TWI226663B - Glass substrate and precision finishing method thereof - Google Patents
Glass substrate and precision finishing method thereof Download PDFInfo
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- TWI226663B TWI226663B TW92131929A TW92131929A TWI226663B TW I226663 B TWI226663 B TW I226663B TW 92131929 A TW92131929 A TW 92131929A TW 92131929 A TW92131929 A TW 92131929A TW I226663 B TWI226663 B TW I226663B
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1226663 五、發明說明（1) "___ 【發明所屬之技術領域] 本發明是有關於一種板材之精修方法，且特曰 於一種利用化學蝕刻來去除切割面之毛邊及玻璃 ^ ^關 璃板材之精修方法。 $的坡 【先前技術】 在半導體產業中，積體電路（Integrated Cir^uit I c )的生產主要分為三個階段··積體電路的設計、積 路的製作及積體電路的封裝（Package)等。其中，封誓 之目的在於防止裸晶片受到外界之濕氣及灰塵等因素的聲 響，並提供裸晶片與外部電路，例如印刷電路板 、 、 (Printed Circuit Board, PCB)或其他封裝用基板之間 電性連接的媒介。然而，在光電產品蓬勃發展的今日，各 類光電元件已經普遍地應用成熟的半導體製程技術，並不 斷地朝著微型化及多功能化的方向發展，應用半導體製程 技術之常見的光電元件例如有 ''電荷耦合" (Charge-Coupled Device， CCD)晶片、、'CMOS 影像感 測"（C Μ 0 S I m a g e S e n s 〇 r， C I S )晶片、太陽能電池 (Solar Cell)、生化晶片（Bio- Chip)及其他光電元件 等。一般而言，光電元件之晶片的主動面（Active Surface )通常具有一功能區域，其用以提供感測、發光 或其他功能。 習知之光電元件的封裝通常先將一玻璃基板切割為適 當之封裝尺寸，並將切割後之玻璃基板配置於晶片之主動 表面的功能區域上方，使得外界之光線得以透過此透明基1226663 V. Description of the invention (1) " ___ [Technical field to which the invention belongs] The present invention relates to a method for refining a plate, and particularly to a method for removing burrs and glass on a cutting surface by using chemical etching ^ ^ Guanli Finishing method of plate. $ 的 坡 【Previous technology】 In the semiconductor industry, the production of integrated circuits (Integrated Cir ^ uit I c) is mainly divided into three stages: · Design of integrated circuits, production of integrated circuits, and packaging of integrated circuits ( Package) and so on. Among them, the purpose of the seal is to prevent the bare chip from being affected by external moisture and dust, and to provide the bare chip with external circuits, such as printed circuit boards, printed circuit boards (PCBs), or other packaging substrates. Electrical connection medium. However, in today's booming optoelectronic products, various types of optoelectronic components have generally applied mature semiconductor process technology, and have continued to develop in the direction of miniaturization and multifunction. Common optoelectronic components that use semiconductor process technology, such as '' Charge-Coupled (Charge-Coupled Device, CCD) wafers, 'CMOS image sensing " (C M 0 SI mage Sensors, CIS) wafers, solar cells (Solar Cells), biochemical wafers (Bio -Chip) and other optoelectronic components. Generally speaking, the active surface of the chip of the photovoltaic device usually has a functional area, which is used to provide sensing, light emitting, or other functions. Conventional packaging of optoelectronic components usually first cuts a glass substrate into an appropriate package size, and arranges the cut glass substrate above the functional area of the active surface of the wafer, so that external light can pass through this transparent substrate.
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五、發明說明（2) 板而照射至 製程後，可 外界之濕氣 正常的運作 往往會於玻 留有玻璃碎 留碎屑。如 玻璃碎屑掉 片無法正常 為了避 成後，再對 (Grinding 以去除切割 磨時需逐次 對使得整體 需使用較高 此，如何加 本，已成為 題。 【發明内容 有鑒於 精修方法， 以加快玻璃 本發明 晶片之主動 於透明基板 及灰塵無法 。然而，習 璃基板的切 屑之情形， 此一來，在 落於晶片·之 運作，相對 免上述之情 玻璃基板之 )等精修（ 面上的毛邊 對不同之切 之製程時間 精度之研磨 快玻璃基板 當前光電元 此’本發明 其利用化學 基板之精修 的另一目的 面的功能區 與晶片之間 進入此密閉 知技術在進 割邊緣產生 且經洗淨處 進行光電元 主動面的功 降低封裝製 形’習知通 切割面進行 Precision 以及玻璃碎 割面進行研 加長。此外 機台，也將 之精修速度 件之封裝技 的目的就是 蝕刻之方式 速度，並可 係提供一種 域。同時， 形成一密閉 腔室，故可 行玻璃基板 毛邊、或是 王里後亦無法 件之封裝時 能區域上， 程的良率。 常會在玻璃 例如機械研 Finishing 屑。然而， 磨，因此相 ，由於進行 使得成本相 並設法降低 術中亟待解 在提供一種 對玻璃基板 節省製作成 玻璃基板， 在完成封裝 腔室，所以 讓晶片維持 之切割時， 切割面上殘 完全移除殘 便谷易使 因而導致晶 基板切割完 磨 )的動作， 由於機械研 當耗時，相 機械研磨時 對提高，因 其製作成 決之重要課 玻璃基板之 進行精修， 〇 其係透過化V. Description of the invention (2) After the board is irradiated to the manufacturing process, the external moisture can normally remain in the glass and leave debris. If the glass chips cannot be cut off normally, in order to avoid them, then (Grinding to remove the cutting mill needs to be paired one by one so that the overall need to use higher. Therefore, how to add cost has become a problem. [Summary of the Invention In view of the refining method, In order to speed up the glass, the wafer of the present invention is not active on the transparent substrate and dust. However, the situation of cutting chips on the glass substrate, as a result, the operation of falling on the wafer, is relatively exempt from the above conditions (such as the glass substrate) The burr on the surface is different from the cutting time accuracy of the grinding fast glass substrate. The current photovoltaic element is used in the present invention. The present invention uses chemical substrate refining to enter between the functional area of the surface and the wafer. The cutting edge is generated and the power of the active surface of the photovoltaic cell is reduced through the cleansing. The packaging shape is reduced. The cutting surface is cut by Precision and the glass cutting surface is lengthened. In addition, the machine also refined the packaging technology of speed parts The purpose is to speed the etching method and provide a domain. At the same time, a closed chamber is formed, so glass is feasible. The burr edge of the board, or the area where the queen can't be packaged, can yield a good yield on the process. Often, it will be used in glass such as mechanical grinding Finishing chips. However, the grinding, therefore, the cost of the phase and the way to reduce the surgery need to be solved. In providing a method of saving a glass substrate into a glass substrate, and completing the packaging cavity, so that when the wafer is maintained for dicing, the cutting surface is completely removed, and the residue valley is easily removed, which will cause the crystal substrate to be cut and ground.) When mechanical research is time-consuming, it is improved during phase mechanical polishing. Because it is an important lesson in the production of glass substrates, it is necessary to refine glass substrates.
1226663 五、發明說明（3) 學蝕刻之方式進行精修，並具有較為理想之表面與最佳潔 淨度，用以提高封裝製程之良率。 基於上述目的，本發明提出一種玻璃基板之精修方 法，此方法適用於一玻璃基板’且此玻璃基板例如具有一 第一表面、對應之一第二表面以及連接於第一表面與第二 表面之間的多個側面。此玻璃基板之精修方法如下：首 先，於玻璃基板之第一表面與第二表面分別貼覆一保護膜 與保護板其中之一；接著，對玻璃基板之側面進行化學蝕 刻；最後，移除上述之保護膜或保護板。 在本發明的較佳實施例中，上述之貼覆保護膜或保護 板的方式例如可於保護膜（或保護板）與第一表面及第二 表面之間形成真空，或利用靜電原理，以使保護膜或保護 板分別完全吸附於第一表面及第二表面。此外，對玻璃基 板之側面進行化學蝕刻時所採用的化學溶劑例如包括氫氟 酸，而在進行化學蝕刻之後，且在移除保護膜或保護板之 前，更例如包括對玻璃基板進行清洗的動作，以將殘留於 玻璃基板上之化學溶劑清除。另外，上述之移除保護膜或 保護板的方式例如可由玻璃基板之邊緣處脫離保護膜或保 護板，而本發明之玻璃基板之精修方法所採用的保護膜與 保護板例如分別可為軟質塑膠膜與軟質塑膠板。 基於上述目的，本發明更提出一種玻璃基板，其例如 可藉由本發明之玻璃基板的精修方法製作而成。此玻璃基 板例如具有一第一表面、對應之一第二表面以及連接於第 一表面與第二表面之間的多個側面，而此玻璃基板之特徵1226663 V. Description of the invention (3) The etching method is used for refining, and has an ideal surface and the best cleanliness to improve the yield of the packaging process. Based on the above objectives, the present invention proposes a method for refining a glass substrate. The method is applicable to a glass substrate, and the glass substrate has, for example, a first surface, a corresponding second surface, and a connection between the first surface and the second surface. Between multiple sides. The method of refining the glass substrate is as follows: first, one of a protective film and a protective plate is respectively pasted on the first surface and the second surface of the glass substrate; then, the side of the glass substrate is chemically etched; The above-mentioned protective film or protective plate. In a preferred embodiment of the present invention, the above-mentioned method of applying a protective film or a protective plate may, for example, form a vacuum between the protective film (or the protective plate) and the first surface and the second surface, or use the principle of static electricity to The protective film or the protective plate is completely adsorbed on the first surface and the second surface, respectively. In addition, the chemical solvent used when chemically etching the side of the glass substrate includes, for example, hydrofluoric acid, and after the chemical etching and before removing the protective film or the protective plate, for example, the action of cleaning the glass substrate is further included. To remove chemical solvents remaining on the glass substrate. In addition, the above-mentioned method for removing the protective film or the protective plate can be separated from the protective film or the protective plate at the edge of the glass substrate, and the protective film and the protective plate used in the method for refining the glass substrate of the present invention can be soft, respectively. Plastic film and soft plastic plate. Based on the above-mentioned object, the present invention further provides a glass substrate, which can be made, for example, by the refining method of the glass substrate of the present invention. The glass substrate has, for example, a first surface, a corresponding second surface, and a plurality of sides connected between the first surface and the second surface. The characteristics of the glass substrate
12486twf.ptd 第8頁 1226663 五、發明說明（4) 在於第一表 在本發 面與側面之 例如包括一 基於上 學蝕刻的方 基板之第一 在蝕刻 側面， 別於習 明之玻 態，且 發明之 基板及 化學蝕 較為簡 為 顯易懂 細說明 【實施 請 精修方 首 例如為 的過 而可 知在 璃基 可使 玻璃 其精 刻， 〇〇 早， 讓本 ，下 如下 方式 參考 法的 先， 二氧 面、第 明的較 連接處 氧化石夕 述，本 式對玻 表面及 程中， 維持第 機械研 板的側 玻璃基 基板可 修方法 故可提 因此更 發明之 文特舉 二表面以及每—側面 佳實施例中，上述之第一 係R角（弧形角），一表 …1内） 而破璃基板之材質 〇 第二表 發明 璃基 第二 僅會 一表 磨後 面在 板的 提南 ，係 供較 可有 上述 一較 之玻璃 板進行 表面貼 餘刻未 面與第 所形成 受到化 邊緣具 封裝製 同時對 快之製 效降低 和其他 佳實施 f板及其精修方法係利用化 $修的動作，其中由於玻璃 ，有保護膜或保護板，因此 又到保護膜或保護板覆蓋之 二表面之完整性。此外，有 =不透光的研磨表面，本發 學麵刻後，將呈現透明的狀 有1^角修飾的效果。藉由本 程之良率，而本發明之玻璃 破璃基板之所有切割面進行 程速度，且因其所需之設備 製作成本。 目的、特徵、和優點能更明 例，並配合所附圖式，作詳 ，= 1 D圖，其依序繪示本發明之玻璃基板之 不思圖。 2 1A圖所示，提供一玻璃基板11 〇，其材質 石夕。此外，玻璃基板1 1 0例如具有一第一表12486twf.ptd Page 8 1226663 V. Description of the invention (4) The first table on the hair surface and side, for example, includes a square substrate based on school etching. The first is on the side of the etching, which is different from the glassy state of the tradition, and the invention The substrate and the chemical etching are relatively simple and easy to understand. [Please implement the refining of the leader for example. You can know that the glass can be engraved on the glass base. Early, let ’s read this. Dioxin surface, Diming ’s relatively connected joints are described below. In this formula, the glass surface and the process of maintaining the side glass substrate of the mechanical research board can be repaired. Therefore, it is possible to mention the second invention. And in the preferred embodiment of each side, the above-mentioned first series of R angles (curved angles), a table ... 1) and the material of the broken glass substrate. The south of the board is designed to be able to have the above-mentioned one compared to the glass board for surface mounting, not to be engraved, and the surface formed by the first edge with a packaged system. At the same time, the efficiency of the board is reduced, and other boards are implemented. And its refining method uses the action of repairing. Among them, because glass has a protective film or protective plate, it also reaches the integrity of the two surfaces covered by the protective film or protective plate. In addition, there is an opaque polished surface. After the surface is engraved, it will appear transparent and have the effect of 1 ^ angle modification. With the yield of the process, all cutting surfaces of the glass-breaking glass substrate of the present invention have a process speed, and because of the equipment manufacturing cost required by the process. The purpose, features, and advantages can be more clearly exemplified, and in accordance with the accompanying drawings, for details, = 1D drawing, which sequentially shows the unintended drawing of the glass substrate of the present invention. As shown in FIG. 2A, a glass substrate 110 is provided, and the material is Shi Xi. In addition, the glass substrate 1 1 0 has a first table, for example.
1226663 五、發明說明（5) 面112、對應之一第二表面114以及連接於第一表面112與 第二表面1 1 4之間的多個側面1 1 6 ，其中側面1 1 6例如為玻 璃基板1 1 0進行切割時之切割面，其上例如具有切割後所 形成之毛邊或玻璃碎屑等。 接著，如第1B圖所示，於玻璃基板11〇之第一表面ι12 與第二表面1 1 4分別貼覆一保護膜（或保護板）丨2 〇，其例 如為軟質塑膠膜（或軟質塑膠板）。在此步驟中，例如可 於保護膜（或保護板）120與第一表面112及第二表面114 之間形成真空，以使保護膜（或保護板）丨2 〇緊密吸附於 第一表面1 1 2及第二表面1 1 4。此外，依照本發明之特徵， 例如更可藉由靜電原理或其他技術來進行保護膜（或保護 板）1 2 0之貼覆動作。 然後’如第1 C圖所示，對玻璃基板1 1 〇之側面1 1 6進行 化學#刻。在此步驟中所採用之化學溶劑例如包括氫氟 酸’其中在進行化學蝕刻時，玻璃基板丨丨〇係浸泡於氫氟 酸中’由於玻璃基板110之第一表面112與第二表面114皆 覆蓋有保護膜（或保護板）丨2 〇，因此氫氟酸僅會對玻璃 基板1 1 0之側面1 1 6進行蝕刻，以將毛邊或玻璃碎屑精修去 除°此外’在完成此步驟之後，更例如可對玻璃基板丨i 〇 ，行清洗的動作，此舉在於將殘留於玻璃基板丨丨〇上之氫 氣酸清除，以避免在後續之步驟中，殘留之氫氟酸對玻璃 基板表面造成破壞。 最後’如第1D圖所示，由玻璃基板110之邊緣處脫離 保護膜（或保護板）i 2 〇，其中由於保護膜（或保護板）1226663 V. Description of the invention (5) The surface 112, a corresponding second surface 114, and a plurality of side surfaces 1 1 6 connected between the first surface 112 and the second surface 1 1 4. The side surface 1 1 6 is, for example, glass. The cutting surface when the substrate 1 10 is cut has, for example, burrs or glass chips formed after the cutting. Next, as shown in FIG. 1B, a protective film (or a protective plate) 2 is attached to the first surface ι12 and the second surface 1 1 4 of the glass substrate 11 〇, such as a soft plastic film (or soft Plastic plate). In this step, for example, a vacuum may be formed between the protective film (or the protective plate) 120 and the first surface 112 and the second surface 114 so that the protective film (or the protective plate) 丨 2 is closely adhered to the first surface 1 1 2 和 第二 表面 1 1 4． In addition, according to the features of the present invention, for example, the protective film (or protective plate) 1 2 0 can be applied by electrostatic principle or other techniques. Then, as shown in FIG. 1C, the side surface 1 1 6 of the glass substrate 1 1 0 is chemically etched. The chemical solvents used in this step include, for example, hydrofluoric acid, where the glass substrate is immersed in hydrofluoric acid during chemical etching, because the first surface 112 and the second surface 114 of the glass substrate 110 are both Covered with a protective film (or protective plate) 2 0, so hydrofluoric acid will only etch the side 1 1 6 of the glass substrate 1 1 6 to trim and remove burrs or glass debris. In addition, 'This step is completed After that, for example, the glass substrate 丨 i 〇 can be cleaned. This action is to remove the hydrogen acid remaining on the glass substrate 丨 丨 〇 to avoid the residual hydrofluoric acid on the glass substrate in the subsequent steps. Damage to the surface. Finally, as shown in FIG. 1D, the protective film (or protective plate) i 2 〇 is released from the edge of the glass substrate 110, where the protective film (or protective plate)
12486twf.ptd 第10頁 122666312486twf.ptd Page 10 1226663
120僅藉由真空作用或靜電 此可輕易地藉由上述之方式移、於玻璃基板1 1()上，因 120，而不會對玻璃基板110:以：（或保=) 請參考第2圖，其繪示本W面/成;任何損傷或殘留。 板的局部側視放大圖。其中t可月^之/父佳實施例之玻璃基 1 1 0之伽而1 1 β产π、風儿姐 了以^楚地見到玻璃基板 H U <侧面1 1 6在經過化學叙為丨 Μ 6 # - ^ ^ ^ 蝕刻之後，原有之毛邊與玻璃碎 项凡全移除，並呈現穿盖 曰 習知$ I、# t M rn 0 t 、的日日格表面。如此一來，與 為夭之不透光的研磨表面相齡 側面因為具有較佳之Ϊ整：；：3本發明之玻璃基板的 Α Λ fr _ m 1 ί 因此呈現透明的狀態，且因 ,,η ^ ., 乳7局寺向性餘刻，因此可在玻璃基板 1 1 〇之邊緣形成R角（弧形角）i J 8。 應用上述之玻璃基板，可進行一光 程，而其所形成之封裝結構如下所示。 ^ ^ 一請參考第3圖，其繪示本發明之較佳實施例之一種光 電元件封裝結構的示意圖。光電元件封裝結構3 〇 〇例如包 括一承載基板310、一玻璃基板3 2 0、一晶片3 3 0、一外框 34 0以及多條導線35〇，其中晶片33〇係配置於承載基板31〇 上’而玻璃基板3 2 0係配置於晶片3 3 0之上方，並藉由外框 3 4 0連接至承載基板3 1 〇。此外，外框3 4 〇之材質例如可為 陶兗材料或塑膠材料等，而晶片3 30例如具有一主動表面 3 3 0a ’其上例如具有一功能區域3 32及圍繞功能區域3 3 2配 置之多個銲墊3 34，承載基板310例如具有一承載表面310a 以及對應之一背面3 1 0 b，其中承載表面3 1 0 a例如具有多個 第一接點3 1 2，而背面3 1 0 b例如具有與第一接點3 1 2電性連120 can be easily moved on the glass substrate 1 1 () only by the action of vacuum or static electricity. Because of 120, it will not affect the glass substrate 110: (or guarantee =) Please refer to Section 2 Figure, which depicts this surface / into; any damage or residue. A partial enlarged side view of the board. Among them, t can be used as a basis for the glass substrate 1 1 0 and 1 1 β produced by the father ’s example, and 1 1 β is produced by the wind. Saw the glass substrate HU < side 1 1 6 after chemical description as丨 Μ 6 #-^ ^ ^ After etching, all the original burrs and broken glass items were removed, and the surface of the sun and the grid of the conventional $ I, # t M rn 0 t, and the appearance of the cover are presented. In this way, the side surface with the opaque polishing surface is relatively smooth because of the better finishing:; 3 Α Λ fr _ m 1 ί of the glass substrate of the present invention is therefore in a transparent state, and, η ^., Ru 7 rounds have anisotropy, so it can form an R angle (arc angle) i J 8 on the edge of the glass substrate 1 10. An optical path can be performed using the above glass substrate, and the package structure formed by it is shown below. ^ ^ Please refer to FIG. 3, which illustrates a schematic diagram of a photovoltaic device package structure according to a preferred embodiment of the present invention. The optoelectronic element packaging structure 3 00 includes, for example, a carrier substrate 310, a glass substrate 3 2 0, a wafer 3 3 0, an outer frame 3 40, and a plurality of wires 35. The wafer 3 30 is disposed on the carrier substrate 31. The glass substrate 3 2 0 is disposed above the wafer 3 3 0 and is connected to the carrier substrate 3 1 0 through the outer frame 3 4 0. In addition, the material of the outer frame 3 4 0 may be, for example, a ceramic material or a plastic material, and the chip 3 30 has, for example, an active surface 3 3 0a ′, for example, it has a functional area 3 32 and is arranged around the functional area 3 3 2 For the plurality of bonding pads 3, 34, the carrier substrate 310 has a carrier surface 310a and a corresponding back surface 3 1 0 b, wherein the carrier surface 3 1 0 a has a plurality of first contacts 3 1 2 and the back surface 3 1 0 b has, for example, electrical connection with the first contact 3 1 2
12486twf.ptd 第11頁 1226663 五、發明說明（7) 接之多個第二接點3 1 4。 請再參考第3圖，晶片3 3 〇例如藉由打線接合的方式輿 承載基板31 0電性連接，其中導線35〇係分別連接於銲藝” 3 3 4與第一接點3 1 2之間，以使得晶片3 3 0可藉由第二接點 3 1 4與外界電性連接。由於玻璃基板3 2 〇可透光，因此外界 之光線3 6 0可藉由玻璃基板32〇進入光電元件封裝結構go/ 中，而當晶片3 3 0之功能區域3 3 2接收光線3 6 0後，例如發 生光電效應而產生一反應電流，並藉由承載基板3丨〇將^ 應電流輸出至外界。 綜上所述，本發明之玻璃基板係利用化學蝕刻的方 進行精修的動作，其中藉由化學蝕刻進行精修之側面具^ 較佳之完整性，並呈現透明的狀態，且因為進行等向性麵 刻L $得玻璃基板的邊緣皆具有r角修飾的效果，故可有 效提高封裝製程之良率。此外，本發明之玻璃基板的精佟 方法係提供較為簡單且快速之步驟，其係同時對玻璃基^ 之所有切割面進行化學蝕刻，以達到精修的效果。藉由 發明之玻璃基板及其精修方法可有效提高整體之封裝製程 ^ f f與良率，且因其僅需使用化學溶劑與簡單之化學蝕 ，因此更可有效降低製作成本。值得注意的是，雖 ί本12 i ί說明係以光電元件之封裝為例，然在不脫 = ϊ神範圍内：本發明之玻璃基板及其精修方法 璃a:ί液晶顯不面板，或其他需要較佳品質之玻 瑪基板的封裝製程之中。 雖然本發明已以一較佳實施例揭露如上，然其並非用12486twf.ptd Page 11 1226663 V. Description of the invention (7) A plurality of second contacts 3 1 4 are connected. Please refer to FIG. 3 again. The chip 3 3 0 is electrically connected to the carrier substrate 3 0 by wire bonding, among which the wire 3 0 is connected to the soldering process. 3 3 4 and the first contact 3 1 2 So that the chip 3 3 0 can be electrically connected to the outside through the second contact 3 1 4. Since the glass substrate 3 2 0 can transmit light, the outside light 3 60 can enter the photoelectricity through the glass substrate 32 0 Component package structure go /, and when the functional area 3 3 2 of the chip 3 3 2 receives light 3 6 0, for example, a photoelectric effect occurs and a reaction current is generated, and the response current is output to the carrier substrate 3 丨 〇 In summary, the glass substrate of the present invention uses the method of chemical etching for refining, and the side refined by chemical etching has better integrity and is transparent, and because of The edges of the glass substrate with the engraved surface have the effect of r-angle modification, so it can effectively improve the yield of the packaging process. In addition, the method for precision polishing of the glass substrate of the present invention provides relatively simple and fast steps. For glass-based ^ The cutting surface is chemically etched to achieve the effect of refining. The invented glass substrate and its refining method can effectively improve the overall packaging process ^ ff and yield, and because it only requires chemical solvents and simple chemistry Etching, so it can effectively reduce the production cost. It is worth noting that although the description of the 12 i is based on the packaging of optoelectronic components as an example, it is within the scope of == God: the glass substrate of the present invention and its finishing Method glass a: a liquid crystal display panel, or other packaging process that requires a better quality glass substrate. Although the present invention has been disclosed above with a preferred embodiment, it is not useful
1226663 五、發明說明（8) 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作些許之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 lilli 12486twf.ptd 第13頁 1226663 圖式簡單說明 第1A〜ID圖依序繪示為本發明之玻璃基板之精修方法 的示意圖。 第2圖繪示為本發明之較佳實施例之玻璃基板的局部 側視放大圖。 第3圖繪示為本發明之較佳實施例之一種光電元件封 裝結構的示意圖。 【圖式標示說明】 110 玻璃基板 112 第一表面 1 14 第二表面 116 側面 118 R角（弧形角） 丨 120 保護膜（或保 護 板） 300 光電元件封裝 結 構 310 承載基板 310a :承載表面 310b :背面 312 第一接點 314 第二接點 320 玻璃基板 330 晶片 3 3 0 a :主動表面 3 3 2 ： 功能區域 3 34 : 鲜塾1226663 V. Description of the invention (8) To limit the present invention, anyone skilled in the art can make some changes and retouch without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be attached as follows. The ones defined in the scope of patent application shall prevail. lilli 12486twf.ptd Page 13 1226663 Brief Description of Drawings Figures 1A ~ ID show the schematic diagram of the finishing method of the glass substrate of the present invention in order. Fig. 2 is an enlarged partial side view of a glass substrate according to a preferred embodiment of the present invention. FIG. 3 is a schematic diagram showing a packaging structure of a photovoltaic device according to a preferred embodiment of the present invention. [Illustration of diagrammatic symbols] 110 glass substrate 112 first surface 1 14 second surface 116 side 118 angle (arc angle) 丨 120 protective film (or protective plate) 300 optoelectronic element packaging structure 310 carrier substrate 310a: carrier surface 310b : Back surface 312 first contact 314 second contact 320 glass substrate 330 wafer 3 3 0 a: active surface 3 3 2: functional area 3 34: fresh
12486twf.ptd 第14頁 1226663 圖式簡單說明 340 :外框 3 5 0 :導線 3 6 0 :光線 第15頁 12486twf.ptd12486twf.ptd Page 14 1226663 Schematic illustration 340: Frame 3 5 0: Wire 3 6 0: Light Page 15 12486twf.ptd
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| TW92131929A TWI226663B (en) | 2003-11-14 | 2003-11-14 | Glass substrate and precision finishing method thereof |
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