TWD214778S - 半導體製造裝置用保溫筒散熱片（四） - Google Patents

半導體製造裝置用保溫筒散熱片（四） Download PDF

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Publication number
TWD214778S
TWD214778S TW109303830F TW109303830F TWD214778S TW D214778 S TWD214778 S TW D214778S TW 109303830 F TW109303830 F TW 109303830F TW 109303830 F TW109303830 F TW 109303830F TW D214778 S TWD214778 S TW D214778S
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TW
Taiwan
Prior art keywords
heat sink
state
semiconductor manufacturing
showing
manufacturing equipment
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Application number
TW109303830F
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English (en)
Chinese (zh)
Inventor
溫清振
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日商東京威力科創股份有限公司
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Publication of TWD214778S publication Critical patent/TWD214778S/zh

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TW109303830F 2020-01-22 2020-07-13 半導體製造裝置用保溫筒散熱片（四） TWD214778S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-001044 2020-01-22
JPD2020-1044F JP1683389S (enExample) 2020-01-22 2020-01-22

Publications (1)

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TWD214778S true TWD214778S (zh) 2021-10-21

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TW109303830F TWD214778S (zh) 2020-01-22 2020-07-13 半導體製造裝置用保溫筒散熱片（四）

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JP (1) JP1683389S (enExample)
TW (1) TWD214778S (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD239446S (zh) 2023-03-13 2025-07-21 日商國際電氣股份有限公司 (日本) 基板處理裝置用隔熱環之部分

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN301238670S (zh) 2009-03-06 2010-05-26 东京毅力科创株式会社 半导体制造装置用保温筒散热片

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN301238670S (zh) 2009-03-06 2010-05-26 东京毅力科创株式会社 半导体制造装置用保温筒散热片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD239446S (zh) 2023-03-13 2025-07-21 日商國際電氣股份有限公司 (日本) 基板處理裝置用隔熱環之部分

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JP1683389S (enExample) 2021-04-12

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