TWI227970B - Optical module and method of fabricating the same - Google Patents

Optical module and method of fabricating the same Download PDF

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Publication number
TWI227970B
TWI227970B TW092131115A TW92131115A TWI227970B TW I227970 B TWI227970 B TW I227970B TW 092131115 A TW092131115 A TW 092131115A TW 92131115 A TW92131115 A TW 92131115A TW I227970 B TWI227970 B TW I227970B
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Taiwan
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infrared
test
module
signal
processor
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TW092131115A
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English (en)
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TW200412737A (en
Inventor
Adrian Wing Fai Lo
Kenjiro Hata
Tohru Kineri
Naoki Hanashima
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Tdk Corp
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/424Mounting of the optical light guide
    • G02B6/4243Mounting of the optical light guide into a groove
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4251Sealed packages
    • G02B6/4253Sealed packages by embedding housing components in an adhesive or a polymer material
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4255Moulded or casted packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/0232Lead-frames
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4292Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • H01S5/02216Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/0231Stems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068Stabilisation of laser output parameters
    • H01S5/0683Stabilisation of laser output parameters by monitoring the optical output parameters

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Selective Calling Equipment (AREA)
  • Light Receiving Elements (AREA)

Description

1227970 五、發明說明(1) 【發明所屬之技術領域】 一種用以測試紅外線功能之治具及方法,應用於具紅 外線傳輸功能之紅外線收發模組的紅外線功能測試。 【先前技術】 目前紅外線功能已然成為選擇電子儀器之要素,所以 現有的電子儀器多配置有紅外線收發模組。 然而在測試紅外線收發模組時,都是將紅外線收發模 組安裝於電子儀器’而後再作紅外線功能的測試,因此必 須使用到兩台電子儀器才能作紅外線功能的測試,也因為 如此,測試紅外線收發模組的時間很長,且花費在紅外線 收發模組的測試費用也較多,所以要提升紅外線收發模組 產能的可能性’根本就是微乎其微的。 【發明内容】 本發明的主要目的即為 之治具及方法’以縮短紅外 紅外線收發模組的測試費用 產能。 提供一種用以測試紅外線功能 線收發模組的測試時間、節省 、以及提升紅外線收發模組的 根據本發明所揭露的 法,係應用於具紅外線傳 測試紅外線功能之治具及方 線功能測試,此用以測試=功能之紅外線收發模組的紅外 理器、紅外線測試模組:=外線功能之治具部分包括有處 處理器係用以於山 义’則模組及顯示器。 涎狂的1示用以發出測 收發紅外線訊號(包括有紅σ遽,紅外線測試模組係用以 號),且連接處理器,以=外線受測訊號及紅外線結果訊 接收測試訊號後,發出紅外線
第5頁 1227970 五、發明說明(2) 受測訊號,並包括有收發恭及控制器,分別用以發出紅外 線受測訊號及接收紅外線結果訊號,及用以控制紅外線受 測訊號、紅外線結果訊號、與測試訊號之收發,受測模組 用以供紅外線收發模組設置及測試,且連接紅外線剛試模 組,以在接收紅外線受測訊號後,測試紅外線收發模組,、 並經紅外線測試模組,而回傳紅外線結果訊號至處理器, 並由處理器傳出’顯示器用以顯示,且連接處理5| ,以接 收紅外線結果訊號,並作顯示。 因此,在使用本發明時,先由處理器發出測試訊號, 且由紅外線測試模組之收發器接收測試訊號,並傳輸至U控 制為’以由控制裔使收發杰發出紅外線受測訊號,因此受 測模組可在接收紅外線受測訊號後,測試紅外線收發模 組,並將紅外線結果訊號傳回,以由紅外線測試模^之收 發器接收,並經由控制器之控制,而回傳紅外線結果訊號 至處理器,所以處理器可將紅外線結果訊號傳輸至顯示 器,以作顯示。 基於上述,可知本發明在測試的過程中,並不需先將 具紅外線傳輸功能之紅外線收發模組安裝於電子儀器後才 作測試,而可在紅外線收發模組未安裝於電子儀器時,便 作測試的動作,因此可縮短紅外線收發模組的測試時間、 節省紅外線收發模組的測試費用、以及提升紅外線收發模 組的產能。 為f對本創作的目的、構造特徵及其功能有進一步的 了解’餘配合圖示詳細說明如下:
1227970 五、發明說明(3) 【實施方式】 本發明係為一種用以測試紅外線功能之治具及方法, 而關於用以測試紅外線功能之治具的部分請參見「第1 圖」所示,且本發明應用於具紅外線傳輸功能之紅外線收 發模組(圖中未示)的紅外線功能測試,並包括有處理器 1 0、紅外線測試模組2 0、受測模組3 0、顯示器4 0及啟動器 50°
處理器1 0係用以發出測試訊號,紅外線測試模組2 0係 用以收發紅外線訊號(包括有紅外線受測訊號及紅外線結 果訊號),且連接處理器1 0,以在接收測試訊號後,發出 紅外線受測訊號,並包括有收發器2 1及控制器2 2,分別用 以發出紅外線受測訊號及接收紅外線結果訊號,及用以控 制紅外線受測訊號、紅外線結果訊號、與測試訊號之收 發,受測模組3 0用以供紅外線收發模組設置及測試,且連 接紅外線測試模組,以在接收紅外線受測訊號後,測試紅 外線收發模組,並經紅外線測試模組2 0,而回傳紅外線結 果訊號至處理器1 0,並由處理器1 0傳出,顯示器4 0用以顯 示,且連接處理器1 0,以接收紅外線結果訊號,並作顯 示。
而受測模組3 0更與處理器1 0連接,且在紅外線收發模 組剛剛設置於受測模組3 0後,受測模組3 0經處理器1 0傳輸 紅外線收發模組資料至顯示器4 0,以作顯示。而紅外線收 發模組資料可為測試治具名稱、部門、版本、治具製作曰 期、以及治具開發人員等等。
第7頁 1227970 五、發明說明(4) 以在啟動時,驅使處 至於啟動器5 0則連接處理器 理器1 0發出測試訊號。 因此,在使用本發明時,必須先將具紅外線傳輸功能 之紅外線收發模組設置於受測模組30,因此受測模組3〇可 將紅外線收發模組之紅外線收發模組資料傳輸至處理器 1 0,並由處理器1 0將紅外線收發模組資料傳輸至顯示器 4 0,以作顯示,接著,可啟動啟動器5 〇,以驅使處理器i 〇 發出測試訊號,且由紅外線測試模組2 〇之收發器2 1接收測 試訊號’並傳輸至控制器2 2,以由控制器2 2使收發器2 1發 出紅外線受測訊號,因此受測模組3 〇可在接收紅外線受測 訊號後’測試紅外線收發模組,並將紅外線結果訊號傳 回,以由紅外線測試模組2 0之收發器2 1接收,並經由控制 器2 2之控制,而回傳紅外線結果訊號至處理器1 〇,所以處 理器1 0可將紅外線結果訊號傳輸至顯示器4 〇,以作顯示。 基於上述,可知本發明在測試的過程中,並不需先將 具紅外線傳輸功能之紅外線收發模組安裝於電子儀器後才 作測試’而可在紅外線收發模組未安裝於電子儀器時,便 作測試的動作,因此可縮短紅外線收發模組的測試時間、 節省紅外線收發模組的測試費用、以及提升紅外線收發模 組的產能。 本舍明係為一種用以測試紅外線功能之方法,請參見 「第2 A、2 B圖」所示,且本發明應用於具紅外線傳輸功能 之紅外線收發模組(圖中未示)的紅外線功能測試,其包括 下列步驟:
第8頁 1227970 五、發明說明(5) 將具紅外線傳輸功能之紅外線收發模組設於 (步驟 1 0 1 )。 ^ 輸至將二、Γ發模組之紅她^ 示(步處驟理外線收發模組資料傳輸至顯示器,以作顯 1〇4)啟動啟動器,以驅使處理器發出測試訊號(步驟 由紅外線測試模組之收發器接收測試訊 控制器(步驟1 〇 5 )。 並傳輸至 由控制器使收發器發出紅外線受測訊號(步 叉測模組接收紅外線受測訊號(步驟1〇7)。 b;〇 广深/則试板組之收發态(步驟1 0 8 )。 109)紅外線測試模組之收發器接“外線結果m號(步驟 ιι〇)^ϋ_紅外線結果訊冑’而回傳至處自器、(步驟 (步驟H將紅外線結果訊號傳輸至顯示器’以作顯示 基於上述,可知本發明在測試的過程中, :^外線傳輪功能之紅外線收發模組安裝於電子:=先將 屑I式,而可在紅外線收發模組未安裝於電子儀哭1後才 測忒的動作,因此可縮短紅外線收發模組的測“:門便
1227970 五、發明說明(6) 節省紅外線收發模組的測試費用、以及提升紅外線收發模 組的產能。 以上所述者,僅為本創作其中的較佳實施例而已,並 非用來限定本創作的實施範圍;即凡依本創作申請專利範 圍所作的均等變化與修飾,皆為本創作專利範圍所涵蓋。
第10頁 1227970 圖式簡單說明 第1圖係為本發明之架構圖;及 第2 A、2 B圖係為本發明之流程圖。 【圖式符號說明】 處理器 10 紅外線測試模組 20 收發器 21 控制器 22 受測模組 30 顯示器 40 啟動器 50 步驟1 0 1 將具紅外線傳輸功能之紅外線收發模組設置 於受測模組 步驟1 0 2 受測模組將紅外線收發模組之紅外線收發模 組資料傳輸至處理器 步驟1 0 3 處理器將紅外線收發模組資料傳輸至顯示 器,以作顯示 步驟1 0 4 啟動啟動器,以驅使處理器發出測試訊號 步驟1 0 5 由紅外線測試模組之收發器接收測試訊號, 並傳輸至控制器 步驟1 0 6 由控制器使收發器發出紅外線受測訊號 步驟1 0 7 受測模組接收紅外線受測訊號 步驟1 0 8 受測模組測試紅外線收發模組,並將紅外線 結果訊號傳回紅外線測試模組之收發器 步驟1 0 9 紅外線測試模組之收發器接收紅外線結果訊
第11頁 1227970

Claims (1)

1227970 六、申請專利範圍 1. 一種用以測試紅外線功能之治具,應用於具紅外線傳輸 功能之一紅外線收發模組之紅外線功能的測試,該用以 測試紅外線功能之治具包括有: 一處理器,用以發出一測試訊號; 一紅外線測試模組,用以發出一紅外線受測訊號及 接收一紅外線結果訊號,且連接該處理器,以在接收該 測試訊號後,發出該紅外線受測訊號; 一受測模組,用以供該紅外線收發模組設置及測 試,且連接該紅外線測試模組,以在接收該紅外線受測 訊號後,測試該紅外線收發模組,並經該紅外線測試模 組,而回傳一紅外線結果訊號至該處理器,並由該處理 器傳出;及 一顯示器,用以顯示,且連接該處理器,以接收該 紅外線結果訊號,並作顯示。 2 .如申請專利範圍第1項所述用以測試紅外線功能之治 具,其中該受測模組更與該處理器連接,且在該紅外線 收發模組設置於該受測模組後,該受測模組經該處理器 傳輸一紅外線收發模組資料至該顯示器,以作顯示。 3. 如申請專利範圍第1項所述用以測試紅外線功能之治 具,其中該紅外線測試模組更包括有一收發器及一控制 器,分別用以發出該紅外線受測訊號及接收該紅外線結 果訊號,及用以控制該紅外線受測訊號、該紅外線結果 訊號、與該測試訊號之收發。 4. 如申請專利範圍第1項所述用以測試紅外線功能之治
第13頁 1227970 六、申請專利範圍 具,更包括有一啟動器,該啟動器連接該處理器,以在 啟動時,驅使該處理器發出該測試訊號。 5. —種用以測試紅外線功能之方法,應用於具紅外線傳輸 功能之一紅外線收發模組之紅外線功能的測試,該用以 測試紅外線功能之方法包括有下列步驟: 將具紅外線傳輸功能之一紅外線收發模組設置於一 受測模組;
啟動一啟動器,以驅使一處理器發出一測試訊號; 由一紅外線測試模組接收該測試訊號,並發出一紅 外線受測訊號; 該受測模組接收該紅外線受測訊號; 由該受測模組測試該紅外線收發模組,並將一紅外 線結果訊號傳回該紅外線測試模組; 由該紅外線測試模組接收該紅外線結果訊號,並回 傳該處理器;及 該處理器將該紅外線結果訊號傳輸至一顯示器,以 作顯示。 6. 如申請專利範圍第5項所述用以測試紅外線功能之方
法,其中該由一紅外線測試模組接收該測試訊號,並發 出一紅外線受測訊號的步驟,更包括有由該紅外線測試 模組之一收發器接收該測試訊號,並傳輸至一控制器的 步驟,以及由該控制器使該收發器發出該紅外線受測訊 號的步驟。 7. 如申請專利範圍第6項所述用以測試紅外線功能之方
第14頁 1227970 六、申請專利範圍 法,其中該由該受測模組測試該紅外線收發模組,並將 一紅外線結果訊號傳回該紅外線測試模組的步驟,係為 傳回該紅外線測試模組之該收發器。 8。 如申請專利範圍第7項所述用以測試紅外線功能之方 法,其中該由該紅外線測試模組接收該紅外線結果訊 號,並回傳該處理器的步驟,更包括有由該紅外線測試 模組之該收發器接收該紅外線結果訊號,以及由該控制 器控制該紅外線結果訊號,而回傳至該處理器。 9. 如申請專利範圍第5項所述用以測試紅外線功能之方
法,其中該將具紅外線傳輸功能之一紅外線收發模組設 置於一受測模組的步驟之後,更包括有該受測模組將該 紅外線收發模組之一紅外線收發模組資料傳輸至該處理 器的步驟,以及該處理器將該紅外線收發模組資料傳輸 至該顯示器,以作顯示的步驟。
第15頁
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