TWI228288B - Wafer lifter pin - Google Patents

Abstract

The invention provides a wafer lifter pin for lifting a wafer disposed on a platform. The platform has at least a circle shape penetrated hold, the center of circle of penetrated hold defines as a hold center. The wafer lifter pin comprises a socket and a pin. The socket is a column. The pin is a column and is located eccentrically on surface of the socket. By rotating the wafer lifter pin, makes the pin to be close to the hole center to avoid friction producing from between the all of penetrated hold and the pin during the wafer lifter pin lifts and descends.

Description

1228288

[Technical field to which the invention belongs] The present invention relates to a lifter pin, particularly a lifter for lifting wafers in a device. [Previous technology] In traditional semiconductor process equipment, the wafer is transferred between different reaction stations by a robotic arm. In particular, when the surface temperature of the wafer is still high and cooling is required, the robot arm will send the wafer into a cooling chamber (collingstation) in a semiconductor device for a cooling process. In order to improve the automation degree of semiconductor equipment, the robot arm and the cooling chamber use a lifting device in the cooling chamber when transferring wafers. The wafers are placed on a platform surface in a cooling chamber. The platform has three through holes of the same size, and has corresponding lifting dreams in the through holes. When the robotic arm takes out the wafer from the cooling chamber, the three lifting devices ^ are simultaneously raised, and the wafer placed on the platform in the cooling chamber is lifted, so that the A robotic arm can take out the wafer smoothly. Please refer to FIG. 1. FIG. 1 is a schematic diagram of a conventional lifting device and a platform. For example, the cooling chamber used in the semiconductor device of model LAM9600 has-flat a 1 0 (part of the actual platform). The platform 10 has a through hole 12. A lifting device 14 is provided in the through-hole 12. As shown in Figure 1, the lift | set 14 is the state after rising.凊 Refer to Figure 2, which is a side view of the conventional elevator. Lifting device

1228288 V. Description of the invention (2) 14 includes a peg 21 and a bracket 22, wherein the bracket "has a 23. Because the clamp portion 23 has the ability to elastically deform, the position is a through the clamp portion 2 3 clamps Clamping the pin 21 and completing the conventional lifting device 14 ', = some corrosive gases or liquids will be used in the semiconductor process' so when the wafer is sent into the cooling chamber' there will still be some such ^ : Nature gas or liquid: So: the material device 14 needs to be able to resist corrosion: rot, and the wafer still has a temperature of about 30 () degrees when the wafer is first sent into the cooling chamber, and the lifting device 14 also needs to be resistant to high temperatures . Therefore, the conventional studs 21 are made of ceramic material. However, since the platform 10 and the lifting device 14 are made by different manufacturers and the studs 21 may not be perfectly straight when they are manufactured, they may be in the studs. The upper part of the pillar has a slight curvature, which causes it to contact the side of the through hole 2. Therefore, during the lifting process of the known lifting device 14, the detection column 21 of the lifting device is extremely easy to rub against the inner wall of the through hole 12 of the platform 10, and then generate particles to contaminate the wafer. Also, the known lifting device 丨Column 2 of 4] It is very easy for the lifting device 14 to move during the movement, and the pin 21 will fall off due to the loosening of the clamp part ^, which will cause the loaded crystal circle to tilt and damage. Because the pin is made of ceramics Therefore, it is extremely easy to break after falling off. [Summary of the Invention] The main purpose is to provide a crystal that avoids friction and particles.

1228288 V. Description of the invention (3) Another object of the present invention is to provide a wafer lifting device that does not have a loosening phenomenon and still resists corrosion and high temperature. The wafer lifter provided by the present invention is used to lift a wafer on a platform. The platform has at least one circular = perforated hole, and each through hole has a side wall. The center of a circle penetrating + = is defined as the center point of a hole. The wafer lifting device is set in the ^ = hole, and the wafer lifting device can be observed only when the wafer is lifting. The wafer lifting device includes a bracket and a pin. The base of the bracket generally defines A—the second surface, and the meaning of the first upper surface = the surface and the bottom surface, and the center of the second upper surface is defined as the first center point. The bottom surface of the stud is the first and the second surface of the sanitary ware, which are vertically and closely combined, and inspected; Xichu-Shi, the top surface is tight = the wafer lifting device is rotated, so that the second center point can be lowered and placed into # 二& S = ft pillar and the side wall of the penetrating hole generate friction when the wafer lifter enters the lamp and rises. ΚίϊΓϊϋ: The spirit can be further understood by the following detailed description of the invention and the appended w. [Embodiment] The schematic diagram of the strictly circular lifting device and platform of the present invention. Circular through-holes: inside the bucket 32 D and V " 31, it has a circular through-hole 32. A wafer lifting and lowering device 33 is provided in the through hole 32. As shown in Figure 3

1228288 Fifth, the description of the invention (4) The wafer lifting device q q & runs through, only depicting: as a d to have-side walls. s circle: 乂 明) and the mother-circular through the hole ㈣, and: circle ;: ^ device 33 is arranged parallel to the side wall of each-circular through 32, because the 33 moving direction of the 33 is connected with the through The holes were observed in full view. Beauty: Said :: The device 33 will only get the platform 31 when it is in the ascending state, so it is completely round; it penetrates through the hole 32 and is smaller than the internal crystal lifting device 33, and ^ passes through the hole 32 to lift the crystal smoothly. circle. The two-point balanced support generated when the door is raised. Please refer to Figure 4, which is a schematic diagram of the wafer lifting / disposing 33ii wafer lifting device. On the body, A =: bracket 41 and a bolt 42. The bracket 41 is large and has a first upper surface 43 having a flat surface. The center of the circle 43 is defined as a first center point 46. The peg 42 is also cylindrical H on the body, and has a second upper surface 44 and a bottom surface 45 having a flat surface. The center of the circle of the second upper surface 44 is defined as a second center point 47. The bottom surface 45 of the peg 42 is in close joint with the first upper surface 43 of the bracket 41, and the second center point 47 of the peg 42 is at a specific distance from the first center point 46 of the bracket 41. In short, the bolt 42 is eccentrically provided on the first upper surface 43 of the holder 41. The above eccentricity means that the axis of the bolt 42 and the axis of the bracket 41 have a certain amount of eccentricity. Please refer to FIG. 5 'FIG. 5 is a plan view of the lifting device and the circular through hole. The center of the circle through the hole 32 is defined as the center point of a hole. The diameter of the first upper surface 43 is larger than the diameter of the second upper surface 44 and smaller than the diameter of the through hole 32.

Page 8 1228288 V. Description of the invention (5) Please refer to Fig. 6 '. Fig. 6 is a plan view of a rotating lifting device and a circle. Since the second center point of the bolt 42 penetrates the dagger hole, the heart point 46 does not overlap, and a

However, 疋 has a special 疋 distance, so when the wafer lifting device 33 is rotated along the side of the building M, the peg 42 will be changed from the original position (the position of the circle of the dashed line) to that shown in FIG. 6. The first center point 4 7 can be closer to the hole center 5 丨, so the wafer lifting device 33 can be rotated at an appropriate angle so that the peg 42 and the circular through =

The side wall of the hole 32 is not in contact, so as to prevent the studs from "friction when the wafer is raised and lowered. The flying stud U and the studs 42 and the brackets 41 are integrally formed with each other and are tightly coupled. It is made of anti-corrosion and high temperature resistant aluminum metal. Therefore, compared with the conventional lifting device, the wafer lifting device 33 will not cause the bolt to become loose during the lifting movement of the conventional lifting device. The pillar falls off, thereby tilting and damaging the loaded wafer. And because the wafer lifting device 33 is made of aluminum metal, it still has the ability to resist corrosion and high temperature with the conventional lifting device. With the above preferred specific embodiments The detailed description is intended to describe the features and spirit of the invention more clearly, rather than to limit the scope of the invention with the preferred embodiments disclosed above. Instead, the purpose is to cover various changes and Equivalent arrangements are within the scope of the patent scope of the present invention.

1228288 Schematic illustration [Schematic description] Figure 1 is a schematic diagram of a conventional lifting device and platform. Figure 2 is a side view of a conventional lifting device. FIG. 3 is a schematic diagram of a wafer lifting device and a platform according to the present invention. FIG. 4 is a schematic diagram of a wafer lifting device according to the present invention. Figure 5 is a plan view of the lifting device and the circular through hole. Figure 6 is a top view of the rotating lifting device and the circular through hole. [Simple description of component representative symbols] 10, 31 platform 1 2 penetrating hole 14 lifting device 21, 42 pin 22, 41 bracket 2 3 clamp portion 3 2 circular penetrating hole 33 wafer lifting device 41 bracket 4 2 pin Post 43 first upper surface 44 second upper surface 4 5 bottom surface

Page 10 1228288 Brief description of the drawing Point 46 First middle 47 Second center S 5 1 Hole center I 61 Direction of rotation

Claims (1)

1228288 VI. Scope of patent application_ 1. A wafer lifting device (Ufter pin), which is a wafer placed on a platform for lifting, the platform has a shape through hole for lowering system 2 the circular through hole With a side wall, this: = the circle of the hole: is defined as the center point of the hole, and the wafer is lifted in the circular through hole. The wafer lifter includes: & a bracket, the bracket The base is generally a cylinder, the bracket has a side, and the circle center of the first upper surface is defined as a first center point and a peg (pm). The peg is generally a cylinder. The stud has two second upper surfaces and a bottom surface, and the center of the second top surface is defined as a second center point. The bottom surface of the stud is combined with the first upper face of the bracket, and the The second center point of the stud has a certain distance from the two of the bracket; τ Among them, by rotating the wafer lifting device, the second center point can be closer to the center of the hole, avoiding the stud and the penetration The side wall of the hole is carried out in the wafer lifting device When the friction drop. 2. The device of claim 1 of the patent scope of the item, wherein the wafer is much larger than the through hole 'and less than the internet. 3. The device according to item 1 of the scope of patent application, wherein the platform is provided in a cooling station. 4. The device according to item 1 of the scope of the patent application, wherein the wafer lifting device is provided in a cooling station. Page 12 1228288 6. Scope of patent application 5. The device described in item 1 of the scope of patent application, wherein the wafer lifting device is made of a material that is corrosion-resistant and resistant to high pressure, and the wafer lifting device is integrally formed. 6. The device as described in item 1 of the scope of patent application, wherein the material resistant to corrosion and high temperature is aluminum metal. 7. The device according to item 丨 in the scope of patent application, wherein the upper surface of the first circle is a flat surface. 8. The device according to item 1 of the scope of patent application, wherein the upper surface of the second circle is a flat surface. 9 The device described in item 1 of the scope of the patent application, wherein the upward and downward movement direction of the wafer lifting device is parallel to the side wall of the through hole. The device according to item 1 of the scope of patent application, wherein the diameter of the first upper surface is larger than the diameter of the second upper surface and smaller than the diameter of the through hole. A wafer lifting device (1 ift er Pi n), which is a wafer lifting device for lifting and lowering a wafer placed on a platform. The platform has a circular opening through the hole. The circular through hole has a side wall. Page 13 1228288 6. Scope of patent application ——- The center of a circular through hole is defined as the center point of a hole. The wafer lifting device is located in the circular hole. The wafer lifting device contains ... A bracket; the bracket is generally a cylinder; and a peg, which is substantially a column, and is eccentrically disposed on an upper surface of the holder; wherein, by rotating the wafer The lifting device makes the stud closer to the center of the hole, and avoids the friction between the stud and the side wall of the through hole when the wafer lifting device is lifting. 1 2. The device according to item 11 of the scope of patent application, wherein the wafer is much larger than the through hole and smaller than the platform. 13. The device according to item 11 of the scope of patent application, wherein the platform is provided in a cooling station. 14. The device according to item u of the scope of patent application, wherein the wafer lifting device is provided in a cooling station. Wherein the wafer is lifted and the wafer is lifted 15. The device as described in item 11 of the scope of patent application, the device is made of a corrosion-resistant and high-temperature resistant material as a unit. 16: The device described in item u of the patent scope, wherein the material which is anticorrosive and resistant to local temperature is aluminum metal. 1228288 VI. Scope of patent application 1 7. The device described in item 11 of the scope of patent application, wherein the first upper surface is a flat surface. 18. The device according to item 11 of the scope of patent application, wherein the second upper surface is a flat surface. 19. The device according to item 11 of the scope of the patent application, wherein the wafer lifting device is moved in a direction parallel to the side wall of the through hole. 20. The device according to item 11 of the scope of patent application, wherein the diameter of the first upper surface is larger than the diameter of the second upper surface and smaller than the diameter of the through hole. Page 15