TW200522220A - Package structure with liquid chip carrier and manufacturing method thereof - Google Patents

Abstract

The present invention provides a package structure with a liquid chip carrier and a manufacturing method thereof. The manufacturing method includes the steps as follow. First, coaxial semiconductor package wire bonds are disposed on a chip, so that one end of each coaxial semiconductor package wire bond is connected to a surface of the chip. Then, the other end of each coaxial semiconductor package wire bond passes through a perforation of a fixed position plate separately. The chip and the fixed position plate are disposed within a container and a liquid substrate material is poured into the container, so that a liquid chip carrier is formed between the chip and the fixed position plate. After the container is removed, solder balls are formed on the liquid chip carrier and the solder balls are electrically connected to the other end of each coaxial semiconductor package wire bond separately. Finally, the package structure with a liquid chip carrier is completely performed.

Description

200522220 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a semiconductor packaging structure, and more particularly, to a packaging structure with a liquid substrate and a manufacturing method thereof. [Previous technology] Due to the constant demand for light, thin and short electronic information products, it has driven the development of printed circuit boards (PCBs) in the direction of thinning and micro-hole technology, coupled with the continuous miniaturization of surface mounting technology Progress has made the demand for high-end c packaging substrates continue to increase. Generally speaking, the substrates used in traditional packaging technologies are different according to the materials used. They can be summarized as ceramic substrates, plastic substrates, metal substrates, lead frames, and organic substrates. organic substrate) and tape. However, with the current development trend of thinning and micro-hole technology, the above substrates will be subject to high-density, small-volume, and high-performance packaging requirements in the future, which will make the layout of the substrate (1 ayou t) The limitations of drilling technology, line width and line spacing, and the dilemma of increasingly complicated substrate structures and increasingly expensive substrate manufacturing costs. [Summary of the Invention] In view of this, the object of the present invention is to provide a packaging structure with a liquid-like substrate, which can three-dimensionally lay out the layout space of the substrate, avoiding the layout of the substrate being affected by drilling technology, line width and line spacing. Restrictions and increase the efficiency of the packaging process.

200522220 V. Description of the invention (2) According to the purpose of the present invention, the deconstruction includes: a liquid-like substrate, a crystal bal 1), and a plurality of coaxial semiconductor-state substrates having upper and lower surfaces on the upper surface, and a solder ball configuration The conductor packaging wire is arranged on the liquid-like packaging wire for electrically connecting the crystals. According to the purpose of the present invention, the method of manufacturing a restructure includes: arranging a wafer, connecting each coaxial semiconductor cover, and connecting each of the same semiconductor semiconductors. Passing through a plurality of through holes on the positioning plate; injecting a liquid base material between the accommodating device and the wafer; removing the substrate of the accommodating device so that these solder balls are electrically connected with each other. According to the purpose of the present invention, a substrate, a wafer, a plurality of solder balls, and a positioning plate are changed. The liquid-like substrate has a surface above the liquid-like substrate. Coaxial semiconductor package bonding wires These coaxial semiconductor package bonding wire boards have multiple through holes and are positioned below the board. Among them, a liquid-like packaging chip with a liquid-like substrate, a plurality of solder balls (solder packaging wire bonds) are produced during the liquid-like forming. The liquid-like, wafer is formed under a liquid-like substrate such as a liquid-like substrate. Surface. In the coaxial half-state substrate, and these coaxial semiconductor wafers and solder balls, a sealing device with a liquid-like substrate is proposed. A plurality of coaxial semiconductor package bonding wires are connected to one end of the mounting wire and one of the chip packaging wires. The other end penetrates the positioning plate and the wafer-receiving accommodation device respectively; 'to form a liquid-like substrate on the positioning plate; and to form a plurality of solder balls on the other end of the liquid-like coaxial semiconductor package bonding wire propose a packaging structure, including Liquid multiple coaxial semiconductor package bonding wires, as well as the surface and the bottom surface, the chip is arranged on a solder ball, is formed under a liquid-like substrate, and is arranged in a liquid-like substrate, and this electrically connects the wafer and the solder ball. The positioning system is selected TW1291F (sun and moon light) connected to the wafer before being placed in a liquid-like substrate-like substrate. Dtd _

Page 10 200522220 V. Description of the invention (3) One end of the coaxial semiconductor package bonding wire is passed through the through hole of the positioning plate to locate these coaxial semiconductor package bonding wires. After forming the liquid-like substrate, the solder balls are respectively formed on the lower surface of the liquid-like substrate to be electrically connected to one end of the corresponding coaxial semiconductor package bonding wire, respectively. ▲ In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible ', a preferred embodiment is given below and described in detail with the accompanying drawings as follows: [Embodiment]

The detailed manufacturing method and practical application disclosed by the present invention will be separately described in the drawings. The drawings are as follows, please refer to FIG. I, FIG. 2, FIG. 3, and FIG. 4 at the same time. FIG. 1 shows a flowchart of a method for manufacturing a packaging structure with a liquid-like substrate according to an embodiment of the present invention, and FIG. 2 to FIG. 4 show a liquid-like substrate with a corresponding step according to FIG. 1. Schematic diagram of the package structure. In the first figure, each step is arranged in the order of step block 12 to step block 24 according to the numerical order and illustrates a method for manufacturing a packaging structure with a liquid-like substrate according to the present invention. First, as described in step 2, a plurality of coaxial semiconductor package bonding wires (wire bonci) 50 are arranged on a chip (30), and one end of each coaxial semiconductor package bonding wire (50) is connected to the chip surface (3). Connect as shown in Figure 2. Next, in the description of step 14, each of the semiconductor package bonding wires 50 is passed through the multiple through holes 41 on the positioning plate 40, so that each coaxial semiconductor package bonding wire 50 is routed through The through holes 41 on the positioning 40 are dispersedly arranged to achieve positioning of the coaxial semiconductor bonding wires 50. I Page 11 TW1291F (Sun Moonlight) .ptd 200522220

In step 16 of the placement device 70, the position plate 40 is separated from the wafer 30 by 40 and the position plate 40 of the accommodation device 70. The embodiment of the sheet 30 is illustrated, and the plate 40 and the wafer 30 are combined. . Then, in the accommodating device 70, it will be described in the following description that "the bottom of this implementation is exactly the same as that shown in Fig. 3". The configuration method adopted is that the positioning device is first set into the accommodating device 70 so that the positioning plate is in contact with each other and the wafer is fixed at a distance of h. However, the only method of this inverted positioning plate 40 and the crystal can be positioned without inversion Each step completes the description of block 18 of the present invention, and injects a liquid substrate into the 'form liquid substrate 60' between the positioning plate 40 and the wafer 30, that is, the wafer 30 is located above the upper surface 61 of the liquid substrate 60 'The positioning plate 40 is located below the lower surface 62 of the liquid-like substrate 60. Furthermore, the coaxial semiconductor package bonding wire 50 whose one end is connected to the chip 30 is fixed in the liquid-like substrate 60, and the other ends of the coaxial semiconductor package bonding wire 50 are respectively penetrated through the through holes 41 of the positioning plate 40 and Exposed outside the liquid-like substrate 60. In addition, the liquid substrate is, for example, a thermosetting resin, or is composed of a compound having a moldable property. In addition, the liquid substrate has the property of being resistant to a high temperature of at least 200 ° C, so as to avoid being affected by the high temperature melting in the manufacturing process of the packaging structure to affect the overall yield. After the liquid substrate is cooled and solidified to form a liquid-like substrate 60 ', the containing device 70 is removed as described in step 20. Next, as shown in step 22, the positioning plate 40 is removed, as shown in FIG. In this embodiment, for example, an etching method is used to remove the positioning plate 40. Finally, a plurality of solder balls 80 are formed on the lower surface 62 of the liquid-like substrate 60 as described in step 24, so that the solder balls 80 correspond to the corresponding ones.

200522220 V. Description of the invention (5) The other end of the coaxial semiconductor package bonding wire 50 exposed to the liquid-like substrate 60 is electrically connected. In addition, please refer to FIG. 5, which is a schematic cross-sectional view of the coaxial semiconductor package bonding wire in FIG. In this embodiment, the coaxial semiconductor package bonding wire 50 includes a signal layer 51, a dielectric layer 52, and a ground layer 53. The dielectric layer 52 is coaxially coated on the outside of the signal layer 51, and the ground layer 53 is coaxially coated on the outside of the dielectric layer 52. The dielectric layer 5 2 is used to insulate the signal layer 51 from the ground layer 5 3, and the ground layer 53 is directly in contact with a liquid substrate 60 such as an insulating property, so there is no need to cover the dielectric layer for connection. Strata 5 3 outside. It should be particularly noted that the step of removing the positioning plate 40 described in step block 22 is not a necessary step of the present invention, that is, after removing the accommodation device 70 described in step block 20, it is not necessary. If the positioning plate 40 needs to be etched, it can be directly performed as described in step 24 to form a plurality of solder balls 80 on the lower surface 62 of the liquid-like substrate 60 so that the solder balls 80 correspond to the corresponding ones. The other end of the coaxial semiconductor package bonding wire 50 which has penetrated through the through hole 41 of the positioning plate 40 and exposed to the liquid-like substrate 60 is electrically connected. Under the positioning of the positioning plate, the sealing structure of the liquid-like substrate disclosed in the above embodiments of the present invention is because the base material serving as the liquid-like substrate is a fluid liquid state before being cured, and is located in the liquid-like substrate. The coaxial semiconductor package bonding wires can be freely configured, so that the layout of the substrate (layout) space can be three-dimensional, which can further prevent the layout of the substrate from being limited by the drilling technology 'line width and line spacing, and improve the efficiency of the packaging process. In summary, although the present invention has been disclosed as above with a preferred embodiment,

TW1291F (Sun and Moonlight) .pt (1 Page 13 200522220

TW1291F (Sun Moonlight) .ptd Page 14 200522220 Brief description of the drawings [Simplified illustration of the drawings] Figure 1 shows a flowchart of a method for manufacturing a packaging structure with a liquid substrate according to an embodiment of the present invention; Figure 2 ~ FIG. 4 is a schematic diagram of a packaging structure with a liquid-like substrate according to one of the steps in FIG. 1. Fig. 5 is a schematic cross-sectional view of a coaxial semiconductor package bonding wire in Fig. 2. Fig. 0 Symbol description Step block

12, 14, 16, 18, 20, 22, 24 3 0 Wafer 31 3: Grounding layer 6 0: Liquid-like substrate 61: Liquid-like substrate upper surface 62 ·· Liquid-like substrate lower surface 70 · · Receiving device 80: Tin ball

Claims (1)

200522220 VI. Scope of patent application 1. A package structure, including: " Liquid-like substrate 'has an upper surface and a lower surface; a chip (ch ip), which is arranged on the upper surface of the liquid substrate A solder ball is formed on the lower surface of the liquid substrate; and a plurality of coaxial semiconductor package wire bonds are disposed in the liquid substrate. The coaxial semiconductor package wires are used for The chip and the solder balls are electrically connected. 2. The packaging structure according to item 1 of the scope of patent application, wherein the packaging structure further comprises: a positioning plate (wire mask) having a plurality of through holes corresponding to the solder balls; wherein, One end of the coaxial semiconductor package bonding wires is connected to the chip, and the other ends of the coaxial semiconductor package bonding wires are respectively penetrated through the through holes and connected to the solder balls. 3. The package structure according to item 1 of the scope of patent application, wherein each of the coaxial semiconductor package bonding wires includes: a signal layer; a dielectric layer, the dielectric layer is coated on the same vehicle An outer side of the signal layer; and a ground layer, the ground layer is coaxially coated on the outer side of the dielectric layer; wherein the dielectric layer insulates the signal layer from the ground layer. TW1291F (sun and moonlight) .ptd 16th stomach 200522220 6. Scope of patent application At4 ^ The packaging structure described in item 1 of the declared patent scope, wherein the material of this type of liquid evil substrate is a thermosetting resin. 5. A method for manufacturing a packaging structure with a liquid-like substrate, comprising: arranging a plurality of coaxial semiconductor package bonding wires (wire bond) on a wafer; one end of each of the coaxial semiconductor package bonding wires is connected to the The surface of the chip is connected; The other ends of the coaxial semiconductor package bonding wires are respectively passed through a plurality of through holes in the positioning plate; the positioning plate and the chip are placed in a receiving device; Note = a liquid substrate is in the receiving device, To form a type of liquid substrate between the positioning plate and the wafer; remove the accommodating device; and a solder ball on the type of liquid substrate '= the solder balls are w and the same semiconductor seals The other end of the Xiangxian line is electrically connected. 6 The manufacturing method according to item 5 of the scope of patent application, wherein before the step of placing the bit plate and the wafer into the intersecting key + stop ^ is a step of setting the valley, the manufacturing method further includes · The positioning plate and the wafer are inverted. 7. The manufacturing method according to item 5 of the scope of patent application, wherein in the step of positioning the wafer and placing the wafer in the receiving device, the positioning plate is placed at the bottom of the present device and the wafer It is separated from the positioning plate by a distance. 200522220 —— ------------- ---- ^ 一 ^ VI. Shen Liu Nasi ^ ^ 8 · The manufacturing method described in item 5 of the scope of patent application, wherein In the step of a liquid-like substrate, the chip is arranged on the surface of the liquid-like substrate, and the coaxial semiconductor package bonding wires are fixed in the liquid-like substrate, and the other ends of the coaxial semiconductor package bonding wires are exposed. Beyond this type of liquid substrate. 9. The manufacturing method according to item 5 of the scope of patent application, wherein the manufacturing method further comprises: removing the positioning plate after the step of removing the accommodating device and before the formation of the solder ball. 10. The manufacturing method as described in item 9 of the scope of patent application, wherein in the step of removing the positioning plate, #etching method (e t c h i n g) is used to remove the positioning plate. 11. The manufacturing method according to item 5 of the scope of patent application, wherein each of the coaxial semiconductor package bonding wires includes: a signal layer; a dielectric layer, and the dielectric layer is coaxially coated on An outer side of the signal layer; and a ground layer (the ground layer) is coaxially coated on the outer side of the dielectric layer; wherein the dielectric layer insulates the signal layer from the ground layer. 12. The manufacturing method according to item 5 of the scope of patent application, wherein the material of this type of liquid substrate is a thermosetting resin. 13. A packaging structure including: a type of liquid substrate having an upper surface and a lower surface; TW1291F (Sun Moonlight) .ptd Page 18 200522220 VI. Patent application scope A chip (ch ip) is arranged on the upper surface of this type of liquid substrate; a plurality of solder balls are formed in this type of liquid The lower surface of the substrate; a plurality of coaxial semiconductor package bonding wires (Wire bonds) arranged in the liquid substrate, the coaxial semiconductor package bonding wires are used to electrically connect the chip and the solder balls; and The positioning plate has a plurality of through holes, and the positioning plate is selectively arranged below the liquid substrate; wherein, before forming the liquid substrate, one end of the coaxial semiconductor package bonding wires on the wafer is connected. The through holes of the positioning plate are respectively passed to position the coaxial semiconductor package bonding wires; wherein, after forming the liquid substrates, the solder balls are respectively formed on the lower surface of the liquid substrates so as to respectively And electrically connected to the ends of the corresponding coaxial semiconductor package bonding wires. 14. The package structure described in item 13 of the scope of the patent application, wherein one end of the coaxial semiconductor package bonding wires is respectively connected to the solder balls through the through holes of the positioning plate. 15. The packaging structure according to item 13 of the scope of the patent application, wherein the positioning plate is removed after forming the liquid substrate and before forming the solder balls. 16. The package structure according to item 13 of the scope of patent application, wherein each of the coaxial semiconductor package bonding wires includes: a signal layer ·, 200522220 6. Scope of patent application and a ground layer, the ground layer is the outside of the dielectric layer; the dielectric layer 'the dielectric layer is sleeved on the outside of the signal layer with the sleeve; coaxially wrapped in it The dielectric layer insulates the signal layer from the ground layer. 17. The packaging structure described in item 13 of the scope of patent application, the material of the liquid cancer-like substrate is a thermosetting resin. 、 The Η page 20 TW1291F (Sun Moonlight) .Ptd