TWI224375B - Package structure with liquid chip carrier and manufacturing method thereof - Google Patents

Abstract

The present invention provides a package structure with a liquid chip carrier and a manufacturing method thereof. The manufacturing method includes the steps as follow. First, coaxial semiconductor package wire bonds are disposed on a chip, so that one end of each coaxial semiconductor package wire bond is connected to a surface of the chip. Then, the other end of each coaxial semiconductor package wire bond passes through a perforation of a fixed position plate separately. The chip and the fixed position plate are disposed within a container and a liquid substrate material is poured into the container, so that a liquid chip carrier is formed between the chip and the fixed position plate. After the container is removed, solder balls are formed on the liquid chip carrier and the solder balls are electrically connected to the other end of each coaxial semiconductor package wire bond separately. Finally, the package structure with a liquid chip carrier is completely performed.

Description

1224375 V. Description of the Invention (l) [Technical Field to which the Invention belongs] The present invention relates to a semiconductor packaging structure, and more particularly, to a packaging structure with a liquid-like substrate and a manufacturing method thereof. [Previous technology] Due to the constant demand for light, thin and short electronic information products, it has driven the development of printed circuit boards (PCBs) in the direction of thinning and micro-hole technology, coupled with the continuous miniaturization of surface mounting technology Advancement has made the demand for high-end IC package substrates constantly increase. Generally speaking, the substrates used in traditional packaging technologies can be summarized as ceramic substrates, plastic substrates, metal substrates, lead frames, and organic substrates. organic substrate) and tape. However, with the current development trend of thinning and micro-hole technology, the above-mentioned substrates will be subject to drilling technology in the future due to high-density, small size and high-performance packaging requirements. And the limitations of line width and line spacing, and the dilemma of increasingly complicated substrate structures and increasingly expensive substrate manufacturing costs. [Summary of the Invention] In view of this, the object of the present invention is to provide a packaging structure with a liquid-like substrate, which can three-dimensionally lay out the layout space of the substrate, avoiding the layout of the substrate being affected by drilling technology, line width and line spacing. Restrictions and increase the efficiency of the packaging process. TW1291F (Sun Moonlight) .ptd Page 9 1224375

V. Description of the invention (2) According to the purpose of the present invention, a packaging structure with a liquid-like substrate is provided, including: a liquid-like substrate, a chip, a plurality of solder balls (solder = 11), and a plurality of coaxial semiconductors. Package wire (wire bond). The liquid-like evil substrate has an upper surface and a lower surface. The wafer is formed on the upper surface of the liquid-like substrate, and the solder balls are disposed on the lower surface of the liquid-like substrate. The coaxial conductor-packaged bonding wires are arranged in a liquid-like substrate, and the coaxial semi-packaged bonding wires are used to electrically connect a chip and a solder ball. According to the purpose of the present invention, a manufacturing method of a sealing structure with a liquid-like substrate is provided. The method includes: arranging a plurality of coaxial semiconductor package bonding wires ^ on a wafer, one end of each coaxial semiconductor package bonding wire is connected to one side of the wafer; The other end of each coaxial semiconductor package bonding wire is respectively penetrated through a plurality of through holes on the positioning plate; the positioning plate and the wafer are placed in a receiving device. A liquid substrate is injected into the receiving device to form a liquid-like substrate Between the positioning plate and the wafer '& de-accommodating device; and forming a plurality of solder balls on a liquid-like substrate such that the solder balls and the other ends of the coaxial semiconductor package bonding wire are separately & according to the object of the present invention In addition, a packaging structure is proposed, including liquid-like substrates, wafers, multiple tins, and multiple coaxial semiconductor package bonding wires. . The liquid-like substrate has an upper surface and a lower surface. The wafer is disposed on the upper surface of the liquid-like substrate, and the solder ball is formed on the lower surface of the liquid-like substrate. The coaxial semiconductor package bonding wires are arranged in a liquid-like substrate, and these coaxial semiconducting f-package bonding wires are used to electrically connect a chip and a solder ball. The positioning plate has a plurality of through holes, and the positioning plate is selectively disposed below the liquid-like substrate. Where ‘is connected to the wafer before forming a liquid-like substrate

Π24375 V. Explanation of the invention (3) One end of the coaxial semiconductor package bonding wire is respectively passed through the through hole of the positioning plate to locate the coaxial semiconductor package bonding wires. After forming the liquid-like substrate, the solder balls are respectively formed on the lower surface of the liquid-like substrate to be electrically connected to one end of the corresponding coaxial semiconductor package bonding wire, respectively. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below, and the following detailed description is given in conjunction with the accompanying drawings: ° [Embodiment] The present disclosure The detailed manufacturing method and actual application practice will be described in the accompanying drawings as follows. Please refer to FIG. 1, FIG. 2, FIG. 3, and FIG. 4 at the same time. FIG. 1 shows a flowchart of a method for manufacturing a packaging structure with a liquid-like substrate according to an embodiment of the present invention, and FIG. 2 to FIG. 4 show a liquid-like substrate with a corresponding step according to FIG. 1. Schematic diagram of the packaging structure ", Fig. 3 In the first figure, each step is described in order of step blocks 12 to step blocks in numerical order according to the size of the packaging structure of a liquid substrate-like packaging method of the present invention. First, As described in step 12, a plurality of coaxial semiconductor package wire bonds 50 are arranged on the chip 30. One end of the coaxial semiconductor package wire 50 is connected to the chip surface 31, as shown in FIG. 2. Then, in the description of step 14, the other end of the package bonding wire 50 passes through the positioning plate 4 respectively. The plurality of bayonet holes 41 on the bonding board 50 make each coaxial semiconductor package bonding wire 50 by The through holes 41 on the 40 are dispersedly arranged to achieve the positioning of the welding wire 50. U Glazed Cow Conductor Seal Pei

1224375 V. Description of the invention (4) In the step device 70, the position plate 40 and the wafer 40 are spaced apart from the receiving device position 40, and the method for manufacturing the plate 30 and the wafer 30 is implemented. However, 40 in the accommodating device 70 and 61 of the wafer 30 are fixed, and further, one end thereof is fixed outside the end system. This liquid package can be filled into the step 22 described in the example. After the example, it will be penetrated according to 80 kinds of liquids. In addition, the film characteristics of the substrate structure is described in the liquid base 20, except for the step method. In the description of the liquid base block 16, the positioning plate 40 and the wafer 30 are placed in the container. The configuration used in this embodiment is to first place the holder 30 upside down and then place it in the container 7 to make the positioning. The bottom of the plate 70 is completely in contact with each other, and the wafer is inferior to FIG. 3 with a pitch h. However, the inverted positioning plate 40 and the crystal form are not the only method of the present invention, and can also be positioned without being inverted, and following the steps described below to complete the present invention, as described in step 18, the liquid base is injected. After the material is cooled, a liquid-like substrate 60 is formed between the positioning plates, that is, the wafer 30 is located above the liquid-like substrate 60 and the surface plate 40 is located below the surface 62 of the liquid-like substrate 60. The coaxial semiconductor package bonding wire 50 which has been connected to the wafer 30 is in the substrate 60, and the other coaxial semiconductor package bonding wire 50 is exposed to the liquid-like substrate 6 through the through hole 41 of the positioning plate 40. The liquid substrate is, for example, a thermosetting resin or is composed of a modeling compound. And it has the characteristics of resistance to at least 200 ° C, and avoids the overall yield from being affected by high temperature melting during the manufacturing process. After the material is cooled and solidified to form a liquid-like substrate 60, the accommodating device 70 is removed as described above. Next, go to the positioning plate 40 according to the step block, as shown in FIG. 4. In this embodiment, the touch plate method (e t ch i ng) is used to remove the positioning plate 40. As described in block 24, a plurality of solder balls 60 are formed on the lower surface 62 of the board 60 so that the solder balls 80 and the corresponding ones

TW1291F (Sun and Moonlight) .ptd Page 12 1224375 、 Explanation of the invention Electrical connection of the other end of coaxial semiconductor package wire 5 〇 exposed to liquid-like substrate 6 〇. In addition, please refer to FIG. 5, which is a schematic cross-sectional view of the coaxial semiconductor package bonding wire in FIG. 2. In this embodiment, the coaxial semiconductor packaged fresh wire 50 includes a signal iayer 5i, a dielectric layer 52, and a ground layer 53. The dielectric layer 52 is coaxially coated on the outer side of the signal layer 51 and the ground layer 5 3 is coaxially coated on the outer side of the dielectric layer 52. Introduce

The electrical layer 52 is used to insulate the signal layer 51 from the ground layer 53, and the ground layer 53 is directly in contact with a liquid substrate 60 having insulation properties, so it is not necessary to separately coat the dielectric layer outside the ground layer 5 3 . It should be particularly noted that the step of removing the positioning plate 40 described in step 22 is not a necessary step of the present invention, that is, after removing the receiving device 70 described in step 20, If the positioning plate 40 needs to be etched, as described in step 24, a plurality of solder balls 80 are formed on the lower surface 62 of the & type liquid substrate 60, so that the solder balls 80 It is electrically connected to the other end of the corresponding coaxial semiconductor package bonding wire 50 which has penetrated through the through hole 41 of the positioning plate 40 and exposed to the liquid-like substrate 60.

In this, the packaging structure with a liquid-like substrate disclosed in the above-mentioned embodiment, under the positioning of the 疋 ^ plate, as the base material of the liquid-like substrate, 流动 I is a flowable liquid ... coaxially standing in the liquid-like substrate The semi-assembled bonding wires can be freely configured, so that the layout of the substrate is further avoided, and the layout of the substrate is not limited by the drilling technology, line width and line spacing, and the efficiency of the packaging process is improved. In summary, although the present invention has been disclosed as above with a preferred embodiment,

1224375 V. Description of the invention (6) Of course, it is not intended to limit the invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the invention. Therefore, the scope of protection of the invention should be Subject to the scope of the attached patent application.

TW1291F (sun and moonlight) .ptd Page 14 1224375 Brief description of the drawings [Simplified illustration of the drawings] Figure 1 shows a flowchart of a method for manufacturing a packaging structure with a liquid substrate according to an embodiment of the present invention; Figure 2 ~ FIG. 4 is a schematic diagram of a packaging structure with a liquid-like substrate according to one of the steps in FIG. 1. Fig. 5 is a schematic cross-sectional view of a coaxial semiconductor package bonding wire in Fig. 2 0 Symbols of the drawings 12, 14, 16, 18, 20, 22, 24: Step block 3 0: Wafer 31: Wafer surface 4 0 : Positioning plate 41: Through hole 5 0: Coaxial semiconductor package bonding wire 51: Signal layer 52: Dielectric layer 5 3: Ground layer 6 0 Liquid-like substrate 61: Upper surface of liquid-like substrate 6 2: Of liquid-like substrate Lower surface 7 0: Receiving device 8 0: Tin ball

TW1291F (Sun Moonlight) .ptd Page 15

Claims (1)

1224375 1. A packaging structure comprising: a type of liquid substrate having an upper surface and a lower surface; upper; a chip, a plurality of solder balls arranged on the upper surface of the liquid substrate, formed On the lower surface of the liquid substrate; and a plurality of coaxial semiconductor package wire bonds are arranged in the liquid substrate, the coaxial semiconductor package wires are used to electrically connect the chip and the chip Some tin balls. 2. The package structure according to item 1 of the scope of patent application, wherein the package structure further comprises: a wire mask, the positioning plate has a plurality of through holes corresponding to the solder balls; One end of the coaxial semiconductor package bonding wires is connected to the chip. The other ends of the coaxial semiconductor package bonding wires are respectively penetrated through the through holes and connected to the solder balls. ~ 3 · The package structure according to item 1 of the scope of patent application, wherein each of these coaxial semiconductor package bonding wires includes: a signal layer; A dielectric layer 'the dielectric layer is coaxially coated on the outside of the signal layer; and a ground layer, the ground layer is coaxially coated on the outside of the dielectric layer; wherein the dielectric layer is Insulate the signal layer from the ground layer. TW1291F (sun and moonlight) .ptd Page 16 1224375 VI. Scope of patent application A The package structure as described in item i of the patent application scope, wherein the material of this type of liquid substrate is a thermosetting resin. 5. · A method for manufacturing a packaging structure with a liquid-like substrate. Wires (wireb ο nd) are arranged on one end of a chip and one of the wafers to arrange a plurality of coaxial semiconductor package bonding pads, and each of the coaxial semiconductor package bonding wire surfaces Connect; — Pass the other ends of the coaxial semiconductor package bonding wires through the through holes in a positioning board; Place the positioning board and the chip in a container to request a liquid evil The substrate is in the accommodating device to form a type of liquid substrate between the positioning plate and the wafer; remove the accommodating device; and form a plurality of solder balls on the type of liquid substrate so that the The solder balls are respectively connected to another of the coaxial semiconductor package bonding wires. 6. The manufacturing method according to item 5 of the scope of patent application, wherein before the step of placing the positioning plate and the wafer into the receiving device, the manufacturing method further includes: inverting the positioning plate and the wafer. 7. The manufacturing method according to item 5 of the scope of patent application, wherein in the step of placing the positioning plate and the wafer into the receiving device, the positioning plate is placed on the bottom of the receiving device, and the wafer And the positioning plate at a distance 1224375 8 · If the patent application scope of the 5th Jg%, +, step of forming such a liquid substrate, said manufacturing method, wherein on the shaped surface, and the coaxial halves are arranged in the liquid substrate substrate , These coaxial semiconducting conductors & = coating and welding wires are fixed outside this type of liquid liquid substrate. 2. The other end of the fresh line is exposed to this type. 9 · As described in the fifth box of the patent application scope, +, ^, the method of manufacturing the toilet after removing the step of the containing device, the method further includes: Before the solder balls, the manufacturer removes the positioning plate. The manufacturing method described above, wherein the step of removing the positioning plate as described in item 9 of the scope of the patent application by using an etching method is to remove the positioning plate. 11. The manufacturing method according to item 5 of the Shengu patent scope, wherein each of the coaxial semiconductor package bonding wires includes: a signal layer; a dielectric layer; the dielectric layer is a coaxial cladding A ground layer is provided on the outside of the signal layer; the ground layer is coaxially coated on the outside of the dielectric layer; wherein the dielectric layer insulates the signal layer from the ground layer. 12. The manufacturing method according to item 5 of the scope of patent application, wherein the material of the liquid substrate is a thermosetting resin. 13. · A package structure comprising: a type of liquid substrate having an upper surface and a lower surface; TW1291F (Sun and Moonlight). Ptd Page 18 1224375 VI. Patent application scope A chip (ch ip) is arranged on the upper surface of this type of liquid substrate; a plurality of solder balls are formed in this type of liquid The lower surface of the substrate; a plurality of coaxial semiconductor package wires (wireb ο nd) are arranged in the liquid substrate, and the coaxial semiconductor package bonding wires are used to electrically connect the chip and the solder balls; And a positioning plate having a plurality of through holes, the positioning plate is selectively arranged below the liquid substrate of the type; wherein, before forming the liquid substrate of the type, the coaxial semiconductor package bonding wires connected to the wafer are formed; One end is respectively passed through the through holes of the positioning plate to position the coaxial semiconductor package bonding wires; wherein, after forming the liquid substrate, the solder balls are formed on the lower surface of the liquid substrate. And are respectively electrically connected to the ends of the corresponding coaxial semiconductor package bonding wires. 14. The sealing structure described in item 13 of the scope of the patent application, wherein one end of the coaxial semiconductor package bonding wires is respectively connected to the solder balls through the through holes of the positioning plate. 15. The packaging structure according to item 13 of the scope of the patent application, wherein the positioning plate is removed after forming the liquid substrate and before forming the solder balls. 16. The sealing structure described in item 13 of the scope of patent application, wherein each of these coaxial semiconductor package bonding wires includes: a signal layer; 1224375 6. The scope of the patent application is a dielectric layer, which is coaxially coated on the outside of the signal layer; and a ground layer, which is coaxially coated on the outside of the dielectric layer; The dielectric layer insulates the signal layer from the ground layer. 17. The packaging structure according to item 13 of the scope of patent application, wherein the material of the liquid substrate is a thermosetting resin. TW1291F (Sun and Moonlight) .ptd Page 20