TWI234223B - Dispenser device for fabricating semiconductor chips - Google Patents

Dispenser device for fabricating semiconductor chips Download PDF

Info

Publication number
TWI234223B
TWI234223B TW92104830A TW92104830A TWI234223B TW I234223 B TWI234223 B TW I234223B TW 92104830 A TW92104830 A TW 92104830A TW 92104830 A TW92104830 A TW 92104830A TW I234223 B TWI234223 B TW I234223B
Authority
TW
Taiwan
Prior art keywords
bolt
solution
screw
dispenser device
needle
Prior art date
Application number
TW92104830A
Other languages
Chinese (zh)
Other versions
TW200411805A (en
Inventor
Min-Jin Ju
Sung-Min Kang
Seung-Min Hong
Original Assignee
Protec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Protec Co Ltd filed Critical Protec Co Ltd
Publication of TW200411805A publication Critical patent/TW200411805A/en
Application granted granted Critical
Publication of TWI234223B publication Critical patent/TWI234223B/en

Links

Landscapes

  • Coating Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

Disclosed is a dispenser device for fabricating semiconductor chips, which readily accomplishes micro-dispensing and high-speed dotting processes and precisely discharges a solution. The dispenser device comprises a main body assembled with a moving unit including a robot unit, and a housing communicating with a syringe vessel containing a viscous solution through a connection pipe and detachably assembled with the main body. A connection shaft is integrated with a lower screw received in the housing, and a screw rod has a collar formed at a lower part of the connection shaft. A balance controller is axially assembled with an upper part of the connection shaft to control horizontal and vertical movement of the screw rod, and a needle member is detachably assembled with a lower part of the housing. Further, a servo motor is installed on the main body and has a driving shaft connected to the connection shaft of the screw rod by a coupling member to control rotation of the screw rod.

Description

1234223 (1) 玖、發明說明 [發明所屬之技術領域】 本發明係關於一種用以製造半導體晶片之 ’特別地’係關於一種用以製造半導體晶片之 ’其容易地達到微分配及高速點化過程,且精 液。 [先前技術】 如熟習此項技藝者而言,分配器裝置在商 至分配諸如環氧樹脂的黏性溶液的過程,爲裝 或積體電路(I C )的電子組件在印刷電路板( 或應用至倒裝晶片的未充滿過程,其中倒裝晶 封裝以保護其免受外部環境的影響。 目前,一種每單位小時裝配 6 5 0 0 0或更 PCB上之高速晶片裝配器已被發展且商業化成 配裝置,因此保留有發展能夠應用至高速晶片 良分配器之需要。 尤其,這是必要的,使用作爲半導體裝置 裝置之分配器以一想要量之精確且快速地分配 以使當製造半導體晶片時,減少瑕疵比例。再 想要於一可容許誤差範圍內在一預定位置快速 出溶液之分配器,甚至當其重複使用達一長時 ’最近已建議經由一泵使用真空壓力或注入壓 以增加溶液的排出速度。 分配器裝置 分配器裝置 確地排出溶 業上係應用 配諸如晶片 PCB )上, 片被塗覆並 多個晶片入 爲一表面裝 裝配器的改 的表面裝配 環氧溶液, 考,消費者 且固定地排 間時。更者 力之過程, -6 - 1234223 (2) 參考圖〗,解說一習知的分配器裝置的 其中一主體2〇包含馬達及栗25,且,劳 達2 1的馬達軸2 2驅動之螺桿2 4。 此時’環氧樹脂係藉由氣動壓力自注入 經由饋送線2 6饋送至泵2 5,而經由位在泵 2 7排出至基底上。 習知分配器裝置結構係以使饋送於螺桿 螺距間的溶液(E · P )依據螺桿2 4的旋轉 由針2 7排入基底,因此,螺桿2 4應被精確 例如,由於溶液壓力的反衝,且,螺桿的水 被精確地控制以在一高速而精確饋送溶液至; 然而,習知分配器裝置的不利點在於, 精確控制螺桿2 4的單元,因此,降低了分 靠性。 許多努力已被進行以避免不利點。例如 發明人的專利,韓國專利第9 8 - 5 8 3 1 6及9 9 -揭示用以注入矽酮的裝置,此裝置構成用以 樹脂塗覆機。依據此些專利,溶液係使用具 轉桿而排出基底上,以控制溶液的排出量。 然而,此些習知專利的不利點在於,此 快速地分配的困難,因爲此裝置具有一大尺 複雜的驅動方式而操作的。亦具有精確分配 液的問題,因爲此裝置的溶液排出能力係不 引起分解/組裝及淸潔此裝置的問題。 簡要截面圖, [2 5設有由馬 容器(S · L ) 2 5的端之針 24的螺栓的 而下降,以經 地控制以防止 平及垂直軸應 S底上。 其設有不足以 配器裝置的可 ,可參考本案 16687號,其 製造半導體的 有一通孔的旋 裝置具有許多 寸且係依據一 微量的樹脂溶 佳的;另外, -7 - 1234223 (3) 此些習知專利的其它不利點在於,此裝置的排出誤差 率係局的’因爲其難以合意地控制此螺桿,其使裝置的可 靠性降低’以及’裝置與其八類型的分配器裝置的互換性 係不佳的’因爲其難以依據樹脂溶液的黏度,精確地分配 樹脂溶液並合意地控制樹脂溶液的排出量。 更者’此些習知專利的不利點在於,由於其複雜的分 配及控制過程’其難以快速地分配樹脂溶液至基底上,其 中液體樹脂溶液(環氧樹脂)係並行地控制;換言之,樹 脂溶液的流動通道係藉由旋轉之開啓及關閉桿或自動倒轉 以分配一預定量的樹脂溶液而阻塞,且,阻塞的流動通道 係藉著使此開啓及關閉桿與流動通道分離而重新開啓以移 動樹脂溶液。 因此’本發明人已建議揭示於韓國專利第 2002-49007號之用以製造半導體片的分配器裝置,以克 服以上的不利點,其中分配器裝置具有一相當簡化的結構 ,且確定一精確的樹脂溶液排放,由於分解及組裝的方便 性之分配器裝置的容易淸潔,以及,此分配器裝置與其八 類型的分配器裝置的極佳互換性。 然而,雖然相較於習知專利(韓國專利第9 8 - 5 8 3 1 6 及99-16687號)已有改善,韓國專利第2002-49007號的 分配器裝置仍具有巨大且複雜的結構、複雜的樹脂溶液饋 送及控制過程、複雜的操作方法及精確地控制此螺桿的困 難的不利點。 (4) 1234223 【發明內容】 因此,本發明係針對發生於習知技術的以上不利點而 製作,且,本發明的目的在於提供一種用以製造半導體晶 片之分配器裝置,其精確地排出一溶液且於溶液的排出期 間微量地控制此溶液,以最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置,其實施一高速點化過程,且,調整來最小 化溶液排出量的誤差,藉此最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置,其利用直接連接至一螺桿以實施高速點化 過程及使用一反衝控制的結束控制過程之伺服馬達以軸向 地控制溶液流動,藉此最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置,由於其精密結構,其於操作期間最大地防 止施加至分配器裝置的巨大負載,以最小化其操作的失誤 〇 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置,其係容易地分解及重組以使方便地淸潔依 據其用途而方便地更換之螺桿,藉此最大化與其它類型的 分配器裝置的互換性。 基於本發明,此些目的可藉配置一種用以製造半導體 晶片之分配器裝置而達成,該分配器裝置包含一主體;一 殼部,連接至注入容器且可拆卸地與主體組裝;一螺桿, ill於殼部中,使用軸向地連接至其本身的伺服馬達經由一 -9- (5) 1234223 針部以預定量排出饋送自注入容器的溶液;及,一平衡控 制器,與螺桿軸向地組裝以控制螺桿的水平及垂直移動。 【實施方式】 現參考圖式,其中相同參考號碼係使用於所有的不同 圖式中以標示相同或相似的組件。 圖2係依據本發明之分配器裝置的立體圖,圖3係依 據本發明之分配器裝置的分解立體圖,以及,圖4係依據 本發明之分配器裝置的截面側視圖。 依據本發明,提供一種分配器裝置,其精確地排出一 黏性溶液,例如,環氧樹脂,以滿足改善性能的需要,包 括用以製造半導體晶片的設備的高速且精確操作,諸如晶 片安裝。 詳細的說’本發明提供一種用以製造半導體晶片之分 配器裝置,其包含與包括一機械臂單元的移動單元(未顯 不)組裝之主體1〇、及經由一連接管(S - 1)與裝有黏 性溶易的注入容器(s · L )相通且可拆卸地與主體1 0組 裝之殼部2 0。連接軸3 3係與容納於殼部2 0的下螺栓3 1 整合’且’螺桿3 0具有形成在連接軸3 3的下部之軸環 3 2。平衡控制器4 〇係與連接軸3 3的上部軸向地組裝以控 制螺桿3 0的水平與垂直移動,且,針構件6 0係與殼部 2 〇的下部可拆卸地組裝。再者,伺服馬達2 0 0係安裝在 主體1 0上,且,具有藉由聯結構件丨〇 〇而連接至螺桿3 〇 的連接軸3 3之驅動軸2 1 0,以控制螺桿3 0的旋轉。 1234223 (6) 參考圖2與圖4,主體10係設有上支撐部n在其上 部,及下支撐部1 3在其下部。下支撐部1 3係軸向地相對 且上支撐部]1,且,組裝槽1 4係形成在上支撐部n上 ,以使上支撐部Π形成一、[/形狀。伺服馬達2 〇 〇係插 入形成在主體1 0的上支撐部Π之馬達組裝內徑1 2中, 以使用螺桿(B )而與主體1 0堅固地組裝,且,殼部2 〇 係藉由將定位螺栓1 6拴緊入形成在下支撐部1 3的兩橫向 側上之定位螺栓孔1 5任一者中而插入與下支撐部1 3可拆 卸地組裝之組裝槽1 4。在此時,定位槽2 5係形成在殼部 20的兩側上,因此,當拴緊入定位螺栓孔1 5時,定位螺 栓1 6係經由定位螺栓孔1 5而插入定位槽2 5,藉此,使 殼部2 0與主體1 〇的下支撐部1 3堅固地組裝。 參考圖8及9,具有上及下擴大階式內徑2 2、2 3之 溶液通道2 1係垂直形成於殻部2 0中,且,溶液通道2】 與經由形成在殻部2 0的內壁上之溶液出口 2 3 a $ $ Λ胃 器(S · L )的連接管(S - 1 )的端垂直地相通。 在此時,碳化物管2 7係插入溶液通道2 1以最小彳匕由 於溶液的流動及下螺栓3 1的旋轉之摩擦聲。 下擴大階式內徑2 3係界定於殼部的外螺紋下部24, 且,接收針6 1的頭部6 3於其內,以及,針6 1係藉由拴 固在殼部的外螺紋下部24上之針蓋62而安裝至下·擴大階 式內徑,如圖9所示。 螺桿3 0的軸環32係插入上擴大階式內徑2 2,其中 上及下無油環3 5、3 6係裝在連接軸3 3上於軸環3 2的上 -11 - 1234223 (7) 方及下方的位置,且,◦形環3 7係安裝以致使與下無油 環3 6的下側接觸,使得溶液出口 2 3 a氣密性地容納下螺 栓3 1。再者,連接軸3 3係連接至伺服馬達2 Q 0的驅動軸 2 1 0及聯結構件1 0 0,以藉伺服馬達2 0 0而被驅動。 螺桿3 0的下螺栓3 1包含螺旋紋及螺旋槽3 1 a,螺旋 槽3 1 a被削圓以平順地移動溶液,且,螺栓3 1的末端形 成一錐形且削圓的尖端,使得螺栓3 1的末端與形成於針 6 1的頭部6 3之V形閥座64接觸,以水密性地阻擋針6 ] 〇 現在回到圖1 〇及1 1中,螺栓3 1可依據螺栓3 1的螺 距尺寸而選擇地使用,且,當溶液的黏度或分配器裝置的 使用被改變時,不同的螺桿3 0被使用。藉此,達到與其 它類型的分配器裝置之互換性。 換言之,於使用窄螺距的螺栓的例子中,自針排出的 溶液量係小的,然而,溶液係自針而精確地排出。另一方 面,於使用寬螺距的螺栓的例子中,溶液係大量地排出, 然而,此溶液係自針而不精確地排出。 再者,平衡控制器4 0作用來控制螺桿3 0的水平及垂 直移動,以精確地排出溶液。 參考圖3至5,平衡控制器4 0係與螺桿3 〇的連接軸 3 3的上部軸向地組裝,且,包含使用第一螺桿(b )而與 殼部2 0組裝之軸承殼部4〗,以使軸承殼部4 1係定位在 殼部20的上與下支撐部1 1、1 3之間。再者,數個軸承 4 2、4 3係位於軸承殼部4 1中,且,外接合預載蓋4 4係 -12- 1234223 (8) 藉由第二螺桿(B )與軸承殻部4 1的上側組裝以向下壓迫 軸承42、43的外接合。再者,內接合預載螺帽46係拴在 裝入軸承4 2、4 3之調整螺栓4 5的外螺紋部4 9 a,因此, 使軸承4 2、4 3的內接合堅固地相互結合。更者,高度調 整螺帽47係拴在調整螺栓45的外螺紋部49a以致使.拴緊 在調整螺栓 4 5的外螺紋部4 9 a,而垂直地壓迫位在螺桿 3 0的軸環3 2的上側上之上無油環3 5,且,彈簧調整螺栓 48係旋入調整螺栓45的內螺紋部49b。彈簧50係位在彈 簧調整螺栓4 8的下側與上無油環3 5的上側之間,以藉與 調整螺栓45的內螺紋部49b嚙合之彈簧調整螺栓48的調 整而彈性地壓迫上無油環3 5。 更者,較佳地,軸承4 2、4 3的每一者係包含內接合 與外接合之角球形軸承。 參考圖6a及6b,定位螺栓47b係拴入形成在高度調 整螺帽4 7的圓周上之內螺紋內徑4 7 a,且,係拴緊入內 螺紋內徑4 7 a,同時上無油環3 5與高度調整螺帽4 7的下 側接觸。 因此,彈簧調整螺栓4 8交替地壓縮或鬆弛彈簧5 0以 調整螺桿3 0的軸環3 2與上及下無油環3 5、3 6間之接觸 程度,如圖7所示。 參考號碼1 2 0代表將注入容器的連接管(S - 1 )連接 至殼部2 0的溶液出口 2 3 a之連接螺栓蓋。 換言之,注入容器(S · L )經由連接管(S 4 )及殼 部2 0的溶液出口 2 3 a而與溶液通道2 1相通,且,螺桿 -13 - 1234223 (9) 3 〇係藉伺服馬達2 Ο 0而驅動以旋轉溶液通道2 1中之螺栓 3 1,藉此,經由針構件6 0的針6 1自溶液通道2 1分配溶 液至諸如半導體晶片(未顯示)之標的上。 溶液藉由螺桿3 0的螺栓3 1的排出係由於此溶液的剪 力,因此’需要時常保持溶液的流動路徑的區域在固定壓 力下(自丨土入谷器饋送溶液的壓力:約〇 . 5 b a r,以精確地 分配溶液。 爲此理由,就壓力而論,需要精確地控制影響到其周 圍溶液之螺桿3 0的平衡。 本發明提供精確地控制螺桿3 0的平衡之平衡控制器 40 〇 螺桿3 〇的平衡應被控制,爲了防止螺桿3 〇的反衝線 象,然而不是關鍵性的,當溶液的黏度係低以及於排出此 溶液期間施加至螺栓3 1之溶液的負載係低時。 因此’本發明的平衡控制器4 0係施加至使用高黏度 溶液的例子中,其增加對螺栓3 1的負載於溶液的排出期 間。 本發明的平衡控制器4 0作用如精確地移動螺桿3 〇, 最小的施加至螺栓3 1之負載的變化,以及,方便地分解 並重組分配器裝置。 詳細地,溶液係於螺桿3 0的旋轉期沿著螺栓3 1的螺 旋槽3 ] a自注入容器(S · L )饋送至針61。 此時’螺栓3 ]旋轉在殼部2 〇的溶液通道2 1的中央 ’且’施加至螺栓3 ]之負載的方向係相對溶液的排出方 -14 - 1234223 (10) 向。 然而,當溶液接近針構件6 0的針6 1時,針對螺栓 3 1之負載係不想要地增加,因爲針6〗的窄直徑。 因此’需要控緊或鬆開調整螺栓4 5以使調整螺栓4 5 的高度調整螺帽4 7接觸到位在螺桿3 0的軸環3 2上之上 無油環3 5的上表面,致使不會由於施加至螺栓3 1之負載 而軸向地移動螺桿3 0,如圖6 a及6 b所示。 此時,較佳地,高度調整螺帽4 7適當地與上無油環 3 5接觸,致使不會防礙螺桿3 〇的平順旋轉。 更者,數個角球形軸承4 2、4 3係位於與主體1 〇組裝 之軸承殼部4 1中,外接合預載蓋44係藉由螺桿(b )而 與軸承殼部4 1組裝,以及,內接合預載螺帽4 6係拴在調 整螺栓45的外螺紋部49a上,因此,精確地控制螺桿3 〇 的軸向移動。此時,高度調整螺帽4 7作用來均勻分配施 加至螺桿3 0的移動之力,且,彈簧5 0係有助於防止螺桿 3 〇的反衝現象。 換言之’當螺桿3 0係藉由伺服馬達2 0 0而驅動時, 與軸環3 2的上及下側接觸之上及下無油環3 5、3 6、彈簧 5 〇、調整螺栓4 5、彈簧調整螺栓4 8及角球形軸承4 2、4 3 的內接合係與連接軸3 3關聯地旋轉,以控制螺桿3 0的水 平與垂直移動。 尤其,本發明的平衡控制器4 〇減小由於螺桿3 0及溶 液間之力而針對螺栓3 1的負載,以使螺桿3 0平順地旋轉 ,因爲連接至角球形軸承4 2、4 3之高度調整螺帽4 7旋轉 1234223 (11) ,同時支撐螺桿3 0的依賴負載。 再者,旋入調整螺栓4 5的內螺紋部4 9 b之彈簧調整 螺栓4 8藉由拴緊或鬆開其本身而上升或下降,因此,推 壓或放鬆彈簧5 0而控制上及下無油環3 5、3 6與螺桿3 0 的軸環3 2間之接觸程度,以如願地避免由於施加至螺栓 3 1的溶液的負載之不利點,如圖7所示。 以下,將更詳細地說明依據本發明之分配器裝置的過 程能力指數。 於一過程的統計品質控制中係一主要目的,穩定地管 理此過程。再者,合意地控制此過程係重要的,以使此過 程的產品符合預定標準必備條件。 因此,這是需要評估產品的品質變化於產品的發展及 製造步驟中,並實施一過程能力分析,其中產品的量測値 與設定値間之差別係使用各種統計方法而·予以檢查,以減 少產品的品質變化。 此過程能力,其包括自然公差(6 σ )的槪念,意指 能夠量測一想要品質的產品之過程的能力,當此過程係於 一穩定狀態在特定條件下。 此時,此過程能力指數係使用來定量地表示此過程能 力。 此過程能力指數,其界定爲可容許過程範圍對自然公 差(6 σ )的比,意指評估藉由某一過程量測一想要品質 的產品的能力是否足夠之指數,且,分類成數類型的過程 能力指數,諸如C p、C p k及C p m,依據與規格限制、偏 1234223 (12) 差及設定値的關係。 C p代表一過程的分佈1234223 (1) Description of the invention [Technical field to which the invention belongs] The present invention relates to a 'particularly' used to manufacture semiconductor wafers, and relates to a 'used to manufacture semiconductor wafers' which can easily achieve micro-distribution and high-speed dots Process and semen. [Prior art] For those skilled in the art, the dispenser device is used in the process of dispensing viscous solutions such as epoxy resin. It is used for mounting or integrated circuit (IC) electronic components on printed circuit boards (or applications). Underfilling process to flip chip, in which flip chip is packaged to protect it from external environment. At present, a high-speed wafer mounter that assembles 6500 or more per unit hour has been developed and commercial It is necessary to develop a good distribution device that can be applied to high-speed wafers. In particular, it is necessary to use a distributor as a semiconductor device device to dispense precisely and quickly with a desired amount so as to manufacture semiconductors. Wafer, reduce the proportion of defects. Then want a dispenser that quickly ejects the solution at a predetermined position within a tolerable error range, even when it is reused for a long time. 'Vacuum pressure or injection pressure through a pump has recently been proposed to Increase the discharge speed of the solution. Dispenser device Dispenser device is exactly discharged on the application system (such as wafer PCB), the sheet is coated and Multiple wafers are loaded into a modified surface mount epoxy solution for a surface mount assembler, which is considered by consumers and fixedly spaced. The process of power, -6-1234223 (2) With reference to the figure, it is explained that one of the main bodies 20 of a conventional dispenser device includes a motor and a chestnut 25, and a motor shaft 22 of a Lauda 2 1 drives the Screw 2 4. At this time, the epoxy resin is self-injected by pneumatic pressure, is fed to the pump 25 through the feeding line 26, and is discharged onto the substrate via the pump 27. The structure of the conventional dispenser device is such that the solution (E · P) fed between the screw pitches is discharged into the base by the needle 27 according to the rotation of the screw 24. Therefore, the screw 24 should be accurate. For example, due to the reaction of the solution pressure And the water of the screw is precisely controlled to feed the solution to it at a high speed; however, the disadvantage of the conventional dispenser device is that the unit of the screw 24 is precisely controlled, thus reducing the reliability. Many efforts have been made to avoid disadvantages. For example, the inventor's patent, Korean Patent Nos. 9 8-5 8 3 16 and 9 9-disclose a device for injecting silicone, and this device is configured for a resin coating machine. According to these patents, the solution is discharged onto the substrate using a rotating rod to control the discharge amount of the solution. However, the disadvantage of these conventional patents is that it is difficult to dispense quickly because the device operates with a large-scale and complicated driving mode. There is also the problem of accurate liquid dispensing because the solution discharge capability of the device does not cause problems with disassembly / assembly and cleaning of the device. A brief cross-sectional view, [25] is provided with the bolt of the end pin 24 of the horse container (S · L) 25, which is lowered by ground control to prevent the flat and vertical axis from being on the bottom. It is not sufficient to provide a device for the device. Please refer to this case No. 16687. The screw device with a through hole for manufacturing semiconductors has many inches and is based on a small amount of resin. In addition, -7-1234223 (3) this Other disadvantages of these conventional patents are that the discharge error rate of the device is localized 'because it is difficult to control the screw desirably, which reduces the reliability of the device' and 'the interchangeability of the device with its eight types of distributor devices The system is not good because it is difficult to accurately distribute the resin solution and desirably control the discharge amount of the resin solution depending on the viscosity of the resin solution. What's more, the disadvantage of these conventional patents is that it is difficult to quickly distribute resin solution to the substrate due to its complicated distribution and control process, where the liquid resin solution (epoxy resin) is controlled in parallel; in other words, the resin The flow channel of the solution is blocked by a rotating opening and closing rod or automatically inverted to dispense a predetermined amount of resin solution, and the blocked flow channel is reopened by separating the opening and closing rod from the flow channel to Move the resin solution. Therefore, the present inventor has proposed a dispenser device for manufacturing semiconductor wafers disclosed in Korean Patent No. 2002-49007 to overcome the above disadvantages, in which the dispenser device has a rather simplified structure and determines an accurate The resin solution is discharged, and the dispenser device is easy to clean due to the convenience of disassembly and assembly, and the interchangeability of this dispenser device with its eight types of dispenser devices is excellent. However, although it has been improved compared to conventional patents (Korean Patent Nos. 9 8-5 8 3 1 6 and 99-16687), the dispenser device of Korean Patent No. 2002-49007 still has a huge and complicated structure, Complex resin solution feeding and control processes, complex operating methods, and difficult disadvantages of accurately controlling this screw. (4) 1234223 [Summary of the Invention] Therefore, the present invention is made in view of the above disadvantages occurring in the conventional technology, and an object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which accurately discharges a The solution is controlled in small amounts during its discharge to maximize its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which implements a high-speed dotization process, and adjusts to minimize the error of the solution discharge amount, thereby maximizing its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which uses a servo motor directly connected to a screw to implement a high-speed dotization process and an end control process using a recoil control to control the solution axially. Flow to maximize its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which, due to its precise structure, prevents a huge load applied to the dispenser device during operation to minimize errors in its operation. Another object is to provide a distributor device for manufacturing a semiconductor wafer, which is easily disassembled and reassembled to facilitate cleaning and replacement of the screw that is convenient for its purpose, thereby maximizing the connection with other types of distributor devices. Interchangeability. Based on the present invention, these objects can be achieved by configuring a dispenser device for manufacturing a semiconductor wafer, the dispenser device including a main body; a shell portion connected to the injection container and detachably assembled with the main body; a screw, In the housing portion, a servo motor that is axially connected to itself is used to discharge a predetermined amount of the solution fed from the injection container via a -9- (5) 1234223 needle portion; and, a balance controller, and the axial direction of the screw Ground assembly to control the horizontal and vertical movement of the screw. [Embodiment] Referring now to the drawings, the same reference numerals are used in all different drawings to indicate the same or similar components. Fig. 2 is a perspective view of a dispenser device according to the present invention, Fig. 3 is an exploded perspective view of the dispenser device according to the present invention, and Fig. 4 is a sectional side view of the dispenser device according to the present invention. According to the present invention, there is provided a dispenser device that accurately discharges a viscous solution, such as epoxy resin, to meet the need for improved performance, including high-speed and precise operation of equipment for manufacturing semiconductor wafers, such as wafer mounting. In detail, the present invention provides a dispenser device for manufacturing a semiconductor wafer, which includes a main body 10 assembled with a mobile unit (not shown) including a robot arm unit, and a connecting pipe (S-1) and A viscous and easy-to-fill injection container (s · L) is provided, and the shell portion 20 is detachably assembled with the main body 10. The connecting shaft 3 3 is integrated with the lower bolt 3 1 accommodated in the housing portion 20, and the screw 30 has a collar 32 formed at a lower portion of the connecting shaft 33. The balance controller 40 is assembled axially with the upper part of the connecting shaft 33 to control the horizontal and vertical movement of the screw 30, and the needle member 60 is removably assembled with the lower part of the housing part 20. Furthermore, the servo motor 200 is mounted on the main body 10, and has a drive shaft 2 1 0 having a connecting shaft 3 3 connected to the screw 30 through a coupling member 丨 〇〇 to control the screw 30 Rotation. 1234223 (6) Referring to Figs. 2 and 4, the main body 10 is provided with an upper support portion n on an upper portion thereof, and a lower support portion 13 on a lower portion thereof. The lower support portion 13 is axially opposed and the upper support portion] 1, and the assembling grooves 14 are formed on the upper support portion n so that the upper support portion Π is formed in a shape. The servo motor 200 is inserted into the motor assembly inner diameter 12 formed in the upper support portion Π of the main body 10 to be firmly assembled with the main body 10 using a screw (B), and the housing portion 2o is formed by The positioning bolts 16 are fastened into either of the positioning bolt holes 15 formed on both lateral sides of the lower support portion 13 and inserted into an assembly groove 14 removably assembled with the lower support portion 13. At this time, the positioning grooves 25 are formed on both sides of the housing portion 20, so when the positioning bolt holes 15 are fastened, the positioning bolts 16 are inserted into the positioning grooves 25 through the positioning bolt holes 15, Thereby, the case portion 20 and the lower support portion 13 of the main body 10 are firmly assembled. Referring to FIGS. 8 and 9, a solution channel 2 1 having upper and lower enlarged stepped inner diameters 2 2, 2 3 is vertically formed in the shell portion 20, and the solution channel 2] and The solution outlet on the inner wall 2 3 a $ $ The ends of the connecting tube (S-1) of the gastric device (S · L) communicate vertically. At this time, the carbide tube 27 is inserted into the solution channel 21 to minimize the frictional sound due to the flow of the solution and the rotation of the lower bolt 31. The lower enlarged stepped inner diameter 2 3 is defined by the lower portion 24 of the external thread of the shell portion, and the head portion 6 3 of the needle 6 1 is received therein, and the needle 6 1 is secured by the external thread of the shell portion The needle cover 62 on the lower portion 24 is attached to the lower and enlarged stepped inner diameter as shown in FIG. 9. The collar 32 of the screw 30 is inserted into the enlarged enlarged inner diameter 22, and the upper and lower oil-free rings 3 5, 3 and 6 are mounted on the connecting shaft 3 3 on the collar 3 2-11-1234223 ( 7) The square and the lower position, and the ◦ ring 3 7 is installed so as to be in contact with the lower side of the lower oil-free ring 36, so that the solution outlet 2 3 a accommodates the lower bolt 31 in an airtight manner. Furthermore, the connection shaft 3 3 is connected to the drive shaft 2 1 0 and the joint structure 1 0 0 of the servo motor 2 Q 0 to be driven by the servo motor 2 0 0. The lower bolt 3 1 of the screw 30 includes a spiral pattern and a spiral groove 3 1 a. The spiral groove 3 1 a is rounded to move the solution smoothly, and the end of the bolt 3 1 forms a tapered and rounded tip such that The end of the bolt 31 is in contact with the V-shaped valve seat 64 formed on the head 63 of the needle 61 to block the needle 6 in a watertight manner.] Now returning to Figures 1 and 11, the bolt 31 can be determined by the bolt. The pitch size of 31 is used selectively, and when the viscosity of the solution or the use of the dispenser device is changed, a different screw 30 is used. Thereby, interchangeability with other types of dispenser devices is achieved. In other words, in the case of using a bolt with a narrow pitch, the amount of solution discharged from the needle is small, but the solution is accurately discharged from the needle. On the other hand, in the case of using a bolt with a wide pitch, the solution was discharged in a large amount, however, the solution was discharged from the needle inaccurately. Furthermore, the balance controller 40 functions to control the horizontal and vertical movement of the screw 30 to accurately discharge the solution. 3 to 5, the balance controller 40 is assembled axially with the upper part of the connecting shaft 33 of the screw 30, and includes a bearing housing part 4 assembled with the housing part 20 using the first screw (b). The bearing housing portion 41 is positioned between the upper and lower support portions 1 1 and 1 3 of the housing portion 20. In addition, a plurality of bearings 4 2, 4 and 3 are located in the bearing housing portion 41, and the outer joint preload cover 4 4 series-12-1234223 (8) is connected to the bearing housing portion 4 by the second screw (B). The upper side of 1 is assembled to press the outer engagement of the bearings 42, 43 downward. In addition, the inner joint preload nut 46 is fastened to the external thread portion 4 9 a of the adjusting bolt 4 5 which is fitted into the bearing 4 2, 4 3. Therefore, the inner joints of the bearings 4 2, 4 3 are firmly coupled to each other. . Furthermore, the height adjusting nut 47 is fastened to the external thread portion 49a of the adjustment bolt 45 so that the external thread portion 4 9a of the adjustment bolt 45 is fastened, and the collar 3 located on the screw 30 is pressed vertically. The upper side of 2 has no oil ring 35, and the spring adjusting bolt 48 is screwed into the internal thread portion 49b of the adjusting bolt 45. The spring 50 is located between the lower side of the spring adjusting bolt 48 and the upper side of the upper oil-free ring 35, so as to elastically press the upper adjustment lever by adjusting the spring adjusting bolt 48 that is engaged with the internal thread portion 49b of the adjusting bolt 45. Oil ring 3 5. Furthermore, preferably, each of the bearings 4 2, 4 3 includes an angular spherical bearing having an inner joint and an outer joint. 6a and 6b, the positioning bolt 47b is fastened to the internal diameter of the internal thread 4 7 a formed on the circumference of the height adjustment nut 4 7, and is fastened to the internal diameter of the internal thread 4 7 a without oil. The ring 35 is in contact with the lower side of the height adjustment nut 47. Therefore, the spring adjusting bolt 48 alternately compresses or relaxes the spring 50 to adjust the contact degree between the collar 32 of the screw 30 and the upper and lower oil-free rings 35, 36, as shown in FIG. The reference number 1 2 0 represents a connection bolt cap that connects the connection pipe (S-1) of the injection container to the solution outlet 2 3 a of the housing portion 20. In other words, the injection container (S · L) communicates with the solution channel 21 through the connection pipe (S4) and the solution outlet 2a of the shell 20, and the screw -13-1234223 (9) 3〇 is by servo The motor 2 0 is driven to rotate the bolt 3 1 in the solution passage 21, whereby the solution is dispensed from the solution passage 2 1 to a target such as a semiconductor wafer (not shown) via the needle 6 1 of the needle member 60. The discharge of the solution through the bolt 3 1 of the screw 30 is due to the shear force of the solution, so the area where the flow path of the solution is often required to be maintained under a fixed pressure (the pressure of the solution fed from the soil inlet device: about 0.5 bar to precisely distribute the solution. For this reason, in terms of pressure, it is necessary to precisely control the balance of the screw 30 that affects the surrounding solution. The present invention provides a balance controller 40 that precisely controls the balance of the screw 30. The balance of the screw 30 should be controlled. In order to prevent the recoil of the screw 30, it is not critical. When the viscosity of the solution is low and the load of the solution applied to the bolt 31 during the discharge of the solution is low. Therefore, the balance controller 40 of the present invention is applied to an example using a high viscosity solution, which increases the load on the bolt 31 during the discharge of the solution. The balance controller 40 of the present invention acts as a precise movement of the screw 30, the smallest change in the load applied to the bolt 31, and the dispenser device is easily disassembled and reassembled. In detail, the solution is tied to the screw 30 during the rotation period along the screw. 3 1 helical groove 3] a is fed from the injection container (S · L) to the needle 61. At this time, 'bolt 3] is rotated in the center of the solution channel 21 of the shell portion 20 and the load is applied to the bolt 3] The direction is relative to the discharge direction of the solution -14-1234223 (10). However, when the solution approaches the needle 6 1 of the needle member 60, the load on the bolt 3 1 increases undesirably because the narrowness of the needle 6 Diameter. Therefore, 'the adjustment bolt 4 5 needs to be tightened or loosened so that the height adjustment nut 4 7 of the adjustment bolt 4 5 contacts the upper surface of the oil-free ring 3 5 above the collar 3 2 of the screw 30, As a result, the screw 30 is not moved axially due to the load applied to the bolt 31, as shown in Figs. 6a and 6b. At this time, it is preferable that the height adjustment nut 4 7 is appropriately connected with the upper oil-free ring. 3 5 contact, which will not hinder the smooth rotation of the screw 30. In addition, several angular spherical bearings 4 2, 4 3 are located in the bearing housing portion 41 assembled with the main body 10, and the preload cover 44 is externally engaged. Is assembled with the bearing housing portion 41 by a screw (b), and the internally engaging preload nut 46 is tied to the external thread portion 49a of the adjustment bolt 45, Therefore, the axial movement of the screw 30 is precisely controlled. At this time, the height adjustment nut 47 acts to evenly distribute the force applied to the movement of the screw 30, and the spring 50 helps prevent the screw 30 The phenomenon of recoil. In other words, when the screw 30 is driven by the servo motor 2000, the upper and lower oil-free rings 3, 5, 6, and 5 are in contact with the upper and lower sides of the collar 32. The inner joints of the adjusting bolt 4 5, the spring adjusting bolt 4 8 and the angular spherical bearing 4 2, 4 3 rotate in association with the connecting shaft 3 3 to control the horizontal and vertical movement of the screw 30. In particular, the balance controller 40 of the present invention reduces the load on the bolt 31 due to the force between the screw 30 and the solution so that the screw 30 rotates smoothly because it is connected to the angular spherical bearings 4 2, 4 3 The height adjustment nut 4 7 rotates 1234223 (11) while supporting the screw 3 0's dependent load. Furthermore, the spring adjusting bolt 4 8 screwed into the internal thread portion 4 9 b of the adjusting bolt 4 5 is raised or lowered by tightening or loosening itself. Therefore, the spring 5 0 is pushed or released to control the upper and lower parts. The degree of contact between the oil-free rings 3 5, 3 6 and the collar 32 of the screw 30, to avoid disadvantages due to the load of the solution applied to the bolt 31, as shown in FIG. Hereinafter, the process capability index of the dispenser device according to the present invention will be described in more detail. A primary purpose in the statistical quality control of a process is to manage the process stably. Furthermore, it is important to control the process desirably so that the products of the process meet the prerequisites of a predetermined standard. Therefore, it is necessary to evaluate the quality change of the product in the product development and manufacturing steps, and implement a process capability analysis. The difference between the measurement and setting of the product is checked using various statistical methods to reduce Product quality changes. This process capability, which includes the idea of natural tolerance (6 σ), means the ability to measure a process of a product of desired quality when the process is in a steady state under certain conditions. At this time, the process capability index is used to quantitatively represent the process capability. This process capability index is defined as the ratio of the allowable process range to the natural tolerance (6 σ), which means an index that evaluates whether the capability of measuring a product of desired quality through a certain process is sufficient, and is classified into a number type The process capability index, such as C p, C pk, and C pm, is based on the relationship with the specification limit, partial 1234223 (12) difference, and set 値. C p represents the distribution of a process

Cp係界定爲可容許過程範圍(部份公差)對實際過 程範圍(自然公差)的定量比,如同公式1 : 公式]Cp is defined as the quantitative ratio of the allowable process range (partial tolerance) to the actual process range (natural tolerance), as in Equation 1:

c _ 可容許過程範圍 p—一Ϊ際過程範圍 USL-LSL ~ ~~~6〇 USL-LSL ~ Wr 其中U S L =上規格界限 LSL =下規格界限 NT=自然公差 從以上公式中,可看到,過程能力指數c P依據上規 格界線及下規格界限而變化。 詳細地說,當C p = 1 · 〇時,可允許過程範圍係相同如 實際過程範圍於一過程中,且,自此過程製造的產品的品 質分佈顯示一穩定的正常分佈。此時’理論上,偏離自規 格界限之部份係〇 . 2 3 %。然而,實際上’因爲裝置的磨損 及爆裂,這是難以經常地確保一想要品質的產品’因此, 較佳地,C p係1 . 3 3或更大。此時’自規格界限的偏離部 係 0·00 7 % 。c _ Permissible process range p—intermediate process range USL-LSL ~ ~~~ 6 USL-LSL ~ Wr where USL = upper specification limit LSL = lower specification limit NT = natural tolerance The process capability index c P changes according to the upper and lower specification boundaries. In detail, when C p = 1 · 〇, the allowable process range is the same as the actual process range in a process, and the quality distribution of products manufactured since this process shows a stable normal distribution. At this point, 'theoretically, the part deviating from the self-defined limit is 0.23%. However, in fact, 'it is difficult to ensure a product of desired quality often due to wear and tear of the device'. Therefore, preferably, C p is 1.3 or more. At this time, the deviation from the specification limit is 0.007%.

Cpk代表一過程平均 另一類型的過程能力指數Cpk係提議來給予關於過程 1234223 (13) 平均距一規格界限平均的偏差的答案,且,如果上規格界 限及下規格界限的平均係由m所指定,m係界定如公式2 公式2 m 二(U S L + L S L ) /2 再者’代表過程平均距規格界限平均的偏差之偏差度 (k )係界定如公式3 : 公式3 k= ( ni- // ) / ( USL-LSL/2 ) 其中’ V係一排出溶液的預設値,因此,Cpk係相同 如(1 - k ) Cp,亦即,Cpk= ( 1 - k ) Cp。 於僅使用上規格界限的例子中,過程能力指數Cpk二 (USL- μ /3 δ )。另一方面,於僅使用下規格界限的例子 中,過程能力指數C p k = ( // - L S L ) / 3。 本發明的較佳瞭解可依據提出解說的以下實例而獲得 ’然而,不會解釋來限制本發明。 使用關於過程能力指數之以上公式,依據本發明之分 配器裝置的過程能力指數係評估如將於一實例中所述的。 實例 於用以製造半導體晶片的未充滿過程中,具有 3〇〇〇〇Cps的黏度之溶液(環氧液)係以1〇_的量排出至 諸如基底的標的上5 〇次,其使用依據本發明之分配器頭 ’以評估分配器裝置的過程能力指數Cpk。結果係如下。 -18 - (14)!234223 10mg Cpk 測試 10.50Cpk represents a process average and another type of process capability index. Cpk is proposed to give the answer to the process 1234223 (13) The average deviation from the average of a specification limit, and if the average of the upper and lower specification limits is given by m Specify that m is defined as Equation 2 Equation 2 m 2 (USL + LSL) / 2 Furthermore, the deviation degree (k) representing the deviation of the process average from the specification limit average is defined as Equation 3: k = (ni- //) / (USL-LSL / 2) where 'V is a preset 値 of the discharged solution. Therefore, Cpk is the same as (1-k) Cp, that is, Cpk = (1-k) Cp. In the case where only the upper specification limit is used, the process capability index Cpk is two (USL-μ / 3/3). On the other hand, in the example using only the lower specification limit, the process capability index C p k = (//-L S L) / 3. A better understanding of the present invention can be obtained based on the following examples of explanations; however, the present invention is not limited by the explanation. Using the above formula regarding the process capability index, the process capability index of the dispenser device according to the present invention is evaluated as will be described in an example. Example In the unfilled process used to manufacture semiconductor wafers, a solution (epoxy solution) with a viscosity of 3,000 Cps was discharged to an object, such as a substrate, 50 times in an amount of 10_, and the basis for its use The dispenser head of the present invention is used to evaluate the process capability index Cpk of the dispenser device. The results are as follows. -18-(14)! 234223 10mg Cpk test 10.50

魏 從以上圖形的結果,可看到,最大排出量係〗〇 .丨3 ., 最小排出量係9.9 6,排出量的範圍係〇 . 2 7,平均排出量 係1 〇 . 〇 3 ’以及’排出量的運算平均分佈(標準)係〇 .〇 5 〇 更者’貫際過程範圍(Cpk USL)係〇.〇3,可容許過 程範圍(Cpk LSL)係3.45,以及,過程能力指數Cpk係 3.03。 如果基於1 〇mg的排出量,分配器裝置的過程能力指 數C p k係1 .3 3或更大,這被視爲優良的。因此,本發明 的分配器裝置具有比習知分配器裝置高2 3倍的過程能力 指數,因此視爲優良的。 如上述’用以製造依據本發明的半導體晶片之分配器 裝置的有利點在於一高黏度溶液係精確地排出,且,一想 要的溶液量係於一高速點化過程期間使用一平衡控制器而 精確地排出’藉此,延長分配器裝置的使用年限並擴大分 配器裝置的用途。 分配器裝置的其它利益爲,施加至分配器裝置之巨大 負載係有效地防止以最小化分配器裝置的操作失誤,分配 益裝置具有一精密結構,這是方便地來分解並重組以及淸 -19 - 1234223 (15) 潔分配器裝置,且,構成此分配器裝置的螺桿可依據其用 途而容易地更換,藉此,合意地確保與其它類型的分配器 裝置的互換性。 本發明已經以解說方式而說明,且,將瞭解到,所使 - 用的用辭預期爲說明的性質而不是限制。本發明的許多修 改及變化係可能的,依據以上教導。因此,將暸解到,於 附加請求項的範圍內,除了特定說明之外,本發明可以不 同方式而實施。 【圖式簡單說明】 自以下的詳細說明以及附圖,將更淸楚地瞭解到本發 明的以上及其它目的、特性及優點,其中: 圖1係一習知分配泵的簡要截面圖; 圖2係依據本發明之分配器裝置的立體圖; 圖3係依據本發明之分配器裝置的分解立體圖; 圖4係依據本發明之分配器裝置的截面側視圖; 圖5係構成依據本發明之分配器裝置之平衡控制器的 ® 分解立體圖; 圖6 a及6 b係依據本發明之平衡控制器的部份放大截 面圖’其中圖6 a解說在軸向調整一螺桿的高度之前的平 衡控制器,以及圖6 b解說在軸向調整此螺桿的高度後之 平衡控制器; 圖7係本發明的平衡控制器的部份放大截面圖,其中 一彈簧係鬆弛的; - 20 - 1234223 (16) 圖8係與一殼部組裝的針構件的放大圖,此殼部構成 依據本發明之分配器裝置; 圖9係圖8的部份F的放大圖; 圖]〇及]1係分別地解說具有不同尺寸的螺距之本發 明的螺桿。 主要元件對照表 S · L 注 入 容 器 B 螺 桿 S- 1 連 接 管 10 主 體 11 上 支 撐 部 12 馬 達 組 裝 內 徑 13 下 支 撐 部 14 組 裝 槽 15 定 位 螺 栓 孔 16 定 位 螺 栓 20 殼 部 2 1 溶 液 通 道 22 上 擴 大 階 式 內 徑 23 下 擴 大 階 式 丨八」 徑 23 a 溶 液 出 □ 24 外 螺 紋 下 部 25 定 位 槽From the results of the above graph, Wei can see that the maximum discharge is 〖〇. 丨 3., the minimum discharge is 9.9 6, the range of the discharge is 0.27, and the average discharge is 1 〇03. And 'The calculated average distribution (standard) of the discharge volume is 0.05. 0 more.' The interim process range (Cpk USL) is 0.03, the allowable process range (Cpk LSL) is 3.45, and the process capability index Cpk. Department 3.03. It is considered excellent if the process capability index C p k of the dispenser device is 1.3 or more based on the discharge amount of 10 mg. Therefore, the dispenser device of the present invention has a process capability index which is 23 to 3 times higher than that of the conventional dispenser device, and is therefore considered to be excellent. As described above, the dispenser device for manufacturing a semiconductor wafer according to the present invention is advantageous in that a high-viscosity solution is accurately discharged, and a desired solution amount is used during a high-speed dotization process using an equilibrium controller. Exhaust accurately, thereby extending the useful life of the dispenser device and expanding the use of the dispenser device. Another advantage of the distributor device is that the huge load applied to the distributor device effectively prevents the operation errors of the distributor device to be minimized. The distributor device has a precise structure, which is convenient to disassemble and reassemble and 淸 -19 -1234223 (15) Clean the dispenser device, and the screw constituting this dispenser device can be easily replaced according to its purpose, thereby ensuring the interchangeability with other types of dispenser devices. The invention has been described by way of illustration, and it will be understood that the terminology used is intended to be illustrative rather than restrictive. Many modifications and variations of the present invention are possible, based on the above teachings. Therefore, it will be understood that, within the scope of the additional claims, the present invention may be implemented in different ways except for the specific description. [Brief description of the drawings] The above and other objects, features, and advantages of the present invention will be more clearly understood from the following detailed description and accompanying drawings, in which: FIG. 1 is a schematic cross-sectional view of a conventional distribution pump; 2 is a perspective view of the dispenser device according to the present invention; FIG. 3 is an exploded perspective view of the dispenser device according to the present invention; FIG. 4 is a cross-sectional side view of the dispenser device according to the present invention; An exploded perspective view of the balance controller of the actuator device; Figs. 6a and 6b are partial enlarged sectional views of the balance controller according to the present invention, wherein Fig. 6a illustrates the balance controller before axially adjusting the height of a screw And Figure 6b illustrates the balance controller after adjusting the height of the screw in the axial direction; Figure 7 is a partial enlarged sectional view of the balance controller of the present invention, in which a spring is loose;-20-1234223 (16) Fig. 8 is an enlarged view of a needle member assembled with a shell part, which constitutes a dispenser device according to the present invention; Fig. 9 is an enlarged view of part F of Fig. 8; Figs. 0 and] 1 are explained separately Have different The pitch of the present inventions inch screw. Comparison table of main components S · L Injection container B Screw S- 1 Connection tube 10 Main body 11 Upper support 12 Motor assembly inner diameter 13 Lower support 14 Assembly groove 15 Positioning bolt hole 16 Positioning bolt 20 Shell 2 1 Solution channel 22 Enlarged stepped inner diameter 23 Under enlarged stepped 丨 eight "diameter 23 a solution outlet □ 24 external thread lower 25 positioning groove

-21 - 1234223 (17) 2 7 碳 化 物 管 3 0 螺 桿 3 1 下 螺 栓 3 1a 螺 旋 槽 3 2 軸 環 ο η J J 連 接 軸 3 5 上 姐 y ϊ 油 環 3 6 下 無 油 環 3 7 〇 形 環 40 平 衡 控 制 器 4 1 軸 承 殼 部 4‘2、4 3 軸 承 44 外 接 合 預 載 芸 .rm. 45 三田 整 螺 栓 46 內 接 合 預 載 螺帽 47b 定 位 螺 栓 47 局 度 調 整 螺 帽 4 7a 內 螺 紋 內 徑 48 彈 簧 調 整 螺 栓 49a 外 螺 紋 部 49b 內 螺 紋 部 50 彈 簧 60 針 構 件 6 ] 針-21-1234223 (17) 2 7 Carbide tube 3 0 Screw 3 1 Lower bolt 3 1a Spiral groove 3 2 Shaft ο η JJ connecting shaft 3 5 Upper sister ϊ Oil ring 3 6 No oil ring 3 7 〇 Ring 40 Balance controller 4 1 Bearing shell 4'2, 4 3 Bearing 44 Outer joint preload Yun. Rm. 45 Mita whole bolt 46 Inner joint preload nut 47b Locating bolt 47 Local adjustment nut 4 7a Internal thread Inner diameter 48 Spring adjusting bolt 49a Externally threaded portion 49b Internally threaded portion 50 Spring 60 Needle member 6] Needle

-22 - (18)1234223 62 針 芸 .ΠΤΧ 63 頭 部 64 V 形 閥 座 1 00 聯 結 構 件 120 連 接 螺 栓蓋 200 伺 服 馬 達 2 10 驅 動 軸-22-(18) 1234223 62-pin yun.ΠΤ63 head 64 V-shaped valve seat 1 00 connection structure 120 connection screw cap 200 servo motor 2 10 drive shaft

-23--twenty three-

Claims (1)

(2) 1234223 --彈簧調整螺栓,拴緊在調整螺 一彈簧’位在彈簧調整螺栓的下 之間’以藉由與調整螺栓的內螺紋部 白整而谷易地壓~]、上無油環。 2.如申請專利範圍第1項之分 軸承係包含內接合及外接合之角球形 3 .如申請專利範圍第1項之分 有上及下放大階式內徑之溶液通道係 部中,且經由形成在殼部的內壁上之 器的連接管垂直地相通,下擴大階式 外螺紋下部並容納針的頭部於其中, 殼部的外螺紋下部之針蓋而安裝至下 4 .如申請專利範圍第3項之分 化物管係插入溶液通道中。 5 ·如申請專利範圍第3項之分 的軸環係插入上擴大階式內徑,且上 的上方及下方的位置裝在連接軸上, 無油環的下側接觸,使得溶液通道氣 ’連接軸係藉由聯結構件連接至伺服 6 .如申請專利範圍第5項之分配 下螺栓包含螺旋紋及螺旋槽,螺旋槽 動一溶液,且,下螺栓的末端形成一 使彳守下螺栓的末端來與形成於針構件 觸以水密性地阻擋針構件。 栓的內螺紋部;及 側及上無油環的上側 嚙合之彈簧調整螺栓 配器裝置,其中每一 軸承。 配器裝置,其中一具 垂直地形成於整個殼 溶液出口而與注入容 內徑係界定於殼部的 以及,針係藉由拴在 擴大階式內徑。 配器裝置,其中一碳 配器裝置,其中螺桿 及下無袖環係在軸環 〇形環係安裝來與下 密地容納下螺栓,且 馬達的驅動軸。 器裝置,其中螺桿的 被削圓以使平順地移 錐形且削圓的尖端, 的頭部之V形閥座接(2) 1234223-Spring adjusting bolt, fasten the adjusting screw to a spring 'located between the lower part of the spring adjusting bolt' so that it can be easily pressed by the white thread with the internal thread of the adjusting bolt ~], Shang Wu Oil ring. 2. If the sub-bearing of item 1 in the scope of the patent application includes angular spheres with inner and outer joints 3. If the sub-item of the scope of patent application in item 1 has upper and lower magnification stepped inner diameters in the solution channel system portion, and Via the connecting tube of the device formed on the inner wall of the shell, it communicates vertically. The lower part of the stepped external thread is enlarged and the head of the needle is accommodated therein. The needle cover of the lower part of the external thread of the shell is installed to the lower part. The split tube of item 3 of the patent application is inserted into the solution channel. 5 · If the collar of the third item of the scope of the patent application is inserted into the enlarged stepped inner diameter, and the upper and lower positions are mounted on the connecting shaft, the lower side of the oil-free ring contacts, so that the solution channel gas The connecting shaft is connected to the servo 6 by a joint structure. For example, the lower bolt of the patent application scope includes a spiral pattern and a spiral groove, and the spiral groove moves a solution, and the end of the lower bolt forms a bolt to guard the lower bolt. The end of the contact with the needle member is formed to block the needle member in a watertight manner. The internal thread of the bolt; and the spring adjustment bolts on the side and on the upper side without the oil ring, the adapter device, each bearing. Dispenser device, one of which is formed perpendicularly to the entire solution outlet of the shell and the inner diameter of the injection volume is defined in the shell part, and the needle is expanded by stepped inner diameter by tethering. Distributor device, one of which is a carbon distributor device, in which the screw and the lower sleeveless ring are attached to the collar o-ring system to tightly accommodate the lower bolt and the drive shaft of the motor. Device, in which the screw is rounded to smoothly move the tapered and rounded tip, the V-shaped valve seat of the head is connected
TW92104830A 2002-12-30 2003-03-06 Dispenser device for fabricating semiconductor chips TWI234223B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20020087069A KR100463685B1 (en) 2002-12-30 2002-12-30 Dispenser device for semi-conductor chip manufacture

Publications (2)

Publication Number Publication Date
TW200411805A TW200411805A (en) 2004-07-01
TWI234223B true TWI234223B (en) 2005-06-11

Family

ID=36592774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92104830A TWI234223B (en) 2002-12-30 2003-03-06 Dispenser device for fabricating semiconductor chips

Country Status (2)

Country Link
KR (1) KR100463685B1 (en)
TW (1) TWI234223B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130030666A (en) 2011-09-19 2013-03-27 삼성디스플레이 주식회사 An liquid crystal display device and the manufacturing method thereof
KR102119940B1 (en) * 2018-04-09 2020-06-08 주식회사 프로텍 Wafer Level Dispenser
US10867818B2 (en) 2018-04-09 2020-12-15 Protec Co., Ltd. Wafer level dispenser

Also Published As

Publication number Publication date
KR20040060299A (en) 2004-07-06
KR100463685B1 (en) 2004-12-30
TW200411805A (en) 2004-07-01

Similar Documents

Publication Publication Date Title
KR101728090B1 (en) Magnetic drive for dispensing apparatus
US20060193969A1 (en) Method and apparatus for streaming a viscous material on a substrate
US9016598B2 (en) Nozzle rotation mechanism and application device therewith
US5002008A (en) Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
US7980197B2 (en) Method and apparatus for dispensing a viscous material on a substrate
US5957343A (en) Controllable liquid dispensing device
US6234358B1 (en) Floating head liquid dispenser with quick release auger cartridge
US7934665B2 (en) Ultrasonic spray coating system
US7975938B2 (en) Coating system
JPH0418941B2 (en)
JP2007144422A (en) Multipoint distribution control system
JPH03170817A (en) Programmable type volume distributing apparatus and method of the same
US5931355A (en) Disposable rotary microvalve
TWI234223B (en) Dispenser device for fabricating semiconductor chips
US7150791B2 (en) Floating head liquid dispenser with dispensing head sensor
JP5278843B2 (en) Coating apparatus and coating method using the same
US6932280B2 (en) Adjustable needle foot for dispensing system
KR100578693B1 (en) Resin dispensing apparatus
JP2017527436A (en) Valve seat for dispenser
CN100521079C (en) Material supplying device and method
US6451114B1 (en) Apparatus for application of chemical process to a workpiece
KR200385695Y1 (en) Resin dispensing apparatus
WO2004087336A9 (en) Ultrasonic spray coating system
KR200307632Y1 (en) Dispenser device for semi-conductor chip manufacture
JPH0733907Y2 (en) Dispenser for small amount of liquid discharge

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent