TWD208679S

TWD208679S - Polishing pad for substrate polishing apparatus

Info

Publication number: TWD208679S
Application number: TW108301156F
Authority: TW
Inventors: 木下将毅; 金馬利文
Original assignee: 日商荏原製作所股份有限公司
Priority date: 2018-08-29
Filing date: 2019-02-27
Publication date: 2020-12-11
Also published as: JP1624379S

Abstract

【物品用途】;本設計的物品是研磨墊，為一種安裝在CMP裝置等的研磨台之上，能夠研磨半導體晶圓等之基板的研磨墊。;【設計說明】;本物品係在平面上形成同心圓狀的溝。本案所主張的部分，是三個孔與其周圍的平坦面部，該三個孔部，是為了從設置在底面側的光源來照射光線，利用光學頭來感受反射到進行研磨的基板表面的反射光來測定基板的膜厚所設置的，功能上具有一體性，必須將三個構成一組設置在圖示位置。;圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。;後視圖與前視圖相同，後視圖省略。;右側視圖與左側視圖相對稱，右側視圖省略。[Use of article] The article of this design is a polishing pad, which is installed on a polishing table of a CMP device and can polish substrates such as semiconductor wafers. ;[Design Description];This product is designed to form concentric grooves on a flat surface. The part proposed in this case is the three holes and the flat surface around them. These three holes are used to irradiate light from the light source installed on the bottom side, and the optical head is used to sense the reflected light reflected on the surface of the substrate being polished. The devices used to measure the film thickness of the substrate are functionally integrated and must be installed in groups of three at the positions shown in the figure. ;The dotted line portion disclosed in the drawing is the part of the case that does not claim design; the one-point chain line in the drawing is surrounded by the scope of the claim, and the one-point chain line itself is the part of the case that does not claim design. ;The rear view is the same as the front view, and the rear view is omitted. ;The right view is symmetrical to the left view, and the right view is omitted.

Description

Part of the polishing pad

本設計的物品是研磨墊，為一種安裝在CMP裝置等的研磨台之上，能夠研磨半導體晶圓等之基板的研磨墊。The article of this design is a polishing pad, which is mounted on a polishing table such as a CMP device and can polish substrates such as semiconductor wafers.

本物品係在平面上形成同心圓狀的溝。本案所主張的部分，是三個孔與其周圍的平坦面部，該三個孔部，是為了從設置在底面側的光源來照射光線，利用光學頭來感受反射到進行研磨的基板表面的反射光來測定基板的膜厚所設置的，功能上具有一體性，必須將三個構成一組設置在圖示位置。This article is formed with concentric grooves on the plane. The part claimed in this case is the three holes and the surrounding flat surface. The three holes are used to irradiate light from the light source installed on the bottom side and use the optical head to sense the reflected light reflected on the surface of the substrate to be polished. The setting to measure the film thickness of the substrate is functionally integrated, and a set of three components must be set at the position shown in the figure.

圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The dotted line exposed in the diagram is the part of the case that does not advocate design; the one-point chain line in the diagram defines the scope of the case, and the dotted line itself is the part of the case that does not advocate design.

後視圖與前視圖相同，後視圖省略。The rear view is the same as the front view, and the rear view is omitted.

右側視圖與左側視圖相對稱，右側視圖省略。The right side view is symmetrical to the left side view, the right side view is omitted.