CN105336823A - LED dispensing method and LED packaging method - Google Patents
LED dispensing method and LED packaging method Download PDFInfo
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- CN105336823A CN105336823A CN201510687703.0A CN201510687703A CN105336823A CN 105336823 A CN105336823 A CN 105336823A CN 201510687703 A CN201510687703 A CN 201510687703A CN 105336823 A CN105336823 A CN 105336823A
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- dispensing method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses an LED dispensing method and an LED packaging method. The LED dispensing method comprises the steps: at the beginning, a dispensing head moves downward toward a first position in an LED support; the dispensing head is controlled to movably push glue from the first position to the blank position in the support; and the dispensing head lifts vertically and then moves to the other LED to dispense. The LED packaging method comprises solid phase crystallization, wire bonding and the above LED dispensing method. The LED dispensing method and the LED packaging method enable the packaging glue to be more uniformly distributed in a dispensing area and enable the fluorescent powder to be more uniformly distributed in the dispensing area so as to improve the uniformity for bright dipping and the efficiency for bright dipping, to prevent the glue-spilling phenomenon and to improve the production efficiency.
Description
Technical field
The present invention relates to a kind of LED technology, especially a kind of LED dispensing method and method for packing.
Background technology
Existing LED comprises: die bond, bonding wire, some glue, light splitting and packaging and other steps, existing dispensing method be by packaging plastic is housed Glue dripping head perpendicular alignmnet LED chip above, then control plastic emitting, then move the some glue that Glue dripping head carries out next LED chip vertically upward.Carry out plastic emitting above this aligning LED chip, due to PPA support bowl cup inside, to drag for groove lower than the position of silver coating, if put and carry out a glue due to the existence of not mean place from non-slot of dragging for packaging plastic can be made Uniform Flow and occurring to overflow the phenomenon of glue.
In order to solve the problem, a kind of dispensing method of new appearance, the Glue dripping head being about to be equipped with packaging plastic vertically declines, and aligning LED chip plastic stent is interior to be put near dragging for slot, then plastic emitting is controlled, then rise Glue dripping head, finally move Glue dripping head and carry out a glue operation to another LED chip position, but because a glue position is near plastic rubber bracket position, and carry out disposable plastic emitting in this position, after plastic emitting, packaging plastic combines with the side near plastic rubber bracket and occurs the glue that overflows, viscose glue phenomenon, thus affect LED outward appearance, and the glue that overflows, viscose glue cannot hold the problem of support by causing suction nozzle in subsequent movement stent procedures, reduce production efficiency.
Be 200610049704.3 applyings date be 2006.3.5 publication date in Chinese Patent Application No. be in the patent documentation of 2007.9.5, disclose a kind of heavy-duty diode dispensing method, and specifically disclose syringe needle and vertically decline-the gluing process that vertically rises of plastic squeeze-syringe needle, this gluing process is to product not damaged, there will not be excessive glue, few glue, the bad phenomenon such as bubble, but, above-mentioned one-point type point glue is adopted for same support, packaging plastic is needed to flow freely from a glue position to other positions, but packaging plastic has certain viscosity, therefore, be difficult to ensure that packaging plastic flowing is evenly distributed in the bowl cup of support, and, for phosphor gel, when phosphor gel is in flow process, even if phosphor gel distribution is comparatively even, but fluorescent material skewness may be caused, like this, can to photochromic, the uniformity of brightness has impact, also impact is had on light extraction efficiency.
In addition, be 201210250161.7 applyings date be 2012.7.19 publication date in Chinese Patent Application No. be in the patent documentation of 2012.10.31, disclose a kind of efficient LED point glue painting method, comprise making and the gluing process of fluorescent glue, comprise the following steps: step 1: by fluorescent material with join glue and mix, be made into the fluorescent glue of viscosity within the scope of 100-8000Pa.s; Step 2: fluorescent glue step 1 made carries out deaeration, till not having bubble to emerge in fluorescent glue; Step 3: fluorescent glue step 2 made is poured in the some packing element of a glue coating machine, by the control program set-point glue step on this glue coating machine, and carries out a glue; Wherein, the pin mouth wall thickness range of dispensing needle head is 0.02-0.10mm; The thickness range of the rack plate of some glue is 0.3-0.5mm; Step 4: baking, selects into the roasting time according to the viscosity of different fluorescent glue, and the most progress time of baking is no more than 15min.Control program in described step 3 comprises following some glue step: step 31: carry out initialization to a glue coating machine by pre-process program; Step 32: carry out stereoscopic three-dimensional point flowing mode point glue by the movement of the some glue arm of control point needle head: the moving direction of some glue arm is as follows: a glue arm is moved upwards up to preset height by initial position, be moved horizontally to directly over first row first LEDs chip bowl cup again, then a glue arm is moved downward to dispensing needle head distance bowl cup peak 0.8-3.0mm, then applies fluorescent glue; Step 33: move forward into line linearity point flowing mode point glue by the some glue arm of control point needle head: after first row first LEDs chip having been applied by step 32, a glue arm is moved horizontally to directly over first row second LEDs chip bowl cup, again applies fluorescent glue; And repeat this Linear Points flowing mode point glue, until last LEDs chip of first row has applied; Step 34: carry out the dynamic and linear crawl of two-dimensional points by the movement of the some glue arm of control point needle head and to combine mode point glue: after last LEDs chip of first row having been applied by step 33, a glue arm is moved horizontally to directly over last LEDs chip of second row, again applies fluorescent glue; Be moved horizontally to by a glue arm directly over second row LEDs chip second from the bottom, coating fluorescent glue, repeats this Linear Points flowing mode point glue, until second row first LEDs chip has applied again; Step 35: repeat the two-dimentional crawl of step 34 and linear crawl and to combine mode point glue, to the last last LEDs chip of row apply, and will put the reset of glue arm.In technique scheme, Linear Points flowing mode point glue is moved horizontally although have employed between two LED chips, but for the LED chip of single, or, packaging plastic skewness, fluorescent material phenomenon pockety in same LED chip can be there is equally in the mode of the fixing point point glue adopted.
Equally, it is the method also disclosing a kind of glue in the patent documentation of 201310742600.0 in China Patent No., although this dispensing method has carried out the action of lateral translation within the scope of bowl cup, but this action is carried out after syringe needle vertically rises, its objective is the homing action in order to change syringe needle after a glue, make residual colloid on dispensing needle head and be not that whole glue amount is trapped in bowl cup, and be not in a glue process, realize portable some glue, therefore, above-mentioned technical problem can be there is equally.
Summary of the invention
In order to allow packaging plastic distribute more even in glue application region, allowing fluorescent material be evenly distributed in glue application region, improving the uniformity of bright dipping, improve light extraction efficiency, prevent excessive glue phenomenon, enhance productivity, the invention provides a kind of LED dispensing method and LED encapsulation method.
For achieving the above object, a kind of LED dispensing method, comprises the following steps: when (1) starts, and Glue dripping head declines facing to the primary importance of glue application region in the support of a LED; (2) Glue dripping head is controlled from the portable plastic emitting of the blank position of glue application region in primary importance upwards described support; (3) Glue dripping head vertically rises and shifts to another LED and carries out a glue.
Above-mentioned LED dispensing method, because Glue dripping head first declines facing to primary importance, then Glue dripping head is allowed from primary importance to the portable plastic emitting of the blank position of glue application region in above-mentioned support, like this, the distribution of packaging plastic in glue application region is mainly realized by Glue dripping head mobile plastic emitting in support, and be not realize by the flowing of packaging plastic in glue application region, packaging plastic is not easy, by the viscosity of packaging plastic and the restriction of supporting structure, to make packaging plastic being evenly distributed in glue application region in the distribution of glue application region; In addition, packaging plastic is mixed in the packing element with Glue dripping head must be more even, when adopting above-mentioned dispensing method, if be mixed with fluorescent material in packaging plastic, in a glue process, packaging plastic then can be encapsulated in glue application region according to the mixture homogeneity in packing element substantially, can not be inconsistent and affect fluorescent material being uniformly distributed in glue application region because of the mobility of fluorescent material and other glue.Therefore, LED dispensing method of the present invention and LED technique, can allow packaging plastic distribute in glue application region more even, allow fluorescent material be evenly distributed in glue application region, improves the uniformity of bright dipping, improves light extraction efficiency, prevent excessive glue phenomenon, enhance productivity.
Further, described primary importance is drag for slot in support to put, and drags for the silver coating of groove lower than support.Put and carry out the glue existence solved due to not mean place from dragging for slot packaging plastic cannot Uniform Flow and occurring to be overflow the phenomenon of glue.
As improvement, described primary importance is near the marginal position of polarity in support.Owing to carrying out a glue near polarity line of demarcation place thus excessive glue phenomenon can prevented.
As improvement, step (2) specifically comprises: control Glue dripping head carries out the first glue in primary importance and measures glue within the very first time, then within the second time, carry out the plastic emitting of the second glue amount to the blank position of glue application region in support from primary importance, the first glue amount is less than or equal to the second glue amount.For same LED, owing to carrying out portable some glue again after employing first some upright position thus making partial encapsulation glue away from the position of vertical point glue, to prevent from causing the problem of the optical effect affecting support useful life and LED to occur owing to too much making packaging plastic and support too much contact at same point packaging plastic.
As improvement, step (2) specifically comprises: control the blank position movable type equably plastic emitting of Glue dripping head from primary importance to glue application region in support.Owing to adopting uniformity movable type point glue, can handled easily while the optical effect improving support useful life and LED.
As improvement, described blank position is that in support, glue application region, away from the position of gold thread and chip, thus improves the light-out effect of LED further while ensureing not affect gold thread and chip.
As improvement, described primary importance is identical to another LED moving direction from a LED with Glue dripping head to blank position moving direction in support.Because in a LED support, moving direction is identical with two LED moving directions, thus can increase work efficiency further.
Present invention also offers a kind of LED encapsulation method, before being included in above-mentioned LED dispensing method, carry out die bond, bonding wire.
Above-mentioned LED encapsulation method, because Glue dripping head first declines facing to primary importance, then Glue dripping head is allowed from primary importance to the portable plastic emitting of the blank position of glue application region in above-mentioned support, like this, the distribution of packaging plastic in glue application region is mainly realized by Glue dripping head mobile plastic emitting in support, and be not realize by the flowing of packaging plastic in glue application region, packaging plastic is not easy, by the viscosity of packaging plastic and the restriction of supporting structure, to make packaging plastic being evenly distributed in glue application region in the distribution of glue application region; In addition, packaging plastic is mixed in the packing element with Glue dripping head must be more even, when adopting above-mentioned dispensing method, if be mixed with fluorescent material in packaging plastic, in a glue process, packaging plastic then can be encapsulated in glue application region according to the mixture homogeneity in packing element substantially, can not be inconsistent and affect fluorescent material being uniformly distributed in glue application region because of the mobility of fluorescent material and other glue.Therefore, LED dispensing method of the present invention and LED technique, can allow packaging plastic distribute in glue application region more even, allow fluorescent material be evenly distributed in glue application region, improves the uniformity of bright dipping, improves light extraction efficiency, prevent excessive glue phenomenon, enhance productivity.
As improvement, described die bond step specifically comprises: carry out plasma cleaning to support and make rack surface alligatoring.By before chip is fixed on support, plasma cleaning process is carried out to support and makes rack surface alligatoring, thus on the one hand can the advantageously diffusion of elargol when die bond, thus reduce the thickness of elargol, make the follow-up diffusion being convenient to packaging plastic when putting packaging plastic again reduce the generation of viscose glue situation further on the other hand.
As improvement, carrying out support also comprising after plasma cleaning makes rack surface roughening step: carry out the examination of water droplet angular measurement to support, if reach default requirement, chip is fixed on support.Tried by water droplet angular measurement, article on plasma cleaning performance is verified, thus effectively controls the thickness of elargol.
Accompanying drawing explanation
Fig. 1 is LED structure schematic diagram of the present invention.
Fig. 2 is the downward schematic diagram of the present invention one LED structure.
Fig. 3 is the flow chart of a kind of LED dispensing method of the present invention.
Fig. 4 is the flow chart of a kind of LED encapsulation method of the present invention.
Embodiment
Below in conjunction with Figure of description, the present invention is further elaborated.
Embodiment 1.
As shown in Figure 1,2 and 3, the embodiment of the present invention provides a kind of LED dispensing method, first, deployed packaging plastic is loaded in the packing element of Glue dripping head 100, then the packaging plastic in packing element carries out waste discharge bubble and vacuumizes process, the parameter such as Glue dripping head 100 gel quantity and some glue height, some glue position is set, starting point glue according to the specification of product.As shown in Figure 1, Glue dripping head 100 moves to above a LED1, and the primary importance of the corresponding LED of Glue dripping head 100 moves vertically downward, this primary importance be LED support 2 in drag for slot and put 4, drag for the silver coating of groove 4 lower than support 2, certainly, primary importance also can be LED support 2 in position, polarity line of demarcation, when Glue dripping head 100 moves to the some glue height determined, as long as some glue height ensures the height exceeding chip 3, control to start plastic emitting, within the very first time, carry out the first glue measure glue, then to move from primary importance to glue application region in support 200 blank position at the second time controling Glue dripping head 100 and carry out the second glue and measure glue, first glue amount is less than or equal to the second glue amount, for same LED, owing to carrying out portable some glue again after employing first some upright position thus making partial encapsulation glue away from the position of vertical point glue, to prevent from causing the problem of the optical effect affecting support useful life and LED to occur owing to too much making packaging plastic and support too much contact at same point packaging plastic.Primary importance is identical to another LED moving direction from a LED with Glue dripping head to blank position moving direction in support, thus can increase work efficiency further.Described blank position is the position away from chip 3, gold thread, thus improves the light-out effect of LED further while ensureing not affect gold thread and chip.The very first time is optimally 0.5-3 second, and the second time deducted the very first time by every LEDs point glue time and determines, every LEDs point glue time can be determined divided by plastic emitting speed according to setting gel quantity.Then Glue dripping head 100 moves vertically upward at blank position, moves to another LED again and carry out above-mentioned single led glue operation until complete the operation of a collection of LED point glue when moving on to Glue dripping head height.
In the present embodiment, because Glue dripping head 100 first declines facing to primary importance, then Glue dripping head 100 is allowed from primary importance to the portable plastic emitting of the blank position of glue application region 200 in above-mentioned support, like this, the distribution of packaging plastic in glue application region 200 is mainly realized by the mobile plastic emitting of Glue dripping head 100, and be not realize by the flowing of packaging plastic in glue application region 200, packaging plastic is not easy, by the viscosity of packaging plastic and the restriction of supporting structure, to make packaging plastic being evenly distributed in glue application region in the distribution of glue application region 200; In addition, packaging plastic is mixed in the packing element with Glue dripping head 100 must be more even, when adopting above-mentioned dispensing method, if be mixed with fluorescent material in packaging plastic, in a glue process, packaging plastic then can be encapsulated in glue application region according to the mixture homogeneity in packing element substantially, can not be inconsistent and affect fluorescent material being uniformly distributed in glue application region because of the mobility of fluorescent material and other glue.Therefore, LED dispensing method of the present invention and LED technique, can allow packaging plastic distribute in glue application region more even, allow fluorescent material be evenly distributed in glue application region, improves the uniformity of bright dipping, improves light extraction efficiency, prevent excessive glue phenomenon, enhance productivity.
Put 4 and carry out the glue existence solved due to not mean place from dragging for slot packaging plastic cannot Uniform Flow and occurring to be overflow the phenomenon of glue.
Embodiment 2.
The difference of another embodiment of the present invention and embodiment 1 is: control, in portable some glue process, to carry out uniformity and move and complete a glue after Glue dripping head 100 vertically decline in support 2.Namely be plastic emitting equably from primary importance to the blank position moving process of glue application region 200, handled easily while light-out effect being improved like this.
Embodiment 3.
As shown in Figure 4, the flow chart of a kind of LED encapsulation method of the present invention, the method comprises: die bond, bonding wire and LED dispensing method.Wherein die bond step specifically comprises: carry out plasma cleaning to support 2 and make rack surface alligatoring, then by the examination of water droplet angular measurement, support 2 surface coarsening degree is tested, whether preset value is reached with Liquid contact angle particular by test bracket 2 surface, as being less than 85 degree, in this way, then chip 3 is fixed on support 2, then enters bonding wire, some glue, light splitting and packaging and other steps; Bonding wire, light splitting and packaging can adopt existing mode to realize; If not, then again carry out plasma cleaning, if do not satisfied condition after plasma cleaning three times, judge that this support is defective.Rack surface alligatoring is made to be convenient to the flowing of elargol in die bond process thus the thickness of further minimizing elargol owing to carrying out plasma cleaning to support 2 before being fixed on support 2 by chip 3, reduce thermal resistance, on the other hand owing to strengthening the flowing of packaging plastic when support 2 has rough surface thus makes invocation point packaging plastic, the possibility of further minimizing support viscose glue, product appearance is good-looking, and improves manufacture efficiency.
Wherein, as shown in Figure 1,2 and 3, LED dispensing method is: first, deployed packaging plastic is loaded in the packing element of Glue dripping head 100, then the packaging plastic in packing element carries out waste discharge bubble and vacuumizes process, the parameter such as Glue dripping head 100 gel quantity and some glue height, some glue position is set, starting point glue according to the specification of product.As shown in Figure 1, Glue dripping head 100 moves to above a LED1, and the primary importance of the corresponding LED of Glue dripping head 100 moves vertically downward, this primary importance be LED support 2 in drag for slot and put 4, drag for the silver coating of groove 4 lower than support 2, certainly, primary importance also can be LED support 2 in position, polarity line of demarcation, when Glue dripping head 100 moves to the some glue height determined, as long as some glue height ensures the height exceeding chip 3, control to start plastic emitting, within the very first time, carry out the first glue measure glue, then to move from primary importance to glue application region in support 200 blank position at the second time controling Glue dripping head 100 and carry out the second glue and measure glue, Glue dripping head 100 is when mobile plastic emitting, even plastic emitting or the first glue amount are less than the second glue amount, for same LED, owing to carrying out portable some glue again after employing first some upright position thus making partial encapsulation glue away from the position of vertical point glue, to prevent from causing the problem of the optical effect affecting support useful life and LED to occur owing to too much making packaging plastic and support too much contact at same point packaging plastic.Primary importance is identical to another LED moving direction from a LED with Glue dripping head to blank position moving direction in support, thus can increase work efficiency further.Described blank position is the position away from chip 3, gold thread, thus improves the light-out effect of LED further while ensureing not affect gold thread and chip.The very first time is optimally 0.5-3 second, and the second time deducted the very first time by every LEDs point glue time and determines, every LEDs point glue time can be determined divided by plastic emitting speed according to setting gel quantity.Then Glue dripping head 100 moves vertically upward at blank position, moves to another LED again and carry out above-mentioned single led glue operation until complete the operation of a collection of LED point glue when moving on to Glue dripping head height.
In the present embodiment, because Glue dripping head 100 first declines facing to primary importance, then Glue dripping head 100 is allowed from primary importance to the portable plastic emitting of the blank position of glue application region 200 in above-mentioned support, like this, the distribution of packaging plastic in glue application region 200 is mainly realized by the mobile plastic emitting of Glue dripping head 100, and be not realize by the flowing of packaging plastic in glue application region 200, packaging plastic is not easy, by the viscosity of packaging plastic and the restriction of supporting structure, to make packaging plastic being evenly distributed in glue application region in the distribution of glue application region 200; In addition, packaging plastic is mixed in the packing element with Glue dripping head 100 must be more even, when adopting above-mentioned dispensing method, if be mixed with fluorescent material in packaging plastic, in a glue process, packaging plastic then can be encapsulated in glue application region according to the mixture homogeneity in packing element substantially, can not be inconsistent and affect fluorescent material being uniformly distributed in glue application region because of the mobility of fluorescent material and other glue.Therefore, LED dispensing method of the present invention and LED technique, can allow packaging plastic distribute in glue application region more even, allow fluorescent material be evenly distributed in glue application region, improves the uniformity of bright dipping, improves light extraction efficiency, prevent excessive glue phenomenon, enhance productivity.
Put 4 and carry out the glue existence solved due to not mean place from dragging for slot packaging plastic cannot Uniform Flow and occurring to be overflow the phenomenon of glue.
Above-mentioned execution mode is only and illustrates from general idea, modular construction and practical function the present invention, and the some improvement made under all prerequisites not departing from design philosophy of the present invention all belong to protection scope of the present invention.
Claims (10)
1. a LED dispensing method, is characterized in that: comprise the following steps: when (1) starts, and Glue dripping head declines facing to the primary importance of glue application region in the support of a LED; (2) Glue dripping head is controlled from primary importance to the portable plastic emitting of the blank position of glue application region in described support; (3) Glue dripping head vertically rises and shifts to another LED and carries out a glue.
2. LED dispensing method according to claim 1, is characterized in that: described primary importance is drag for slot in support to put, and drags for the silver coating of groove lower than support.
3. LED dispensing method according to claim 2, is characterized in that: described primary importance is near the marginal position of polarity in support.
4. LED dispensing method according to claim 1, it is characterized in that: step (2) specifically comprises: control Glue dripping head carries out the first glue in primary importance and measures glue within the very first time, then within the second time, carry out the plastic emitting of the second glue amount to the blank position of glue application region in support from primary importance, the first glue amount is less than or equal to the second glue amount.
5. LED dispensing method according to claim 1, is characterized in that: step (2) specifically comprises: control the blank position movable type equably plastic emitting of Glue dripping head from primary importance to glue application region in support.
6. LED dispensing method according to claim 1, is characterized in that: described blank position be in support glue application region away from the position of gold thread and chip.
7. LED dispensing method according to claim 1, is characterized in that: described primary importance is identical to another LED moving direction from a LED with Glue dripping head to blank position moving direction in support.
8. utilize the LED dispensing method described in any one of claim 1-7 to realize a LED encapsulation method, it is characterized in that: before LED dispensing method, carry out die bond, bonding wire.
9. LED encapsulation method according to claim 8, is characterized in that: described die bond step specifically comprises: carry out plasma cleaning to support and make rack surface alligatoring.
10. LED encapsulation method according to claim 9, is characterized in that: carrying out support also comprising after plasma cleaning makes rack surface roughening step: carry out the examination of water droplet angular measurement to support, if reach default requirement, be fixed on support by chip.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108906482A (en) * | 2018-03-30 | 2018-11-30 | 鸿利智汇集团股份有限公司 | A kind of LED dispensing method and point glue equipment |
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| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
| CN102755947A (en) * | 2012-07-19 | 2012-10-31 | 厦门多彩光电子科技有限公司 | Efficient LED (Light-Emitting Diode) gluing and coating method |
| CN103657975A (en) * | 2013-12-30 | 2014-03-26 | 广州市鸿利光电股份有限公司 | Large-power LED glue dispensing method |
| CN103962279A (en) * | 2014-05-28 | 2014-08-06 | 冯子相 | Automatic dispensing machine capable of moving in three directions |
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- 2015-10-22 CN CN201510687703.0A patent/CN105336823B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
| CN102755947A (en) * | 2012-07-19 | 2012-10-31 | 厦门多彩光电子科技有限公司 | Efficient LED (Light-Emitting Diode) gluing and coating method |
| CN103657975A (en) * | 2013-12-30 | 2014-03-26 | 广州市鸿利光电股份有限公司 | Large-power LED glue dispensing method |
| CN103962279A (en) * | 2014-05-28 | 2014-08-06 | 冯子相 | Automatic dispensing machine capable of moving in three directions |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108906482A (en) * | 2018-03-30 | 2018-11-30 | 鸿利智汇集团股份有限公司 | A kind of LED dispensing method and point glue equipment |
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