CN103231163B - Tungsten filament welding device - Google Patents

Tungsten filament welding device Download PDF

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Publication number
CN103231163B
CN103231163B CN201310124064.8A CN201310124064A CN103231163B CN 103231163 B CN103231163 B CN 103231163B CN 201310124064 A CN201310124064 A CN 201310124064A CN 103231163 B CN103231163 B CN 103231163B
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Prior art keywords
tungsten
tungsten filament
threaded rod
metal electrode
rigid plate
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CN201310124064.8A
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Chinese (zh)
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CN103231163A (en
Inventor
谢东珠
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SHANGHAI HAIBANG MACHINERY EQUIPMENT MANUFACTURING Co Ltd
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SHANGHAI HAIBANG MACHINERY EQUIPMENT MANUFACTURING Co Ltd
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Abstract

The invention provides a tungsten filament welding device which comprises a metal base, a fixed support, a first insulating hard plate, a second insulating hard plate, a first threaded rod, a second threaded rod, a metal rod, a first pointy metal electrode, a second pointy metal electrode, an insulating rod and an adjustable transformer. Two output ends of the adjustable transformer are connected with the first pointy metal electrode and the second pointy metal electrode respectively; the first threaded rod, the second threaded rod and the fixed support are sequentially connected to the metal base; the metal rod is connected with the first threaded rod and the second insulating hard plate for clamping a tungsten needle; the first insulating hard plate for clamping a tungsten filament is connected with the fixed support; a free end of the second insulating hard plate is opposite to a free end of the first insulating hard plate, and intervals are reserved between the free end of the second insulating hard plate and the free end of the first insulating hard plate; and the first pointy metal electrode is connected with the second threaded rod through the insulating rod. The electrodes and the tungsten filament are not adhered together, and the tungsten filament welding device has the advantages of being simple in structure and easy to operate and the like.

Description

Tungsten filament soldering apparatus
Technical field
The invention belongs to photoelectron technology and precision instrument manufacture field, main application is the welding for Flied emission tungsten pin in field emission microscope electron gun, is specifically related to a kind of tungsten filament soldering apparatus.
Background technology
The electron source of SEM has three kinds of forms: thermal emission electron source; Cold field emission electron source; Thermal field emission electron source.
The micro-employing thermal emission electron source of ordinary hot electron emission, makes tungsten filament and sends out pronged shape and be heated to more than 2500K electron emission, and this electron source advantage makes easily, and required vacuum is not high, and air pressure is less than 10 -3namely, shortcoming is that the bundle spot of electron source is large to handkerchief, and be about tens microns, microscopical resolution ratio is low.
Under cold field emission electron microscope employing room temperature, the Flied emission of tungsten tip produces electron beam, and its advantage is that beam spot is superfine, is a few ten nanometers level, resolution ratio is high, its deficiency is that the radius of curvature of requirement tungsten tip is less than 100 nanometers, makes difficulty, and requires during work that air pressure is 10 -9below handkerchief, to avoid producing sputtering to needle point after residual gas molecule ionization under hyperbar thus damaging Flied emission needle point, therefore apparatus expensive.
Thermal field emission electron microscope adopts the Flied emission under high temperature to produce electron beam, namely Flied emission tungsten pin is welded on heatable tungsten filament, during work, tungsten filament is heated to 1500K ~ 2000K, advantage is that tungsten tip radius of curvature can be greater than 100 nanometers, only requires that air pressure is less than 10 during work -6handkerchief, due to not high to the vacuum level requirements of Flied emission tungsten tip and electron gun, therefore thermal field emission electron microscope is relatively lower than cold field emission electron microscope manufacturing cost, therefore have more competitiveness, high resolution scanning electron microscope is in the market thermal field emission electron microscope mainly.
One of key technology of thermal field emission electron gun is that accurate for tungsten pin positioning welding is bent protrusion place at tungsten filament.Tungsten is materials with high melting point (3400 DEG C), and being welded on tungsten filament by tungsten pin is a very difficult thing, adopts the existing conventional spot welding in market to pick repeatedly to test and all tungsten pin cannot be welded on tungsten filament.
Summary of the invention
For above weak point of the prior art, the invention discloses a tungsten filament soldering apparatus, can facilitate and tungsten pin is welded on tungsten filament fastly.
According to an aspect of the present invention, a kind of tungsten filament soldering apparatus is provided, comprise metab, fixed support, the first insulating rigid plate, the second insulating rigid plate, the first threaded rod, the second threaded rod, metallic rod, the first pointed metal electrode, the second pointed metal electrode, insulating bar, adjustable transformer, wherein:
An output of described adjustable transformer connects described first pointed metal electrode by wire, and another output of described adjustable transformer connects described second pointed metal electrode by wire; Described first threaded rod, the second threaded rod, fixed support are connected in turn on described metab; Described metallic rod connects described first threaded rod and the second insulating rigid plate for clamping tungsten pin; Described first insulating rigid plate for clamping tungsten filament connects described fixed support; Be oppositely arranged between the free end of the second insulating rigid plate and the free end of the first insulating rigid plate and there is gap; Described first pointed metal electrode connects described second threaded rod by insulating bar.
Preferably, described metallic rod can move up and down along the axis of described first threaded rod.
Preferably, described first pointed metal electrode can move up and down along the axis of described second threaded rod.
Preferably, also comprise tungsten filament, wherein, described tungsten filament becomes bending to be held on described first insulating rigid plate.
Preferably, also comprise tungsten pin, wherein, described tungsten pin is held on described second insulating rigid plate.
Preferably, the free end of described tungsten pin stretches out more than 2 millimeters to the side that described tungsten filament is recessed, and described tungsten pin contacts with tungsten filament.
Preferably, described first pointed metal electrode contacts the position that described tungsten pin contacts with tungsten filament, and described second pointed metal electrode contacts the free end of described tungsten pin.
The technical solution adopted in the present invention adopts short circuit current fusing method to be welded on tungsten filament by tungsten pin, and namely at a bit of making alive of tungsten pin self, big current produces high temperature makes this segment tungsten pin melt thus be welded on tungsten filament by tungsten pin.
The contact point of tungsten pin and tungsten filament is pad, about 2 millimeters long between solder joint and an end points of tungsten pin, this section of tungsten pin adds about 30V voltage, instantaneously by this section of tungsten pin combustion melting, because the temperature of tungsten pin and tungsten filament contact position is lower, the tungsten filament of contact position can not melt, and the tungsten pin that therefore one end is melted just is welded on tungsten filament.
The existing mash welder in market makes the surperficial local melting of tungsten filament when welding thus welds together, and this mash welder is easy to make electrode stick together with welded tungsten filament thus make to weld unsuccessfully in welding process.
Compared with mash welder existing on market, the present invention has obvious advantage:
1. an electrode supporting is at solder joint place, this place due to temperature lower, electrode and tungsten filament can not stick together; And another electrode contacts with burned tungsten pin end points, tungsten pin combustion melting rear electrode automatically disengages, and also can not stick together with tungsten filament.
2. structure of the present invention is simple, and volume is little, and cost is low, simple to operate etc.
Utilize the present invention to be welded on bending tungsten filament by tungsten pin, carried out a large amount of experiments, success rate is more than 80 percent.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 illustrates the structural representation according to tungsten filament soldering apparatus provided by the invention.
In figure:
1 is metab;
2 is fixed support;
3 is wire;
4 is the first insulating rigid plate;
5 is the first threaded rod;
6 is metallic rod;
7 is the second insulating rigid plate;
8 is the second threaded rod;
9 is the first pointed metal electrode;
10 is the second pointed metal electrode;
11 is insulating bar;
12 is adjustable transformer.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
Below in conjunction with accompanying drawing, implementation process of the present invention is described.
According to tungsten filament soldering apparatus provided by the invention, comprise metab 1, fixed support 2, first insulating rigid plate 4, second insulating rigid plate 7, first threaded rod 5, second threaded rod 8, the pointed metal electrode 10 of metallic rod the 6, first pointed metal electrode 9, second, insulating bar 11, adjustable transformer 12, tungsten filament, tungsten pin, wherein: an output of described adjustable transformer 12 connects described first pointed metal electrode 9 by wire, another output of described adjustable transformer 12 connects described second pointed metal electrode 10 by wire; Described first threaded rod 5, second threaded rod 8, fixed support 2 are connected in turn on described metab 1; Described metallic rod 6 connects described first threaded rod 5 and the second insulating rigid plate 7 for clamping tungsten pin; Described first insulating rigid plate 4 for clamping tungsten filament connects described fixed support 2; Be oppositely arranged between the free end of the second insulating rigid plate 7 and the free end of the first insulating rigid plate 4 and there is gap; Described first pointed metal electrode 9 connects described second threaded rod 8 by insulating bar 11.
In a preference, described metallic rod 6 can move up and down along the axis of described first threaded rod 5.Described first pointed metal electrode 9 can move up and down along the axis of described second threaded rod 8.Described tungsten filament becomes bending to be held on described first insulating rigid plate 4.Described tungsten pin is held on described second insulating rigid plate 7.The free end of described tungsten pin stretches out more than 2 millimeters to the side that described tungsten filament is recessed, and described tungsten pin contacts with tungsten filament.Described first pointed metal electrode 9 contacts the position that described tungsten pin contacts with tungsten filament, and described second pointed metal electrode 10 contacts the free end of described tungsten pin.
The input voltage of adjustable transformer 12 is alternating current 220V, and output voltage is adjustable 0 ~ 110V, and an output of adjustable transformer 12 connects the first pointed metal electrode 9 by wire, and another output connects the second pointed metal electrode 10 by wire.
Fix with the first insulating rigid plate 4 after tungsten filament bends to required shape, the the second insulating rigid plate 7 needing the tungsten pin of welding to be used as insulation clip is clamped and is fixed in the securing member metallic rod 6 that can move up and down at threaded rod 5, and regulating the upper-lower position of tungsten pin to be located on tungsten filament needs the position of welding to stretch out about 2 millimeters long to recessed side.
The upper-lower position of the first pointed metal electrode 9 is regulated to make it the soldered point cantact with tungsten filament, second pointed metal electrode 10 makes it to contact with the end points of soldered tungsten pin, due to instantaneous short circuit between the first pointed metal electrode 9 and the second pointed metal electrode 10 liang of electrodes, make outwardly directed 2 millimeters of tungsten pins burned and melt, tungsten pin is welded on tungsten filament.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.

Claims (7)

1. a tungsten filament soldering apparatus, it is characterized in that, comprise metab (1), fixed support (2), the first insulating rigid plate (4), the second insulating rigid plate (7), the first threaded rod (5), the second threaded rod (8), metallic rod (6), the first pointed metal electrode (9), the second pointed metal electrode (10), insulating bar (11), adjustable transformer (12), wherein:
An output of described adjustable transformer (12) connects described first pointed metal electrode (9) by wire, and another output of described adjustable transformer (12) connects described second pointed metal electrode (10) by wire; Described first threaded rod (5), the second threaded rod (8), fixed support (2) are connected in turn on described metab (1); Described metallic rod (6) connects described first threaded rod (5) and the described second insulating rigid plate (7) for clamping tungsten pin; Described first insulating rigid plate (4) for clamping tungsten filament connects described fixed support (2); Be oppositely arranged between the free end of the second insulating rigid plate (7) and the free end of the first insulating rigid plate (4) and there is gap; Described first pointed metal electrode (9) connects described second threaded rod (8) by insulating bar (11).
2. tungsten filament soldering apparatus according to claim 1, is characterized in that, described metallic rod (6) can move up and down along the axis of described first threaded rod (5).
3. tungsten filament soldering apparatus according to claim 1, is characterized in that, described first pointed metal electrode (9) can move up and down along the axis of described second threaded rod (8).
4. tungsten filament soldering apparatus according to claim 1, is characterized in that, also comprise tungsten filament, and wherein, described tungsten filament becomes bending to be held on described first insulating rigid plate (4).
5. the tungsten filament soldering apparatus according to claim 1 or 4, is characterized in that, also comprises tungsten pin, and wherein, described tungsten pin is held on described second insulating rigid plate (7).
6. tungsten filament soldering apparatus according to claim 5, is characterized in that, the free end of described tungsten pin stretches out more than 2 millimeters to the side that described tungsten filament is recessed, and described tungsten pin contacts with tungsten filament.
7. tungsten filament soldering apparatus according to claim 6, is characterized in that, described first pointed metal electrode (9) contacts the position that described tungsten pin contacts with tungsten filament, and described second pointed metal electrode (10) contacts the free end of described tungsten pin.
CN201310124064.8A 2013-04-10 2013-04-10 Tungsten filament welding device Active CN103231163B (en)

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Application Number Priority Date Filing Date Title
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CN103231163B true CN103231163B (en) 2015-07-22

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105033530B (en) * 2013-12-30 2017-11-28 浙江罗丹照明电器有限公司 A kind of improved filament bonding machine

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB297493A (en) * 1927-06-23 1928-09-24 Bell Telephone Labor Inc Process of and apparatus for welding
DE3130663A1 (en) * 1982-08-31 1983-06-23 Videocolor S.A., 92128 Montrouge Method for producing and installing filament heaters and a beam generator having such filament heaters
JP2000271779A (en) * 1999-03-26 2000-10-03 Kanai Hiroaki Method and device for annealing metal wire immediately after welding
CN2590714Y (en) * 2003-01-06 2003-12-10 秦二寅 Electromagnetic wire welder
CN201300279Y (en) * 2008-11-28 2009-09-02 李晨 High voltage wick double-point high-efficiency automatic spot welding machine
CN201410600Y (en) * 2009-06-19 2010-02-24 深圳市翠绿首饰股份有限公司 Butt-welding machine
CN102339704A (en) * 2011-09-30 2012-02-01 北京大学 Alternating-current electrochemical corrosion method of field emission electron source
CN102489858A (en) * 2011-12-08 2012-06-13 北京大学 Field-emission electron emission source emitter welding device
CN203245503U (en) * 2013-04-10 2013-10-23 上海海邦机械设备制造有限公司 Tungsten filament welding device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1705684A1 (en) * 2005-03-22 2006-09-27 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Stabilized emitter and method for stabilizing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB297493A (en) * 1927-06-23 1928-09-24 Bell Telephone Labor Inc Process of and apparatus for welding
DE3130663A1 (en) * 1982-08-31 1983-06-23 Videocolor S.A., 92128 Montrouge Method for producing and installing filament heaters and a beam generator having such filament heaters
JP2000271779A (en) * 1999-03-26 2000-10-03 Kanai Hiroaki Method and device for annealing metal wire immediately after welding
CN2590714Y (en) * 2003-01-06 2003-12-10 秦二寅 Electromagnetic wire welder
CN201300279Y (en) * 2008-11-28 2009-09-02 李晨 High voltage wick double-point high-efficiency automatic spot welding machine
CN201410600Y (en) * 2009-06-19 2010-02-24 深圳市翠绿首饰股份有限公司 Butt-welding machine
CN102339704A (en) * 2011-09-30 2012-02-01 北京大学 Alternating-current electrochemical corrosion method of field emission electron source
CN102489858A (en) * 2011-12-08 2012-06-13 北京大学 Field-emission electron emission source emitter welding device
CN203245503U (en) * 2013-04-10 2013-10-23 上海海邦机械设备制造有限公司 Tungsten filament welding device

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