1221436 玖、發明說明 (發明辨明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明） 【發明所屬之技術領域3 發明所屬之技術領域 该發明係有關於一種板材研磨裝置’主要係層板之板 材研磨裝置，特別係有關於一種板材研磨裝置，其係於製 5 作層板時，研磨構成層板之中心層（芯層）之板材表面者。 習知技術 房屋之建築材料（諸如地板材料），係使用層板’該層 板係由原木取出薄且寬之板材，並將多數片該等板材朝斜 10 紋方向與相對於該斜紋方向之直角方向交互地重疊黏著者 。如此之層板，強度優良，不僅可使用於房屋之建築材料 ，亦可使用於家具等，通常，如第19圖所示’係由五層結 構形成，該五層結構係於中心設置有薄板材W5 ’並於上 下設置有構成中心層之板材W4、W3，且於表面與内面分 15別設置有板材W2、W1。當然，亦有三層結構，係於中心 層使用一片板材，並於其表面與内面設置有板材以夾持該 中心層之板材者。此時，表面之板材W1與内面之板材W2 ，由於容易看見，因此，多使用較優良且漂亮之材料，而 構成中心層之板材W4、W5則通常不論材質好壞。如此之 2〇中心層之板材W4、W5，多為由原木取出就使用之薄板材 ，厚度皆不一定均等。又，表面及内面之板材Wl、W2之 材質需良好且薄。 發明欲解決之課題 如前述，層板係將多數片之薄板材交互地積層而製 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 〆 6 1221436 發明說明®Μ 玖、發明說明 5 作，且最終地將表面及内面以砂磨機等研磨加工成預定厚 度。然而，由於中心層之板材W4、W3多不均等，故，為 了使尺寸一致而過度研磨，如第18圖所示研磨成規定尺寸 時，削磨表面與内面之板材W1會使内部中心層之板材W3 露出。因如此地研磨而使中心層露出時，不僅無法加工成 規定厚度尺寸，且，具有露出部分之層板成為不良品，如 此不良品之發生率高時，亦會使品質受到不良影響且提高 生產成本。 【發明内容】 10 該發明之目的係提供一種板材研磨裝置及板材之研磨 方法，其係為了對應處理前述課題而形成，即使研磨加工 表面與内面，中心層亦不會露出，又，可製作厚度正確且 品質穩定優良之層板。 解決課題之手段 ί 15 為了解決前述課題，如第1態樣之發明，板材研磨裝 置包含有工作台、板材上部運送機構、板材研磨機構，前 述工作台係於台座架，具有板材之下部運送機構與板材吸 附機構，前述板材研磨機構則具有以一定間隔形成有大直 徑旋轉部與小直徑旋轉部之研磨頭。 20 又，如第2態樣之發明，板材研磨裝置包含有工作台 、板材上部運送機構、與板材研磨機構，前述工作台係於 台座架，具有板材之下部運送機構與板材吸附機構者，前 述板材研磨機構則將以一定間隔形成有大直徑旋轉部與小 直徑旋轉部之2個研磨頭於相對於運送板材方向之直角方 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 1221436 玖、發明說明 發明說明續裒 向上，使大直徑之旋轉部相對地錯開1間距而配置者。 又’如第3態樣之發明，係於如前述第i或2態樣之 前述研磨頭之大直徑旋轉部表面黏著有硬質研磨材。 又’如第4態樣之發明，係於如前述第i或2態樣之 5板材研磨裝置，更設置有一升降裝置，該升降褒置係用以 按照板材之加工厚度使工作台升降者。 進而，如第5態樣之發明，係於如前述第i或2態樣 之板材研磨裝置，更設置有一藉一集塵罩集塵之集塵裝置 〇 10 又’如第6態樣之發明，係一面運送板材，一面藉具 有以一定間隔形成有大直徑旋轉部與小直徑旋轉部之研磨 頭之研磨機構，一定間隔地研磨板材表面，接著研磨剩餘 之未加工部分。 又，如第7態樣之發明，板材之研磨方法，係一面運 15 送板材’ 一面利用將以一定間隔形成有大直徑旋轉部與小 直徑旋轉部之2個研磨頭於相對於運送方向之直角方向上 ，使大直徑之旋轉部相對地錯開1間距而配置之板材研磨 機構，首先藉第1研磨頭一定間隔地將板材表面研磨成條 紋狀，接著，藉第2研磨頭研磨剩餘之未加工部分。 20 【實施方式】 發明之實施形態 以下，針對該發明具體實施形態，一面參照圖示一面 作說明。第1圖係該發明之板材研磨裝置之俯視圖，第2 圖係側視圖，第3圖係正視圖。該板材研磨裝置係將由原 E續次頁（發明說明頁不敷使用時，請註記並使用續頁） 1221436 玫、發明__ |發萌說明續頁 圖係側視圖，第3圖係正視圖。該板材研磨裝置係將由原 木切下取出之薄板材研磨成一定厚度之裝置，且主要由台 座架1、與具有結合該台座架1之板材之下部運送機構2 與板材吸附機構3的工作台4、板材上部運送機構5、板材 5 研磨機構6,6、升降裝置7、集塵裝置8,8等構成。接著， 針對該等各機構之結構詳細地說明。 第4圖係顯示前述板材之下部運送機構2詳細部分之 圖，第5圖則係第4圖之P箭頭方向之觀看圖。該下部運 送機構2係由驅動輥21、馬達22、鏈輪24、鏈輪26、與 10 鏈27構成，前述馬達（此時，係齒輪電動機）22係旋轉驅動 該驅動輥21，前述鏈輪24係已固定於驅動輥21之旋轉軸 23，該鏈輪26則已固定於齒輪電動機22之旋轉軸25，且 前述鏈27係繞捲安裝於該等鏈輪。如此一來，已繞捲安裝 於驅動輥21之運輸帶9，係於設置於工作台4另一方端部 15 之鬆緊輥28(參照第2圖）間於無止盡狀態下搬送，以運送 板材。此外，繞捲安裝運輸帶9之驅動輥21與鬆緊輥28 ，係軸支於工作台4而可自由旋轉者。 接著，針對板材吸附機構3作說明。第6圖係具有板 材吸附機構3之前述運輸帶9與工作台4之運送板材機構 20 部份之俯視圖，第7圖係第6圖之R箭頭方向之側視圖。 運輸帶9係寬度較寬之帶，且表面穿設有無數小孔 9a，9a,9a · ·。該孑L 9a，9a，· ·，如後述，係用以使工作台 4内部，以板材吸附用鼓風機10及通氣管（排氣管）31,31吸 引時之板材密接之孔。於工作台4，於兩側面設置有用以 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 1221436 软、發明說明 吸引空氣之設備32,32。該設備32,32,係使板材密接於運 輸帶9,且連接用以吸引因加工而產生之粉塵之前述通氣 管（排氣管）31，31，以藉板材吸附用鼓風機10吸引工作台4 及運輸帶9内部空間之空氣。如此一來，板材係一面密接 運輸帶9，一面藉後述上部運送機構5搬送，而藉研磨頭 61，62研磨力口工。 第8圖係顯示接觸板材上面且搬送該板材之上部運送 機構5與研磨機構6、6之詳細部分之俯視圖，第9圖係第 8圖之S箭頭方向之觀看圖。 ίο 15 滎明說明續;^ 該上部運送機構5，係以帶驅動輥51、馬達52、上部 運送快輥53,53、上部運送托輥54、運輸帶55,55, · ·構 成，前述帶驅動輥51係已架設於工作台4之大略中央，該 馬達52則驅動該帶驅動輥51，前述運輸帶55,55, · ·係繞 捲安裝於帶驅動輥51與該等前後之上部運送快輥53,53及 上部運送托輥54。於前述帶驅動輥51，繞捲安裝多數運輸 帶55,55，· ·，且劃分為繞捲安裝於前部之上部運送快輥 53,53與上部運送托輥54以搬送板材之帶群，與繞捲安裝 於後部之上部運送快輥53,53與上部運送托輥54以搬送板 材之帶群，進行板材搬送。 第10圖係顯示板材研磨機構6之第1研磨頭之結構之 正視圖，第11圖係顯示該板材研磨裝置6之第2研磨頭之 結構之正視圖。該板材研磨機構係由第1研磨頭61、用以 旋轉驅動該第1研磨頭61之滑輪63、軸支該第1研磨頭 61之軸部65,65之軸承67,67、及第2研磨頭62、用以旋 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 10 20 1221436 玖、發明說明 ::；·. - ；' , ·λ；：· …·. 轉驅動該第2研磨頭62之滑輪64、軸支該第 之軸部66,66之轴承68,68等構成。此外，如第12圖及第 發明說明_圓 2研磨頭62 13圖所示’該等第！研磨頭61之滑輪63 ’與第2研磨頭 62之滑輪64，係由已繞捲安裝於i個驅動馬達69之滑輪 60之帶分隔為2個輪群而同時地驅動。 ίο 15 如第10圖及第11圖所示，於前述第1研磨頭61，係 以一定間隔之大直徑旋轉部61a，61a，· ·，與一定間隔之 小直控旋轉部（溝）61b，61b，· ·形成，於大直徑旋轉部61& 表面，黏著有板材研磨用之研磨材，例如金剛石粒或陶瓷 粒。又，小直徑旋轉部61b之空間，即，大直徑旋轉部 61a與大直徑旋轉部61a間之溝空間，則成為前述上部運 送機構5之運輸帶55佔有之空間。又，第2研磨頭62亦 以大直徑疋轉部62a，62a，· ·，與小直徑旋轉部（溝 )62b，62b，· ·形成，並於大直徑旋轉部6ia表面，黏著有 板材研磨用之硬質紙石粒，例如金剛石粒，且與第1研磨 頭61相同，小直徑旋轉部62b之空間成為前述上部運送機 構5之運輸帶55,55 · ·佔有之溝空間。此外，前述第！研 磨頭61及第2研磨頭62之大直徑旋轉部61 a，62a，可以紙 石形成，亦可以硬質之鐵材製作，並於表面形成有多數粗 糙突起。 i ( 接著’於刖述結構之板材研磨機構6之第1研磨頭61 ，與第2研磨頭62中，大直徑旋轉部61a與大直徑旋轉部 62a之運送方向之位置係於相對於運送方向之直角方向錯 開1間距。即，如第10圖及第11圖所示，於第i研磨頭 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 11 20 1221436 玖、發明賴明 5 10 61之大直徑旋轉部61a之運送方向之位置，位有第2研磨 頭62之小直徑旋轉部62b，於小直徑旋轉部61b之運送方 向之位置，則位有第2研磨頭62之大直徑旋轉部62a。該 原因如後述，研磨寬板之板材表面時，以1根研磨頭一次 地研磨時，研磨負荷增大，其研磨抵抗亦增大而不易研磨 ，然而，區分為二進行研磨時，研磨抵抗亦減小而可圓滑 地研磨。即，可以第1研磨頭61之大直徑旋轉部61a，61a， ••將板材表面研磨成條紋狀，並以第2研磨頭62之大直 徑旋轉部62a，62a· ·，毫無剩餘地研磨剩餘板材之未研磨 部分。 15 發明說明__ 第14圖係於架1兩側面設置有工作台4之升降裝置7 之狀態之側視圖。前述工作台4係結合有前述下部運送機 構2與板材吸附機構3等，並藉該升降裝置7，依研磨之 板材厚度進行升降。該升降裝置7係由設置於台座架1兩 侧下部之起重器71，71(相反側不圖示），與驅動該起重器71 之驅動機構構成，而該驅動機構係由鏈輪72,73，與繞捲安 裝於該鏈輪72,73之鏈74，及驅動該等鏈輪72,73 —者之 馬達（圖示省略）構成，以使前述工作台上下，然而，起重 器71之驅動機構不限此等，亦可使用齒輪或滾筒等。又， 亦可不特別設置升降裝置，而藉螺旋機構使工作台4整體 上下。 接著，針對集塵裝置作說明。如第1圖乃至第3圖及 第15圖、第16圖所示，於該板材研磨裝置設置有集塵裝 置8。該集塵裝置8係以分別包覆構成研磨機構6之第1 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 12 20 1221436 發賴說明 玖、發明說明 5 研磨頭61及第2研磨頭62全體之集塵罩81，81、已設置於 兩侧之架83,83、及已架設固定於該架間之安裝設備82,82 構成。且於前述各集塵罩81設置連接集塵機及通氣管之圓 筒狀之連接設備8 la，81a。如此，藉第1研磨頭61及第2 研磨頭62研磨之板材之切屑可藉集塵機及通氣管排出。 該板材研磨裝置係由如以上結構構成，且主要係為了 研磨層板製作時之成為中心層之板材而使用，接著，針對 其研磨加工作說明。第17圖係顯示板材研磨製程之圖。將 構成層板中心層之板材W，投入該板材研磨裝置時，藉板 10 材之下部運送機構2與板材上部運送機構5搬送。此時， 板材W —面藉以板材吸附機構3進行吸附之運輸帶9吸附 ，一面搬送。然後，藉第1研磨頭61，首先，以一定間隔 ，以大直徑旋轉部61a，61a，· ·之間隔研磨研磨部1221436 发明 Description of the invention (identification of the invention should be stated: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings are briefly explained) [Technical field to which the invention belongs 3 Technical field to which the invention belongs The invention relates to a plate The “grinding device” mainly refers to a plate polishing device for a laminated plate, and in particular relates to a plate grinding device that grinds the surface of the plate forming the center layer (core layer) of the laminated plate when it is used as a laminated plate. The building materials (such as flooring materials) of the conventional technology houses use laminates. The laminates are thin and wide boards taken from logs, and most of the boards are oriented in a diagonal direction and opposite to the direction of the diagonal line. Right angles alternately overlap the adherers. Such a laminate is excellent in strength, and can be used not only as a building material for houses, but also in furniture. Usually, as shown in FIG. 19, 'is formed of a five-layer structure, and the five-layer structure is provided with a thin center. The plate W5 ′ is provided with plates W4 and W3 constituting a central layer above and below, and plates W2 and W1 are respectively provided on the surface and the inner surface 15. Of course, there is also a three-layer structure, which uses a plate on the center layer, and has a plate on its surface and inner surface to clamp the plate on the center layer. At this time, because the surface plate W1 and the inner plate W2 are easy to see, more and more beautiful and beautiful materials are used, and the plates W4 and W5 constituting the center layer usually do not matter the quality of the materials. In this way, the boards W4 and W5 of the 20 center layer are mostly thin boards used for taking out logs, and their thicknesses are not necessarily equal. In addition, the materials of the plates W1 and W2 on the front and inner surfaces must be good and thin. The problem to be solved by the invention is as described above. The laminated board is made by laminating a plurality of thin plates alternately to create a 0-page continuation page (when the description page of the invention is insufficient, please note and use the continuation page) 5. Description of the Invention The surface and the inner surface are finally ground to a predetermined thickness by a sander or the like. However, since the plates W4 and W3 in the center layer are often uneven, excessive grinding is performed to make the dimensions consistent. When grinding to a predetermined size as shown in FIG. 18, grinding the surface and inner plate W1 will cause Plate W3 is exposed. When the center layer is exposed due to such grinding, not only cannot be processed to a predetermined thickness, but also the laminate with the exposed portion becomes a defective product. When the incidence of such defective products is high, the quality will be adversely affected and production will be improved. cost. [Summary of the Invention] 10 The object of the present invention is to provide a plate grinding device and a plate grinding method, which are formed to deal with the aforementioned problems. Even if the processing surface and the inner surface are ground, the center layer will not be exposed, and the thickness can be made. Laminates that are accurate and stable. Means for solving the problem ί 15 In order to solve the aforementioned problem, as in the first aspect of the invention, the plate grinding device includes a table, an upper plate conveying mechanism, and a plate grinding mechanism. The foregoing table is attached to a pedestal frame and has a lower plate conveying mechanism. With the plate adsorption mechanism, the aforementioned plate grinding mechanism has a grinding head formed with a large-diameter rotating portion and a small-diameter rotating portion at a certain interval. 20 According to the second aspect of the invention, the plate grinding device includes a table, a plate upper conveying mechanism, and a plate grinding mechanism. The table is attached to a pedestal frame and has a plate lower conveying mechanism and a plate adsorption mechanism. For the plate grinding mechanism, two grinding heads with a large-diameter rotating part and a small-diameter rotating part are formed at a certain interval. The right-angled square with respect to the direction of the conveying plate is 0. Continued pages (Continued) 1221436 发明, description of the invention Description of the invention Continued upward, the large diameter rotating part is relatively staggered by 1 pitch and placed. According to a third aspect of the invention, a hard abrasive is adhered to the surface of the large-diameter rotating portion of the polishing head as in the i-th or second aspect. According to the invention of the fourth aspect, the invention is based on the above-mentioned fifth or fifth aspect of the plate grinding device, and a lifting device is also provided. The lifting device is used to lift the table according to the processing thickness of the plate. Furthermore, the invention according to the fifth aspect is based on the plate grinding device of the i or 2 aspect described above, and a dust collecting device for collecting dust by a dust collecting cover is also provided. While transporting the plate, the surface of the plate is ground at regular intervals by a grinding mechanism having a grinding head formed with a large-diameter rotating portion and a small-diameter rotating portion at a certain interval, and then the remaining unprocessed portions are ground. In addition, as in the seventh aspect of the invention, the grinding method of the plate is to send 15 plates while transporting the plate, while using two grinding heads with a large-diameter rotating portion and a small-diameter rotating portion formed at a certain interval. In a right-angle direction, a plate grinding mechanism configured by relatively rotating a large-diameter rotating part by a distance. First, the surface of the plate is ground into stripes by a first grinding head at a certain interval. Then, the remaining grinding is ground by a second grinding head. Processing section. 20 [Embodiment] Embodiments of the invention Hereinafter, specific embodiments of the invention will be described with reference to the drawings. Fig. 1 is a top view of the plate grinding device of the invention, Fig. 2 is a side view, and Fig. 3 is a front view. The plate grinding device will be continued from the original E (the description page of the invention is insufficient, please note and use the continuation page) 1221436 Rose, invention __ | Fameng description The next page is a side view, and Figure 3 is a front view . The plate grinding device is a device that grinds a thin plate cut from a log to a certain thickness, and is mainly composed of a pedestal frame 1, and a work table 4 having a lower plate conveying mechanism 2 and a plate adsorption mechanism 3 combined with the pedestal frame 1. , Plate upper conveying mechanism 5, plate 5 grinding mechanism 6, 6, lifting device 7, dust collecting device 8, 8 and so on. Next, the structure of each of these organizations will be described in detail. Fig. 4 is a view showing a detailed part of the lower conveying mechanism 2 of the aforementioned plate, and Fig. 5 is a view in the direction of arrow P in Fig. 4. The lower conveying mechanism 2 is composed of a driving roller 21, a motor 22, a sprocket 24, a sprocket 26, and a chain 10. The motor (in this case, a gear motor) 22 rotates and drives the driving roller 21, and the sprocket 24 is fixed to the rotating shaft 23 of the driving roller 21, the sprocket 26 is fixed to the rotating shaft 25 of the gear motor 22, and the aforementioned chain 27 is wound and installed on the sprocket. In this way, the conveyor belt 9 which has been wound around the driving roller 21 is transported in an endless state between the elastic roller 28 (refer to FIG. 2) provided at the other end 15 of the table 4 to be transported. Plate. In addition, the driving roller 21 and the elastic roller 28 of the conveying belt 9 are wound around, and the shaft is supported on the table 4 and can rotate freely. Next, the plate adsorption mechanism 3 will be described. FIG. 6 is a top view of the aforementioned conveyor belt 9 and the plate conveying mechanism 20 of the table 4 having a plate adsorption mechanism 3, and FIG. 7 is a side view in the direction of the arrow R in FIG. The conveyor belt 9 is a wide belt, and there are numerous small holes 9a, 9a, 9a ·· on the surface. These 孑 L 9a, 9a, ··· are holes for tightly adhering the sheet material when the sheet material suction blower 10 and the air pipe (exhaust pipe) 31, 31 are attracted to the inside of the table 4, as will be described later. On the workbench 4, there are 0 pages on both sides. If the invention description page is not enough, please note and use the continuation page. 1221436 Soft and invention description Equipment 32, 32 for attracting air. The equipment 32 and 32 are used for tightly adhering the plate to the conveying belt 9 and connecting the aforementioned vent pipes (exhaust pipes) 31 and 31 for attracting dust generated by processing, so as to attract the workbench 4 by the plate adsorption blower 10 And the air inside the conveyor belt 9. In this way, the sheet material is tightly contacted with the conveying belt 9 while being conveyed by the upper conveying mechanism 5 described later, and the grinding heads 61 and 62 are polished. Fig. 8 is a plan view showing a detailed portion of the upper conveying mechanism 5 and the grinding mechanisms 6, 6 which are in contact with the upper surface of the plate, and Fig. 9 is a view in the direction of arrow S in Fig. 8. ίο 15 荥 明明 Continue; ^ The upper conveying mechanism 5 is constituted by a belt driving roller 51, a motor 52, an upper conveying fast roller 53,53, an upper conveying idler 54, a conveying belt 55,55, The driving roller 51 has been erected in the approximate center of the worktable 4, and the motor 52 drives the belt driving roller 51. The aforementioned transport belts 55, 55, and · are wound and mounted on the belt driving roller 51 and the front and rear upper parts for transportation. The fast rollers 53 and 53 and the upper carrying roller 54 are provided. On the aforementioned belt driving roller 51, a plurality of transport belts 55, 55, ... are installed around the coil, and are divided into a belt group installed on the front and above the upper conveying rollers 53, 53 and the upper conveying rollers 54 to convey the sheet material. The belt rolls are mounted on the rear upper part to transport the fast rollers 53 and 53 and the upper carrier roller 54 to carry the sheet group and carry the sheet. Fig. 10 is a front view showing the structure of the first grinding head of the plate grinding mechanism 6, and Fig. 11 is a front view showing the structure of the second grinding head of the plate grinding device 6. The plate grinding mechanism is composed of a first grinding head 61, a pulley 63 for rotationally driving the first grinding head 61, a bearing 67, 67 supporting a shaft portion 65, 65 of the first grinding head 61, and a second grinding. Head 62, used to rotate 0 to continue the next page (if the invention description page is insufficient, please note and use the continuation page) 10 20 1221436 发明, invention description: ;;.-;; ', · λ;: ... The pulley 64 of the second grinding head 62 is rotationally driven, and the bearings 68 and 68 of the shaft portions 66 and 66 which support the second grinding head 62 are configured. In addition, as shown in FIG. 12 and the description of the invention_circle 2 grinding head 62 13 FIG. The pulley 63 ′ of the polishing head 61 and the pulley 64 of the second polishing head 62 are driven simultaneously by being divided into two wheel groups by a belt that has been wound around a pulley 60 mounted on an i driving motor 69. ίο 15 As shown in Fig. 10 and Fig. 11, in the aforementioned first grinding head 61, the large-diameter rotating portions 61a, 61a, ·· at a certain interval, and the small direct-control rotating portions (grooves) 61b at a certain interval 61b, formed on the surface of the large-diameter rotating part 61, with abrasive materials for plate grinding, such as diamond particles or ceramic particles. The space of the small-diameter rotating portion 61b, i.e., the groove space between the large-diameter rotating portion 61a and the large-diameter rotating portion 61a, becomes the space occupied by the transport belt 55 of the above-mentioned upper transport mechanism 5. In addition, the second grinding head 62 is also formed with large-diameter turning sections 62a, 62a, ..., and small-diameter rotating sections (grooves) 62b, 62b, ... The hard paper particles, such as diamond particles, are the same as the first grinding head 61, and the space of the small-diameter rotating portion 62b becomes the groove space occupied by the conveyor belts 55, 55 of the upper conveying mechanism 5. In addition, the aforementioned section! The large-diameter rotating portions 61 a and 62 a of the grinding head 61 and the second grinding head 62 may be formed of paper or stone, and may also be made of hard iron, and have many rough protrusions formed on the surface. i (Next, in the first grinding head 61 and the second grinding head 62 of the plate grinding mechanism 6 of the plate structure described above, the positions in the conveying direction of the large-diameter rotating portion 61a and the large-diameter rotating portion 62a are relative to the conveying direction. The right angle direction is staggered by 1. That is, as shown in Fig. 10 and Fig. 11, at the i-th grinding head, the next page is 0 (if the description page of the invention is insufficient, please note and use the next page) 11 20 1221436 玖 、 It is found that the position of the large-diameter rotating portion 61a of Lai Ming 5 10 61 in the conveying direction is the small-diameter rotating portion 62b of the second grinding head 62, and the second grinding is in the position of the small-diameter rotating portion 61b in the conveying direction. The large-diameter rotating portion 62a of the head 62. This reason will be described later. When grinding the surface of a wide plate, polishing with one grinding head at a time increases the grinding load and increases the grinding resistance, making it difficult to grind. In the second grinding, the grinding resistance is reduced and smooth grinding can be performed. That is, the large-diameter rotating portions 61a, 61a of the first grinding head 61 can be polished into a stripe shape, and the second grinding head can be used. Large diameter rotating parts 62a, 62a of 62 ... Grind the unpolished portion of the remaining plate without any excess. 15 Description of the invention __ Figure 14 is a side view of a state in which a lifting device 7 with a table 4 is installed on both sides of the frame 1. The aforementioned table 4 is combined with the aforementioned lower portion The conveying mechanism 2 and the plate adsorption mechanism 3 are lifted and lowered by the lifting device 7 according to the thickness of the ground plate. The lifting device 7 is composed of jacks 71, 71 (the opposite side is not on the opposite side) (Illustrated), and a driving mechanism for driving the jack 71, and the driving mechanism is composed of sprocket 72, 73, a chain 74 wound around the sprocket 72, 73, and driving the sprocket 72 , 73 — The motor (not shown) is configured to make the aforementioned table up and down, however, the driving mechanism of the jack 71 is not limited to this, and gears or rollers can also be used. Also, no special lifting device may be provided. The screw mechanism is used to make the entire table 4 up and down. Next, the dust collecting device will be described. As shown in Fig. 1 to 3, and Figs. 15 and 16, a dust collecting device is provided in the plate grinding device. 8. The dust collecting device 8 is formed by covering the dust separately. 10th continuation page of mechanism 6 (note that the invention description page is insufficient, please note and use the continuation page) 12 20 1221436 Request for explanation, description of invention 5 Dust cover for the entire polishing head 61 and second polishing head 62 81, 81, racks 83, 83 that have been installed on both sides, and installation equipment 82, 82 that have been erected and fixed between the racks. And the above-mentioned each dust collecting cover 81 is provided with a cylindrical shape connecting the dust collector and the air duct. Connect the equipment 8 la, 81a. In this way, the chips of the plate polished by the first grinding head 61 and the second grinding head 62 can be discharged by the dust collector and the ventilation pipe. The plate grinding device is composed of the above structure and is mainly used for grinding It is used as the center layer when manufacturing the laminate. Next, the grinding and working instructions will be described. Fig. 17 is a diagram showing a plate grinding process. When the plate W constituting the center layer of the layer plate is put into the plate grinding device, the lower plate conveying mechanism 2 and the upper plate conveying mechanism 5 are conveyed by the plate 10. At this time, the sheet W is transported while being adsorbed by the conveyor belt 9 which is adsorbed by the sheet adsorption mechanism 3. Then, with the first grinding head 61, first, the grinding section is ground at a certain interval and at intervals of the large-diameter rotating sections 61a, 61a, ...
Wa，Wa，Wa，· ·，且剩餘之Wb，Wb，Wb，· ·成為未研磨條 15 紋狀態。接著，更進一步搬送時，藉第2研磨頭之大直徑 旋轉部62a，62a，· ·，將板材W之未藉第1研磨頭61研 磨之未研磨部Wb,Wb，· ·，以該第2研磨頭62之大直徑 旋轉部62a，62a，· ·研磨。如此一來，板材W表面整面毫 無剩餘地，研磨成預定厚度。 20 此外，於該發明實施形態中，研磨頭係使用第1研磨 頭61與第2研磨頭62，然而，亦可僅使用第1研磨頭61 ，研磨成條紋狀，接著使該條紋狀之板材錯開1間距尺規（ 圖示省略）位置，且再度投入以研磨剩餘部份。又，於實施 形態中，係針對研磨板材上面之形態進行說明，然而，亦 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 13 1221436 發明_明續Μ 玖:、發明酬 發明效果 如以上詳述，依該發明板材研磨裝置，於層板製作時 ，可將構成中心層之板材之厚度加工成一定，因此，可於 層板製作時將層板整體厚度作成一定厚度。因此，即使將 5 層板表面與内面最後研磨，亦不會如習知使構成中心層之 部份露出，且可使不良品發生率顯著降低。又，不僅層板 厚度，中心層之板材厚度亦總是構成一定厚度，因此，亦 可製作於強度上穩定之品質優良之層板。 t圈式簡單說明3 10 圖示簡單說明 第1圖係該發明板材研磨裝置之俯視圖。 第2圖係該發明板材研磨裝置之側視圖。 第3圖係該發明板材研磨裝置之正視圖。 第4圖係顯示構成該發明板材研磨裝置之板材下部運 15 送機構之詳細部份之圖。 第5圖係顯示板材之下部運送機構詳細部份之第4圖 的P箭頭方向之觀看圖。 第6圖主要為板材吸附機構之俯視圖，該板材吸附機 構係安裝於設置在構成該發明板材研磨裝置之工作台的運 20 送板材機構部。 第7圖係顯示板材吸附機構之第6圖的R箭頭方向之 側視圖。 第8圖係顯示構成該發明板材研磨裝置之上部運送機 構與研磨機構之詳細部份之圖。 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 14 1221436 發明說明續頁 玫、發匪_明 機構與研磨機構之詳細部份之圖。 第9圖係顯示上部運送機構與研磨機構之第8圖的S 箭頭方向之觀看圖。 第10圖係顯示構成該發明板材研磨裝置之板材研磨機 構之第2研磨頭之結構的正視圖。 第11圖係顯示構成該發明板材研磨裝置之板材研磨機 構之第1研磨頭之結構的正視圖。 第12圖係顯示旋轉驅動第1研磨頭與第2研磨頭之驅 動裝置之結構之圖。 10 第13圖係第12圖之Q箭頭方向之觀看圖。 第14圖係顯示構成該發明板材研磨裝置之工作台之升 降裝置之圖。 第15圖係顯示該發明板材研磨裝置所使用之集塵裝置 之結構之俯視圖。 15 第16圖係顯示該發明板材研磨裝置所使用之集塵裝置 之結構之側視圖。 第17圖係顯示使用該發明板材研磨裝置研磨板材之方 法0 第18圖（A)係習知製作層板過程中所發生之中心層露 20 出之例之立體圖，第18圖（B)則為其中心層露出部份之截 面圖。 第19圖係顯示一般層板結構之戴面圖。 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 15 1221436Wa, Wa, Wa, ···, and the remaining Wb, Wb, Wb, ·· are in a state of an unpolished stripe. Next, during further conveyance, the unpolished portions Wb, Wb, ... of the plate W, which have not been polished by the first polishing head 61, are borrowed from the large-diameter rotating portions 62a, 62a, ... of the second polishing head. 2 The large-diameter rotating portions 62a, 62a of the polishing head 62 are polished. In this way, the entire surface of the plate W is ground to a predetermined thickness without any residue. 20 In the embodiment of the present invention, the polishing head uses the first polishing head 61 and the second polishing head 62. However, it is also possible to use only the first polishing head 61 to grind the stripe, and then make the stripe plate Stagger the position of the 1-pitch ruler (not shown in the figure), and put it in again to grind the remaining part. In addition, in the embodiment, the description is made on the upper surface of the grinding plate. However, it is also continued on the next page (when the description page of the invention is insufficient, please note and use the continuation page) 13 1221436 Invention_ 明 Continue M 玖:, The effect of the invention is as detailed above. According to the plate grinding device of the present invention, the thickness of the plate constituting the center layer can be processed to a certain level during the production of the layer. Therefore, the entire thickness of the layer can be made constant during the production of the layer. thickness. Therefore, even if the surface and inner surface of the five-layer board are finally ground, the portion constituting the center layer will not be exposed as is known, and the incidence of defective products can be significantly reduced. In addition, not only the thickness of the laminate, but also the thickness of the sheet in the center layer always constitutes a certain thickness. Therefore, it is also possible to produce a laminate of excellent quality that is stable in strength. Brief description of t-ring type 3 10 Brief description of illustration Figure 1 is a top view of the plate grinding device of the present invention. Figure 2 is a side view of the plate grinding device of the invention. Figure 3 is a front view of the plate grinding device of the invention. Fig. 4 is a diagram showing a detailed part of the lower conveying mechanism of the plate constituting the plate grinding device of the invention. Fig. 5 is a view in the direction of arrow P of Fig. 4 showing a detailed part of the lower conveying mechanism of the plate. Fig. 6 is a plan view of the plate adsorption mechanism, which is installed in the transportation mechanism of the plate transporting mechanism provided on the table constituting the plate grinding device of the invention. Fig. 7 is a side view showing the direction of the arrow R in Fig. 6 of the plate adsorption mechanism. Fig. 8 is a view showing a detailed part of the upper conveying mechanism and the grinding mechanism constituting the plate grinding device of the present invention. 0 Continued pages (If the description page of the invention is insufficient, please note and use the continuation page) 14 1221436 Continued page of the invention description The details of the mechanism and grinding mechanism. Fig. 9 is a view in the direction of arrow S in Fig. 8 showing the upper conveying mechanism and the grinding mechanism. Fig. 10 is a front view showing the structure of the second grinding head of the plate grinding mechanism constituting the plate grinding device of the present invention. Fig. 11 is a front view showing the structure of the first grinding head of the plate grinding mechanism constituting the plate grinding device of the present invention. Fig. 12 is a view showing a structure of a driving device for rotationally driving the first polishing head and the second polishing head. 10 Figure 13 is a view in the direction of the Q arrow in Figure 12. Fig. 14 is a diagram showing a lifting device constituting a table of the plate grinding device of the present invention. Fig. 15 is a plan view showing the structure of a dust collecting device used in the plate grinding device of the present invention. 15 FIG. 16 is a side view showing the structure of a dust collecting device used in the plate grinding device of the present invention. FIG. 17 is a perspective view showing a method for grinding a plate by using the plate grinding device of the present invention. FIG. 18 (A) is a perspective view of an example of a central layer dew 20 occurring in the process of conventionally manufacturing a laminate. FIG. 18 (B) A cross-sectional view of the exposed portion of its center layer. Fig. 19 is a wearing view showing a general laminate structure. 0 Continued pages (Please note and use continuation pages when the invention description page is insufficient) 15 1221436
玖、發明說明 【圖式之主要元件代表符號表】 54…上部運送托輥 60、 63、64…滑輪 61. ··第1研磨頭 61a、62a…大直徑旋轉部 61b、62b…小直徑旋轉部 62···第2研磨頭 65、66…軸部 67、68···軸承 71.. .起重器 81···集塵罩 81a…連接設備 82…安裝設備 83.. .架 W5"·薄板材 W、W卜W2、W3、W4…板材 Wa…研磨部 Wb···未研磨部 1.. .台座架 2…板材之下部運送機構 3.. .板材吸附機構 4·"工作台 5…板材上部運送機構 6…板材研磨機構 7…升降裝置 8.. .集塵裝置 9、55···運輸帶 9a...小孔 10…板材吸附用鼓風機 21···驅動輥 22、52、69…馬達 23…旋轉軸 24、26、72、73."鏈輪 25".驅動軸 27、74...鏈 28.. .鬆緊輥 31.. .通氣管(排氣管） 32.. .通氣管安裝設備 51…帶驅動輥 53.. .上部運送快輥 16发明 Description of the invention [Representative symbols of the main components of the drawing] 54 ... Upper conveying rollers 60, 63, 64 ... Pulley 61. · 1st grinding head 61a, 62a ... Large-diameter rotating parts 61b, 62b ... Small-diameter rotation 62 ... 2nd grinding head 65, 66 ... Shaft 67, 68 ... Bearing 71 ... Jack 81 ... Dust cover 81a ... Connection device 82 ... Installation device 83 ... Frame W5 " · Thin plate W, W Bu W2, W3, W4 ... Plate Wa ... Grinding section Wb ... Unground section 1.... Stand 2... Lower plate conveying mechanism 3... Plate adsorption mechanism 4. &Quot; Worktable 5 ... Upper plate conveying mechanism 6 ... Plate grinding mechanism 7 ... Lifting device 8. Dust collecting device 9, 55 ... Transport belt 9a ... Small hole 10 ... Blower for plate adsorption 21 ... Drive roller 22, 52, 69 ... Motor 23 ... Rotary shaft 24, 26, 72, 73. " Sprocket 25 ". Drive shaft 27, 74 ... Chain 28 .. Elastic roller 31 .. Ventilation pipe (exhaust Pipe) 32 .. Ventilation pipe installation equipment 51 ... With drive roller 53 .. Upper conveying fast roller 16