JP1733769S - - Google Patents

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Publication number
JP1733769S
JP1733769S JP2022017170F JP2022017170F JP1733769S JP 1733769 S JP1733769 S JP 1733769S JP 2022017170 F JP2022017170 F JP 2022017170F JP 2022017170 F JP2022017170 F JP 2022017170F JP 1733769 S JP1733769 S JP 1733769S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022017170F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2022017170F priority Critical patent/JP1733769S/ja
Application granted granted Critical
Publication of JP1733769S publication Critical patent/JP1733769S/ja
Priority to TW110305062D01F priority patent/TWD236269S/zh
Priority to US29/883,098 priority patent/USD1053157S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022017170F 2022-08-10 2022-08-10 Active JP1733769S (https=)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022017170F JP1733769S (https=) 2022-08-10 2022-08-10
TW110305062D01F TWD236269S (zh) 2022-08-10 2023-01-10 基板處理裝置用反射板
US29/883,098 USD1053157S1 (en) 2022-08-10 2023-01-24 Heat reflector for semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022017170F JP1733769S (https=) 2022-08-10 2022-08-10

Publications (1)

Publication Number Publication Date
JP1733769S true JP1733769S (https=) 2023-01-06

Family

ID=84601522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022017170F Active JP1733769S (https=) 2022-08-10 2022-08-10

Country Status (3)

Country Link
US (1) USD1053157S1 (https=)
JP (1) JP1733769S (https=)
TW (1) TWD236269S (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240093740A (ko) 2021-10-18 2024-06-24 램 리써치 코포레이션 멀티-스테이션 반도체 프로세싱 챔버를 세정하기 위한 장치들
USD1114751S1 (en) * 2021-10-18 2026-02-24 Lam Research Corporation Hub with gas deflectors
CN118891705A (zh) 2021-11-23 2024-11-01 朗姆研究公司 用于清洁多站半导体处理室的装置和技术
JP1746404S (ja) * 2023-01-11 2023-06-15 サセプタカバーベース
JP1760960S (https=) * 2023-06-12 2024-01-10

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
US6108491A (en) * 1998-10-30 2000-08-22 Applied Materials, Inc. Dual surface reflector
JP3859072B2 (ja) * 2001-03-08 2006-12-20 信越半導体株式会社 熱線反射材料及びそれを用いた加熱装置
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
TWD174921S (zh) * 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
JP1565116S (https=) * 2016-02-10 2016-12-12
US10283637B2 (en) * 2016-07-18 2019-05-07 Taiwan Semiconductor Manufacturing Co, Ltd. Individually-tunable heat reflectors in an EPI-growth system
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
JP1624353S (https=) 2018-07-19 2019-02-12
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
JP1706320S (https=) * 2021-06-28 2022-01-31

Also Published As

Publication number Publication date
USD1053157S1 (en) 2024-12-03
TWD236269S (zh) 2025-02-11

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