TW556261B - Buried discrete circuit components and fabricating method thereof - Google Patents

Abstract

A method of fabricating a buried discrete circuit component, its steps includes: (a) a plurality of matrix component grain face conductive circuits are formed on a first surface of a substrate, each grain face conductive circuits comprise electric independent a first conductive part and a second conductive part; (b) a plurality of matrix welding face conductive circuits are formed on a second surface which is corresponding the reverse side of the first surface of the substrate, each welding face conductive circuits comprise electric independent a first conductive part and a second conductive part, and the first conductive part and the second conductive part of the grain face conductive circuits electric connect to the first conductive part and the second conductive part of the welding face conductive circuits by using a Plated Through-Hole of a buried conductive material; (c) a component grain is placed on the first conductive part of grain conductive circuit of the first surface, and the first electrode of the grain electric connect to the first conductive part of the grain conductive circuits; (d) the second electrode of the component grain electric connect to the second conductive part of the grain conductive circuits; (e) using electric insulation material steam completely seal up all component grains and all conductive circuits on the first surface of the substrate; and (f) cutting the steam sealed substrate to dismember all component grains to get individual independent discrete circuit components.

Description

556261 V. Description of the invention (1) Scope of the invention The present invention relates generally to circuit components and methods of making the same. In particular, the present invention relates to a discrete circuit component suitable for automated mass production, suitable for use in electronic circuits, and a method for manufacturing the same. BACKGROUND OF THE INVENTION Active and passive circuit components such as diodes, transistors, resistors, and capacitors are widely used in electronic circuits. Circuit components. Whether it is a small signal (si gna j) or high power (p0Wer) application, linear (linear) or digital (d 1 g 1 ta 1) circuits need to be applied to these discrete discrete circuits. element. In addition to diodes, resistors and valleys integrated in integrated circuits, diodes in the form of discrete components are resistors and capacitors, which are electronic components that are used in large quantities. Due to the circuit components in the form of discrete components, they are used in a wide variety of electronic devices, and their unit price is not suitable for other active components such as transistors, so it is extremely suitable, or That is to say, there is a great need for mobilized mass production. From another point of view, if such a large number of low-priced units' cannot be automated and high-speed production, it will be difficult to have commercial competitiveness. There are various types of packaging for off-the-shelf circuit components, such as leade [package]. Based on miniaturization, for the purpose of SMT (surface-mount technology)

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Page 8 556261 V. Description of the invention (2) The type of discrete components has gradually become the electronic components required for miniaturized electronic devices. Therefore, high-speed mass production at low cost is such discrete circuit components. The direction in which it must be manufactured. However, the method of manufacturing such discrete circuit elements in the conventional technology still cannot completely separate the manual processing steps. For example, some types of discrete diode circuit components still rely on a high proportion of manual production steps. On the other hand, some discrete circuit component manufacturing methods that have been automated use process steps that include more than two drilling operations. Since the mechanical drilling action of the plate requires a certain operating time and positioning accuracy, the base and each two-electrode element usually need to be drilled at least twice, so it also forms a bottleneck in the overall process. Therefore, in the conventional technology, the process of using two or more drilled plates will inevitably require a longer process time and require more precise positioning accuracy operations. Both of these factors increase the unit manufacturing cost of the component. Therefore, the object of the present invention is to provide a buried-hole discrete circuit component and a method for manufacturing the component. The component structure can be suitable for SMD types, such as the EIA standard wafer size, and the manufacturing method can be suitable for low-cost Mass production. Summary of the Invention In order to achieve the foregoing object, the present invention also provides a method for manufacturing a buried-hole discrete circuit element, the steps of which include (a) forming a matrix of a plurality of element crystal faces on a first surface of a substrate to conduct electricity Circuit, each of the grain-plane conductive lines includes a first conductive segment and a second conductive segment that are electrically independent of each other; (b), correspondingly, the substrate is opposed to the first table

10125 twfl.ptd Page 9 556261 Number of joints on the conductive surface of the line complex moments 1 forming the top 3) Table February-the first and the second phase of the five-to-one first phase The electrically conductive surface has grains and crystals, each segment is connected, and the line segment is ^ ¾ ^ mj. The conductive surface is connected to the first welding segment and each electrical segment of this segment is electrically conductive. The ground junction is electrically connected and the electrical hole segment is penetrated. The second line of the first coating and the first line of the first line of the buried line are electrically connected to the second line of the conductive line and the second line is connected to the upper line of the first line. The first conductive particle will be crystallized in the crystal segment of the route, and the crystal grains of the first to the second crystal grains will be electrically connected to the first element of the conductive grain. ; even i i crystalline segment of t + d eleven pilot helmet of this electrode Hai a port of the electrically f - of the first plate-yl) ^ the (f bag and cover the whole road completely dense air conductive wire electrically with a water The quality of the material and the marginal grains of the amorphous element are slightly above the surface seal air and water are cut The scattered β rhyme singularity is made into S :. The mouth split grain crystal element should have some advantages. In the form of element, the element board contains the first element of a package, the quality, the object covers the element and the road Electric edge type isolated ionization hole and fml buried, see the second L seed grain and one crystal supply, and make it clear. The base of the hair board has the phase table mutuality. The electric conductance of the section line has two grains and one crystal on the two sides, and the elementary electric conductance has a first surface and a single surface. The conductive surface is covered with a bell. The first section includes the first section of the package. The conductive surface and the second surface of the conductive surface are connected to each other, and a segment is connected with electricity to form a conductive material. The first surface of the electrical surface and the second surface of the surface are second and second. This section of the crystal power will be electrically connected, the first quality of the electricity-the road buried in the line electricity, the via surface through welding and plating the plating and the second ground of the first electricity and the current. The first surface of the road line meter should be connected to the welding device and the grounded crystal electrical components. Electricity, the second connection, the first part of the electricity

10125 twf1.pt d Page 10 556261 V. Description of the invention (4) On the first conductive segment of the grain conductive circuit, the first electrode of the grain is electrically connected to the first conductive segment of the grain conductive circuit; And the second electrode of the grain is electrically connected to the second conductive segment of the grain conductive circuit. The electrically insulating material completely covers the element crystal grains and all conductive lines on the first surface of the substrate in a water-vapor-sealed manner. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Each of the drawings shows a buried-hole discrete circuit element according to the present invention, a method for making the preferred embodiment thereof, and a view of several selected process steps. These include various views such as an upper view, a cross-sectional view, and a perspective view, which respectively show the stepwise structure in each step of manufacturing the buried-hole discrete circuit element according to the present invention. The following explanatory text will cooperate with these selected stepwise steps to describe in detail a preferred embodiment of a method for manufacturing a buried-hole discrete circuit element according to the present invention. FIG. 1 is a plan view of a grain plane of a substrate of a buried-hole discrete circuit component according to a preferred embodiment of the present invention. As shown in the figure, the substrate 100, which typically has hundreds of discrete circuit elements arranged to support the entire matrix arrangement, has a plurality of discrete conductive circuit elements 111, 1 on the surface of the grain plane 110. 1 2,... And 1 1 6 etc. are arranged in, for example, a two-dimensional orthogonal matrix. With respect to the initial conductive line of the grain surface of FIG. 1, the substrate 100 is on the opposite surface of the grain surface 1 10 of FIG. 1, that is, the welding surface of the component, and there is a plurality of initial conductive lines 21 1 , 212, ..., 214, etc. are arranged in the corresponding matrix. Fig. 2 is a plan view of the soldering surface of the substrate of Fig. 1, and the initial conductive lines of a plurality of discrete circuit elements are arranged in a matrix on the surface. note

10125twfl.ptd Page 11 556261 V. Description of the invention (5) The substrate welding surface 2 1 to FIG. 2 is the substrate grain surface 1 1 0 of the substrate shown in FIG. This can correspond to the line 1 1 1 of the grain plane 1 1 0 in Figs. 1 and 2 corresponding to the line 2 1 1 of the welding plane 2 1 0, the line 1 1 2 and 2 1 2 correspond to, ... and 1 1 4 and 2 1 4 corresponds and is understood. In the initial conductive lines (including the grain plane and the soldered surface) of each discrete component, a through hole is formed at a position roughly at the center of the conductive line, and penetrates substantially the entire thickness of the substrate 100 vertically. For example, in the conductive lines 1 1 1 and the corresponding 2 1 1 in FIGS. 1 and 2, there is a through hole 1 3 1, and in the conductive lines 1 1 2 and the corresponding 2 1 2, there is a through hole 1. 3 2. The relative positional relationship between each through-hole and its corresponding conductive line on the grain surface and the soldering surface of the substrate is shown in Figs. Fig. 3 is a partial enlarged view of Fig. 1 ', showing details of the configuration of the initial conductive line of the substrate grain plane, and Fig. 4 is a cross-sectional view of the substrate of Figs. In Figs. 1, 2 and 3, each substantially rectangular area surrounded by a dashed line, as will be described later, represents the physical range of a discrete electronic component. For example, as shown in FIG. 3, the range indicated by the dashed line 1 2 1 is the physical range of a complete buried-hole discrete electronic component according to the present invention. Among them, approximately at the center of the range 1 2 1 ′ is indicated by the dashed area 1 5 1. The “not marked position” is the position where the element die will be positioned. It is noted that the asymmetric pattern of the conductive line on the substrate 100 grain surface 1 10 along the long axis (horizontal direction in the figure) shown in the plan view of FIG. 3. According to a preferred embodiment of the buried-hole discrete electronic component according to the present invention, its conductive line is shown in the individual footprint of a component of another component (C 0 m ρ ο n e n t

10125twfl.ptd Page 12 556261 V. Description of the invention (6)

Footprint) In the range 121, along the short axis direction (vertical direction in the figure), the conductive lines 1 1 1 and 1 1 2 are substantially symmetrical figures. In contrast, the lines 1 1 1 and 1 1 2 show a significant asymmetry along the long axis of the component footprint. In essence, the conductive lines 1 1 1 and 1 12 are two conductive patterns that are electrically independent of each other. Each of the conductive lines 1 1 1 and 1 1 2 has a conductive line segment extending toward the center of the element. One of the two conductive lines is oriented toward the center of the component, that is, the positioning of the component grains is extended, and the other conductive line does not extend to the center by a considerable amount so that the two do not contact each other and maintain an electrically open circuit state. In the embodiment shown in FIG. 3, the conductive line 1 1 1 on the right side is a conductive line extending more toward the center of the element. However, as can be understood by those skilled in the art, it is also feasible to arrange the conductive line on the left to reach the center of the component. The cross-sectional view of FIG. 4 shows that each through-hole is a plated through-hole (PTΗ). As shown in the figure, through the 孑 L131 and 132, a conductive metal layer can be formed on the transparent hole wall by using techniques such as duttering, electroplating, etc. to make printed circuit boards. This plated metal layer on the wall of the through hole can electrically connect the conductive lines on the grain surface of the substrate 100 and the soldering surface on the opposite side to each other. The substrate shown in Figs. 1 and 2 serves as the basis for the buried-hole discrete electronic component of the present invention. The substrate is an electrically insulating plate, which can be, for example, glass fiber reinforced resin (F R P), or can be made into a plate using an appropriate insulating material using a technology such as die casting (m ο 1 d i n g). Available later

10125twf1.ptd Page 13 556261 V. Description of the invention (7) The conductive lines on the grain surface and the welding surface are made by the technique of developing after-cut (p h 〇 t ο 1 i t h 〇 g r a p h y). Through-holes can be drilled through numerically-machined tools at the positions shown in Figure 3. Thereafter, as described above, a plating through-hole may be formed by a process such as sputtering and / or plating. After the plated through holes are formed, the substrate 100 shown in Figs. 1 and 2 can be obtained. Then, a conductive filling material can be buried in the plated through hole. In a preferred embodiment of the buried-hole discrete electronic component of the present invention, the conductive material filled in the plated through-holes embedded in the plates shown in FIGS. 1 and 2 is tin used in the manufacture of general circuit boards. Or tin alloy leads. The substrates shown in Figs. 3 and 4 are filled with a conductive material in the plated through holes. Using this substrate, as shown in FIG. 5, the crystal grains of the discrete circuit element can be set on the positioning 1 51 shown in FIG. The cross-sectional view of FIG. 5 shows that the crystal grain 5 1 1 of a discrete circuit element is set on the crystal grain surface 1 1 0 of the substrate 100. Moreover, the electrode ′ of each grain 5 1 1 is electrically connected to the conductive line 1 1 1 A on the grain surface 1 1 0 on the substrate 1 ◦ 0. The electrical connection between the die 5 1 1 and the conductive line 1 1 1 A can be used. For example, a pre-formed solder on the lower surface electrode of the die 5 1 1 is applied, such as infrared reflow (IRR ef 1 〇w). This is achieved by the technology of soldering the surface of the component (SMD). After the electrode on the lower surface of the circuit element die 5 1 1 and the conductive line 1 1 1 A on the die face are electrically and firmly bonded, the other end of the die 5 1 1 is the other electrode on the top. , You can use, for example, a jumper to connect with another conductive line 1 1 2 B on the substrate 100 grain surface 1 1 0 through the wire 5 3 1 and

10125 twfl. Ptd Page 14 556261 V. Description of the invention (8) Electrically bonding. When the structure shown in Figure 5 is completed, the electrodes of each element die are electrically connected to the corresponding soft soldering pins in their respective substrate ranges (the component ranges indicated by dashed lines in Figures 1, 2 and 3). on. At this time, the electrical structure has been constructed, but the discrete circuit components of each buried hole still arranged in the matrix can be sealed hermetically. The cross-sectional view of FIG. 6 shows a case where the crystal grains of the discrete circuit element of FIG. 5 are covered with a water-tight material 600. This sealing coating can be performed, for example, by die casting. Just use the mold to form a space with an appropriate height above the grain surface 1 10 of the substrate 100, and then use it. For example, injecting molten insulating material into the space, it can be easily made into a water-air seal. Install 6 0 0 to protect the grains 5 1 1, 5 ... It is noted that the choice of the water-air-tight insulating material 600 can be exactly the same as that used by the substrate 100 itself. Thereafter, the cross-sectional view of FIG. 7 shows that the substrate structure of FIG. 6 is cut into discrete discrete circuit elements. Note that the cut between two adjacent elements is essentially a cut made by aligning the symmetrical centerline of the buried hole between the two elements. As shown in the figure, cutting the component 7 1 1 in FIG. 7 requires cutting along the cutting lines 7 4 1 and 7 4 2. In addition, as can be understood, along the directions not shown in the figure, which are substantially perpendicular to the cutting lines 7 4 1 and 7 4 2, at least two cuttings must be performed to completely separate the component 7 1 1. The perspective views of Figs. 8 and 9 respectively show the electrode pin structure of the discrete discrete circuit element which has been manufactured and cut and separated. Since the cutting is performed through the symmetrical centerline of the buried hole as described above, the perspective view of FIG. 9 shows that

10125twfl.ptd Page 15 556261 V. Description of the invention (9) Two parts of each component are higher than the buried hole filling material on the substrate. During the soldering process of the present invention, in the initial stage of the manufacturing process of the substrate with buried vias of the present invention, the designated formation space is defined, and therefore, the crystal grains. In other words, it is possible to use as many pieces as possible, such as using two safe spaces in 0 6 0 3. Therefore, although the discrete electronic element has been described in the foregoing, the application is still widely possible with the discrete size of the discrete artisan. The bulk capacitors, either non-moving or integrated circuit electrodes, can have a conductive junction with a large enough area and a highly significant initial conductive line thickness, as shown in Figure 9 along the direction perpendicular to the substrate plane. The emergence of high discrete electronic components with various buried holes on the printed circuit board into the conductive interface can ensure good soldering quality. Although the hole-discrete circuit element 'uses a base formed with a plurality of elements that are used to construct the entire matrix, the through-holes are buried therein. Therefore, in each component area, since the entire component area does not need to be reserved for subsequent drilling processing, it can be fully used to carry the component. The minimum space that the component must occupy on the substrate is reduced. This special electrode is suitable for making micro-sized elements and even 0 4 0 2 components. In contrast, in the conventional drilling process, the component size cannot be reduced to the minimum as the buried hole disclosed in the present invention because the component size of the drilling must be kept. The descriptive text is a specific embodiment of the present invention which has been completed with various modifications, changes in construction, and equivalents. For example, although only the circuit elements are used to describe the present invention in the detailed description of the foregoing embodiments, as understood by those skilled in the art, under the SMT type, various diodes of the El A standard wafer, such as Zener, Schottky, etc., or Whether there is polarity, or discrete resistance, or even the main nature, but only the electronic components of the electrical connector are used.

10125 twfl.ptd Page 16 556261 V. Description of the Invention (ίο) are applicable to the manufacturing methods disclosed in the present invention. In addition, the present invention is not only applicable to the common SMT-type EIA standard chip sizes such as 1210, 1206, and 0805, but it is also particularly suitable for smaller SMT discrete circuit components. For another example, the conductive lines on the grain surface of the substrate may be cured silver paste, cured copper paste, or cured copper alloy paste. For another example, the conductive lines on the welding surface of the board may be further covered with a nickel layer or a gold layer. Therefore, the foregoing description should not be used to limit the present invention, and its scope should be defined in the text of the scope of section B of the attached patent application.

111U1

10125twfl.ptd Page 17 556261 The drawings briefly explain the foregoing objects and other features and advantages of the present invention. In the following description with reference to the attached drawings, detailed descriptions are given in conjunction with the description rather than limiting the preferred embodiments of the nature. After explanation, it will be easier to understand. Each of the drawings shows the discrete circuit components of the present invention. During the process steps of the manufacturing method of the preferred embodiment, the structural views of certain selected stages are shown in the drawings. FIG. 1 is a buried-hole discrete circuit of the present invention. A plan view of the grain surface of the substrate of a preferred embodiment of the device; FIG. 2 is a plan view of the soldering surface of the substrate of FIG. 1; FIG. 3 is a partial enlarged view of FIG. Fig. 4 is a cross-sectional view of the substrate of Figs. 1 and 2; Fig. 5 is a cross-sectional view of a discrete circuit element placed on a die surface of the substrate and forming an electrical connection of the element electrodes; The figure shows that the discrete circuit element of FIG. 5 is covered with a water-tight material, the cross-sectional view of FIG. 7 shows that the substrate structure of FIG. 6 is cut into discrete discrete circuit elements; and the perspective views of FIG. 8 and FIG. 9 respectively show that the manufacturing is completed The individual structure of discrete circuit components separated by cutting.

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Claims (1)

556261 VI. Scope of patent application 1. A method for manufacturing buried-hole discrete circuit elements, the steps include: (a) forming a matrix of a plurality of element grain plane conductive lines on a first surface of a substrate, each The grain-plane conductive lines each include a first conductive segment and a second conductive segment that are electrically independent of each other; (b) correspondingly forming a matrix complex number on a second surface of the substrate opposing the first surface Each of the welding surface conductive circuits each includes a first conductive segment and a second conductive segment which are electrically independent of each other, and the first and second conductive segments of the grain surface conductive circuit The segments are electrically connected to the first and second conductive segments of the conductive line of the welding surface with embedded conductive through-holes through the plated through holes. (C) Grain conductive lines on the first surface. A component die is placed on the first conductive segment, and the first electrode of the die is electrically connected to the first conductive segment of the conductive circuit of the die; (d) the second electrode of the component die is electrically connected; To the die The second conductive segment of the conductive line; (e) completely sealing the element crystal grains and all conductive lines on the first surface of the substrate with an electrically insulating material water-tightly; and (f) cutting the coated water The substrate is hermetically sealed to separate all the element dies into individual discrete electronic components. 2. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified silver paste. 3. Buried via discrete circuit components as described in item 1 of the patent application 10125twf1.ptd Page 19 556261 VI. Manufacturing method of patent application scope ', wherein the conductive lines on the grain surface of the substrate are solidified copper paste. 4. The method for manufacturing a buried-hole discrete circuit component as described in item 1 of the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified copper alloy paste. 5. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of the patent application, wherein the conductive lines on the soldering surface of the substrate are further covered with a recording layer. 6. The manufacturing method of the buried-hole discrete circuit element according to item 1 of the scope of patent application, wherein the conductive lines on the soldering surface of the substrate are further covered with a gold layer. 7. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of the patent application, wherein the crystal element of the circuit element is a diode crystal. 8. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of patent application, wherein the crystal element of the circuit element is a transistor crystal. 9. According to the method for manufacturing a buried-hole discrete circuit element described in item 1 of the scope of the patent application, the crystal element of the circuit element is a capacitor crystal. 10. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of patent application, wherein the crystal grain of the circuit element is a resistive crystal grain. 11. The method for manufacturing a buried-hole discrete circuit element as described in item 1 of the scope of the patent application, wherein the circuit element die is a die that includes active and passive circuit components. 12. A method for manufacturing a buried-hole discrete circuit element, the steps include: 10125twfl.ptd Page 20 556261 6. Scope of patent application (a) Form a matrix of multiple element grain plane conductive circuits on the first surface of a substrate, each of these grain plane conductive circuits contains electrical properties A first conductive segment and a second conductive segment that are independent of each other; (b) correspondingly forming a matrix of a plurality of bonding surface conductive lines on a second surface of the substrate opposing the first surface, each of which is soldered Each of the surface conductive circuits includes a first conductive segment and a second conductive segment that are electrically independent of each other, and the first and second conductive segments of the grain surface conductive circuit are electrically connected to the welding surface conductive circuit, respectively. The first and second conductive segments are electrically connected; (c) a component die is placed on the first conductive segment of the grain conductive circuit on the first surface, and the first electrode of the die is electrically connected Ground is connected to the first conductive segment of the grain conductive line; (d) the second electrode of the element die is electrically connected to the second conductive segment of the grain conductive line; (e) is electrically insulated Substance water completely and air-tightly covers the base All the plurality of conductive traces and die member, and the substrate (f) cutting the sealed surface of the water vapor of the first, to all of the plurality of elements of the crystal grains is divided into an independent individual discrete electronic components. 13. The method for manufacturing a buried-hole discrete circuit element as described in item 12 of the scope of the patent application, wherein the first and second conductive sections of the grain plane conductive line are plated through-holes with a conductive material embedded therein. Electrically and electrically connected to the first and second conductive sections of the conductive line of the welding surface, respectively. 14. A buried-hole discrete circuit component comprising: a substrate having a component grain plane conductive line formed on a first surface thereof 10125twfl.ptd Page 21 556261 VI. Patent Application Road, which includes a first conductive segment and a second conductive segment that are electrically independent of each other; it opposes the formation of a welding surface on the second surface of the first surface A conductive circuit including a first conductive segment and a second conductive segment that are electrically independent of each other; a first plated through-hole, a conductive substance is embedded, and the first conductive surface of the grain plane conductive circuit The second conductive segment is electrically connected to the first conductive segment of the conductive line of the welding surface; and a second plated through hole is embedded with a conductive substance, and the second conductive segment of the grain surface conductive line is electrically connected Ground is electrically connected to the second conductive segment of the conductive line of the welding surface; a component grain is placed on the first conductive segment of the grain conductive line on the first surface, and the first electrode of the grain is electrically Ground is connected to the first conductive segment of the grain conductive line; and the second electrode of the grain is electrically connected to the second conductive segment of the grain conductive line; and an electrically insulating substance, water-tightly Completely covering the first surface of the substrate These devices all of the conductive lines and die. 15. The buried-hole discrete circuit element as described in item 14 of the scope of patent application, wherein the conductive lines on the grain surface of the substrate are solidified paste-like silver glue. 16. The buried-hole discrete circuit element according to item 14 of the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified copper paste. 17. The buried-hole discrete circuit element according to item 14 of the scope of the patent application, wherein the conductive lines on the grain surface of the substrate are solidified paste-like copper alloy glue. 18. Buried-hole discrete circuit elements as described in item 14 of the scope of patent application 10125twf1.ptd Page 22 556261 6. The scope of patent application, in which the conductive lines on the soldering surface of the substrate are further covered with a nickel layer. 19. The buried-hole discrete circuit element according to item 14 of the scope of patent application, wherein the conductive lines on the soldering surface of the substrate are further covered with a gold layer. 2 0. The buried-hole discrete circuit element as described in item 14 of the scope of patent application, wherein the crystal element of the circuit element is a diode crystal. 2 1. The buried-hole discrete circuit element as described in item 14 of the scope of patent application, wherein the crystal element of the circuit element is a transistor crystal. 22. The buried-hole discrete circuit element according to item 14 of the scope of patent application, wherein the crystal element of the circuit element is a capacitor crystal. 2 3. The buried-hole discrete circuit element according to item 14 of the scope of patent application, wherein the crystal element of the circuit element is a resistor crystal. 24. The buried-hole discrete circuit element as described in item 14 of the scope of patent application, wherein the die of the circuit element is a die including active and passive circuit components. 10125twfl.ptd Page 23