measure the physical parameter of the element 8 to be measured. In this step, the measuring device 3 is used to measure the element 8 of the vibrating element 8 in the vibration. Physical parameters. The measuring device 3 can perform only one measurement during the 1236537 DUT 8 oscillation process, and of course, it can also perform evening measurements. In this embodiment, in order to determine the leakage current value of the electrolytic capacitor 81 at different vibration phases (positions and angles), the leakage current of the electrolytic capacitor 81 is measured at a measurement frequency different from the vibration frequency. value. As shown in Figure 4, the greatest common factor between the value of the vibration frequency and the value of the measurement frequency is 1, to avoid the measurement results from being concentrated on the same or specific occurrence when the vibration frequency and the measurement frequency are factors or multiples of each other. Condition of vibration phase. Step 106 'Determine whether the physical parameter is within the preset range. In this step, the comparison unit 52 compares the physical parameter with the preset range to determine whether the measured physical parameter is located in the preset range. Within the range, the output unit 53 outputs a signal corresponding to the comparison result of the physical parameter and the preset interference, so as to provide a warning and a record. ^ Step ι〇8, if the physical parameter in step 106 is not within the preset dry range, that is, when abnormal conditions such as short circuit or open circuit are measured, it means that the component under test 8 does not meet the design requirements Therefore, the defective product can be detected by screening. Step 110, if the physical parameter in step 106 is within the preset range, then the vibration frequency is oscillated, and the vibration frequency is oscillated. It is not a necessary step of the oscillation detection method of the present invention, but the condition of the device under test 8 in different environments, so it is possible to sieve the mouth of the device 8 more carefully by using various vibration materials. For example, in this embodiment, if the electrolytic capacitor 81 has more debris, it may shift at a specific vibration frequency, and 1236537 causes abnormalities such as short circuit of the electrolytic capacitor. 5 10 81 Vibration in special When the frequency oscillates, 82: Only Guangguang repeats Step 104 to Step 110, and after the vibration frequency i such as the device under test has passed, the next step is performed. In step m, the DUT 8 passes the oscillation detection method of the present invention. In the above steps 102 and 102, the order of the vibration frequencies applied by the vibrator 2 has been set in the controller 4 in step 100 in advance. Invented the Zhenying S method. But-in general, the vibration frequency that is prioritized during testing, the natural vibration frequency of 70 pieces 8 to be tested, and the possible environment in which the test component 8 will be used (such as aircraft and vehicles) Vibration frequency, and vibration frequencies adjacent to the natural vibration frequency and the environmental vibration frequency
15 率°當然’若該待測元件8之特性與其結構方向有關，則 也能對振動之方向加以控制與改變，其與上述控制與改變 忒振動頻率一樣，同屬於本發明振盪檢測方法之實施態樣 與應用。 20 由於以往在進行該電解電容器81之檢測時，會先進鲁 行该電解電容器81之極性檢測，故若該電解電容器8丨在 製作過程中，殘留其中之碎屑已劃破或刺穿該電解電容器 81之介電層（圖未示），往往會在進行上述極性檢測時，因 通電使得該電解電容器81之電板（圖未示）表面自然生成三 氧化二鋁膜，使得在進行如漏電流或電容值等之品質檢測 時’無法檢查出此隱性結構瑕疵所造成之『假性短路』。 因此，依據上述之振盪檢測方法及振盪檢測裝置丨，在該 11 1236537 電解電容1 81受減之過程中進行檢測，將能輕易地檢 測出該會再度破壞該電解電容n 81設計舰之隱性結構 瑕疵，使得無論是在該電解電容器81出廠時之品質管制， 或於使用後檢修，均能射本發明之錄檢測方法及其裝 置進行檢測，輕易地發現該電解電容@ 81之隱性結構瑕 疫’而篩選出不良的瑕疵品。 當然，該待測元件8並非限定是電解電容器81，其也 可以是電阻、電感，以及電晶體等其他電子元件，甚至於 以半導體製程所製作出之晶片也能依本發明振盪檢測方 法及其裝置進行檢測，藉以檢測出無法以靜態檢測出之隱 性結構瑕疵。 此外，本發明更能應用於光學元件之檢測，例如一般 鍍设有多層鍍膜之背光板，若該等鍍膜間存在有間隙，除 將導致忒背光板之效果與品質大打折扣外，更有可能影響 邊背光板之使用壽限，然而，此等光學上之隱性結構瑕疵 同樣難以由傳統靜態之檢測篩選出。 因此，本發明振盪檢測方法及其裝置之第二較佳實施 例，便是應用於檢測一光學元件之隱性結構瑕疵，如圖5 及圖6所示，在本實施例中，該待測元件8為一具有複數 位置點83並鍍設有多層鍍膜之背光板82，而量測之物理 參數則為該背光板82上該等位置點83其中之一待測位置 點83’不同入射角的折射光線強度，檢測之預定範圍則為 鄰近該待測位置點83’之其他位置點83，，折射光線的平均 強度正負5%;當然，此預定範圍能依實際需求變化調整。 12 1236537 與上述第一較佳實施例大致相同地，在本實施例中， 該振盪檢測裝置i同樣包括—振盪該背光板82之振動器 2、一里測該物理參數的量測器3、一控制該振動器2與該 里測器3之控制器4，以及一接收與判斷該物理參數是否 於該預設範圍内之分析儀5。 該振動器2具有一基| 2卜一可轉動地設置於該基座 21上之振動座22，以及一與該振動座22相連接之驅動模 組23。在本實施例中，該驅動模組23為一可驅動該振動 座22相對於該基座21以不同扭轉角度間擺動之偏心馬 達。該量測器3包含-照射該背光板82之光源31，以及 一與該基座21相對固定之感光單元32，該感光單元32能 感測經由該背光板82折射之光線，並轉換成以電子訊號 表示之灰階。在本實施例中，該感光單元32為一電荷耦 合元件（CCD)，但並非以此為限，能進行光電轉換之感光 元件，均能應用於本發明中。 該控制器4包括一控制該振動器2以一振動頻率扭轉 擺盪該背光板82之振盪控制單元4丨，以及一控制該量測 器3以複數相異測量頻率量測該待測元件之物理參數的量 測控制單元42,藉以使該量測器3能於該待測元件8被振 盪期間量測該物理參數。 该分析儀5包括一由該量測器3接收該物理參數之接 收單元51、一比對該物理參數與該預設範圍之比對單元 52,以及一輸出該比對單元52之比對結果的輸出單元53。 在本實施例中，該分析儀5能於接收該量測器3量測所得 13 1236537 之違背光板82所有位置點83之灰階，並計算出鄰近該待 測位置點83,之其他位置點83，，之平均灰階，以得到該以 上述平均㈣正負5%為限制條件之預設範圍；再比對該 待測位置黑"3’之灰階與該預設範圍，以判斷該待測位置 點83’之灰階是否位於該預設範圍内，並將比對判斷结果 以該輸出單元53輸出。 ^ 以下說明應用本發明之振蘯檢測方法，檢測該背光板 82之方法，如圖7所示，該方法包含下列步驟·· 步驟200，預設一振動頻率。 步驟202,以該振動頻率扭動擺盪該背光板82;在本 實施例中是由該振盪控制單元41控制該振動座22振動， 並藉以帶動該背光板82相對於該感光單元32擺盪。 y驟204在5亥煮光板82扭轉擺盪過程中，量測該背 光板82上該等位置點83之折射光線強度，在本實施例 中°亥里測器3疋以複數相異於該振動頻率之測量頻率量 測各該位置點83之折射光線強度，在本實施例中，該振 動頻率之數值與該測量頻率之數值的最大公因數為1，以 避免因該振動頻率與該測量頻率互為因數或倍數時，造成 量測相同振動相位（位置與角度）之狀況。 步驟206，判斷該背光板82之各該位置點83折射光 線之強度是否於該預設範圍内，在此步驟中，該分析儀5 依據步驟204中量測所得之該背光板82所有位置點83之 灰階’计算出鄰近該待測位置點8 3 ’之其他位置點8 3，，之 平均灰階，以得到該預設範圍；再由該比對單元52比對 1236537 該待測位置點83,之灰階與該預設範圍，以判斷該待測位 置點83,之灰階是否位於該預設範圍内， «將比對判斷結果以一訊號輸出，藉以提供警示與= 步驟208 ’完成本發明之振盪檢測方法。 5 在上述步驟202中，該振動器2施加於該背光板82 之扭準擺盪之方向當然也能加以控制與改變，藉以檢測出 該背光板82上具有方向性之隱性結構瑕疵。由於該背光 板82之該等鍍膜間存在有間隙，則將會在該背光板82轉 動至一定角度時，產生建設性或破壞性干涉，因此藉由相 10 對固定之該感光單元32，便能將該背光板82之隱性結構 瑕疲篩選出。 准以上所述者，僅為本發明之二較佳實施例而已，當 不能以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及發明說明書内容所作之簡單的等效變化與修 15 飾’皆應仍屬本發明專利涵蓋之範圍内。 【圓式簡單說明】 圖1疋一般電解電容器之一部分剖面示意圖，說明該 電解電容器之基本構造； 圖2是本發明振盪檢測方法及其裝置之第一較佳實施 20 例的一示意圖，說明該振盪檢測裝置之系統架構； 圖3是該第一較佳實施例之一流程圖； 圖4是該第一較佳實施例之一示意圖，說明振動頻率 與測量頻率彼此相異； 圖5是本發明振盪檢測方法及其裝置之第二較佳實施 15 1236537 例的一平面圖，說明一背光板之複數位置點關係； 圖6是該第二較佳實施例的一示意圖，說明該振盪檢 測裝置之系統架構；及 圖7是該第二較佳實施例之一流程圖。15 Rate ° Of course, if the characteristics of the device under test 8 is related to its structural direction, the direction of vibration can also be controlled and changed, which is the same as the above control and changing the vibration frequency, and belongs to the implementation of the oscillation detection method of the present invention. Form and application. 20 In the past, when the electrolytic capacitor 81 was tested, the polarity detection of the electrolytic capacitor 81 will be advanced. Therefore, if the electrolytic capacitor 8 丨 is left in the manufacturing process, the debris has scratched or pierced the electrolytic capacitor. The dielectric layer (not shown) of the capacitor 81 tends to naturally generate an aluminum oxide film on the surface of the electric plate (not shown) of the electrolytic capacitor 81 during the above polarity detection. During the quality inspection of the current or capacitance value, it is impossible to detect the "false short circuit" caused by this hidden structure defect. Therefore, according to the above-mentioned oscillation detection method and the oscillation detection device, the detection during the reduction of the 11 1236537 electrolytic capacitor 1 81 will easily detect the concealment that will destroy the electrolytic capacitor n 81 design ship again. The structural defect makes the electrolytic capacitor @ 81's hidden structure easily detectable by the inspection method and device of the present invention, whether it is the quality control when the electrolytic capacitor 81 leaves the factory, or is repaired after use. Defectives' and screen out the defective ones. Of course, the device under test 8 is not limited to an electrolytic capacitor 81, and it can also be other electronic components such as resistors, inductors, and transistors. Even wafers made by semiconductor processes can also be used in accordance with the oscillation detection method and method of the present invention. The device performs inspections to detect hidden structural defects that cannot be detected statically. In addition, the present invention can be more applied to the detection of optical elements. For example, a backlight plate generally coated with a plurality of coatings. If there is a gap between the coatings, it will be more likely to reduce the effect and quality of the backlight plate. Affect the service life of the edge backlight. However, these optical hidden structural defects are also difficult to be screened out by traditional static detection. Therefore, the second preferred embodiment of the oscillation detection method and device of the present invention is applied to detect a hidden structural defect of an optical element, as shown in FIGS. 5 and 6. In this embodiment, the Element 8 is a backlight plate 82 having a plurality of position points 83 and plated with a plurality of coatings, and the measured physical parameter is one of the position points 83 on the backlight plate 82. The measured position points 83 'have different incident angles. The predetermined range of the intensity of the refracted light is the other position points 83 adjacent to the position point 83 'to be measured. The average intensity of the refracted light is plus or minus 5%; of course, this predetermined range can be adjusted according to actual needs. 12 1236537 Similar to the first preferred embodiment described above, in this embodiment, the oscillation detection device i also includes a vibrator 2 that oscillates the backlight 82, a measuring device 3 that measures the physical parameter, A controller 4 that controls the vibrator 2 and the telemeter 3, and an analyzer 5 that receives and determines whether the physical parameter is within the preset range. The vibrator 2 has a base 2 and a vibrating base 22 rotatably disposed on the base 21, and a driving module 23 connected to the vibrating base 22. In this embodiment, the driving module 23 is an eccentric motor capable of driving the vibration base 22 to swing with different torsion angles relative to the base 21. The measuring device 3 includes a light source 31 that illuminates the backlight plate 82, and a photosensitive unit 32 that is relatively fixed to the base 21. The photosensitive unit 32 can sense the light refracted by the backlight plate 82 and convert it into light. Gray scale represented by electronic signals. In this embodiment, the photosensitive unit 32 is a charge-coupled device (CCD), but it is not limited thereto, and any photosensitive element capable of photoelectric conversion can be applied to the present invention. The controller 4 includes an oscillation control unit 4 that controls the vibrator 2 to oscillate the backlight board 82 at a vibration frequency, and a controller 3 that controls the measurement device 3 to measure the physical properties of the component under test at a plurality of different measurement frequencies. The parameter measurement control unit 42 enables the measurement device 3 to measure the physical parameter while the DUT 8 is being oscillated. The analyzer 5 includes a receiving unit 51 that receives the physical parameter by the measuring device 3, a comparison unit 52 that compares the physical parameter with the preset range, and an output of the comparison result of the comparison unit 52. The output unit 53. In this embodiment, the analyzer 5 can receive the gray scale of 13 1236537 which violates all the position points 83 of the backlight 82 measured by the measuring device 3, and calculate other position points adjacent to the position point 83 to be measured. 83, the average gray level to obtain the preset range with the above average ㈣ plus or minus 5% as the limiting condition; then compare the gray level of the measured position " 3 'with the preset range to determine the Whether the gray level of the position point 83 'to be measured is within the preset range, and the comparison judgment result is output by the output unit 53. ^ The following describes a method for detecting the backlight plate 82 using the vibration trembling detection method of the present invention. As shown in FIG. 7, the method includes the following steps: Step 200: preset a vibration frequency. In step 202, the backlight plate 82 is twisted and oscillated at the vibration frequency. In this embodiment, the vibration control unit 41 controls the vibration base 22 to vibrate, and thereby drives the backlight plate 82 to swing relative to the photosensitive unit 32. In step 204, during the twisting and swinging process of the light cooking plate 82, the intensity of the refracted light at the position points 83 on the backlight plate 82 is measured. In this embodiment, the helical measuring device 3 is different from the vibration in complex numbers. Frequency measurement The frequency measures the intensity of the refracted light at each of the position points 83. In this embodiment, the greatest common factor between the value of the vibration frequency and the value of the measurement frequency is 1 to avoid the vibration frequency and the measurement frequency. When they are factors or multiples of each other, the same vibration phase (position and angle) is measured. In step 206, it is determined whether the intensity of the refracted light at each of the position points 83 of the backlight plate 82 is within the preset range. In this step, the analyzer 5 according to all positions of the backlight plate 82 measured in step 204 The gray level of 83 'calculates the average gray level of the other position points 8 3' near the measured position point 8 3 ', to obtain the preset range; the comparison unit 52 then compares 1236537 the measured position The gray level of the point 83, and the preset range to determine whether the gray level of the point to be measured is within the preset range, «The comparison judgment result is output as a signal to provide a warning and = step 208 'Complete the oscillation detection method of the present invention. 5 In the above step 202, the direction of the wobble of the vibrator 2 applied to the backlight plate 82 can of course be controlled and changed, so as to detect a hidden structural defect with directivity on the backlight plate 82. Because there is a gap between the coatings of the backlight plate 82, constructive or destructive interference will occur when the backlight plate 82 rotates to a certain angle. Therefore, by fixing the photosensitive unit 32 with 10 pairs, The hidden structure defects of the backlight plate 82 can be screened out. Those mentioned above are only the second preferred embodiment of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the invention specification All 15's should still fall within the scope of the invention patent. [Circular type brief description] Fig. 1 示意图 A schematic sectional view of a part of a general electrolytic capacitor, illustrating the basic structure of the electrolytic capacitor; Fig. 2 is a schematic diagram of the first preferred embodiment 20 of the oscillation detection method and device of the present invention, illustrating the System architecture of an oscillation detection device; FIG. 3 is a flowchart of the first preferred embodiment; FIG. 4 is a schematic diagram of the first preferred embodiment, illustrating that the vibration frequency and the measurement frequency are different from each other; A plan view of the second preferred embodiment 15 1236537 of the invention for the oscillation detection method and its device, illustrating the relationship of the plural position points of a backlight panel; FIG. 6 is a schematic diagram of the second preferred embodiment, illustrating the oscillation detection device. System architecture; and FIG. 7 is a flowchart of the second preferred embodiment.
16 1236537 【圖式之主要元件代表符號說明】 1 振盪檢測裝置 52 2 振動器 53 21 基座 8 22 振動座 81 3 量測器 82 31 光源 83 32 感光單元 9 4 控制器 91 41 振盪控制單元 92 42 量測控制單元 93 5 分析儀 94 51 接收單元 100 .102.104.106.108.110. 112.114. 200.202.204.206.208. 步驟 比對單元 輸出單元 待測元件 電解電容器 背光板 位置點 電解電容器 陽極鋁箔板 陰極鋁箔板 電解紙 介電層 步驟 1716 1236537 [Description of the main symbols of the drawings] 1 Oscillation detection device 52 2 Vibrator 53 21 Base 8 22 Vibration stand 81 3 Measuring device 82 31 Light source 83 32 Photosensitive unit 9 4 Controller 91 41 Oscillation control unit 92 42 Measurement control unit 93 5 Analyzer 94 51 Receiving unit 100 .102.104.106.108.110. 112.114. 200.202.204.206.208. Step comparison unit output unit DUT element electrolytic capacitor backlight plate position electrolytic capacitor anode aluminum foil plate cathode Aluminum foil plate electrolytic paper dielectric layer step 17