TWI225931B - Forming method of probes for testing wafer or chip - Google Patents

Abstract

The purpose of the present invention is to provide the manufacturing method of the probe for testing wafer (chip). The manufacturing procedures at least contain the following steps: straightening and cutting the prepared wire material after it is heated by resistive element; and using the electroplating manner to form the wire material, in which electroplating treatment is performed onto the front end of wire diameter of the wire material and is followed by sharpening the front end of wire diameter of the wire material to form a sharp taper after straightening and cutting the wire material suitable for use in wafer (chip) test such as tungsten, beryllium copper, tungsten containing rhenium and palladium. In the electroplating method, plural preset wire materials are set as the anode electrode and are placed into an electroplating tank having the electrolyte. The bottom end face in the electroplating tank is provided with at least one metal plate that is set as the cathode electrode. After that, each wire material is placed stably in the electrolyte to make the preset wire material generate anodic dissolution, and stably rise after forming sharp taper at the tip terminal of each wire material. In addition, the taper length of each wire material is made capable of obtaining a different taper length depending on the depth of going deep into the liquid. By using the manufacturing method to form the probe for testing wafer (chip), the extremely large effects of increasing the production rate and reducing the production cost can be obtained.

Description

1225931 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention refers to a method for forming a probe for a wafer (wafer) test, and particularly to a wafer (wafer) that can improve the speed of production and reduce the rate of loss. ) With a probe. [Previous technology] The so-called wafer (the contact point of the wafer or the internal electrical detection output value of the wafer. This type of wafer or wafer-to-wafer or wafer-to-wafer test is required to stop the test and it needs to be replaced. It is easy to derive many equipment into Cheng Zhi's technique is a groundbreaking method, such as the application process shown in the first figure, which is used to produce 1. Prepare the wire; 2. Shape by electrolytic sharpening; 4, Shape 0) Test probe, which is used to Contact with the chip on the road so that the input signals or probes directly to the chip are mastered and imported by foreign manufacturers. The precision of distribution points and circuits needs to be extremely fine, so it is often damaged due to improper operation and damage. The structure has a large amount of wear and its forming production is not original, so the inventor now not only has the probe manufacturing method described above, but has experimentally obtained the probe forming party, and asked the processing party of invention application No. 0 9 1 1 1 9 9 7 The probe structure includes at least the following steps: Straighten and cut after high frequency heating; 3, the wire rod applies the wire tip to the electric arc to form a ball [content] (the technical problem to be solved) Yu processing method due to the break may not be significant number of manufacturers, although this investigation the probe is a single processing method is excellent in a molding and having

Page 6 1225931 V. Description of the invention (2) Those who have a circular arc loss prevention structure, but because of its processing method, the production speed is relatively slow, and the industry does not always need this circular arc structure, and the wafer circuit is becoming more complicated and each circuit The gap of the arrangement is more narrow, so it is obvious that the pointed cone shape still has its special purpose, and the above-mentioned arc-shaped probe structure is complicated to process, so it still cannot meet the needs of a large number of people. Simple and rapid prototyping and those who can still reduce the purchase cost. (Technical means to solve the problem) The present inventor used a truly barrier-free open-slot electrolysis method to form the probe structure in large quantities, and borrowed a method that can form a large number of probes to purchase and reduce the cost of the probe in one fell swoop. A large number of users in the electronic wafer (or wafer) industry, the invention of this invention, uses a high-temperature heating method to make a wire suitable for wafers (wafers) quickly reach a temperature suitable for red heat. The wire is cut, and the wire diameter after cutting can be a straight probe base material, and the base material is set to have a tapered cone diameter by an electrolytic treatment method. (Comparison with the effect of the prior art) Except for the invention based on the processing method of the 9 1 1 1 9 9 7 application, that is, the processing method is to change the heating method of the wire to use the resistance of the wire itself as a conductive heating structure It also uses wire cutting as an aid, and it can hold the device to preset a large number of wires to apply the electrolytic method: it uses most wires as electrolytic anodes, and at least one layer of cathode metal for electrolysis is provided on the inner bottom end surface of the electrolytic tank. Plate, and subsequently use its open notches

Page 7 1225931 V. Description of the invention (3) Different lengths or different modular wires can be made into a tapered cone with different lengths according to the depth of the electrolyte surface; and also equipped with the electrolytic metal cathode plate The through slot and the supporting device are used to fix and lift the metal plate to the liquid level end or the appropriate level of the liquid surface, so that the forming taper is more complete and fast; and the slot and the metal plate are designed once. Processing can generate a large number of probes, which can also reduce the cost of each test industry. [Embodiment] Please refer to Figures 2 to 4. The method and method for the preparation of the front section of the wire are still the same as the original applicant's application No. 091119977. Therefore, the process of this creative implementation step includes at least the following, that is, as the first As shown in the figure, first prepare the wire; apply the first step: first prepare an appropriate wire (or substrate) 1 for straightening and cutting: Among them, because the prepared wire 1 is special (can be set to tungsten, containing Chain tungsten, beryllium copper, palladium). Among them, the wire heating method first uses a high temperature (changes to resistance heating 2) for each wire 1 to be thermoformed (see the third picture), that is, the wire 1 is first set. In an open hollow pipe body A, tension is applied to both sides of the wire 1 and positive and negative electrodes are applied to the two guide wheels B sides to energize the wire, and a heat energy is generated by the resistance of the wire itself and paralleled. Straighten with the guide wheel B, and an inert gas C is applied to the tube A during heating to prevent the wire 1 from being oxidized during the heating process. After the straight shape is completed, the wire electrode 3 is cut by a discharge wire. , So even if the tungsten wire below 0.1 mm ( After one sheet) forming its flatness level can also approach, since the discharge wire cutting a metal-based non-contact cutting method without departing from the generating axis of the substrate cause poor flatness concerns.

Page 8 1225931 V. Description of the invention (4) Second step: different wires 1 can be laser welded or resistance welded: suitable for a single chip test circuit, the method is made by using metal (nickel, copper) wire ( The wire diameter is 0.51mm) and tungsten wire (less than 0.15mm) to be joined by a laser welding or resistance welding technology (as shown in Figure 6) the third wire, the wire, the circular electrolyte, the 5 plate, and the cylinder. The wire rod is a cylinder with a pointed cone-shaped top and a different cone-shaped fourth fixture, and the alternative is the one that is as follows (1) Prepared with the same substrate) 1) Set (2) Steps for the inner end surface: 1) Electric pole The electrolysis of the body wire is performed as a wire 1 point and a length of 10 points. Steps: Clamp. Among them, the wire 1 is shown in the figure or different as the electricity at least, and can still be sharpened into the material 1 as the solution in the slot 4, extremely soluble (the front end of the anode through the one, and the, and the The tip will be tapered like the original No. 0 9 1 1 1 9 9 7 7 application-like type ... Use an electrolytic treatment method: the electrolytic anode is set so that the tank is set as shown in Figure 4 ~ 4A The method is to place the electric cone at a fixed time and leave the length of the electric cone. According to the apex of the cone, the lower part can be put on the front end and placed in a circular surface 7 filled with a cathode metal for electrolysis. After dehydration, a immersion depth of less than 0 is produced. Different plating places produce 4m i cron; It is good for welding as shown in Figure 5 ~ 5C. Another modification of this creative method is to apply electrolytic forming method to make a difference Production steps The method for processing the preliminary wire is: an open slot 8 and an electrolytic cell 4 into which an electrolyte can be placed, and a large number of wires for preliminary processing (or anodes for electrodes; a layer of electrolytic metal plates 6) Set directly in the electrolytic tank 4 as the cathode for electrolysis;

$ 9 pages 1225931 V. Description of the invention (5) (3) and simultaneously or at the same time, put a plurality of preliminary wires (substrates) into the electrolytic cell 4 in a stable manner, and urge the wire 1 to be immersed in part to set It is in the form of anode dissolution, so that the wire can be immersed in the liquid surface 7 at different depths and processing times and then raised to obtain a substrate with a different tapered length.

Therefore, the metal plate 6 (cathode plate) used for electrolysis is provided on the bottom end surface of the electrolytic cell to make the slot 8 open first, and it is not restricted by the position of the slot 8 or the cathode plate 6, so it can be used for comparison. Those who process a large number of wires at the same time can form a larger number of probes at the same processing time, which greatly reduces the production cost of the probe, and greatly improves the forming rate of the probe, which is beneficial to the industry and effectively reduces the overall production cost. And as shown in Figures 6 to 6B, where the electrolytic metal plate 6 (cathode plate) is first fixed by a suspension device 15 (or a support device) as shown in the fifth figure In the liquid surface 7 (or just parallel to the liquid surface 7), and make more than a plurality of through-slots 61 provided on the metal plate 6 to match the diameter and processing quantity of the pre-processed wire 1 and provide The wire rod is used as an electrolytic treatment in the opening slot 8 of the electrolytic cell 4 to vertically rise and fall, thereby setting the slot hole 6 1 on the electric metal cathode plate 6 to obtain a more stable shape and reliability than that of two wire rods. Sharp-shaped effect.

Wherein, as shown in FIG. 6C, another embodiment of the electrolytic method of the present invention is that the metal cathode plate 6 for electrolysis may be further fixed by a supporting device 15 (or fixed by a suspension device) and precisely It is set at an appropriate lower end of the liquid surface of the electrolytic cell 4 so that the wire can just reach into the liquid level of the electrolytic cell, and the wire can be sharpened. And the other one, as shown in the second and seventh pictures of the probe assembly after processing

Page 10 1225931 V. Description of the invention (6) The schematic diagram is shown in another embodiment of this creation: it is a prepared wire 1 is also heated and straightened and cut through the above step 2; then according to step 3 , Which is the combination of two different wire diameter wires such as wire 1 and another wire with a larger wire diameter 12, and then according to step three, most of the front ends of the cylinders with tungsten wire 1 can be used to create the above. The electrolysis procedure shown in Figures 5 to 6C is used to make a pointed cone-shaped probe, so we can get the original creation with a pointed cone-shaped structure. Therefore, according to the above-mentioned molding method, the actual shape of the arc-shaped probe can be shown in Annex I, which is enlarged by an electron microscope. Therefore, in summary, the method for forming a wafer (wafer) test probe according to the present invention is to prepare a wire (for example: tungsten, tungsten containing baht, beryllium copper, palladium), and the two sides are connected with A set of rollers are heated by electricity and made into a straight cylinder, and then cut to become the base material of the probe by electric discharge. Then, the electrolytic processing method of placing the cathode plate for electrolysis on the bottom end surface of the tank by using a re-opening slot can make it one time. The front end of a large number of substrates is processed to form a tapered cone, so the wafer (wafer) probe is formed by this method. Regardless of the production time and forming efficiency, the processing time and the actual purchase cost requirements are improved. '' For those who need to know, the above are only the specific embodiments of the invention and the technical principles used. If changes are made according to the concept of this creation,

Page 11 1225931 Schematic description of the first picture brother picture. Enough ^ S3 The second picture is the flow chart of the probe forming method of the applicant's original invention No. 0 9 1 1 1 99 7 7 application. This is the manufacturing process of another embodiment of the method of forming the probe of the present invention. Step 2 of the method of forming the probe of the present invention is to straighten, cut off the sound, and figure. ~ The fourth ~ fourth A picture The fifth ~ fifth B picture •• The 0-9 1 1 1 9 9 7 7 application probe forming method steps _ Schematic diagram of electrolytic wire sharpening forming. Figures 6 ~ 6C: This is the third step of the probe forming method. The wire is applied with an electrolytic method. Zan 1㈤ ·· This is another embodiment of the wire electrolysis method. The second embodiment of Tian · Yu Creation Department is another schematic diagram of two different diameter body lines. •, Shi, laser welding or resistance welding. Attachment 1 · This is an enlarged view of the real object created with this creation. Description of drawing number> A · · ·. Tube C · · · • Inert gas 1 · · · · Wire 3 · · · · Discharge cut 5 · .. · Electrolyte 61 ··· Through groove 8 · · · • Notch 10 · · · Acuminate conical secant electrode 2 · 4 · 6 · Hole 7 · 9 · Point 12 · • • Guide wheel • Resistance heating • Electrolytic cell • • Electrolytic metal • • Liquid level • • EDM Installation • Larger diameter cylinder

1225931 Brief description of drawings 15 · Supporting device ϋΒ page 13

Claims (1)

I. No. 92109547: Amendment 1. A wafer (wafer) measurement and formation includes at least the following steps. First, a probe forming method is performed, and the probe is then subjected to an electrical discharge cutting. The metal wire is prepared by heating, straightening, and bonding. Substrate application—additional exploration: substrate; another one that has been straightened or pointed into a tapered shape; and among them, it is desired to combine the wire body to form a front end and taper into a tapered electrolytic forming method. Straightened and cut base material is added, prepared-open type d: step: tank, and the same or different size of electrolyte that can be placed in the electrolyte is used as the anode of the electrode; Inner bottom end face: to gold: j is directly set in the electrolytic cell and the second base = or the base material is formed in a stable manner, so that the wire must be immersed in the liquid surface without: dissolving in the anode to obtain: substrates with different tapered lengths; The degree of door wood and time are increased, and the processing method forms a wafer probe with a tapered cone shape, and the metal probe made of chain is made easy, and the probe can be easily processed. According to the test of the wafer (wafer) described in item 2 of the scope of the patent application or the chain-containing method, # 中 'can be set to tungsten = beryllium tungsten or beryllium copper or palladium or other suitable Metal, will: use a resistance heating to generate high temperature on the two t wire, that is, the wire is first put into the hollow tube body, and tension is applied to both sides of the wire and two guide wheels are used to apply positive The negative electrode is energized, and the wire is generated by the positive resistance of the wire _ = the wire itself generates __ thermal energy to generate electricity and heat, and it is added by the guide wheel to the tube and an inert gas is applied to prevent the The wire is then converted into a straight shape by cutting the wire and then cutting the electrode with water and electricity after tensioning and rolling the guide wheel into a straight shape. Probe V ::: Please refer to the Crystal® (wafer) test described in item 1 of the patent scope by the function method, where the probe base metal laser welding can be performed according to actual needs. 'It is used to weld different wire diameters or different metals back and forth by resistance welding, and then perform this after joining: needle-taper π shaper' and can apply a number of probes for electrolytic processing together. The test of the wafer (wafer) described in the item is set to Hi. In #, most of the wires subjected to electrolytic processing can be of different diameters or different lengths or modularized, and can be conveniently placed in an electrolytic cell. The inside is processed into a pointed cone-shaped vertex probe. 5. According to the crystalline method described in item 丨 of the scope of application for patent, the wire electrolysis method is based on: i; solution: the cathode plate is provided with -support. The device is connected or suspended.] After fixing, the lower edge is in proper place, and the wire is placed by this cathode plate. It can be moved one by two. High stability and reliability of the wire 6, according to the scope of patent application 丨 or 5 test probe Molding method, wherein the ㈣f aaBI (wafer) is provided with a plurality of metal on the cathode plate was through _ / ,, the electrolytic shell shoots Monk hole fitting hole of the preset wire ^ In 199209547, the month (0 said correction_ diameter and number of processing, and set up with a support device fixed or suspended device fixed in the electrolytic cell, and set the wire by extending into the cathode plate through Holes and grooves, and by moving the wire up and down, a better shape of the wire can be obtained. Page 16