TWI235273B - Device and method for stripping electric parts - Google Patents

Device and method for stripping electric parts Download PDF

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Publication number
TWI235273B
TWI235273B TW087100378A TW87100378A TWI235273B TW I235273 B TWI235273 B TW I235273B TW 087100378 A TW087100378 A TW 087100378A TW 87100378 A TW87100378 A TW 87100378A TW I235273 B TWI235273 B TW I235273B
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TW
Taiwan
Prior art keywords
heating head
electrical
electrical parts
peeling
parts
Prior art date
Application number
TW087100378A
Other languages
Chinese (zh)
Inventor
Naoki Takeshita
Manabu Kusano
Fumihiko Sagawa
Taizo Nakagawa
Original Assignee
Alps Electric Co Ltd
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Publication date
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Publication of TWI235273B publication Critical patent/TWI235273B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Resistance Heating (AREA)

Abstract

To make it possible to heat an electric component preliminarily and to shorten its peeling operation by a method wherein a heating head which is used to sandwich and hole the electric component is installed and a moving heating head which faces the heating head so as to be movable up and down is installed. A heating head which is used to sandwich and hold an electric component is arranged and installed. A moving heating head which faces the heating head so as to be movable up and down, which comprises a protrusion a and which is used to pressurize the electric component is arranged and installed. The heating head is heated to a temperature which is higher than that of the moving heating head. In addition, a holding member is installed so as to be movable in such a way that the electric component can be drawn out from a part between the heating head and the moving heating head. Thereby, the electric component can be heated preliminarily, and its peeling operation can be shortened. As a result, a peeling apparatus whose operability is good can be achieved.

Description

1235273 A7 B7 五、發明説明(彳) 〔本發明所屬之技術領域〕 (請先閲讀背面之注意事項再填寫本頁) 本發明係有關譬如針對液晶顯示裝置等,適於進行互 相連接的兩個電氣零件間的剝離之電氣零件之剝離裝置及 δ亥電氣零件之剝離方法。 〔習知之技術〕 說明習知之電氣零件之剝離裝置及該電氣零件之剝離 方法之前,將於電氣零件中的連接構造,根據第3圖加以 說明。 如第3圖所示,在玻璃等絕緣板1上,形成由I τ〇 膜(由氧化銦製成的透明阻抗膜)等製成之複數個導電配 線2、3,以構成一個電氣零件4。 又,在框體5的下面,形成複數個導電體(突起)6 、7,以構成I C晶片等之另一電氣零件8。 經濟部智慧財產局員工消費合作社印製 然後,該電氣零件8 ,將該導電體6、7,相向於絕 緣板1上的導電配線2、3 ,藉由以混入導電粒子9的熱 硬化環氧黏著劑等製成的熱硬化型非等向性導電體1 〇, 貼固電氣零件4和8,同時利用導電粒子9,連接位於上 下的導電體6和導電配線2以及導電體7和導體配線3之 構成。 具有此種連接構造的電氣零件,於組裝途上或者使用 途上,電氣零件會被破壞,或者會發生兩個電氣零件之間 的導電連接不良。 ‘ 於是,由於僅能利用正常的電氣零件,故採用剝離和 本纸張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) 1235273 A7 B7 五、發明説明(2 ) 修理或者更換電氣零件的方法。 (請先閲讀背面之注意事項再填寫本頁) 然後,將使用此種作業的習知之電氣零件之剝離裝置 及該電氣零件之剝離方法,根據第5圖加以說明。 習知之電氣零件之剝離裝置,係如第5圖所不,以平 坦的工作台3 0和電烙鐵3 1所構成的。 然後,於此種剝離裝置的電氣零件之剝離方法中,係 如第5圖所示,首先,在平坦的工作台30上,載置以熱 硬化非等向性導電體1 0連接的電氣零件4、8。 接著,將加熱的電烙鐵3 1接觸在電氣零件8上,介 由電氣零件8對於熱硬化型非等向性導電體1 〇加熱,以 熔融熱硬化型非等向性導電體1 0。 之後,以手作業將電氣零件8剝離電氣零件4。 〔本發明欲解決之課題〕 經濟部智慧財產局員工消費合作社印製 如上所述,於習知之電氣零件之剝離裝置及剝離方法 中,雖然裝置很簡單,但由於利用電烙鐵3 1的剝離作業 ,其作業時間很費時,作業性差,且由於利用手作業剝離 ,作業性更差。 又,若電氣零件像是柔軟的絕緣板之長條體時,其作 業極困難,作業性更差。 〔用以解決課題之手段〕 作爲解決上述課題之第一解決手段,爲具備··將前述 電氣零件之一方面加熱之加熱頭;與前述加熱頭相對向而 本紙張尺度適用中國國家標準(CNS ) A4規格(2!0X297公釐) -5- 1235273 A7 B7 五、發明説明(3 ) (請先閲讀背面之注意事項再填寫本頁) 以上下可動方式被支持著,且具有可限制前述電氣零件之 橫向移動之限制部,而將上述電氣零件之另一方面加熱之 加熱頭;以及爲協同前述限制部,將前述電氣零件與前述 基板拉離而以橫向移動之保持構件。 又,作爲第二解決手段,爲將前述電氣零件之一方面 ,以第一加熱頭加熱;伴隨前述加熱頭,將上述電氣零件 之另一方面,以第二加熱頭加熱,而使前述熱硬化型非等 向性導電體成爲熔融狀態,其後,以前述第二加熱頭限制 前述電氣零件之橫向移動,而使前述基板橫向移動,藉以 將前述電氣零件與前述基板剝開。 又,作爲第三解決手段,藉由前述加熱頭,以較前述 移動加熱頭更高的溫度,將兩個電氣零件間剝開。 〔本發明之實施形態〕 接著,於說明本發明之電氣零件之剝離裝置及該電氣 零件之剝離方法之前,將適用該剝離裝置、剝離方法的電 氣零件的連接構造以第3、4圖加以說明。 經濟部智慧財產局員工消費合作社印製 首先,第3圖係爲適用本發明剝離裝置、剝離方法的 電氣零件的連接構造之一說明圖,同圖(A )係重要部之 俯視圖,同圖(B )係重要部之斷面圖,該第3圖所示之 連接構造係如前所述,在玻璃等的絕緣板1上,形成由 I T ◦膜(由氧化銦製成的透明阻抗膜)等製成之複數個 導電配線2、3,以構成一個電氣零件4。 又,在框體5的下面,形成複數個導電體(突起)6 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -6 - 1235273 A7 ____B7 五、發明説明(4 ) 、7,以構成I C晶片等之另一電氣零件8。 (請先閲讀背面之注意事項再填寫本頁) 然後,該電氣零件8,將該導電體6、7,相向於絕 緣板1上的導電配線2 ' 3,藉由以混入導電粒子9的熱 硬化環氧黏著劑等製成的熱硬化型非等向性導電體1 〇, 連接電氣零件4和8,同時利用導電粒子9,連接位於上 下的導電體6和導電配線2以及導電體8和導體配線3之 構成。 又,第4圖係本發明剝離裝置、剝離方法適用的電氣 零件的連接構造之另一說明圖,同圖(A )係重要部之俯 視圖,同圖(B )係重要部之斷面圖,該第4圖所示者, 係在柔軟的絕緣板1 1上,.形成由銀等製成之複數個導電 配線1 2,以構成一個電氣零件1 3,又在柔軟的絕緣板 1 4上,形成由銀等製成之複數個導電配線1 5,以構成 另一電氣零件1 6。 經濟部智慧財產局員工消費合作社印製 而且,該電氣零件1 6,係將該導電配線1 5,相向 於另一邊的電氣零件1 3的導電配線1 2,利用混入導電 粒子9的熱硬化環氧黏著劑等製成的熱硬化型非等向性導 電體1 0,連接電氣零件1 3和1 6,同時利用導電粒子 9,連接位於上下的導電配線1 5和導體配線1 2之構成 〇 如前所述,具有此種連接構造之電氣零件,就組裝途 中或者使用途中,即會破壞電氣零件,又會發生兩個電氣 零件間的導電連接不良。 於是,爲了僅能利用正常的電氣零件,採用剝開修理 本纸張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 1235273 A7 __ B7 五、發明説明(5 ) 電氣零件,或者替換的方法。 (請先閱讀背面之注意事項再填寫本頁) 而且,爲使用此種作業的本發明之電氣零件之剝離裝 置及該電氣零件之剝離方法,根據第1、2圖加以說明。 此例,右將本發明之電氣零件之剝離裝置根據第1、 2圖加以說明,第1圖係本發明之電氣零件之剝離裝置之 重要部之前視圖,第2圖係同一重要部之側視圖,以具有 爲夾持電氣零件的加熱之加熱頭2 0和、相向於該加熱頭 2 0而設成可上下動之突部2 1 a,同時與加熱頭2 0 — 起夾持電氣零件作爲加壓電氣零件的加熱之移動加熱頭 2 1和、保持電氣零件,且設成可從前述加熱頭2 0和移 動加熱頭2 1之間拉出電氣零件的移動之保持構件2 2所 構成。 經濟部智慧財產局員工消費合作社印製 而且,加熱頭20,係加熱至比移動加熱頭21更高 的溫度,而保持構件2 2的平坦面2 2 a,係與加熱頭 2 0的平坦面2 0 a —致,甚至保持構件2 2,係平行於 加熱頭2 0的平坦面2 0 a,於第1圖中面對紙面而垂直 的方向,亦即,於第2、3圖(A)中可向箭頭P方向移 動。 接著,若將電氣零件之剝離方法,以第2圖所示的電 氣零件之連接構造爲例,根據第1圖加以說明,首先,在 保持構件2 2的平坦面2 2 a上,載置以熱硬化型非等向 性導電體1 0連接之電氣零件4、8,同時以保持構件 2 2保持電氣零件4。 於是,電氣零件4係爲載置在加熱頭2 0的平坦面 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -8 - 1235273 A7 __ B7 五、發明説明(6 ) 2 〇 a上的狀態,利用加熱的加熱頭2 0預先加熱電氣零 件4、熱硬化型非等向性導電體1 0及電氣零件8。 (請先閱讀背面之注意事項再填寫本頁) 接著,使移動加熱頭2 1移動至下方,接觸電氣零件 8,以移動加熱頭2 1和加熱頭2 0夾持電氣零件4、8 〇 於是,利用加熱的兩個頭2 0、2 1熔融熱硬化型非 等向性導電體1 0。 接著,將保持構件2 2,面對加熱頭2 0而成平行, 且製成從兩個頭2 0、2 1間拉出電氣零件4、8的移動 0 於是,由於電氣零件4係爲利用保持構件2 2強制移 動的反面,另一邊的電氣零件8係爲拉至移動加熱頭2 1 的突部2 1 a的狀態,所以會互相剝離。 藉由此種方法,進行兩個電氣零件間的剝離,就連第 4圖所示的電氣零件之連接構造,也是利用如上所述的方 法,進行剝離。 經濟部智慧財產局員工消費合作社印製 〔本發明之效果〕 若根據本發明,由於以加熱的加熱頭和加熱的移動加 熱頭夾持電氣零件,進行兩個電氣零件的剝離,所以能預 先加熱電氣零件,縮短其作業,提供作業性良好的剝離裝 置及方法。 又,由於藉由保持電氣零件之保持構件,從加熱頭和 移動加熱頭間拉出電氣零件,所以能自動化剝離,提供作 本紙張尺度適用中國國家標準(CNS ) A4規格(2I0X297公釐) -9- 1235273 A7 B7 五、發明説明(7 ) 業省時之剝離裝置及方法。 --------靡衣—— (請先閱讀背面之注意事項再填寫本頁) 甚至,藉由將加熱頭的加熱溫度,加熱至比移動加熱 頭更尚,以提高電氣零件的預先加熱,更進一步縮短作業 時間。 〔圖面之簡單說明〕 第1圖係本發明電氣零件之剝離裝置之重要部之前視 圖, 第2圖係本發明電氣零件之剝離裝置之重要部之側視 圖; 第3圖係適用本發剝離裝置、剝離方法的電氣零件的 連接構造之一說明圖; 第4圖係適用本發剝離裝置、剝離方法的電氣零件的 連接構造之另一說明圖; 第5圖係表示習知電氣零件之剝離裝置及剝離方法之 說明。 經濟部智慧財產局員工消費合作社印製 〔符號之說明〕 1.......絕緣板 2、3.....導電配線 4 .......電氣零件 5 .......框體 6、7.....導電體 8.......電氣零件 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -10- 1235273 A7 B7 五、發明説明(8 ) 9 .......導電粒子 10 ......熱硬化型非等向性導電體 2 0......加熱頭 2 0a.....平坦面 2 1......移動加熱頭 2 1a.....突部 2 2......保持構件 2 2a.....平坦面 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -11 -1235273 A7 B7 V. Description of the invention (彳) [Technical field to which the present invention belongs] (Please read the precautions on the back before filling out this page) The present invention is related to, for example, two liquid crystal display devices suitable for interconnection with each other. Stripping device between electrical parts. Stripping device for electrical parts and method for stripping electrical components. [Known Technology] Before explaining the conventional stripping device for electrical parts and the method for stripping the electrical parts, the connection structure in the electrical parts will be described with reference to FIG. 3. As shown in FIG. 3, on the insulating plate 1 such as glass, a plurality of conductive wirings 2, 3 made of an I τ0 film (transparent resistance film made of indium oxide), etc. are formed to constitute one electrical part 4 . In addition, a plurality of electrical conductors (protrusions) 6 and 7 are formed on the lower surface of the housing 5 to constitute another electrical component 8 such as an IC chip. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, the electrical parts 8, the conductors 6 and 7 are opposed to the conductive wirings 2 and 3 on the insulating board 1, and the heat-curing epoxy mixed with the conductive particles 9 is used. A thermosetting non-isotropic conductor 1 made of an adhesive, etc., which is used to fix electrical parts 4 and 8, and at the same time, conductive particles 9 are used to connect the upper and lower conductors 6 and 2 and the conductors 7 and 2 The composition of 3. An electrical part having such a connection structure may be damaged during assembly or use, or a poor conductive connection between the two electrical parts may occur. '' Therefore, since only normal electrical parts can be used, the Chinese National Standard (CNS) A4 specification (210X 297 mm) is adopted for the stripping and this paper size. 1235273 A7 B7 V. Description of the invention (2) Repair or replacement of electrical parts Methods. (Please read the precautions on the back before filling this page.) Then, the conventional stripping device for electrical parts and the method for stripping electrical parts will be explained with reference to Figure 5. The conventional stripping device for electrical parts is composed of a flat table 30 and an electric iron 31 as shown in FIG. 5. Next, in the method for peeling electrical parts of such a peeling device, as shown in FIG. 5, first, on a flat table 30, an electrical part connected with a heat-curable anisotropic conductor 10 is placed. 4, 8. Next, the heated electric soldering iron 31 is brought into contact with the electric component 8 and the thermosetting type anisotropic conductor 10 is heated through the electric component 8 to melt the thermosetting type anisotropic conductor 10. After that, the electrical component 8 is peeled off by hand. [Problems to be Solved by the Invention] As described above, in the consumer electronics cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, in the conventional peeling device and peeling method for electrical parts, although the device is simple, the peeling operation using an electric soldering iron 31 , Its work time is time-consuming, workability is poor, and because of hand peeling, workability is worse. In addition, if the electrical parts are like a long body of a flexible insulating plate, the work is extremely difficult and the workability is worse. [Means for solving the problem] As the first solution for solving the above-mentioned problems, a heating head for heating one aspect of the aforementioned electrical parts is provided; opposite to the above-mentioned heating head, and the Chinese paper standard (CNS) ) A4 specification (2! 0X297mm) -5- 1235273 A7 B7 V. Description of the invention (3) (Please read the precautions on the back before filling this page) The above movable modes are supported, and they can limit the aforementioned electrical A heating head that heats the other side of the electrical part while limiting the lateral movement of the part; and a holding member that pulls the electrical part away from the substrate to move laterally in cooperation with the limiting part. As a second solution, one aspect of the electrical component is heated by a first heating head; with the heating head, the other aspect of the electrical component is heated by a second heating head to harden the heat. The non-isotropic conductive body is in a molten state, and then the second heating head is used to restrict the lateral movement of the electrical component, and the substrate is moved laterally, thereby peeling the electrical component from the substrate. As a third solution, the heating head is used to peel the two electrical parts apart at a higher temperature than the moving heating head. [Embodiment of the present invention] Next, before explaining the peeling device of the electrical component and the peeling method of the electrical component of the present invention, the connection structure of the electrical component to which the peeling device and the peeling method are applied will be described with reference to Figs. 3 and 4. . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. First, FIG. 3 is an explanatory diagram of a connection structure of electrical parts to which the stripping device and the stripping method of the present invention are applied. The same figure (A) is a top view of an important part and the same figure ( B) is a cross-sectional view of an important part. The connection structure shown in FIG. 3 is an IT film (a transparent impedance film made of indium oxide) formed on an insulating plate 1 such as glass as described above. The plurality of conductive wirings 2 and 3 are made to form an electrical component 4. In addition, a plurality of electrical conductors (protrusions) are formed under the frame 5. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -6-1235273 A7 ____B7 5. Description of the invention (4), 7 To form another electrical component 8 such as an IC chip. (Please read the precautions on the back before filling this page.) Then, the electrical component 8 opposes the conductive bodies 6, 7 to the conductive wiring 2'3 on the insulating plate 1, and mixes the heat of the conductive particles 9 Heat-curable non-isotropic conductor 1 made of hardened epoxy adhesive, etc., is used to connect electrical parts 4 and 8, and at the same time, conductive particles 9 are used to connect conductors 6 and 2 on top and bottom, and conductors 8 and 8 The structure of the conductor wiring 3. In addition, FIG. 4 is another explanatory diagram of the connection structure of electrical parts to which the peeling device and the peeling method of the present invention are applied. The same figure (A) is a plan view of an important part, and the same figure (B) is a cross-sectional view of the important part. The one shown in FIG. 4 is attached to a flexible insulating plate 11 to form a plurality of conductive wirings 12 made of silver or the like to form an electrical part 1 3 and to the flexible insulating plate 14 A plurality of conductive wirings 15 made of silver or the like are formed to constitute another electrical part 16. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The electrical parts 16 are conductive wires 15 facing the electrical parts 1 3 on the other side. A thermosetting non-isotropic conductive body 10 made of an oxygen adhesive and the like is connected to electrical parts 13 and 16 and at the same time, conductive particles 9 are used to connect the upper and lower conductive wires 15 and 12 to each other. As mentioned earlier, electrical parts with such a connection structure, either during assembly or during use, will destroy the electrical parts and cause a poor conductive connection between the two electrical parts. Therefore, in order to use only normal electrical parts, the paper is peeled and repaired. The paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) 1235273 A7 __ B7 V. Description of the invention (5) Electrical parts, or replacement Methods. (Please read the precautions on the reverse side before filling out this page.) Furthermore, the peeling device of the electrical part of the present invention and the method for peeling the electrical part using this operation will be described with reference to FIGS. 1 and 2. In this example, the peeling device of the electrical part of the present invention will be described on the right according to FIGS. 1 and 2. FIG. 1 is a front view of the important part of the peeling device of the electrical part of the present invention, and FIG. 2 is a side view of the same important part. A heating head 20 having heating for holding electrical parts and a protrusion 2 1 a which can be moved up and down opposite to the heating head 20 are used to hold electrical parts together with the heating head 20 as The moving heating head 21 for heating the pressurized electric part and the holding electric part are configured to be provided with a moving holding member 22 that can pull out the electrical parts from between the heating head 20 and the moving heating head 21. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the heating head 20 is heated to a higher temperature than the moving heating head 21, and the flat surface 2 2 a of the holding member 2 2 is the flat surface of the heating head 20. 2 0 a-even, even the holding member 2 2 is parallel to the flat surface 2 0 a of the heating head 20, in the direction perpendicular to the paper surface in FIG. 1, that is, in FIGS. 2 and 3 (A ) To move in the direction of arrow P. Next, if the method of peeling electrical parts is described by taking the connection structure of the electrical parts shown in FIG. 2 as an example, and explained with reference to the first figure, first, place a flat member 2 2 a on the holding member 22 The electric parts 4 and 8 to which the thermosetting type anisotropic conductor 10 is connected, and the electric parts 4 are held by the holding members 22. Therefore, the electrical part 4 is a flat surface placed on the heating head 20, and the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -8-1235273 A7 __ B7 V. Description of the invention (6) 2 〇 In the state of a, the electric component 4, the thermosetting type anisotropic conductor 10 and the electric component 8 are heated in advance by the heated heating head 20. (Please read the precautions on the back before filling in this page.) Next, move the moving heating head 21 to the bottom and contact the electrical part 8 to move the heating head 21 and the heating head 20 to hold the electrical parts 4, 8. Using the heated two heads 20, 21, the molten thermosetting anisotropic conductive body 10 is melted. Next, the holding member 22 is made parallel to the heating head 20, and the movement of the electrical parts 4, 8 drawn between the two heads 20, 21 is made. Therefore, since the electrical parts 4 are used On the reverse side of the holding member 2 2 forcibly moving, the other electrical part 8 is pulled to the protrusion 2 1 a of the moving heating head 2 1 and therefore peels from each other. In this way, the peeling between the two electric parts is performed, and even the connection structure of the electric parts shown in FIG. 4 is peeled by the method described above. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Effect of the present invention] According to the present invention, since the electric parts are held by the heated heating head and the heated moving heating head, the two electric parts can be peeled off, so the heating can be performed in advance. Electrical parts are shortened in operation, and peeling devices and methods with good workability are provided. In addition, since the electrical parts are pulled out between the heating head and the moving heating head by the holding members that hold the electrical parts, they can be automatically peeled off, and the paper size applicable to the Chinese National Standard (CNS) A4 specification (2I0X297 mm)- 9- 1235273 A7 B7 V. Description of the invention (7) Time-saving stripping device and method. -------- Miyi—— (Please read the precautions on the back before filling this page) Even, by heating the heating head to a higher temperature than moving the heating head, the electrical parts can be improved. Pre-heating further shortens the working time. [Brief description of the drawing] Fig. 1 is a front view of the important part of the peeling device of the electrical part of the present invention, and Fig. 2 is a side view of the important part of the peeling device of the electrical part of the present invention; One explanatory diagram of the connection structure of the electrical parts of the device and the peeling method; FIG. 4 is another explanatory diagram of the connection structure of the electrical parts to which the peeling device and the peeling method of the present invention are applied; Description of device and peeling method. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [Explanation of Symbols] 1 ....... Insulation plates 2, 3 ..... Conductive wiring 4 ......... Electrical parts 5 ... ... framework 6, 7, ...... conductor 8 .... electrical parts The paper size is applicable to Chinese National Standard (CNS) A4 (210X297 mm) -10- 1235273 A7 B7 V. Description of the invention (8) 9 ......... conductive particles 10 ... thermosetting type anisotropic conductor 2 0 ... heating head 2 0a ..... flat surface 2 1 ... moving the heating head 2 1a ..... protrusion 2 2 ... holding member 2 2a ..... flat surface (please read the precautions on the back before filling in this Page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized for the Chinese National Standard (CNS) A4 (210X 297 mm) -11-

Claims (1)

1235273 A8 B8 C8 D8 六、申請專利範圍 1 1 · 一種電熟零件之剝離裝置,以熱硬化型非等向性 導電體使連接於基板的電氣零件剝離,g,持徵@ t: (請先閲讀背面之注意事項再填寫本頁) 加熱該電氣零件的一側面之加熱頭; 面對該加熱頭可上下動作地被支持,具有限制該電氣 零件的橫向移動之限制部,加熱該電氣零件的他側面之移 動加熱頭;以及 與該限制部協同,用以拉離該電氣零件與該基板而橫 向移動之保持構件。 2 · —種電氣零件之剝離方法,以熱硬化型非等向性 導電體使連接於基板的電氣零件剝離,其特徵爲: 以第一加熱頭加熱該電氣零件的一側面,伴隨著該加 熱頭,以第二加熱頭加熱該電氣零件的他側面,令該熱硬 化型非等向性導電體爲熔融狀態,然後,以該第二加熱頭 限制該電氣零件的橫向移動,使該基板橫向移動,藉以剝 開該電氣零件與該基板。 3 ·如申請專利範圍第2項所述之電氣零件之剝離方 法,其中用以藉由比該移動加熱頭還高的溫度的該加熱頭 剝開兩個電氣零件間。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)1235273 A8 B8 C8 D8 VI. Patent application scope 1 1 · A peeling device for electrical components, which uses a thermosetting non-isotropic conductor to peel off the electrical components connected to the substrate. Read the precautions on the back and fill in this page again.) A heating head that heats one side of the electrical part. It can be supported up and down in the face of the heating head. It has a restricting part that restricts the lateral movement of the electrical part. A moving heating head on the other side; and a holding member that cooperates with the restricting portion to pull away from the electrical component and the substrate and move laterally. 2-A method of peeling electrical parts, which uses a thermosetting non-isotropic conductor to peel off the electrical parts connected to the substrate, and is characterized in that one side of the electrical part is heated by a first heating head and accompanied by the heating A second heating head is used to heat the other side of the electrical part, so that the thermosetting non-isotropic conductive body is in a molten state, and then the second heating head is used to restrict the lateral movement of the electrical part, so that the substrate is horizontal. Move to peel off the electrical part and the substrate. 3. The method for peeling electrical parts as described in item 2 of the scope of patent application, wherein the heating head is used to peel the two electrical parts apart by the heating head having a temperature higher than that of the moving heating head. This paper size applies to China National Standard (CNS) A4 (210X297 mm)
TW087100378A 1997-02-19 1998-01-13 Device and method for stripping electric parts TWI235273B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9051038A JPH10233576A (en) 1997-02-19 1997-02-19 Apparatus and method for peeling electric component

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CN100515643C (en) * 2004-06-28 2009-07-22 鸿富锦精密工业(深圳)有限公司 Constant temperature type hot-press jointing device and method

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JPH0682915B2 (en) * 1989-04-20 1994-10-19 千住金属工業株式会社 Reflow furnace
JP2897406B2 (en) * 1990-11-06 1999-05-31 セイコーエプソン株式会社 Semiconductor element peeling method
JP2707189B2 (en) * 1992-08-26 1998-01-28 株式会社日立製作所 Method and apparatus for removing electronic component from substrate
JP3498872B2 (en) * 1995-06-01 2004-02-23 日立化成工業株式会社 Chip repair device

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CN1169014C (en) 2004-09-29
CN1191325A (en) 1998-08-26

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