TW586197B - Image sensor semiconductor package - Google Patents

Abstract

A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between conductive parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A transparent window is placed on top of the semiconductor chip and covers the vision chip active area. A wire shielding block is formed on the multi-layer resin mask organic substrate around the semiconductor chip covering and protecting the bonding wires and the semiconductor chip not covered by the transparent window. A liquid encapsulant is formed to protectively seal the device but does not block the vision of the vision chip active area through the transparent window. Since no space is required between the vision chip active area, and the transparent window, the overall height of the device is reduced. This allows the image sensor semiconductor package of the present invention to be more compact.

Description

586197 V. Description of the invention (1) The present invention relates to an image sensor including an image sensor chip and a camera as a camera, a ruler that requires a shadow, and a ceramic case, which is quite expensive. It is the same as the pottery body. If the body is very strong, it will damage the water protection image and reduce the number of images. This makes the body more expensive. The porcelain shell attached to the porcelain shell should be connected to the crystal to help reduce the rate. It should be half as necessary for the industry to manufacture the device and make the semiconductor chip of the system must be low in cost and the cost of the conductor image is basically used by a Ang ceramic top quilt and a net to allow electricity to be used in a reliable device. The image sensor 0 has an expensive casing protruding from the top, and the image sensor semiconductor package has a bonding wire shield in the main part, wherein the bonding wire shielding sheet and the bonding wire of the organic substrate. Many electronic devices, such as digital Internet devices, are designed to make semiconductor designs used in these electronic devices more dense, and have higher performance components in highly competitive industrial and economic environments. , Which has the processing and viewing to capture images by electrical induction. The disadvantage of the development of the wafer is that it contains a plurality of layers of ceramic material to form an electrical lead. The ceramic material is made of a plurality of layers through the side of the ceramic shell. When the inside of the one is covered with a glass cover, The size of the sticky glass cover and the ceramic shell Φ The conventional device has some disadvantages, such as the separation of the glass cover and the porcelain shell, because the separation between the glass and the ceramic causes the wafer to be exposed to the external environment. And the above-mentioned easy to self-poor, knot the device. One disadvantage is that moisture will enter the porous ceramic shell, and the gas will condense inside the glass cover to reduce the capture of the image sensor chip.

586197 V. Description of the invention (2) Capability of capturing images and quality of wafers. In addition, the ceramic materials used in today's devices are quite expensive. The use of expensive ceramic materials to make a plurality of layers of ceramic lids causes the unit price of the device to be too high, and its manufacturing process is special. Furthermore, the structure of today's ceramic devices does not provide a smaller design or a denser package. Therefore, how to propose a novel image-sensing semiconductor package to address the above problems can not only improve the shortcomings of traditional moisture penetration, but also have low-cost, high stability, and more densely designed devices, which have been eager for users for a long time. I hope that the inventor is here, and based on his many years of experience in research, development, and sales of semiconductor-related products, the inventor finally developed an image based on his personal expertise through multiple research and design and special discussions. Improved packaging of inductive semiconductors can solve the above problems. The image-sensing semiconductor of the present invention mainly includes an organic substrate of a plurality of layers of trees, a semiconductor wafer, a sensing region of an image-sensing chip, a plurality of wires, a wire shield, a transparent window, and A package. The organic substrate of the multiple-layer resin mask is a substrate, and its main part includes: a resin mask and an organic substrate of the same material as the mask. Using the same material can make the substrate absolutely flat. The resin light f is formed on the substrate and is flat, so it provides a very flat substrate surface, so it has a better configuration for the semiconductor device and a better adhesion to the semiconductor wafer and the substrate.

Page 6 586197 V. Description of the invention (3) The semi-response area of the semiconductor wafer is an organic substrate. The image sensing part may be an independent crystalline semiconductor (CMOS). A plurality of conductive coating resin masks are used organically. The semiconductor wafer is electrically connected. A transparent window, which is the sensing area of the chip, may be a lens. It is manufactured on a fresh wire shield and is required for semiconductor wafers. When the wire is warped, the wire can be warped to ensure that the wire is not damaged. It is placed to prevent the organic substrate of the mask before the packaging or a gel-like package body, which can completely shield the small part of the bonding wire from passing through the package body or most of the conductor chips without being connected to a plurality of layers of the resin mask through an adhesive. The sensing area of the sensing chip including an image sensing chip may be one of the semiconductor chips. The image sensing chip is a complementary gold oxide or a charge coupled (CCD) image sensing chip. And is connected between the conductive end of the semiconductor wafer and the plurality of substrates, and the conductive device includes a gold wire and an organic substrate of a plurality of layers of resin masks to be disposed above the semiconductor wafer to cover the image sensing transparent window It is a borosilicate glass or other transparent material, and the pressure lines around it will not be damaged. In addition, when the package is covered, the covered wire is covered by a shield to block the shadow. The wire protects the conductive force. Extremely small, if it hits the crystal, the bonding wire shields the area covered by the external cover and penetrates. However, the package is placed like an inductive crystalline layer resin shield. Therefore, the edge of the sheet may or may accidentally include a local window. It should be noted that the size of the sheet does not form a welding wire, so it protects against collisions. For the complex edge of the damaged part, the organic substrate of the transparent shielding area can be twisted by different lines, and the semiconductor crystal can be damaged by the conductive device. Several layers of resin. The package window has only one bright window as a whole.

586197 V. Description of the invention (4) The video of the world can not pass through the organic mask of the transparent tree vinegar mask. It can be reserved for input or output before the substrate and the semiconductor package or after the package. Various ball brake arrays will be mentioned in the description. (BGA) Square flat lead-free dots, such as the base material and the chip device shield, will not be damaged. The wire used for bending will often be more cost effective than the cost of the effective chip and space. The invention of the same image induction welding wire shield chip welding wire has reduced the ceramic material. In the semiconducting area, there is excess induction. The half image induction area must have a clean window so that the transparent window enters the induction area, and the package must have an image. The sensing area of the sensor chip. Furthermore, because the substrate has very flat characteristics, it is necessary to have good adhesion characteristics between the adherends using an adhesive. The packaging of the image-sensing semiconductor can be supplemented with other processes as needed, for example, according to the form of the package, the contact area of the electronic signals of the semiconductor. Various packaging forms of the present invention, for example, the final packaging forms are, leadless (LCC), square flat (QFP), (QFN) and other packaging forms. The package of the image-sensing semiconductor of the present invention has the flatness of the board and has better adhesion to the wafer; it has characteristics that can provide higher stability and resistance to moisture; and because the bonding wire is completely protected by the shielding of the bonding wire, It is believed that it will never touch the edge of the wafer, so the semiconductor is bad. In today's devices, because they are not protected or distorted, the return rate is increased during packaging, and this shield can improve the yield. In addition, the organic substrates used in today's Ming are expensive, so the present invention is beneficial. Furthermore, the present invention provides a relatively small profile, and the overall height is not reduced between the sensing area of the image sensing chip and the transparent window, so the imaging equipment of the present invention is more dense and increases the value of the device. ill ill II III ill page 8 586197 V. Description of the invention (5) Another object of the present invention is to provide a method which can be implemented by those skilled in the art by reading the patent specification of the present invention. In order to make your reviewing members have a better understanding and understanding of the structural features and achieved effects of the present invention, I would like to provide better examples and detailed descriptions with detailed descriptions as follows: As mentioned above, the ceramics used today The image sensing device has many disadvantages, such as: ceramic materials are very expensive to use in production; moisture will penetrate into the device and cause it to condense inside some components, thus reducing the operating capability of the image sensing device; further, when it has only When the adhesive is fixed on the ceramic package, the glass cover is easily separated from the ceramic package, so that the wafer is exposed to the outside, and the wafer is damaged as a result. However, the image-sensing semiconductor package provided by the present invention can improve its moisture resistance, reduce cost, improve stability, and have higher density. Please refer to FIG. 1, which is a cross-sectional view of a preferred embodiment of the present invention. As shown in the figure, the image sensing semiconductor 100 of the present invention includes a plurality of layers of an organic substrate 11 0 of a resin mask, an adhesive 1 2 0, a semiconductor wafer 1 3 0, and a sensing region 1 4 of an image sensing wafer. 0, wire 1 50, a wire shield 16 0, a transparent window 170, a package 1 800, and a solder ball 190. The organic substrate 110 of the multiple-layer resin mask is a substrate. The substrate includes a resin mask and an organic substrate, both of which have the same material. The same material can be used to make the substrate appear absolutely flat. The resin mask is formed on a flat substrate, so a very flat substrate surface is provided. 'This arrangement allows the semiconductor wafer 1 30 to have

Page 9 586197 V. Description of the invention (6) Better adhesion. Conversely, other types of substrates are poorly designed, and their circuits will rise slightly on the substrate, making the surface of the substrate appear uneven. Therefore, the use of integrated circuits on other types of substrates will make physical and mechanical Poor properties, such as reduced adhesion between the semiconductor wafer and the substrate, and the substrate tends to absorb too much moisture, causing the device to have problems of instability. The semiconductor wafer 130 is connected to the organic substrate 1 1 of the plurality of resin masks through an adhesive 1 2 0. It should be clearly understood that only one semiconductor wafer is connected in this embodiment, but in other embodiments It is also possible to use a plurality of semiconductor wafers on the same semiconductor package. The semiconductor wafer 130 includes a sensing region 140 of an image sensing chip. The sensing region of the image sensing chip may be a part of the semiconductor wafer 130 or a separate chip. The image sensing chip 140 may be a Either CMOS or CCD. A plurality of conductive devices 150 are connected between the conductive end of the semiconductor wafer 130 and the organic substrate 1 1 0 of the resin mask. The conductive device 150 may be a gold wire. . A transparent window 170 is disposed above the semiconductor chip 130 and covers the sensing area 140 of the image sensor chip. The transparent window 170 may be a borosilicate glass or other transparent material or a lens. . A wire shield 160 is formed on an organic substrate of a plurality of layers of resin masks. Around the semiconductor wafer 130, the wire shield 160 can be made in an appropriate size as needed to bond the wires. Line wrap.

Page 10 586197 V. Description of the invention (7) The welding wire shield is a protective conductive device. When the welding wire shield is formed on the welding wire, the pressure on the welding wire is extremely small, so the welding wire will not be distorted. It is ensured that the bonding wire does not hit the edge of the wafer, so the semiconductor wafer is not damaged. In addition, wire shields protect the conductive devices from external or accidental damage before or during packaging. In the embodiment of the present invention, the transparent window is arranged on the semiconductor wafer and has the same manufacturing process as the formation of the wire shield, so that the production time can be shortened, the production process can be reduced, and the manufacturing cost can be reduced. In this step <, the wire shield helps to fix the position of the transparent window, and it is a special process before packaging. The bonding wire cover 160 is made of the same material or elastic rubber as the resin substrate. The feature of the present invention is that the bonding wire cover 160 is made of the same or similar material as the organic substrate 1 110 Because the physical properties of the two are the same or similar, the organic substrate 110 and the bonding wire shield 160 can have a strong adhesive force, which increases the stability of the device. A colloidal package 1 80, covering the required area, such as a partial area of the organic substrate 1 1 0 of a plurality of layers of the resin mask, the edge of the wire shield 16 and the transparent window 1 70, the package The body 180 will completely cover the wire shield 160, but it must be noted that the package 180 covers only a small part of the transparent window 170, and does not cover the entire transparent window 170 or The sensing area of the image sensing chip is 1 40, so it will not affect the function of the sensing area of the image sensing chip. The sensing area of the image sensing chip 1 40 must have a clean window so that the external video can be transparent. Window 170 is captured. The package body 1 80 is printed (P r i n t i n g) or other coating methods,

Page 11 586197 V. Description of the invention (8) (Coating, in〇1 ding), the package body 180 is adhesively fixed and protects the solder feet of the image sensing semiconductor to cover the semiconductor wafer 130 And the sensing area of the image sensor chip 140, to isolate it from the outside environment. In addition, because the substrate 110 is a resin mask organic substrate and is very flat, there is a very strong adhesion between the substrate 1 10 and the package body 180. The packaging of the image-sensing semiconductor can be packaged as needed. Add another process before or after packaging, for example: reserve the contact area of the electronic signal of the input or output semiconductor according to the package form. The package form used in the present invention, for example, uses a solder ball 190 to contact the bottom of the organic substrate 110 of the plurality of layers of the resin mask to form the semiconductor package of the BGA (see FIG. 1). Each solder ball 190 is an organic substrate 1 1 0 which is electrically connected to the conductive circuit and a part of a plurality of layers of the resin mask. The material of the solder ball 190 may be Pb, Sη or other conductive materials. It can be used as the electrical connection between the electrode of the semiconductor device 100 and the semiconductor wafer 130 and the printed circuit board. Although the present invention discloses a special form of packaging, the present invention can also be used in other examples such as: BGA, LCC, QFP, QFN, or other packaging forms. The most important thing to note in the packaging of image-sensing semiconductors is that they are resistant to moisture. Moisture can penetrate into the device and condense in the sensing area of glass windows, semiconductor wafers, or image-sensing wafers. This is a problem commonly encountered by today's devices. However, In the present invention, the flat substrate, the same or similar material, has better adhesion, and can provide a high stability and moisture-resistant image sensing. 111 III 1 II S1 Page 12 586197 When the bonding wire is completed, It can indeed be damaged and caused to bend. The advantage of using a welding device to machine the substrate of the device is to compensate the Ang. It is also found that the induction area has been reduced to a national patent law application, and all the welded wires are protected from welding. Or the twisted wire cover is expensive. The cost is to reduce a smaller and lower transparent window, and it can also have the novelty of the Qijun Bureau. The wire received by the welding is not in line with the current song. Extremely small pressure will collide with Jingjin's device. Therefore, the encapsulation is made of σ yield rate material, which is more than the device, and requires additional production costs. Appearance, there is no amount between half and half. To increase the invention, progress and patent application should be given as early as possible. V. Invention Description (9) Device. In addition, the wire shield is not protected by twisted semiconductor wafers, and often has a rate of shipment. In addition, the present invention should now be made of ceramic materials for semiconductors. Therefore, the present invention furthermore provides an integrated device like an inductive wafer. The inventor of the invention should comply with our method and propose special protection. When welding is formed, therefore, the edge of the welding wire sheet, so that the welding wire is not received, will increase its retreat. The invention's image-sensing multiple layers of expensive production process, conductor The value of the chip and the space outside the shadow. There is no doubt that the industry can use it, but Yi Yi's sense of prayer is the only one of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. The equal changes and modifications of the shapes, structures, features, and spirits mentioned above should all be included in the scope of patent application of the present invention. Brief description of drawing number: 1 0 0 image sensor semiconductor

1 111! _ II Page 13 586197 V. Description of the invention (1) 0 1 1 Multiple organic substrates of resin mask 1 2 0 Adhesive 1 3 0 Semiconductor wafer 1 4 0 Sensing area of image sensor wafer 1 5 0 Welding wire 1 6 0 Fresh wire cover 1 7 0 Transparent window 1 8 0 Package 1 9 0 Solder ball 586197

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Claims (1)

586197 VI. Application Patent Scope 1. An image sensing semiconductor package, which mainly includes at least: an organic substrate of a tree vinegar mask, which includes a plurality of wires; a semiconductor wafer, which includes the sensing of an image sensor chip Area 'The semiconductor wafer is a plurality of conductive devices connected to the organic substrate of the tree mask, and is electrically connected to the conductive end of the semiconductor wafer and the organic substrate of the resin mask to form a conductive circuit; a transparent window , Which is located above the sensing region of the semiconductor wafer and the image sensing wafer; a wire shield is formed around the organic substrate of the resin mask and the semiconductor wafer, wherein the wire shield covers a plurality of conductions Device, but does not cover the transparent window; a package body, which covers a local area of the organic substrate of the resin mask, a wire shield, and the edges of the transparent window, wherein the package body is not covered on the transparent window. 2 · The image-sensing semiconductor package described in item 1 of the scope of the patent application, wherein the plurality of conductive devices are bonding wires. 3. The packaging of the image-sensing semiconductor according to item 1 of the scope of the patent application, wherein the organic substrate of the resin mask is an organic substrate of a plurality of layers of the resin mask. ® 4 · The packaging of image-sensing semiconductors as described in item 1 of the scope of patent application, wherein the wire shield and the organic substrate of the resin mask are made of the same material. 5 · Packaging of image-sensing semiconductors as described in item 1 of the scope of patent applications Page 16 586197 6. Scope of patent application, where the transparent window is a glass. 6. The package of an image-sensing semiconductor as described in item 1 of the scope of patent application, wherein the transparent window is a lens. 7 · The image sensing semiconductor package described in item 1 of the scope of patent application, wherein the semiconductor wafer is a complementary metal oxide semiconductor (CMOS) image sensing wafer. 8 · The package of an image-sensing semiconductor as described in item 1 of the scope of the patent application, wherein the semiconductor wafer is a charge-coupled (CCD) image sensor.应 chip. 9 · The image-sensing semiconductor package ¥ described in item 1 of the scope of the patent application, wherein the package is a square flat no-lead (QFN) package. 1 〇 The image-sensing semiconductor package described in item 1 of the scope of patent application, wherein the package is a leadless (LCC) package. 1 1 · The package of the image-sensing semiconductor as described in item 1 of the scope of the patent application, wherein the package is in the form of a ball-gate array (BG A) package 0 1 2 · As described in the scope of the patent application The package of an image sensing semiconductor, wherein the semiconductor package includes a plurality of semiconductor wafers. 1 3 · — An image sensing semiconductor package, the main parts of which include: _ an organic substrate of a plurality of layers of a resin mask, wherein a plurality of wires are electrically connected to the organic substrate of the resin mask to form a circuit; A semiconductor wafer adhered to an organic substrate of a plurality of layers of resin mask, the semiconductor wafer including a sensing area of an image sensing chip Page 17 586197 6. Application scope: A plurality of bonding wires are respectively connected to the conductive end of the semiconductor wafer and the organic substrate of a plurality of layers of the resin mask to form a circuit; a transparent window covering the sensing of the image sensor chip Above the area, a wire cover is formed on the organic substrate of a plurality of layers of resin mask and around the semiconductor wafer, wherein the wire cover covers a plurality of conductive devices, but does not cover a transparent window; a package body It covers the local area of the organic substrate of the multiple-layer resin mask, the wire shield and the edge of the transparent window. The package does not cover the transparent window, so it will not damage the sensing area of the image sensor chip. Function, and the package system protects the pins of the image sensing semiconductor. 14 · The package of the image-sensing semiconductor as described in item 13 of the scope of the patent application, wherein the bonding wire shield and the organic substrate of the resin mask are made of the same material. 15 · The package of an image-sensing semiconductor as described in item 13 of the scope of patent application, wherein the transparent window is a glass. 16 · The package of an image-sensing semiconductor as described in item 13 of the scope of patent application, wherein the transparent window is a lens. 17 · The package of an image-sensing semiconductor as described in item 13 of the scope of patent application, wherein the semiconductor wafer is an image-sensing wafer using complementary metal oxide semiconductor (CMOS). 1 8 · Packaging of image sensing semiconductor as described in item 13 of the scope of patent application Page 18 586197 6. Scope of patent application, in which the semiconductor wafer is an image sensing wafer using charge coupled (CCD). 19 · The image-sensing semiconductor package described in item 13 of the scope of patent application, wherein the package is a square flat no-lead (QFN) package. 20 · The image sensing semiconductor package as described in item 13 of the scope of patent application, wherein the package is in a leadless (LCC) package. 2 1 · The image sensing semiconductor package as described in item 13 of the scope of patent application, wherein the package is a ball gate array (BG A) package. 2 2 · The package of an image-sensing semiconductor as described in item 13 of the scope of patent application, wherein the semiconductor package includes a plurality of semiconductor wafers. Page 19