CN108906482A - A kind of LED dispensing method and point glue equipment - Google Patents
A kind of LED dispensing method and point glue equipment Download PDFInfo
- Publication number
- CN108906482A CN108906482A CN201810291959.3A CN201810291959A CN108906482A CN 108906482 A CN108906482 A CN 108906482A CN 201810291959 A CN201810291959 A CN 201810291959A CN 108906482 A CN108906482 A CN 108906482A
- Authority
- CN
- China
- Prior art keywords
- led
- dripping head
- glue dripping
- galvanic circle
- gold wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
A kind of LED dispensing method and point glue equipment, point glue equipment includes Glue dripping head, Glue dripping head can form galvanic circle with corresponding LED light source, and galvanic circle includes that controller, triggering power supply, LED gold wire and LED substrate, the controller are connect with the movement mechanism of driving Glue dripping head.When Glue dripping head and LED gold wire contact, Glue dripping head forms galvanic circle with corresponding LED light source, and trigger controller control Glue dripping head stops movement.The present invention judges whether Glue dripping head contacts with LED gold wire with the conductive condition of LED light source by detecting Glue dripping head, prevents Glue dripping head from destroying LED gold wire during dispensing, this kind of method is easy to operate, and the repacking of point glue equipment is convenient, at low cost;For LED dispensing, there is unexpected beneficial effect.
Description
Technical field
The present invention relates to LED encapsulation technologies, especially LED dispensing method.
Background technique
The manufacturing process of existing LED packaged light source is generally die bond, bonding wire, dispensing, light splitting and packaging, wherein dispensing be
LED chip surface forms fluorescent adhesive layer comprising needle-based dispensing mode, model formula dispensing mode etc., and needle-based dispensing side
Formula with the advantages such as easy to operate due to being widely used in production, and needle-based dispensing method general process:With glue, incite somebody to action
The glue prepared pours into glue bucket, then the syringe with syringe needle moves down chip surface and the shifting close to die bond bonding wire after good
Dynamic formula plastic emitting, but it is easy to appear the gold threads that syringe needle is pressed onto LED chip when syringe is moved down, so that gold thread fracture shows
As, and then influence the reliability of product connection.In the prior art, such as one kind of Chinese Patent Application No. CN201610250169.1
Internet of Things dispenser, it discloses will be surveyed between high sensor institute measuring point rubber head and object to be processed by the controller in dispenser
Height value be transmitted on mobile phone or computer by wireless network, carry out warning note when measuring height value exception, but this
Kind mode can only detect the height between Glue dripping head and object to be processed, and need that object to be processed is arranged and survey high sensor,
It is complicated for operation;Height detection is carried out for mobile Glue dripping head additionally by high sensor is surveyed, Glue dripping head and machined object
Height between body is in variable condition, so that warning note can not real-time and accurately be carried out, while structure is complicated, cost
It is high.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of LED point glue equipment and dispensing methods, can prevent dispensing
LED gold wire is destroyed in head dispensing moving process, and easy to operate, it is at low cost.
In order to solve the above technical problems, the technical scheme is that:A kind of LED dispensing method, during dispensing, works as a little
When rubber head and LED gold wire contact, Glue dripping head forms galvanic circle with corresponding LED light source, and trigger controller controls Glue dripping head
Stop movement.The present invention judges whether Glue dripping head connects with LED gold wire by the conductive condition of detection Glue dripping head and LED light source
Touching, prevents Glue dripping head from destroying LED gold wire during dispensing, this kind of method is easy to operate, and the repacking of point glue equipment is convenient, cost
It is low;For LED dispensing, there is unexpected beneficial effect.
As an improvement, the galvanic circle includes Glue dripping head, LED gold wire, LED substrate and triggering power supply.
As an improvement, the step of dispensing method, includes:
(1)Glue dripping head is vertically displaced downwardly to the top of LED chip;
(2)Glue dripping head plastic emitting;
(3)Glue dripping head transverse shifting;
(4)Glue dripping head resets;
Step(1)And step(2)In the process, it is detected to whether Glue dripping head contacts with LED gold wire, it can be in LED dispensing process
The occurrence of middle real-time monitoring Glue dripping head and LED gold wire contact situation, prevent Glue dripping head crimping.
As an improvement, after control Glue dripping head stops movement, control Glue dripping head is upward when Glue dripping head touches LED gold wire
Inclination movement.
As an improvement, the galvanic circle further includes alarm, alarm equipment alarm is triggered after the conducting of galvanic circle.
As an improvement, being equipped with current testing device in the galvanic circle, when galvanic circle is connected, galvanic circle is shown
Current value, and determine according to current value the contact electrode of Glue dripping head Yu LED gold wire, LED substrate or LED chip.
As an improvement, triggering power supply according to Glue dripping head when LED light source includes several LED chips connected in series and parallel
Position exports different voltage.
As an improvement, the output voltage values of triggering power supply be Glue dripping head present position and the external cathode of LED light source it
Between LED chip quantity and LED chip forward direction bear the product between voltage.
In order to solve the above technical problems, another technical solution of the present invention is:A kind of LED point glue equipment, including Glue dripping head, point
Rubber head forms galvanic circle with corresponding LED light source, and galvanic circle includes controller, triggers power supply, LED gold wire and LED substrate,
The controller is connect with the movement mechanism of driving Glue dripping head.
The present invention judges whether Glue dripping head contacts with LED gold wire with the conductive condition of LED light source by detecting Glue dripping head,
Prevent Glue dripping head from destroying LED gold wire during dispensing, this kind of method is easy to operate, and the repacking of point glue equipment is convenient, at low cost;
For LED dispensing, there is unexpected beneficial effect.
As an improvement, further including that the current testing device on galvanic circle shows galvanic circle when galvanic circle is connected
Current value, and determine according to current value the contact electrode of Glue dripping head Yu LED gold wire, LED substrate or LED chip.
The beneficial effect of the invention compared with the existing technology is:
The present invention judges whether Glue dripping head contacts with LED gold wire with the conductive condition of LED light source by detecting Glue dripping head, prevents
Glue dripping head destroys LED gold wire during dispensing, this kind of method is easy to operate, and the repacking of point glue equipment is convenient, at low cost, for
For LED dispensing, there is unexpected beneficial effect.
Detailed description of the invention
Fig. 1 is conducting loop structure schematic diagram.
Fig. 2 is the dispensing path profile under rectangle cofferdam.
Fig. 3 is the dispensing path profile under circular cofferdam.
Specific embodiment
The invention is further explained in the following combination with the attached drawings of the specification.
As shown in Figure 1, a kind of LED point glue equipment, including Glue dripping head 1, driving Glue dripping head 1 mobile movement mechanism and control
Device, triggering power supply 2.Glue dripping head 1 is conductive.The LED light source includes LED gold wire 6, LED chip 4 and LED substrate 5, institute
It states controller and is connect with the movement mechanism of Glue dripping head 1 is driven.When Glue dripping head 1 and LED gold wire 6 contact, Glue dripping head 1, triggering electricity
Source 2, LED gold wire 6 and LED substrate 5 form galvanic circle, and Glue dripping head 1 is connected with the anode of triggering power supply 2, and triggering power supply 2 is born
Pole is connected with LED substrate 5, can prevent from charging due to LED substrate in this way and damage LED light when operator is in contact with LED substrate
Source.The galvanic circle further includes alarm 3, and triggering alarm 3 is alarmed after the conducting of galvanic circle.In the galvanic circle
Equipped with current testing device, when galvanic circle is connected, current testing device shows the current value of galvanic circle, and according to current value
Determine the contact electrode of Glue dripping head 1 Yu LED gold wire 6, LED substrate 5 or LED chip 4;According to circuit theory, in galvanic circle
Resistance it is bigger, the current value of galvanic circle is smaller;When Glue dripping head contacts triggering galvanic circle with LED substrate, galvanic circle
In ohmic load be mainly LED substrate and Glue dripping head, the current value of current testing device is I1 at this time;When Glue dripping head and LED
When gold thread contact triggering galvanic circle, the current value of current testing device is I2 at this time;When the electrode of Glue dripping head and LED chip connects
When touching triggering galvanic circle, the current value of current testing device is I3 at this time;It is conductive that Glue dripping head contacts triggering with LED core plate electrode
Ohmic load, which contacts ohmic load in triggering galvanic circle with LED gold wire than Glue dripping head and has more, in circuit is partially:LED chip electricity
Pole and electrode and part gold thread judge Glue dripping head and LED gold wire, LED substrate or LED core with this thus I1 > I2 > I3
The contact electrode of piece, by the method can collect dispensing time point rubber head touching position consequently facilitating Glue dripping head position tune
It is whole.
The voltage value of the triggering power supply 2 is no more than human safety voltage(Such as 36V), or trigger the current value of power supply 2 not
More than human-body safety electric current(Such as 10mA), so that the case where causing operating personnel's electric shock during dispensing generation is prevented, into one
Step, the voltage value for triggering power supply is no more than LED chip breakdown reverse voltage value(Such as 50V), guaranteeing what human body did not geted an electric shock
In the case of prevent from happening on LED chip there are LED chip when backward voltage is breakdown.
LED light source dispensing method, step following steps:
(1)Glue dripping head 1 is vertically displaced downwardly to the top of LED chip 4;
(2)1 plastic emitting of Glue dripping head;
(3)1 transverse shifting of Glue dripping head;
(4)Glue dripping head 1 resets.
Step(1)And step(2)In the process, it is detected to whether Glue dripping head 1 contacts with LED gold wire 6, i.e., before plastic emitting
And it is detected during plastic emitting.
When Glue dripping head 1 touches LED gold wire 6, galvanic circle conducting, and trigger controller sends a signal to Glue dripping head 1
Movement mechanism controls Glue dripping head 1 and stops movement, can prevent from continuing to be moved when Glue dripping head 1 pushes down LED gold wire 6 in this way
Dynamic the case where causing gold thread to collapse;
When Glue dripping head 1 touches LED gold wire 6, after control Glue dripping head 1 stops movement, control Glue dripping head 1 is moved to top is tilted towards
It is dynamic, it can prevent Glue dripping head 1 from moved vertically upward to the gold thread effect of pullling so as to cause the fracture of LED gold wire 6 in this way.
For being equipped with the dispensing method of the COB light source of several LED chips 4 connected in series and parallel:
(1)The circuit structure that COB light source is determined before carrying out dispensing, plans the movement routine of Glue dripping head 1, as shown in Fig. 2, having
The movement routine of the COB light source in rectangle cofferdam is from left to right and then from top to bottom to form the path movement of rectangle;According to determination
Good path carries out dispensing, when Glue dripping head 1 is on the 1st chips, is determined and is triggered according to single chip forward conduction voltage value
The voltage value that power supply 2 exports is single chip forward conduction voltage value;If when on the 2nd chips, according to two chips forward direction
Turn-on voltage is determined as triggering the output voltage values of power supply 2;
(2)The circuit structure that COB light source is determined before carrying out dispensing, plans the movement routine of Glue dripping head 1, as shown in figure 3, having
The movement routine of the COB light source of circular cofferdam is to draw annular to cofferdam direction from cofferdam central point to carry out dispensing;When progress dispensing
When, when such as dispensing to A point, determine that the output voltage values of triggering power supply 2 are single chip forward conduction voltage value;If dispensing is to B
When point, determine that the output voltage values of triggering power supply 2 are two chips forward conduction voltage values;If dispensing is to C point, triggering is determined
The output voltage of power supply 2 is two chips forward conduction voltage values.
When LED light source includes several LED chips 4 connected in series and parallel, triggering power supply 2 is defeated according to the position of Glue dripping head 1
Different voltage out can prevent the output voltage values of triggering power supply are too low to cause LED chip that can not light or trigger power supply in this way
The excessively high generation for leading to LED chip damaged condition of output voltage values, generally speaking, triggering power supply 2 output voltage values be point
Between 1 present position of rubber head and the external cathode of LED light source 4 quantity of LED chip and 4 forward conduction voltage value of LED chip it
Between product.
The present invention judges whether Glue dripping head contacts with LED gold wire with the conductive condition of LED light source by detecting Glue dripping head,
Prevent Glue dripping head from destroying LED gold wire during dispensing, this kind of method is easy to operate, and the repacking of point glue equipment is convenient, and it is at low cost,
For LED dispensing, there is unexpected beneficial effect.
Claims (10)
1. a kind of LED dispensing method, it is characterised in that:During dispensing, when Glue dripping head and LED gold wire contact, Glue dripping head with
Corresponding LED light source forms galvanic circle, and trigger controller control Glue dripping head stops movement.
2. a kind of LED dispensing method according to claim 1, it is characterised in that:The galvanic circle include Glue dripping head,
LED gold wire, LED substrate and triggering power supply.
3. a kind of LED dispensing method according to claim 1, it is characterised in that:The step of dispensing method includes:
(1)Glue dripping head is vertically displaced downwardly to the top of LED chip;
(2)Glue dripping head plastic emitting;
(3)Glue dripping head transverse shifting;
(4)Glue dripping head resets;
Step(1)And step(2)In the process, it is detected to whether Glue dripping head contacts with LED gold wire.
4. a kind of LED dispensing method according to claim 1, it is characterised in that:When Glue dripping head touches LED gold wire,
After controlling Glue dripping head stopping movement, control Glue dripping head is displaced obliquely above.
5. a kind of LED dispensing method according to claim 1, it is characterised in that:The galvanic circle further includes alarm,
Alarm equipment alarm is triggered after the conducting of galvanic circle.
6. a kind of LED dispensing method according to claim 1, it is characterised in that:Electric current is equipped in the galvanic circle to survey
Trial assembly is set, and when galvanic circle is connected, shows the current value of galvanic circle, and according to current value determine Glue dripping head and LED gold wire,
The contact electrode of LED substrate or LED chip.
7. a kind of LED dispensing method according to claim 1, it is characterised in that:When LED light source includes several connecting in series and parallel
When the LED chip connect, triggering power supply exports different voltage according to the position of Glue dripping head.
8. a kind of LED dispensing method according to claim 8, it is characterised in that:The output voltage values for triggering power supply are point
Between rubber head present position and the external cathode of LED light source between LED chip quantity and LED chip forward conduction voltage value
Product.
9. a kind of LED point glue equipment, including Glue dripping head, it is characterised in that:Glue dripping head forms conductive return with corresponding LED light source
Road, galvanic circle include controller, triggering power supply, LED gold wire and LED substrate, the movement of the controller and driving Glue dripping head
Mechanism connection.
10. a kind of LED point glue equipment according to claim 9, it is characterised in that:It further include the electric current survey on galvanic circle
Trial assembly is set, and when galvanic circle is connected, shows the current value of galvanic circle, and according to current value determine Glue dripping head and LED gold wire,
The contact electrode of LED substrate or LED chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810291959.3A CN108906482A (en) | 2018-03-30 | 2018-03-30 | A kind of LED dispensing method and point glue equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810291959.3A CN108906482A (en) | 2018-03-30 | 2018-03-30 | A kind of LED dispensing method and point glue equipment |
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CN108906482A true CN108906482A (en) | 2018-11-30 |
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CN201810291959.3A Pending CN108906482A (en) | 2018-03-30 | 2018-03-30 | A kind of LED dispensing method and point glue equipment |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109675765A (en) * | 2018-12-29 | 2019-04-26 | 广东晶科电子股份有限公司 | A kind of dispensing detection method of touch and its detection system |
CN109967294A (en) * | 2019-03-14 | 2019-07-05 | 云谷(固安)科技有限公司 | A kind of foreign bodies detection positioning device and apparatus for coating |
CN112133064A (en) * | 2019-06-24 | 2020-12-25 | 江西鸿利光电有限公司 | Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser |
CN117772566A (en) * | 2023-12-26 | 2024-03-29 | 东莞市朗通自动化科技有限公司 | Control method and system for planning dispensing track |
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JP2001024316A (en) * | 1999-07-06 | 2001-01-26 | Toshiba Corp | Method and device for controlling dispenser |
CN102735149A (en) * | 2012-02-01 | 2012-10-17 | 昆山华恒焊接股份有限公司 | Detector and robot system provided with same |
CN105336823A (en) * | 2015-10-22 | 2016-02-17 | 广州市鸿利光电股份有限公司 | LED dispensing method and LED packaging method |
KR20170043008A (en) * | 2015-10-12 | 2017-04-20 | 서울반도체 주식회사 | Dispensing system for detecting contact between needle and wire |
KR20170088597A (en) * | 2016-01-25 | 2017-08-02 | 주식회사 두오텍 | Wire contact detecting system for chip package |
-
2018
- 2018-03-30 CN CN201810291959.3A patent/CN108906482A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001024316A (en) * | 1999-07-06 | 2001-01-26 | Toshiba Corp | Method and device for controlling dispenser |
CN102735149A (en) * | 2012-02-01 | 2012-10-17 | 昆山华恒焊接股份有限公司 | Detector and robot system provided with same |
KR20170043008A (en) * | 2015-10-12 | 2017-04-20 | 서울반도체 주식회사 | Dispensing system for detecting contact between needle and wire |
CN105336823A (en) * | 2015-10-22 | 2016-02-17 | 广州市鸿利光电股份有限公司 | LED dispensing method and LED packaging method |
KR20170088597A (en) * | 2016-01-25 | 2017-08-02 | 주식회사 두오텍 | Wire contact detecting system for chip package |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109675765A (en) * | 2018-12-29 | 2019-04-26 | 广东晶科电子股份有限公司 | A kind of dispensing detection method of touch and its detection system |
CN109967294A (en) * | 2019-03-14 | 2019-07-05 | 云谷(固安)科技有限公司 | A kind of foreign bodies detection positioning device and apparatus for coating |
CN112133064A (en) * | 2019-06-24 | 2020-12-25 | 江西鸿利光电有限公司 | Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser |
CN117772566A (en) * | 2023-12-26 | 2024-03-29 | 东莞市朗通自动化科技有限公司 | Control method and system for planning dispensing track |
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Application publication date: 20181130 |