TWD208385S - Liquid precision discharge machine - Google Patents
Liquid precision discharge machine Download PDFInfo
- Publication number
- TWD208385S TWD208385S TW108307017F TW108307017F TWD208385S TW D208385 S TWD208385 S TW D208385S TW 108307017 F TW108307017 F TW 108307017F TW 108307017 F TW108307017 F TW 108307017F TW D208385 S TWD208385 S TW D208385S
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- precision
- design
- liquid supply
- dispensing machine
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title abstract description 19
- 238000007599 discharging Methods 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本物品係一種液體精密吐出機，其係於印刷基板等之半導體產品、電子機器、精密機器、光學機器、家電產品等之製造步驟中，用以將膏狀焊料、銀膏、LED螢光體、接著劑等之液體超微量吐出至IC或高密度安裝基板、其他精密零件等並進行接著、填充、塗佈或者灌注等之處理。該液體精密吐出機，係搭載於桌上機器人或自動機的頭部，且與桌上機器人或自動機連動，並將注射器等之液體供給源所供給之上述液體從噴嘴以高速且高精準度吐出至被處理體。又，該液體精密吐出機，主要係由與驅動控制部、驅動部、注射器等之液體供給源連結之送液部至噴嘴之液體通道所構成。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。以實線表示之部分為部分設計之主張設計部分。[Use of article]: This article is a liquid precision dispensing machine, which is used in the manufacturing steps of semiconductor products such as printed circuit boards, electronic equipment, precision equipment, optical equipment, home appliances, etc., to paste solder and silver paste. , discharging ultra-micron amounts of liquids such as LED phosphors and adhesives onto ICs, high-density mounting substrates, and other precision parts, and performing bonding, filling, coating, or pouring. This liquid precision dispensing machine is mounted on the head of a tabletop robot or automatic machine and is linked to the tabletop robot or automatic machine. It dispenses the above-mentioned liquid supplied from a liquid supply source such as a syringe from a nozzle at high speed and with high precision. Spit out to the object to be processed. Furthermore, this precision liquid dispensing machine is mainly composed of a liquid passage from a liquid supply part to a nozzle connected to a liquid supply source such as a drive control part, a drive part, and a syringe. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. The part represented by the solid line is the proposed design part of the partial design.
Description
本物品係一種液體精密吐出機，其係於印刷基板等之半導體產品、電子機器、精密機器、光學機器、家電產品等之製造步驟中，用以將膏狀焊料、銀膏、LED螢光體、接著劑等之液體超微量吐出至IC或高密度安裝基板、其他精密零件等並進行接著、填充、塗佈或者灌注等之處理。該液體精密吐出機，係搭載於桌上機器人或自動機的頭部，且與桌上機器人或自動機連動，並將注射器等之液體供給源所供給之上述液體從噴嘴以高速且高精準度吐出至被處理體。又，該液體精密吐出機，主要係由與驅動控制部、驅動部、注射器等之液體供給源連結之送液部至噴嘴之液體通道所構成。 This article is a liquid precision discharging machine, which is used in the manufacturing steps of semiconductor products such as printed circuit boards, electronic equipment, precision equipment, optical equipment, household appliances, etc., to paste paste solder, silver paste, LED phosphor , Adhesives and other liquids are discharged to IC, high-density mounting substrates, other precision parts, etc., and then processed by bonding, filling, coating or pouring. The liquid precision discharging machine is mounted on the head of a desktop robot or automatic machine, and is linked with the desktop robot or automatic machine, and supplies the above-mentioned liquid from a liquid supply source such as a syringe from the nozzle with high speed and high precision Spit out to the treated body. In addition, the liquid precision ejection machine is mainly composed of a liquid channel from a liquid supply unit connected to a liquid supply source such as a drive control unit, a drive unit, and a syringe to the nozzle.
圖式所揭露之虛線部分，為本案不主張設計之部分。以實線表示之部分為部分設計之主張設計部分。 The dotted line exposed in the diagram is a part of this case that does not advocate design. The part indicated by the solid line is the part of the design proposal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108307017F TWD208385S (en) | 2019-11-14 | 2019-11-14 | Liquid precision discharge machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108307017F TWD208385S (en) | 2019-11-14 | 2019-11-14 | Liquid precision discharge machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD208385S true TWD208385S (en) | 2020-11-21 |
Family
ID=89023851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108307017F TWD208385S (en) | 2019-11-14 | 2019-11-14 | Liquid precision discharge machine |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD208385S (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI402104B (en) | 2006-12-04 | 2013-07-21 | Musashi Engineering Inc | Liquid material discharge device |
| TWI580479B (en) | 2009-04-24 | 2017-05-01 | Musashi Engineering Inc | A nozzle rotating mechanism and a coating device provided with the same |
-
2019
- 2019-11-14 TW TW108307017F patent/TWD208385S/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI402104B (en) | 2006-12-04 | 2013-07-21 | Musashi Engineering Inc | Liquid material discharge device |
| TWI580479B (en) | 2009-04-24 | 2017-05-01 | Musashi Engineering Inc | A nozzle rotating mechanism and a coating device provided with the same |
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