TWI226867B - Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member - Google Patents

Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member Download PDF

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TWI226867B
TWI226867B TW092121316A TW92121316A TWI226867B TW I226867 B TWI226867 B TW I226867B TW 092121316 A TW092121316 A TW 092121316A TW 92121316 A TW92121316 A TW 92121316A TW I226867 B TWI226867 B TW I226867B
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Taiwan
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plate
vibration
shaped member
plates
vibration plate
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TW092121316A
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Chinese (zh)
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TW200404725A (en
Inventor
Masaki Takasan
Kazuhiro Suzuki
Yoshikazu Koike
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Toyota Ind Corp
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Priority claimed from JP2002232978A external-priority patent/JP4029689B2/en
Priority claimed from JP2002232977A external-priority patent/JP3894071B2/en
Priority claimed from JP2002232976A external-priority patent/JP4359028B2/en
Application filed by Toyota Ind Corp filed Critical Toyota Ind Corp
Publication of TW200404725A publication Critical patent/TW200404725A/en
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Publication of TWI226867B publication Critical patent/TWI226867B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

Several oscillating plates 17 are parallel arranged. Each oscillating plate 17 is formed to become a long rectangular shape which is narrower than the width of the glass-substrate 12. Said oscillating plate 17 keeps the glass-substrate 12 at a floating state. Each oscillating plate 17 is grounded respectively. When the glass-substrate 12 loaded on the oscillating plate 17 is moved from the oscillating plate 17, the oscillating plate 17 is excited and the super sonic wave is generated. By means of the emitting pressure of the sonic wave, the glass-substrate 12 is floated to be kept a definite distance G from the oscillating plate 17.

Description

1226867 玖、發明說明： 【發明所屬之技術領域】 本發明係有關於一種在搬送液晶面板之玻璃基板或半 導體晶圓等板狀構件時，用以抑制在板狀構件中有靜電帶 電、產生靜電等技術，以及有關於將已帶電之板狀構件進 行去電的技術。 【先前技術】 在分離接觸之兩個物體時，在接觸界面方面，由一方之 面移動至另一方之面的局部電荷載體係回到一方之面，而 · 殘留在表面之局部電荷載體係形成靜電。接觸時之電荷移 動並非僅有絕緣體’即使是作爲導體之各個金屬亦會引起 接觸時之電荷移動。從而，若使藉由絕緣體所維持之各個 金屬接觸、再使其相互剝離時，便會進行帶電（剝離帶電）。 此外’將已帶電之物體以飄浮狀態（非接觸狀態）進行搬送 時’當已帶電之物體與將其以飄浮狀態支撐之支撐構件之 間的距離G在進彳了變化時，便會產生靜電。 在液晶面板之製造程序或半導體裝置之製造程序中，必 鲁 須使玻璃基板或半導體晶圓在多數個程序間進行搬送，而 當使板狀構件由載置部移動時，便會產生上述之剝離帶 電。特別是在如同作爲液晶面板之製造程序之一程序的硏 · 磨程序或貼合程序的易產生靜電的程序中，在使板狀構件 由載置部進行移動時，將由於剝離帶電而導致帶電量增 多。此外’剝離帶電之帶電量係隨著剝離速度的加速而增 加。因此’在減少帶電量方面，爲必須減緩剝離速度、亦 1226867 即減緩將板狀構件由載置部舉起之速度。其結果，造成增 長作業時間、降低生產性。 在板狀構件已帶電的情況下，去靜電器（I〇nizer)等去電 裝置係由已帶電之物體中去除或是中和靜電。去電裝置並 非是防止或是抑制剝離帶電之裝置。在對於去靜電器 (Ionizer)爲採用作爲較廉價之去電裝置的之去電刷情況 下’一般係將去電刷之前端與作爲應去電之對象的物體間 之距離設定爲數mm。不過，在此種距離中，由已帶電之 物體去除靜電的去電效果較低。此外，在使用去靜電器 (Ionizer)之情況下，若在對象物體與載置部之間爲存在有 空氣層時’係造成去電的困難，且造成在面對載置部之對 象物體裏面之去電的困難。 【發明內容】 本發明之第一目的係爲，在使板狀構件由載置部移動 時，爲將板狀構件之剝離帶電抑制至最佳狀態，同時，亦 可抑制在板狀構件之承接傳送時之靜電的產生。第二目的 係爲’將已帶電之板狀構件去電至最佳狀態。 爲了達成上述目的，本發明係提供如下述之板狀構件之 剝離帶電控制方法。剝離帶電控制方法係爲，當使載置於 載置部之板狀構件由載置部移動時，具備有利用藉由使載 置部激發振動而產生有音波之放射壓，進而使板狀構件由 載置部飄浮。 本發明又提供如下述之剝離帶電控制裝置。剝離帶電控 制裝置係爲，當由載置部剝離被載置於載置部的板狀構件 1226867 之際，爲抑制板狀構件之帶電。載置部係由物體飄浮裝置 所形成。物體飄浮裝置係具備有：振動板，係由可載置板 狀構件之導電性材料所形成；激發振動裝置，係使振動板 激發振動。藉由來自被激發振動之振動板的音波之放射壓 而使板狀構件由振動板之表面飄浮。振動板係被接地。 本發明又提供如下述之卸貨方法，係爲將板狀構件由第 •-物體飄浮裝置上移載至第二物體飄浮裝置上。第一以及 第二物體飄浮裝置係分別具備有由導電性材料所形成之多 數的振動板。第一以及第二物體飄浮裝置係分別藉由使各 個振動板激發振動所產生之音波的放射壓而將板狀構件進 行飄浮維持。第二物體飄浮裝置係更被裝備在可往復作動 之支撐部上。當將板狀構件由第一物體飄浮裝置上移載至 第二物體飄浮裝置上之際，爲將第一物體飄浮裝置之振動 板相互設爲相同電位、或是進行接地的同時，將第二物體 飄浮裝置之振動板相互設爲相同電位、或是進行接地之狀 態下，調整成使各個物體飄浮裝置之振動板與前述板狀構 件之間的距離形成爲一定狀。 本發明又提供如下述之卸貨裝置。卸貨裝置係具備有·· 支撐部，係可往復作動；移動裝置，爲使支撐部往復作動； 物體飄浮裝置，爲利用藉由使以導電性材料所形成之多數 之振動板被激發振動所產生之音波的放射壓，而將板狀構 件維持在飄浮狀態。振動板係被接地，或是振動板爲設成 相互爲相同電位。 本發明又提供如下述之收貨裝置。收貨裝置係具備有由 1226867 導電性材料所形成之多數的振動板。利用使振動板激發振 動所產生之音波的放射壓，而使將板狀構件進行飄浮維持 的物體飄浮裝置裝備在移動體上。振動板係爲相互爲相同 電位，或是振動板爲相互接地。 本發明又提供如下述之板狀構件之去電方法。去電方法 係具備有：飄浮維持步驟，係利用使由導電性材料所形成 之振動板激發振動所產生之音波的放射壓，而將已帶電之 板狀構件進行飄浮維持；去電步驟，在將振動板進行接地 之狀態下，將板狀構件與振動板之間的距離調整爲1 mm以 下，而將板狀構件進行去電。 本發明又提供其他板狀構件之去電方法。去電方法係包 含有：飄浮維持步驟，係利用使由導電性材料所形成之振 動板激發振動所產生之音波的放射壓，而將已帶電之板狀 構件進行飄浮維持；調整步驟，在將振動板進行接地之狀 態下，將板狀構件與振動板之間的距離調整爲1 mm以下； 去電步驟，係使用去靜電器（Ionizer)而將板狀構件進行去 電。 本發明又提供其他板狀構件之卸貨裝置。卸貨裝置係具 備有：支撐部，係可往復作動；移動裝置，爲使支撐部往 復作動；物體飄浮裝置，爲具備有多數之振動板。物體飄 浮裝置係被裝備在支撐部上，爲利用藉由使各個振動板被 激發振動所產生之音波的放射壓，而將板狀構件維持在飄 浮狀態。各個振動板係被接地。將去電刷配置成將去電刷 之前端位於略與對向於板狀構件之振動板之面相同面上。 1226867 本發明又提供其他收貨裝置。收貨裝置係具備有物體飄 浮裝置，係利用藉由使多數之振動板被激發振動所產生之 音波的放射壓，而將板狀構件維持在飄浮狀態。各個振動 板係被接地。將去電刷配置成將去電刷之前端位於略與對 向於板狀構件之振動板之面相同面上。 【實施方式】 以下，基於第1A圖至第4圖，說明將本發明於液晶面 板之製造程序中具體化的第一實施例。 如第1 A圖所示，作爲剝離帶電防止裝置之收貨裝置 11 ’係以物體飄浮裝置1 3所構成，其係具有可將作爲板狀 構件之玻璃基板1 2 (以鏈線圖示）暫時性載置的載置部之機 能。物體飄浮裝置1 3係被設置在以水平所配置之支撐板i 4 上。物體飄浮裝置1 3係具備有由導電性材料所形成之多數 (在本實施例中爲兩個）的振動板1 7。各個振動板之長邊方 向想端部係分別經由角板1 6而連結至振動件1 5。兩振動 板1 7係被配設成相互平行，並且，爲形成比玻璃基板1 2 之寬度更爲狹窄的長條矩形。藉由兩振動板1 7而使玻璃基 板1 2被支撐、或是被飄浮維持。各個振動板1 7係被接地。 各個角板1 6係爲，在其前端中，爲經由多數之螺絲1 8 而螺鎖至對應的振動板1 7。各個角板1 6係藉由對應之振 動件1 5所激發振動。各個角板1 6係形成爲扁平且略成直 方體狀。在角板1 6之下面係成一體狀的固定有圓錐狀之錐 體16a。錐體16a係爲，被固定在與固定於角板16面之相 反側之面中的振動件1 5上。角板1 6之前端面細雨振動件 -10- 1226867 1 5之軸線正交，而角板1 6之軸線與振動件1 5之軸線係爲 同軸而沿著鉛直方向延伸。此外，在第1 A圖以及第1 B圖 中，係以無視於角板1 6、錐體1 6a、以及振動件之大小比 例所繪製。 在振動件15中爲使用朗格分（音譯：Langevin)形振動 件。各個振動件1 5係如第1 B圖所示，爲具備有形成環狀 之一對壓電元件1 9a、1 9b，在兩壓電元件1 9a、1 9b之間 係配置有形成環狀之電極板2 0。使兩個金屬塊2 1 a、2 1 b 配置成夾持電極板20以及兩壓電元件19a、19b，以未圖 示之螺栓鎖緊固定兩金屬塊2 1 a、2 1 b，藉此而構成振動件 15。前述螺栓係爲，被插入至形成在金屬塊21b之孔（未圖 示），同時螺鎖至形成在金屬塊2 1 a之前述螺孔。兩金屬塊 2 1 a、2 1 b係經由螺栓而相互成電氣性的導通。在金屬塊2 1 a 中係形成有突緣22。各個振動件1 5之金屬塊2 1 a係以被 嵌合形呈於支撐板14之孔（未圖示）之狀態下，以未圖示之 螺栓經由突緣22而被固定在支撐板14上。 各個振動件1 5係被連接至對應之震盪器23。各個電極 板20係經由配線24a而與對應之震盪器23連接，震盪器 23之接地端子爲經由配線24b而被連接至金屬塊21b。構 成以角板16、錐體16a、振動件15、以及震盪器23而使 振動板1 7激發振動地激發振動裝置。此外，在第1 A圖中， 係僅揭示被連接至各個物體飄浮裝置1 3之一方之振動件 1 5的震盪器2 3。 說明如前所述之構造的裝置之作用。 1226867 收穫裝置1 1係爲在硏磨程序或貼合程序等容易產生靜 電的程序中作爲載置部所配設。在進行硏磨處理或貼合處 理之際，爲停止前述激發振動裝置之驅動，使玻璃基板1 2 在接觸至振動板1 7之狀態下被支撐。 當使玻璃基板1 2在由振動板1 7上移動之際爲使激發振 動裝置驅動。亦即，驅動震盪器23、使振動件1 5以指定 之共振頻率（例如，20kHz前後）激發振動，進行縱向振動 角板1 6、而經由角板1 6使振動板1 7被激發振動的撓曲振 動，在振動板1 7上產生駐波。如此，如第2 A圖所示，已 接觸狀態而被支撐在振動板1 7上之玻璃基板1 2係藉由由 振動板1 7所放射之音波的放射壓而如第2 B圖所示，由振 動板1 7之表面飄浮。飄浮距離係例如爲1 0 0 // m以上且3 0 0 // m以下之範圍，在第2B圖中係誇張地進行圖示。 在分離處於接觸狀態之兩個物體時，一般而言係爲產生 剝離帶電。即使在玻璃基板1 2之情況下，在以手動作業握 持玻璃基板1 2之一端而由振動板1 7剝離時，在玻璃基板 1 2上係帶電有極大的電荷。另一方面，在使物體飄浮裝置 1 3作動而使振動板1 7由玻璃基板1 2剝離的情況下，玻璃 基板1 2之電位雖會增大若干程度，不過，電位之增大量額 係減少爲接近於在以手動作業握持玻璃基板1 2之一端而 ^由振動板1 7剝離之情況下的1 /1 0。其狀態係揭示在第3 圖之圖表。 如第3圖之虛線所示，在欲單純地由振動板分離玻璃基 板12之情況下，爲在以短時間增大至接近40 0V爲止之玻 1226867 璃基板1 2的電位之後降低。另一方面，如在第3圖之實線 所示，在使用物體飄浮裝置1 3而使玻璃基板1 2由振動板 1 7剝離的情況下，玻璃基板1 2之電位係約增大些許而在 低電位聚合。其理由雖未明確可知，不過，音波飄浮之情 況下爲使玻璃基板1 2與振動板1 7之間的距離維持一定 狀，並且該距離G係較小，因此如第4圖所示，係可判斷 用以使玻璃基板1 2與振動板1 7具有如同電容器之機能。 本實施具有以下之優點。 當使玻璃基板1 2由振動板1 7移動時，使振動板1 7激 發振動而產生高音波，利用音波之放射壓而使玻璃基板1 2 由振動板1 7飄浮。藉由來自振動板1 7之音波的作用而使 玻璃基板1 2與振動板1 7之間的距離形成爲保持一定的狀 態，因此，使得玻璃基板1 2之剝離帶電受到抑制。 因振動板1 7係爲導電性材料，故可容易地進行接地， 而形成可容易地進行靜電防止。 玻璃基板1 2係藉由超音波之作用，於瞬間由振動板17 飄浮而起。因此，係爲縮短作業時間，提昇生產性。 因使用長條狀之振動板1 7，相較於使用多數較短之振動 板的構造，係可減少振動板1 7之數目，並且亦可容易地進 行將各個振動板接地之作業。 在將收貨裝置Π作爲在液晶面板之製造程序之硏磨程 序中的載置部來使用，在硏磨處理後將玻璃基板1 2由載置 部移動時’爲可抑制玻璃基板1 2之剝離帶電。 其次，依據第5A圖至第6C圖來說明本發明之第二實施 -13- 1226867 例。本實施例與第1 A圖至第4圖之實施例相異點係爲， 在使被載置於振動板上之板狀構件由振動之表面飄浮而起 之際，將振動板構成爲可移動狀，以使對應於板狀構件之 撓曲而用以使各個振動板與板狀構件間之距離保持一定。 針對於與第1 A圖至第4圖之實施例相同部分，係賦予相 同符號而省略其詳細說明。 如第6 A圖至第6 C圖所示，在本實施例中，係設有三個 振動件1 5、1 1 5。在三個振動件1 5、1 1 5中之中央的振動 件1 5係被固定在支撐板Π 4之指定位置。用以夾持中央之 振動件1 5而設在兩側之兩個振動件1 1 5之振動板1 7，係 被設置成可移動狀，進而用以可調整中央之振動件1 5之振 動板1 7間之距離以及所形成的角度。各個振動板1 7係被 接第。此外，在第6A圖至第6C途中，係在圖面揭示支撐 中央振動板1 5之支撐板1 4，省略支撐兩側之振動件1 1 5 之支撐板1 4的圖式。 如第5A圖以及第5B圖所示，爲使支撐可移動之兩個移 動板1 7之振動件Π 5，分別沿著支撐板1 4上之一對導軌 2 5而固定在可移動的移動體2 6上。導軌2 5係被配設在與 振動板17之長邊方向（與第5A圖以及第5B圖之紙面垂直 的方向）正交之方向延伸。導軌25之上面係形成爲使其曲 率彎曲成與使玻璃基板1 2以飄浮狀態維持時之撓曲狀態 中的區域略爲相同狀。使孔1 4 a形成在支撐板1 4上，在其 扎之兩側部5又有導軌2 5。孔1 4 a係容許振動件1 1 5與移動 體26依同移動。移動體26係具備有在導軌25上轉動之車輪 1226867 2 6a。移動體26係被連結在固定於支撐板1 4上之線性引動 器2 7之衝桿2 8。移動體2 6係藉由線性引動器2 7之之驅 動而沿著導軌2 5移動。在移動體2 6與衝桿2 8間之連結部 分上，所採用之構造（例如，銷與長孔的組合）係可容許對 於移動體2 6之衝桿2 8的上下方向之相對移動。 如弟6 C圖所不’當玻璃基板1 2由與振動板1 7接觸之 狀態下而使玻璃基板1 2飄浮升起之際，首先，爲使各個振 動板1 7激發振動、使玻璃基板1 2由振動板1 7之表面如第 6B圖所示的飄浮。當玻璃基板1 2爲大型且較薄的情況下， 係因其本身重量而造成玻璃基板12撓曲、且造成玻璃基板 1 2與振動板1 7間之距離未形成一定狀。爲了避免該情況， 爲由第6 B圖之狀態而即刻使各個線性引動器2 7被驅動， 使移動體26移動至指定之位置。如第6A圖所示，兩側之 振動件1 1 5爲與振動板1 7 —同配合玻璃基板1 2之撓曲， 而移動至振動板1 7與玻璃基板1 2間之距離形成爲一定的 指定位置。其結果，即使在玻璃基板1 2中產生撓曲的情況 下，亦可將玻璃基板1 2與振動板1 7間之距離維持成一定， 而可抑制玻璃基板1 2之剝離帶電。 本實施例係添加第1 A圖至第4圖之實施例的優點，而 具有下述之優點。 局部之振動板1 7係對應於玻璃基板1 2之撓曲，用以將 振動板1 7與玻璃基板1 2間之距離維持成一定’而構成爲 可與振動件1 1 5 —同移動。從而，即使是對於大型、較薄、 且容易產生撓曲的玻璃基板1 2，亦可良好的抑制剝離帶 1226867 電。 以下，依據第7圖至第1 1 B圖，說明本發明之第三實施 例的收貨裝置1 1 1。 如第7圖所示，收貨裝置〗i i係具備有維持玻璃基板等 之板狀構件2 1 5的第一物體飄浮裝置1 1 2。第一物體飄浮 裝置係具備有形成矩形之振動板114a至U4e。振動板114a 至1 1 4e爲具有相互相同的大小。將設在與板狀構件2 ；[ 5 (以 鏈線所示）之四角對應之位置上的振動板設爲第一至第四 振動板1 l4a至1 14d，將設在與第一至第四振動板1 14a至 1 1 4d爲相等距離之位置上的振動板設爲第五振動板 114e。如弟8圖所不’在各個振動板114a至114e中，構 成激發振動裝置之角板1 1 6係分別在其前端中藉由未圖示 之螺絲來鎖緊。使各個振動板1 1 4a至1 1 4e分別接地。 如第8圖所示，形成圓錐台狀之角板1 1 6係在對應之振 動板114a至U4e之中央部份中，爲被安裝成角板116之 軸線與振動板1 1 4a至1 1 4e成正交狀。第一振動板至第五 振動板1 14a至1 14e係被配置成水平狀。角板116之前端 面係與振動件1 1 7之軸向正交。使角板1 1 6以及振動件1 1 7 連結而使角板1 1 6以及振動件1 1 7之各個中心軸位在一値 線上。 在振動件117中爲使用朗格分（音譯：Langevin)形。 振動件1 1 7係如第8圖所示，爲具備有形成一對環狀之壓 電元件1 1 8 a、1 1 8b。使形成環狀之電極板1 1 9配置在兩壓 電元件1 18a、1 1 8b間。兩個金屬塊120a、120b係被配置 1226867 成夾持電極板119以及兩壓電元件118a、118b。藉由未圖 示之螺栓而鎖緊固定金屬塊1 2 0 a、1 2 Ob，藉此以構成振動 件117。在金屬塊120a、120b中爲形成未圖示之螺孔，前 述螺栓係被螺鎖至前述螺孔。兩金屬塊1 2 0 a、1 2 0 b係經由 前述螺栓而相互成電氣性的導通。 在金屬塊120a中爲形成有突緣121。各個振動件117之 金屬塊120a係爲，在嵌合至形成在支撐板122之孔（未圖 示）之狀態下，藉由未圖示之螺栓而經由突緣1 2 1被固定在 支撐板122上。與固定有各個振動板U4a至114e之面爲 相反側之角板116之面上，爲固定有突緣121。電極板119 爲經由配線124a而被連接至震盪器123，震盪器123之接 地端子爲經由配線124b而被連接至金屬塊120b。藉由振 動件1 17、震盪器123而構成使第一至第五振動板U4a至 1 1 4 e激發振動的激發振動裝置。此外，在第7圖中，係省 略對於第一振動板114a、第三振動板114c以及第五振動板 114e的震盪器123之圖示。 其次，針對於在收貨裝置Π1與未圖示之般送裝置間所 進行之板狀構件2 1 5之移載作業（卸貨作業）的卸貨裝置 125進行說明。如第9圖所示，卸貨裝置125爲具備有可 往復作動之支撐部1 2 6、使支撐部1 2 6於第9圖之左右方 向往復作動之移動裝置1 2 7。支撐部1 2 6係作爲叉部機能 而形成爲長條狀，且具備有相互延伸成平行狀的第一以及 第二臂部 126a、126b。 如第7圖、第9圖、以及第1 0圖所示，形成長條狀之 1226867 第一以及第二振動板128a、128b爲被支撐在支撐部ι26。 詳細而言，如第1 0圖所示，爲使第二振動板1 2 8 b之第一 端部經由以振動件1 29所激發振動的角板3 〇而被固定在 支撐部K6上’第二振動板l28b之第二端部爲經由角板 1 3 1而被固定在第二臂部1 2 6 b之前端部。此外，即使是針 對於第一振動板1 2 8 a，亦與第二振動板1 2 8 b相同的被支 撐在第一臂部126a以及支撐部126。各個振動板128a、128b 係被接地。振動件1 2 9爲構成與收貨裝置1 1 1之振動件1 1 7 爲相同狀，而被連接至對應之震盪器1 32。藉由第一振動 板1 2 8 a、對應之振動件1 2 9、一對之角板1 3 〇、：[ 3〗、以及 對應之震盪器132而構成一個第二物體飄浮裝置133。 移動裝置127爲具備已具有環部127a之純量式之習知 的機械手臂。移動裝置1 2 7爲藉由未圖示之驅動機構而使 支撐部126往復移動、同時升降。卸貨裝置i 25係具備有 確認第一以及第二臂部126a、126b之高度的感測器（未圖 示）。 其次，說明構成如前所述之裝置的作用來進行說明。 收貨裝置111係爲，各個振動板114a至11 4e爲將板狀 構件2 1 5進行飄浮維持。亦即，藉由震盪器1 2 3之驅動， 而使振動件1 17以指定之共振頻率（例如，2〇kHz前後）來激 發振動，角板1 1 6爲進行縱向振動。經由角板1 1 6而使對 應之振動板1 14a至1 14e激發振動、進行撓曲振動。各個 振動板114a至114e爲藉由進行撓曲振動而由各個振動板 114a至IMe產生音波（駐波）。藉由由各個振動板IMa至 1226867 構件 距離 以上 間之 發振 1112 ，首 狀構 臂部 l 127 之卸 振動 15上 15與 爲使 波而 128b 浮裝 使兩 退、 裝置 1 1 4 e所放射之音波的放射壓，如第1 1 A圖所示，板狀 2 1 5爲由振動板1 1 4 a至1 1 4 e之表面所飄浮升起。飄浮 係爲1mm以下，例如爲在1 00 // m以上、且3 0 0 // m 之範圍。使各個振動板1 1 4 a至1 1 4 e與板狀構件2 1 5 距離G形成爲一定狀而使得振動板1 1 4 a至1 1 4 e之激 動狀態受到控制，抑制剝離帶電以及靜電之產生。 其次，藉由卸貨裝置125來進行在第一物體飄浮裝g 上維持呈飄浮狀態的板狀構件2 1 5的卸貨作業。亦即 先，停止未圖不之搬送裝置，如第11A圖所示在使板 件2 1 5於指定位置上維持呈飄浮狀態的狀態下，使兩 126a、126b配置在進入準備位置。由該狀態使移動裝濯 受到驅動，使支撐部1 26前進至與板狀構件2 1 5對應 貨位置。其次，如第1 1 B圖所示，板狀構件2 1 5與兩 板128a、128b間之距離GG，係形成爲使板狀構件2 升至與開始卸貨作業前（參照第1 1 A圖）之板狀構件2 振動板11 4 a至1 1 4 e間之距離G G形成相等。並且， 板狀構件2 1 5藉由由兩振動板1 2 8 a、1 2 8 b所產生之駐 被維持飄浮。之後，將板狀構件2 1 5與兩振動板1 2 8 a、 間之距離GG維持成一定，用以幾乎無因第一物體飄 置1 1 2所造成之對於板狀構件2 1 5之飄浮力的影響而 臂部l26a、126b上升至指定筒度。其次，支撐部126後 且使板狀構件2 1 5連同卸貨裝置1 2 5之第二物體飄浮 133 —起移動。 其次，在使臂部126a、126b移動至與未圖示之搬送裝 1226867 置對應之指定位置之後，爲使臂部i 2 6 a、1 2 6 b下降、 狀構件2 1 5移載至前述搬送裝置上。亦即，板狀構件 在由收貨裝置1 1 1移載至搬送裝置之間，係以非接觸 來移動。 本實施例係具有以下之優點。 板狀構件2 1 5係以非接觸狀態而由第一物體飄浮 1 1 2上移載至第二物體飄浮裝置丨3 3上。將板狀物體 寄行飄浮維持之各個物體飄浮裝置1 1 2、1 3 3之各個振 1 1 4 a至1 1 4 e、1 2 8 a、1 2 8 b係被接地。爲使各個振動板 至1 1 4 e、1 2 8 a、1 2 8 b與板狀構件2 1 5間之距離G G形 一定狀而控制各個振動板1 1 4 a至1 1 4 e、1 2 8 a、1 2 8 b 發振動狀態，而使靜電的產生受到抑制。從而，將無 置去靜電器（Ionizer)等去電裝置。 在本實施例中，爲了抑制靜電之產生係無須減緩卸 速度。因此，係可縮短作業時間、提昇生產性。 藉由在板狀構件2 1 5中較小的多數之振動板1 1 4 I 1 4 e而使板狀構件2 1 5被飄浮維持，因此，相較於使 條狀之振動板的構造，係容易的將振動板1 1 4 a至1 Η 設成不致與卸貨裝置1 2 5產生干涉。 其次，基於第1 2圖說明在本發明之第四實施例中 貨裝置2 1 1。收貨裝置2 1 1係具備搭載有第一物體飄 置2 1 2的台車2 3 3。第一物體飄浮裝置2 1 2爲具備振 II 4 a至114 6以及振動件417。第一物體飄浮裝置212 板狀構件2 1 5維持在飄浮狀態。經由形成圓柱狀之 使板 2 15 狀態 裝置 2 15 動板 114a 成爲 知激 須設 貨的 a至 用長 e配 之收 浮裝 動板 爲將 角板 -20- 1226867 1 4 Ο，各個振動板1 1 4 a至1 1 4 e係被支撐在對應之振動件4 1 7 上。各個振動件4 1 7係以使各個振動板11 4a至1 1 4e位於 水平狀而被固定在支撐架1 3 4上。各個振動件4 1 7係被連 接至震盪器1 2 3。板狀構件2 1 5係以被飄浮維持在第一物 體飄浮裝置2 1 2之狀態下，伴隨於台車2 3 3之移動而搬送 至指定之位置。 以下，基於第1 3圖至第1 5圖說明本發明之第五實施例 之收或裝置3 1 1。本實施例係爲，在第7圖之收貨裝置1 1 1 之構造中追加有多數之去電刷213之點爲與第7圖至第 1 1 B圖之實施例相異。此外，與第7圖至第1 1 B圖之實施 例爲相同部份爲賦予相同符號，省略該說明。 如第13圖所示，在第一以及第二振動板114a、114b之 間、第一以及第三振動板1 1 4 a、1 1 4 c之間、第三以及第四 振動板U4c、lMd之間、第二以及第四振動板114b、114d 之間，爲分別在不與卸貨裝置1 2 5產生干涉之位置上設有 去電刷2 1 3。各個去電刷2 1 3係被接地。如第1 4圖所示， 各個去電刷213係具有支撐板213a。在支撐板213a上爲 設有多數之導電性纖維2 1 3b。去電刷2 1 3係被配置成將去 電刷2 1 3之前端面、亦即導電性纖維2 1 3b之前端部位於與 對向至板狀構件215之第一至第四振動板1 1 4a至11 4d之 面爲略同一面上（參照第1 5圖）。由去電刷2 1 3之前端面至 板狀構件2 1 5爲止的距離係形成爲與第一至第四振動板 1 1 4a至11 4d之面和板狀構件2 1 5間之距離略爲相同。具 體而沿’爲使去電刷2 1 3之導電性纖維2 1 3 b之前端部與板 1226867 狀構件2 1 5之對向面間之距離維持在1 mm以下。因此，係 可藉由非接觸狀悲而去除因去電刷2 1 3在板狀構件2 1 5上 所造成之帶電的電荷。此外，無須另外設置用以進行已帶 電之板狀構件2 1 5之去電的時間，而可在搬送時間中效率 爲佳地進行去電。 說明在本實施例中藉由卸貨裝置1 2 5所進行之卸貨十乍 業。在本實施例中’爲使被飄浮維持在未圖示之搬送裝置 上的板狀構件2 1 5移載至收貨裝置2 1 1之第一物體飄浮裝 置1 12上。 φ 停止前述搬送裝置之移動，在使板狀構件2 1 5以在指定 位置上維持呈飄浮狀態的狀態中，使兩臂部126a、l26b配 置在進入準備位置。由該狀態使移動裝置1 2 7驅動，藉由 使支撐部126前進移動而使兩臂部126a、126b配置在與板 狀構件2 1 5對應之卸貨位置上，之後爲上升至指定位置。 板狀構件2 1 5爲藉由由兩振動板1 2 8 a、1 2 8 b所產生之駐波 而被維持飄浮。在使臂部126a、126b上升至幾乎無因搬送 裝置之物體飄浮裝置所造成對於板狀構件2 1 5之飄浮利之 ® 影響的指定高度後，使支撐部126後退、使板狀構件215 由搬迭:裝置上移動。並且，在使兩臂部126a、126b前進移 動至與收貨裝置3 1 1對應之指定位置爲止之後，使兩臂部 _ 126a、12 6b下降、將板狀構件215移載至收貨裝置311上。 · 從而’以未圖示之搬送裝置而被搬送至與收貨裝置311對 應之位置的板狀構件2 1 5，係藉由卸貨裝置225而以非接 觸狀態由搬送裝置上移載至第一物體飄浮裝置1 1 2上。 -22- 1226867 收貨裝置3 1 1係將板狀構件2〗5維持在飄浮狀態之期 間’將板狀構件2 1 5與第一至第五振動板i i 4 a至1 1 4 e間 之距離調整成1 mm以下。藉由使第一至第五振動n 4 a至 1 14e接地、以及使板狀構件215與第一至第五振動板〗14a 至1 1 4e間之距離調整成1 mm以下，藉此，在板狀構件2 i 5 帶電之情況下，爲以非接觸狀態下進行板狀構件2 1 5之去 電。 本實施例係具有以下之優點。 將已帶電之板狀構件2 1 5藉由由第一至第五振動板1 1 4a 至1 1 4e所產生之音波的放射壓，而由第一至第五振動板 1 1 4a至1 1 4e維持在飄浮狀態。藉由將板狀構件2 1 5與第一 至第五振動板1 1 4 a至1 1 4 e間之距離調整爲1 mm以下，而 在非接觸狀態下進行板狀構件2 1 5之去電。從而，無須使 用去靜電器（Ionizer)等高價位的去電裝置，而可藉由非接 觸狀態來去除於板狀構件2 1 5中帶電的電荷。再者，藉由 去電刷2 1 3係可確實的將板狀構件2 1 5之靜電進行去電。 板狀構件2 1 5之去電之際，係可將板狀構件2 1 5與第一 至第五振動板Π 4a至1 1 4e間之距離跨越板狀構件2 1 5之 全面而維持成均勻狀，因此可抑制靜電的產生。 兩振動板128a、128b係被接地。因此，在以卸貨裝置 125進行卸貨作業期間，係可去除在板狀構件215中帶電 的局部電荷。 使第一至第四振動板1 至1 l4d分別配置在與板狀構 件215之四角對應之處，在鄰接之振動板1 14a至1 14e間 -23- 1226867 配設有去電刷2 1 3。從而，相較於使用長條狀之振動板， 爲可容易的將去電刷2 1 3以不至與卸貨裝置1 2 5產生千涉 之狀態下進行配設。 其次’基於第1 6圖，針對於在本發明之第六實施例中 之卸貨裝置2 2 5而進行說明。本實施例之卸貨裝置2 2 5係 爲，在第1 3圖之卸貨裝置1 2 5中裝設有多數之去電刷2 1 3。 不過，於第16圖中所示之兩臂部126a、126b之寬度係形 成爲寬於第13圖中所示之兩臂部126a、126b之寬度。沿 著振動板1 2 8 a、1 2 8 b之長邊方向上、對應於振動板1 2 8 a、 12 8b之兩側的位置上，爲設有去電刷213。各個去電刷213 之前端部爲配置成位於略與和板狀構件2 1 5對向之振動板 128a、128b之面爲同一面上。即使在本實施例中，藉由卸 貨裝置22 5而在飄浮狀態（非接觸狀態）所卸下的板狀構件 2 1 5，係在被維持在卸貨裝置22 5之期間爲效率較佳地進行 去電。 其次，基於第1 7圖而針對於在本發明之第七實施例中 之卸貨裝置3 2 5進行說明。本實施例係爲在第1 3圖之卸貨 裝置125中，在各個臂部126a、126b上裝備有多數（在第 1 7圖中爲三個）振動板3 3 4，以取代形成爲長條狀之振動板 1 2 8 a、12 8 b。各個振動板3 3 4係經由角板1 1 6而被支撐在 未圖示之振動件上。各個振動板3 3 4係被接地的同時，爲 在相鄰接的振動板3 3 4之間配設有去電刷2 1 3。亦即振動 板3 3 4與去電刷2 1 3係沿著支撐部1 2 6之往復動作方向而 交互配置。即使在此種情況下，藉由卸貨裝置1 2 5而在飄 -24- 1226867 浮狀態下所卸貨的板狀構件2 1 5，係可在維持於卸 1 2 5之期間效率爲佳的被去電。此外，即使不增大 12 6a、l26b之寬度，亦可將去電刷213裝設至臂部 126b ° 此外，亦可將實施例變更爲例如如下所述。 在第5A圖至第6C圖之實施例中，在玻璃基板 薄、大型且易撓曲的情況下，用以替代將玻璃基板 方成凸狀撓曲狀地進行飄浮維持，亦可將玻璃基板 方成凸狀撓曲狀地進行飄浮維持。 在第5 A圖至第6C圖之實施例中，作爲對應於玻 1 2之撓曲而將玻璃基板1 2與振動板1 7間之距離G 一定狀的構造，用以替代將移動體26沿著導軌25 之構造，係可將支撐振動件1 1 5之支撐板設成可藉 裝置來進行升降，亦可藉由可傾斜動作狀的將振動 設置在支撐板上。即使是在此種情況下，藉由組合 傾斜動作，係可將玻璃基板1 2與振動板1 7間之距 整至指定之値。 在第1A圖至第6C圖之實施例中，角板16之寬 未與振動板1 7之寬度相同，係可較振動板1 7之寬度 或是爲窄。較希望係爲大於振動板1 7之寬度爲佳。 第12圖之台車233亦可藉由導體所形成。在此 下，爲使各個振動板114a至114e、128a、128b以 的連接至台車2 3 3。也因此，各個振動板1 1 4 a至 128 a、128b之電位係形成爲一定。 貨裝置 兩臂部 126a' 1 2爲較 12於下 12於上 璃基板 維持成 所移動 由升降 件115 升降與 離G調 度易可 爲寬、 種情況 電氣性 1 1 4e、 -25 - 1226867 在第1 3圖至第！ 7圖之各個實施例中，使板狀構件2 j 5 移載至收貨裝置3 1 1、4 1 1之裝置並非被限定在以非接觸狀 態來進行卸貨的卸貨裝置1 2 5，亦可將板狀構件2〗5搬送 至收貨裝置311、411、移載至收貨裝置311、411。收貨裝 置3 1 1、4 1 1係在接收板狀構件2 1 5之後，爲將板狀構件 2 1 5維持在飄浮狀態，直到使板狀構件2 ][ 5爲藉由卸貨裝 置1 2 5而被卸貨至其他場所，以去除在板狀構件2丨5中所 帶電的電荷。 在第13圖至第17圖之各個實施例中，並未在收貨裝置 3 1 1、4 11中設置去電刷2 1 3，而亦可使僅將振動板1 1 4a至 1 1 4e與板狀構件2 1 5間之距離調整成1 mm以下，去除在板 狀構件2 1 5中所帶電的電荷。然而，藉由倂用去電刷2 1 3 係可提昇去電效率。 在第1 3圖至第1 7圖之各個實施例中，亦可將板狀構件 215與第五振動板1 14a至1 14e間之距離調整成1mm以下， 使用去靜電器（Ionizer)而進行去電。在此種情況下，於剝 離帶電之中，爲藉由飄浮來抑制在去靜電器（Ionizer)中所 無法抑制阻斷之靜電的產生。再者，係在振動板與板狀構 件間爲具有空氣層之狀態下藉由去靜電器（Ionizer)來進行 去電，因此，係可經度爲佳地進行去電（爲將靜電抑制在數 1〇至lkV以下）。 在第1 A圖至第1 7圖之各個實施例中振動件1 5、1 1 5、 1 1 7、1 29、4 1 7並非限制在朗格分（音譯：Lang ev in )之振 動件，亦可使用其他的振動件。 -26- 1226867 第1 A圖至第1 7圖之各個實施例中，在增大各個振動板 的面積、板狀構建爲較小的情況下，並非一定要將振動板 接地。在此種情況下，振動板本身係達到接地之作用。 第1A圖至第17圖之各個實施例中，在振動板17中並 非被限制在經由直接配線而連接至地面的方法，亦可將支 撐板1 4或是收貨裝置1 1之框架由導電性材料所形成，將 其與地面之間經由配線而進行接地。 在第1 A圖至第1 7圖之各個實施例中，板狀構件並非被 限制在玻璃基板1 2，亦可爲其他物體、例如亦可爲半導體 晶圓。 在第1 A圖至第1 7圖之各個實施例中，對於振動板之角 板之固定並非被限定在藉由螺絲來鎖緊之固定，亦可使用 接著劑、或是以焊接或熔接來固定。 在第1 A圖至第1 7圖之各個實施例中，用以取代將振動 板進行接地而亦可將各個振動板設爲相同電位。例如，若 是連接至體積爲大於各個振動板之導體時，各個振動板之 電位係形成與導體之電位爲相同狀，而各個振動板之電位 係形成爲一定。 【圖式簡單說明】 第1 A圖係爲在將本發明具體化之第一實施例中之收貨 裝置的模式立體圖。 第1 B圖係爲第1 A圖之收貨裝置之側面圖。 第2A圖係爲使玻璃基板載置於振動板上之狀態的模式 圖。 -27- 1226867 第2 B圖係爲玻璃基板已飄浮之狀態的模式圖。 第3圖將玻璃基板剝離時之時間與電位之關係的圖表。 第4圖係爲說明作用之模式圖。 第5 A圖所示係爲在本發明之第二實施例中之剝離帶電 抑制裝置的側面圖。 第5 B圖所示係由第5 A圖之剝離帶電抑制裝置去除振動 板之該裝置的平面圖。 第6 A圖係爲說明第5 A圖之裝置作用的側面圖。 第6B圖係爲說明第5 A圖之裝置作用的側面圖。 第6C圖係爲說明第5 A圖之裝置作用的側面圖。 第7圖係爲在本發明之第三實施例中之收貨裝置以及卸 貨裝置的立體圖。 第8圖所示係爲設在第7圖之收貨裝置之角板與振動件 的正面圖。 第9圖係爲第7圖之卸貨裝置的平面圖。 第1 0圖係爲第7圖之卸貨裝置的側面圖。 第Π A圖所示係爲使板狀構件載置於第7圖之收貨裝置 上之狀態的模式圖。 第Π B圖所示係爲第7圖之卸貨裝置之卸貨時之狀態的 模式圖。 第1 2圖係爲在本發明之第四實施例中之收貨裝置的側 面圖。 第1 3圖係爲在本發明之第五實施例中之收貨裝置以及 卸貨裝置的立體圖。 -28- 1226867 第1 4圖係爲在第1 3圖之收貨裝置中所具備的去電刷之 圖式。 第1 5圖所示係爲使板狀構件載置於第1 3圖之收貨裝釐 上之狀態的示意圖。 第16圖所示係爲在本發明之第六實施例中之卸貨裝置 的平面圖。 第1 7圖所示係爲在本發明之第七實施例中之卸貨裝® 的平面圖。 φ 【主要部分之代表符號說明】 11 :收貨裝置 1 1 2 :第一物體飄浮裝置 1 14a〜1 14e ··振動板 1 2 :玻璃基板 12 0a ：金屬塊 1 2 0 b :金屬塊 1 2 1 :突緣 _ 1 2 5 :卸貨裝置 1 2 6 :支撐部 1 2 6 a :臂部 - 1 2 6 b :臂部 . 127 :移動裝置 1 2 7 a :環部 1 3 :物體飄浮裝置 1 3 3 :第二物體飄浮裝置 -29- 1226867 1 34 :支撐架 1 4 :支撐板 1 4 0 :角板 14a :孔 1 5 :振動件 1 6 :角板 1 6 a :錐體 1 7 :振動板 1 9 a :壓電元件 19b :壓電元件 2 0 :電極板 2 1 3 :去電刷 2 13b :導電性纖維 2 1 5 :板狀構件 2 1 a :金屬塊 2 1 b :金屬塊 2 2 :突緣 23 :震盪器 2 3 3 :台車 2 5 :導軌 2 6 :移動件 27 :線性引動器1226867 玖, Description of the invention:  [Technical field to which the invention belongs] The present invention relates to a method for conveying a plate-shaped member such as a glass substrate or a semiconductor wafer of a liquid crystal panel. Used to suppress electrostatic charge in plate-like members, Generating static electricity, There are also techniques for de-energizing a plate member that has been charged.  [Prior art] When separating two objects in contact, In terms of contact interfaces, Partial charge carriers moving from one side to the other are returned to one side, And · Local charge carriers remaining on the surface form static electricity. Charge transfer at contact is not only insulators' Even the individual metals as conductors will cause charge transfer at contact. thereby, If the individual metals maintained by the insulator are brought into contact, When they are peeled from each other, It will be charged (peel-off charging).  In addition, "when transporting a charged object in a floating state (non-contact state)" when the distance G between the charged object and a supporting member that supports it in a floating state changes, Static electricity will be generated.  In the manufacturing process of a liquid crystal panel or the manufacturing process of a semiconductor device, It is necessary to transfer glass substrates or semiconductor wafers between many processes. When the plate-like member is moved from the mounting portion, This will cause the above-mentioned peeling charging. Especially in processes that are prone to static electricity, such as a grinding process or a lamination process, which is one of the manufacturing processes of LCD panels, When the plate-like member is moved from the mounting portion, The electrification will increase due to the peeling of the electrification. In addition, the charge amount of the peeling charge increases as the peeling speed is accelerated. So ’in terms of reducing charge, In order to slow the peeling speed, Also, 1226867 slows down the speed of lifting the plate-like member from the mounting portion. the result, Cause increased operating time, Reduce productivity.  When the plate-like member is charged, Deionization devices such as deionizers remove or neutralize static electricity from charged objects. The de-energizing device is not a device for preventing or inhibiting the peeling of the electrification. In the case of using a de-brushing device which is a cheaper de-ionizing device for the deionizer, the distance between the front end of the de-brushing brush and the object to be de-battered is generally set to several mm. but, At this distance, The effect of removing static electricity from a charged object is low. In addition, When using an Ionizer, If there is an air layer between the target object and the mounting part, it ’s difficult to remove electricity. It also causes difficulty in removing electricity from the object facing the mounting portion.  SUMMARY OF THE INVENTION The first object of the present invention is to When the plate-like member is moved from the mounting portion, In order to suppress the peeling and charging of the plate-like member to the optimal state, Simultaneously, It is also possible to suppress the generation of static electricity when the plate-shaped member receives and transfers. The second purpose is to de-energize the charged plate-like member to an optimal state.  To achieve this, The present invention provides a method for controlling peeling and charging of a plate-like member as described below. The control method of peeling charge is When the plate-like member placed on the placement portion is moved from the placement portion, Equipped with a radiating pressure that generates sound waves by exciting the mounting part, Further, the plate-like member is caused to float from the mounting portion.  The present invention also provides a peeling charging control device as described below. The peeling live control device is, When the plate-shaped member 1226867 placed on the placement portion is peeled off by the placement portion, To suppress the electrification of the plate-like member. The mounting portion is formed by an object floating device. The object floating device is provided with: Vibration plate, It is made of conductive material on which plate-shaped members can be placed; Excitation vibration device, The vibration plate is excited. The plate-shaped member floats from the surface of the vibration plate by the radiation pressure of the sound wave from the vibration plate excited by vibration. The vibration plate is grounded.  The present invention further provides a discharging method as follows, It is used to transfer the plate-shaped member from the first object floating device to the second object floating device. The first and second object floating devices are each provided with a plurality of vibration plates formed of a conductive material. The first and second object floating devices respectively float and maintain the plate-like member by radiating pressure of sound waves generated by vibrations of the respective vibration plates. The second object floating device is further provided on a reciprocating support portion. When the plate-shaped member is transferred from the first object floating device to the second object floating device, In order to set the vibration plates of the first object floating device to the same potential as each other, Or while grounding, Set the vibration plates of the second object floating device to the same potential as each other, Or in a grounded state, It is adjusted so that the distance between the vibration plate of each object floating device and the aforementioned plate-like member is constant.  The present invention further provides a cargo unloading device as described below. The unloading device is equipped with a support section, Department can move back and forth; Mobile device, To make the support move back and forth;  Object floating device, In order to make use of the radiation pressure of sound waves generated by vibrating a plurality of vibration plates formed of a conductive material, The plate-like member is maintained in a floating state. The vibration plate is grounded, Or the vibration plates are set to the same potential as each other.  The present invention further provides a receiving device as described below. The receiving device includes a plurality of vibration plates made of 1226867 conductive material. By using the radiation pressure of the sound wave generated by exciting the vibration plate, An object floating device that maintains the plate-shaped member in a floating state is provided on the moving body. The vibration plates are at the same potential as each other. Or the vibration plates are grounded to each other.  The present invention also provides a method for removing electricity from a plate-shaped member as described below. Outgoing method: Floating maintenance steps, The radiation pressure of a sound wave generated by exciting a vibration plate made of a conductive material is used. The charged plate-shaped member is floated and maintained; Outgoing steps, With the vibration plate grounded, Adjust the distance between the plate-shaped member and the vibration plate to 1 mm or less. The plate-like member is de-energized.  The invention also provides a method for removing electricity from other plate-shaped members. The call removal method package contains: Floating maintenance steps, The radiation pressure of a sound wave generated by exciting a vibration plate made of a conductive material is used. Floating and maintaining the charged plate-like components; Adjustment steps, With the vibration plate grounded, Adjust the distance between the plate-like member and the vibration plate to 1 mm or less;  Outgoing steps, The plate-shaped member is de-energized using an Ionizer.  The present invention also provides an unloading device for other plate-like members. Unloading device system Support, Department can move back and forth; Mobile device, To move the support back and forth; Object floating device, It has many vibration plates. The object floating device is equipped on the support, In order to make use of the radiation pressure of sound waves generated by exciting each vibration plate, The plate-like member is maintained in a floating state. Each vibration plate system is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same plane as the surface facing the vibration plate facing the plate-like member.  1226867 The present invention provides another receiving device. The receiving device is equipped with an object floating device, It uses the radiation pressure of sound waves generated by the vibration of most vibration plates, The plate-like member is maintained in a floating state. Each vibration plate system is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same plane as the face of the vibration plate facing the plate-like member.  [Embodiment] The following, Based on Figures 1A to 4 A first embodiment embodying the present invention in the manufacturing process of a liquid crystal panel will be described.  As shown in Figure 1 A, The receiving device 11 ′, which is a device for preventing the peeling and charging, is constituted by an object floating device 13. It has a function of a mounting portion capable of temporarily placing a glass substrate 12 (illustrated by a chain line) as a plate-like member. The object floating device 1 3 is provided on a support plate i 4 arranged horizontally. The object floating device 13 includes a plurality of vibration plates 17 (two in this embodiment) formed of a conductive material. The long-side direction end portions of the respective vibration plates are connected to the vibration members 15 through the corner plates 16 respectively. The two vibration plates 17 and 7 are arranged parallel to each other, and, In order to form an elongated rectangle narrower than the width of the glass substrate 12. The glass substrate 12 is supported by the two vibration plates 17, Or be maintained by the float. Each vibration plate 17 is grounded.  Each angle plate 1 6 series is, In its front end, It is screwed to the corresponding vibration plate 17 by a plurality of screws 18. Each corner plate 16 is vibrated by the corresponding vibration member 15. Each corner plate 16 is formed into a flat and slightly rectangular parallelepiped shape. A conical cone 16a is fixed to the lower surface of the corner plate 16. The cone 16a is, The vibrating member 15 is fixed to a surface on the opposite side to the surface of the corner plate 16. The axis of the drizzle before the angle plate 1 6 -10- 1226867 1 5 The axis is orthogonal, The axis of the corner plate 16 and the axis of the vibration member 15 are coaxial and extend in the vertical direction. In addition, In Figure 1 A and Figure 1 B, Ignore the angle plate 1 6, Cone 1 6a, And the size ratio of the vibrator is drawn.  In the vibration member 15, the Lange points are used (transliteration: Langevin) shaped vibrator. Each vibration member 15 is shown in FIG. 1B, In order to have a pair of piezoelectric elements 19a, 1 9b, In the two piezoelectric elements 19a, Between 19b, a ring-shaped electrode plate 20 is arranged. Make two metal blocks 2 1 a, 2 1 b is configured to hold the electrode plate 20 and the two piezoelectric elements 19 a, 19b, Tighten and fix the two metal blocks with bolts not shown 2 1 a, 2 1 b, Thereby, the vibrating element 15 is constituted. The bolts are: Is inserted into a hole (not shown) formed in the metal block 21b, At the same time, it is screwed to the aforementioned screw hole formed in the metal block 21a. Two metal blocks 2 1 a, 2 1 b is electrically connected to each other via a bolt. A flange 22 is formed in the metal block 2 1 a. The metal block 2 1 a of each vibration member 15 is in a state of being fitted into a hole (not shown) of the support plate 14 in a fitted shape. A bolt (not shown) is fixed to the support plate 14 via a flange 22.  Each vibration member 15 is connected to a corresponding oscillator 23. Each electrode plate 20 is connected to a corresponding oscillator 23 via a wiring 24a, The ground terminal of the oscillator 23 is connected to the metal block 21b via the wiring 24b. Constructed with angle plates 16, Cone 16a, Vibration piece 15, And the oscillator 23 excites the vibration device to excite the vibration plate 17. In addition, In Figure 1 A,  Only the oscillators 2 3 of the vibrating members 15 connected to one of the object floating devices 13 are disclosed.  The function of the device constructed as described above will be described.  The 1226867 harvesting device 1 1 is provided as a placement part in a process that is likely to generate static electricity, such as a honing process or a bonding process. When honing or bonding, In order to stop the driving of the aforementioned excitation vibration device, The glass substrate 1 2 is supported while being in contact with the vibration plate 17.  When the glass substrate 12 is moved by the vibration plate 17, the excitation vibration device is driven. that is, Drive oscillator 23, Make the vibrator 15 at a specified resonance frequency (for example, Around 20kHz) excitation vibration, Perform longitudinal vibration And the deflection vibration of the vibration plate 17 is excited by the corner plate 16. A standing wave is generated on the vibration plate 17. in this way, As shown in Figure 2A, The glass substrate 12 which has been supported on the vibration plate 17 in the contact state is shown in FIG. 2B by the radiation pressure of the sound wave radiated from the vibration plate 17. Floating from the surface of the vibration plate 17. The floating distance is, for example, a range from 1 0 0 // m to 3 0 0 // m, It is exaggeratedly illustrated in FIG. 2B.  When separating two objects in contact, Generally speaking, this is to cause peeling and charging. Even in the case of the glass substrate 12, When one end of the glass substrate 12 is held by manual operation and the vibration plate 17 is peeled off, The glass substrate 12 is charged with a great charge. on the other hand, When the object floating device 1 3 is operated and the vibration plate 17 is peeled from the glass substrate 12, Although the potential of the glass substrate 12 will increase to some extent, but, The amount of increase in the potential is reduced to approximately 1/10 of the case where the glass substrate 12 is held by one hand and detached from the vibration plate 17 by manual operation. The status is shown in the chart in Figure 3.  As shown by the dotted line in Figure 3, In the case where the glass substrate 12 is simply separated by the vibration plate, This is to reduce the potential of the glass substrate 12 2 after it has been increased to approximately 400 V in a short time. on the other hand, As shown by the solid line in Figure 3, When the glass substrate 12 is peeled from the vibration plate 17 using the object floating device 13, The potential of the glass substrate 12 is increased slightly and polymerized at a low potential. Although the reason is not clear, but, In the case of sound waves floating, in order to maintain a constant distance between the glass substrate 12 and the vibration plate 17, And the distance G is small, So as shown in Figure 4, It can be judged that the glass substrate 12 and the vibration plate 17 can function as capacitors.  This implementation has the following advantages.  When the glass substrate 12 is moved by the vibration plate 17, Vibrating the vibration plate 17 to generate treble waves, The glass substrate 12 is floated from the vibration plate 17 by the radiation pressure of sound waves. The distance between the glass substrate 12 and the vibration plate 17 is maintained at a constant state by the action of the sound wave from the vibration plate 17 therefore, This makes it possible to suppress the peeling and charging of the glass substrate 12.  Since the vibration plate 17 is a conductive material, So it can be easily grounded,  On the other hand, static electricity prevention can be easily performed.  Glass substrates 1 and 2 are made by ultrasonic waves. It floats up from the vibration plate 17 at an instant. therefore, In order to reduce operating time, Improve productivity.  Due to the use of a long diaphragm 17 Compared to the construction using most short diaphragms, Can reduce the number of vibration plates 17 Furthermore, the operation of grounding each vibration plate can be easily performed.  The receiving device Π is used as a mounting portion in a honing process of a manufacturing process of a liquid crystal panel, When the glass substrate 12 is moved from the mounting portion after the honing process, the peeling and charging of the glass substrate 12 can be suppressed.  Secondly, The second embodiment of the present invention will be described with reference to FIGS. 5A to 6C. The difference between this embodiment and the embodiments of FIGS. 1A to 4 is:  When the plate-like member placed on the vibration plate is caused to float from the vibrating surface, The vibration plate is configured to be movable, The distance between each vibration plate and the plate-like member is kept constant in accordance with the deflection of the plate-like member.  Aiming at the same parts as the embodiments in FIGS. 1A to 4, The same symbols are assigned and detailed descriptions are omitted.  As shown in Figures 6A to 6C, In this embodiment, There are three vibrating parts. 1 1 5. In three vibrating parts 1 5, The central vibration member 15 in 1 1 5 is fixed at a designated position of the support plate Π 4. A vibrating plate 1 7 for holding two vibrating members 1 1 5 on both sides for clamping the vibrating member 15 in the center, The system is set to be movable, Furthermore, it can be used to adjust the distance and the angle formed between the vibration plate 15 and the vibration plate 15 in the center. Each of the vibration plates 17 is connected. In addition, On the way from Figures 6A to 6C, The supporting plate 1 4 supporting the central vibration plate 15 is revealed in the drawing, The illustration of the supporting plate 14 supporting the vibration members 1 1 5 on both sides is omitted.  As shown in Figures 5A and 5B, In order to support the vibrating member Π 5 of the two movable plates 17 that are movable, Each pair of guide rails 2 5 on the support plate 14 is fixed to the movable body 26. The guide rails 25 and 5 are arranged to extend in a direction orthogonal to the long-side direction of the vibration plate 17 (direction perpendicular to the paper surface in Figs. 5A and 5B). The upper surface of the guide rail 25 is formed so that the curvature thereof is slightly the same as the area in the deflected state when the glass substrate 12 is maintained in a floating state. The hole 1 4 a is formed in the support plate 14, There are guide rails 25 on both sides 5 of the tie. The hole 1 4 a allows the vibrator 1 15 to move in accordance with the moving body 26. The moving body 26 is provided with wheels 1226867 2 6a that rotate on a guide rail 25. The moving body 26 is a punch 28 connected to a linear actuator 27 which is fixed to a support plate 14. The moving body 26 is moved along the guide rail 25 by the drive of the linear actuator 27. On the connecting part between the moving body 26 and the punch 28, Adopted construction (for example, The combination of the pin and the long hole) allows relative movement in the up-down direction with respect to the punch 28 of the moving body 26.  As shown in Figure 6C, when the glass substrate 12 is brought into contact with the vibration plate 17 and the glass substrate 12 floats up, First of all, In order for each vibration plate 17 to excite vibration, The glass substrate 12 is caused to float from the surface of the vibration plate 17 as shown in Fig. 6B. When the glass substrate 12 is large and thin,  The glass substrate 12 is deflected due to its own weight, In addition, the distance between the glass substrate 12 and the vibration plate 17 is not constant. To avoid this,  In order to immediately drive the linear actuators 27 from the state of FIG. 6B,  The moving body 26 is moved to a designated position. As shown in Figure 6A, The vibration members 1 1 5 on both sides are the same as those of the vibration plate 1 7 —the bending of the glass substrate 12  On the other hand, the distance between the vibration plate 17 and the glass substrate 12 is fixed to a predetermined position. the result, Even when deflection occurs in the glass substrate 12, The distance between the glass substrate 12 and the vibration plate 17 can also be maintained constant.  In addition, peeling and charging of the glass substrate 12 can be suppressed.  This embodiment adds the advantages of the embodiments of FIGS. 1A to 4, It has the following advantages.  The local vibration plate 17 corresponds to the deflection of the glass substrate 12 In order to maintain a constant distance between the vibration plate 17 and the glass substrate 12, it is configured to be movable together with the vibration member 1 1 5. thereby, Even for large, Thinner,  And glass substrates 1 2 which are prone to deflection, Can also well suppress the peeling tape 1226867 electricity.  the following, According to Figures 7 to 1 1 B, A receiving device 1 1 1 according to a third embodiment of the present invention will be described.  As shown in Figure 7, Receiving device i i is a first object floating device 1 1 2 having a plate-like member 2 1 5 that holds a glass substrate or the like. The first object floating device is provided with rectangular-shaped vibration plates 114a to U4e. The vibration plates 114 a to 1 1 4e have the same size as each other. Will be provided with the plate-like member 2; [5 (indicated by the chain line) The vibration plates at the positions corresponding to the four corners are set to the first to fourth vibration plates 1 14a to 1 14d, The vibration plate provided at a distance equal to the first to fourth vibration plates 114a to 114d is referred to as a fifth vibration plate 114e. As shown in FIG. 8 ', in each of the vibration plates 114a to 114e, The corner plates 1 1 6 constituting the vibration excitation device are respectively locked in the front end thereof with screws (not shown). Each of the vibration plates 1 1 4a to 1 1e is grounded.  As shown in Figure 8, The corner plates 1 1 6 forming a truncated cone shape are in the central portions of the corresponding vibration plates 114a to U4e, The axis of the corner plate 116 is orthogonal to the vibration plates 1 1 4a to 1 1e. The first to fifth vibration plates 114a to 114e are arranged horizontally. The front end surface of the corner plate 116 is orthogonal to the axial direction of the vibration member 1 1 7. The corner plates 1 1 6 and the vibrator 1 1 7 are connected, and the respective central axes of the corner plate 1 1 6 and the vibrator 1 1 7 are positioned on a line.  In the vibration part 117, Lange points are used. Langevin).  The vibrator 1 1 7 is shown in FIG. 8, In order to have a piezoelectric element 1 1 8 a forming a pair of rings, 1 1 8b. The ring-shaped electrode plates 1 1 9 are arranged on both piezoelectric elements 118a, 1 1 8b room. Two metal blocks 120a, 120b system is arranged 1226867 to sandwich the electrode plate 119 and two piezoelectric elements 118a, 118b. Fasten and fix the metal block with bolts not shown 1 2 0 a, 1 2 Ob, Thereby, the vibrating member 117 is constituted. In the metal block 120a, In 120b, a screw hole (not shown) is formed. The aforementioned bolts are bolted to the aforementioned screw holes. Two metal blocks 1 2 0 a, 1 2 0 b is electrically connected to each other through the bolts.  The metal block 120 a is formed with a flange 121. The metal block 120a of each vibration member 117 is, In a state of being fitted to a hole (not shown) formed in the support plate 122, It is fixed to the support plate 122 via a flange 1 2 1 by a bolt (not shown). The face of the corner plate 116 on the opposite side to the face on which the respective vibration plates U4a to 114e are fixed, To fix the flange 121. The electrode plate 119 is connected to the oscillator 123 via the wiring 124a, The ground terminal of the oscillator 123 is connected to the metal block 120b via the wiring 124b. With vibrator 1 17, The oscillator 123 constitutes an excitation vibration device for exciting the first to fifth vibration plates U4a to 1 1 4e. In addition, In Figure 7, For the first vibration plate 114a, An illustration of the oscillator 123 of the third vibration plate 114c and the fifth vibration plate 114e.  Secondly, The unloading device 125 for transferring a plate-like member 2 1 5 (unloading operation) between the receiving device Π1 and a general feeding device (not shown) is described. As shown in Figure 9, The unloading device 125 is provided with a support portion capable of reciprocating action 1 2 6 A moving device 1 2 7 that causes the support portion 1 2 6 to reciprocate in the left-right direction in FIG. 9. The supporting part 1 2 6 is formed in a long shape as a function of the fork part, And includes first and second arm portions 126a extending in parallel to each other, 126b.  As shown in Figure 7, Figure 9, And as shown in Figure 10, The first and second vibrating plates 128a, 128b is supported by the support part 26.  Specifically, As shown in Figure 10, In order that the first end portion of the second vibration plate 1 2 8 b is fixed to the support portion K6 through the corner plate 3 0 excited by the vibration member 1 29, the second end portion of the second vibration plate l28 b is passed through The corner plate 1 3 1 is fixed to the front end portion of the second arm portion 1 2 6 b. In addition, Even for the first vibration plate 1 2 8 a, The second vibration plate 1 2 8 b is also supported by the first arm portion 126 a and the support portion 126. Each vibration plate 128a, 128b is grounded. The vibration element 1 2 9 has the same configuration as the vibration element 1 1 7 of the receiving device 1 1 1. It is connected to the corresponding oscillator 1 32. With the first vibration plate 1 2 8 a, Corresponding vibration parts 1 2 9, Pair of corner plates 1 3 〇, : [3〗 、 And a second object floating device 133 is formed corresponding to the oscillator 132.  The moving device 127 is a conventional robot arm having a scalar type having a ring portion 127a. The moving device 1 2 7 moves the support portion 126 back and forth by a driving mechanism (not shown), Lifting at the same time. The unloading device i 25 is provided with a confirmation first and second arm portion 126a, 126b height sensor (not shown).  Secondly, The function of the device as described above will be described.  The receiving device 111 is, Each of the vibration plates 114a to 11 4e is configured to float and maintain the plate-like member 2 1 5. that is, Driven by the oscillator 1 2 3,  While the vibrating member 1 17 is caused to have a resonance frequency Around 20kHz) to induce vibration, The corner plates 1 1 6 perform longitudinal vibration. Vibration plates 1 14a to 1 14e of the corresponding vibration plates are excited through the corner plates 1 1 6, Perform flexural vibration. Each of the vibration plates 114a to 114e generates a sound wave (standing wave) from each of the vibration plates 114a to IMe by performing flexural vibration. By the vibration of each of the vibration plates IMa to 1226867 and the distance above the component 1112, Disassembly of the head arm l 127 vibration 15 on 15 and 128b floating for wave  The radiation pressure of the sound waves emitted by the device 1 1 4 e, As shown in Figure 1 1 A, The plate-like shape 2 1 5 floats and rises from the surfaces of the vibration plates 1 1 4 a to 1 1 4 e. Floating system is below 1mm, For example, above 1 00 // m, And the range of 3 0 0 // m. Forming the distance G between each of the vibration plates 1 1 4 a to 1 1 4 e and the plate-like member 2 1 5 into a certain shape so that the excitation states of the vibration plates 1 1 4 a to 1 1 4 e are controlled, Suppression of peeling and static electricity.  Secondly, The unloading operation is performed by the unloading device 125 to maintain the plate-shaped member 2 1 5 in a floating state on the first object floating loading g. That is, first, Stop the unillustrated transfer device, As shown in FIG. 11A, in a state where the plate 2 1 5 is maintained in a floating state at a specified position, Make both 126a, 126b is arranged in the entry preparation position. This state drives the mobile device, The support portion 126 is advanced to a cargo position corresponding to the plate-like member 2 1 5. Secondly, As shown in Figure 1 1 B, Plate-like member 2 1 5 and two plates 128a, Distance GG between 128b, The plate-like member 2 is raised so that the distance G G between the plate-like member 2 vibration plate 11 4 a to 1 1 4 e before the unloading operation is started (refer to FIG. 1A). and,  The plate-like member 2 1 5 has two vibration plates 1 2 8 a, The presence of 1 2 8 b is kept floating. after that, The plate-like member 2 1 5 and the two vibration plates 1 2 8 a,  The distance GG is kept constant, It is used to hardly affect the buoyancy of the plate-like member 2 1 5 caused by the floating of the first object 1 1 2. 126b rose to the specified cone. Secondly, Behind the support part 126, the plate-shaped member 2 1 5 is moved together with the second object 133 of the unloading device 1 2 5.  Secondly, When the arm portion 126a, After 126b moves to the designated position corresponding to the 1226867 transport unit (not shown), To make the arms i 2 6 a, 1 2 6 b drop,  The member 2 1 5 is transferred to the aforementioned transfer device. that is, The plate-shaped member is moved between the receiving device 1 1 1 and the conveying device. It moves without contact.  This embodiment has the following advantages.  The plate-like member 2 1 5 is floated from the first object 1 2 to the second object floating device 3 3 in a non-contact state. Floating device for each object that floats and maintains the plate-like object 1 1 2, Each of 1 3 3 1 1 4 a to 1 1 4 e, 1 2 8 a, 1 2 8 b is grounded. To make each vibration plate to 1 1 4 e, 1 2 8 a, 1 2 8 b and the plate-like member 2 1 5 The distance G G is constant to control each vibration plate 1 1 4 a to 1 1 4 e, 1 2 8 a, 1 2 8 b vibration state, Therefore, the generation of static electricity is suppressed. thereby, Remove deionization equipment such as an ionizer (Ionizer).  In this embodiment, In order to suppress the generation of static electricity, it is not necessary to slow down the discharge speed. therefore, System can reduce operation time, Improve productivity.  The plate-shaped member 2 1 5 is float-maintained by the vibration plate 1 1 4 I 1 4 e having a smaller majority among the plate-shaped members 2 1 5. therefore, Compared with the structure of the strip-shaped vibration plate, It is easy to set the vibration plates 1 1 4 a to 1 Η so as not to interfere with the unloading device 1 2 5.  Secondly, The cargo device 2 1 1 in the fourth embodiment of the present invention will be described based on Figs. The receiving device 2 1 1 is provided with a trolley 2 3 3 equipped with a first object floating 2 1 2. The first object floating device 2 1 2 includes vibrations II 4 a to 114 6 and a vibration element 417. The first object floating device 212 maintains the plate-like member 2 1 5 in a floating state. By forming a cylindrical shape, the plate 2 15 state device 2 15 moving plate 114a becomes the exciting a to be set up, and the floating plate equipped with a long e is a floating plate. The angle plate is -20- 1226867 1 4 〇, Each of the vibration plates 1 1 4 a to 1 1 4 e is supported on the corresponding vibration member 4 1 7. Each of the vibrating members 4 1 7 is fixed to the supporting frame 1 3 4 so that each of the vibrating plates 11 4a to 1 1 4e is horizontal. Each vibrating member 4 1 7 is connected to the oscillator 1 2 3. The plate-like member 2 1 5 is maintained in a floating state in the first object floating device 2 1 2. It is moved to the designated position with the movement of the trolley 2 3 3.  the following, A receiver or device 3 1 1 according to a fifth embodiment of the present invention will be described based on Figs. 13 to 15. This embodiment is, The structure of the receiving device 1 1 1 in FIG. 7 is different from the embodiments in FIG. 7 to FIG. In addition, It is the same as the embodiment of FIG. 7 to FIG. This description is omitted.  As shown in Figure 13, The first and second vibration plates 114a, Between 114b, First and third vibration plates 1 1 4 a, 1 1 4 c, Third and fourth vibration plates U4c, lMd, The second and fourth vibration plates 114b, 114d, Debrushing brushes 2 1 3 are provided at positions that do not interfere with the unloading device 1 2 5. Each debrush 2 3 is grounded. As shown in Figure 14  Each de-brushing brush 213 has a support plate 213a. The support plate 213a is provided with a plurality of conductive fibers 2 1 3b. The de-brush 2 1 3 is configured to remove the front end of the de-brush 2 1 3, That is, the front end portion of the conductive fiber 2 1 3b is located on the same plane as the surface facing the first to fourth vibrating plates 1 1 4a to 11 4d facing the plate-like member 215 (see FIG. 15). The distance from the end face before the de-brushing brush 2 1 3 to the plate-like member 2 1 5 is formed to be slightly different from the surface of the first to fourth vibration plates 1 1 4a to 11 4d and the plate-like member 2 1 5 the same. Specifically, the distance between the front end of the conductive fiber 2 1 3 b of the brush 2 1 3 and the facing surface of the plate 1226867-like member 2 1 5 is kept below 1 mm. therefore, It is possible to remove the charged electric charges caused by the de-brushing brushes 2 1 3 on the plate-shaped member 2 1 5 by non-contacting the sadness. In addition, There is no need to set a separate time for de-energizing the plate-shaped member 2 1 5 which has been charged, On the other hand, it is possible to perform the power-removal efficiently during the transportation time.  The unloading operation performed by the unloading device 1 2 5 in this embodiment will be described. In this embodiment, 'is to transfer the plate-like member 2 1 5 floated on a conveying device (not shown) to the first object floating device 1 12 of the receiving device 2 1 1.  φ stop the movement of the aforementioned conveying device, In a state where the plate-like member 2 1 5 is maintained in a floating state at a designated position, Make both arms 126a, The l26b is configured in the entry ready position. In this state, the mobile device 1 2 7 is driven, By moving the support portion 126 forward, the two arm portions 126a, 126b is arranged at the unloading position corresponding to the plate-like member 2 1 5 After that, it rises to the specified position.  The plate-like member 2 1 5 is formed by two vibration plates 1 2 8 a, The standing wave generated by 1 2 8 b is kept floating. When the arm portion 126a, 126b rises to the specified height with almost no effect on the floating effect of the plate-like member 2 caused by the object floating device of the conveying device, Back support 126, Let the plate-like member 215 be stacked: On the device. and, When the two arm portions 126a, 126b moves forward to the designated position corresponding to the receiving device 3 1 1 Make both arms _126a, 12 6b drop, The plate-shaped member 215 is transferred to the receiving device 311.  · Thus, the plate-like member 2 1 5 is transported to a position corresponding to the receiving device 311 by a transport device (not shown), It is transferred from the transfer device to the first object floating device 1 12 in a non-contact state by the unloading device 225.  -22- 1226867 The receiving device 3 1 1 is to maintain the plate-like member 2〗 5 in a floating state 'between the plate-like member 2 1 5 and the first to fifth vibration plates ii 4 a to 1 1 4 e Adjust the distance to 1 mm or less. By grounding the first to fifth vibrations n 4 a to 1 14e, And adjusting the distance between the plate-shaped member 215 and the first to fifth vibration plates 14a to 1 1 4e to 1 mm or less, With this, When the plate-like member 2 i 5 is charged, To de-energize the plate-like member 2 1 5 in a non-contact state.  This embodiment has the following advantages.  The charged plate-shaped member 2 1 5 is radiated by sound waves generated by the first to fifth vibration plates 1 1 4a to 1 1 4e, The first to fifth vibration plates 1 1 4a to 1 1 4e are maintained in a floating state. By adjusting the distance between the plate-like member 2 1 5 and the first to fifth vibration plates 1 1 4 a to 1 1 4 e to be 1 mm or less, On the other hand, the plate-shaped member 2 1 5 is de-energized in a non-contact state. thereby, No need to use expensive deionization equipment such as deionizer, The non-contacted state can remove the charged charges in the plate-like member 2 1 5. Furthermore, The static electricity of the plate-like member 2 1 5 can be reliably de-energized by the de-brushing brush 2 1 3.  When the plate-like member 2 1 5 is de-energized, The distance between the plate-shaped member 2 1 5 and the first to fifth vibration plates Π 4a to 1 1 4e can be maintained uniformly across the entire surface of the plate-shaped member 2 1 5. Therefore, generation of static electricity can be suppressed.  Two vibration plates 128a, 128b is grounded. therefore, During the unloading operation with the unloading device 125, The local electric charges charged in the plate-like member 215 can be removed.  The first to fourth vibrating plates 1 to 1 4d are respectively arranged at positions corresponding to the four corners of the plate-like member 215, Between adjacent vibrating plates 1 14a to 1 14e -23-1226867, a de-brushing brush 2 1 3 is provided. thereby, Compared to the use of a long diaphragm,  In order to easily dispose the de-brushing brushes 2 1 3 so as not to interfere with the unloading device 1 2 5.  Secondly, based on Figure 16 The unloading device 2 2 5 in the sixth embodiment of the present invention will be described. The unloading device 2 2 5 of this embodiment is, A plurality of brushes 2 1 3 are installed in the unloading device 1 2 5 in FIG. 13.  but, The two arm portions 126a shown in FIG. 16 The width of 126b is made wider than the two arm portions 126a, 126b width. Along the vibration plate 1 2 8 a, 1 2 8 b Corresponds to the vibration plate 1 2 8 a,  12 on both sides of 8b, Is provided with a de-brush 213. The front end of each de-brushing brush 213 is a vibration plate 128a, which is arranged so as to be slightly opposed to the plate-like member 2 1 5. The faces of 128b are the same. Even in this embodiment, The plate-like member 2 1 5 removed in the floating state (non-contact state) by the unloading device 22 5, It is better to perform power removal while being maintained in the unloading device 225.  Secondly, The unloading device 3 2 5 in the seventh embodiment of the present invention will be described based on Fig. 17. This embodiment is in the unloading device 125 in FIG. 13. At each arm 126a, 126b is equipped with a majority (three in FIG. 17) of vibration plates 3 3 4, To replace the long-shaped vibration plate 1 2 8 a, 12 8 b. Each of the vibration plates 3 3 4 is supported on a vibration member (not shown) via a corner plate 1 1 6. While each vibration plate 3 3 4 is grounded, A de-brushing brush 2 1 3 is arranged between the adjacent vibration plates 3 3 4. That is, the vibration plate 3 3 4 and the de-brushing brush 2 1 3 are alternately arranged along the reciprocating direction of the support portion 1 2 6. Even in this case, The plate-like member 2 1 5 which is unloaded by the unloading device 1 2 5 in the floating state -24-1226867, It can be de-energized with better efficiency during the period of 1-25. In addition, Even without increasing 12 6a, l26b width, It is also possible to attach the brush 213 to the arm 126b °. The embodiment may be modified as described below, for example.  In the embodiments of FIGS. 5A to 6C, On glass substrate For large and flexible cases, It is used instead of floating and maintaining the glass substrate square convexly and flexibly. The glass substrate may be float-maintained while being convexly flexed.  In the embodiments of FIGS. 5A to 6C, As a structure in which the distance G between the glass substrate 12 and the vibration plate 17 is constant in accordance with the deflection of the glass 12, To replace the structure that moves the moving body 26 along the guide rail 25, The supporting plate supporting the vibration member 1 1 5 can be set to be lifted by a device, Vibration can also be installed on the support plate by tilting action. Even in this case, By combining tilting actions, The distance between the glass substrate 12 and the vibration plate 17 can be adjusted to a specified value.  In the embodiments of FIGS. 1A to 6C, The width of the corner plate 16 is not the same as the width of the vibration plate 17 It may be narrower than the width of the vibration plate 17. It is more desirable that the width is larger than the width of the vibration plate 17.  The trolley 233 of FIG. 12 can also be formed by a conductor. Under this, To make each of the vibration plates 114a to 114e, 128a, 128b and is connected to the trolley 2 3 3. So, Each vibration plate 1 1 4 a to 128 a, The potential of 128b is constant.  The cargo arms 126a '1 2 are maintained in a position higher than 12 lower than 12 on the upper glass substrate.  Situation Electricity 1 1 4e,  -25-1226867 In pictures 1 to 3!  In each embodiment of FIG. 7, Transfer the plate-like member 2 j 5 to the receiving device 3 1 1. The 4 1 1 device is not limited to the unloading device 1 2 5 for unloading in a non-contact state. It is also possible to transfer the plate-shaped member 2 to 5 to the receiving device 311, 411, Transfer to receiving device 311, 411. Receiving device 3 1 1. 4 1 1 is after receiving the plate-like member 2 1 5 In order to maintain the plate-like member 2 1 5 in a floating state, Until the plate-like member 2] [5 is unloaded to another place by the unloading device 1 2 5, In order to remove the electric charges charged in the plate-like member 2 丨 5.  In each of the embodiments of FIGS. 13 to 17, Not in the receiving device 3 1 1. De-brushing is set in 4 11 2 1 3, It is also possible to adjust only the distance between the vibration plates 1 1 4a to 1 1 4e and the plate-like member 2 1 5 to 1 mm or less, The electric charges charged in the plate-like member 2 1 5 are removed. however, By using the brush 2 1 3 series, the power-off efficiency can be improved.  In each of the embodiments of FIGS. 13 to 17, The distance between the plate-shaped member 215 and the fifth vibration plate 114a to 114e can also be adjusted to 1 mm or less.  Deionization was performed using an Ionizer. In this case, In peeling and charging, In order to suppress the generation of static electricity that cannot be blocked in an ionizer by floating. Furthermore, Ionizer is used to remove electricity under the condition that there is an air layer between the vibration plate and the plate-like member. therefore, The system can be de-energized with a good longitude (in order to suppress static electricity to a number of 10 to below lkV).  In each of the embodiments of FIGS. 1A to 17, the vibration member 15, 1 1 5.  1 1 7, 1 29, 4 1 7 is not limited to Lange points (transliteration: Lang ev in) Other vibrating elements can also be used.  -26- 1226867 In each of the embodiments of FIG. 1A to FIG. 17, When increasing the area of each vibration plate, When the plate-like structure is small, It is not necessary to ground the diaphragm. In this case, The vibration plate itself achieves the function of grounding.  In each of FIGS. 1A to 17, The vibration plate 17 is not limited to a method of connecting to the ground via direct wiring, The frame of the support plate 14 or the receiving device 11 can also be formed of a conductive material. Ground it by wiring it to the ground.  In each of the embodiments of FIGS. 1A to 17, The plate-like member is not limited to the glass substrate 12 For other objects, For example, it may be a semiconductor wafer.  In each of the embodiments of FIGS. 1A to 17, The fixing of the corner plate of the vibration plate is not limited to the fixing by screwing, You can also use adhesives, Or fixed by welding or welding.  In each of the embodiments of FIGS. 1A to 17, Instead of grounding the vibration plate, it is also possible to set each vibration plate to the same potential. E.g, If it is connected to a conductor whose volume is larger than each vibration plate, The potential of each vibration plate is the same as that of the conductor. The potential of each vibration plate is formed constant.  [Brief description of the drawings] Fig. 1A is a schematic perspective view of a receiving device in the first embodiment embodying the present invention.  Figure 1B is a side view of the receiving device of Figure 1A.  Fig. 2A is a schematic view showing a state where a glass substrate is placed on a vibration plate.  -27- 1226867 Figure 2B is a schematic diagram of the state where the glass substrate has floated.  Fig. 3 is a graph showing the relationship between time and potential when the glass substrate is peeled.  Figure 4 is a schematic diagram illustrating the function.  Fig. 5A is a side view showing a peeling-off suppression device in a second embodiment of the present invention.  Figure 5B is a plan view of the device in which the vibration plate is removed by the stripped charge suppression device of Figure 5A.  Fig. 6A is a side view illustrating the operation of the device of Fig. 5A.  Fig. 6B is a side view illustrating the operation of the device of Fig. 5A.  Fig. 6C is a side view illustrating the operation of the device of Fig. 5A.  Fig. 7 is a perspective view of a receiving device and an unloading device in a third embodiment of the present invention.  Fig. 8 is a front view of a corner plate and a vibrating member of the receiving device shown in Fig. 7.  Fig. 9 is a plan view of the unloading device of Fig. 7.  Fig. 10 is a side view of the unloading device of Fig. 7.  Fig. ΠA is a schematic view showing a state in which the plate-like member is placed on the receiving device of Fig. 7.  Figure ΠB is a schematic diagram showing the state of the unloading device in Figure 7 when unloaded.  Fig. 12 is a side view of a receiving device in a fourth embodiment of the present invention.  Fig. 13 is a perspective view of a receiving device and an unloading device in a fifth embodiment of the present invention.  -28- 1226867 Fig. 14 is a drawing of the de-brushing device provided in the receiving device of Fig. 13.  Fig. 15 is a schematic view showing a state where the plate-shaped member is placed on the receiving container of Fig. 13.  Fig. 16 is a plan view of the unloading device in the sixth embodiment of the present invention.  Figure 17 shows a plan view of the unloading container® in the seventh embodiment of the present invention.  φ [Description of Representative Symbols of Main Parts] 11: Receiving device 1 1 2: First object floating device 1 14a ~ 1 14e ·· Vibration plate 1 2: Glass substrate 12 0a: Metal block 1 2 0 b: Metal block 1 2 1: Flange _ 1 2 5: Unloading device 1 2 6: Support 1 2 6 a: Arm-1 2 6 b: The arm.  127: Mobile device 1 2 7 a: Ring 1 3: Object floating device 1 3 3: Second object floating device-29- 1226867 1 34: Support frame 1 4: Support plate 1 4 0: Corner plate 14a: Hole 1 5: Vibration element 16: Corner plate 16a: Cone 17: Vibration plate 1 9a: Piezo element 19b: Piezo element 2 0: Electrode plate 2 1 3: Brushless 2 13b: Conductive fiber 2 1 5: Plate-shaped member 2 1 a: Metal block 2 1 b: Metal block 2 2: Flange 23: Oscillator 2 3 3: Trolley 2 5: Rail 2 6: Moving member 27: Linear actuator

Claims (1)

1226867 拾、申請專利範圍： 1. 一種板狀構件之剝離帶電控制方法，其特徵在於：當使 載置於載置部之板狀構件由載置部移動時，利用藉由使 載置部激發振動而產生有音波之放射壓，進而使板狀構 件由載置部飄浮。 2 ·如申請專利範圍第1項之剝離帶電控制方法，其中前述 載置部係由導電性材料所形成，且被接地。 3 · —種剝離帶電抑制裝置，爲當由載置部剝離被載置於載 置部的板狀構件之際，抑制板狀構件之帶電，其特徵在 · 於：前述載置部係由物體飄浮裝置所形成，前述物體飄 浮裝置係具備有：振動板，係由可載置板狀構件之導電 性材料所形成；激發振動裝置，係使前述振動板激發振 動；藉由來自被激發振動之振動板的音波之放射壓而使 前述板狀構件由前述振動板之表面飄浮，振動板係被接 地。 4 ·如申請專利範圍第3項之剝離帶電抑制裝置，其中前述 振動板係爲多數中之一個，在使被載置於前述振動板上 ® 之前述板狀構件由該振動板之表面飄浮時，對應於前述 板狀構件之撓曲而將振動板與前述板狀構件間之距離維 持成一定’且具備以移動前述振動板的移動裝置。 ~ 5 ·如申請專利範圍第3或4項之剝離帶電抑制裝置，其中 · 前述振動板係形成爲長條狀。 6.如申請專利範圍第3或4項之剝離帶電抑制裝置，其中 前述板狀構件係爲玻璃基板。 -31 - 1226867 7 .如申請專利範圍第4項之剝離帶電抑制裝置，其中前述 移動裝置係爲使前述振動板傾斜移動、且使其升降。 S · 一種卸貨方法，係爲將板狀構件由第一物體飄浮裝置上 移載至第二物體飄浮裝置上，其特徵在於：第一以及第 二物體飄浮裝置係分別具備有由導電性材料所形成之多 數的振動板；利用使各個振動板激發振動所產生之音波 的放射壓而將板狀構件進行飄浮維持，第二物體飄浮裝 置係更被裝備在可往復作動之支撐部上，當將板狀構件 由第一物體飄浮裝置上移載至第二物體飄浮裝置上之 際’爲將第一物體飄浮裝置之振動板相互設爲相同電 位、或是進行接地的同時，將第二物體飄浮裝置之振動 板相互設爲相同電位、或是進行接地之狀態下，調整成 使各個物體飄浮裝置之振動板與前述板狀構件之間的距 離形成爲一定狀。 9. 一種卸貨裝置，其特徵在於具備有： 支撐部，係可往復作動； 移動裝置，爲使前述支撐部往復作動； 物體飄浮裝置，係被裝設在前述支撐部上，爲利用藉 由使以導電性材料所形成之多數之振動板被激發振動所 產生之音波的放射壓，而將板狀構件維持在飄浮狀態； 前述振動板係被接地，或是振動板爲設成相互爲相同 電位。 1 0 · —種收貨裝置，其特徵在於：利用使由導電性材料所形 成之多數的振動板激發振動所產生之音波的放射壓，而 -32- 1226867 使將板狀構件進行飄浮維持的物體飄浮裝置裝備在移動 體上，前述振動板係爲相互爲相同電位，或是前述振動 板爲相互接地。 1 1 .如申請專利範圍第1 0項之收貨裝置，其中前述移動體之 框架係由導電性材料所構成，前述各個振動板係被連接 至前述框架。 1 2 . —種板狀構件之去電方法，其特徵在於具備有： 飄浮維持步驟，係利用使由導電性材料所形成之振動 板激發振動所產生之音波的放射壓，而將已帶電之板狀 構件進行飄浮維持； 去電步驟，在將前述振動板進行接地之狀態下，將前 述板狀構件與前述振動板之間的距離調整爲1 mm以下， 而將板狀構件進行去電。 1 3 ·如申請專利範圍第1 2項之板狀構件之去電方法，其中爲 使去電刷配置成將去電刷之前端位於略與對向於前述板 狀構件之前述振動板之面相同面上。 1 4 . 一種板狀構件之去電方法，其特徵在於具備有： 飄浮維持步驟，係利用使由導電性材料所形成之振動 板激發振動所產生之音波的放射壓，而將已帶電之板狀 構件進行飄浮維持； 調整步驟’在將振動板進行接地之狀態下，將板狀構 件與振動板之間的距離調整爲1 mm以下* ; 去電步驟’係使用去靜電器（I 〇 n i z e r)而將板狀構件進 行去電。 -33- 1226867 1 5 · —種卸貨裝置，係特徵在於： 具備有： 支撐部，係可往復作動； 移動裝置，爲使前述支撐部往復作動； 物體飄浮裝置，爲具備有多數之振動板，物體飄浮裝 置係被裝備在前述支撐部上，爲利用藉由使各個振動板 被激發振動所產生之音波的放射壓，而將板狀構件維持 在飄浮狀態； 各個振動板係被接地，將去電刷配置成將去電刷之前 端位於略與對向於前述板狀構件之前述振動板之面相同 面上。 1 6 . —種收貨裝置，其特徵在於：具備有物體飄浮裝置，係 利用藉由使多數之振動板被激發振動所產生之音波的放 射壓，而將板狀構件維持在飄浮狀態； 前述各個振動板係被接地。將去電刷配置成將去電刷 之前端位於略與對向於前述板狀構件之振動板之面相同 面上。 1 7 .如申專利範圍第1 6項之收貨裝置，其中前述物體飄浮裝 置以及前述去電刷係被裝設在移動體上。 -34-1226867 Patent application scope: 1. A method for controlling the peeling and electrification of a plate-shaped member, characterized in that when the plate-shaped member placed on the placement portion is moved from the placement portion, the placement portion is excited by using The vibration generates radiated pressure of sound waves, and further, the plate-shaped member floats from the mounting portion. 2 · The peeling and charging control method according to item 1 of the patent application range, wherein the mounting portion is formed of a conductive material and is grounded. 3. A peeling suppression device for suppressing the electrification of a plate-shaped member when the plate-shaped member placed on the placing section is peeled off by the placing section, which is characterized in that the placing section is an object It is formed by a floating device. The object floating device is provided with: a vibration plate formed of a conductive material on which a plate-shaped member can be placed; an excitation vibration device that causes the vibration plate to excite vibration; The radiation pressure of the sound wave of the vibration plate causes the plate-shaped member to float from the surface of the vibration plate, and the vibration plate is grounded. 4 · If the peeling charge suppressing device of item 3 of the patent application range, wherein the aforementioned vibration plate is one of the majority, when the aforementioned plate-shaped member placed on the aforementioned vibration plate® is floated from the surface of the vibration plate In accordance with the deflection of the plate-like member, a distance between the vibration plate and the plate-like member is maintained to be constant, and a moving device for moving the vibration plate is provided. ~ 5 · The peeling charge suppression device according to item 3 or 4 of the scope of patent application, wherein the aforementioned vibration plate is formed in a long shape. 6. The peel-off electrification suppressing device according to item 3 or 4 of the scope of patent application, wherein the aforementioned plate-like member is a glass substrate. -31-1226867 7. The peeling electrification suppression device according to item 4 of the scope of patent application, wherein the moving device is for tilting and moving the vibration plate and lifting it. S · A method of unloading is to transfer a plate-shaped member from a first object floating device to a second object floating device, characterized in that the first and second object floating devices are each provided with a conductive material The majority of the vibration plates are formed; the plate-shaped member is floated and maintained by using the radiation pressure of the sound waves generated by the vibration vibration of each vibration plate. The second object floating device is further equipped on a reciprocating support portion. When the plate-like member is transferred from the first object floating device to the second object floating device, 'the vibration plates of the first object floating device are set to the same potential with each other, or the second object is floated while grounding When the vibration plates of the device are set to the same potential or grounded, the distance between the vibration plate of each object floating device and the plate-like member is adjusted to be constant. 9. A cargo unloading device, comprising: a supporting part capable of reciprocating movement; a moving device for reciprocating the aforementioned supporting part; an object floating device being mounted on the aforementioned supporting part for use by using The plate-shaped member is maintained in a floating state by a plurality of vibration plates formed of a conductive material being excited by sound waves generated by vibration; the aforementioned vibration plates are grounded, or the vibration plates are set to the same potential as each other . 1 0 · —A receiving device, characterized in that a radiating pressure of a sound wave generated by exciting vibrations of a plurality of vibration plates formed of a conductive material is used, and -32-1226867 is used to float and maintain a plate-like member. The object floating device is equipped on a moving body, the vibration plates are at the same potential as each other, or the vibration plates are grounded to each other. 1 1. The receiving device according to item 10 of the patent application range, wherein the frame of the moving body is made of a conductive material, and each of the vibration plates is connected to the frame. 1 2. A method for removing electricity from a plate-shaped member, comprising: a floating maintenance step, using a radiation pressure of a sound wave generated by exciting a vibration caused by a vibration plate formed of a conductive material, The plate-shaped member is float-maintained; in the power-off step, the distance between the plate-shaped member and the vibration plate is adjusted to 1 mm or less while the vibration plate is grounded, and the plate-shaped member is de-energized. 1 3 · The method for removing electricity of a plate-like member according to item 12 of the scope of the patent application, wherein the brush is arranged so that the front end of the brush is located slightly opposite to the face of the vibration plate facing the plate-like member. Same surface. 14. A method for removing electricity from a plate-shaped member, comprising: a floating maintenance step, using a radiation pressure of a sound wave generated by exciting a vibration plate made of a conductive material to vibrate, and charging the charged plate The floating member is maintained in a floating state; the adjustment step 'adjusts the distance between the plate-shaped member and the vibration plate to 1 mm or less while grounding the vibration plate *; the step of removing electricity' uses a destaticizer (I 〇nizer ) And the plate-shaped member is de-energized. -33- 1226867 1 5-A kind of unloading device, characterized in that: It is equipped with: a support part that can be reciprocated; a moving device for reciprocating the aforementioned support; an object floating device that is equipped with a large number of vibration plates, The object floating device is equipped on the aforementioned support portion to maintain the plate-like member in a floating state by using the radiation pressure of the sound waves generated by causing each vibration plate to be excited to vibrate; each vibration plate system is grounded and will go to The brush is configured so that the front end of the de-brushing brush is located on the same plane as the surface of the vibration plate facing the plate-shaped member. 16. A kind of receiving device, characterized in that: it is provided with an object floating device, and the plate-shaped member is maintained in a floating state by using the radiation pressure of sound waves generated by causing most of the vibration plates to be excited and vibrated; Each vibration plate system is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same side as the face of the vibration plate facing the plate-shaped member. 17. The receiving device according to item 16 of the patent application scope, wherein the aforementioned object floating device and the aforementioned de-brushing device are installed on a moving body. -34-
TW092121316A 2002-08-09 2003-08-05 Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member TWI226867B (en)

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JP2002232978A JP4029689B2 (en) 2002-08-09 2002-08-09 Loading method for plate-like members
JP2002232977A JP3894071B2 (en) 2002-08-09 2002-08-09 Method for removing electricity from plate-like member, load receiving device and load receiving device
JP2002232976A JP4359028B2 (en) 2002-08-09 2002-08-09 Peeling suppression device

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