CN1502535A - Electricity discharge and goods taking, stripping charge suppressing method and device, goods taking and receiving device - Google Patents

Electricity discharge and goods taking, stripping charge suppressing method and device, goods taking and receiving device Download PDF

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Publication number
CN1502535A
CN1502535A CNA031580890A CN03158089A CN1502535A CN 1502535 A CN1502535 A CN 1502535A CN A031580890 A CNA031580890 A CN A031580890A CN 03158089 A CN03158089 A CN 03158089A CN 1502535 A CN1502535 A CN 1502535A
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CN
China
Prior art keywords
plate
mentioned
shaped
oscillating plate
oscillating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA031580890A
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Chinese (zh)
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CN1310810C (en
Inventor
高三正已
铃木和宏
小池义和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyoda Automatic Loom Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002232978A priority Critical patent/JP4029689B2/en
Priority to JP232977/2002 priority
Priority to JP232978/02 priority
Priority to JP232977/02 priority
Priority to JP232978/2002 priority
Priority to JP2002232977A priority patent/JP3894071B2/en
Priority to JP232976/2002 priority
Priority to JP2002232976A priority patent/JP4359028B2/en
Priority to JP232976/02 priority
Application filed by Toyoda Automatic Loom Works Ltd filed Critical Toyoda Automatic Loom Works Ltd
Publication of CN1502535A publication Critical patent/CN1502535A/en
Application granted granted Critical
Publication of CN1310810C publication Critical patent/CN1310810C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

Several oscillating plates 17 are parallel arranged. Each oscillating plate 17 is formed to become a long rectangular shape which is narrower than the width of the glass-substrate 12. Said oscillating plate 17 keeps the glass-substrate 12 at a floating state. Each oscillating plate 17 is grounded respectively. When the glass-substrate 12 loaded on the oscillating plate 17 is moved from the oscillating plate 17, the oscillating plate 17 is excited and the super sonic wave is generated. By means of the emitting pressure of the sonic wave, the glass-substrate 12 is floated to be kept a definite distance G from the oscillating plate 17.

Description

Remove electricity and get goods, stripping charge suppressing method and device, get goods and the device of receiving
Technical field
The present invention relates to when plate-shaped members such as the glass substrate of carrying liquid crystal board and semiconductor wafer, the technology of static electrification or generation static reaches charged plate-shaped member is removed electric technology on the inhibition plate-shaped member.
Background technology
When two objects of contact separated, on contact interface, a part of charge carrier that has moved on another face from a face turned back on the original face, and remaining in lip-deep charge carrier part just becomes static.Insulator not only, the metal of conductor also produce the electric charge migration when contacting each other.Thereby, if make it to peel off mutually after the metal that uses insulator to keep contacts each other, with regard to charged (stripping charge).In addition, at floating condition (contactless state) down during the charged object of carrying, charged object with press between its support component of floating condition support apart from G one variation, just produce static.
In the Fabrication procedure of the Fabrication procedure of liquid crystal board and semiconductor device, need be at plate-shaped members such as a plurality of inter processes carrying glass substrates and semiconductor wafers, making plate-shaped member when mounting portion moves, just produce above-mentioned stripping charge.Particularly, in the such operation that is easy to generate static of the friction process of one of Fabrication procedure that resembles liquid crystal board and gluing operation, making plate-shaped member when mounting portion moves, because of the stripping charge carried charge increases.In addition, if peeling rate accelerates, the carried charge of stripping charge just increases.Therefore, reduce carried charge, peeling rate is promptly slowed down from the speed of mounting portion rise plate-shaped member.Its result, the operating time is elongated, and capacity rating descends.
Under the charged situation of plate-shaped member, electro-dissociator neutralizers such as (イ オ Na イ ザ one) can from charged object remove or and static.Neutralizer is not to prevent or suppress stripping charge.With respect to electro-dissociator, removing under the situation of brush of the less expensive neutralizer of use, usually, setting removes the front end of brush and will be several mm except that the distance between the electric target object.But, on this distance, from the static of charged object to remove electric effect low.In addition, using under the situation of electro-dissociator,, removing just difficulty of electricity if do not have air layer between target object and the mounting portion, towards the back side of the target object of mounting portion to remove electricity just difficult.
Summary of the invention
First purpose of the present invention is when making plate-shaped member suppress the stripping charge of plate-shaped member preferably when mounting portion moves, the generation of the static when suppressing the plate-shaped member handing-over.Second purpose is preferably charged plate-shaped member to be removed.
In order to achieve the above object, the invention provides the stripping charge suppressing method of following plate-shaped member.Stripping charge suppressing method is included in and makes the plate-shaped member that is positioned in the mounting portion when mounting portion moves, and utilizes the radiation pressure of the sound wave that makes the excitation of mounting portion and produce, and makes plate-shaped member from the floating operation of mounting portion.
The present invention provides following stripping charge restraining device in addition.The stripping charge restraining device suppresses the charged of plate-shaped member when the plate-shaped member that is positioned in the mounting portion is peeled off by mounting portion.Mounting portion is made of the object flotation gear.The object flotation gear comprise can mounting the oscillating plate that constitutes by conductive material of plate-shaped member and the excitation mechanism that makes oscillating plate excitation (encourage and shake).Because from the radiation pressure of the sound wave of the oscillating plate that is energized, plate-shaped member is from the surface flotation of oscillating plate.Oscillating plate ground connection.
The present invention provide in addition a kind of from the 1st object flotation gear the cargo interests method of getting to the 2nd object flotation gear carrying plate-shaped member.The the 1st and the 2nd object flotation gear has a plurality of oscillating plates that are made of conductive material separately.The the 1st and the 2nd object flotation gear utilizes the radiation pressure of the sound wave that is produced by each oscillating plate of excitation to come floating maintenance plate-shaped member separately.The 2nd object flotation gear also is installed on the support portion that can move back and forth.From the 1st object flotation gear during to the 2nd object flotation gear carrying plate-shaped member, in mutual equipotential of the oscillating plate that makes the 1st object flotation gear or connected to chassis while, under mutual equipotential of the oscillating plate that makes the 2nd object flotation gear or connected to chassis state, adjust the oscillating plate of each object flotation gear and the distance between the above-mentioned plate-shaped member and equal constant.
The present invention provides following goods taking device in addition.Goods taking device comprises: the support portion that can move back and forth; The travel mechanism that the support portion is moved back and forth; The object flotation gear, it is installed on the support portion, utilizes to make a plurality of oscillating plate excitations that are made of conductive material and the next floating maintenance plate-shaped member of radiation pressure of the sound wave that produces.Oscillating plate ground connection perhaps makes the mutual equipotential of oscillating plate.
The present invention provides the following device of receiving in addition.The device of receiving has a plurality of oscillating plates that are made of conductive material.The object flotation gear is installed on moving body, and its utilization makes the oscillating plate excitation and the radiation pressure of the sound wave that produces, floating maintenance plate-shaped member.Mutual equipotential of oscillating plate or mutual ground connection.
The present invention provides the method for electrically that removes of following plate-shaped member in addition.Remove the radiation pressure that method for electrically comprises the steps: to utilize the sound wave that the oscillating plate that is made of conductive material is encouraged and produce, the step of the plate-shaped member that floating maintenance is charged; Make under the oscillating plate connected to chassis state, the distance of adjusting between plate-shaped member and the oscillating plate becomes the following step of also removing electroplax shape parts of 1mm.
The present invention provides the method for electrically that removes of other plate-shaped member in addition.Remove the radiation pressure that method for electrically comprises the steps: to utilize the sound wave that the oscillating plate that is made of conductive material is encouraged and produce, the step of the plate-shaped member that floating maintenance is charged; Make under the oscillating plate connected to chassis state, the distance of adjusting between plate-shaped member and the oscillating plate becomes the following step of 1mm; Use electro-dissociator to remove the step of electroplax shape parts.
The present invention provides the goods taking device of other plate-shaped member in addition.Goods taking device comprises: the support portion that can move back and forth; The travel mechanism that the support portion is moved back and forth; Object flotation gear with a plurality of oscillating plates.The object flotation gear is installed on the support portion, utilizes the radiation pressure of the sound wave that makes each oscillating plate excitation and produce to come floating maintenance plate-shaped member.Each oscillating plate ground connection.Configuration removes brush, make front end except that brush be positioned at the face of the opposed oscillating plate of plate-shaped member roughly with on the one side.
The present invention provides the other device of receiving in addition.The device of receiving comprises that the radiation pressure that utilizes the sound wave that makes a plurality of oscillating plate excitations and produce comes the object flotation gear of floating maintenance plate-shaped member.Each oscillating plate ground connection.Configuration removes brush, make front end except that brush be positioned at the face of the opposed oscillating plate of plate-shaped member roughly with on the one side.
The description of the drawings
Fig. 1 (a) is a pattern block diagram of specializing the device of receiving in first embodiment of the present invention.
Fig. 1 (b) is the lateral plan of the device of receiving of Fig. 1 (a).
Fig. 2 (a) is the view of mounting glass substrate on oscillating plate.
Fig. 2 (b) is the scheme drawing of glass substrate floating condition.
Fig. 3 is the chart that the relation of time when peeling off glass substrate and current potential is shown.
Fig. 4 is the mode chart of illustration.
Fig. 5 (a) is the lateral plan of the stripping charge restraining device in second embodiment of the present invention.
Fig. 5 (b) is a birds-eye view of removing this device behind the oscillating plate from the stripping charge restraining device of Fig. 5 (a).
Fig. 6 (a) is the lateral plan of the effect of instruction diagram 5 (a) device.
Fig. 6 (b) is the lateral plan of the effect of instruction diagram 5 (a) device.
Fig. 6 (c) is the lateral plan of the effect of instruction diagram 5 (a) device.
Fig. 7 is the block diagram of receive device and goods taking device in the 3rd embodiment of the present invention.
Fig. 8 illustrates the horn (ホ one Application) on the device of receiving that is arranged on Fig. 7 and the front elevation of oscillator.
Fig. 9 is the birds-eye view of the goods taking device of Fig. 7.
Figure 10 is the lateral plan of the goods taking device of Fig. 7.
Figure 11 (a) is the view of plate-shaped member that has been illustrated on the device of receiving of Fig. 7 mounting.
Figure 11 (b) be illustrate Fig. 7 goods taking device get goods the time view.
Figure 12 is the lateral plan of the device of receiving in the 4th embodiment of the present invention.
Figure 13 is the block diagram of receive device and goods taking device in the 5th embodiment of the present invention.
Figure 14 is the figure that removes brush included in the device of receiving of Figure 13.
Figure 15 is the constitution diagram of plate-shaped member that has been illustrated on the device of receiving of Figure 13 mounting.
Figure 16 is the birds-eye view of the goods taking device in the 6th embodiment of the present invention.
Figure 17 is the birds-eye view of the goods taking device in the 7th embodiment of the present invention.
The specific embodiment
Below, based on Fig. 1 (a)~Fig. 4, illustrate and in the Fabrication procedure of liquid crystal board, specialized first embodiment of the present invention.
Shown in Fig. 1 (a), the device 11 of receiving as anti-stripping charge device is made of object flotation gear 13, has as the function of the temporary transient mounting of energy as the mounting portion of the glass substrate 12 (graphic long and short dash line) of plate-shaped member.Object flotation gear 13 is arranged on the stay bearing plate 14 of horizontal arrangement.
Object flotation gear 13 has a plurality of (being two in the present embodiment) oscillating plate 17 that is made of conductive material.On the both ends longitudinally of each oscillating plate 17, link oscillator 15 by horn 16 separately.Two oscillating plates 17 are arranged in parallel, and form the long rectangle narrower than the width of glass substrate 12.Support or floating maintenance glass substrate 12 by two oscillating plates 17.Each oscillating plate 17 ground connection.
Each horn 16 is concluded on cooresponding oscillating plate 17 by a plurality of screws 18 at its front end.By cooresponding oscillator 15 excitation each horn 16 (ホ one Application).Each horn 16 forms flat roughly cuboid.Below horn 16, fixing cylindrical-conical cone 16a integratedly.Cone 16a with opposed of the face that is fixed on the horn 16 in be fixed on the oscillator 15.The orthogonal axe of the front end face of horn 16 and oscillator 15, the axis of the axis of horn 16 and oscillator 15 is coaxial, vertically prolongs.Have, in Fig. 1 (a) and Fig. 1 (b), the ratio of the horn 16 of ignoring, cone 16a and oscillator 15 sizes is described again.
On oscillator 15, use ten thousand bright shape oscillators of ラ Application ジ ユ バ Application.Each oscillator 15 has a pair of piezoelectric element 19a of the annular of forming, 19b shown in Fig. 1 (b).Configuration forms the battery lead plate 20 of annular between two piezoelectric element 19a and 19b.Mode with holding electrode plate 20 and two piezoelectric element 19a and 19b disposes two derby 21a and 21b, by not shown bolted two derby 21a and 21b, constitutes oscillator 15.Above-mentioned bolt in being inserted into the tapped bore (not shown) that is formed among the derby 21b in, screw togather with the above-mentioned screw thread that is formed among the derby 21a.Two derby 21a and 21b are by the conducting of the mutual electric property of bolt.On derby 21a, form flange 22.Under the state in the hole (not shown) that the derby 21a of each oscillator 15 forms on being entrenched in stay bearing plate 14, be fixed on the stay bearing plate 14 by flange 22 by not shown bolt.
Each oscillator 15 connects cooresponding oscillator 23.Each battery lead plate 20 is connected with cooresponding oscillator 23 by distribution 24a, and the ground terminal of oscillator 23 connects derby 21b by distribution 24b.Constitute the excitation mechanism that makes oscillating plate 17 excitations by horn 16, cone 16a, oscillator 15 and oscillator 23.Have again, in Fig. 1 (a), only show the oscillator 23 of the oscillator 15 on the one side that connects each object flotation gear 13.
Below, the effect of the device that constitutes as previously mentioned is described.
Be easy to generate in the operation of static at friction process and gluing operation etc.,, be provided with the device 11 of receiving as mounting portion.When carrying out friction treatment and gluing processing, stop the driving of above-mentioned excitation mechanism, support glass substrate 12 is at the state that touches oscillating plate 17.
Make glass substrate 12 from oscillating plate 17, drive excitation mechanism when mobile.That is, driving oscillator 23, a/s resonant frequency (for example, about 20kHz) excitation oscillator 15, horn 16 longitudinal vibrations, by horn 16, oscillating plate 17 is energized, and carries out flexible vibration, produces standing wave on oscillating plate 17.So, shown in Fig. 2 (a), be supported on oscillating plate 17 contact conditions under glass substrate 12, utilize from the radiation pressure of the sound wave of oscillating plate 17 radiation, shown in Fig. 2 (b), from the surface flotation of oscillating plate 17.Floating distance illustrates in Fig. 2 (b) enlargedly for example more than the 100 μ m and in the scope below the 300 μ m.
Usually, when two of separation are in the object of contact condition, just produce stripping charge.Under the situation of glass substrate 12,, on glass substrate 12, also produce a large amount of electric charges if operation makes it peel off from oscillating plate 17 by an end of glass substrate 12 by hand.On the other hand, make 13 actions of object flotation gear, make under the situation that glass substrate 12 peels off from oscillating plate 17, some increases the current potential of glass substrate 12, but the increase of current potential is reduced to nearly 1/10 of situation that a end that above-mentioned operation by hand takes glass substrate 12 separates from oscillating plate 17.Fig. 3 expresses this state.
Shown in Fig. 3 dotted line, merely under the situation of oscillating plate 17 separation of glasses substrates 12, increase in the current potential short time of glass substrate 12 up near 400V, reduce then.On the other hand, shown in Fig. 3 solid line, under the situation that glass substrate 12 is peeled off from oscillating plate 17,, all be converged on the active potential though the current potential of glass substrate 12 increases.Though this reason is indeterminate, under the floating situation of sound wave, the distance between glass substrate 12 and the oscillating plate 17 keeps constant, and it is very little apart from G, therefore, as shown in Figure 4, can think that glass substrate 12 and oscillating plate 17 have the such function of cond.
Present embodiment has the following advantages.
Make glass substrate 12 when oscillating plate 17 moves, making oscillating plate 17 excitations produce super sonics, utilizing the radiation pressure of sound wave, making glass substrate 12 floating from oscillating plate 17.Because be used to the effect of the sound wave of self-excited oscillation plate 17, the distance that just becomes between glass substrate 12 and the oscillating plate 17 keeps constant state, therefore, can suppress the stripping charge of glass substrate 12.
Because oscillating plate 17 is conductive materials, therefore, carries out ground connection easily, just easy electrostatic prevention.
Glass substrate 12 is because action of ultrasonic waves and instantaneous floating from oscillating plate 17.Therefore, the operating time shortens, and capacity rating improves.
Owing to use long oscillating plate 17, therefore use the structure of short oscillating plate to compare with majority, used a spot of oscillating plate 17 just, and, each oscillating plate 17 connected to chassiss operation is become easy.
Owing in the friction process of the Fabrication procedure of liquid crystal board, use and receive device 11 as mounting portion, therefore, after friction treatment, make glass substrate 12 when mounting portion moves, can suppress the stripping charge of glass substrate 12.
Below, based on Fig. 5 (a)~Fig. 6 (c) second embodiment of the present invention is described.The difference of the embodiment of present embodiment and Fig. 1 (a)~Fig. 4 is, oscillating plate can move, when making the plate-shaped member that is positioned on the oscillating plate from the surface flotation of oscillating plate, corresponding with the amount of deflection of plate-shaped member, keep the constant distance between each oscillating plate and the plate-shaped member.For with the identical part of embodiment of Fig. 1 (a)~Fig. 4, the Reference numeral that mark is identical omits its detailed explanation.
Shown in Fig. 6 (a)~Fig. 6 (c), in the present embodiment, three oscillators 15,115 are set.The oscillator 15 of the central authorities in three oscillators 15,115 is fixed on the assigned position of stay bearing plate 14.The oscillating plate 17 that is arranged on two oscillators 115 of both sides in the mode of clamping central authorities oscillator 15 is arranged to movably, thereby can adjust the distance and the angulation of central oscillator 15 and oscillating plate 17.Each oscillating plate 17 ground connection.Have again, in Fig. 6 (a)~Fig. 6 (c), show the stay bearing plate 14 that supports central oscillator 15, omitted the diagram that supports the stay bearing plate 14 of both sides oscillator 115.
Shown in Fig. 5 (a) and Fig. 5 (b), support the movably oscillator 115 of two oscillating plates 17, be fixed on separately on the moving body 26 that can move along the pair of guide rails 25 that is fixed on the stay bearing plate 14.Guide rail 25 is arranged on the direction with vertical (with the written vertical direction of Fig. 5 (a) with Fig. 5 (b)) quadrature of oscillating plate 17 and prolongs.The top bending of guide rail 25, under its curvature and the floating condition during maintenance glass substrate 12 curvature of the state of deflection roughly the same.On stay bearing plate 14, form hole 14a, guide rail 25 is set in the both sides in its hole.Hole 14a allows that oscillator 115 and moving body 26 move jointly.Moving body 26 has the wheel 26a that rolls on guide rail 25.Moving body 26 is linking the plunger 28 of the linear actuator 27 that is fixed on the stay bearing plate 14.Moving body 26 is moved along guide rail 25 by the driving of linear actuator 27.On the linking portion of moving body 26 and plunger 28, employing can be allowed with respect to the structure that relatively moves of the above-below direction of the plunger 28 of moving body 26 (for example, the combination of pin and slotted hole).
Shown in Fig. 6 (c),, shown in Fig. 6 (b), make the surface flotation of glass substrate 12 from oscillating plate 17 making glass substrate 12 from when floating, at first making each oscillating plate 17 excitation with oscillating plate 17 state of contact.Under the big and thin situation of glass substrate 12, glass substrate 12 deflections owing to its deadweight, it is constant that distance between glass substrate 12 and the oscillating plate 17 just can not keep, for fear of this kind situation, state from Fig. 6 (b), drive each linear actuator 27 immediately, moving body 26 is moved to the position of regulation.Shown in Fig. 6 (a), the amounts of deflection of the oscillator of both sides 115 and oscillating plate 17 common contrast glass substrates 12 move on the constant assigned position of distance maintenance between oscillating plate 17 and the glass substrate 12.Its result producing under the situation of amount of deflection on the glass substrate 12, also can keep the constant distance between glass substrate 12 and the oscillating plate 17, can suppress the stripping charge of glass substrate 12.
Present embodiment also has following advantage except the advantage that the embodiment of Fig. 1 (a)~Fig. 4 has.
Part oscillating plate 17 is corresponding with the amount of deflection of glass substrate 12, constitutes movably structure jointly with oscillator 115, to keep the constant distance between oscillating plate 17 and the glass substrate 12.Thereby, even, also can suppress stripping charge well for the big and thin glass substrate that is easy to generate deflection 12.
Below, based on Fig. 7~Figure 11 (b), the device 111 of receiving of the 3rd embodiment of the present invention is described.
As shown in Figure 7, the device 111 of receiving has the 1st object flotation gear 112 that keeps plate-shaped members 215 such as glass substrate.The 1st object flotation gear 112 has the oscillating plate 114a~114e that forms rectangle.Oscillating plate 114a~114e size mutually is identical.If being arranged on corresponding to the oscillating plate on the corner location of plate-shaped member 215 (illustrating with long and short dash line) is the 1st~the 4th oscillating plate 114a~114d, being arranged on apart from the equidistant locational oscillating plate of the 1st~the 4th oscillating plate 114a~114d is the 5th oscillating plate 114e.As shown in Figure 8, constitute the horn 116 of excitation mechanism, conclude on each oscillating plate 114a~114e by not shown screw at front end separately.Each oscillating plate 114a~114e is ground connection respectively.
As shown in Figure 8, the horn 116 of formation truncated cone is installed on the middle body of cooresponding oscillating plate 114a~114e the axis of horn 116 and oscillating plate 114a~114e quadrature.The the 1st~the 5th oscillating plate 114a~114e horizontal arrangement.The axial quadrature of the front end face of horn 116 and oscillator 117.Horn 116 and oscillator 117 link in the mode that each center shaft of horn 116 and oscillator 117 is positioned on the straight line.
On oscillator 117, use ラ Application ヅ ユ バ Application shape oscillator.Oscillator 117 has a pair of piezoelectric element 118a and the 118b that forms annular as shown in Figure 8.Configuration forms the battery lead plate 119 of annular between two piezoelectric element 118a and 118b.Mode with holding electrode plate 119 and two piezoelectric element 118a and 118b disposes two derby 120a and 120b.Utilization constitutes oscillator 117 by not shown bolted derby 120a and 120b.Form not shown tapped bore on derby 120a, above-mentioned screw threaded is in above-mentioned tapped bore.Two derby 120a and 120b are by the conducting of the mutual electric property of above-mentioned bolt.
On derby 120a, form flange 121.Under the state in the hole (not shown) that the derby 120a of each oscillator 117 forms on being entrenched in stay bearing plate 122,, be fixed on the stay bearing plate 122 by flange 121 by not shown bolt.The face of the horn 116 relative with the face of fixing each oscillating plate 114a~114e is fixed on the flange 121.Battery lead plate 119 is connected with oscillator 123 by distribution 124a, and the ground terminal of oscillator 123 is connected with derby 120b by distribution 124b.Constitute the excitation mechanism that makes the 1st~the 5th oscillating plate 114a~114e excitation by horn 116, oscillator 117, oscillator 123.Have again, in Fig. 7, omitted diagram with the 1st oscillating plate 114a, the 3rd oscillating plate 114c and the cooresponding oscillator 123 of the 5th oscillating plate 114e.
Below, describe for goods taking device 125 in the carrying operation (getting the goods operation) of carrying out plate-shaped member 215 between device 111 and the not shown Handling device of receiving.As shown in Figure 9, goods taking device 125 comprises support portion 126 that can move back and forth and the travel mechanism 127 that support portion 126 is moved back and forth on the left and right directions of Fig. 9.Bifurcated is played in support portion 126, forms long chi shape, and has the 1st and the 2nd hold-down arm 126a and the 126b of the elongation of being parallel to each other.
As Fig. 7, Fig. 9 and shown in Figure 10, the 1st and the 2nd oscillating plate 128a and the 128b that form long chi shape prolong along cooresponding hold-down arm 126a and 126b, are supported on the support portion 126.In detail, as shown in figure 10, the first end of the 2nd oscillating plate 128b is fixed on the support portion 126 by the horn 130 by oscillator 129 excitations, the second end of the 2nd oscillating plate 128b is fixed on the leading section of the 2nd hold-down arm 126b by horn 131.Have again,, also similarly be supported on the 1st hold-down arm 126a and the support portion 126 with the 2nd oscillating plate 128b about the 1st oscillating plate 128a.Each oscillating plate 128a and 128b ground connection.The structure of oscillator 129 is identical with the oscillator 117 of the device 111 of receiving, and is connecting cooresponding oscillator 132.Constitute one the 2nd object flotation gear 133 by the 1st oscillating plate 128a, cooresponding oscillator 129, a pair of horn 130 and 131, cooresponding oscillator 132.Similarly, constitute one the 2nd object flotation gear 133 by the 2nd oscillating plate 128b, cooresponding oscillator 129, a pair of horn 130 and 131, cooresponding oscillator 132.
Travel mechanism 127 has the robot arm with ring 127a of known scaler (ス カ ラ) formula.Travel mechanism 127 utilizes not shown actuating device, when support portion 126 is moved back and forth, makes its lifting.Goods taking device 125 has the sensor (not shown) of the height of confirming the 1st and the 2nd hold-down arm 126a and 126b.
The following describes the effect of the device that constitutes as previously mentioned.
The receive floating maintenance plate-shaped member 215 of each oscillating plate 114a~114e of device 111.That is, utilize the driving of oscillator 123, a/s resonant frequency (for example, about 20kHz) excitation oscillator 117, horn 116 carries out longitudinal vibration.Cooresponding oscillating plate 114a~114e carries out flexible vibration by horn 116 excitations.Because each oscillating plate 114a~114e carries out flexible vibration and produces sound wave (standing wave) from each oscillating plate 114a~114e.Utilization is from the radiation pressure of the sound wave of each oscillating plate 114a~114e radiation, and shown in Figure 11 (a), plate-shaped member 215 is from the surface flotation of oscillating plate 114a~114e.Floating distance is below 1mm, for example more than the 100 μ m and the scope below the 300 μ m.The foment of control oscillating plate 114a~114e is so that equal constant apart from G, the generation of inhibition stripping charge and static between each oscillating plate 114a~114e and the plate-shaped member 215.
Then, undertaken getting the goods operation by goods taking device 125 by what floating condition remained on plate-shaped member 215 on the 1st object flotation gear 112.That is, at first, not shown Handling device stops, and shown in Figure 11 (a), remains in the state of assigned position by floating condition at plate-shaped member 215, disposes two hold-down arm 126a and 126b and is preparing on the in-position.Begin to drive travel mechanism 127 from this state, support portion 126 advances to the plate-shaped member 215 cooresponding goods yards of getting and puts.Then, shown in Figure 11 (b), plate-shaped member 215 rises, up between plate-shaped member 215 and two oscillating plate 128a and the 128b apart from GG with begin to get goods operate before on the assigned position that equates apart from GG between plate-shaped member 215 and the oscillating plate 114a~114e of (with reference to Figure 11 (a)).Then, utilization comes floating maintenance plate-shaped member 215 from the standing wave of two oscillating plate 128a and 128b generation.Afterwards, two hold-down arm 126a and 126b rise, and keep constant apart from GG between plate-shaped member 215 and two oscillating plate 128a and the 128b simultaneously, the specified altitude that has not almost had up to influence by the floating force of 112 pairs of plate-shaped members 215 of the 1st object flotation gear.Then, support portion 126 retreats, and plate-shaped member 215 moves jointly with the 2nd object flotation gear 133 of goods taking device 125.
Then, hold-down arm 126a and 126b moved to the cooresponding assigned position of not shown Handling device after, hold-down arm 126a and 126b descend, plate-shaped member 215 is moved on the above-mentioned Handling device.That is, be transported on the Handling device from the device 111 of receiving during, plate-shaped member 215 moves under contactless state.
Present embodiment has the following advantages.
Plate-shaped member 215 is carried to the 2nd object flotation gear 133 from the 1st object flotation gear 112 under contactless state.Each object flotation gear 112 of floating maintenance plate-shaped member 215 and 133 each oscillating plate 114a~114e, 128a and 128b ground connection.Because the foment of control each oscillating plate 114a~114e, 128a and 128b makes and equals constant apart from GG between each oscillating plate 114a~114e, 128a and 128b and the plate-shaped member 215, therefore, can suppress the generation of static.Thereby, do not need to be provided with neutralizers such as electro-dissociator.
In the present embodiment, need the speed of getting goods be slowed down for the generation that suppresses static.Therefore, can shorten the operating time, capacity rating is improved.
Owing to by a plurality of oscillating plate 114a~114es floating maintenance plate-shaped member 215 littler, therefore, compare, be easy to dispose oscillating plate 114a~114e, and do not disturb goods taking device 125 with the structure of using long oscillating plate than plate-shaped member 215.
Below, based on Figure 12, the device 211 of receiving in the 4th embodiment of the present invention is described.The device 211 of receiving has the chassis 233 that loads the 1st object flotation gear 212.The 1st object flotation gear 212 has oscillating plate 114a~114e and oscillator 417.The 1st object flotation gear 212 keeps plate-shaped member 215 at floating condition.By forming columniform horn 140, each oscillating plate 114a~114e is supported on the cooresponding oscillator 417.Each oscillator 417 is fixed on the Support bracket 134, so that each oscillating plate 114a~114e is positioned on the level attitude.Each oscillator 417 is connected with oscillator 123.Under the floating state that remains on the 1st object flotation gear 212, plate-shaped member 215 is moved to assigned position along with moving of chassis 233.
Below, based on Figure 13~Figure 15, the device 311 of receiving of the 5th embodiment of the present invention is described.The difference of the embodiment of present embodiment and Fig. 7~Figure 11 (b) is, added a plurality of brushes 213 that remove in the structure of the device 111 of receiving of Fig. 7.Have, the part mark identical Reference numeral identical with the embodiment of Fig. 7~Figure 11 (b) omits its explanation again.
As shown in figure 13, between the 1st and the 2nd oscillating plate 114a and the 114b, between the 1st and the 3rd oscillating plate 114a and the 114c, between the 3rd and the 4th oscillating plate 114c and the 114d, between the 2nd and the 4th oscillating plate 114b and the 114d, on the position of not disturbing with goods taking device 125, be provided with respectively and remove brush 213.Respectively remove brush 213 ground connection.As shown in figure 14, respectively remove brush 213 and have stay bearing plate 213a.Many conductive fiber 213b are set on stay bearing plate 213a.Configuration removes brush 213 and makes front end face except that brush 213, is that the leading section of conductive fiber 213b is positioned on the roughly same plane with the face of plate-shaped member 215 opposed the 1st~the 4th oscillating plate 114a~114d (with reference to Figure 15).Roughly the same from the front end face that removes brush 213 to face and the distance the plate-shaped member 215 of distance and the 1st~the 4th oscillating plate 114a~114d of plate-shaped member 215.Specifically, the distance of removing the opposed faces of the leading section of conductive fiber 213b of brush 213 and plate-shaped member 215 remains on below the 1mm.Therefore, can remove the electric charge of band on plate-shaped member 215 under the contactless state by removing brush 213.In addition, be not provided for carrying out the time of removing electricity of charged plate-shaped member 215 in addition, and can during carrying, remove expeditiously.
The goods of getting that goods taking device 125 in the present embodiment is described is operated.In the present embodiment, the floating plate-shaped member 215 that remains on the not shown Handling device is transported on the 1st object flotation gear 112 of the device 211 of receiving.
Stop the mobile of above-mentioned Handling device, press floating condition and keep plate-shaped member 215 in the state of assigned position, dispose two hold-down arm 126a and 126b and preparing on the in-position.From this state, utilize travel mechanism 127 is driven, it is mobile to be advanced in support portion 126, puts and two hold-down arm 126a and 126b are configured in the plate-shaped member 215 cooresponding goods yards of getting, and afterwards, makes it rise to assigned position.Come floating maintenance plate-shaped member 215 by standing wave from two oscillating plate 128a and 128b generation.After the specified altitude that hold-down arm 126a and 126b is risen to the influence of the floating force of plate-shaped member 215 is not almost had by the object flotation gear of Handling device, support portion 126 is retreated, plate-shaped member 215 is moved from Handling device.Then, after two hold-down arm 126a and 126b being advanced to and receive device 311 cooresponding assigned positions, two hold-down arm 126a and 126b are descended, carrying plate-shaped member 215 is to the device 311 of receiving.Thereby,, be transported on the 1st object flotation gear 112 from Handling device under the contactless state by goods taking device 125 by the not shown Handling device device 311 cooresponding locational plate-shaped members 215 that are transported to and receive.
During the device 311 of receiving kept plate-shaped member 215 by floating condition, the distance between adjustment plate-shaped member 215 and the 1st~the 5th oscillating plate 114a~114e was below 1mm.By the 1st~the 5th oscillating plate 114a~114e ground connection, adjust distance between plate-shaped member 215 and the 1st~the 5th oscillating plate 114a~114e below 1mm, under the charged situation of plate-shaped member 215, under contactless state, carry out plate-shaped member 215 except that.
Present embodiment has the following advantages.
By the radiation pressure of the sound wave that produces from the 1st~the 5th oscillating plate (film) 114a~114e, press floating condition from the 1st~the 5th oscillating plate 114a~114e and keep charged plate-shaped member 215.Utilize the distance of adjusting between plate-shaped member 215 and the 1st~the 5th oscillating plate 114a~114e below 1mm, under contactless state, carry out removing of plate-shaped member 215.Thereby,, just can under contactless state, remove the electric charge of band on the plate-shaped member 215 without the neutralizer of high prices such as electro-dissociator.In addition, can utilize the static of removing plate-shaped member 215 except that brush 213 reliably.
Since plate-shaped member 215 remove electricity the time, can spread all over plate-shaped member 215 whole faces and maintain distance between plate-shaped member 215 and the 1st~the 5th oscillating plate 114a~114e equably, therefore, can suppress the generation of static.
Two oscillating plate 128a and 128b ground connection.Therefore, can get goods operating period with goods taking device 125, remove the electric charge of part band on plate-shaped member 215.
Dispose the 1st~the 4th oscillating plate 114a~114d respectively in four jiaos of cooresponding places, between the oscillating plate 114a~114e of adjacency, be provided with and remove brush 213 with plate-shaped member 215.Thereby, compare with the situation of using long oscillating plate, be easy under the state that does not disturb goods taking device 125, be provided with and remove brush 213.
Below, based on Figure 16, the goods taking device 225 in the 6th embodiment of the present invention is described.The goods taking device 225 of present embodiment has been installed a plurality of brushes 213 that remove in the goods taking device 125 of Figure 13.But the width of two hold-down arm 126a shown in Figure 16 and 126b forms wideer than the width of the two hold-down arm 126a of Figure 13 and 126b.Along oscillating plate 128a and 128b vertically, on the cooresponding position of oscillating plate 128a and 128b both sides, be provided with and remove brush 213.The leading section that is configured to respectively to remove brush 213 is positioned on the roughly same plane with the face of plate-shaped member 215 opposed oscillating plate 128a and 128b.In the present embodiment, under floating condition (contactless state), get the plate-shaped member 215 of goods by goods taking device 225, also can remain on the goods taking device 225 during remove expeditiously.
Below, based on Figure 17, the goods taking device 325 in the 7th embodiment of the present invention is described.The oscillating plate 128a and the 128b of the long chi shape of formation in the goods taking device 125 of present embodiment replacement Figure 13, and a plurality of (being three among Figure 17) oscillating plate 334 is installed on each hold-down arm 126a and 126b.Each oscillating plate 334 is supported on the not shown oscillator by horn 116.At each oscillating plate 334 connected to chassis simultaneously, between adjacent oscillating plate 334, be provided with except that brush 213.That is, described oscillating plate 334 and remove brush 213 moves back and forth the direction alternate configurations on support portion 126 along support portion 126.Under this situation, under floating condition, get the plate-shaped member 215 of goods by goods taking device 125, also can remain on the goods taking device 125 during remove expeditiously.In addition, even do not increase the width of two hold-down arm 126a and 126b, also can on hold-down arm 126a and 126b, install and remove brush 213.
Have, embodiment also can be done distortion as follows again.
In the embodiment of Fig. 5 (a)~Fig. 6 (c), big and under the situation thin and easily deflection at glass substrate 12, replacing the deflection under downward protruding state of 12 one-tenths of floating maintenance glass substrates also can be the floating deflection under convex state that is held in.
In the embodiment of Fig. 5 (a)~Fig. 6 (c), as with the cooresponding formation of the amount of deflection of glass substrate 12, keep constant between glass substrate 12 and the oscillating plate 17 apart from G, replace the structure that moving body 26 is moved along guide rail 25, also the oscillator 115 that can fascinate can be set on stay bearing plate, can support the stay bearing plate of oscillator 115 with the lifting mechanism lifting.The combination that also can utilize lifting and fascinate under this situation is adjusted and is become specified value apart from G between glass substrate 12 and the oscillating plate 17.
In each embodiment of Fig. 1 (a)~Fig. 6 (c), the width of horn 16 also can be different with the width of oscillating plate 17, than the width of oscillating plate 17 is wide or narrow can.Be preferably in more than the width of oscillating plate 17.
The chassis 233 of Figure 12 also can form with conductor.Under this situation, each oscillating plate 114a~114e, 128a, 128b are connected with chassis 233 electric property.Therefore, the current potential of each oscillating plate 114a~114e, 128a, 128b equals constant.
In each embodiment of Figure 13~Figure 17, plate-shaped member 215 is transported to receive the device on device 311 and 411, be not limited under contactless state, get the goods taking device 125 of goods, for example also can carry plate-shaped member 215 to device 311 and 411 of receiving, and be transported on receive device 311 and 411 by Handling device with adsorption plant.Receive device 311 and 411 after having received plate-shaped member 215, press floating condition and keep plate-shaped member 215,, remove the electric charge of band on plate-shaped member 215 during this up to getting goods plate-shaped member 215 to other place by goods taking device 125.
In each embodiment of Figure 13~Figure 17, also can on receive device 311 and 411, not be provided with and remove brush 213, and the distance of only adjusting oscillating plate 114a~114e and plate-shaped member 215 is removed the electric charge of band on plate-shaped member 215 below 1mm.But, utilize and with improving except that electrical efficiency except that brush 213.
In each embodiment of Figure 13~Figure 17, also can adjust distance between plate-shaped member 215 and the 1st~the 5th oscillating plate 114a~114e below 1mm, use electro-dissociator to remove.Under this situation, in stripping charge, suppress to suppress the generation of clean static by sound wave floating with electro-dissociator.In addition, owing to be to have under the state of air layer to remove electricity between oscillating plate and the plate-shaped member, therefore, can remove electricity (inhibition static is below tens~1kV) accurately by electro-dissociator.
In each embodiment of Fig. 1 (a)~Figure 17, oscillator 15,115,117,129,417 is not limited to ラ Application ヅ ユ バ Application shape oscillator, also can use its also oscillator.
In each embodiment of Fig. 1 (a)~Figure 17, under the situation that area is big, plate-shaped member is little of each oscillating plate, also can not necessarily make oscillating plate ground connection, oscillating plate itself plays the connected to chassis effect under this situation.
In each embodiment of Fig. 1 (a)~Figure 17, be not limited on oscillating plate 17 also can form stay bearing plate 14 or the framework of the device 11 of receiving by conductive material by hard wire and ground bonded assembly method, between they and ground by distribution ground connection.
In each embodiment of Fig. 1 (a)~Figure 17, plate-shaped member is not limited to glass substrate 12, also can be other objects, for example wafer conductor.
In each embodiment of Fig. 1 (a)~Figure 17, oscillating plate to horn fixedly be not limited to conclude by screw, also can use adhesive agent or fixing with soldering and welding.
In each embodiment of Fig. 1 (a)~Figure 17, replace oscillating plate ground connection and also can make each oscillating plate equipotential.For example, if be connected than the bulky conductor of each oscillating plate, the current potential of each oscillating plate just current potential with conductor is identical, the current potential of each oscillating plate is just constant.

Claims (17)

1. the stripping charge suppressing method of a plate-shaped member, it is characterized in that, make the plate-shaped member that is positioned in the mounting portion when mounting portion moves, utilizing the radiation pressure of the sound wave that makes above-mentioned mounting portion's excitation and produce, making above-mentioned plate-shaped member floating from above-mentioned mounting portion.
2. stripping charge suppressing method as claimed in claim 1 is characterized in that, above-mentioned mounting portion is made of conductive material, and ground connection.
3. stripping charge restraining device, it is characterized in that, when the plate-shaped member that is positioned in the mounting portion is peeled off by above-mentioned mounting portion, suppress in the charged stripping charge restraining device of plate-shaped member, above-mentioned mounting portion is made of the object flotation gear, above-mentioned object flotation gear comprise can mounting the oscillating plate that constitutes by conductive material of plate-shaped member and the excitation mechanism that makes above-mentioned oscillating plate excitation, owing to the radiation pressure from the sound wave of the oscillating plate that is energized makes the surface flotation of above-mentioned plate-shaped member from above-mentioned oscillating plate, oscillating plate ground connection.
4. stripping charge restraining device as claimed in claim 3, it is characterized in that, above-mentioned oscillating plate is a plurality of one of them, for when making the above-mentioned plate-shaped member that is positioned on the above-mentioned oscillating plate from the surface flotation of this oscillating plate, corresponding with the amount of deflection of above-mentioned plate-shaped member, keep the constant distance between oscillating plate and the above-mentioned plate-shaped member, and have the travel mechanism that above-mentioned oscillating plate is moved.
5. as claim 3 or 4 described stripping charge restraining devices, it is characterized in that above-mentioned oscillating plate forms microscler.
6. as claim 3 or 4 described stripping charge restraining devices, it is characterized in that above-mentioned plate-shaped member is a glass substrate.
7. stripping charge restraining device as claimed in claim 4 is characterized in that, above-mentioned travel mechanism make above-mentioned oscillating plate simultaneously fascinate the one side lifting.
8. the cargo interests method of getting of a plate-shaped member, it is characterized in that, getting the cargo interests method from the 1st object flotation gear to the 2nd object flotation gear carrying plate-shaped member, the the 1st and the 2nd object flotation gear has a plurality of oscillating plates that are made of conductive material separately, the radiation pressure of the sound wave that utilization is produced by each oscillating plate of excitation comes the above-mentioned plate-shaped member of floating maintenance, the 2nd object flotation gear also is installed on the support portion that can move back and forth, from the 1st object flotation gear during to the 2nd object flotation gear carrying plate-shaped member, mutual equipotential of the oscillating plate that makes above-mentioned the 1st object flotation gear or ground connection, and, under mutual equipotential of the oscillating plate that makes above-mentioned the 2nd object flotation gear or connected to chassis state, adjust the oscillating plate of each object flotation gear and the distance between the above-mentioned plate-shaped member and equal constant.
9. a goods taking device is characterized in that, comprising:
The support portion that can move back and forth;
The travel mechanism that above-mentioned support portion is moved back and forth;
The object flotation gear, it is installed on the above-mentioned support portion, utilizes to make a plurality of oscillating plate excitations that are made of conductive material and the next floating maintenance plate-shaped member of radiation pressure of the sound wave that produces, and above-mentioned oscillating plate ground connection perhaps makes the mutual equipotential of oscillating plate.
10. device of receiving, it is characterized in that, the object flotation gear is installed on moving body, its utilization makes a plurality of oscillating plate excitations that are made of conductive material and the radiation pressure of the sound wave that produces, floating maintenance plate-shaped member makes mutual equipotential of above-mentioned oscillating plate or mutual ground connection.
11. the device of receiving as claimed in claim 10 is characterized in that the framework of above-mentioned moving body is made of conductive material, above-mentioned each oscillating plate is connected with said frame.
12. a plate-shaped member remove method for electrically, it is characterized in that, comprising:
Utilization makes the oscillating plate excitation that is made of conductive material and the radiation pressure of the sound wave that produces, the step of the plate-shaped member that floating maintenance is charged;
Under above-mentioned oscillating plate connected to chassis state, the distance of adjusting between above-mentioned plate-shaped member and the above-mentioned oscillating plate becomes the following step of also removing electric above-mentioned plate-shaped member of 1mm.
13. plate-shaped member as claimed in claim 12 remove method for electrically, it is characterized in that configuration removes brush, make front end except that brush be positioned at the face of the opposed above-mentioned oscillating plate of above-mentioned plate-shaped member roughly with on the one side.
14. a plate-shaped member remove method for electrically, it is characterized in that, comprising:
Utilization makes the oscillating plate excitation that is made of conductive material and the radiation pressure of the sound wave that produces, the step of the plate-shaped member that floating maintenance is charged;
Under above-mentioned oscillating plate connected to chassis state, the distance of adjusting between above-mentioned plate-shaped member and the above-mentioned oscillating plate becomes the following step of 1mm;
Use electro-dissociator to remove the step of electroplax shape parts.
15. the goods taking device of a plate-shaped member is characterized in that, comprising:
The support portion that can move back and forth;
The travel mechanism that above-mentioned support portion is moved back and forth;
Object flotation gear with a plurality of oscillating plates, object flotation gear are installed on the above-mentioned support portion, utilize the radiation pressure of the sound wave that makes each oscillating plate excitation and produce, floating maintenance plate-shaped member,
Above-mentioned each oscillating plate ground connection, configuration removes brush, make front end except that brush be positioned at the face of the opposed above-mentioned oscillating plate of above-mentioned plate-shaped member roughly with on the one side.
16. device of receiving, it is characterized in that, comprise that the radiation pressure that utilizes the sound wave that makes a plurality of oscillating plate excitations and produce comes the object flotation gear of floating maintenance plate-shaped member, above-mentioned each oscillating plate ground connection, configuration removes brush, make front end except that brush be positioned at the face of the opposed above-mentioned oscillating plate of above-mentioned plate-shaped member roughly with on the one side.
17. the device of receiving as claimed in claim 16 is characterized in that, above-mentioned object flotation gear and the above-mentioned brush that removes are installed on moving body.
CNB031580890A 2002-08-09 2003-08-07 Electricity discharge and goods taking, stripping charge suppressing method and device, goods taking and receiving device Expired - Fee Related CN1310810C (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP232978/02 2002-08-09
JP232977/02 2002-08-09
JP232978/2002 2002-08-09
JP2002232977A JP3894071B2 (en) 2002-08-09 2002-08-09 Method for removing electricity from plate-like member, load receiving device and load receiving device
JP232976/2002 2002-08-09
JP2002232976A JP4359028B2 (en) 2002-08-09 2002-08-09 Peeling suppression device
JP232976/02 2002-08-09
JP2002232978A JP4029689B2 (en) 2002-08-09 2002-08-09 Loading method for plate-like members
JP232977/2002 2002-08-09

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CN1310810C CN1310810C (en) 2007-04-18

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CN110193811A (en) * 2018-02-26 2019-09-03 江苏金风科技有限公司 The method of support device, support frame and control support device movement
CN111377246A (en) * 2018-12-28 2020-07-07 上海微电子装备(集团)股份有限公司 Material conveying device and system

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JP4361538B2 (en) * 2006-02-16 2009-11-11 株式会社フューチャービジョン Static elimination method for glass substrate
CN109987414A (en) * 2019-05-08 2019-07-09 广州林恩静电科学技术应用有限公司 A kind of flat panel display product roller transmissioning device with static safety technology scheme

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JP3552793B2 (en) * 1995-06-15 2004-08-11 株式会社カイジョー Object transfer device
JP3122061B2 (en) * 1997-07-22 2001-01-09 株式会社カイジョー Cluster tool type single wafer processing equipment with ultrasonic levitation transport mechanism
DE10039482B4 (en) * 2000-08-08 2016-03-24 Zs-Handling Gmbh Handler for transporting flat substrates used in the semiconductor industry
JP2002167026A (en) * 2000-12-01 2002-06-11 Toyota Industries Corp Article levitating and carrying device

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Publication number Priority date Publication date Assignee Title
CN110193811A (en) * 2018-02-26 2019-09-03 江苏金风科技有限公司 The method of support device, support frame and control support device movement
CN111377246A (en) * 2018-12-28 2020-07-07 上海微电子装备(集团)股份有限公司 Material conveying device and system

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CN1310810C (en) 2007-04-18
TW200404725A (en) 2004-04-01

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