TWD231087S

TWD231087S - Light emitting chip scale package

Info

Publication number: TWD231087S
Application number: TW112303770F
Authority: TW
Inventors: 愛德華貝利
Original assignee: 加拿大商汽車系統麥格納外飾公司分支 (加拿大); 加拿大商汽車系統麥格納外飾公司分支
Priority date: 2023-02-08
Filing date: 2023-07-26
Publication date: 2024-05-01

Abstract

【物品用途】;本設計為一種發光晶片，特別是指一種將多個LED(Light-Emitting Diode,發光二極體)封裝一體之發光晶片尺寸封裝的造型新設計。;【設計說明】;請參閱立體圖、前視圖及左側視圖，本設計發光晶片尺寸封裝(Light Emitting Chip Scale Package)包含三個並列的LED晶片及一個設置在所述三個LED晶片下方的第四個LED晶片，其中所述三個直立並列的LED晶片能夠發射出紅色、綠色和藍色的光線，而第四個LED晶片為橫置並與所述三個LED晶片保持視當間距，能夠發射出白色光線，值得一提的是，所述第四個LED晶片的外圍四周設置圍繞層，用於減少所述三個LED晶片所發射的光線與第四個LED晶片所發射光線的撞擊，四個晶片整體封裝後單一形體的外觀提供具有簡潔視感與特定效果的融合設計。;綜上所述，本設計發光晶片尺寸封裝確為新穎獨特，爰依法提出申請，本申請圖面上所示虛線部分為本設計發光晶片尺寸封裝不主張設計的部分。[Use of Article]; This design is a light-emitting chip, and in particular refers to a new design of a light-emitting chip size package that packages multiple LEDs (Light-Emitting Diodes) into one package. ;【Design Description】;Please refer to the three-dimensional diagram, front view and left side view. The light emitting chip scale package (Light Emitting Chip Scale Package) of this design includes three parallel LED chips and a fourth LED chip arranged below the three LED chips, wherein the three vertically parallel LED chips can emit red, green and blue light, and the fourth LED chip is horizontally arranged and keeps an apparent distance from the three LED chips, and can emit white light. It is worth mentioning that a surrounding layer is arranged around the outer periphery of the fourth LED chip to reduce the collision between the light emitted by the three LED chips and the light emitted by the fourth LED chip. After the four chips are packaged as a whole, the appearance of a single shape provides a fusion design with a simple visual sense and a specific effect. ;In summary, the light-emitting chip size package of this design is indeed novel and unique, so an application is filed in accordance with the law. The dotted line portion shown in the drawing of this application is the portion of the light-emitting chip size package of this design that is not claimed to be designed.

Description

LED size package

本設計為一種發光晶片，特別是指一種將多個LED(Light-Emitting Diode,發光二極體)封裝一體之發光晶片尺寸封裝的造型新設計。 This design is a light-emitting chip, specifically a new design that packages multiple LEDs (Light-Emitting Diodes) into a light-emitting chip size package.

請參閱立體圖、前視圖及左側視圖，本設計發光晶片尺寸封裝(Light Emitting Chip Scale Package)包含三個並列的LED晶片及一個設置在所述三個LED晶片下方的第四個LED晶片，其中所述三個直立並列的LED晶片能夠發射出紅色、綠色和藍色的光線，而第四個LED晶片為橫置並與所述三個LED晶片保持視當間距，能夠發射出白色光線，值得一提的是，所述第四個LED晶片的外圍四周設置圍繞層，用於減少所述三個LED晶片所發射的光線與第四個LED晶片所發射光線的撞擊，四個晶片整體封裝後單一形體的外觀提供具有簡潔視感與特定效果的融合設計。 Please refer to the three-dimensional diagram, front view and left side view. The light emitting chip scale package (Light Emitting Chip Scale Package) of this design includes three parallel LED chips and a fourth LED chip arranged below the three LED chips. The three vertical parallel LED chips can emit red, green and blue light, while the fourth LED chip is horizontally arranged and maintains an apparent distance from the three LED chips, and can emit white light. It is worth mentioning that the surrounding layer is arranged around the outer periphery of the fourth LED chip to reduce the collision between the light emitted by the three LED chips and the light emitted by the fourth LED chip. The appearance of a single shape after the four chips are packaged as a whole provides a fusion design with a simple visual sense and a specific effect.

綜上所述，本設計發光晶片尺寸封裝確為新穎獨特，爰依法提出申請，本申請圖面上所示虛線部分為本設計發光晶片尺寸封裝不主張設計的部分。 In summary, the light-emitting chip size package of this design is indeed novel and unique, so an application is filed in accordance with the law. The dotted line part shown in the application drawing is the part of the light-emitting chip size package of this design that is not claimed to be designed.