200411805 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種用以製造半導體晶片之分配器裝置 ’特別地，係關於一種用以製造半導體晶片之分配器裝置 ’其容易地達到微分配及高速點化過程，且精確地排出溶 液。 【先前技術】 · 如熟習此項技藝者而言，分配器裝置在商業上係應用 至分配諸如環氧樹脂的黏性溶液的過程，爲裝配諸如晶片 或積體電路（1C )的電子組件在印刷電路板（PCB )上， 或應用至倒裝晶片的未充滿過程，其中倒裝晶片被塗覆並 封裝以保護其免受外部環境的影響。 目前，一種每單位小時裝配 05000或更多個晶片入 ‘200411805 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a dispenser device for manufacturing semiconductor wafers, and in particular, to a dispenser device for manufacturing semiconductor wafers, which easily achieves Micro-dispensing and high-speed spotting process, and the solution is accurately discharged. [Prior art] · For those skilled in the art, dispenser devices are commercially applied to the process of dispensing viscous solutions such as epoxy resin. For assembling electronic components such as wafers or integrated circuits (1C), An underfill process on a printed circuit board (PCB), or applied to a flip chip, where the flip chip is coated and packaged to protect it from the external environment. Currently, there is a method of assembling 05,000 or more wafers per unit hour into ‘
PCB上之高速晶片裝配器已被發展且商業化成爲一表面裝 配裝置，因此保留有發展能夠應用至高速晶片裝配器的改 I 良分配器之需要。 尤其’這是必要的，使用作爲半導體裝置的表面裝配 裝置之分配器以一想要量之精確且快速地分配環氧溶液， 以使當製造半導體晶片時，減少瑕疵比例。再者，消費者 想要於一可容許誤差範圍內在一預定位置快速且固定地排 出溶液之分配器，甚至當其重複使用達一長時間時。更者 ，最近已建議經由一泵使用真空壓力或注入壓力之過程， 以增加溶液的排出速度。 -6 - (2) 200411805 參考圖1，解說一習知的分配器裝置的 其中一主體20包含馬達21及泵25，且，劳 達2 ]的馬達軸2 2驅動之螺桿2 4。 此時，環氧樹脂係藉由氣動壓力自注入 經由饋送線26饋送至泵2 5，而經由位在泵 27排出至基底上。 習知分配器裝置結構係以使饋送於螺桿 螺距間的溶液（E · P )依據螺桿24的旋轉 由針27排入基底，因此，螺桿24應被精確 例如，由於溶液壓力的反衝，且，螺桿的水 被精確地控制以在一高速而精確饋送溶液至 然而，習知分配器裝置的不利點在於， 精確控制螺桿24的單元，因此，降低了分 靠性。 許多努力已被進行以避免不利點。例如 發明人的專利，韓國專利第9 8 - 5 8 3 1 6及9 9 揭示用以注入矽酮的裝置，此裝置構成用以 樹脂塗覆機。依據此些專利，溶液係使用具 轉桿而排出基底上，以控制溶液的排出量。 然而，此些習知專利的不利點在於，此 快速地分配的困難，因爲此裝置具有一大尺 複雜的驅動方式而操作的。亦具有精確分配 液的問題，因爲此裝置的溶液排出能力係不 引起分解/組裝及淸潔此裝置的問題。 簡要截面圖， [2 5設有由馬 容器（S · L ) 2 5的端之針 24的螺栓的 而下降，以經 地控制以防止 平及垂直軸應 基底上。 其設有不足以 配器裝置的可 ，可參考本案 •1 6 68 7 號，其 製造半導體的 有一通孔的旋 裝置具有許多 寸且係依據一 微量的樹脂溶 佳的；另外， -7- (3) (3)200411805 此些習知專利的其它不利點在於，此裝置的排出誤差 率係高的，因爲其難以合意地控制此螺桿，其使裝置的可 靠性降低，以及，裝置與其八類型的分配器裝置的互換性 係不佳的，因爲其難以依據樹脂溶液的黏度，精確地分配 樹脂溶液並合意地控制樹脂溶液的排出量。 更者，此些習知專利的不利點在於，由於其複雜的分 配及控制過程，其難以快速地分配樹脂溶液至基底上，其 中液體樹脂溶液（環氧樹脂）係並行地控制；換言之，樹 脂溶液的流動通道係藉由旋轉之開啓及關閉桿或自動倒轉 以分配一預定量的樹脂溶液而阻塞，且，阻塞的流動通道 係藉著使此開啓及關閉桿與流動通道分離而重新開啓以移 動樹脂溶液。 因此，本發明人已建議揭示於韓國專利第 2 0 0249007號之用以製造半導體片的分配器裝置，以克 服以上的不利點，其中分配器裝置具有一相當簡化的結構 ，且確定一精確的樹脂溶液排放，由於分解及組裝的方便 性之分配器裝置的容易淸潔，以及，此分配器裝置與其八 類型的分配器裝置的極佳互換性。 然而，雖然相較於習知專利（韓國專利第 9 8 - 5 8 3 1 6 及99-16687號）已有改善，韓國專利第2002-49007號的 分配器裝置仍具有巨大且複雜的結構、複雜的樹脂溶液饋 送及控制過程、複雜的操作方法及精確地控制此螺桿的困 難的不利點。 (4) (4)200411805 【發明內容】 因此’本發明係針對發生於習知技術的以上不利點而 製作’且’本發明的目的在於提供一種用以製造半導體晶 片之分配器裝置，其精確地排出一溶液且於溶液的排出期 間微量地控制此溶液，以最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置，其實施一高速點化過程，且，調整來最小 化溶液排出量的誤差，藉此最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置，其利用直接連接至一螺桿以實施高速點化 過程及使用一反衝控制的結束控制過程之伺服馬達以軸向 地控制溶液流動，藉此最大化其可靠性。 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置，由於其精密結構，其於操作期間最大地防 止施加至分配器裝置的巨大負載，以最小化其操作的失誤 〇 本發明的其它目的在於提供一種用以製造半導體晶片 之分配器裝置，其係容易地分解及重組以使方便地淸潔依 據其用途而方便地更換之螺桿，藉此最大化與其它類型的 分配器裝置的互換性。 基於本發明，此些目的可藉配置一種用以製造半導體 晶片之分配器裝置而達成，該分配器裝置包含一主體；一 殻部，連接至注入容器且可拆卸地與主體組裝；一螺桿， 位於殼部中，使用軸向地連接至其本身的伺服馬達經由一 -9- (5) (5)200411805 針部以預定量排出饋送自注入容器的溶液；及，一平衡控 制器，與螺桿軸向地組裝以控制螺桿的水平及垂直移動。 【實施方式】 現參考圖式，其中相同參考號碼係使用於所有的不同 圖式中以標示相同或相似的組件。 圖2係依據本發明之分配器裝置的立體圖，圖3係依 據本發明之分配器裝置的分解立體圖，以及，圖4係依據 本發明之分配器裝置的截面側視圖。 依據本發明，提供一種分配器裝置，其精確地排出一 黏性溶液，例如，環氧樹脂，以滿足改善性能的需要，包 括用以製造半導體晶片的設備的高速且精確操作，諸如晶 片安裝。 詳細的說，本發明提供一種用以製造半導體晶片之分 配器裝置，其包含與包括一機械臂單元的移動單元（未顯 示）組裝之主體10、及經由一連接管（S - 1)與裝有黏 性溶易的注入容器（S · L )相通且可拆卸地與主體1 0組 裝之殻部2 0。連接軸3 3係與容納於殼部2 0的下螺栓3 1 整合，且，螺桿3 0具有形成在連接軸3 3的下部之軸環 3 2。平衡控制器40係與連接軸3 3的上部軸向地組裝以控 制螺桿3 0的水平與垂直移動，且，針狀構件6 0係與殻部 20的下部可拆卸地組裝。再者，伺服馬達2〇〇係安裝在 主體I 〇上，且，具有藉由聯結構件1 〇〇而連接至螺桿3 0 的連接軸3 3之驅動軸2 1 0，以控制螺桿3 0的旋轉。 -10- (6) (6)200411805 參考圖2與圖4，主體1 〇係設有上支撐部丨1在其上 部，及下支撐部1 3在其下部。下支撐部1 3係軸向地相對 且上支撐部1 1，且，組裝槽14係形成在上支撐部1 1上 ，以使上支撐部1 1形成一、[/形狀。伺服馬達2 0 0係插 入形成在主體1 0的上支撐部1 1之馬達組裝內徑1 2中， 以使用螺桿（B )而與主體1 〇堅固地組裝，且，殻部20 係藉由將定位螺栓1 6检緊入形成在下支撐部1 3的兩橫向 側上之定位螺栓孔1 5任一者中而插入與下支撐部1 3可拆 卸地組裝之組裝槽1 4。在此時，定位槽2 5係形成在殻部 2 〇的兩側上，因此，當拴緊入定位螺栓孔1 5時，定位螺 栓1 6係經由定位螺栓孔1 5而插入定位槽2 5，藉此，使 殼部2 0與主體1 〇的下支撐部1 3堅固地組裝。 參考圖8及9，具有上及下放大的階式內徑22、23 之丨谷液通道2 1係垂直形成於殼部2 0中，且，溶液通道 21與經由形成在殼部20的內壁上之溶液出口 23之注入 谷益（S· L)的連接管（S-1)的端垂直地相通。 在此時，碳化物管27係插入溶液通道2 1以最小化由 於溶液的流動及下螺栓3 1的旋轉之摩擦聲。 下放大的階式內徑23係界定於殻部的外螺紋下部24 ’且’接收針6 1的頭部63於其內，以及，針6 1係藉由 检固在殼部的外螺紋下部24上之針蓋62而安裝至下放大 的階式內徑，如圖9所示。 螺桿3 0的軸環3 2係插入上放大的階式內徑2 2，其 中上及下無油環3 5、3 6係裝在連接軸3 3上於軸環3 2的 -11 - (7) (7)200411805 上方及下方的位置，且，0形環3 7係安裝以致使與下無 油1¾ ：> 6的下側接觸’使得溶液出口 2 3氣密性地容納下螺 栓3 1。再者，連接軸3 3係連接至伺服馬達2〇〇的驅動軸 2 ] 〇及聯結構件1 00，以藉伺服馬達200而被驅動。 螺桿3 0的下螺栓3 1包含螺旋紋及螺旋槽3〗a，螺旋 槽3 1 a被削圓以平順地移動溶液，且，螺栓3 I的末端形 成一錐形且削圓的尖端’使得螺栓3 1的末端與形成於針 6 1的頭部6 3之V形閥座64接觸，以水密性地阻擋針6 ! 〇 現在回到圖1 0及1 1中，螺栓3 1可依據螺栓3 1的螺 距尺寸而選擇地使用，且，當溶液的黏度或分配器裝置的 使用被改變時，不同的螺桿3 0被使用。藉此，達到與其 它類型的分配器裝置之互換性。 換言之，於使用窄螺距的螺栓的例子中，自針排出的 溶液量係小的，然而，溶液係自針而精確地排出。另一方 面，於使用寬螺距的螺栓的例子中，溶液係大量地排出， 然而，此溶液係自針而不精確地排出。 再者，平衡控制器40作用來控制螺桿3 〇的水平及垂 直移動，以精確地排出溶液。 參考圖3至5，平衡控制器40係與螺桿3 0的連接軸 3 3的上部軸向地組裝，且，包含使用第一螺桿（b )而與 殻部2 〇組裝之軸承殼部4 1，以使軸承殻部4 1係定位在 殼部2〇的上與下支撐部1 1、1 3之間。再者，數個軸承 42、43係位於軸承殼部4 1中，且，外接合預載蓋44係 -12- (8) (8)200411805 藉由第二螺桿（B )與軸承殼部4 1的上側組裝以向下壓迫 軸承4 2、4 3的外接合。再者，內接合預載螺帽4 6係控在 裝入軸承42、43之調整螺栓45的外螺紋部49a，因此， 使軸承42、43的內接合堅固地相互結合。更者，高度調 整螺帽4 7係拴在調整螺栓4 5的外螺紋部4 9 a以致使拴緊 在調整螺栓45的外螺紋部49a，而垂直地壓迫位在螺桿 3 〇的軸環3 2的上側上之上無油環3 5，且，彈簧調整螺栓 4 8係旋入調整螺栓4 5的內螺紋部4 9 b。彈簧5 0係位在彈 簧調整螺栓4 8的下側與上無油環3 5的上側之間，以藉與 調整螺栓45的內螺紋部49b嚙合之彈簧調整螺栓48的調 整而彈性地壓迫上無油環3 5。 更者，較佳地，軸承4 2、4 3的每一者係包含內接合 與外接合之角球形軸承。 參考圖6a及6b，定位螺栓47b係拴入形成在高度調 整螺帽4 7的圓周上之內螺紋內徑4 7a，且，係拴緊入內 螺紋內徑47a，同時上無油環35與高度調整螺帽47的下 側接觸。 因此，彈簧調整螺栓4 8交替地壓縮或鬆驰彈簧5 0以 調整螺桿3 0的軸環3 2與上及下無油環3 5、3 6間之接觸 程度，如圖7所示。 參考號碼12〇代表將注入容器的連接管（S-1)連接 至殻部2 0的溶液出口 2 3之連接螺栓蓋。 換S之，注入容器（s· L)經由連接管（S-1)及殻 部2〇的溶液出口 23而與溶液通道21相通，且，螺桿3〇 -13- 200411805 Ο) 係藉伺服馬達2 0 0而驅動以旋轉溶液通道2 ：[中之螺栓3 J ，藉此，經由針狀構件6 0的針6 1自溶液通道2 1分配溶 液至α者如半導體晶片（未顯不）之標的上。 溶液藉由螺桿3 0的螺栓3 1的排出係由於此溶液的剪 力，因此，需要時常保持溶液的流動路徑的區域在固定壓 力下（自注入容器饋送溶液的壓力：約〇 . 5 b ar，以精確地 分配溶液。 爲此理由，就壓力而論，需要精確地控制影響到其周 圍溶液之螺桿3 0的平衡。 本發明提供精確地控制螺桿3 0的平衡之平衡控制器 4 0 〇 螺桿3 0的平衡應被控制，爲了防止螺桿3 〇的反衝線 象’然而不是關鍵性的，當溶液的黏度係低以及於排出此 溶液期間施加至螺栓3 1之溶液的負載係低時。 因此’本發明的平衡控制器40係施加至使用高黏度 溶液的例子中，其增加對螺栓3〗的負載於溶液的排出期 間。 本發明的平衡控制器4 0作用如精確地移動螺桿3 0， 最小的施加至螺栓3 1之負載的變化，以及，方便地分解 並重組分配器裝置。 詳細地’溶液係於螺桿3 〇的旋轉期沿著螺栓3 1的螺 旋槽3 1 a自注入容器（s · L )饋送至針6 1。 此時’螺栓3 1旋轉在殻部2 〇的溶液通道2 1的中央 ’且，施加至螺栓3 1之負載的方向係相對溶液的排出方 -14- (10) (10)200411805 向。 然而，當溶液接近針狀構件6 0的針6 1時，針對螺栓 3 1之負載係不想要地增加，因爲針6 1的窄直徑。 因此’需要拴緊或鬆開調整螺栓4 5以使調整螺栓4 5 的高度調整螺帽4 7接觸到位在螺桿3 0的軸環3 2上之上 無油環3 5的上表面，致使不會由於施加至螺栓3 1之負載 而軸向地移動螺桿3 0，如圖6 a及6b所示。 此時’較佳地，高度調整螺帽47適當地與上無油環 3 5接觸，致使不會防礙螺桿3 0的平順旋轉。 更者，數個角球形軸承4 2、4 3係位於與主體1 〇組裝 之軸承殼部4 1中，外接合預載蓋44係藉由螺桿（B )而 與軸承殼部4 1組裝，以及，內接合預載螺帽46係拴在調 整螺栓4 5的外螺紋部4 9 a上，因此，精確地控制螺桿3 〇 的軸向移動。此時，高度調整螺帽47作用來均勻分配施 加至螺桿3 0的移動之力，且，彈簧5〇係有助於防止螺桿 3 〇的反衝現象。 換言之，當螺桿3 0係藉由伺服馬達200而驅動時， 與軸環3 2的上及下側接觸之上及下無油環3 5、3 6、彈簧 5 0、調整螺栓4 5、彈簧調整螺栓4 8及角球形軸承4 2、4 3 的內接合係與連接軸3 3關聯地旋轉，以控制螺桿3 〇的水 平與垂直移動。 尤其’本發明的平衡控制器4〇減小由於螺桿3 0及溶 液間之力而針對螺栓3 1的負載，以使螺桿3 0平順地旋轉 ，因爲連接至角球形軸承4 2、4 3之高度調整螺帽4 7旋轉 -15- (11) (11)200411805 ，同時支撐螺桿3 0的依賴負載。 再者，旋入調整螺栓45的內螺紋部49b之彈簧調整 螺栓4 8藉由拴緊或鬆開其本身而上升或下降，因此，推 壓或放鬆彈簧5 0而控制上及下無油環3 5、3 6與螺桿3 0 的軸環3 2間之接觸程度，以如願地避免由於施加至螺栓 3 1的溶液的負載之不利點，如圖7所示。 以下，將更詳細地說明依據本發明之分配器裝置的過 程能力指數。 於一過程的統計品質控制中係一主要目的，穩定地管 理此過程。再者，合意地控制此過程係重要的，以使此過 程的產品符合預定標準必備條件。 因此，這是需要評估產品的品質變化於產品的發展及 製造步驟中，並實施一過程能力分析，其中產品的量測値 與設定値間之差別係使用各種統計方法而予以檢查，以減 少產品的品質變化。 此過程能力，其包括自然公差（6 σ )的槪念，意指 能夠量測一想要品質的產品之過程的能力，當此過程係於 一穩定狀態在特定條件下。 此時，此過程能力指數係使用來定量地表示此過程能 力。 此過程能力指數，其界定爲可容許過程範圍對自然公 差（6 σ )的比，意指評估藉由某一過程量測一想要品質 的產品的能力是否足夠之指數，且，分類成數類型的過程 能力指數，諸如Cp、Cpk及Cpm，依據與規格限制、偏 •16- (12) (12)200411805 差及設定値的關係。 c p代表一過程的分佈 C P係界定爲可容許過程範圍（部份公差）對實際過 程範圍（自然公差）的定量比，如同公式1 : 公式1 可容許過程範圍 P—實際過程程範圍 USL - LSL 6σ""""High-speed chip mounters on PCBs have been developed and commercialized as a surface mount device, so the need to develop improved distributors that can be applied to high-speed chip mounters remains. In particular, it is necessary to use a dispenser as a surface-mounting device of a semiconductor device to dispense an epoxy solution accurately and quickly with a desired amount so that the percentage of defects is reduced when a semiconductor wafer is manufactured. Furthermore, consumers want a dispenser that quickly and fixedly discharges a solution at a predetermined location within a tolerable error range, even when it is reused for a long time. Furthermore, it has recently been proposed to increase the discharge speed of the solution through a process using a vacuum pressure or an injection pressure through a pump. -6-(2) 200411805 Referring to Fig. 1, one of the main bodies 20 of a conventional dispenser device includes a motor 21 and a pump 25, and a screw 24 driven by a motor shaft 2 2 of Lauda 2]. At this time, the epoxy resin is self-injected by the pneumatic pressure to be fed to the pump 25 through the feeding line 26, and discharged to the substrate via the pump 27. The structure of the conventional dispenser device is such that the solution (E · P) fed between the screw pitches is discharged into the base by the needle 27 according to the rotation of the screw 24. Therefore, the screw 24 should be precisely, for example, due to the backlash of the solution pressure, and The water of the screw is precisely controlled to feed the solution at a high speed accurately. However, the disadvantage of the conventional dispenser device is that the unit of the screw 24 is precisely controlled, thus reducing the reliability. Many efforts have been made to avoid disadvantages. For example, the inventor's patent, Korean Patent Nos. 9 8-5 8 3 16 and 9 9 disclose a device for injecting silicone, and the device is configured for a resin coating machine. According to these patents, the solution is discharged onto the substrate using a rotating rod to control the discharge amount of the solution. However, the disadvantage of these conventional patents is that it is difficult to dispense quickly because the device operates with a large-scale and complicated driving mode. There is also the problem of accurate liquid dispensing because the solution discharge capability of the device does not cause problems with disassembly / assembly and cleaning of the device. A brief cross-sectional view, [25] is provided with a bolt of the end pin 24 of the horse container (S · L) 25, which is lowered by ground control to prevent the horizontal and vertical axis from being applied to the substrate. It is not sufficient to provide a device for the device. Please refer to this case No. 1 6 68 7. The screw device with a through hole for manufacturing semiconductors has many inches and is based on a small amount of resin. In addition, -7- ( 3) (3) 200411805 Other disadvantages of these conventional patents are that the discharge error rate of this device is high because it is difficult to control the screw desirably, which reduces the reliability of the device, and the device and its eight types The interchangeability of the dispenser device is not good because it is difficult to accurately distribute the resin solution and desirably control the discharge amount of the resin solution based on the viscosity of the resin solution. Furthermore, the disadvantages of these conventional patents are that it is difficult to quickly dispense a resin solution onto the substrate due to its complicated distribution and control process, in which the liquid resin solution (epoxy resin) is controlled in parallel; in other words, the resin The flow channel of the solution is blocked by a rotating opening and closing rod or automatically inverted to dispense a predetermined amount of resin solution, and the blocked flow channel is reopened by separating the opening and closing rod from the flow channel to Move the resin solution. Therefore, the present inventors have proposed a dispenser device for manufacturing semiconductor wafers disclosed in Korean Patent No. 2 0249007 to overcome the above disadvantages, wherein the dispenser device has a rather simplified structure and determines an accurate The resin solution is discharged, and the dispenser device is easy to clean due to the convenience of disassembly and assembly, and the interchangeability of this dispenser device with its eight types of dispenser devices is excellent. However, although it has been improved compared to conventional patents (Korean Patent Nos. 9 8-5 8 3 1 6 and 99-16687), the dispenser device of Korean Patent No. 2002-49007 still has a huge and complicated structure, Complex resin solution feeding and control processes, complex operating methods, and difficult disadvantages of accurately controlling this screw. (4) (4) 200411805 [Summary of the Invention] Therefore, 'the present invention is made in view of the above disadvantages occurring in the conventional technology' and 'the object of the present invention is to provide a dispenser device for manufacturing semiconductor wafers, which is accurate A solution is discharged on the ground and the solution is controlled in a small amount during the discharge of the solution to maximize its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which implements a high-speed dotization process, and adjusts to minimize the error of the solution discharge amount, thereby maximizing its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which uses a servo motor directly connected to a screw to implement a high-speed dotization process and an end control process using a recoil control to control the solution axially. Flow to maximize its reliability. Another object of the present invention is to provide a dispenser device for manufacturing a semiconductor wafer, which, due to its precise structure, prevents a huge load applied to the dispenser device during operation to minimize errors in its operation. Another object is to provide a distributor device for manufacturing a semiconductor wafer, which is easily disassembled and reassembled to facilitate cleaning and replacement of the screw that is convenient for its purpose, thereby maximizing the connection with other types of distributor devices. Interchangeability. Based on the present invention, these objects can be achieved by configuring a dispenser device for manufacturing a semiconductor wafer, the dispenser device including a main body; a shell portion connected to the injection container and detachably assembled with the main body; a screw, Located in the housing portion, a servo motor axially connected to itself is used to discharge the solution fed from the injection container by a predetermined amount via a -9- (5) (5) 200411805 needle portion; and, a balance controller, and a screw Assembled axially to control horizontal and vertical movement of the screw. [Embodiment] Referring now to the drawings, the same reference numerals are used in all different drawings to indicate the same or similar components. Fig. 2 is a perspective view of a dispenser device according to the present invention, Fig. 3 is an exploded perspective view of the dispenser device according to the present invention, and Fig. 4 is a sectional side view of the dispenser device according to the present invention. According to the present invention, there is provided a dispenser device that accurately discharges a viscous solution, such as epoxy resin, to meet the need for improved performance, including high-speed and precise operation of equipment for manufacturing semiconductor wafers, such as wafer mounting. In detail, the present invention provides a dispenser device for manufacturing a semiconductor wafer, which includes a main body 10 assembled with a mobile unit (not shown) including a robot arm unit, and a connecting pipe (S-1) and The viscous-soluble injection container (S · L) communicates with the shell part 20 assembled with the main body 10 detachably. The connection shaft 3 3 is integrated with the lower bolt 3 1 accommodated in the housing portion 20, and the screw 30 has a collar 32 formed at a lower portion of the connection shaft 33. The balance controller 40 is axially assembled with the upper portion of the connecting shaft 33 to control the horizontal and vertical movement of the screw 30, and the needle-like member 60 is detachably assembled with the lower portion of the case portion 20. In addition, the servo motor 200 is mounted on the main body I 0, and has a drive shaft 2 1 0 having a connecting shaft 33 connected to the screw 30 through a coupling member 100 to control the screw 30 Rotation. -10- (6) (6) 200411805 Referring to FIG. 2 and FIG. 4, the main body 10 is provided with an upper support portion 丨 1 on the upper portion thereof, and a lower support portion 13 on the lower portion thereof. The lower support portion 13 is axially opposed to the upper support portion 11 and the assembling groove 14 is formed on the upper support portion 11 so that the upper support portion 11 is formed in a shape. The servo motor 200 is inserted into the motor assembly inner diameter 12 formed in the upper support portion 11 of the main body 10 to be firmly assembled with the main body 10 using a screw (B), and the housing portion 20 is formed by The positioning bolts 16 are tightened into either of the positioning bolt holes 15 formed on both lateral sides of the lower support portion 13 and inserted into an assembly groove 14 removably assembled with the lower support portion 13. At this time, the positioning grooves 25 are formed on both sides of the housing portion 20, so when the positioning bolt holes 15 are fastened, the positioning bolts 16 are inserted into the positioning grooves 2 5 through the positioning bolt holes 15 Thus, the shell portion 20 and the lower support portion 13 of the main body 10 are firmly assembled. Referring to FIGS. 8 and 9, a valley liquid channel 21 having stepped inner diameters 22 and 23 enlarged up and down is formed vertically in the shell portion 20, and the solution channel 21 and the inner portion are formed in the shell portion 20 via The ends of the connection pipe (S-1) injecting Gu Yi (S · L) into the solution outlet 23 on the wall communicate with each other vertically. At this time, the carbide tube 27 is inserted into the solution channel 21 to minimize the frictional sound due to the flow of the solution and the rotation of the lower bolt 31. The lower enlarged stepped inner diameter 23 is defined in the lower part of the outer thread of the shell part 24 and the head 63 of the needle 61 is received therein, and the needle 6 1 is fixed to the lower part of the outer thread of the shell part by inspection The upper needle cover 62 on the 24 is installed to the enlarged inner diameter of the lower step, as shown in FIG. 9. The screw collar 3 2 of the screw 30 is inserted into the enlarged stepped inner diameter 22, and the upper and lower oil-free rings 3 5, 3 and 6 are mounted on the connecting shaft 3 3 to the collar 3 2-11-( 7) (7) 200411805 above and below, and the 0-ring 3 7 series is installed so as to be in contact with the lower oil-free 1¾: > 6 so that the solution outlet 2 3 air-tightly accommodates the lower bolt 3 1. Furthermore, the connecting shaft 33 is connected to the drive shaft 2 of the servo motor 200 and the coupling structure 100 to be driven by the servo motor 200. The lower bolt 3 1 of the screw 30 includes a spiral pattern and a spiral groove 3a. The spiral groove 3a is rounded to smoothly move the solution, and the end of the bolt 3I forms a tapered and rounded tip. The end of the bolt 31 is in contact with the V-shaped valve seat 64 formed on the head 63 of the needle 6 1 to block the needle 6 in a watertight manner. Now returning to FIGS. 10 and 11, the bolt 31 can be determined by the bolt. The pitch size of 31 is used selectively, and when the viscosity of the solution or the use of the dispenser device is changed, a different screw 30 is used. Thereby, interchangeability with other types of dispenser devices is achieved. In other words, in the case of using a bolt with a narrow pitch, the amount of solution discharged from the needle is small, but the solution is accurately discharged from the needle. On the other hand, in the case of using a bolt with a wide pitch, the solution was discharged in a large amount, however, the solution was discharged from the needle inaccurately. Furthermore, the balance controller 40 functions to control the horizontal and vertical movement of the screw 30 to accurately discharge the solution. 3 to 5, the balance controller 40 is axially assembled with the upper portion of the connecting shaft 33 of the screw 30, and includes a bearing housing portion 4 1 assembled with the housing portion 20 using the first screw (b). , So that the bearing shell portion 41 is positioned between the upper and lower support portions 11 and 13 of the shell portion 20. In addition, several bearings 42 and 43 are located in the bearing housing portion 41, and the outer joint preload cover 44 is -12- (8) (8) 200411805 and the bearing housing portion 4 is connected by the second screw (B). The upper side of 1 is assembled to press the outer engagement of the bearings 4 2, 4 3 downward. Furthermore, since the internally engaging preload nut 46 is controlled by the externally threaded portion 49a of the adjusting bolt 45 incorporated in the bearings 42, 43, the internal engagement of the bearings 42, 43 is firmly coupled to each other. Furthermore, the height adjusting nut 4 7 is fastened to the externally threaded portion 49 a of the adjustment bolt 45 so that the externally threaded portion 49 a of the adjustment bolt 45 is fastened, and the collar 3 at the screw 3 is pressed vertically. There is no oil ring 3 5 on the upper side of 2 and the spring adjusting bolt 4 8 is screwed into the internal thread portion 4 9 b of the adjusting bolt 4 5. The spring 50 is located between the lower side of the spring adjusting bolt 48 and the upper side of the upper oil-free ring 35, and is elastically compressed by the adjustment of the spring adjusting bolt 48 which is engaged with the internal thread portion 49b of the adjusting bolt 45. Oil-free ring 3 5. Furthermore, preferably, each of the bearings 4 2, 4 3 includes an angular spherical bearing having an inner joint and an outer joint. 6a and 6b, the positioning bolt 47b is fastened to the internal diameter 47a of the internal thread formed on the circumference of the height adjustment nut 47, and is fastened to the internal diameter 47a of the internal thread. The lower side of the height adjustment nut 47 is in contact. Therefore, the spring adjusting bolt 4 8 alternately compresses or relaxes the spring 50 to adjust the contact degree between the collar 32 of the screw 30 and the upper and lower oil-free rings 3 5 and 36 as shown in FIG. 7. The reference number 120 represents a connection bolt cover which connects the connection pipe (S-1) of the injection container to the solution outlet 23 of the housing portion 20. In other words, the injection container (s · L) communicates with the solution channel 21 through the connection tube (S-1) and the solution outlet 23 of the shell portion 20, and the screw 3〇-13- 200411805 〇) is a servo motor 2 0 0 is driven to rotate the solution channel 2: [in the bolt 3 J, whereby the solution is distributed from the solution channel 21 to the α such as a semiconductor wafer (not shown) via the needle 6 1 of the needle-like member 60. Superscript. The discharge of the solution by the screw 31 of the screw 30 is due to the shear force of this solution, so the area where the flow path of the solution is often required to be kept under a fixed pressure (the pressure of the solution fed from the injection container: about 0.5 b ar To precisely distribute the solution. For this reason, in terms of pressure, it is necessary to precisely control the balance of the screw 30 that affects the surrounding solution. The present invention provides a balance controller 40 that accurately controls the balance of the screw 30. The balance of the screw 30 should be controlled in order to prevent the recoil line of the screw 30 'however it is not critical when the viscosity of the solution is low and the load applied to the solution of the bolt 31 during the discharge of this solution is low Therefore, the balance controller 40 of the present invention is applied to an example using a high viscosity solution, which increases the load on the bolt 3 during the discharge of the solution. The balance controller 40 of the present invention functions as precisely moving the screw 3 0, the smallest change in the load applied to the bolt 31, and the dispenser device is easily disassembled and reassembled. In detail, the 'solution is tied to the screw 30, and the rotation period is along the bolt 31. The spiral groove 3 1 a is fed from the injection container (s · L) to the needle 6 1. At this time, 'the bolt 31 is rotated in the center of the solution passage 21 of the shell portion 20, and the load applied to the bolt 31 is The direction is relative to the discharge direction of the solution -14- (10) (10) 200411805. However, when the solution approaches the needle 6 1 of the needle-like member 60, the load on the bolt 31 increases undesirably because the needle 6 The narrow diameter of 1. Therefore, 'the adjustment bolt 4 5 needs to be tightened or loosened so that the height adjustment nut 4 5 of the adjustment bolt 4 5 comes into contact with the oil ring 3 5 on the collar 3 2 of the screw 30. The upper surface is such that the screw 30 is not moved axially due to the load applied to the bolt 31, as shown in Figs. 6a and 6b. At this time, 'preferably, the height adjustment nut 47 is appropriately oil-free. The rings 35 are in contact with each other, so that they do not hinder the smooth rotation of the screw 30. Furthermore, several angular spherical bearings 4 2, 4 and 3 are located in the bearing housing 41 assembled with the main body 10, and the preload cover is externally connected. 44 is assembled with the bearing housing portion 41 by a screw (B), and the internally engaging preload nut 46 is fastened to the external thread portion 4 9 a of the adjusting bolt 45, Therefore, the axial movement of the screw 30 is precisely controlled. At this time, the height adjustment nut 47 acts to evenly distribute the force applied to the movement of the screw 30, and the spring 50 system helps prevent the screw 30 from reacting. In other words, when the screw 30 is driven by the servo motor 200, the upper and lower oil-free rings 3, 5, 6, spring 5, 0, and adjusting bolt 4 are in contact with the upper and lower sides of the collar 32. 5. The inner joint system of the spring adjusting bolt 48 and the angular spherical bearings 4 2, 4 3 rotates in association with the connecting shaft 3 3 to control the horizontal and vertical movement of the screw 30. In particular, the balance controller 40 of the present invention reduces the load on the bolt 31 due to the force between the screw 30 and the solution, so that the screw 30 rotates smoothly because it is connected to the angular spherical bearings 4 2, 4 3 The height adjustment nut 4 7 rotates -15- (11) (11) 200411805 while supporting the screw-dependent load of 30. Furthermore, the spring adjusting bolt 48 screwed into the internal thread portion 49b of the adjusting bolt 45 is raised or lowered by tightening or loosening itself. Therefore, the spring 50 is pushed or released to control the upper and lower oil-free rings. The degree of contact between 3, 5, 6 and the collar 32 of the screw 30, in order to avoid disadvantages due to the load of the solution applied to the bolt 31, as shown in FIG. Hereinafter, the process capability index of the dispenser device according to the present invention will be described in more detail. A primary purpose in the statistical quality control of a process is to manage the process stably. Furthermore, it is important to control the process desirably so that the products of the process meet the prerequisites of a predetermined standard. Therefore, it is necessary to evaluate the quality change of the product in the development and manufacturing steps of the product and implement a process capability analysis. The difference between the measurement and setting of the product is checked using various statistical methods to reduce the product. Quality change. This process capability, which includes the idea of natural tolerance (6 σ), means the ability to measure a process of a product of desired quality when the process is in a steady state under certain conditions. At this time, the process capability index is used to quantitatively represent the process capability. This process capability index is defined as the ratio of the allowable process range to the natural tolerance (6 σ), which means an index that evaluates whether the capability of measuring a product of desired quality through a certain process is sufficient, and is classified into a number type The process capability index, such as Cp, Cpk, and Cpm, is based on the relationship with the specification limit, partial 16- (12) (12) 200411805 difference, and set 値. cp represents the distribution of a process CP is defined as the quantitative ratio of the allowable process range (partial tolerance) to the actual process range (natural tolerance), as in formula 1: formula 1 allowable process range P-actual process range USL-LSL 6σ " " " "
一USL-LSL NT 其中USL =上規格界限 LSL =下規格界限 NT=自然公差 從以上公式中’可看到’過程能力指數Cp依據上規 格界線及下規格界限而變化。 詳細地說，當Cp= 1.0時，可允許過程範圍係相同如 實際過程範圍於一過程中，且，自此過程製造的產品的品 質分佈顯不一穩疋的正常分佈。此時，理論上，偏離自規 格界限之部份係0.2 3 %。然而，實際上，因爲裝置的磨損 及爆裂’适是難以經常地確保一想要品質的產品，因此， 較佳地’ Cp係1 .3 3或更大。此時，自規格界限的偏離部 係 0.007 % 〇A USL-LSL NT where USL = upper specification limit LSL = lower specification limit NT = natural tolerance From the above formula, ‘see’ the process capability index Cp changes according to the upper specification limit and the lower specification limit. In detail, when Cp = 1.0, the allowable process range is the same as the actual process range in a process, and the quality distribution of products manufactured since this process is unstable and normal. At this time, theoretically, the part that deviates from the self-specification limit is 0.2 3%. However, in practice, since the wear and tear of the device is difficult to ensure a product of a desired quality frequently, the Cp is preferably 1.3 or more. At this time, the deviation from the specification limit is 0.007%.
Cpk代表一過程平均 (13) (13)200411805 另一類型的過程能力指數Cpk係提議來給予關於過程 平均距一規格界限平均的偏差的答案，且，如果上規格界 限及下規格界限的平均係由m所指定，m係界定如公式2 公式2 m= ( USL + LSL ) /2 再者，代表過程平均距規格界限平均的偏差之偏差度 (k )係界定如公式3 : 公式3 k= ( m- ". ) / ( USL-LSL/2 ) 其中，//係一排出溶液的預設値，因此，Cpk係相同 如（卜k ) Cp，亦即，Cpk= ( 1 - k ) Cp。 於僅使用上規格界限的例子中，過程能力指數Cpk = (USL- β /3 δ )。另一方面，於僅使用下規格界限的例子 中，過程能力指數Cpk=( //-LSL) /3。 本發明的較佳瞭解可依據提出解說的以下實例而獲得 ，然而，不會解釋來限制本發明。 使用關於過程能力指數之以上公式’依據本發明之分 配器裝置的過程能力指數係評估如將於一實例中所述的。 實例 於用以製造半導體晶片的未充滿過程中’具有 3 0 0 0 〇 c p s的黏度之溶液（環氧液）係以1 0 m g的量排出至 諸如基底的標的上5 0次’其使用依據本發明之分配器頭 -18- (14)200411805 ，以評估分配器裝置的過程能力指數Cpk。結果係如下。 lOmgCpk 測試 3 10.25 10.00 ιΗ 9.75 9.50Cpk represents a process average (13) (13) 200411805 Another type of process capability index Cpk is proposed to give the answer about the deviation of the process average from a specification limit average, and if the average system of the upper and lower specification limits Specified by m, m is defined as Equation 2 Equation 2 m = (USL + LSL) / 2 Furthermore, the degree of deviation (k), which represents the deviation of the process average from the specification limit average, is defined as Equation 3: Equation 3 k = (m- ".) / (USL-LSL / 2) where // is a preset value for discharging the solution. Therefore, Cpk is the same as (Bu k) Cp, that is, Cpk = (1-k) Cp. In the case where only the upper specification limit is used, the process capability index Cpk = (USL- β / 3 δ). On the other hand, in the example using only the lower specification limit, the process capability index Cpk = (//-LSL) / 3. A better understanding of the present invention can be obtained from the following examples, which are presented as illustrations, however, they are not to be construed to limit the present invention. Using the above formula for the process capability index ', the process capability index of the dispenser device according to the present invention is evaluated as will be described in an example. Example: During the underfilling process used to manufacture semiconductor wafers, a solution (epoxy solution) with a viscosity of 3 00 cps is discharged to a target such as a substrate 50 times in an amount of 10 mg. The basis for its use The dispenser head -18- (14) 200411805 of the present invention is used to evaluate the process capability index Cpk of the dispenser device. The results are as follows. lOmgCpk Test 3 10.25 10.00 ιΗ 9.75 9.50
次數 10.50 從以上圖形的結果，可看到，最大排出量係1 0 ·13 ’ 最小排出量係9.96，排出量的範圍係0.27，平均排出量 係10.03，以及，排出量的運算平均分佈（標準）係〇.〇5 更者，實際過程範圍（Cpk USL)係0.03，可容許過 程範圍（Cpk LSL)係3.45，以及，過程能力指數Cpk係 3.03。 如果基於1 〇 m g的排出量，分配器裝置的過程能力指 數Cpk係1.33或更大，這被視爲優良的。因此，本發明 的分配器裝置具有比習知分配器裝置高2.3倍的過程能力 指數，因此視爲優良的。 如上述，用以製造依據本發明的半導體晶片之分配器 裝置的有利點在於一高黏度溶液係精確地排出，且，一想 要的溶液量係於一高速點化過程期間使用一平衡控制器而 精確地排出，藉此，延長分配器裝置的使用年限並擴大分 配器裝置的用途。 -19- (15) (15)200411805 分配器裝置的其它利益爲，施加至分配器裝置之巨大 負載係有效地防止以最小化分配器裝置的操作失誤，分配 器裝置具有一精密結構，這是方便地來分解並重組以及淸 潔分配器裝置，且，構成此分配器裝置的螺桿可依據其用 途而容易地更換，藉此，合意地確保與其它類型的分配器 裝置的互換性。 本發明已經以解說方式而說明，且，將暸解到，所使 用的用辭預期爲說明的性質而不是限制。本發明的許多修 改及變化係可能的，依據以上教導。因此，將瞭解到，於 附加請求項的範圍內，除了特定說明之外，本發明可以不 同方式而實施。 【圖式簡單說明】 自以下的詳細說明以及附圖，將更淸楚地瞭解到本發 明的以上及其它目的、特性及優點，其中： 圖1係一習知分配栗的簡要截面圖； 圖2係依據本發明之分配器裝置的立體圖； 圖3係依據本發明之分配器裝置的分解立體圖； 圖4係依據本發明之分配器裝置的截面側視圖； 圖5係構成依據本發明之分配器裝置之平衡控制器的 分解體圖， 圖6a及6b係依據本發明之平衡控制器的部份放大截 面圖’其中圖6 a解說在軸向調整一螺桿的高度之前的平 衡控制器’以及圖6 b解說在軸向調整此螺桿的高度後之 -20- (16) 200411805 平衡控制器； 圖7係本發明的平衡控制器的部份放大截面圖，其中 一彈簧係鬆弛的； 圖8係與一殼部組裝的針狀構件的放大圖，此殼部構 成依據本發明之分配器裝置； ® 9係圖8的部份F的放大圖； 圖1 〇及U係分別地解說具有不同尺寸的螺距之本發 明的螺桿。The number of times 10.50 From the results of the above graph, it can be seen that the maximum discharge amount is 10 · 13 ', the minimum discharge amount is 9.96, the range of the discharge amount is 0.27, the average discharge amount is 10.03, and the calculated average distribution of the discharge amount (standard ) Is 0.05. In addition, the actual process range (Cpk USL) is 0.03, the allowable process range (Cpk LSL) is 3.45, and the process capability index Cpk is 3.03. It is considered excellent if the process capability index Cpk of the dispenser device is 1.33 or more based on the discharge amount of 10 mg. Therefore, the dispenser device of the present invention has a process capability index which is 2.3 times higher than that of the conventional dispenser device, and is therefore considered to be excellent. As described above, the dispenser device for manufacturing a semiconductor wafer according to the present invention is advantageous in that a high-viscosity solution is accurately discharged, and a desired solution amount is used during a high-speed dotization process using an equilibrium controller. It is discharged accurately, thereby extending the useful life of the dispenser device and expanding the use of the dispenser device. -19- (15) (15) 200411805 Another benefit of the distributor device is that the huge load applied to the distributor device effectively prevents the operation errors of the distributor device from being minimized. The distributor device has a precision structure, which is It is convenient to disassemble and reassemble and clean the dispenser device, and the screw constituting the dispenser device can be easily replaced according to its use, thereby desirably ensuring interchangeability with other types of dispenser devices. The invention has been illustrated by way of illustration, and it will be understood that the terminology used is intended to be illustrative and not restrictive. Many modifications and variations of the present invention are possible, based on the above teachings. Therefore, it will be understood that, within the scope of the additional claims, the present invention may be implemented in different ways except for the specific description. [Brief description of the drawings] The above and other objects, features, and advantages of the present invention will be more clearly understood from the following detailed description and accompanying drawings, in which: FIG. 1 is a schematic cross-sectional view of a conventional distribution chestnut; 2 is a perspective view of the dispenser device according to the present invention; FIG. 3 is an exploded perspective view of the dispenser device according to the present invention; FIG. 4 is a cross-sectional side view of the dispenser device according to the present invention; 6a and 6b are partial enlarged cross-sectional views of the balance controller according to the present invention, 'of which FIG. 6a illustrates the balance controller before axially adjusting the height of a screw' and Figure 6b illustrates the -20- (16) 200411805 balance controller after the height of the screw is adjusted axially; Figure 7 is a partially enlarged cross-sectional view of the balance controller of the present invention, one of which is loose; Figure 8 It is an enlarged view of a needle-shaped member assembled with a shell part, which constitutes the dispenser device according to the present invention; ® 9 is an enlarged view of part F of Fig. 8; Figs. 10 and U are separately explained with different size The pitch of the screw of the invention.
主要元件 對照表 s · L 注入容器 B 螺桿 S-1 連接管 10 主體 11 上支撐部 1 2 馬達組裝內徑 13 下支撐部 14 組裝槽 1 5 定位螺栓孔 16 定位螺栓 20 殻部 20 主體 2 1 溶液通道 2 1 馬達 -21 - (17)200411805 22 上放大的階式內徑 22 馬達軸 23 下放大的階式內徑 23 溶液出口 24 外螺紋下部 24 螺桿 25 定位槽 25 泵 26 饋送線 27 碳化物管 27 針 3 0 螺桿 3 1 下螺栓 3 1a 螺旋槽 3 2 軸環 3 3 連接軸 3 5 上無油環 3 6 下無油環 3 7 〇形環 40 平衡控制器 4 1 軸承殼部 42、4 3 軸承 44 外接合預載蓋 45 調整螺栓Comparison table of main components s · L injection container B screw S-1 connecting pipe 10 main body 11 upper support part 1 2 inner diameter of motor assembly 13 lower support part 14 assembly groove 1 5 anchor bolt hole 16 anchor bolt 20 case 20 body 2 1 Solution channel 2 1 Motor-21-(17) 200411805 22 Stepped inner diameter enlarged 22 Motor shaft 23 Stepped inner diameter enlarged 23 Solution outlet 24 External lower part 24 Screw 25 Positioning groove 25 Pump 26 Feed line 27 Carbonization Object tube 27 needle 3 0 screw 3 1 lower bolt 3 1a spiral groove 3 2 collar 3 3 connecting shaft 3 5 oil-free ring 3 6 oil-free ring 3 7 〇 ring 40 balance controller 4 1 bearing housing 42 , 4 3 bearing 44 outer joint preload cover 45 adjustment bolt
-22- (18)200411805 46 內 接 合 預 載 螺帽 4 7b 定 位 螺 栓 47 高 度 調 整 螺 帽 4 7a 內 螺 紋 內 徑 4 8 彈 簧 調 整 螺 栓 4 9a 外 螺 紋 部 49b 內 螺 紋 部 5 0 彈 簧 60 針 狀 構 件 6 1 針 6 2 針 蓋 63 頭 部 64 V 形 閥 座 1 00 聯 結 構 件 1 20 連 接 螺 栓 蓋 200 伺 服 馬 達 2 10 馬區 動 軸-22- (18) 200411805 46 Inner engagement preload nut 4 7b Locating bolt 47 Height adjusting nut 4 7a Internal thread inner diameter 4 8 Spring adjusting bolt 4 9a External thread portion 49b Internal thread portion 5 0 Spring 60 Needle-like member 6 1 needle 6 2 needle cover 63 head 64 V-shaped seat 1 00 joint structure 1 20 connecting bolt cover 200 servo motor 2 10 horse zone moving shaft
-23--twenty three-