TWI223429B - Semiconductor integrated circuit - Google Patents

Abstract

An unsuitable element in a functional black 11 can be substituted by a spare element if a spare element group black 12, each of the functional blocks 11 is respectively arranged on the surrounding of the spare element group block 12.

Description

1223429 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a semiconductor integrated circuit, and more particularly to a semiconductor integrated circuit having a spare element that can be used in place of the element originally used. [Prior art] Generally, in a semiconductor integrated circuit, a redundant circuit is prepared in order to substitute a circuit or a component having a poor quality generated in the manufacturing process. Also, if the circuit is made wrong, substitute components must be prepared to correct the wrong part of the circuit. A typical example of a redundant circuit is a redundant circuit of a semiconductor memory. Among the conditions of semiconductor memory, the most bad ones occur in memory cells. Therefore, the unit is prepared by using word lines or bit lines. Long memory cells. The redundant circuit is the same as the regular circuit, and is connected by a fuse (f u s e). Therefore, it is necessary to cut off the fusible link connected to the defective circuit at the stage where the defect occurs. In this way, the redundant circuit used so far will replace the defective circuit and become usable. In addition, in the case of using spare components such as transistors, resistors, and capacitors, since the spare components themselves are already installed in the semiconductor integrated circuit, wiring connections are not required. However, if the manufactured semiconductor integrated circuit components are not suitable, the method is to 'use a mask, etc.' on a spare component intended to replace the unsuitable component, and additionally use metal wiring to replace the function. The spare components used so far can be used. -6- 1223429 In recent years, semiconductor integrated circuits, which are representative of the system L S I (large-scale integrated circuit), are often constructed by mounting a plurality of functional blocks on a single chip. In this case, the conventional semiconductor integrated circuit, as a replacement component, is mounted in a dead space (hereinafter referred to as a dead space) formed between the functional blocks. FIG. 1 is a plan view showing a configuration pattern of a conventional semiconductor integrated circuit. As shown in FIG. 1, the semiconductor wafer 40 includes a plurality of work blocks 4 1, 4 b 1, 4 1 -2, ... 4 1 -7) and the like. When a plurality of functional blocks 41 are mounted on one semiconductor wafer 40, since the size and shape of each functional block 41 are different, a method is created between each functional block 41 Components, also used as dead angles 42-1 and 42-2 for wiring. In conventional technology, spare parts that are not frequently used are usually mounted on such dead corners in order to effectively utilize the area of the semiconductor chip 40. For example, in the first figure, a capacitor 43 and a resistor 44 are disposed at the dead corner 4 2-1, and an NMOS transistor 45, a PMOS transistor 46, a NOT 47, and 47 are disposed at the dead corner 42-2. NAND smells 48, etc. However, these dead angles 4 2-1 and 4 2-2 are the products caused by the configuration of the functional blocks 4 1, so it is difficult to limit the distance between them and which functional block is the closest. For example, The function blocks 4 1-7 are far away from the p M 0S transistor 4 6. Further, the dead angles 42-1 and 42-2 mostly occur in a narrow area around the plurality of function blocks 41. Therefore, if a spare component is mounted at the dead corner 42-1 and 42-2, the component used in a certain functional block 41 must be additionally wired to the spare element 1223429 to replace it. The wiring itself It is very difficult, even if it is barely wiring, but because its wiring length is very long, it is also problematic. In particular, if the wiring length is too long in the case of an analog circuit, the noise generated is also large, and as a result, the undesirable performance of the machine is lowered. The purpose of the present invention is to provide an abundance conductive volume circuit in order to solve the above-mentioned problems. The simplest way is to replace the components originally used in a certain functional block with a spare component and replace them. The wiring to the spare component can also be the shortest.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems of the present invention, the following configuration is adopted. That is, the semiconductor integrated circuit according to the present invention is a semiconductor integrated circuit having more than one functional block < fia na) block), which are clustered by a PJ circuit, and has a spare. The component block is provided with a spare component, which can substitute the components in the functional block, and the functional block is arranged around the spare component block.

Here, if the functional block is composed of, for example, a semiconductor of a high-frequency wireless circuit, such as a tuner section or an inter face, the functional block is arranged around a spare element block provided with a spare element. Since the function block is arranged around the spare component block, the wiring distance from a certain functional block to the spare component is the shortest. Therefore, except when the component in a certain function block is unsuitable, the simplest method can be used for the spare component. In addition to wiring, at the same time, the length of the wiring toward the spare component can be shortened. In the above-mentioned semiconductor integrated circuit, the functional block is arranged around the spare element block around the spare element block. -8- 1223429 By this means, the wiring from any functional block to the spare element can be implemented early and shorten the wiring length to the wiring element. Furthermore, in the above-mentioned semiconductor integrated circuit, the functional block has a power rail for supplying a power voltage of the functional block; and a ground rail for setting a reference voltage in the functional block, so the spare component block can be configured in: The position from the power rail to the ground rail in the function block is located outside the area between the two. Accordingly, since the area from the power rail to the ground rail is not enlarged, the size of the entire circuit can be suppressed. Further, in the semiconductor integrated circuit, the spare element block may be arranged in parallel with the functional block and formed into an elongated configuration. According to this, the spare component unit can be space-savingly arranged on the central portion of the semiconductor volume circuit. In the above-mentioned semiconductor integrated circuit, the spare element can be constructed as a structure connected to the uppermost wiring layer of the plurality of wiring layers. According to this, if there is an unsuitable semiconductor element, only the mask of the uppermost wiring layer is changed, and the replacement of the spare element can be performed instead of changing the mask of each snake layer from top to bottom. Part of the operation time and cost can be greatly reduced. [Brief Description of the Drawings] The present invention will be more apparent with the following description of the drawings, in which: FIG. 1 is a plan view showing the structure of a conventional semiconductor integrated circuit. Fig. 2 is a plan view showing a configuration pattern of an embodiment of a semiconductor integrated circuit of the present invention. -9- 1223429 Figure 3 is an enlarged view of the dotted line in Figure 2. Fig. 4 is a plan view showing a constitution pattern of another embodiment of a semiconductor integrated circuit of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 2 is a plan view showing a configuration pattern of an embodiment of a semiconductor integrated circuit of the present invention.

As shown in FIG. 2, the semiconductor wafer 10 is composed of a plurality of functional blocks 丨 丨 (丨 丨 _ j, 1 1-2 5 ... 1 1-7); and a spare element group block 1 2; In order to realize a functional circuit, it is integrated according to the MOS structure or the bipolar structure.

The function referred to here refers to the functional unit that can be divided into certain smaller units by one semiconductor wafer 10 to achieve the entire processing. The processing content or the number of divisions depends on the use of the semiconductor wafer 10 But different. For example, if the semiconductor integrated circuit implements a high-frequency hand line circuit, it can be divided into a functional unit 11 including a radio frequency tuner section, an intermediate frequency processing section, and a face section. The chip may include a base band signal processing unit. On these functional blocks 11, the metal wiring is completed through the masking process through the diffusion process, and the wiring of the above circuit is completed. In the semiconductor integrated circuit of this embodiment, in addition to a plurality of functional blocks 11, a spare element block is set as a spare for a functional block having a higher possibility of replacement in the future, so it is at the center of the semiconductor wafer 10 A spare element group block 12 composed of a plurality of spare elements is arranged, and accordingly, the position of the spare element group unit block 12 is closest to the function block. -10- 1223429 In addition, if the components in the function block 11 are not suitable, use metal or other cables to replace the unsuitable components with the spare components in the spare component group 12. Furthermore, if the semiconductor integrated circuit of this embodiment has a multilayer structure, changing the mask of the uppermost layer can replace the spare component with a functional block that is not suitable for the situation. In other words, if the semiconductor integrated circuit has a five-layer structure with three VIA (through-hole) layers and two wiring layers, a spare element group 12 is arranged in the lowermost layer in advance. Therefore, VIA and metal wiring are used to connect the spare element to the uppermost layer. Therefore, if an unsuitable semiconductor element occurs, only the mask at the uppermost position can be changed, and the spare element can be used instead. There is no need to change the mask from the top to the bottom position, so the operation time and cost of this part can be greatly reduced. According to this, since the function block 11 is arranged around the spare element group block 12 as the center, the function block 11 can be replaced with the spare element at the nearest position. That is, the wiring length between the function block 11 to the spare element 12 can be shortened. The spare component group 12 shown in Fig. 2 is configured with capacitors 1 2-1, resistance 12-2, NMOS transistor 12-3, PMOS transistor 12-4, NOT gate 12-5, and N AND gate. 12-6 and so on. In addition, the spare components shown in Fig. 2 are just examples, and they are not restricted. In addition, the above-mentioned spare component is a substitute component used to modify the circuit so that it can be used when an unsuitable condition occurs in the integrated circuit in the functional block. Therefore, what kind of spare component group 12 is provided? Components, how many components, etc., are different according to the 1223429 circuit content of the function block 1 1 arranged around the spare component group block 12. However, if a spare component with a high probability of being used in the future is known in advance, the spare component can be placed closest to the corresponding functional block.

As described above, in the conventional semiconductor integrated circuit, the spare components are arranged on the dead corners 4 2-1 and 4 2-2 formed between the functional blocks. Then, for example, when the function blocks 4 1-5 need resistance 4 4 and the function blocks 4 1-7 need PM 0 S transistor 4 6 and other conditions, the spare components must be wired for replacement functions. Because of the existence of other functional blocks 41 such as functional blocks 4 1-6, the wiring is hindered, so this kind of wiring itself is extremely difficult. In addition, if the wiring itself bypasses the other functional blocks and becomes a circuitous shape, the length of the wiring will be greatly increased. In this regard, according to the semiconductor integrated circuit of this embodiment, a spare element group block 12 having necessary spare elements is arranged at the center of a semiconductor wafer 10 having each functional block 11, for example, the functional block 1 1-1 and function block 1 1-7 When components are not suitable, you can use the wiring method to use the spare component group 12 in place of the replacement component, which is not suitable for the functional block and the replacement component to be replaced. For simplicity, and the wiring length is very short.

Moreover, in the semiconductor integrated circuit of this embodiment, the spare element group block 12 is only configured with a spare component. For the conventional semiconductor integrated circuit, the spare component is arranged in a dead space. The number of spare components is naturally high. FIG. 3 is an enlarged view of a dotted line in FIG. 2. As shown in Fig. 3, each function block (function blocks 1 1-2, 1 1-3, and 1 1-4 in Fig. 3) is provided at: a power supply (VCC) for supplying a power supply voltage to the function block 11 ) Rail 20; and ground (GND) rail 21 for setting the reference voltage in each function; -12-1242929. Therefore, the spare element group block 12 is located adjacent to (outside) the ground rail 21, that is, the spare element group block 12 is not located on the power rail 20 and the ground rail 2 1 of the function block. The area a between them is in area b outside it. In addition, the power rail 2 0 and the ground rail 21 are also located on the two sides of the other function blocks 1 1-1, 1 1-4, 1 1-5, 1 6 and 1 1-7, but the third Not shown in the figure. In Fig. 3, the spare element group block 12 is arranged outside the ground rail 21, and according to the structure of the function block n, a power supply rail 20 is arranged on its side.

For example, 'spare component block 12 is located in area b. However, when the spare component group block 12 is provided in the area a between the power rail 20 and the ground rail 21, the power rail 20 and the ground can be reduced. The distance (area) of the rails can reduce the area of the entire semiconductor wafer 10.

Above, if the semiconductor integrated circuit according to this embodiment has any unsuitable conditions for the used components in a certain functional block, it can be simply wired to the spare component, and the length of the wiring towards the spare component It is also very short, which can minimize the degradation of machine performance (especially noise). In addition, since these spare element group blocks 12 are arranged in the center and the functional blocks 11 are arranged around them, although the size of the semiconductor wafer 10 is slightly increased, this structure can be greatly reduced compared with those of conventional users. In terms of saving operating time and costs, its advantages outweigh its disadvantages and are fully compensated. In addition, the semiconductor integrated circuit of the embodiment described above is merely an illustrative example for implementing the present invention, and various other modifications and changes are possible without departing from the spirit of the present invention. For example, FIG. 4 is a plan view showing the structure of the semiconductor integrated circuit -13-1223429 of another embodiment. The semiconductor wafer 3 0 shown in FIG. 4 is the same as the semiconductor wafer 10 shown in FIG. 2. The functional blocks 11-11) are arranged around the spare element group 31. The difference from the semiconductor wafer 10 shown in FIG. 2 is that the spare element group block 31 is arranged parallel to the functional block 11 and its structure is slender. also'

The spare element group block 31 shown in FIG. 4 is configured by arranging each spare element one by one in a row or a row. If the shape of the block is elongated, there is no limitation on the arrangement of the spare element. If it is, if the spare element block 31 is made slender, the spare element block 31 can be arranged in the center of the semiconductor wafer 30 in a space-saving manner, so that the area of the semiconductor wafer 30 can be reduced. In addition, the spare element cluster 31 has a reduced area due to its slender shape; therefore, the number of spare elements arranged thereon is naturally small, and the area of the entire semiconductor wafer 30 becomes smaller.

From the above, it is known that the semiconductor integrated circuit according to the present invention has a spare element block 'when the elements in the functional block are not suitable. It can be replaced by a spare component. Because the functional block is arranged around the spare component block, if there is an unsuitable condition for a component in a functional block, wiring to the substitute spare component can be performed in a very simple way to perform its function. , And the length of the wiring is very short. Description of Representative Symbols of Main Parts 10 Semiconductor Wafer 11 Function Block 12 Spare Component Block -14-Power Rail Ground Rail Semiconductor Wafer Spare Component Block Semiconductor Wafer Functional Block Dead End Capacitor

NMOS transistor PMOS transistor NOT NAND gate

-15-

Claims (1)

1223429 Scope of patent application: 1 · A semiconductor integrated circuit with more than one functional block that can be used to achieve a predetermined function. It is characterized in that the semiconductor integrated circuit has a spare component block, which is provided with Substitute spare parts for the components in the functional block; and the functional block is arranged around the spare component block. 2 · Semiconductor integrated circuits such as the one in the scope of patent application, where The functional block is arranged around the spare component block with the spare component block as a center. 3. The semiconductor integrated circuit according to item 丨 of the patent application scope, wherein the functional block has a power rail for supplying a power voltage to the functional block and a ground rail for setting a reference voltage in the functional block; It is characterized in that the spare element block is arranged at a position outside the area from the power rail to the ground rail where the functional block is arranged. 4 · If the semiconductor integrated circuit of item 1 of the patent application scope, wherein The spare element is arranged in parallel with the functional block and is formed in a slender manner. 5 ′% The semiconductor integrated circuit of the scope of application for patent item i, wherein the spare element is connected to the uppermost wiring layer of the plurality of wiring layers. -16-