TWI223580B - Circuit component having fabrication-stage blind holes and process of making - Google Patents

Abstract

A process for fabricating a discrete circuit component on a substrate having blind holes is disclosed. The first surface of the substrate has a matrix of dice surface trace sets each having a first and a second electrically conductive segment disconnected from each other. The second surface of the substrate has a corresponding matrix of soldering surface trace sets each having a first and a second electrically conductive segment disconnected from each other. One blind hole electrically connects each of the first and second conductive segments of each of the dice surface trace sets respectively to the first and second conductive segments of the corresponding soldering surface trace set. The process comprises the steps of: (a) placing a circuit die on said first conductive segment of each of said dice surface trace sets and electrically connecting the first electrode of said die thereto and electrically connecting the second electrode of said die to said second conductive segment of the same trace set; (b) hermetically sealing said dice and all dice surface trace sets on said first surface of said substrate; and (c) physically separating each of said plurality of discrete circuit components by cutting into said hermetically sealed substrate for all individual ones of said dice.

Description

1223580 a »V. Description of the invention (1) Field The present invention relates generally to circuit components and manufacturing methods thereof, and in particular to a circuit component (circuit components) suitable for automated mass production and having blind holes at the process stage. ) And how to make it. Previous technologies such as diodes, transistors, resistors, and capacitors are active and passive circuit components, which are widely used in electronic circuits. Circuit components. Whether it is small signal (s i gna i) or high power (power) applications, linear (1 inear) or digital (d i g i ta 1) circuits need to be applied to these discrete circuit components of different properties. In addition to diodes, resistors and valleys integrated in integrated circuits, diodes in the form of discrete components, resistors and capacitors, are electronic components that are used in large quantities. There are many types of packaging for discrete circuit components, such as leaded packages. Based on the demand for miniaturization, surface-mount technology (SMT) discrete components have gradually become circuit components required for miniaturized electronic devices. Therefore, high-speed mass production at low cost is The direction in which such discrete circuit components must be manufactured. Different from wire-type packaging, soldering of circuit components is performed by using the pin holes of the parts inserted on the printed circuit board to solder, and SMT discrete electric

1223580 5. Description of the invention (2) The electrical contact terminals of circuit components use the substantial area of their contact terminals to eat tin, and the components themselves are soldered to the printed circuit board. Since the SMT component does not have a convex electrical contact terminal inserted into the hole of the printed circuit board, it must rely on a large enough soldering area to be able to firmly solder the component to the position of the printed circuit board and have a good Electrical contact quality.

However, the electrical contact terminals of the SMT type discrete circuit components of the conventional technology have a flat solder surface. Some types of SM components, such as diodes in cylindrical packages, have tin-like surfaces that are even convex. These flat or protruding solder surfaces have disadvantages when the circuit components are assembled into a printed circuit board. For example, circuit components are prone to displacement, and insufficient auto-correction forces occur when displacement occurs. On the other hand, there are some row packages that integrate multiple individual discrete circuit components in a single component package, such as diodes, transistors, and resistors. The soldering surfaces of the electrical contact terminals are It is a single plane configuration. Due to various factors such as the uniformity of solder paste printing when the printed circuit board is assembled, these single-plane soldering electrical contact terminals often have problems with their soldering quality. On some electrical contact terminals that require power current, these non-uniformities in solder quality are extremely likely to cause circuit function problems. Summary of the Invention

Therefore, an object of the present invention is to provide a blind-hole discrete circuit component and a manufacturing method thereof at a manufacturing stage. The component structure can be suitable for different wafer sizes, and the manufacturing method can be suitable for low-cost mass production. The object of the present invention is also to provide a blind-hole discrete electric

Page 8 1223580 V. Description of the invention (3) The circuit component and its manufacturing method are suitable for making discrete circuit components with different chip sizes using the same process fixture.

In order to achieve the foregoing object, the present invention provides a method for manufacturing a blind hole in a process stage capable of fabricating discrete circuit elements on a substrate, and a matrix of a plurality of element grain plane conductive lines is formed on the first surface of the substrate. Each of the grain-plane conductive lines includes a first conductive segment and a second conductive segment that are electrically independent of each other, and a matrix is correspondingly formed on the second surface of the substrate opposing the first surface. A plurality of welding surface conductive lines, each of which includes a first conductive segment and a second conductive segment which are electrically independent of each other, and has a plated blind hole to connect the grain surface conductive lines to each other. The first and second conductive segments are electrically connected to the first and second conductive segments of the welding surface conductive line, respectively. The steps of the manufacturing method include: (a) on the first surface An element die is placed on the first conductive section of the die conductive circuit, and the first electrode of the die is electrically connected to the first conductive section of the die conductive circuit, and the second electrode of the die is electrically connected. * Electrode Ground is connected to the second conductive segment of the grain conductive line; (b) the element grains and all conductive lines on the first surface of the substrate are completely covered with water-tight electrical insulating material; and (C) Cutting the water-air-sealed substrate to divide all the element dies into individual discrete electronic components. The present invention also provides a blind-hole discrete circuit element at a manufacturing stage, wherein φ includes: a substrate, an element die, and an electrically insulating substance. An element grain plane conductive line is formed on the first surface of the substrate, and includes a first conductive segment and a second conductive segment that are electrically independent of each other. The object is opposed to the first table.

Page 9 1223580 V. Description of the invention (":") A welding surface conductive line is formed on the second surface of the surface, which includes a first conductive segment and a second conductive segment that are electrically independent of each other. A first plated blind hole electrically connects the first conductive segment of the grain plane conductive circuit with the first conductive segment of the solder plane conductive circuit. A second plated blind hole electrically connects the second conductive segment of the grain-plane conductive line with the second conductive segment of the fresh-face conductive line. An element grain is positioned on the first conductive segment of the grain conductive circuit on the first surface, and the first electrode of the grain is electrically connected to the first conductive segment of the grain conductive circuit; and the crystal The second electrode of the grain is electrically connected to the second conductive segment of the grain conductive circuit. The electrically insulating material completely and water-tightly covers the element crystal grains and all conductive lines on the first surface of the substrate. Embodiments of the invention FIG. 1 is a perspective view of a crystal plane of a substrate of a blind-hole discrete circuit element in a preferred embodiment of a blind-hole process stage in a process stage of the present invention. As shown in the figure, the substrate 100, which typically has hundreds of discrete circuit elements arranged to support the entire matrix arrangement, has a plurality of discrete conductive circuit elements on the surface of the grain plane 1 10. 1 1 1, 1 1 2, ... and 1 1 6 are arranged in, for example, a two-dimensional orthogonal matrix as shown in the figure. It is noted that the substrate 100 itself is also used as a basic carrier sheet for a large number of circuit elements produced in a batch in the present invention at an early stage of the process. With respect to the initial conductive line of the grain surface of FIG. 1, the substrate 100 is on the opposite surface of the grain surface 1 10 of FIG. 1, that is, the welding surface of the component, and there is a plurality of initial conductive lines 2 1 1, 2 1 2, ... and 2 1 4 etc.

1223580 V. Description of the invention (5) Among the corresponding matrices. Fig. 2 is a perspective view of the soldering surface of the substrate of Fig. 1. On the surface, there are also a plurality of discrete conductive elements of the initial conductive lines 2 1 1, 2 1 2, ... and 2 1 4 arranged in a matrix. Note that the substrate welding surface 2 1 0 of FIG. 2 is a matrix arrangement pattern of the conductive surface of the welding surface shown by horizontally flipping the substrate grain surface 110 of FIG. 1. This can correspond to the line 1 1 1 of the grain surface 1 1 0 in Figs. 1 and 2 corresponding to the line 2 1 1 of the welding surface 2 1 0, the line 1 1 2 and 2 1 2, ... and 1 1 4 and 2 1 4 corresponds and is understood.

A blind hole is formed in each of the discrete conductive elements' initial conductive lines (including the grain surface and the soldering surface) at approximately the center of the conductive lines. Except for the grain surface conductive circuit layer, it passes through substantially vertically. The entire thickness of the substrate 100. For example, a blind hole 1 3 1 is formed in the conductive line 1 1 1 and the corresponding 2 1 1 in FIGS. 1 and 2, and a blind hole 1 is formed in the conductive line 1 1 2 and the corresponding 2 1 2. 3 2. The relative positional relationship between each blind hole and its corresponding conductive line on the grain surface and the soldering surface of the substrate is shown in Figs. FIG. 3 is a partial enlarged view of FIG. 1, which shows the configuration details of the initial conductive lines on the substrate grain surface, and FIG. 4 is a cross-sectional view of the substrate of FIGS. 1 and 2. Figures 1, 2 and 3

Each substantially rectangular area surrounded by a dotted line, as will be described later, represents the physical range of a discrete circuit element. For example, as shown in FIG. 3, the range indicated by the dashed line 1 2 1 is the physical range of a complete discrete circuit component of the present invention. Among them, the approximate center of the range 1 2 1 is as indicated by the dashed area 1 5 1 The position is the position where the element die will be positioned. Note that as shown in the perspective view of FIG. 3, the conductive lines are on the substrate

Page 11 1223580 V. Description of the invention (6) 100 grain plane 110 Asymmetrical pattern along the long axis direction (horizontal direction in the figure). According to a preferred embodiment of the discrete circuit component of the present invention, the conductive circuit is within the component footprint range 121 of a component shown in FIG. 3 along the short axis direction (vertical direction in the figure). 'The conductive lines 1 1 1 and 1 1 2 are substantially symmetrical in shape.

In comparison, the ‘lines 丨 1 and 丨 丨 2 show significant asymmetry along the long axis of the component footprint. The conductive lines 丨 丨 1 and 丨 丨 2 are essentially two conductive patterns that are electrically independent of each other. Each of the conductive lines 111 and 112 has a conductive line segment extending toward the center of the το member. One of the two conductive lines extends toward the center of the element, that is, the position where the element crystal grains are positioned, and the other conductive line does not extend to the center by a considerable extent so that the two are not in contact with each other and maintain an independent open circuit state of electrical properties. In the embodiment shown in FIG. 3, the conductive line 1 1 1 on the right side is a conductive line extending more toward the center of the element. However, as can be understood by those skilled in the art, it is also feasible to arrange the conductive line on the left to reach the center of the component.

The cross-sectional view of FIG. 4 shows that each blind hole is a plated hole of a plated surface. As shown in the figure, the blind holes 131 and 132 can form a conductive metal layer on the wall of the hole by using techniques such as sputtering, electroplating, and the like to make a printed circuit board. This metal-clad metal layer on the hole wall of the blind hole can electrically connect the conductive lines on the grain surface of the substrate and the conductive lines on the welding surface on the opposite side. The substrate shown in Figs. 1 and 2 serves as the discrete circuit element of the present invention.

Page 12 1223580 V. The basis of invention description (7). The substrate is an electrically insulating sheet material, which can be, for example, glass fiber reinforced resin (FRP), or can be made into a sheet material using appropriate insulation properties using techniques such as die casting (m ο 1 d i n g). Thereafter, the conductive lines on the grain side and the solder side can be made by using, for example, a development engraving technique (p h 0 t ο 1 i t h 0 g r a p h y). The blind hole can be formed by drilling a hole at a position as shown in FIG. 3 by using an appropriate processing tool. Thereafter, as described above, a plating through-hole can be formed by a process such as sputtering and / or plating. After the plating blind holes are formed, the substrate 100 shown in Figs. 1 and 2 can be obtained. Then, in a preferred embodiment, a permanent buried material can be buried in each blind hole. The blind hole can be filled with a permanent material with good conductive properties. As can be understood by those skilled in the art, suitable materials include, for example, conductive glue, solder paste or solder balls, etc. After filling, these filling materials can completely and tightly fill the entire blind hole. Of course, the blind hole can also maintain headroom without being filled with any substance. The substrates shown in Figs. 3 and 4 are not filled with the buried hole material in the plated blind holes. Using this substrate, as shown in FIG. 5, the crystal grains of the discrete circuit element can be set on the positioning 151 shown in FIG. The cross-section of FIG. 5 shows that the crystal grain 5 1 1 of a discrete circuit element is set on the crystal grain surface 1 1 0 of the substrate 100. The electrode of the element grain 5 1 1 is electrically connected to the conductive line 1 1 1 A on the crystal grain surface 1 1 0 on the substrate 100. The electrical connection between the die 5 1 1 and the conductive line 1 1 1 A can be used, for example, heating in an electric furnace to melt and cool the solder previously formed on the lower surface of the die 5 1 1 or the position of the conductive line 1 5 1 After the grain 5 1 1 is welded to the conductive

Page 13 1223580 V. Description of the invention (8) Line 1 1 1 A of 1 5 1 is positioned. After the electrode on the lower surface of the circuit element die 5 1 1 and the conductive line 111A on the die face have reached a stable electrical connection, the other end of the die 51 i, that is, the other electrode on the top, can use a jumper, for example. 5 3 i is electrically connected to another conductive line 112B on the grain surface 110 of the substrate 100 through a wire. After pf when the structure shown by 1 j 1 5 is used, the electrodes of each component die are dried, and the respective 12i substrate ranges (the corresponding soft and fresh contact terminals marked by the dashed lines in Figures 1, 2 and 3). : "Fancheng ', but each discrete circuit still arranged in the matrix ^ can be processed by hermetic seal (Figure 6): The surface view shows the watertightness of the discrete circuit element grains of Figure 5 Material = 6 0 0 cladding case. This type of sealing coating can, for example, use die casting = method, order, and just use a mold to form a south face above the grain surface 1 1 0 of the substrate 100. ^ Appropriate space can be used, for example, melting (soft water ^ air ^ sealing material is injected into the space ') can be easily and easily made water and air tight. 1 1, 5 1 2 etc. are protected in it.〉 The idea is that the choice of 'water-tight insulation material 600' can also be exactly the same as that used by the substrate 100 itself. Later, the cross-sectional surface of FIG. 7 The figure shows that the substrate structure of FIG. 6 is cut into shims, in other words, loose circuit components. Note that two adjacent The cutting between the pieces can basically be performed by aligning the symmetrical centerline between the two elements. As shown by ^ 'to cut the element 7 1 1 in FIG. 7 must be cut along the cutting lines 7 4 1 and 7 4 2 In addition, 'as can be understood, along with

Page 14 1223580 V. Description of the invention (9) The direction perpendicular to the cutting lines 7 4 1 and 7 4 2 also requires two cuttings to completely separate the component 7 1 1. If the material buried in the blind hole is permanent and has good conductive properties, the stuffing material becomes part of the electrical contact terminal. On the other hand, if the blind hole is not buried, after the cutting procedure, the surface of the exposed blind hole itself can be used as the conductive surface of the electrical contact terminal.

8 and 9 respectively show perspective views of the back surface and the soldering surface of a circuit element manufactured in accordance with a preferred embodiment of the present invention and cut and separated. Because the cutting is performed through the symmetrical centerline of the blind hole as described above, the perspective view of FIG. 9 shows that the two electrodes of each component can have a large area and a height that is significantly higher than the initial conductive line thickness on the substrate. The height of a conductive junction, such as the unfilled blind hole in FIG. 9, along the direction perpendicular to the plane of the substrate. The conductive interface can ensure good soldering quality when the blind-hole discrete electronic component is soldered on a printed circuit board at each process stage of the present invention. On the other hand, in the aforementioned preferred embodiment of blind hole filling using a permanent conductive filling material, the conductive junction formed by the aforementioned cutting is a surface without recesses.

Figs. 10 and 11 respectively show perspective views of a back surface and a soldering surface of another circuit element single structure of the present invention, which have four electrical contact terminals. This circuit element can be a connection of two types of components as shown in Figs. 8 and 9, which have four electrical contact terminals. Note that the electrical contact terminals 1 0 1 1, 1 0 1 3 and the like of the component 1 0 0 0 in the figure are similar to the terminal 8 1 1 of the component 8 0 0 in FIGS. . Figures 1 2 and 1 3 respectively show the structure of another circuit element according to the present invention.

Page 15 1223580 V. Description of the invention (ίο) A perspective view of the back surface and the soldering surface, which has four rows of four electrical contact terminals each. It can be a connection of four types of component monomers as shown in Figure 8, with a double row Four _ electrical contact terminals each. The electrical contact terminals 1 2 1 1, 1 2 1 3, etc. of the component 1 2 0 in the figure are similar to the terminal 8 1 1 of the component 8 0 0 in FIG. 8, and also have a recessed conductive connection surface. The multiple electrical contact terminal circuit elements shown in Figs. 10 to 13 can be applied to, for example, integrated active or passive circuit elements such as diodes. On the other hand, Fig. 14 shows a perspective view of a soldering surface of a single circuit element structure of the present invention. The three electrical contact terminals 1411, 1 4 1 3, and 1 4 1 2 of this circuit element 1400 are arranged in an asymmetrical form, which can be adapted to the needs of discrete circuit elements such as transistors that require three pins. FIG. 15 is a perspective view of a soldering surface of a single circuit element structure of the present invention, which has a plurality of electrical contact terminals arranged on four sides. Note that the circuit element 1 500 in the figure has four electrical contact terminals (1511, 1513, 1515, and 1517 and 1512, 1514, 1516, and 1518) on each of its two wider sides, while its narrower sides each have only One electrical contact terminal 1 5 2 1 and 1 5 2 2. Such an electrical contact terminal arrangement of the circuit element 1 500 is equally applicable to, for example, integrated active or passive circuit elements such as a diode or a transistor. In a typical component pin assignment method, a wide-side electrical contact terminal may be a signal pin of a plurality of individual discrete circuit components contained in the component 15500, such as the positive and negative pins of a diode. The narrow-side electrical contact terminals can be used for common ground or common φ ground such as common ground or common cathode diodes. As can be understood by those skilled in the art, although the circuit element 15 0 0 in the figure has substantially a single electrical element on its side

Page 16 1223580 V. Description of the invention (11) Contact terminals, but combined with different elements The invention has blind holes formed at the beginning of the manufacturing process. Therefore, it is necessary to reserve for subsequent full use, which must be occupied by components suitable for production specifications. Although the entire description is described above, the application is still widely applicable to discrete discrete capacitors of the size that can be used by discrete artisans, and passive or integrated circuits are applicable. Not only are they applicable to ordinary chip sizes and their components. Another example is a solidified paste, which can also arrange more than one electrical contact terminal to suit the needs of the part. In the process stage, blind hole discrete circuit components use a substrate as the basis for constructing multiple elements of the entire matrix. In the meantime, these blind holes have been formed equivalent to the specified formation range that penetrates each component. Because there is no space for drilling, the entire range of components is used to carry component dies. In other words, the smallest space on the substrate can be minimized. Such extremely small components, such as 0 6 0 3, 0 4 0 2 or even smaller explanatory texts, have been a specific embodiment of the present invention, complete with various modifications, changes in construction and equivalent. . For example, although the detailed description of the foregoing embodiments describes only the circuit elements to illustrate the present invention, as understood by those skilled in the art, under the SMT type, various diodes of the El A standard wafer, such as Zener, Schottky, etc., or Whether there is polarity, or discrete resistance, or even the main nature, it is only necessary to use electronic components with two electrical connectors in the manufacturing method disclosed in the present invention. In addition, the SMT EIA standards such as 1210, 120 6, and 0805, which are seen in the present invention, are particularly suitable for smaller SMT discrete circuits. Cured paste copper paste, or cured paste copper compound

Page 17 1223580 .t \ V. Description of the invention (12) Gold glue. For another example, the conductive lines on the welding surface of the board may be further covered with a nickel layer or a gold layer. Therefore, the foregoing description should not be used to limit the present invention, but its scope should be defined in the text of the scope of section B of the attached patent application.

Page 18 1223580 Brief description of drawings Figure 1 is a perspective view of a crystal plane of a substrate of a blind hole discrete circuit element in a preferred embodiment of a blind hole process stage of the manufacturing process of the present invention; Figure 3 is a partial enlarged view of Figure 1 showing the configuration details of the initial conductive lines on the substrate grain plane; Figure 4 is a cross-sectional view of the substrate of Figures 1 and 2; Figure 5 is a cross-sectional view of a discrete circuit The element crystal grains are set on the crystal grain surface of the substrate and form the electrical connection of the element electrodes. The cross-sectional view of FIG. 6 shows that the discrete circuit element of FIG. 5 is covered with a water-tight material. The cross-sectional view shows that the substrate structure of FIG. 6 is cut into discrete discrete circuit elements. FIGS. 8 and 9 respectively show a circuit element manufactured in accordance with a preferred embodiment of the present invention and cut and separated. Three-dimensional views of the soldering surface; Figures 10 and 11 show perspective views of the back surface and soldering surface of another circuit element single structure of the present invention, respectively, which have four electrical contact terminals; Figures 12 and 13 respectively show the present invention and another A circuit element A perspective view of the back surface and soldering surface of the body structure, which has four rows of four electrical contact terminals each; FIG. 14 shows a perspective view of the soldering surface of another circuit element single structure of the present invention; and FIG. 15 shows another circuit of the present invention A perspective view of a soldering surface of a single element structure having a plurality of electrical contact terminals arranged on four sides.

Page 19

Claims (1)

1223580 Republic of China 092121S) Patent Application No. 11 Circuit components with blind holes in the process stage and the revision of the patent application scope of the application (without dashes) Circuit manufacturing method, it is operated on a substrate, the first surface of the recording board is formed with _ = a through-piece grain plane conductive line, each 1 _ inspection _ 2 roads each with a distance of = = segment and — The second conductive segment, and the substrate is formed on the first surface correspondingly with a matrix of a plurality of welding surface conductive lines _ Brother knows that the conductive lines of the interface each contain a misaligned I — guide And, there is a conductive section, and there are plated blind holes, the first and the fifth of the conductive line of the grain plane-15 == r line rhyme, two (a) the grain conductive line on the first surface A first grain is placed on the first conductive segment, and the first electrode of the crystal grain is electrically connected to the third string of the conductive circuit of the crystal grain, and the second electrode of the element crystal grain is electrically connected to the pure electrode. ㈣Electric line = one conductive segment; 20 The scope of the applied patent is 1. The first and second layers of the substrate are completely covered with water-tight insulation material by water-tight, and the grains of the element and all its conductive impurities are cut; In order to divide all the prostitute grains into individual independent 3: discrete electronic components. That is, 2. The method for manufacturing a circuit element according to the item of the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified silver paste. Said. 3. The method for manufacturing a circuit element according to the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified copper paste. 1 25 1223580 4. According to the method for manufacturing circuit elements with the widest application scope, wherein the conductive lines on the grain surface of the substrate are nationalized paste-like copper alloy glues. 5. The method for manufacturing a circuit element according to the first application of the patent application, wherein a nickel layer is provided on the conductive lines on the soldering surface of the substrate. 56. The method for manufacturing a circuit element according to item 1 of the application, wherein a gold layer is further formed on the conductive lines on the soldering surface of the substrate. 7. The method for manufacturing a circuit element according to item 1 of the scope of patent application, wherein the crystal grains of the circuit element are diode crystal grains. 8. The method for manufacturing a circuit element according to item 1 of the patent application, wherein the crystal grains of the circuit element 10 are transistor crystal grains. 9. The method for fabricating a circuit element according to item 1 of the patent application, wherein the crystal grains of the circuit element are capacitor crystal grains. 10. The method for manufacturing a circuit element according to item 1 of the patent application, wherein the crystal grains of the circuit element are resistance crystal grains. 15 U · The method for manufacturing a circuit element according to item 1 of the scope of patent application, wherein the die of the circuit element is a die including active and passive circuit components. 12 A method for manufacturing a circuit element with a blind hole at a manufacturing stage, the steps include: (1) forming a matrix of a plurality of element grain planes on a first surface of a substrate; The conductive lines each include a first conductive segment and a second conductive segment that are electrically independent of each other; (b) correspondingly forming a matrix of a plurality of welding surfaces on the second surface of the substrate opposing the first surface to conduct electricity; Circuits, each of the conductive surfaces on the welding surfaces of the scales contains electrically independent -conducting sections and n electrical sections, and the first and second conductive sections of the 25-sided conductive circuit of the crystal grain are plated with blind holes. The segments are electrically connected to the first and second conductive segments of the conductive line 2 of the welding surface, respectively; (c) grain grains on the first surface, and the first electrode of the grains is electrically Connected to = set-the element crystal segment on the electric section, and the second I of the element crystal grains-the first conductive: the second conductive; the hard to change the first- Water-tightly encapsulates the component grains and all of them with an electrically insulating material Electrical line; and (vii) those of Su is to cut the base of the pull moisture (iv), to form discrete circuit elements independence. The two elements are divided into 13 · -type circuit elements, which include: qian ^ board 'on which the first surface is formed with element crystals and conductive lines, which include 15: the first surface is formed with fresh connections Surface conductive line, which includes electrical mutual = # 一 conductive section and-second conductive; _ 第 —_f 孔 ， 赖 晶 = the first conductive section is electrically connected to the first conductive section of the welding surface conductive line And a second plated blind hole to electrically connect the second conductive segment of the grain plane conductive line to the welding conductively capture a second conductive and conductive connection; —On the first conductive segment 20 of the grain guide of the surface, the first electrode of the grain is electrically connected to the first conductive of the grain conductive line, and the second electrode of the grain is electrically The second conductive segment is connected to the conductive circuit of the crystal grain; and an electrically insulating material, water-tightly completely covers the element crystal grains and all conductive circuits on the first surface of the tomb board. · If the circuit component of the patent application No.13, wherein the conductive lines on the grain surface of the substrate are 25 1223580 15. The circuit component of item 13 in the scope of patent application, wherein the conductive lines on the grain surface of the substrate are solidified copper paste. 16. The circuit element of the scope of application for item 13 of the patent application, wherein the conductive circuits on the grain surface of the substrate are solidified copper alloy paste. 17. The circuit element of scope of application for the application item of patent 13, wherein the The conductive lines on the soldering surface of the substrate are further covered with a nickel layer. 18. For the circuit element of the scope of application for item 13, the conductive lines on the soldering surface of the substrate are further covered with a gold layer. 19. If the circuit element according to item 13 of the patent application scope, wherein the crystal element grain size of the circuit element 10 is a diode grain. 20. If the circuit element according to item 13 of the patent scope application, the circuit element grain size is Electrocrystalline crystal grains. · 21. If the circuit element of the scope of patent application No. 13 is used, the grain of the circuit element is a capacitor grain. 15 22. If the circuit element of the scope of patent application No. 13 is, the circuit element Grain system is electric Die 23. The range of the circuit elements patent, Paragraph 13, wherein the circuit element comprises a die to die is active and passive circuit elements.