TW595047B - Method to prevent contamination for gold finger and substrate - Google Patents

Abstract

The present invention provides a method to prevent contamination for gold finger and substrate, whose feature is: passivate a film made of heat-resistant, high-tension, plastic/rubber/silicone material on the location needed to be protected before the circuit board enters into the high-temperature soldering. The film can tolerate the temperature up to 300 degrees. The high tension of material itself makes the film be pasted onto the circuit substrate. Due to capillary effect and atmosphere pressure, the film and substrate is effectively sealed/bonded without peeling off, thereby contamination is avoid during the soldering or electroplating process. Also, since the material is robust, it can be used repeatedly after a slight cleaning.

Description

V. Description of the invention (1) [Technology to which the invention belongs The method according to the invention belongs to method 1, which can be used with rubber and silicone materials to enter Wen Tanxi's front spreading force and high adsorption force ', which is smoothed by light pressure, light' and has 'not easy to stretch' If it falls off, if the substance is slightly adhered after use, only use the dye to reduce it first. [Technical field] The technical system process needs to be heat-resistant, high tension and capillary workability, so this process can provide an adjustment to 30% protection and cohesion before the operation can clean the material. When thin solder is used, the physical properties are again inconvenient. It is a kind of gold hand material, and at 0 degrees, the atmospheric pressure film can be used without force. It can be achieved that the film with a high temperature is opposite to the substrate. The material is bonded to the circuit force effect by the material itself, because the sealing and bonding are not contaminated, and because the material does not need to reach the force of effective light and accurate pollution. The material on the substrate of the two extension substrates of the circuit board is based on the adhesion and antifouling process. [The previous tin bottle slump to the solder tape and the method, but 0 degree chemical adhesion, very technical] Know the printing neck It is due to pollution, or the conductive semi-solid can only be a single solder warm glue, and it affects the soldering of the circuit board. It affects the product. The degree of chemical dissolution, although it is easy to use in high tape, refers to the current production or soldering rate, which is very large, and it is damaged. Chemical adhesion to thermal tapes. Improper soldering and chemical transformation. In the process, tin is generally used when tin is produced. Although the tape is mainly tolerant to sticking, it can be softened or softened to yield bad products. Spattered welding fingers should be chemically adhered to the user before sticking. 18 2 Adhesive tape can cause more contamination or tear off. Page 4 V. Description of the invention (2) ^ 'and After tearing, there will still be a sticking phenomenon. Fen: 'Secondary pollution caused by sticky ;; clever; the stability of the processing circuit and the yield of the product are very large, and because: f Meng finger ) Itself: the state must be allowed (if there is too much adhesive or tape C is different, you must immediately remove it before you can proceed —: = 'or not: the sticky handyman intervenes in the operation, so the I product process ca n’t be broken :: After the person comes on, tear it off by hand. The tape can withstand high temperatures, f: inconvenience, and there may be chemical reactions or softening. The tearing is still closed = the chemical adhesive tape is not easy to stick after high temperature and must be repeated; 4 2 The traditional tradition of May 19th, the Spring and the Spring, and the father ’s righteousness, ^ W σ was only the father, so the uncoated sticky parts that had just deviated from hf were produced, and there were a lot of problems in the process of making impurities. Sticking its heat-resistant tape is a high-priced consumable, so for this use, because it is really fast, it is time consuming: the tape is time-consuming, and the glue must be manually adjusted: quasi-neck, iii 'form the current stage of the printed circuit board process-large bottles Li Shenjing is desperately trying to improve without law, such as special, prevent The material is a semi-solid two-plate soldering prevention method. Drying the substrate is attached to the circuit board, and the baked plate process is complicated. For simplicity, sincerity; = ": It is impossible to effectively reduce the production cost. P2 'How to provide an easy operation' can provide fast and accurate ^, effectively reduce the production cost, and greatly improve the yield of the machine ^ = substrate anti-pollution method is to stimulate the case Inventor's invention

[Summary of the invention] • The finger and the basic invention make the thin film with partial tension clamp itself on the drawing and point hole of the south circuit board 4 and correct the positioning 9, and then check the heat-resistant adhesive, if the board is damaged-the picture shows It is shown that the present invention provides a kind of gold; method, in order to solve the above-mentioned problems of the prior art, the methods include: ... Film / can adjust its material according to the process needs, and the circuit board enters the quality of 1 '▼ The heat-resistant to 300 ° C high-temperature extension of the inter-soldering solder is covered in front of the place to be protected, the material is ΐ ΐ; :: force / high The effect of tension and cohesion fits the effect, but the present invention: mi "11, which does not have a method of P ~ 5. Put the basic circuit on the substrate 1 and then take the heat-resistant film 3. According to the above circuit board, solder is required for the heat-resistant film. The fixed circuit board of the upper template (working platform) is not covered until the working platform 5 is covered with the heat-resistant film 6 ..., the anti-drying film 7, flatten the heat-resistant film g, and then pass through the tin furnace to remove the welding residue 1 〇. The heat-resistant film 1 1 is inspected for damage 1 2 at the same time. If there is no damage, the fourth step is returned to the first step. Another implementation of the present invention is to take the heat-resistant film holder 丄 3 and put it on the substrate 1 j, = heat-resistant The film is flattened on the pin part i 5 (excess air can be completely sealed), apply tin 丄 6 and remove the dross 7 after the tin, and sandwich the heat-resistant film 1 8, and check whether the heat-resistant film is damaged. 9If there is no t, the person who is damaged will reply to the second step. 2 Replacing damaged by heat while the film 21.

595047 V. Description of the Invention (4) [Embodiment] Please refer to the third, fourth, fifth and sixth figures. The present invention provides a method for anti-pollution of gold finger and substrate. The best embodiment of the present invention includes: A heat-resistant film 6 is a high-tension and ten-heat material. The heat-resistant film 6 can be coated on the gold finger and the substrate 1. The heat-resistant film 6 and the gold finger and the substrate 1 are bonded to each other to form a heat-insulating protective mold. Cooperative use to reduce the damage of electronic components and the pollution of solder residue; a block of heat-resistant film θ 1, 62, 64, 63, 65, providing the gold finger 2 2 spaced blocks on the surface, so as to block heat-resistant film 6 1, 62 , 63, 64, 65 are respectively coated with spaced blocks on the surface of the gold finger 22 for the protection of the bonding segment; the gold finger and the substrate 1 as described above have electronic components placed on the heat-resistant film 6 and the gold finger. Between the substrate and the substrate, the thermal film 6 covered by the electronic component 2 3 is the first layer of heat-resistant film 6 0, in which the first layer of the anti-manganese thermal film 60 0 is not covered with the other electronic component 2 ^ The first layer of heat-resistant film 601 can be set to achieve double layers The substrate 25 and the electronic components 2 ^, 2 4 are laminated and laminated. In order to make the present invention more show its progress and practicability, the advantages are listed as follows: 1. The heat-resistant film has the effects of high adsorption force, high tension and cohesion. 2. The heat-resistant film can be used repeatedly up to 2,000 times to 1. It is practical. Third, it does not rely on chemical bonding and is progressive.

Page 7 595047 V. Description of the invention (5) Fourth, the operation is simple and can be fixed by mechanical means. The application requirements, 爰, and given to the present invention. In summary, the present invention has been in accordance with the invention patent Application in accordance with the law, I ask the examiner of the Bureau of the Bureau of the patent to understand the patent, it is very convenient. 595047 Brief description of the diagram The first diagram is a flowchart (1) of the heat-resistant film of the present invention. The second figure is a flowchart (2) of the heat-resistant film of the present invention. The third picture is a diagram of bonding the heat-resistant film of the present invention with a gold finger and a substrate. The fourth picture is the two pictures of bonding the heat-resistant film of the present invention to the gold finger and the substrate. The fifth picture is the three pictures of bonding the heat-resistant film of the present invention to the gold finger and the substrate. The sixth diagram is the four diagrams of bonding the heat-resistant film of the present invention to the gold finger and the substrate. 1 1 Μ .. ^ ~ ^ Destroyed cool holes 3 plate flat glue · Welding · · · No fixed point · Die making 6 Hot and hot · Anti · 滓 · Yougu 1 and · Shanggong · Finance hot film 9 slag film Ming 1 picture is installed in the · protective rubber resistant film · the film said · road film plate heat-proof heat-proof · hot-hot glue number One or two pieces of flat tin with electric heating can be used to check the resistance of the substrate. The repairing of the resistance zone can be performed in the first zone. The clamp can be cleaned and the clamp can be fixed. \ 厶 口 平 5 Works · 工 · (厶 口 板 平 4 ο ο 、 · 6 6 1—I piece piece piece piece 6 glue 8 ⑽ ^ glue · welding · ο

IX 7 2 4 5 595047 Brief description of the drawing on the substrate ... 1 4 Heat-resistant film flattened on the pin part ... 1 5 Soldering ... 1 6 Tin dregs after removing tin ... 1 7 Picking up the heat-resistant film 18 Check if there is any damage to the hot film. 1 9 If there is no damage, reply to the second step. 2 0 Change the heat-resistant film to the damaged person. 2 1 Gold finger. 2 2

Electronic components ... 23, 24 Double-layer substrate ... 2 5

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Claims (1)

And has a high-tension T: finger 5 substrate anti-pollution method, using a heat-resistant material film on the circuit handle, 橡胶, rubber material 'can be heat-resistant to 300 degrees high temperature 本身 ϊ = covered with high-temperature solder before being covered Attach to the circuit board by the force effect: and ϊ: on the enemy :: thermal film: the basic circuit diagram can be marked on the substrate for resist film ^ heat-resistant film punch holes according to the circuit board needs solder ,: Yu: On-chip template (working platform) ... cool, juxtaposed circuit chip, and apply the weight: after the heat-resistant film is placed on the back, the positioning of the heat-resistant solder mask should be corrected, the heat-resistant adhesive ^ heat-resistant film, then pass through the tin furnace, then clear the solder Desolate, cool The anti-fouling of the gold finger and the substrate as described in item 1 of the middle-eye patent range = where the aforementioned heat-resistant film can be removed from the heat-resistant film and the fixing clips can be reduced from two to flatten the heat-resistant film on the pin portion (after light pressure can be Exclude Xi, Erqi, and Wuquan.) After applying tin and removing the dross after tin, pick up the heat-resistant film and then pass the tin and remove the dross after welding to clamp the heat-resistant film. 3, As described in item i of the patent application, the gold finger and substrate anti-pollution method j, in which the plastic and rubber materials of the aforementioned heat-resistant film have high adhesion, south tension and cohesion effects. 4. The antifouling method for gold fingers and substrates as described in item χ of the scope of patent application, wherein the plastic, silicon, and rubber materials of the heat-resistant film can withstand temperatures up to 300 ° C. '' 5. The anti-pollution method for gold fingers and substrates as described in item 1 of the scope of the patent application, in which the aforementioned heat-resistant film can be repeatedly processed in accordance with the substrate to be made into different circuit pattern holes or pinholes, which are successively bonded and pressed. Level, off: Page 11 6. Scope of patent application (soldering), remove and clamp the old film, and repeat the previous process η times. Put on a film with a new circuit pattern hole. 6. As in the method of patent application scope No. 1, the method of entering and dyeing, basin towel # ,, VL, to the fingers and substrate anti-fouling. The anti-adhesive rubber is shaped like a paste, which is attached to each person, and the film can be cut into different shapes. The mouth is attached to the substrate or gold finger to be protected. 7. As described in item 1 of the scope of the patent application, the ancient hand-dyed gold,: t, Ganrbong *, 〇 ,, r «i Yu Cairi and substrate antifouling. Methods /, the anti-pollution and heat resistance described in the description The film can be printed on the same day & 7 劁 π π μ line or pinhole, at the required height, stacked, = printed: the same tin or paste, and can be repeated. 、 "Soil plate, again ,,, JL over 8, as mentioned in the patent application scope of one hundred hundred years of old 氺 ώ ώ Γ brother 1 item described in the gold finger and the substrate anti-pollution and heat-resistant film can be attached manually or mechanically . The method of completion ° Ιιί The antifouling of the gold finger and the substrate described in Item 1 of the method: Method, the anti-pollution heat-resistant film described in the Eighth Middle School can be repeatedly applied according to the need of adding different media to the A plate, distracting the soil … Holes, which have been pasted, flattened, and pasted: the circuit diagram holes or needles of the second garment, and then replaced with "": two (solder or engraved), cleared, clamped. Dan replaced the film with a new circuit pattern hole, and repeated the previous process η times. Loss = Gold finger and substrate reverse as described in Γ " 1 of the range of interest. Hi :: The aforementioned hot film can be coated on the gold finger and On the substrate +…, the sheet is bonded to the gold finger and the substrate to form a thermal insulation mold, so as to reduce the damage of electronic components and the pollution caused by soldering.丄 The method of inverting gold fingers and substrates as described in item 1 of the scope of the patent application, wherein the block heat-resistant film is provided with a surface of the gold finger and a 'day block' is formed, and the block heat-resistant film is individually coated. Between the gold-coated fingers 595047 Page 13