TWI220777B - Package process of image sensor chip - Google Patents

Abstract

The present invention discloses a package process of image sensor chip. A molding process is mainly used for sealing the package process of image sensor chip. Compared to the package process of image sensor chip in the prior art, the design not only effectively reduces the manufacturing cost, but also increases the efficiency and stability of the image sensor during operation. In addition, the design of the present invention can simplify the package process of image sensor chip. Therefore, the design of the present invention can provide a package process of image sensor chip, which is more efficient and reliable than that of the prior art.

Description

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a packaging process for a wafer sealing image sensing chip. 1 clothing, in particular, related to a [previous technology] i. The purpose of the electronic packaging process is to give the structure, so that it can play a stable function. Gu Huibu ,. ± stops at the integrated circuit process technology of the second physical chemistry; the scope of the technology covers Syria, its application 彳 L · zi, machinery, materials, motors ... metal, ceramics, polymers, etc. for a long time Xiang Xun also used to develop integrated circuit sealing technology: importance is not equal to f microelectronics level medium-range technology or microelectronics related technology, so countries around the world can not; road system to obtain technological leadership. At the mouth of silicon, gallium arsenide or piezoelectric materials: j of the integrated circuit components made by the thin film process technology: the hunting structure is also extremely fragile, so it must be packaged to prevent external forces or = go: damage, and then physical The destruction of nature and the chemical nature of the two ':, to ensure the transmission of signals and energy, so that it can play normal and accurate 2: said: "The electrical functions of components such as gallium gallium or I electrical materials must be two to two. Because of & integrated circuit packaging is to establish the guaranteed performance of components, it begins with the completion of the wafer process I, the packaging process is more package design and chip bonding, circuit connection, structural sealing glue The combination of the combination of the system and even the completion of the product, the version is to provide the function of carrying and structural protection to protect the I c "thing" destruction or chemical interference; provide energy transfer 1220777 V. Description of the invention (2) The signal distribution of 1; avoid the generation of signal delay and affect the operation of the system; provide excellent heat dissipation methods. Packaging is based on the establishment of inter-level interface bonding (IntercOnnecti〇n-based technology, its process technology is divided into five different levels: the zeroth = = chip-level interface combination), which lies in the circuit design on the chip and ^, The first level (single-chip or multi-chip module) is a process of placing a chip in a case and completing the circuit and sealing protection. This is also called mold, and (mold) or chip-level packaging. (Chip-level packages), absolutely second-tier (printed circuit board, PCB), which is a process of combining the components of the first-level sealed element on the circuit card; the third-level (motherboard station Each circuit board is combined on the motherboard to become a sub-system 10% ^ 丄! Four-tier 'level (electronic products), which is a process of grouping several sub-systems into electrical power ... (⑽). Department 'Welding line 7 is quite vague, the key technologies used are', ', A ,,,, σ (Wlre Bonding), tape-and-reel automatic splicing (Plant 2: 2: 1, TAB) and cover Crystal bonding (F1ip Chip / layer, and packaging. With the needs of product design The user's eyes are that the external two integrated circuit components have significant changes regardless of the internal functional design, the size of the components, the package type, the number of pins, and the pitch of the people; The second type of mountable technology has significant changes. According to the "

Plastic Package Μ1 ". ~ With "60 and plastic packaging (& g), if divided according to the combination of components and circuit board _, mouth knife" pin insertion type (Pin — Techrough-Hole PTH; also known as

122077V V. Description of the invention (3) _ Plug-in type)

) Two categories; if the pins are UAUrface Mount Device; SMD bilateral pins and quad pins: The two f states can be divided into single-sided pins, image sensing films; ^ $ pin and other four types Pin distribution pattern. To reduce such as moisture, how can the disc be produced with effective efficiency and stability after packaging ;,; = Yes: The image sensor chip needs to be very careful during the operation process: the whole image sensor chip package Image sensor chip packaging system =; a picture system-according to the image of the conventional technology of the image sensor chip "figure. F" a picture 'is shown in the conventional arts step 〇. The upper HW / is generally provided with a lead frame. For example, the upper lead frame includes at least one wafer holder, and the mounting bracket C is located around the wafer holder. Next, proceed-Healing Guide: Block. 1 = process) ′ Fill a chip holder 7 between two soils with a plastic sealing material, and form an outer mold on one surface of the lead frame, as shown in step 120. Then, as shown in step 130, a wafer bonding process is performed, and an image-sensing wafer is bonded on each wafer holder. Wire bonding (wire bonding), step 140, to connect the image sense through a plurality of wires; then the chip and the upper wire are arranged. Finally, an embedding process is performed to form a transparent layer. Bundled above the% image sensing chip, refer to step 150, which is mainly carried out by inserting a cover on: === embedded in the above-mentioned outer mold to seal the above-mentioned image sensing chip on the guide. However, there are many problems in the process of packaging the image sensing chip of the known technology. First, because the transparent cover used in the final sealing is an optical glass, the packaging process described in '1 will be because

V. Explanation of the invention (4) The high cost makes the overall cost increase accordingly, and then the following aspects: Shi Liϋ Predict the commercial competitiveness of the wafer sealing process. The other one is learning to make glass (transparent cover). It ’s because of the use of a light, a method, and a technology to seal the image sensor chip. More seriously, there is no moisture around the image sensor chip: i :::: micro = lowering the above image sensor chip «Packaging process obtained optical components: ΐ :: technical image sensing Chip and stability. It is not possible to achieve excellent operating efficiency. Wire racks are used to seal the image sensing wafer on the guide wafer, and a liquid transparent material is inserted into the image sensor to achieve the above-mentioned sealed image sensing wafer. purpose. However, above Note: After the process of producing transparent cans in the transparent material === step, the above-mentioned fine bubbles will be difficult to remove = 1. The above small bubbles are combined with the phenomenon of uneven surface to further enhance the image sensing quality of the image sensing chip: # i = This is the evolution of science and technology. People have improved the optical components of image sensing. Reliable image sensing chip packaging has become an important issue. [Summary of the Invention] The above-mentioned invention of the old scene towel ’is used to seal the image sensor chip.

Page 8 1220777

Problem 'The main purpose of the present invention is to improve the manufacturing process, in which the above-mentioned housing and transparent cover formed by the above-mentioned image sensing wafer process (molding process), and an image sensing packaging process produced by the assembly process can be achieved by The image-sensing chip package further simplifies the packaging process of the present invention, and prevents moisture and noise through the plastic packaging process. Therefore, according to the measurement chip, the cost of the image sensor chip package can be closely compared with the conventional image sensor. Various kinds of wafers are sealed using plastic packaging structure in the middle. The purpose is to provide a method for forming sealed fine particles. The quality and stability of the know-how of the present invention The chip sealing image sensing process can be installed in a structure for image sensing image sensing image sensing degree. Better assembly process can measure the chip. Effectively reduce the transparent cover of the image sensing crystal. The chip is used to operate the chip packaging. The operation of the chip is based on the use of one type. Therefore, according to the image sensing chip packaging process, an undesired image can be displayed. The non-optical glass of the present invention The film encapsulation process of the present invention _ The encapsulation process of the root sheet encapsulation sheet bearing surface The above-mentioned shadow structure can not only have moisture or the above process. Steps for mounting the element; Sealing the image sensor crystal can effectively prevent the shadow of the fine particles described in the present invention, the image sensor chip is formed; forming an outer mold for the reduction of the chip package described above An image sensor crystal image sensor crystal interference source is formed on a wafer such as the above by laminating and manufacturing the wafer. The packaging process includes the steps of the above-mentioned wafer process, the image sensor chip package on the carrier element, and the chip package junction to provide one of the carrier element according to the image sensing crystal; and a step of performing a plastic process. By measuring the cost of the chip packaging process, images such as the present invention appear in the structure

1220777 V. Description of the invention (6) The sensor chip packaging process can enable the image sensor chip to exert its due performance and greatly enhance the competitiveness in the industry. [Embodiment] + Some embodiments of the present invention will be described in detail as follows. However, in addition to the details, the present invention can be widely implemented in other embodiments, and the scope of the present invention is not limited, and the scope of the following patents shall prevail. Moreover, in this description, different parts of each element are not drawn according to ::. Certain dimensions have been exaggerated compared to other related dimensions for a clearer description and understanding of the invention. . Upper ϊ: Two preferred embodiments are an image sensing chip packaging process called chip Κ The packaging process includes at least the following steps: · Provide one: a chip holder; form a set of outer molds to order a wafer bonding process described above In order to join one thousand halberds over one thousand; and perform a plastic packaging process to seal the uploading element. According to this embodiment, the above-mentioned crystals are in the external mold described above. The seat is arranged with a plurality of wires. The above-mentioned J The periphery of the wafer holder including the -wafer. The above-mentioned forming of the outer mold and the seven-seater seat are located on the surface of the above-mentioned component. The step of forming the outer mold is t = the wafer is wound around the outside of the wafer holder, and The outer mold is the step between the enclosure and the wire configuration base. The material can be filled in the above-mentioned wafer process or other known methods. The outer mold can be plastic-sealed to attach the wafer to the wafer. After the holder, according to this embodiment, it is configured by a plurality of wires to be electrically connected, connected, and electrically connected, and the holder is configured. In the above-mentioned plastic packaging process, the chip described above to the above-mentioned The lead is made of a transparent plastic sealing material The tenth stomach 1220777 V. Description of the invention (7) The above-mentioned chip is sealed between the above-mentioned outer molds. Another preferred embodiment of the present invention is an image sensing chip packaging process. The second figure is based on this implementation The flow chart of the example of the image sensing chip packaging process. Referring to the second figure, first, a wafer carrier component is provided, as shown in step 2 10. The above wafer carrier component includes at least a wafer holder and a plurality of wire arrangement seats. It is located around the wafer holder. The above-mentioned wafer carrying element may be a lead frame, a main board, a ceramic plate, or other supporting elements. Next, a step of forming an outer mold is performed, as shown in step 22. The above step of forming an outer mold mainly includes filling an insulating material between the above-mentioned wafer holder and the wire arrangement base, and forming an outer mold on one surface of the wafer carrier element, wherein the above-mentioned outer mold is located on the above-mentioned wire arrangement base. Outer edge. The above steps of forming the outer mold can be accomplished by a plastic packaging process or other techniques well known to those skilled in the art. An open space can be formed with the outer mold, so that the wafer can be placed in the above open space in the subsequent steps. After the man-made description, the first mold is lost, and one wafer is used. ; = yStep 23〇. The above wafer bonding process can be completed by applying the main 1Γ-bonding technology. In the above wafer bonding process,

′, And a wafer affixed with an image Wei Ke a K respectively. μ, +, image sensing day-to-day film package rn meter-乂 image H film mentioned above ¥ image sensor chip described above! Jd, top: The pads are located in the active zone of K, the control. Next, wire bonding is performed (wire: n is required to be 1:, as shown in step 240. In the above-mentioned wire bonding process, the welding wire of the image sensing chip is connected to the above-mentioned conducting wire.

1220777 5 Description of the invention (8) Step 25. The most: Show 'Λ one through two plastic packaging materials to carry out-plastic packaging process, as described above by the outer sealing process system-transparent plastic packaging material filled in Tian π mold Xing lead frame shape, ^ ^ ^ the above external mold And β Μ „4 2 A carried by the wafer carrier further achieves the effect of sealing the open two rooms in the plastic molding process described above. The upper and middle processes are performed. Image sensing of the environment; ί ::::: See the difference between the manufacturing processes according to this embodiment = image sensing in the art. In the sealing process of the wafer, the image ## ffi 泰 S α 技 π The test chip package system uses a transparent optical glass to embed the image sensor chip on the lead frame ...: There is a way to seal the image, such as because the optical glass sensor chip cannot be used in a completely true # Here comes the shirt after installation-the image sensor chip is extremely likely to cause the best performance of 1 degree or the effect of fine particles. In contrast, in this embodiment, a plastic packaging material is used: glass The design of 'households' according to this embodiment can greatly Reduce the shadow = .. ^ ^ ^ — It is very simple. The design of this embodiment is carried out under the environment of the South vacuum degree. The plastic sealing material is plastic-sealed. The image-sensing chip is sealed to the wafer carrier: transparent Therefore, the chip encapsulation system according to this embodiment can completely avoid the possible residual moisture in the package structure of image sensing, so that: to a higher level of moisture-proof effect, ensure this—image sensing chip can

1220777 V. Description of the invention (9) The influence of moisture to fully exert the performance of the image sensor chip. Furthermore, after the virtue of the image sensing chip packaging process of this embodiment, since the periphery of the image sensing chip is filled with transparent plastic, this-the image sensing chip can be avoided in the handling of materials, which may occur as known 2 Noise is caused by the interference of fine particles. Therefore, after the image sensor chip of this embodiment =, the characteristics of high efficiency and high stability can be further exerted. On the other hand, compared with the other-known technique, the method of encapsulating a j-image sensor wafer with a liquid transparent material is used. Since the present invention uses a plastic package to make a m-image sensor wafer, so according to the present invention, The packaging process can effectively avoid many disadvantages in the provincial know-how. The design of the plastic packaging is similar to the knowledge of those skilled in the art. The plastic packaging process is roughly ^ first put solid plastic packaging materials into the prayer towel, '' = ΐ, to fill the parts made of the outer mold and the wafer carrying components ... According to the invention, the manufacturing process will not: in the process of describing the image sensing chip, the package surface will not be as well-known as the above-mentioned conventional techniques. Therefore, after the root is formed, the influence of the flat factor can be obtained, and it can be maintained Interference sensing crystals such as flatness m # The above-mentioned image of the shirt image sensing chip T σ 'i ~ # The invention discloses a kind of image sensing chip package 1220777 V. Description of the invention (10) Manufacturing. The above image The sensing chip packaging process includes at least one wafer holder and a plurality of wafer holders. Two wafer holders are provided to form an external mold on the wafer. The carrier: =: two holders, and a wafer bonding process is performed. Use a surface chip holder that fits a shadow ^ to perform a wire-making process to electrically connect the two ;: ☆ t = wire configuration seat 'and perform a plastic packaging process to make the heart = two to loosely seal the image sensing chip on The above-mentioned wafer carrying element ^ design of the present invention Since the surrounding of the above-mentioned image sensing wafer is filled with a transparent sealing material], the image sensing wafer according to the present invention does not reduce the shadow due to interference such as moisture or fine particles. Efficiency and stability [Other— $ Since the == system of the present invention uses a plastic packaging process to seal the image sensing wafer on the wafer carrier element, so the image sensing wafer described above does not occur such as because of the small size in the package structure. Factors such as air bubbles or flatness of the package surface detract from its proper image sensing quality. In addition, compared to the image sensing chip packaging process used in the conventional art, since optical is not used in the present invention Glass is used to seal the image sensing wafer on the wafer holder, but the above-mentioned image sensing wafer is sealed with a plastic sealing material. Therefore, the design of the present invention can effectively reduce the packaging cost of the image sensing wafer. The description is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application of the present invention; all other things without departing from the spirit disclosed by the present invention All the specific changes or modifications' shall be included in the patent application parks mentioned below.

Page 1212777 Brief description of the drawings [Simplified description of the drawings] The above-mentioned objects and advantages of the present invention will be described in detail with the following embodiments and diagrams, where: The first picture is an image according to the known art A flowchart of the plastic packaging process of the sensing chip; and the second figure is a flowchart of the plastic packaging process of the image sensing chip according to the present invention. [Representative symbols of main parts] 110 Steps for providing lead frame 120 Steps for plastic packaging process 130 Steps for wafer bonding process 140 Steps for wire bonding process 150 Steps for transparent cover embedding process 210 Steps for providing wafer carrier components 22 0 Step of forming an outer mold 230 Step of performing a wafer bonding process 240 Step of performing a wire bonding process 250 Step of performing a plastic packaging process

Page 15

Claims (1)

uzu // / 6. Patent application scope 1 · An image sensing wafer package manufacturing process includes:, air range, the above-mentioned image sensing wafer package provides a wafer carrying element; forming an outer mold on the wafer bearing to carry out a The wafer is bonded on one side; on the wafer carrier element; and on the wafer carrier, an image sensing wafer is bonded ::: a plastic packaging process to seal the image sensing wafer on the wafer carrier 2. If applied The image bearing test BH of the first item of the patent scope The wafer carrier element further includes: ~ H-chip packaging process, at least one of which is a wafer holder; and a plurality of wire arrangement seats, which are located on the wafer Operation 3, please use the image sensing chip packaging process of item 1 in the above range, in which a transparent plastic sealing material is used to fill an open space formed by the outer mold and the wafer core piece to seal the image Sense 4: Before performing the wafer bonding process, such as the image sensing in item 2 of the patent application scope, the method further includes a step between the wafer holder and the wire arrangement holder. In the chip packaging process, the insulating material is filled in the 5; for example, the image sensing chip packaging process in the second patent application scope, wherein the outer mold is located around the wire arrangement bases. , ^ ′, 6 · If the image sensing chip packaging process of item 2 of the patent application scope, before performing the plastic packaging process, it further includes a step of performing a wire bonding process, wherein the 1220777 VI. Scope of patent application The wire-forming process is to form a plurality of wires for electrically connecting them to the wire arrangement seat. μ-shirt image sensor chip and 7. Image sensor chip as described in the first item of the patent application. The chip carrier element is a lead frame. In the manufacturing process, the image sensing chip package in which t Λ is applied for patent 11 ® No. 1 ′ is conceived. The chip carrier element is a ceramic plate. Pei Zhiyun, the image sensing chip package described in 9. · An image sensing chip package manufacturing process includes: providing a wafer carrying element, wherein the wafer carries a wafer base and a plurality of wire arrangement bases; the oregano father comprises forming an The outer mold is on one surface of the wafer carrier element. The chip holder-wafer bonding process '卩 attaches an image sensing chip to the crystallized fV line 线' The wire-forming process is electrically connected to the wire with a plurality of wires ~ The image sensing chip and the conductive wire arrangement seat; and the encapsulation process, the plastic packaging process is sealed with a transparent plastic encapsulation material ~ the image sensing chip is on the wafer carrying element. _10. If the image sensing chip package shoe of item 9 of the patent application scope, the outer mold is located around these wire arrangement bases. , 11 ·, = The image sensing chip packaging process of the 9th scope of the patent application, before the Japanese-Japanese film bonding process is performed, it further includes an insulating material filled between the chip holder and the wire arrangement bases. A step of. 12. If the image-sensing chip packaging process of item 9 of the scope of patent application, the step of forming the outer mold further includes a plastic packaging process. Page 17 1220777 VI. Scope of patent application 1 3 · If the scope of patent application is ____ The plastic packaging process in the 9th is-to the second degree 14. If the chip is claimed 1 5. If the chip is claimed 16. If the application The wafer 17 · — a package package provides a wafer holder. The patent scope of the carrier element is requested. The patent scope of the carrier element is requested. The patent scope of the carrier element is the image sensor. One of the components is on the surface; the image sensing chip packaging process of item 9, which is a lead frame. The image sensing chip packaging process of item 9 is a ceramic plate. The image sensing chip packaging process of item 9 is a motherboard. In the chip packaging process, the above-mentioned image-sensing wafer sealing element 'wherein the wafer carrier element includes at least a line configuration seat; the King of Science' forms an external mold on the wafer carrier element and performs the chip sealing on the wafer seat Secret 18 · As the application of the outer mold 19 · Rushen a wafer bonding process, to attach an image sensing wafer to the wafer and a wire manufacturing process to sense the wafer and a second plastic encapsulation. The scope of this image sensing patent is located at The scope of these patents ▲ The wire bonding process is to electrically connect the wire configuration bases with a plurality of wires; and the process, the second plastic packaging process is to use a transparent plastic J-chip on the wafer carrier element. = 1 The image sensing chip packaging process of 7 items, the wires are arranged around the seat. The image sensing chip packaging process of item 17 is the step between filling the scope of the patent application with an insulating material between the chip holder and the wires during the wafer bonding process. The image-sensing wafer sealing process of the second molding process is carried out. In the environment with a vacuum degree of about -760 mmHg 21 · As in the scope of patent application; | 7 5, The wafer carrier element is a wire = image sensing wafer sealing process, and 22 · as in the scope of patent application scope 17顼: Once the chip carrier element is a ceramic ^ ^ image sensor chip packaging process, the 2 ·· If the scope of the patent application is 17th, the chip carrier element is a motherboard image sensing Chip packaging process, which Page 19