TWD236269S - 基板處理裝置用反射板 - Google Patents

基板處理裝置用反射板 Download PDF

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Publication number
TWD236269S
TWD236269S TW110305062D01F TW110305062D01F TWD236269S TW D236269 S TWD236269 S TW D236269S TW 110305062D01 F TW110305062D01 F TW 110305062D01F TW 110305062D01 F TW110305062D01 F TW 110305062D01F TW D236269 S TWD236269 S TW D236269S
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TW
Taiwan
Prior art keywords
design
processing device
substrate processing
difference
view
Prior art date
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TW110305062D01F
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English (en)
Chinese (zh)
Inventor
佐藤明博
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD236269S publication Critical patent/TWD236269S/zh

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TW110305062D01F 2022-08-10 2023-01-10 基板處理裝置用反射板 TWD236269S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-017170 2022-02-07
JP2022017170F JP1733769S (https=) 2022-08-10 2022-08-10

Publications (1)

Publication Number Publication Date
TWD236269S true TWD236269S (zh) 2025-02-11

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TW110305062D01F TWD236269S (zh) 2022-08-10 2023-01-10 基板處理裝置用反射板

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US (1) USD1053157S1 (https=)
JP (1) JP1733769S (https=)
TW (1) TWD236269S (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240093740A (ko) 2021-10-18 2024-06-24 램 리써치 코포레이션 멀티-스테이션 반도체 프로세싱 챔버를 세정하기 위한 장치들
USD1114751S1 (en) * 2021-10-18 2026-02-24 Lam Research Corporation Hub with gas deflectors
CN118891705A (zh) 2021-11-23 2024-11-01 朗姆研究公司 用于清洁多站半导体处理室的装置和技术
JP1746404S (ja) * 2023-01-11 2023-06-15 サセプタカバーベース
JP1760960S (https=) * 2023-06-12 2024-01-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD197466S (zh) 2018-07-19 2019-05-11 日商國際電氣股份有限公司 基板處理裝置用隔熱板

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
US6108491A (en) * 1998-10-30 2000-08-22 Applied Materials, Inc. Dual surface reflector
JP3859072B2 (ja) * 2001-03-08 2006-12-20 信越半導体株式会社 熱線反射材料及びそれを用いた加熱装置
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
TWD174921S (zh) * 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
JP1565116S (https=) * 2016-02-10 2016-12-12
US10283637B2 (en) * 2016-07-18 2019-05-07 Taiwan Semiconductor Manufacturing Co, Ltd. Individually-tunable heat reflectors in an EPI-growth system
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
JP1706320S (https=) * 2021-06-28 2022-01-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD197466S (zh) 2018-07-19 2019-05-11 日商國際電氣股份有限公司 基板處理裝置用隔熱板

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USD1053157S1 (en) 2024-12-03
JP1733769S (https=) 2023-01-06

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