CN112133064A - Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser - Google Patents

Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser Download PDF

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Publication number
CN112133064A
CN112133064A CN201910549871.1A CN201910549871A CN112133064A CN 112133064 A CN112133064 A CN 112133064A CN 201910549871 A CN201910549871 A CN 201910549871A CN 112133064 A CN112133064 A CN 112133064A
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CN
China
Prior art keywords
dispensing head
plc
metal
bonding wire
chip
Prior art date
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Pending
Application number
CN201910549871.1A
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Chinese (zh)
Inventor
陈凯儒
吴爱民
李义园
张明武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Hongli Photoelectric Co ltd
Original Assignee
Jiangxi Hongli Photoelectric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Hongli Photoelectric Co ltd filed Critical Jiangxi Hongli Photoelectric Co ltd
Priority to CN201910549871.1A priority Critical patent/CN112133064A/en
Publication of CN112133064A publication Critical patent/CN112133064A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18Status alarms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00

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  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to an alarming method for touching a metal bonding wire in a chip by a dispensing head of an LED dispensing machine, which relates to the technical field of LED dispensing. The metal welding wire can be touched by the point gum head to give an alarm in time, so that the risk is reduced, the product is isolated, and the possibility of outflow control due to the fatal quality defect of the product is avoided.

Description

Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser
Technical Field
The invention relates to the technical field of LED dispensing, in particular to an alarming method for touching a metal bonding wire in a chip by a dispensing head of an LED dispenser.
Background
With the rapid development of the lighting industry in recent years, the number of various models of LED dispenser is infinite, and the UPH of the dispenser is also increasing, but the increasing UPH means the quality risk is also increasing in proportion. For example, the dispensing head may cause a fatal problem of wire bonding in the chip during dispensing, and the machine may not detect the risk of product outflow control.
The glue dispensing head of the current glue dispensing machine table is only controlled by software, and hard limit is not provided. I.e., there is a risk that the dispensing head touches the die bond wires without feedback from the machine. This risk is fatal to the reliability of the product, and a method capable of timely alarming when the dispensing head touches the metal welding wire is needed.
Disclosure of Invention
The invention aims to provide a reasonably designed alarming method for touching the metal bonding wires in the chip by the dispensing head of the LED dispenser, aiming at the defects and shortcomings of the prior art, and the alarming method can be used for timely alarming when the dispensing head touches the metal bonding wires, reducing risks, isolating products and avoiding the possibility of outflow control due to fatal quality defects of the products.
In order to achieve the purpose, the invention adopts the following technical scheme: the operation steps are as follows: connect PLC between foot rest arm and machine metal bottom plate to connect the alarm on this PLC, then when getting into machine metal bottom plate with metal support, the cylinder jacking is tight with the machine metal bottom plate clamp and is laminated and switch on metal support, when the dispensing head descends the point glue or staff debug dispensing head position at high-speed operation, in case the dispensing head touches chip metal bonding wire in the chip, then the dispensing head links up with the metal bottom plate, and form a return circuit with PLC, PLC reads this return circuit signal, thereby control machine reports to the police immediately and shuts down.
Further, the PLC model is KEYENCE KV-N6 OAT.
Furthermore, the metal bottom plate of the machine is electrically connected with the public end of the PLC, and meanwhile, the glue dispensing arm is electrically connected with the input end of the PLC.
Furthermore, the alarm is connected with the output end of the PLC.
Furthermore, the connecting line of the PLC and the metal bottom plate of the machine is grounded.
After adopting the structure, the invention has the beneficial effects that: the invention provides an alarming method for touching a metal bonding wire in a chip by a dispensing head of an LED dispenser, which can alarm in time when the dispensing head touches the metal bonding wire, reduce risks, isolate products and avoid the possibility of outflow control due to fatal quality defects of the products.
Description of the drawings:
fig. 1 is a schematic diagram of the connection of the present invention.
Fig. 2 is a circuit schematic of the present invention.
Description of reference numerals:
the adhesive dispensing head A, the metal support B, the chip metal bonding wire C and the machine metal base plate D.
The specific implementation mode is as follows:
the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, the following technical solutions are adopted in the present embodiment: the operation steps are as follows: the PLC is connected between the foot pad arm and a machine metal base plate D, the PLC is KEYENCE KV-N6OAT in model, meanwhile, a connecting circuit of the PLC and the machine metal base plate D is grounded, the glue dispensing arm is electrically connected with an ROO7 input end of the PLC, the machine metal base plate D is electrically connected with a common end of COM3 of the PLC, an alarm is connected to the PLC and is connected with an R605 output end of the PLC, then, when the metal support B enters the machine metal base plate D, the metal support B and the machine metal base plate D are clamped, attached and conducted through jacking of an air cylinder, when the glue dispensing head A descends in high-speed operation and glue dispensing or a worker debugs the glue dispensing head, once the glue dispensing head A touches a chip metal bonding wire C in a chip, a loop is formed between the ROO7 and the common end of the COM3, and an output port R605 of the PLC outputs a pressing metal wire alarm and stops after the ROO 7.
After the method is adopted, the beneficial effects of the specific embodiment are as follows: the specific embodiment provides an alarm method for touching a metal bonding wire in a chip by a dispensing head of an LED dispenser, which can alarm in time when the dispensing head touches the metal bonding wire, reduce risks, isolate products and avoid the possibility of outflow control due to fatal quality defects of the products; the touch alarm is not only suitable for the LED industry, but also can be applied to the IC industry and the alarm application of all equipment touch prevention mechanisms.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims (5)

1. An alarming method for a glue dispensing head of an LED glue dispenser to touch a metal bonding wire in a chip is characterized in that: the operation steps are as follows: connect PLC between foot rest arm and machine metal bottom plate to connect the alarm on this PLC, then when getting into machine metal bottom plate with metal support, the cylinder jacking is tight with the machine metal bottom plate clamp and is laminated and switch on metal support, when the dispensing head descends the point glue or staff debug dispensing head position at high-speed operation, in case the dispensing head touches chip metal bonding wire in the chip, then the dispensing head links up with the metal bottom plate, and form a return circuit with PLC, PLC reads this return circuit signal, thereby control machine reports to the police immediately and shuts down.
2. The alarm method for the glue dispensing head of the LED glue dispenser to touch the metal bonding wire in the chip according to claim 1, wherein the alarm method comprises the following steps: the PLC model is KEYENCE KV-N6 OAT.
3. The alarm method for the glue dispensing head of the LED glue dispenser to touch the metal bonding wire in the chip according to claim 1, wherein the alarm method comprises the following steps: the machine metal bottom plate is electrically connected with the public end of the PLC, and meanwhile, the glue dispensing arm is electrically connected with the input end of the PLC.
4. The alarm method for the glue dispensing head of the LED glue dispenser to touch the metal bonding wire in the chip according to claim 1, wherein the alarm method comprises the following steps: and the alarm is connected with the output end of the PLC.
5. The alarm method for the glue dispensing head of the LED glue dispenser to touch the metal bonding wire in the chip according to claim 1, wherein the alarm method comprises the following steps: and the connecting circuit of the PLC and the metal baseplate of the machine is grounded.
CN201910549871.1A 2019-06-24 2019-06-24 Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser Pending CN112133064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910549871.1A CN112133064A (en) 2019-06-24 2019-06-24 Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910549871.1A CN112133064A (en) 2019-06-24 2019-06-24 Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser

Publications (1)

Publication Number Publication Date
CN112133064A true CN112133064A (en) 2020-12-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910549871.1A Pending CN112133064A (en) 2019-06-24 2019-06-24 Alarming method for touching metal bonding wire in chip by dispensing head of LED dispenser

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CN (1) CN112133064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114637352A (en) * 2022-03-17 2022-06-17 武汉起深通讯有限公司 Chip preparation point gum machine on-line control management system based on machine vision

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009140077A (en) * 2007-12-04 2009-06-25 Gastar Corp House heat exchange equipment for crime prevention, and security system using the same
CN104010441A (en) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 PCB wire welding and dispensing machine easy to operate
CN108906482A (en) * 2018-03-30 2018-11-30 鸿利智汇集团股份有限公司 A kind of LED dispensing method and point glue equipment
CN109675765A (en) * 2018-12-29 2019-04-26 广东晶科电子股份有限公司 A kind of dispensing detection method of touch and its detection system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009140077A (en) * 2007-12-04 2009-06-25 Gastar Corp House heat exchange equipment for crime prevention, and security system using the same
CN104010441A (en) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 PCB wire welding and dispensing machine easy to operate
CN108906482A (en) * 2018-03-30 2018-11-30 鸿利智汇集团股份有限公司 A kind of LED dispensing method and point glue equipment
CN109675765A (en) * 2018-12-29 2019-04-26 广东晶科电子股份有限公司 A kind of dispensing detection method of touch and its detection system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114637352A (en) * 2022-03-17 2022-06-17 武汉起深通讯有限公司 Chip preparation point gum machine on-line control management system based on machine vision
CN114637352B (en) * 2022-03-17 2023-01-03 杭州名光微电子科技有限公司 Chip preparation point gum machine on-line control management system based on machine vision

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Application publication date: 20201225