TWD166931S - Led package - Google Patents

Led package

Info

Publication number
TWD166931S
TWD166931S TW103300731F TW103300731F TWD166931S TW D166931 S TWD166931 S TW D166931S TW 103300731 F TW103300731 F TW 103300731F TW 103300731 F TW103300731 F TW 103300731F TW D166931 S TWD166931 S TW D166931S
Authority
TW
Taiwan
Prior art keywords
design
light
rectangular
emitting diode
diode package
Prior art date
Application number
TW103300731F
Other languages
Chinese (zh)
Inventor
Jesse Reiherzer
Michael John Bergmann
Joseph Gates Clark
Original Assignee
科銳公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 科銳公司 filed Critical 科銳公司
Publication of TWD166931S publication Critical patent/TWD166931S/en

Links

Abstract

【物品用途】;一種用以封裝發光二極體之發光二極體封裝體之設計。;【設計說明】;本設計之發光二極體封裝體的外觀係呈矩形塔狀結構,矩形體之基座下方形成有三個扁平長方形接腳,而中間的接腳具有一缺口形狀,呈矩形塔狀之覆蓋體形成於基座上方。右側視圖與左側視圖相同,故省略右側視圖。;本設計之發光二極體封裝體如附圖所示,其整體外形式樣新穎美觀,為根據使用機能所作之最佳與最合理之設計,申請前未見於刊物亦未公開使用,符合設計專利要件。[Use of article]; A design of a light-emitting diode package used to package light-emitting diodes. ;[Design Description];The appearance of the light-emitting diode package of this design is a rectangular tower-shaped structure. There are three flat rectangular pins formed under the base of the rectangular body, and the middle pin has a notch shape and is rectangular. A tower-like covering is formed above the base. The right view is the same as the left view, so the right view is omitted. ;The light-emitting diode package of this design is as shown in the attached figure. Its overall appearance is novel and beautiful. It is the best and most reasonable design based on the use function. It has not been seen in publications or publicly used before application, and it is consistent with the design patent. Requirements.

TW103300731F 2013-08-08 2014-02-10 Led package TWD166931S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/462,795 USD758976S1 (en) 2013-08-08 2013-08-08 LED package

Publications (1)

Publication Number Publication Date
TWD166931S true TWD166931S (en) 2015-04-01

Family

ID=56100975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103300731F TWD166931S (en) 2013-08-08 2014-02-10 Led package

Country Status (2)

Country Link
US (1) USD758976S1 (en)
TW (1) TWD166931S (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
JP1563909S (en) * 2016-03-24 2016-11-21
JP1563908S (en) * 2016-03-24 2016-11-21
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element

Family Cites Families (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4013916A (en) 1975-10-03 1977-03-22 Monsanto Company Segmented light emitting diode deflector segment
JPH0545812Y2 (en) 1985-10-21 1993-11-26
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
DE58909888C5 (en) 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung A method of manufacturing a surface mount opto-device and surface mount opto-device
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
DE69104859T2 (en) 1990-02-07 1995-04-27 Shinetsu Chemical Co Epoxy resin compositions containing highly transparent silica-titanium dioxide glass balls.
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
JPH09321343A (en) 1996-05-31 1997-12-12 Dowa Mining Co Ltd Component device for optical communication
JP2001518692A (en) 1997-07-29 2001-10-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト Photoelectric element
US5951150A (en) 1997-09-11 1999-09-14 Eaton Corporation Display system
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
JP3784976B2 (en) 1998-12-22 2006-06-14 ローム株式会社 Semiconductor device
JP4279388B2 (en) 1999-01-29 2009-06-17 日亜化学工業株式会社 Optical semiconductor device and method for forming the same
US6350041B1 (en) 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
JP4406490B2 (en) 2000-03-14 2010-01-27 株式会社朝日ラバー Light emitting diode
CN1189951C (en) 2000-04-24 2005-02-16 罗姆股份有限公司 Edge-emitting light-emitting semiconductor device and method of manufacturing thereof
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
JP2002299698A (en) 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd Light-emitting device
JP4101468B2 (en) 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
CN1417868A (en) 2001-10-29 2003-05-14 银河光电股份有限公司 Multiple-chip package structure of LED chip
JP4009097B2 (en) 2001-12-07 2007-11-14 日立電線株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LEAD FRAME USED FOR MANUFACTURING LIGHT EMITTING DEVICE
KR100439402B1 (en) 2001-12-24 2004-07-09 삼성전기주식회사 Light emission diode package
JP3912607B2 (en) 2002-06-19 2007-05-09 サンケン電気株式会社 Manufacturing method of semiconductor light emitting device
DE10229067B4 (en) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelectronic component and method for its production
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
DE10255932A1 (en) 2002-11-29 2004-06-17 Osram Opto Semiconductors Gmbh Optoelectronic component
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100499140B1 (en) 2003-01-07 2005-07-04 삼성전자주식회사 Backlight unit
US6871982B2 (en) 2003-01-24 2005-03-29 Digital Optics International Corporation High-density illumination system
US6667451B1 (en) 2003-03-20 2003-12-23 Eaton Corporation Push button assembly
JP4504662B2 (en) 2003-04-09 2010-07-14 シチズン電子株式会社 LED lamp
JP2006525682A (en) * 2003-04-30 2006-11-09 クリー インコーポレイテッド High power solid state light emitting device package
USD511330S1 (en) 2003-07-09 2005-11-08 Nichia Corporation Light emitting diode
USD494550S1 (en) 2003-08-26 2004-08-17 Nichia Corporation Light emitting diode
US6982518B2 (en) 2003-10-01 2006-01-03 Enertron, Inc. Methods and apparatus for an LED light
US6942360B2 (en) 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
TW200517437A (en) 2003-10-16 2005-06-01 Nitto Denko Corp Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
USD508235S1 (en) 2003-12-05 2005-08-09 Nichia Corporation Light emitting diode
JP2005197329A (en) 2004-01-05 2005-07-21 Stanley Electric Co Ltd Surface-mounting semiconductor device and its lead-frame structure
JP2005252219A (en) 2004-02-06 2005-09-15 Toyoda Gosei Co Ltd Light emitting device and sealing member
US7009343B2 (en) 2004-03-11 2006-03-07 Kevin Len Li Lim System and method for producing white light using LEDs
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
TWI280673B (en) 2004-09-22 2007-05-01 Sharp Kk Optical semiconductor device, optical communication device, and electronic equipment
JP2008520810A (en) 2004-11-16 2008-06-19 ナノクリスタル・ライティング・コーポレーション High refractive index nanocomposite sealing material and optical waveguide material based on optically reliable nanoparticles
JP2006165029A (en) 2004-12-02 2006-06-22 Fujikura Ltd Substrate for mounting light emitting element and light emitting element package
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
TWI521748B (en) 2005-02-18 2016-02-11 日亞化學工業股份有限公司 Light emitting device provided with lens for controlling light distribution characteristic
JP4915052B2 (en) 2005-04-01 2012-04-11 パナソニック株式会社 LED component and manufacturing method thereof
JP4992282B2 (en) 2005-06-10 2012-08-08 ソニー株式会社 Light emitting diode, light emitting diode manufacturing method, light emitting diode backlight, light emitting diode illumination device, light emitting diode display, and electronic device
US8563339B2 (en) 2005-08-25 2013-10-22 Cree, Inc. System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
JP2007091960A (en) 2005-09-30 2007-04-12 Nitto Denko Corp Resin composition for sealing optical semiconductor element and optical semiconductor device obtained by using the same
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
US20070108463A1 (en) 2005-11-17 2007-05-17 Chua Janet B Y Light-emitting diode with UV-blocking nano-particles
JP3992059B2 (en) 2005-11-21 2007-10-17 松下電工株式会社 Method for manufacturing light emitting device
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
CN101351891B (en) 2005-12-22 2014-11-19 科锐公司 Lighting device
US9084328B2 (en) 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
US8998444B2 (en) 2006-04-18 2015-04-07 Cree, Inc. Solid state lighting devices including light mixtures
JP2007287981A (en) 2006-04-18 2007-11-01 Konica Minolta Opto Inc Light emitting device
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
WO2007125956A1 (en) 2006-04-26 2007-11-08 Sekisui Chemical Co., Ltd. Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
JP2007299905A (en) 2006-04-28 2007-11-15 Nichia Chem Ind Ltd Semiconductor device
EP2021688B1 (en) 2006-05-05 2016-04-27 Cree, Inc. Lighting device
USD591697S1 (en) 2006-08-09 2009-05-05 Cree, Inc. Lamp package
US7910938B2 (en) 2006-09-01 2011-03-22 Cree, Inc. Encapsulant profile for light emitting diodes
USD572210S1 (en) 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
US8058668B2 (en) 2007-05-17 2011-11-15 Showa Denko K.K. Semiconductor light-emitting apparatus
USD576574S1 (en) 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
CN101369619B (en) 2007-08-14 2011-01-05 富士迈半导体精密工业(上海)有限公司 Surface labeling type LED component and LED back light module unit
US7791093B2 (en) 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
EP2042528B1 (en) 2007-09-25 2010-06-16 Sony Chemical & Information Device Corporation Curable resin composition
DE102007049799A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelectronic component
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US8940561B2 (en) 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US7845829B2 (en) 2008-05-20 2010-12-07 Abl Ip Holding Llc Enclosures for LED circuit boards
US8104920B2 (en) 2008-06-01 2012-01-31 Jack Dubord Adjustable modular lighting system and method of using same
US8382322B2 (en) 2008-12-08 2013-02-26 Avx Corporation Two part surface mount LED strip connector and LED assembly
JP5182512B2 (en) 2008-12-15 2013-04-17 日亜化学工業株式会社 Thermosetting epoxy resin composition and semiconductor device
JP5468600B2 (en) 2009-03-10 2014-04-09 株式会社東芝 White LED, backlight using the same, and liquid crystal display device compliant with EBU standard
WO2010119617A1 (en) * 2009-04-14 2010-10-21 シャープ株式会社 Planar light source device and display device provided with the planar light source device
DE102009021182A1 (en) 2009-05-13 2010-11-18 Hella Kgaa Hueck & Co. Lighting device for roads
US8203161B2 (en) 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
JP5549568B2 (en) 2009-12-15 2014-07-16 信越化学工業株式会社 Resin composition for sealing optical semiconductor element and optical semiconductor device sealed with the composition
USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
TW201123562A (en) 2009-12-30 2011-07-01 Harvatek Corp A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
US8783915B2 (en) 2010-02-11 2014-07-22 Bridgelux, Inc. Surface-textured encapsulations for use with light emitting diodes
US8523383B1 (en) 2010-02-19 2013-09-03 Cooper Technologies Company Retrofitting recessed lighting fixtures
US8508127B2 (en) 2010-03-09 2013-08-13 Cree, Inc. High CRI lighting device with added long-wavelength blue color
USD631020S1 (en) 2010-04-29 2011-01-18 Edison Opto Corporation LED package
JP2011253882A (en) 2010-06-01 2011-12-15 Toshiba Corp Light-emitting device and method of manufacturing the same
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD680504S1 (en) * 2010-07-30 2013-04-23 Nichia Corporation Light emitting diode
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
USD667802S1 (en) * 2011-03-09 2012-09-25 Citizen Electronics Co., Ltd. Light-emitting diode
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
US8672508B2 (en) 2012-04-17 2014-03-18 Tempo Industries, Llc Scalable LED sconce light
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711840S1 (en) * 2012-06-11 2014-08-26 Cree, Inc. LED package
US20130328074A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
US9818919B2 (en) * 2012-06-11 2017-11-14 Cree, Inc. LED package with multiple element light source and encapsulant having planar surfaces
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant

Also Published As

Publication number Publication date
USD758976S1 (en) 2016-06-14

Similar Documents

Publication Publication Date Title
TWD159498S (en) Led package
TWD135430S1 (en) Led bulb
TWD146385S (en) Packaging container
TWD160700S (en) Crayon (egg)
TWD165510S (en) Portion of motion sensor with microphone
TWD158573S (en) Led package
TWD166931S (en) Led package
TWD163683S (en) Portion of a power supply
TWD154961S (en) Starfish nightlight
TWD157618S (en) Light-emitting diode
TWD173883S (en) Part of light emitting diode chip
TWD160698S (en) Crayon (flower)
TWD173888S (en) Part of light emitting diode chip
TWD175296S (en) Portion of light-emitting diode (led) package
TWD154714S (en) Desk lamp
TWD158993S (en) Portion of lens for light-emitting diode (1)
TWD158994S (en) Portion of lens for light-emitting diode (2)
TWD158995S (en) Portion of lens for light-emitting diode (3)
TWD158477S (en) Portion of lamp
TWD158483S (en) Portion of lamp
TWD158481S (en) Portion of lamp
CN302270951S (en) Light Emitting Diode Package
CN302046005S (en) light emitting diode element
TWD173884S (en) Part of light emitting diode chip
TWD157247S (en) Lantern