TWD214286S - Part of elastic film for semiconductor wafer polishing - Google Patents
Part of elastic film for semiconductor wafer polishing Download PDFInfo
- Publication number
- TWD214286S TWD214286S TW110301302F TW110301302F TWD214286S TW D214286 S TWD214286 S TW D214286S TW 110301302 F TW110301302 F TW 110301302F TW 110301302 F TW110301302 F TW 110301302F TW D214286 S TWD214286 S TW D214286S
- Authority
- TW
- Taiwan
- Prior art keywords
- article
- view
- wafer polishing
- semiconductor wafer
- membrane
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract description 7
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 239000012528 membrane Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007517 polishing process Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
Images
Abstract
【物品用途】;本部分設計的物品是半導體晶圓研磨用彈性膜(membrane)，為一種應用於製造半導體等的晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使彈性膜面朝向正面側膨脹，用以將配置在本物品的正面側的晶圓的單面朝向研磨墊推壓。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;仰視圖與俯視圖相對稱，仰視圖省略。左側視圖與右側視圖相對稱，左側視圖省略。[Use of article]; The article designed in this section is an elastic membrane (membrane) for semiconductor wafer polishing. It is a kind of elastic membrane (membrane) used in the wafer polishing process of manufacturing semiconductors. It is installed inside the substrate holding ring of the polishing device and is removed from the device side. Gas such as air is supplied to the back side of the article to expand the elastic membrane surface toward the front side, thereby pressing one side of the wafer placed on the front side of the article toward the polishing pad. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. ;The bottom view is symmetrical to the top view, and the bottom view is omitted. The left view is symmetrical to the right view, and the left view is omitted.
Description
本部分設計的物品是半導體晶圓研磨用彈性膜(membrane)，為一種應用於製造半導體等的晶圓研磨工序中，安裝在研磨裝置的基板保持環內側，從裝置側將空氣等氣體供給到本物品的背面側使彈性膜面朝向正面側膨脹，用以將配置在本物品的正面側的晶圓的單面朝向研磨墊推壓。The article designed in this part is an elastic membrane for semiconductor wafer polishing (membrane), which is used in the wafer polishing process of manufacturing semiconductors. It is installed inside the substrate holding ring of the polishing device and supplies air and other gases from the device side. The back side of the article expands the elastic film surface toward the front side to push the single side of the wafer arranged on the front side of the article toward the polishing pad.
圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line exposed in the diagram is the part that is not recommended for design in this case.
仰視圖與俯視圖相對稱，仰視圖省略。左側視圖與右側視圖相對稱，左側視圖省略。The bottom view is symmetrical to the top view, and the bottom view is omitted. The left side view is symmetrical to the right side view, and the left side view is omitted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020019864F JP1683320S (en) | 2020-09-17 | 2020-09-17 | Elastic film for polishing semiconductor wafers |
| JP2020-019864 | 2020-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD214286S true TWD214286S (en) | 2021-09-21 |
Family
ID=81344543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110301302F TWD214286S (en) | 2020-09-17 | 2021-03-16 | Part of elastic film for semiconductor wafer polishing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1683320S (en) |
| TW (1) | TWD214286S (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
-
2020
- 2020-09-17 JP JP2020019864F patent/JP1683320S/en active Active
-
2021
- 2021-03-16 TW TW110301302F patent/TWD214286S/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1683320S (en) | 2021-04-12 |
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