TW586158B - Reinforced chemical mechanical planarization belt - Google Patents

Reinforced chemical mechanical planarization belt Download PDF

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Publication number
TW586158B
TW586158B TW092105436A TW92105436A TW586158B TW 586158 B TW586158 B TW 586158B TW 092105436 A TW092105436 A TW 092105436A TW 92105436 A TW92105436 A TW 92105436A TW 586158 B TW586158 B TW 586158B
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TW
Taiwan
Prior art keywords
polymer
belt
cmp
polymer material
layer
Prior art date
Application number
TW092105436A
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Chinese (zh)
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TW200304180A (en
Inventor
Jibing Lin
Diane J Hymes
Original Assignee
Lam Res Corp
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Publication date
Priority claimed from US10/097,337 external-priority patent/US6666326B2/en
Priority claimed from US10/112,447 external-priority patent/US20030186630A1/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200304180A publication Critical patent/TW200304180A/en
Application granted granted Critical
Publication of TW586158B publication Critical patent/TW586158B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30Belts or like endless load-carriers
    • B65G15/32Belts or like endless load-carriers made of rubber or plastics
    • B65G15/34Belts or like endless load-carriers made of rubber or plastics with reinforcing layers, e.g. of fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02Backings, e.g. foils, webs, mesh fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D29/00Producing belts or bands
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30Belts or like endless load-carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/08Reinforcements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2413/00Belts

Abstract

A processing belt for use in chemical mechanical planarization (CMP), is provided. The processing belt is reinforced with one of a mesh belt and a woven fabric. The processing belt includes a polymeric material encasing the mesh belt to define the processing belt. The processing belt is fabricated so that the mesh belt forms a continuous loop within the polymeric material, and the mesh belt is constructed as a grid of intersecting members. The intersecting members are joined at fixed joints to form a rigid support structure for the processing belt.

Description

586158 五、發明說明(1) 一、【發明所屬之技術鎖域】 本發明係關於一種晶圓製備用帶,更明確的說’係關 於使用於化學機械平坦化裝置中之工具帶的製造。 二、【先前技術】 在半導體元件的製造中,通常複數之薄膜層被配置於 一基板上,且其特徵即是定義於該薄膜層中。在製造過程 中,基板或晶圓之表面形狀會變得不規則,且未修正之不 規則程度會隨著後來之薄膜層增加而變大。化學機械平坦 化(CMP,Chemical Mechanical Planarization)已發展 成為一製造步驟,其用來平坦化半導體晶圓之表面,且實 施額外之製程,包含拋光、擦淨、基板清理、蝕刻製程等 等。 通 一控制 於彼此 確保整 裝置包 被支撐 動的路 操作表 一研磨 提供了 至該帶 常’ CMP製程包含以一操作表面對基板或晶圓施加 壓力。操作表面與晶圓皆被轉動、旋轉、或者相對 而獨立移動,藉此來產生平坦化所需之摩擦力,且 個晶圓的表面受到一貫且可控制的處理。傳統CMp 含線性帶操作系統,在其中一具有一操作表面之帶 =一個以上之滾輪或滾軸之間,其使得該帶以一轉 徑來移動,該路徑呈現了 _對晶圓施加壓力之平坦 =。晶圓通常藉著一晶圓運送器來支撐及旋轉,且 設置於移動在其環狀路裎之帶的下方。該平台 t有该帶通過之平坦表面,且晶圓被施加壓力 1作表面’而該帶倚靠著該平台所提供之平坦表586158 V. Description of the invention (1) 1. [Technical lock domain to which the invention belongs] The present invention relates to a wafer preparation tape, and more specifically, it relates to the manufacture of a tool belt used in a chemical mechanical planarization device. 2. [Previous Technology] In the manufacture of semiconductor devices, usually a plurality of thin film layers are arranged on a substrate, and their characteristics are defined in the thin film layer. During the manufacturing process, the surface shape of the substrate or wafer will become irregular, and the degree of uncorrected irregularity will increase with the subsequent increase of the film layer. Chemical mechanical planarization (CMP) has been developed into a manufacturing step for planarizing the surface of semiconductor wafers and performing additional processes including polishing, wiping, substrate cleaning, and etching processes. By controlling each other to ensure that the entire device package is supported, the operation table is polished to provide the tape. The CMP process includes applying pressure to a substrate or wafer with an operating surface. The operation surface and the wafer are both rotated, rotated, or moved independently and independently to generate the friction required for planarization, and the surface of each wafer is subjected to a consistent and controllable treatment. The traditional CMP contains a linear belt operating system, in which a belt with an operating surface = more than one roller or roller, which makes the belt move with a rotation path, the path presents _ the pressure on the wafer Flat =. Wafers are usually supported and rotated by a wafer carrier, and are placed below a belt that moves around their end. The platform t has a flat surface through which the belt passes, and the wafer is pressured 1 as a surface 'and the belt leans against a flat surface provided by the platform

第5頁 586158 發明說明(2) ΐ被:ίί:::強:研磨:置於水溶液中’㈣知之研 术絮助與加強平坦化或者其他〇1)製程。 社構之/ 裝置包含具有一用為操作表面之圓形襯塾 CMP操作裝置、Ιίί 5、一類似圓形CMP操作裝置之執道 系統,1机置了 :人二 P操作裝置、及其他的CMP操作 的力量置與構造,財利用化學與機械 導體晶圓=進路=他製作於其上之結構的半 他的製程。—“洗、拋光、擦淨、清潔或其 在該線性帶CMP系统中,兮逃t 來提供—可忍受該 ^帶與操作表面通常被製作 可於其上進行精確與可控m之壓f的穩定結構,及-面。除了由該帶與環繞著穩定操作表 表面所引起的拉伸與收縮之外、先之滾輪而移動的操作 潮濕環境,其由研漿與沖洗接你帶與操作表面通常處於一 表面通常由複數個材料所構纟$液體所引起。帶與操作 層、-緩衝層及-或多個=矣舉例來說:-不錄鋼支持 合、接合、連結等方法來結人面層。讜複數層藉著黏 之連續帶狀結構,而在CMP製_ +形成具有一朝外操作表面 操作表面。 中,晶圓被施加壓力至該 具有如上所述複數層之始 CMP帶拉伸所需之支撐,但是’帶的製造提供了避免線相 本。因為正常使用所造成加了帶構^的製造成 潮濕之CMP環境而惡化,如層間之綠合斷裂會因傳海 衣見 *此導致帶可能難以正常運作,Page 5 586158 Description of the invention (2) quilt: ί ::: strong: grinding: placed in aqueous solution. ㈣Knowledge research aids and strengthens flattening or other 〇1) process. The social structure / device includes a CMP operation device with a circular lining used as the operating surface, Ιίί5, a roadway system similar to a circular CMP operation device, and one machine is installed: a man and a P operation device, and other The power of the CMP operation is set and structured, and the chemical and mechanical conductor wafers are used = the approach = the semi-hidden process on which the structure is fabricated. — "Wash, polish, wipe, clean or provide it in the linear belt CMP system.-Tolerable The belt and the operating surface are usually made to perform a precise and controllable pressure f The stable structure, and-surface. In addition to the belt and the stretching and shrinkage caused by the surface around the stable operation table, the operation of the first wheel moves in a humid environment, which is connected to the belt and operation by grinding and washing. The surface is usually on a surface usually caused by a plurality of materials 材料 $ liquid. Belt and operation layer,-buffer layer and-or more = 矣 For example:-do not record steel support bonding, joining, joining and other methods Bonding surface layer. 谠 Multiple layers are formed by a continuous continuous tape-like structure in CMP to form an operating surface with an outward-facing operating surface. In the wafer, pressure is applied to the beginning of the layer with the multiple layers as described above. The CMP belt needs the support required for stretching, but the manufacture of the belt provides the avoidance of thread phase. Because of the normal use, the belt structure is made into a humid CMP environment and deteriorated. For example, the green break between layers will be transmitted by the sea.衣 见 * This may cause the belt to be difficult to correct Operation,

586158586158

五、發明說明(3) 且對於終點偵測系統來說,該帶於開始時便會遭遇奸 之問題。 w霉上 利用於線性帶CMP系統中之線性帶之製作成本昂貴, 且更換耗時。更換線性帶需要CMP系統暫停運轉,導^產 量減少並增加生產成本。線性帶可能會遭遇一些問題,如 層與層之間的剝離或分開,其起因於一些因素,如當使用 時之收縮與拉伸力、黏合或其他的結合方法因時間而斷 裂,且在潮濕之CMP環境中而加速惡化。 鑑於上述缺點,因此我們需要一方法、製程與裝置 製造一線性CMP操作帶,其對於使用之壓力具有彈力、不 易剝離或分離,製作容易且成本低廉、且於複數個cmp 作裝置與環境中易於運作。 三、【發明内容】 士泛說來’本發明可滿足這些需求,藉著提供一強化 J a“物CMP操作帶。|發明可以許多方式來實施,包含 =、裝置、系、統、元件或方法等。本發明之一 將於以下說明。 一貝视5. Description of the invention (3) And for the end point detection system, the band will encounter the problem of rape at the beginning. The use of linear strips in linear strip CMP systems is expensive to produce and time-consuming to replace. Replacing the linear belt requires the CMP system to be suspended, leading to reduced production and increased production costs. Linear tapes may encounter problems, such as peeling or separation between layers, due to factors such as shrinkage and tensile force when used, adhesion or other bonding methods that break over time and are wet In the CMP environment. In view of the above-mentioned shortcomings, we need a method, process and device to manufacture a linear CMP operating belt, which is resilient to the pressure used, is not easy to peel or separate, is easy to manufacture and low cost, and is easy to use in multiple cmp devices and environments. Operation. III. [Summary of the Invention] Shi Pan said that the present invention can meet these needs, by providing a strengthened J a "physical CMP operation belt. | The invention can be implemented in many ways, including =, device, system, system, element or Method, etc. One of the present invention will be described below.

人心i I實施例中,揭露一種cmp操作用帶。其包含一聚 二及一連择為一連續環路來決定該cmp操作用帶、 核心被定義為該聚合物材質之一堅固連續師孔 來人^:實施例中1露一種CMP操作用帶。其包含-I物材I被塑造為-連續環路來決定該CMP操^In the embodiment of the human mind i, a cmp operation belt is disclosed. It includes one polymer, one continuous, and one continuous loop to determine the cmp operation belt. The core is defined as one of the polymer material's sturdy continuous teacher's holes. Here comes a CMP operation belt. It contains -I Material I is shaped as a -continuous loop to determine the CMP operation ^

586158 五、發明說明(4) 帶、以及一強化編織物,嵌入該聚合物材質與一附加聚合 物層之間。該強化編織物被定義為一連續環路於該聚合物 材質與該附加聚合物層之間。 本發明有許多優點。一個本發明顯著的好處與優點為 大大的增加了聚合物CMP操作帶在CMP製程中之使用期。不 像典型習知技術之線性CMP操作帶,本發明之強化核心提 供了所需之強度、支撐與彈性,而堆疊結合之層與層間不 會發生剝離或分開。本發明之強化核心被包圍在操作帶之 結構中’因此其與該帶之結構整合。聚合物材質被塑造環 繞且穿過該強化核心,或喷灑及穿過該強化核心,使得" CMP操作帶在CMP製程中之使用期大幅增加。 另一個優點為降低成本與簡化製造。不像典 術之操作帶,本發明之一實施例包含一單一内^ '二其周圍有研磨帶之聚合物群塑造。在另一實施例中' 本I明包含一支撐與主導之聚合物材質結構。 數層:之黏合劑、編結物或其他之結合材 =, 而不會連累強度、支撐與彈性。 皮移 另個優點為易於將本發明之告#点丨你1 泉置整合之能力。本發明之;例f光學終點横測 戶」,其可結合終點偵測裴先學由 強度、支撐與彈性。此外,餐人 不會連累所需之 增加剝離或分開之可能性,或;測裝置並不會 另一優點為本發明為特1 夕呆乍帶之使用期。 遽擇。本發明之實施例;仿二^特殊之應用提供了複數個 例了依據特定條件或製程需要,藉著586158 V. Description of the invention (4) A belt and a reinforced braid embedded between the polymer material and an additional polymer layer. The reinforced braid is defined as a continuous loop between the polymer material and the additional polymer layer. The invention has many advantages. A significant benefit and advantage of the present invention is that it greatly increases the useful life of the polymer CMP process belt in the CMP process. Unlike the linear CMP operating belt of typical conventional techniques, the reinforced core of the present invention provides the required strength, support, and elasticity, and the layers and layers that are combined in a stack will not peel or separate. The reinforced core of the present invention is enclosed in the structure of the operating belt 'so it is integrated with the structure of the belt. The polymer material is shaped around and passed through the reinforced core, or sprayed and passed through the reinforced core, which greatly increases the service life of the " CMP operation belt in the CMP process. Another advantage is reduced cost and simplified manufacturing. Unlike a typical operating belt, one embodiment of the present invention includes a single polymer group with abrasive belts around it. In another embodiment, the present invention includes a supporting and dominant polymer material structure. Several layers: adhesives, braids or other bonding materials = without compromising strength, support and elasticity. Peeling Another advantage is the ability to easily integrate the information of the present invention. The present invention; Example f Optical end-point transverse survey user ", which can be combined with end-point detection to learn from strength, support and elasticity. In addition, the diners will not be involved in the need to increase the possibility of peeling or separation, or the testing device does not have another advantage: the use of the present invention is particularly useful. Choose. Examples of the present invention; imitating two special applications provides a plurality of examples according to specific conditions or process needs, by

Η、L貫施方式】 t發明揭露一種CMP操作帶 :二”,操作帶包含一強化筛匕方;。在較佳實 ^資%繞該篩孔帶來定義該操作帶一/、以一聚合物 f合物材質所構成,並以織布 人’其由― 義CMP製程中所使用之操作帶。h成材質來強化而定 在接下來的說明中,提出許多明 發明之完整瞭解。然而,孰糸此去$節來提供對本 確說明的情況;::以=在-= 混清本發^所熟知之製程操作不做詳細說…避免 册圖1A顯示一典型線性帶CMP系統1〇〇。一線性CMp操作 絜1 〇 2裱繞著二滾輪1 〇 4。一進行處理之晶圓〗〇 6貼附至一 線性帶CMP系統1〇〇上之晶圓運送器1〇8。晶圓運送器1〇8 被引起旋轉110,其造成晶圓106旋轉,而滾輪丨〇4旋轉而 導致線性CMP操作帶1 〇 2朝方向11 2移動。其上有晶圓1 〇 6貼 附之旋轉中的晶圓運送器1 〇 8被施加壓力至以方向1 1 2環繞 滾輪104移動之線性CMP操作帶102。平台114位於線性CMP 操作帶1 0 2相對於其上有晶圓1 〇 6貼附之晶圓運送器1 0 8之 下方(即線性CMP操作帶1 02相對於晶圓運送器108之另一 586158 五、發明說明(6) 邊)。平台114提供了額外之支撐,以使晶圓106可以充分 之壓力施加到線性CMP操作帶1 02來達成所欲之平坦化或其 他的CMP製程,而且提供了一可供進行一致且可量測之處 理的平坦表面。圖1B為上述線性帶CMP系統丨〇〇之侧視圖。方式, L method of implementation] t invention discloses a CMP operation belt: two ", the operation belt contains a reinforced sieve square; in a better practice, around the sieve belt to define the operation belt one /, one The polymer f-composite material is composed of the operation belt used in the CMP process by the weaver. It is reinforced by the material. In the following description, many complete understandings of the invention are proposed. However, here we go to the $ section to provide a clear explanation of the situation; ::: clarify the process operation of the well-known process with = in-= ^ do not go into details ... Avoid the book Figure 1A shows a typical linear band CMP system 1 〇. A linear CMP operation 絜 〇2 mounted around the two rollers 104. a processing wafer 〇06 attached to a linear tape CMP system 100 wafer carrier 108. The wafer carrier 108 is caused to rotate 110, which causes the wafer 106 to rotate, and the rotation of the rollers 〇〇4 causes the linear CMP operation belt 10 to move in the direction 112. There is a wafer 106 attached to it The rotating wafer carrier 108 is pressed to the linear CMP operation belt 10 that moves around the roller 104 in the direction 1 1 2 2. The platform 114 is located below the linear CMP operation belt 1 0 2 relative to the wafer carrier 108 with the wafer 106 attached thereto (that is, the linear CMP operation belt 10 02 is opposite the wafer conveyor 108 Another 586158 V. Description of the invention (6) side). The platform 114 provides additional support so that the wafer 106 can be applied with sufficient pressure to the linear CMP operation belt 102 to achieve the desired planarization or other CMP process Moreover, a flat surface is provided for consistent and measurable processing. Fig. 1B is a side view of the above-mentioned linear belt CMP system.

由圖1 A與1 B中可了解,當線性帶CMP系統1 〇 〇運轉中, 線性CMP操作帶1〇2承受許多壓力。舉例來說,當線性CMP 操作帶102上之一點通過滾輪1〇4時,其承受了一拉伸力, 且線性CMP操作帶1 〇2之外側區域所承受之拉伸力較其内側 區域大。當線性CMP操作帶102上之該點繼續通過並^離滾 輪104時,其承受一收縮力,因為該帶往外伸直且通過該 線性帶CMP系統1 〇〇之頂端或底端,往下一個滾輪1〇4移 動。此外,線性帶CMP操作系統1〇〇使線性CMp操作帶1〇2承 受了操作壓力,如晶圓倚靠在操作表面之下壓力、旋轉之 晶圓106與線性CMP操作帶1〇2之間的摩擦接觸、及其他此 類之操作壓力。 〃It can be understood from FIGS. 1A and 1B that when the linear belt CMP system 100 is in operation, the linear CMP operating belt 102 is subjected to many pressures. For example, when a point on the linear CMP operation belt 102 passes through the roller 104, it receives a tensile force, and the outer CMP area of the linear CMP operation belt 102 receives a larger tensile force than its inner area. . When the point on the linear CMP operating belt 102 continues to pass through and away from the roller 104, it receives a contraction force because the belt straightens out and passes the top or bottom end of the linear belt CMP system 1000, and goes to the next The roller 104 moves. In addition, the linear belt CMP operating system 100 subject the linear Cmp operation belt 102 to operating pressure, such as the pressure of the wafer against the operating surface, the rotating wafer 106 and the linear CMP operation belt 102. Friction contact, and other such operating pressures. 〃

圖2A為一典型線性CMP操作帶12〇之橫剖面圖。該例 性線性CMP操作帶120包含三層122、124與126。頂端之聚 合物層122提供了在CMP製程中被晶圓106 (見圖u與^ ) 所施加壓力之操作表面。一緩衝層丨24通常設置於^喿 面聚合物層122與支持層或基層126之間,且 作' 合物層1 22與堅硬的支持層或基層丨2 6之間提供了'一 Ξί金ΪΓ 或基層126為一實心不銹鋼或其㈣ 似之金屬帶,其上有緩衝層124與聚合物操作表面声9 成。此複數層通常藉著黏合、於一層上鑄造另一層胃或其1FIG. 2A is a cross-sectional view of a typical linear CMP operation zone 120. FIG. The exemplary linear CMP operation zone 120 includes three layers 122, 124, and 126. The top polymer layer 122 provides an operating surface that is pressed by the wafer 106 (see Figs. U and ^) during the CMP process. A buffer layer 24 is usually provided between the polymer layer 122 and the support layer or the base layer 126, and provides a gold layer between the composite layer 1 22 and the hard support layer or the base layer 26. ΪΓ or base layer 126 is a solid stainless steel or similar metal strip, and a buffer layer 124 and a polymer operating surface are formed thereon. The multiple layers are usually bonded by casting one stomach or another on one layer

586158586158

類似兩層之接合方法來結合。 圖2B為圖2A中之典型線性CMP操作帶12〇具有一帶之開 放區域1 2 8之橫剖面圖,其配合一現場光學終點偵測 (EPD, End Point Detection)系統來使用。由圖2B可看 出,線性CMP操作帶120的一部分被移除,包括支持層或基 層126、緩衝層124及操作表面聚合物層122。當一線性cmp 操作帶120中形成一開放區域128時,一作為光學epd實施 用之足夠大小的開放區域1 2 8被產生於線性操作帶1 2 〇中。 通常,足夠大小包含線性CMP操作帶120之小圓形、橢圓形 或方形區域,其大小依據特定之操作裝置而改變,其通常 之尺寸為長約1.25吋,寬約〇· 75吋,因此並不是線性CMp 操作帶1 2 0之全部寬度,否則如此大的尺寸會嚴重減弱線 性CMP操作帶1 20之結構強度。作為epd用之開放區域丨2 8的 製造通常包含於線性CMP操作帶1 20中形成一孔洞或開放區 域且穿透操作表面聚合物層122、緩衝層124及支持層或基 層126之每一層。 如上所述,在線性CMP操作系統1 〇 〇 (見圖丨A與丨β )正 常運轉時所引起之拉身力與收縮力會引起如圖2 A ^斤示之線 性CMP操作帶1 20層與層間之剝離或分開。此正常使用所造 成壓力之效果會因包含研漿、沖洗等之潮濕環境而加重= 如圖2 B所示之開放區域1 2 8之結構會增加線性c % p操作帶 1 2 0遭受結構問題(包含層與層間之剝離或分開)之 t 性,因為承受壓力之表面積增加、層間之接合點、黏人點 或其他接合暴露於潮濕環境之可能性的增加、支持層$某Similar to the joining method of two layers. FIG. 2B is a cross-sectional view of the typical linear CMP operating belt 120 in FIG. 2A with an open area 1 28 of a belt, which is used in conjunction with an on-site optical end point detection (EPD) system. As can be seen from FIG. 2B, a portion of the linear CMP operation belt 120 is removed, including a support layer or a base layer 126, a buffer layer 124, and an operation surface polymer layer 122. When an open area 128 is formed in a linear cmp operation belt 120, an open area 1 2 of a sufficient size for implementation as an optical epd is generated in the linear operation belt 1220. Generally, a small circular, oval, or square area of sufficient size including a linear CMP operating zone 120, the size of which varies depending on the particular operating device, and its usual dimensions are approximately 1.25 inches long and 0.75 inches wide, so It is not the full width of the linear CMP operating belt 1 2 0, otherwise such a large size will seriously weaken the structural strength of the linear CMP operating belt 1 20. The manufacturing of the open area used as the epd 28 usually involves forming a hole or open area in the linear CMP operation belt 120 and penetrating each of the operation surface polymer layer 122, the buffer layer 124, and the support layer or the base layer 126. As mentioned above, when the linear CMP operating system 100 (see Figures 丨 A and 丨 β) is operating normally, the pulling force and contraction force caused by the linear CMP operating system will cause the linear CMP operating belt 120 as shown in Figure 2A. Peel or separate from the layer. The effect of pressure caused by this normal use will be aggravated by the humid environment including mortar, washing, etc. = The structure of the open area 1 2 8 shown in Figure 2 B will increase linearity c% p Operating belt 1 2 0 suffers from structural problems (Including peeling or separation between layers), due to increased surface area under pressure, increased likelihood of joints between layers, sticky points or other joints exposed to moisture, support layer

第11頁 586158 五、發明說明(8) 層1 2 6由所產生之開放區域而發生結構上的減弱等等。 圖3A為依據本發明一實施例之CMP操作帶150之橫剖面 圖。在圖3A所示之改良CMP操作帶150中,其基本上由_聚 合物1 5 2材質(在此也稱為聚合物層1 5 2及聚合物1 5 2 )結 合一不銹鋼或其他材質之篩孔核心1 54所構成。在一實施 例中’該篩孔核心1 5 4形成一約略核心或中央層,且該聚 合物層1 5 2環繞且穿過該篩孔核心1 5 4而形成。用來構成該 CMP操作帶聚合物層1 52之聚合物材質的例子包含聚氨g旨、 聚醋、聚氯乙烯(P V C )、聚丙烯酸酯與環氧樹脂。所形 成之結構具有彈性且可承受於線性帶CMp系統1〇〇 (見圖ιΑ 〃 1 B )中使用所造成之拉伸與收縮力,且被作為一單獨且 完整之結構,因此其遭受層與層間之剝離或分開的可能性 較低,其提供了 一作為CMP處理之穩定表面、容易與光學 EPD系統整合、為耐用且持久的,並且有許多超越習知技 術之優點。 在本發明之一實施例中,篩孔核心丨54提供了 一内部 ^撐,就如同圖2A與2B所述之支持層或基層126。在此所 次明的,CMP操作帶之篩孔核心被決定為一連續環路、帶 狀的内核心。此連續環路沒有起點與終點,因此為一帶狀 結,。不像圖2A與2B之實心的支持層或基層126,本發明 之篩孔,〜1 5 4提供了作為一内核心所需之強度與支撐, 且因其篩孔之設計,其結合形成於聚合物層丨5 2中,可實 質上減少或消除層與層之間剝離或分開之可能性,而此剝 離或分開部可能發生於當聚合物層結合或以其他方式形成Page 11 586158 V. Description of the invention (8) Layer 1 2 6 is structurally weakened by the resulting open area and so on. Fig. 3A is a cross-sectional view of a CMP operation belt 150 according to an embodiment of the present invention. In the modified CMP operation belt 150 shown in FIG. 3A, it is basically made of a polymer 1 5 2 (also referred to herein as a polymer layer 1 5 2 and a polymer 1 5 2) combined with a stainless steel or other material. The sieve core 1 54 is formed. In one embodiment, 'the sieve core 1 4 5 forms an approximately core or central layer, and the polymer layer 1 5 2 surrounds and passes through the sieve core 1 15 4. Examples of the polymer material used to constitute the polymer layer 152 of the CMP process belt include polyurethane, polyvinyl acetate, polyvinyl chloride (PVC), polyacrylate, and epoxy resin. The resulting structure is flexible and can withstand the tensile and contractive forces caused by the use of the linear belt CMP system 100 (see Figure ι 〃 1 B), and is treated as a separate and complete structure, so it suffers from layers Possibility of peeling or separation from layers is low, it provides a stable surface as a CMP process, is easy to integrate with optical EPD systems, is durable and durable, and has many advantages over conventional techniques. In one embodiment of the present invention, the sieve core 54 provides an internal support, just like the support layer or base layer 126 described in FIGS. 2A and 2B. It is clear here that the sieve core of the CMP operation belt is determined as a continuous loop, belt-shaped inner core. This continuous loop has no beginning and end, so it is a ribbon knot. Unlike the solid support layer or base layer 126 of FIGS. 2A and 2B, the sieve holes of the present invention provide the strength and support required as an inner core, and due to the design of the sieve holes, their combination is formed in In the polymer layer, the possibility of peeling or separation between layers can be substantially reduced or eliminated, and this peeling or separation may occur when the polymer layers are bonded or formed in other ways.

第12頁 586158 五、發明說明(9) ' 於圖2A與2B所示之支持層或·基層丨26時。 圖3B為依據本發明另一實施例之CMp操作帶15〇之橫剖 面圖。圖3B所示之實施例中,聚合物CMp操作帶15〇藉著一 篩孔強化層154來強化。圖3B之篩孔強化層154其結構與圖 3A所示之篩孔核心1 54相同。因此,篩孔強化層丨54為二 C Μ P操作帶1 5 0之師孔層’其具有一連續環路、帶狀^構。 在一實施例中,CMP操作帶1 50基本上由聚合物層152所構 成,且該強化篩孔層1 54配置於聚合物層1 52之底表面。接 著,強化篩孔層154藉著喷灑156另外的聚合物材質153而 與聚合物層1 5 2結合,形成一附加聚合物層丨5 3而導致強化 篩孔層1 54成為一篩孔核心1 54。在一實施例中,附加聚合 物層153其材質與聚合物層152相同。再另一實施例中,附 加聚合物層153其材質與聚合物層152不同,依照製程需要 與要求而定。 在本發明之一貫施例中,一喷灑器1 5 8被用來喷灑1 § 6 (或其他方式)聚合物至強化篩孔層1 54,其位置倚靠著 已被聚合物152塑造之CMP操作帶150。附加聚合物層153被 加到強化篩孔層1 5 4與聚合物層1 52,在一實施例中,形成 一連續結構,其與聚合物層1 52具有相同之聚合物材質\ 且流過及環繞強化篩孔層1 54之廣泛多孔性篩孔結構。' 圖3C為依據本發明再一實施例之CMP操作帶15〇之橫剖 面圖。圖3C所示之實施例中,聚合物CMP操作帶1 5 〇藉著一 師孔強化層1 5 4來強化。圖3 C之筛孔強化層1 5 4其結構與圖 3Α與3Β所示之篩孔核心1 54相同。在圖3C所示之實施例Page 12 586158 V. Description of the invention (9) 'At the time of the support layer or the base layer shown in Figs. 2A and 2B. Fig. 3B is a cross-sectional view of a CMP operating belt 15o according to another embodiment of the present invention. In the embodiment shown in Fig. 3B, the polymer CMP operating belt 150 is reinforced by a mesh reinforcement layer 154. The structure of the mesh reinforcement layer 154 of FIG. 3B is the same as the mesh core 154 of FIG. 3A. Therefore, the sieve reinforcement layer 54 is a pore layer of two CMP operating belts 150, which has a continuous loop and a belt-like structure. In one embodiment, the CMP operation belt 150 is basically composed of the polymer layer 152, and the reinforced mesh layer 1 54 is disposed on the bottom surface of the polymer layer 152. Next, the reinforced sieve layer 154 is combined with the polymer layer 152 by spraying 156 with another polymer material 153 to form an additional polymer layer 5 3, which causes the reinforced sieve layer 1 54 to become a sieve core. 1 54. In one embodiment, the material of the additional polymer layer 153 is the same as that of the polymer layer 152. In still another embodiment, the material of the additional polymer layer 153 is different from that of the polymer layer 152, which depends on the needs and requirements of the manufacturing process. In one embodiment of the invention, a sprayer 158 is used to spray 1 § 6 (or other means) polymer to the reinforced sieve layer 1 54 in a position that rests against the shape of the polymer 152 CMP operation belt 150. The additional polymer layer 153 is added to the reinforced mesh layer 1 5 4 and the polymer layer 1 52. In one embodiment, a continuous structure is formed, which has the same polymer material as the polymer layer 1 52 and flows through And a wide porous mesh structure surrounding the reinforced mesh layer 154. 3C is a cross-sectional view of a CMP operation belt 15o according to yet another embodiment of the present invention. In the embodiment shown in FIG. 3C, the polymer CMP operation band 150 is strengthened by a master hole strengthening layer 154. The structure of the mesh reinforcement layer 1 54 of FIG. 3C is the same as the mesh core 1 54 of FIGS. 3A and 3B. The embodiment shown in FIG. 3C

第13頁 586158 五、發明說明(ίο) 中’ CMP操作帶1 50基本上由聚合物層152圍繞篩孔核心ι54 而形成,其類似圖3A所示之CMP操作帶150。在一實施例 中’ 一操作表面層1 55接著形成於圍繞篩孔核心丨54之聚合 物層1 5 2上。在另一實施例中,操作表面層利用如圖3β所 示之喷灑器來喷灑。圖3C所示之CMP操作帶1 50可被用於操 作條件之最適化,其利用具有不同硬度之操作表面層丨 與聚合物層1 52之材質。操作表面層155與聚合物層152皆 可為聚合物材質,因此可被穩固的結合。此外,當操作條 件允許時,操作表面層丨55可被塑造或以其他方法形成/' 而且包含一或多個個別層,圖3C僅顯示一層。一由多層聚 $物物質所構成之操作表面層丨5 5可被利用於,在CMp操作 帶150中採用不同硬度層,來達成所欲之操作表面特性, 舉例來說’在操作表面之下的緩衝層。 圖4A為依據本發明一實施例之CMp操作帶16〇之橫剖面 f °在圖4A所示之改良CMP操作帶16〇中,其基本上由一聚 合物材質1 6 2結合一編織物或合成材質強化層丨6 * ,及一以 ^灑或其他方式所形成之附加聚合物層1 6 6所構成,其將 、扁織物或合成材質強化層丨6 4結合至聚合物材質1 6 2。聚合 物材質162可包含任何複數之適合用來製造CMP操作帶及^ 作表面之聚合物材質,包含聚氨酯、聚酯、pVc、聚 ’、 酸S旨與複數之環氧樹脂等等。 〜在貫施例中’編織物或合成材質強化層1 6 4為一聚 ,笨曱醯胺(keviar )之織物。在另一實施例中,編織物 尺由合成材質所構成,如尼龍、聚亞醯胺、聚酯等合成織Page 13 586158 5. In the description of the invention ('ο), the CMP operation belt 1 50 is basically formed by the polymer layer 152 around the sieve core ι54, which is similar to the CMP operation belt 150 shown in FIG. 3A. In one embodiment, an operation surface layer 1 55 is then formed on the polymer layer 1 52 surrounding the sieve core 54. In another embodiment, the operation surface layer is sprayed using a sprayer as shown in Fig. 3β. The CMP operating belt 150 shown in FIG. 3C can be used for optimizing the operating conditions by using the materials of the operating surface layer 丨 and the polymer layer 152 having different hardnesses. Both the operation surface layer 155 and the polymer layer 152 can be made of a polymer material, so they can be firmly combined. In addition, when the operating conditions allow, the operating surface layer 55 may be shaped or otherwise formed / 'and contains one or more individual layers, FIG. 3C shows only one layer. An operating surface layer composed of multiple layers of polymer material 5 5 can be used to achieve different operating surface characteristics using different hardness layers in the CMP operating belt 150, for example, 'under the operating surface Buffer layer. FIG. 4A is a cross section f of a CMP operating belt 16o according to an embodiment of the present invention. In the modified CMP operating belt 16 shown in FIG. 4A, it is basically composed of a polymer material 16 2 combined with a knitted fabric or Synthetic material reinforcement layer 6 *, and an additional polymer layer 1 6 6 formed by spraying or other means, which combines a flat fabric or a synthetic material reinforcement layer 6 4 to a polymer material 1 6 2 . The polymer material 162 may include any plurality of polymer materials suitable for manufacturing CMP process belts and surfaces, including polyurethane, polyester, pVc, poly ', acid and plural epoxy resins, and the like. ~ In the examples, the woven or synthetic material reinforcing layer 164 is a poly-keviar fabric. In another embodiment, the woven fabric ruler is made of synthetic materials, such as nylon, polyamide, polyester, etc.

第14頁 586158 五、發明說明(ll) 在有些例子中,編織物係為合成材質之組合,舉例來 吞兄,例如尼龍材質形成織物之_方& 物之另-方向。依此方旨材料:成織 性,如強度、硬度或彈物之需求特 性的施行於一CMP操作帶160。 处王要求,而選擇 在圖4A所示之實施例中,附加聚合物層166顯示,其 :::物或合成材質強化層164結合至聚合物材質162。附 ::::2層166彳包含任何複數之適合用來製造CMP操作帶 =ς S物,包含聚氨醋、聚醋、pvc、聚丙稀酸醋與任何 稷數之環氧樹脂等等。 如圖4A所*,本發明之一實施例包含施加附加聚合物 :抱八藉著利用聚合物喷灑器158喷灑156所欲之聚合 =織物或合成材質強化層丨6 4暫時被夾住、固定、釘 ϊϋ二或以其他方式暫時被置於聚合物材質上162。 水口 、灑器1 5 8用來喷灑1 5 6該附加聚合物層丨6 6,如此 附加Λ*。物層丨6 6被施加於編織物或合成材質強化層1 6 4 在一實施例中,其滲入編織物或合成材質強化層 $成一化學鍵結於聚合物材質1 6 2與附加聚合物層 在一實施例中,聚合物材質162與附加聚合物層 # 1 #目同之聚合物製造。在另外之實施例中,聚合物材 人;^ 附加聚合物層1 6 6由不同之聚合物製造。然而,聚 e物之$性提供了層與層間強大、固定的,且在某些例子 中之化學鍵結,其有效的將編織物或合成材質強化層丨64 包圍在結合之聚合物162、1 66之中。Page 14 586158 V. Description of the invention (ll) In some examples, the knitted fabric is a combination of synthetic materials, for example, to swallow the brother, for example, nylon material to form the other side of the fabric. According to the purpose of the material, the texture characteristics such as strength, hardness, or elasticity are applied to a CMP operation belt 160. Requested by the king, and selected In the embodiment shown in FIG. 4A, the additional polymer layer 166 is shown, and the ::: material or synthetic material reinforcement layer 164 is bonded to the polymer material 162. Attach :::: 2 layer 166 彳 contains any number of suitable materials for making CMP operation belts, including polyurethane, polyacetate, pvc, polyacrylic acid and any number of epoxy resins. As shown in FIG. 4A *, one embodiment of the present invention includes the application of additional polymer: Bao Ba by spraying 156 with a polymer sprayer 158 desired polymerization = fabric or synthetic material strengthening layer 6 4 temporarily clamped , Fixed, nailed or otherwise temporarily placed on a polymer material 162. The nozzle and the sprinkler 1 5 8 are used to spray 1 5 6 of the additional polymer layer 6 6, so Λ * is added. The physical layer 丨 6 6 is applied to the knitted or synthetic material reinforcement layer 1 6 4 In an embodiment, it penetrates into the knitted or synthetic material reinforcement layer to form a chemical bond with the polymer material 1 6 2 and the additional polymer layer. In one embodiment, the polymer material 162 and the additional polymer layer # 1 # are made of the same polymer. In other embodiments, the polymer material is ^ The additional polymer layer 166 is made of a different polymer. However, the properties of poly-E materials provide a strong and fixed layer to layer, and in some cases chemical bonding, which effectively encloses a woven or synthetic material reinforcement layer 64 in the bound polymer 162, 1 66.

第15頁 586158 五、發明說明(12) 柽你冊貝施例中,編織物或合成材質強化層164形成CMP 162之連廣’因此具有如CMP操作帶160之聚合物材質 之掣造方哭裒路、帶狀結構。如上所述,本發明一實施例 矽又t ,法包含暫時施加編織物或合成材質強化層1 64到 法。如 、b 2,糟者如夾住、固定、釘住、黏合等方 層1°64二接Γ來詳細說明之圖5,編織物或合成材質強化 ,人可$成倚靠著聚合物材質162之内表面,或者編織物 材質強化層丨64可形成倚靠著聚合物材質162之外表 作二此處所利用,聚合物材質162之内表面與定義CMP操 7 〇之連續環路、帶狀結構之内表面一致。CMP操作帶 總之内表面為與滾輪104及平台114 (參考圖1A與1B)接 表面因此’其外表面為具有一操作表面且一晶圓施 加於其上進行處理之表面。 圖4B為依據本發明一實施例之CMp操作帶16〇之橫剖面 圖。與圖4A所示之CMP操作帶160相似,圖4B中之CMP操作 帶包含一聚合物材質162、一編織物或合成材質強化層164 與I ^ ί聚合物層166。編織物或合成材質強化層164被安 置倚罪著聚合物材質162,且附加聚合物層166藉著噴灑 1 56或其他方式施加附加聚合物層丨6 6而施加於編織物或合 成材質強化層1 64上,如此所施加之聚合物滲入編織物或 合成材質強化層164而形成一強大且固定之化學鍵結於聚 合物材質1 6 2與附加聚合物層丨6 6之間,有效的將編織物或 合成材質強化層164包圍在CMP操作帶160之中。在一些例 子中,t合物材質1 6 2與附加聚合物層1 6 β之間所形成之結Page 15 586158 V. Description of the invention (12) In the example of your book, the braided or synthetic material reinforcement layer 164 forms the CMP 162, so it has a polymer material such as the CMP operation belt 160. Kushiro, ribbon structure. As described above, an embodiment of the present invention includes a method of temporarily applying a braid or a synthetic material reinforcing layer 164 to a method. For example, b 2, the bad ones such as clamping, fixing, pinning, gluing, and other square layers 1 ° 64 are connected to Γ to explain in detail. Figure 5, knitted or synthetic materials are strengthened, one can rely on polymer materials 162 The inner surface of the braided material or the reinforced layer of woven material 丨 64 can be formed against the outer surface of the polymer material 162 for use here. The inner surface of the polymer material 162 and the continuous loop and band structure that define the CMP operation 7 The inner surface is consistent. The inner surface of the CMP operation belt is the surface connected to the roller 104 and the platform 114 (refer to FIGS. 1A and 1B). Therefore, its outer surface is a surface having an operation surface and a wafer applied thereon for processing. Fig. 4B is a cross-sectional view of a CMP operating belt 160 according to an embodiment of the present invention. Similar to the CMP operation belt 160 shown in FIG. 4A, the CMP operation belt in FIG. 4B includes a polymer material 162, a braid or a synthetic material reinforcement layer 164, and a polymer layer 166. The braided or synthetic material reinforcement layer 164 is placed against the polymer material 162, and the additional polymer layer 166 is applied to the braided or synthetic material reinforcement layer by spraying 156 or otherwise applying the additional polymer layer. 6 6 On 1 64, the applied polymer penetrates into the knitted fabric or synthetic material reinforcement layer 164 to form a strong and fixed chemical bond between the polymer material 1 6 2 and the additional polymer layer 丨 6 6. A woven or synthetic reinforcing layer 164 is enclosed in the CMP operation belt 160. In some examples, the knot formed between the t-composite material 16 2 and the additional polymer layer 1 6 β

第16頁 586158 五、發明說明(13) 合為化學鍵結。圖4B所示之實施例包含一EPD開放區域 168 ’其作用如圖2B中之描述。Page 16 586158 V. Description of the invention (13) Chemical bonding. The embodiment shown in Fig. 4B includes an EPD open area 168 'whose function is as described in Fig. 2B.

在一實施例中,EPD之開放區域1 68被形成於編織物或 合成材質強化層164之中,在將編織物或合成材質強化層 1 64置於聚合物材質上1 6 2之前。在施加了附加聚合物層 166之後,聚合物材質162與附加聚合物層166結合而包圍 編織物或合成材質強化層1 6 4。在^一實施例中,E P D之開放 區域168被形成於CMP操作帶160之中,藉著形成一穿過聚 合物材質1 6 2與附加聚合物層1 6 6之開放區域,其對準與穿 過已經形成於編織物或合成材質強化層丨64之中的開放區 域。在某些應用中,所選擇的編織物或合成材質是堅固、 強韋刃與财用的,所以難以切開或穿過來形成EpD開放區 域。當編織物或合成材質被包圍於聚合物材質中時,開放 區域變得難以形成,因此開放區域被形成於將編織物或合 成材質強化層164置於聚合物材質上162之前。In one embodiment, the open area 1 68 of the EPD is formed in the knitted or synthetic material reinforcing layer 164 before the knitted or synthetic material reinforcing layer 1 64 is placed on the polymer material 1 62. After the additional polymer layer 166 is applied, the polymer material 162 is combined with the additional polymer layer 166 to surround the knitted or synthetic material reinforcement layer 164. In one embodiment, the open area 168 of the EPD is formed in the CMP operation belt 160. By forming an open area passing through the polymer material 16 and the additional polymer layer 16, the alignment and Pass through an open area that has been formed in a woven or synthetic material reinforcement layer 64. In some applications, the braid or synthetic material chosen is strong, strong, and financial, so it is difficult to cut or penetrate to form the EpD open area. When the knitted fabric or synthetic material is surrounded by the polymer material, the open area becomes difficult to form. Therefore, the open region is formed before the knitted fabric or synthetic material reinforcement layer 164 is placed on the polymer material 162.

在其他實施例中’聚合物材質丨6 2與附加聚合物層1 6 6 在EPD開放區域1 68被定義穿過編織物或合成材質強化層 164之區域較薄(未示於圖4B)。在某些實施例中,不需 要7G全穿透所有的聚合物材質162、編織物或合成材質強 化層1 6 4與附加聚合物層1 6 6。因為編織物或合成材質強化 層164已具有一EPD開放區域,可允許光學傳送穿透該強化 層,聚合物材質1 6 2與附加聚合物層丨66僅需要被削薄來使 得EPD所用之光學傳送得以通過。 在其他實施例中,EPD之開放區域168被製造,藉著於In other embodiments, the 'polymer material 6 2 and the additional polymer layer 1 6 6 are defined in the EPD open area 1 68 as being thinner through the braid or synthetic material reinforcement layer 164 (not shown in FIG. 4B). In some embodiments, it is not necessary for 7G to penetrate all the polymer materials 162, braids or synthetic materials to strengthen the layers 16 and the additional polymer layers 166. Because the woven or synthetic material reinforcement layer 164 already has an EPD open area, which allows optical transmission to penetrate the reinforcement layer, the polymer material 1 62 and the additional polymer layer 66 need only be thinned to make the optical used in EPD Transmission passed. In other embodiments, the open area 168 of the EPD is manufactured by

第17頁 586158 五、發明說明(14)Page 17 586158 V. Description of the invention (14)

—製造完成之CMP操作帶160形成一穿透每一個組合之聚合 物材質1 6 2、編織物或合成材質強化層1 6 4與附加聚合物層 1 6 6之開放區域。在一替代性實施例中,當製造◦ μ p操作帶 160時,EPD之開放區域1 68可被製造於聚合物材質丨62之 中’ Μ形成該連續環路、帶狀結構時,且一開放區域可被 形成於編織物或合成材質強化層164之中,在其被置於聚 合物材質上162之前。當編織物或合成材質強化層ι64被置 於聚合物材質上162之前,對準各組合層之開放區域。附 加聚合物層1 6 6被施加,結合該層並包圍編織物或合成材 質強化層164來形成CMP操作帶160。EPD之開放區域168接 著被形成,藉著擊穿位於聚合物材質1 62與編織物或合成 材質強化層1 6 4中已形成之開放區域上的附加聚合物層 166 〇 圖5為依據本發明之實施例,在圖4Α與4Β所示之結構 中施加附加聚合物層1 6 6的細部圖。如圖4Α與4Β所述,編 織物或合成材質強化層1 6 4被製造為一連續環路、帶狀結 構,且被安置倚靠於亦是連續環路、帶狀結構之聚合物材 質162。編織物或合成材質強化層164可被置於聚合物材質 上162之内表面或外表面,依據所欲CMP操作帶1 60的實施 與使用而定。在一實施例中,編織物或合成材質強化層 1 64由聚對苯甲醯胺製成。在其他實施例中,編織物或合 成材質強化層1 6 4是由任何複數個織物或合成材質所構 成,包含聚酯、人造纖維、尼龍、聚亞醯胺或合成纖維之 混合物等等。通常所選擇之編織物或合成材質強化層1 6 4-The finished CMP operation belt 160 forms an open area penetrating each combination of polymer material 16 2, knitted or synthetic material reinforcement layer 16 4 and additional polymer layer 1 6 6. In an alternative embodiment, when manufacturing the μ p operating band 160, the open area 1 68 of the EPD may be manufactured in a polymer material 62, when the continuous loop, band structure is formed, and The open area may be formed in the braid or synthetic material reinforcement layer 164 before it is placed on the polymer material 162. When the knitted or synthetic material reinforcement layer ι64 is placed on the polymer material 162, the open area of each combination layer is aligned. An additional polymer layer 1 6 is applied, which is combined with the layer and surrounds the braid or synthetic material reinforcement layer 164 to form a CMP operating belt 160. The open area 168 of the EPD is then formed by breaking through the additional polymer layer 166 on the open area formed in the polymer material 1 62 and the braid or synthetic material reinforcement layer 1 64. Figure 5 is in accordance with the present invention In the embodiment, a detailed view of applying an additional polymer layer 166 to the structure shown in FIGS. 4A and 4B is shown. As shown in FIGS. 4A and 4B, the woven fabric or synthetic material reinforcing layer 164 is manufactured as a continuous loop, band structure, and is placed against a polymer material 162 which is also a continuous loop, band structure. The braid or synthetic material reinforcement layer 164 may be placed on the inner or outer surface of the polymer material 162, depending on the implementation and use of the desired CMP operation belt 160. In one embodiment, the braid or synthetic material reinforcing layer 164 is made of polyparaben. In other embodiments, the knitted or synthetic material reinforcing layer 164 is composed of any plurality of fabrics or synthetic materials, including polyester, rayon, nylon, polyamide, or a mixture of synthetic fibers, and the like. Woven or synthetic reinforcement of choice 1 6 4

第18頁 586158 五、發明說明(15) 為多孔狀,可允許附加平人从 質,如此使得聚合物“广62物鱼層广穿過編織物或合成材 形成-鍵結,有效的將編气物;^加//併物層166之聚合物 在臂人& u π 1 π & 、扁織物或合成材質強化層164包圍 發生如習知CMP操作帶及择作矣之、、且°、、Ό構’基本上不會 間制離與分開之問題作表面所使用之結構之層與層 一如圖5所示,本發明之一實施例包含藉著以一 所H8喷灑1 56聚合物材質來施加附加聚合物層1『6。 合二ΐ;=合门物層166的聚鑛^ 的實施例中,^目可為之聚合物或聚合物材質,或者在其他 實施例中,所i擇:ϊ ϋ ί聚合物或聚合物材質。在較佳 與固定姓人β 士擇聚5物或聚合物材質具有可提供強力 為化iii'成之特性。在其他實施例中,所形成之結合 PVC、鍵、。例示性之聚合物材質包含聚氨酯、聚酯、 瞭解,H稀酸酿與任何複數之環氧樹脂等等。由圖5中可 1 6 4,於|也加之聚合物穿過編織物或合成材質強化層 力且固合物材質162與附加聚合物層166之間形成一強 住。所二=鍵結,且將編織物或合成材質強化層1 6 4包圍 單元。7成之結構決定了強化之CMP操作帶為一組合結構 面圖圖1為副依據本發明另一實施例之CMP操作帶170之橫剖 材質162、6所示之實施例中,CMP操作帶170包含聚合物 、 、編織物或合成材質強化層1 64與附加聚合物層 第19頁 586158P.18 586158 V. Description of the invention (15) is porous, which can allow the flat surface to be attached, so that the polymer "guang 62 objects and fish layers can pass through the woven fabric or synthetic material to form a bond, which will effectively edit Gas matter; ^ plus // the polymer layer 166 of the polymer in the arm & u π 1 π &, flat fabric or synthetic material reinforcement layer 164 surrounded by the occurrence of the conventional CMP operation band and optional, and °, Ό structure 'basically does not have the problem of separation and separation. The layers and layers of the structure used on the surface are shown in Fig. 5. An embodiment of the present invention includes spraying with a H8 1 56 polymer material to apply the additional polymer layer 1 "6. ΐ 二 ΐ; = 合 门 物 层 166 的 聚聚 ^ In the embodiment, ^ mesh may be a polymer or polymer material, or in other embodiments In the choice, ϊ 聚合物 polymer or polymer material. In the preferred and fixed family β shi selection polymer or polymer material, it has the characteristics of providing a strong power. In other embodiments The resulting combination of PVC, bond, and exemplified polymer materials includes polyurethane, polyester, understand, H dilute acid and What is the number of epoxy resins and so on. From Figure 6 may be 1 6 4 and also add the polymer through the braid or synthetic material to strengthen the layer and the solid material 162 and the additional polymer layer 166 form a Strong. So the second = bonding, and the braid or synthetic material reinforced layer 1 6 4 surrounds the unit. 70% of the structure determines the strengthened CMP operation belt as a combined structure. Figure 1 is another according to the present invention. In the embodiment shown in the cross-section material 162, 6 of the CMP operation belt 170 of the embodiment, the CMP operation belt 170 includes a polymer, knit, or synthetic material reinforcing layer 1 64 and an additional polymer layer. Page 19 586158

166 灑 4A 面 戈口圃4A 挪α衣囬層172被鑄造、喑 、或以其他方式施加到圖6所示之CMP操作帶17〇。圖、 、4B、5所示之實施例中’聚合物材質162決定了操 、土。^圖6所不之實施例中’ 一不同之操作表面層172被麵 定CMP操作帶170之操作表面。 %决166 Sprinkle 4A surface Gokoupu 4A alpha coat layer 172 is cast, cast, or otherwise applied to the CMP operation belt 17 shown in FIG. 6. In the embodiment shown in Figs., 4B, and 5, the polymer material 162 determines the operation and soil. ^ In the embodiment shown in Fig. 6, a different operation surface layer 172 is used to define the operation surface of the CMP operation belt 170. % Decision

製造圖6所示之CMP操作帶170之目的為最適化操作 面,其應用於欲採用與底下之聚合物材質162或附加聚合 物層166具有不同硬度之操作表面層172。如圖5所示,^ 織物或合成材質強化層164可被置於聚合物材質上162之 表面或聚合物材質162之外表面。依此方式,不同硬度之 層可被組合來最適化操作表面層172之硬度,依據操^條 件與要求而定。在一實施例中,聚合物材質162、編織物 或合成材質強化層164與附加聚合物層166被製造如圖u、 4Β、5所示,然後操作表面層172被鑄造於已形成之層上 決定CMP操作帶170之操作表面。在其他實施例中,聚合物 材質1 62、編織物或合成材質強化層丨64與附加聚合物層 166被製造,然後操作表面層172被噴灑The purpose of manufacturing the CMP operation belt 170 shown in FIG. 6 is to optimize the operation surface, and it is applied to an operation surface layer 172 having a different hardness from the underlying polymer material 162 or the additional polymer layer 166. As shown in FIG. 5, the fabric or synthetic material reinforcing layer 164 may be placed on the surface of the polymer material 162 or on the outer surface of the polymer material 162. In this way, layers of different hardness can be combined to optimize the hardness of the operating surface layer 172, depending on operating conditions and requirements. In one embodiment, polymer material 162, braid or synthetic material reinforcement layer 164 and additional polymer layer 166 are manufactured as shown in Figures u, 4B, and 5, then the operation surface layer 172 is cast on the formed layer. The operation surface of the CMP operation belt 170 is determined. In other embodiments, a polymer material 1 62, a woven or synthetic material reinforcement layer 64, and an additional polymer layer 166 are manufactured, and then the operation surface layer 172 is sprayed

於已形成之層上來決定CMP操作帶17〇。 万式細加 圖6所示之CMP操作帶1 7 〇之實施例還可被用來控制CMp 操作帶170之厚度,以符合製程要求。依據上述本發明各 實施例之典型CMP操作帶150、160、17〇之厚度範圍約從8〇 密爾(nnl )到1〇〇密爾。在依據本發明之CMp操作帶17〇之 實施例中,聚合物材質162、編織物或合成材質強化層164The CMP operation band 170 is determined on the formed layer. The embodiment of the CMP operating belt 170 shown in FIG. 6 can also be used to control the thickness of the CMP operating belt 170 to meet the process requirements. The thickness of the typical CMP operation belts 150, 160, and 170 according to the above embodiments of the present invention ranges from about 80 mils (nnl) to 100 mils. In the embodiment of the CMP operating belt 17o according to the present invention, the polymer material 162, the braid or the synthetic material reinforcement layer 164

第20頁 586158Page 586 158

f附加t合物層1 6 6之厚度可被最小化到約2 〇到3 〇密爾之 |。巳圍’而保持所欲強度與結構支撐之特性。然後整個cΜΡ 細作帶ijo之厚度便視操作表面層172之種類與厚度而定。 舉例來說,如果想要較厚之CMp操作帶17〇,聚合物材質 162、附加聚合物層166、操作表面層172之任一者可被製 造成一所欲厚度來達成設計目標。以相似的方法,層 1 72 162、166之厚度與組成可被調整來達到所欲硬度、 強度等等,依據操作條件與要求而定。The thickness of the f-additive compound layer 166 can be minimized to about 20 to 30 mils.巳 'to maintain the desired strength and structural support characteristics. Then, the thickness of the entire cMP tape Ijo depends on the type and thickness of the operation surface layer 172. For example, if a thicker CMP operation belt 17 is desired, any one of the polymer material 162, the additional polymer layer 166, and the operation surface layer 172 can be made to a desired thickness to achieve the design goal. In a similar way, the thickness and composition of layers 1 72 162, 166 can be adjusted to achieve the desired hardness, strength, etc., depending on the operating conditions and requirements.

,=二依據圖3A、3B、3C所示實施例之CMP操作帶150 中,可藉著調整上述聚合物層152、附加聚合物層153、操 y表面層1 55任一者來達到所欲厚度。在一實施例中,於 ,整個操作帶丨50之厚度便視操作表面層丨55之種類與 ^度而疋。如果想要較厚之CMP操作帶,聚合物層1 52結合 二戶^包圍之篩孔核心1 54可被製造成一所欲厚度來達到所 要求厚度之CMP操作帶。== In the CMP operation belt 150 according to the embodiment shown in FIGS. 3A, 3B, and 3C, any one of the polymer layer 152, the additional polymer layer 153, and the surface layer 1 55 can be adjusted to achieve the desired thickness. In an embodiment, the thickness of the entire operation belt 50 depends on the type and degree of the operation surface layer 55. If a thicker CMP operation belt is desired, the polymer layer 1 52 combined with the mesh core 1 54 surrounded by two households ^ can be made into a CMP operation belt of a desired thickness to achieve the required thickness.

一接下,對圖3 A、3B、3C所示本發明實施例之結構做更 、v之w兒明’圖7為依據本發明一實施例之篩孔核心1 5 4 f。在所不之實施例中,篩孔核心1 54被設計為格 μ 、型態。如此處所述,格子決定了内部篩孔核心丨54之 ^ Ό構,且格子亦可被設計為陣列型態。垂直部分1 74a ^ ^平部分1 74b被安排而形成一如圖示之直交格子。在一 二鼽例中,绵孔核心丨5 4藉著黏合、接合、鍛接、焊接或 ^他方法將垂直部分174a與水平部分1?4b固定而形成。如 下來圖8A與8B將詳細說明的,篩孔核心丨54不限於垂直Next, the structure of the embodiment of the present invention shown in Figs. 3A, 3B, and 3C is changed. Fig. 7 is a screen core 1 5 4f according to an embodiment of the present invention. In various embodiments, the sieve core 1 54 is designed as a grid μ. As described here, the grid determines the structure of the inner sieve core 54, and the grid can also be designed as an array. The vertical portion 1 74a ^ ^ The flat portion 1 74b is arranged to form an orthogonal grid as shown. In one or two cases, the cotton core 5 4 is formed by fixing the vertical portion 174 a to the horizontal portion 1-4 b by gluing, joining, forging, welding, or other methods. As will be explained in detail in FIGS. 8A and 8B below, the sieve core 54 is not limited to vertical

第21頁 586158 五、發明說明(18) 』;2 : ί Γ部分1 74b ’其可為任何所要求之方向或格 74 (如圖7A所示之l74am74b),依 據标作ί衣丨兄、要求與規格等而定。 在一實施例中,為了要中斷格子,每一個格子部分 174a與l、74b之間的連接點176被固定,此處在接下來 與8B將詳細說明。在另一實施例中,格子或陣列藉著編 織、編結或其他方法形成具有内編織部分17“盥 子來製造。 一〖40之裕 在-實施例中,垂直部分174a與水平部分mb為由不 鏽鋼所構成之圓柱轴狀或單股金屬線。其他可形成筛孔核 心154之材質包含不鏽鋼合金、鋁、鋼與鋼等,以 乂 性CMP操作帶150 (如圖3A )強韌之内部架構,其可承受'正Page 21 586158 V. Description of the invention (18) "2: ί Γ part 1 74b 'It can be any required direction or grid 74 (l74am74b shown in Fig. 7A), according to the label as yiyi, brother, Requirements and specifications vary. In one embodiment, in order to interrupt the grid, the connection point 176 between each grid portion 174a and 1, 74b is fixed, which will be described in detail below and 8B. In another embodiment, the grid or array is manufactured by weaving, knitting, or other methods to form a 17 "toilet with an inner braided portion.-In the embodiment, the vertical portion 174a and the horizontal portion mb are used Cylindrical shaft or single-stranded metal wire made of stainless steel. Other materials that can form the sieve core 154 include stainless steel alloy, aluminum, steel, and steel, etc., with a strong CMP operation belt 150 (Figure 3A), strong internal structure Which can withstand 'positive

常線性CMP操作所引起之壓力,且易於製造及易於被包"" I 於聚合物中,因此不會遭受層間剝離,且提供一適合支斤 CMP處理之晶圓施壓之堅固結構,提供一耐用之強、化口# # 帶來維持CMP裝置之操作,且不會遭受拉伸或其他之= 形。圓柱軸狀結構,與單股金屬線或棒狀相似,被選^ 來提供一最有彈性、最強韌或最耐用之結構,其用來製& 篩孔核心1 5 4。本發明之其他實施例包含利用具有平括/ 面與薄外觀之矩形軸狀,來提供巨大表面積作為格子1八 1 7 4 a與1 7 4 b之間接合點的結合,或其他易於在^孔之格刀 或陣列型態中形成之結構。 + 圖8 A與8 B顯示以一替代性之格子或陣列型熊所構成 篩孔核心之實施例。在圖8A中,篩孔核心1 54以一链μ 裡簡單The pressure caused by the normal linear CMP operation is easy to manufacture and easy to be enclosed in the polymer, so it will not suffer from interlayer peeling, and provides a strong structure suitable for supporting the pressure of wafers for CMP processing. Provide a durable and strong, chemical port # # to maintain the operation of the CMP device without being stretched or otherwise deformed. The cylindrical shaft-like structure, similar to a single strand of metal wire or rod, was selected to provide the most flexible, strong or durable structure used to make & sieve cores 1 5 4. Other embodiments of the present invention include the use of a rectangular shaft with a flattened surface and a thin appearance to provide a large surface area as a combination of joints between the grids 1 7 4 a and 1 7 4 b, or other easy Holes are formed in a knife or array pattern. + Figures 8A and 8B show an embodiment of a sieve core formed by an alternative grid or array type of bear. In FIG. 8A, the sieve core 1 54 is simple in a chain μ.

586158586158

土錯或斜」線格子型態來製造。在圖8B中,篩孔核心i54結 =圖7所示之直父格子與圖8 A所示之簡單交錯或斜線格子 來製造。圖8 A與8B僅顯示兩種具有複數格子排列或形狀之 替代性實施例。此處應瞭解,篩孔核心154之格子部分174 可隨特定應用來安排與設計。舉例來說,篩孔核心154可 被叹计來提供額外之交錯帶強化、提供額外之帶強化環繞 於線性CMP操作帶周長、或提供所需要之特定、局部的強 化或加強。一特定、局部之強化的例子將於圖9 b中說明。 替代性之格子或陣列型態提供了複數個本發明之實施例, 以滿足複數個CMP操作應用之需求。 圖9 A為依據本發明一實施例之篩孔核心丨5 4之細部 圖。在圖9A所示之實施例中,一EPD開放區域178由篩孔核 〜1 5 4移除。如上面圖7所示,篩孔核心1 5 4之實施例藉著 黏合、接合、锻接、焊接或其他方法將垂直部分丨7 4 a與水 平部分174b固定而形成。為了要中斷格子,每一個格子部 分174a與174b之間的連接點176被固定。圖9A顯示一在篩 孔核心1 5 4之格子中中斷之例子。格子部分之連接點被固 定’如此使得移除一固定連接點之一軸部而留下其餘三 軸,且該固定連接點原封不動。如圖9A所示,一EPD開放 區域1 7 8藉著選擇性的切除複數個鄰接格子連接點之垂直 部分17 4a與水平部分174b而形成於篩孔核心154内。因為 格子連接點1 7 6為固定的,所以篩孔核心1 5 4可保持所欲之 強度、硬度、彈性與恢復力,其原本由篩孔核心1 5 4所提 供。EPD開放區域1 78可容許光學EPD訊號被傳送穿過線性It can be made by the pattern of soil error or oblique line. In FIG. 8B, the sieve core i54 knot is manufactured by a straight parent grid shown in FIG. 7 and a simple staggered or diagonal grid shown in FIG. 8A. Figures 8A and 8B show only two alternative embodiments having a plurality of lattice arrangements or shapes. It should be understood here that the lattice portion 174 of the screen core 154 may be arranged and designed according to a specific application. For example, the screen core 154 may be metered to provide additional staggered band reinforcement, to provide additional band reinforcement around the circumference of the linear CMP operating belt, or to provide the specific, localized strengthening or reinforcement required. An example of a specific, local enhancement will be illustrated in Figure 9b. Alternative lattice or array types provide multiple embodiments of the invention to meet the needs of multiple CMP operation applications. FIG. 9A is a detailed view of a sieve core 5 54 according to an embodiment of the present invention. In the embodiment shown in FIG. 9A, an EPD open area 178 is removed by the sieve cores ~ 154. As shown in FIG. 7 above, the embodiment of the screen core 1 54 is formed by fixing the vertical portion 7 4a to the horizontal portion 174b by gluing, joining, forging, welding, or other methods. To interrupt the grid, a connection point 176 between each grid portion 174a and 174b is fixed. Fig. 9A shows an example of a break in the grid of the sieve core 154. The connection point of the grid portion is fixed 'so that one shaft portion of a fixed connection point is removed and the remaining three axes are left, and the fixed connection point remains intact. As shown in FIG. 9A, an EPD open area 178 is formed in the screen core 154 by selectively cutting a plurality of vertical portions 17 4a and horizontal portions 174b adjacent to the connection points of the lattice. Because the grid connection point 176 is fixed, the sieve core 1 5 4 can maintain the desired strength, hardness, elasticity and restoring force, which was originally provided by the sieve core 154. EPD open area 1 78 allows optical EPD signals to be transmitted through linear

第23頁 586158 五、發明說明(20) CMP操作帶150 (見圖3A)。圖9A所示之EPD開放區域178具 有一形狀,其易由所示之篩孔核心丨54之格子來製造。在 一典型CMP操作帶150中,EPD開放區域178之形狀為圓形、 糖圓形或方形,且可被修飾來符合特殊處理需求。所示之 EPD開放區域1 78為任何複數個可能形狀之代表。Page 23 586158 V. Description of the invention (20) CMP operation belt 150 (see Fig. 3A). The EPD open area 178 shown in Fig. 9A has a shape that can be easily manufactured from the grid of the sieve core 54 shown. In a typical CMP operation zone 150, the EPD open area 178 is circular, sugar-shaped, or square, and can be modified to meet special processing requirements. The EPD open area 178 shown is representative of any number of possible shapes.

圖9 B為依據本發明另一實施例之篩孔核心丨5 4之細部 圖。在圖9A中,一EPD開放區域178形成於篩孔核心154 中。在所示之實施例中,EPD開放區域178藉著支持部分 1 8 0來強化。支持部分丨8 〇可視需求來製造與形成,以定義 EPD開放區域178之周圍。在一篩孔核心154之實施例中, 其格子是藉著編織、編結或其他方式編結格子部分丨7 4來 製造,一具有支持部分18〇之EPD開放區域;1 78對於避免散 開、拉伸或其他在格子中之中斷區域之變形特別有用。在 一貫施例中’支持部分至少固定在每一個環繞Ep])開放區 域周圍之格子連接點。所示之實施例僅為多數格子部分 1 74之構型與型態的其中之一。在另一個實施例中(未圖 示)’ 一或更多圓形之支持部分180定義了EPD開放區域 1 7 8之周圍,其依附在篩孔核心丨5 4之格子,至少固定在每 一個鄰接之格子連接點。Fig. 9B is a detailed view of a sieve core 5 54 according to another embodiment of the present invention. In FIG. 9A, an EPD open area 178 is formed in the screen core 154. In the illustrated embodiment, the EPD open area 178 is enhanced by the support portion 180. Supporting part 丨 8 〇 It can be manufactured and formed according to requirements to define the EPD open area 178 around. In an embodiment of a sieve core 154, the lattice is made by weaving, knitting, or other methods of knitting the lattice portion, 74, an EPD open area with a supporting portion 18, and 1 78 for avoiding spreading and stretching. Or other deformations in the interrupted areas in the grid are particularly useful. In the conventional embodiment, the 'support portion is fixed at least at each grid connection point surrounding the open area surrounding Ep]). The embodiment shown is only one of the configurations and forms of most lattice sections 174. In another embodiment (not shown), one or more circular support portions 180 define the EPD open area 1 78, which is attached to the grid of the sieve core 5 4 and fixed at least to each Adjacent grid connection points.

圖10A顯示依據本發明一實施例之製作CMp操作帶之方 法。圖10A顯示一形成於鑄造模型182a、182b之中的CMp操 作帶之截面’其包含_EPD開放區域178於篩孔核心154 中。在一實施例中,篩孔核心丨5 4位於鑄造模型之第一側 18 2a與第二側182b之間。在一實施例中,epd開放區域178Fig. 10A shows a method for making a CMP operation belt according to an embodiment of the present invention. Fig. 10A shows a cross-section of a CMP operating belt formed in the casting molds 182a, 182b, which contains an EPD open area 178 in the screen core 154. In one embodiment, the screen core 5 4 is located between the first side 18 2a and the second side 182b of the casting mold. In one embodiment, the epd open area 178

第24頁 586158Page 586158

之位置鄰接於鑄造模型第二側1821)之特徵區域〗84,來產 生一線性CMP操作帶之較薄區域於EpD開放區域丨78。聚合 物之f驅物或液態聚合物被引入鑄造模型中,而流動並環 繞内篩孔核心1 5 4而形成。利用聚合物與鑄造模型來形成 一線性CMP操作帶將藉著圖1丨來做更進一步之說明。 在本發明之一實施例中,在EPD開放區域178之特徵部 分184形成一聚合物丨52表面之較薄區域於EpE)開放區域 178。在利用一光學EPD系統之線性帶CMp系統1〇〇中(見圖 1A與1B )。一光束被傳送穿過線性CMp操作帶。epd開放區 域178允許光束傳送穿過該篩孔核心154。複數之聚合物^ a午X限之光束傳送穿過聚合物群,且在本發明之一實施例 中’聚合物1 5 2群之厚度被最小化以允許光學傳送。特徵^ 部分184提供鑄造一聚合物1 52之較薄區域於EPD開放區域 1 78。在一替代性之實施例中,鑄造模型之第一側丨82a與 第一側1 8 2 b沒有特徵部分1 8 4,且如果需要的話,在形成 線性CMP操作帶之後,將在EPD開放區域178之聚合物^2表 面削薄。在另一個實施例中,在EPD開放區域178之聚合物 1 52群被局部處理以除去聚合物丨52。此局部清除之聚I物 152區域就如同一扇穿過EPD開放區域178之窗戶。 口 圖10B顯示本發明之鑄造模型182a、182b之另一實施 例。圖10B所示之鑄造模型之第一側182a與第二侧丨82b ^ 具有一特徵部分184位於EPD開放區域178。特徵部分18/形 成一聚合物152群之較薄區域於線性CMP操作帶之上下表^ 面。如圖10A所述,EPD開放區域178之聚合物152可另外被The position is adjacent to the characteristic region 84 on the second side 1821) of the casting model to generate a thinner region of the linear CMP operation band in the EpD open region 78. Polymeric polymers or liquid polymers are introduced into the casting mold, and flow and form around the inner sieve core 154. The use of polymers and casting models to form a linear CMP operating belt will be further explained with reference to FIG. In one embodiment of the present invention, a characteristic portion 184 of the EPD open area 178 forms a thinner surface of the polymer 52 at the EpE) open area 178. In a linear band CMP system 100 using an optical EPD system (see Figs. 1A and 1B). A light beam is transmitted through a linear CMP operating belt. The epd open area 178 allows light beams to pass through the screen core 154. A plurality of polymer beams are transmitted through the polymer group, and in one embodiment of the present invention, the thickness of the 'polymer 1 5 2 group is minimized to allow optical transmission. Features ^ Section 184 provides a thinner area of a polymer 1 52 cast in the EPD open area 1 78. In an alternative embodiment, the first side of the casting model 82a and the first side 1 8 2 b do not have a characteristic portion 1 8 4 and, if necessary, will be in the EPD open area after forming the linear CMP operation zone The surface of polymer 178 is thinned. In another embodiment, the polymer 1 52 population in the EPD open area 178 is treated locally to remove polymer 52. This partially cleared area 152 is like the same window through the EPD open area 178. Fig. 10B shows another embodiment of the casting models 182a, 182b of the present invention. The first side 182a and the second side 82b of the casting model shown in FIG. 10B have a characteristic portion 184 located in the EPD open area 178. The feature portion 18 / forms a thinner region of the polymer 152 cluster above and below the linear CMP operating band. As shown in FIG. 10A, the polymer 152 of the EPD open area 178 may be additionally

586158 五、發明說明(22) 處理而清除聚合物152區域,來形成一窗戶 ,11為依據本發明—實施例’製造—聚合物線性⑽ 法的流程圖2 00。所示之方法由操作2〇2開始, ί ί Π :物線性CMP操作帶之篩孔核心被置於線性CMP操 1 1。線性CMf操作帶之模型接下來將參考圖丨^與 Μ /坪細5兒明。在操作202中,聚合物線性(:評操作帶之 師孔核心,其可依需求包含或不包含EpD開放區域,被安 置於模型中而,得聚合物環繞且穿過該篩孔核心來鑄造。 $下來在操作204中,準備一用來塑造線性CMp操作帶 ^ H °在一實施例中’一用來塑造聚合物線性CMP操 =合物利用—完整之聚合物製模容器來製備,其接 :來:參考圖UA與13Β來詳細說明。任何所欲之聚合物都 可依據預期之製程要求而被使用。通t,有彈性、耐用且 ,韌的材質較常用於線性CMP操作帶,以有效的進行晶圓 ,坦化而不產生刮傷。戶斤選擇之聚合物未必要完全具有彈 但在使用中不應該變鬆。不同之聚合物可被選擇來增 :J預期製程之某些特性。在一實施例+,聚合物可為聚氨 曰。在另一實施例中,聚合物可為氣甲酸乙醋(urethane )混合物,其可產生完整線性CMp操作帶之操作表面,直 為一微孔之聚氨酯,具有一比重約為0H. 5克/平方公 ^及硬度約為2.5-90蕭耳(处〇1~6)1)。通常,一液態樹脂 與一液態硬化劑被混合而形成聚氨酯混合物。在另一實施 例中’聚合物凝膠可用來形成線性CMp操作帶。 在操作2 04之後,於操作20 6將準備好之聚合物注入模586158 V. Description of the invention (22) Process and clear the area of polymer 152 to form a window, 11 is a flowchart of 00 according to the present invention-Example ‘manufacturing — polymer linearization method. The method shown starts with operation 202, and the sieve core of the linear CMP operation belt is placed in the linear CMP operation. The model of the linear CMf operation band will be described with reference to Figures ^ and Μ / /. In operation 202, the polymer is linear (: the core of the master hole of the operation belt, which may or may not include an EpD open area, is placed in the model, and the polymer surrounds and passes through the sieve core to be cast. In operation 204, prepare a linear CMP operation belt to prepare a linear CMP operation in one embodiment. 'One is used to shape the polymer linear CMP operation. The use of the polymer-a complete polymer molding container to prepare, Connection: Come: Refer to Figures UA and 13B for details. Any desired polymer can be used according to the expected process requirements. Through t, flexible, durable and tough materials are more commonly used in linear CMP operation belts In order to effectively carry out wafers, frankization does not produce scratches. The polymer selected by the householder does not need to be completely elastic but should not become loose in use. Different polymers can be selected to increase: Certain characteristics. In one embodiment +, the polymer may be polyurethane. In another embodiment, the polymer may be a mixture of urethane gaseous formic acid, which can produce the operating surface of a complete linear CMP operating band, Polyammine Ester, having a specific gravity of about 0. 5 g / cm <2> and a hardness of about 2.5-90 Xiao Er (where 0 ~ 6) 1). Generally, a liquid resin and a liquid hardener are mixed to form a polyurethane mixture. In another embodiment, a &apos; polymer gel may be used to form a linear CMP operating band. After operation 20 04, the prepared polymer is injected into the mold at operation 20 6

586158 五、發明說明(23) ------------ 材二被f入貝3例中’氨甲酸乙酯或其他聚合物或聚合物 10B二隹半圓柱狀模型。圓柱狀模型將參考画與 之模^都了一Λ說明。此處應了解,任何其他形式與形狀 心候型都可合適地使用。 此應H在f作2°8中’加熱硬化所製備之聚合物。在 化' 要苴口 ί類之聚合物皆可以任何方式被加熱硬 之物;里特性。:ijincMp操作帶中可產生所欲 -氨甲西”咕在人實中,在一預定溫度下,加熱硬化 作帶。d:5物一預定時間’來形成一氨甲酸乙醋操 合化時間與溫度,其應該適合所選擇之聚 c:合物材質,或適合達到特定要求之性質。在另一 熱塑性材質被加熱處理,然後藉著冷卻而定 該聚合物線性CMP操 在一實施例中,該模 ’如接下來圖13A與 在操作2 0 8之後,進行操作2 j 〇 乍帶藉著由模型中移出而進行去模( 1為聚合物線性CMP操作帶製模容器 1 3 B之詳細說明。 工至一^定2作212中’聚合物線性㈣操作帶被車床加 果聚合物線性CMP操作帶為且有= 製程。如 作212中還包令為具有EPD開放區域之實施例,操 實施例中,聚合物線性 02-0. 2„t, λ _ 第27頁 JOO 丄:&gt;« 五、發明說明(24) 聚合f線⑽p操作帶所利用之⑽製程而定。 操作212之後,於择作91/| 士 ^枉而疋 之聚合物線性CMP操作=4:矣,在依據本發明-實施例 實施例中,在塑造時%作形成溝槽。在另一 圖案來形成。在—實施=槽f者在模型内提供-適當之 削及畫出溝槽,以產生!!:有鑄:物於車床上車 之邊:’於操作216中對聚合物線性cmp操作帶 操作:且傕用然後’在操作218中清理聚合物線性cmp 3預備使用。在—實施例中,聚合物線性CM p操作 =長度為90-110吋,寬度為8_16吋,厚度為〇〇2_〇2吋。 ,其適合用於Lam Research公司所製造之TeresTM線性拋 、&gt;裝置。一旦聚合物線性CMp操作帶已準備使用,該製程 方法便完成。 圖1 2 A顯示篩孔核心1 54位於線性CMP操作帶模型(未 圖不)之中的部分。在一實施例中,篩孔核心j 54置於模 型中’且位於一軌道内及由模型底部軌道2 2〇c延伸出來之 支持器上。在另一實施例中,篩孔核心丨5 4之垂直部分 1 74a被週期性的延伸來提供支撐予篩孔核心丨54。篩孔核 心1 54之支撐被提供來將篩孔核心;[5 4置於模型(未圖示) 中,俾使聚合物線性CMP操作帶被製造,其環繞且穿過篩 孔核心1 5 4並且有一足夠所欲之距離介於篩孔核心1 5 4之邊 緣與完成之聚合物線性CMP操作帶之邊緣之間。此處需注 意,篩孔核心1 54之堅固結構允許安置與支撐篩孔核心1 54 於模型(未圖示)中。在一實施例中篩孔核心1 5 4被置於586158 V. Description of the invention (23) ------------ In the 3 cases of material Ⅱ, urethane or other polymer or polymer 10B, two semi-cylindrical model. The cylindrical model will be described with reference to the model and model ^. It should be understood here that any other form and shape cardioid may be suitably used. This should be a polymer prepared by heat hardening at a temperature of 2 ° 8 '. The polymers of the 'class' can be heated in any way; the characteristics. : IjincMp operation belt can produce the desired-carbamazepine "in human reality, at a predetermined temperature, heat and harden into a belt. D: 5 things a predetermined time 'to form a urethane ethyl acetate operation time Temperature, which should be suitable for the selected poly c: composite material, or properties suitable to meet specific requirements. In another thermoplastic material, heat treatment is performed, and then the polymer linear CMP operation is performed by cooling. In one embodiment, This mold is as shown in FIG. 13A and after operation 208, operation 2j is performed. The tape is removed by removing it from the model (1 is a polymer linear CMP operation belt molding container 1 3B details Explanation. The "Polymer Linear 2" operation belt in the work 212 is made by the lathe plus the polymer linear CMP operation belt and there is a process. For example, the operation in 212 also includes an EPD open area, In the embodiment, the polymer linearity is 02-0. 2 „t, λ _ page 27 JOO 丄: &gt;« V. Description of the invention (24) The polymer f-line ⑽p operation belt is used for the process. Operation 212 After that, the polymer linear CMP operation of 91 / | In the embodiment according to the present invention, in the embodiment, the groove is formed during molding. It is formed in another pattern. In-implementation = groove f is provided in the model-appropriate cut and draw the groove to Produced !!: There is a cast: the object is on the lathe and the side of the car: 'Operate the polymer linear cmp operation belt in operation 216: and use it' and then clear the polymer linear cmp 3 in operation 218 for use. In the example, the polymer linear CM p operation = 90-110 inches in length, 8-16 inches in width, and 002_〇2 inches in thickness. It is suitable for TeresTM linear polishing, &gt; devices manufactured by Lam Research. Once the polymer linear CMP operating belt is ready for use, the process is completed. Figure 12 A shows the portion of the sieve core 1 54 located in the linear CMP operating belt model (not shown). In one embodiment, The screen core j 54 is placed in the model 'and is located in a track and on a support extending from the bottom track 2 220c of the model. In another embodiment, the vertical part 1 74a of the screen core 5 4 is Periodically extended to provide support to the screen core 丨 54. Screen The support of the heart 1 54 is provided to place the sieve core; [5 4 is placed in a model (not shown), so that a polymer linear CMP operation belt is manufactured, which surrounds and passes through the sieve core 1 5 4 and has a The sufficient distance is between the edge of the screen core 1 5 4 and the edge of the completed polymer linear CMP operation belt. Note here that the solid structure of the screen core 1 54 allows the screen core 1 to be placed and supported 54 in a model (not shown). In one embodiment, the screen core 1 5 4 is placed

第28頁 586158 五、發明說明(25) '— -- 支持器上(見圖12B),且在另一實施例中,被置於為了 支撐棋型中的師孔核心1 5 4而延伸出來之垂直部分1 7 4 L ^。當被安置時,篩孔核心1 54之材質特性可避免下陷、 号曲、折疊等等。在一實施例中,為了精確將篩孔核心 154置於模型中,舉例來說,鄰接EpD開放區域,提供了内 部安置接腳(未圖示)。Page 28 586158 V. Description of the invention (25) '-on the support (see Figure 12B), and in another embodiment, it is placed to extend the support of the teacher's hole core 1 5 4 in the chess pattern The vertical part 1 7 4 L ^. When placed, the material characteristics of the sieve core 1 54 can avoid sags, tunes, folds, and the like. In one embodiment, in order to accurately place the screen core 154 in the model, for example, adjacent to the EpD open area, internal placement pins (not shown) are provided.

圖1 2B顯示依據本發明一實施例,一篩孔核心支持器 230支撐一篩孔核心丨54之情形。在一實施例中,篩孔核\ 支持器2 3 0由模型底部執道延伸出來,以將篩孔核心丨5 4置 於距完成之聚合物線性CMP操作帶之邊緣一所欲距離之 處。在一實施例中,篩孔核心支持器23〇之枝幹23〇a由一 材質所形成,其具有足夠強度可支撐篩孔核心丨54、可承 文熱或聚合物鑄造中之任何壓力、且易於在聚合物線性 CMP操作帶完成後與底部執道22〇c切斷分離。例示性的材 質包含軟或脆性金屬等等。FIG. 12B shows a screen core support 230 supporting a screen core 54 according to an embodiment of the present invention. In one embodiment, the sieve core \ supporter 2 30 extends from the bottom of the model to place the sieve core 5 4 at a desired distance from the edge of the completed polymer linear CMP operation belt. . In one embodiment, the stem 23a of the sieve core support 23 is formed of a material that has sufficient strength to support the sieve core 丨 54, can withstand any pressure in the thermal or polymer casting, And it is easy to cut off and separate from the bottom channel 22c after the completion of the polymer linear CMP operation belt. Exemplary materials include soft or brittle metals, and the like.

圖1 3 A與1 3 β顯示依據本發明一實施例之聚合物線性 CMP操作帶模型2 20。在圖13Α中,模型220分別顯示了其一 第一側220a與一第二側2 20b,及底部執道220c。一篩孔核 心位置執道2 20d位於底部執道22 0c中。第一側2 20a與第二 側2 2 0 b被組合而成為同心’如方向箭頭2 2 2所示,俾使第 一側22 0a定義所形成之聚合物線性CMp操作帶之第一表 面,第二側2 20b定義所形成之聚合物線性CMP操作帶之第 二表面’底部軌道220c定義所形成之聚合物線性CMP操作 帶之第三表面。在一實施例中,第一側22〇a定義所形成之Figures 13 A and 1 3 β show a polymer linear CMP operation band model 2 20 according to an embodiment of the present invention. In Fig. 13A, the model 220 shows a first side 220a and a second side 220b, and a bottom channel 220c, respectively. A sieve core position guide 20 20d is located in the bottom guide 22 0c. The first side 2 20a and the second side 2 2 0 b are combined to become concentric. As shown by the directional arrow 2 2 2, the first side 22 0a defines the first surface of the polymer linear CMP operating band formed, The second side 220b defines the second surface of the formed polymer linear CMP operation zone. The bottom track 220c defines the third surface of the formed polymer linear CMP operation zone. In one embodiment, the first side 22a defines the formed

586158 五、發明說明(26) f的上表面,第^一側22〇b疋義所形成之帶的下表面,底部 執道22 0c定義所形成之帶的側面。内部篩孔核心154 (見 圖1 2 A )被置於第一側2 2 0 a與第二側2 2 0 b之間,且被支撑 於底部執道2 20c上。 圖1 3 B顯不一組合之聚合物線性C Μ P操作帶模型2 2 〇, 其可置入内部篩孔核心154 (見圖12Α),然後液態聚合物 或聚合物前驅物可流入模型而形成聚合物線性]?操作 帶。如圖13Α所示,在一實施例中,底部軌道22〇c定義所 开&gt; 成之聚合物線性CMP操作帶的側面。在聚合物帶的形成 聚合物材質流入模型22 0中,在一實施例中,以一液 態聚合物或聚合物前驅物之形式。依照本發明一實施例, 液怨聚合物或聚合物前驅物接著填滿模型2 2 〇,流過且環 繞該内部篩孔核心。然後,在模型之頂端,液態聚合物&amp;或 聚合物前驅物之表面定義了所形成之聚合物線性CMp操作 帶的第二側面。 圖1 4為依據本發明另一實施例,製造一強化聚合物 CMP操作帶之方法的流程圖2 5 0。所示之方法由操作2 &amp; 2開 始’首先製造編織物或合成材質強化層。在一實施例中' 編織物或合成材質強化層是由聚對笨甲醯胺所形成。在其 他實施例中,編織物或合成材質強化層是由尼龍、人造纖 維、聚醋、聚亞醯胺、合成材質之混合物或任何其他所欲 之編織物或合成材質所構成’以提供所製造之αρ操作帶 所要求之強化。所要求之強化性質包含如強度、耐用性、 減少CMP操作帶在連續使用時拉伸之傾向、在一線性CMp操586158 V. Description of the invention (26) The upper surface of f, the lower surface of the band formed by the 22nd side of the first side, and the bottom 22a, which defines the side of the band. The inner screen core 154 (see FIG. 12A) is placed between the first side 220a and the second side 220b, and is supported on the bottom channel 220c. Figure 1 B shows a combination of polymer linear C MP operating belt models 2 2 0, which can be placed in the inner mesh core 154 (see Figure 12A), and then liquid polymers or polymer precursors can flow into the model and Forming a polymer linear] operating band. As shown in FIG. 13A, in one embodiment, the bottom track 22oc defines the side of the polymer linear CMP operation band that is opened. In the formation of the polymer band, the polymer material flows into the model 220, in one embodiment, in the form of a liquid polymer or polymer precursor. According to an embodiment of the present invention, the liquid polymer or polymer precursor then fills the model 220, flows through and surrounds the inner sieve core. Then, at the top of the model, the surface of the liquid polymer & or polymer precursor defines the second side of the polymer linear CMP operating band formed. FIG. 14 is a flowchart of a method for manufacturing a reinforced polymer CMP operation belt according to another embodiment of the present invention. FIG. The illustrated method begins with operation 2 &amp; 2 'to first manufacture a woven or synthetic reinforced layer. In one embodiment, the 'braid or synthetic material reinforcement layer is formed of polyparaben. In other embodiments, the braid or synthetic material reinforcement layer is made of nylon, rayon, polyester, polyurethane, synthetic material mixture, or any other desired braid or synthetic material to provide manufacturing The required strengthening of the αρ operating band. The required strengthening properties include, for example, strength, durability, reducing the tendency of the CMP process belt to stretch during continuous use, and a linear CMP operation.

IEH I 第30頁 586158 五、發明說明(27) ^ --------- 作裝置或系統中使用具有彈性等等。 袁;^ ί:Ϊ施:中’編織物或合成材質強化層被形成而倚 !造之CMP操作帶之聚合物材質之内表面。在另- 物Λ合成材質強化層被形成而倚靠著所製 2強化層依照所欲之尺寸來製造,且安置於 :柯 中。在-實施例中,當製造各層·,EPD開放區 Ϊίΐ需求被製造於編織物或合成材質強化層中。 之聚=在i=4中中’準備一將被塑造為cmp操作帶 =物或聚合物材質利用一聚合乍帶 用:塑造聚合物㈣作帶成為-連續環 具有所铲开1此藉者將所欲之聚合物或聚合物材質注入一 包含準心用ΐίΐ之模型中。在一實施例中,操作254 中之符费16?、來』化聚合物材質(參考圖4Α、4Β、、5、6 操作25γΛ之聚合物或聚合物材質。在—實施例中, 加聚合物芦聚合物或々聚合物材質包含製備用來作為附 質。 θ 〇上述之符號166)之聚合物或聚合物材 中,满要之聚合物或聚合物材質都可用於操作254 質# $人需求而定。通常,一有彈性、耐用且堅動之#IEH I Page 30 586158 V. Description of the invention (27) ^ --------- It is flexible to use in the device or system. Yuan; ^ ί: ΪShi: Middle ’woven or synthetic material reinforcement layer is formed to rely on the inner surface of the polymer material of the CMP operation belt. In another-Λ synthetic material reinforcement layer is formed and relied on the produced 2 reinforcement layer is made according to the desired size, and is placed in: Ke. In the embodiment, when manufacturing each layer, the EPD open area is required to be manufactured in a woven fabric or a synthetic material reinforcing layer. Gathering = In i = 4, 'prepare one will be shaped as a cmp operation belt = object or polymer material using a polymeric tape: use the polymer to shape the belt to become-a continuous loop with a shovel 1 of this borrower Inject the desired polymer or polymer material into a model that contains a quasi-centered application. In one embodiment, the polymer cost in operation 254 is 16 ?, and the polymer material is referred to (refer to FIG. 4A, 4B, 5, 6, and the polymer or polymer material in operation 25γΛ. In the embodiment, polymerization is added The material of polymer or polymer of arsenic includes preparation for adhering. Θ 〇 The above-mentioned symbol 166) of the polymer or polymer material can be used for operation 254 quality # $ It depends on people's needs. Generally, a flexible, durable, and stable #

Si二:線性CMP操作帶,以有效的進行晶圓平坦化 在使用中不庫兮:j擇之聚合物未必要完全具有彈性,但 不應邊變鬆。不同之聚合物可被選擇來增強預期Si 2: Linear CMP operation bands for effective wafer flattening. Not used during use: The polymer selected by J need not be completely flexible, but should not become loose. Different polymers can be selected to enhance expectations

586158 、發明說明(28) 製程之某些特性。在一實施例中,聚合物可為聚氨酯。在 另一實施例中,聚合物可為氨甲酸乙酯混合物,其可產生 完整之聚合物CMP操作帶之操作表面,其為一微孔之聚氨 酯,具有一比重約為0.4-15克/平方公分及硬度約為 2· 5-90蕭耳D。通常,一液態樹脂與一液態硬化劑被混合 而形成聚氨酯混合物。在另一實施例中,聚合物凝膠可用 來形成線性C Μ P操作帶。 在刼作2 54後,於操作2 5 6中將所製備之聚合物注入模 型中。在一實施例中,氨甲酸乙酯或其他之聚合物或聚合 物材質被加入一熱圓柱狀模型中。在一實施例中,將所製 2之?κ合物注入模型中而形成如上述圖中之符號丨6 2所代 表之聚合物材質。 在操作2 58中,戶斤製備之聚合物被加熱硬化。在此應 i使丄Ϊ何種類之聚合物皆可以任何方式被加熱硬化,只 性1、# 2 Ϊ ,聚合物CMP操作帶中可產生所欲之物理特 實施例中,在一預定溫度下,加熱硬化一氨甲酸 =曰=物一預定時間,來形成-氨甲酸乙醋操作帶。應 二物G化時間與溫度,其應該適合所選擇之聚合物或聚 :物,或適合達到特定要求之性質。在另一實施例 ^,性材質被加熱處理,然後藉著冷卻而定型。 模型中之後,進行操作2 60,該聚合物材質藉著由 著編織物或人成材暂合綠裔’其用來形成聚合物材質’其藉 切^ 口成材質強化層與附加聚合物層來強化,並且586158, Invention Description (28) Certain characteristics of the process. In one embodiment, the polymer may be polyurethane. In another embodiment, the polymer may be a urethane mixture, which may produce a complete polymer CMP operating surface, which is a microcellular polyurethane with a specific gravity of about 0.4-15 g / square. Cm and hardness is about 2.5-90 Xiao D. Generally, a liquid resin and a liquid hardener are mixed to form a polyurethane mixture. In another embodiment, a polymer gel can be used to form a linear CMP operating band. After operation 2 54, the prepared polymer was injected into the mold in operation 2 5 6. In one embodiment, a urethane or other polymer or polymer material is added to a hot cylindrical mold. In one embodiment, will 2 be made? The κ compound is injected into the model to form a polymer material represented by the symbol 丨 62 in the above figure. In operation 2 58, the polymer prepared by Hu Jin is heat-hardened. Here, any kind of polymer can be heated and hardened in any way, only 1, # 2 Ϊ, the desired physical characteristics can be produced in the polymer CMP operating zone, at a predetermined temperature , Heating and curing a urethane = a substance = a predetermined time, to form-urethane ethyl acetate operating belt. The temperature and temperature of the two materials should be suitable for the selected polymer or polymer, or suitable properties to meet specific requirements. In another embodiment, the sexual material is heat-treated and then shaped by cooling. After the model, proceed to operation 2 60. The polymer material is formed by temporarily combining green fabric with knitted fabric or artificial material, which is used to form a polymer material, and which is cut into a material strengthening layer and an additional polymer layer. Strengthen, and

第32頁 五 發明說明(29) _ H織物或合成材質強化層包圍於CMp操作帶之聚合物結 製造ΐ後所ί操作262中’聚合物材質依據製程要求,被 之厚度與尺寸。在-實靖,聚合物材質 線性CMP製程。在-實施例中,聚 被車床加工至厚度範圍約為0· 02—0· 2吋,較佳 2定〇。2-〇.〇5吋,依據聚合物CMP操作帶所採用之CMp製^程 在操作2 64中,編織物或合成材質強化層被置於聚八 ,材質上且暫時被固定。暫時固定的方法包含夾住丫固口 定、釘住、黏合等方法,以精確的將編織物或合成材質強 $層置於聚合物材質上。在一實施例中,編織物或合成材 質強化層被安置倚靠於聚合物層之内表面。在另一 ^施例 中’編織物或合成材質強化層被置於聚合物材質上之外表 面’視製程需要而定。 在操作2 6 6中’額外之聚合物材質被施加而形成附加 聚合物層,且將編織物或合成材質強化層包圍在所製造之 CMP操作帶之聚合物結構中。在一實施例中,附加聚合物 層藉著喷灑額外之聚合物材質,而被施加編織物或合成材 質強化層上。在另一實施例中’聚合物材質與暫時被固定 之編織物或合成材質強化層被置於一模型中,且附加聚合 物層被塑造於編織物或合成材質強化層上。當附加聚合物Page 32 5 Description of the invention (29) _ H The fabric or synthetic material reinforced layer surrounds the polymer knot of the CMP operation belt. After the manufacturing process, the polymer material in operation 262 is based on the thickness and size of the process. In-Shijing, polymer material Linear CMP process. In the embodiment, the polymer lathe is processed to a thickness ranging from about 0.02 to 0.2 inches, preferably about 2 °. 2-〇.05 inch, according to the CMP process used in the polymer CMP operating belt ^ In operation 2 64, a woven or synthetic material reinforcement layer is placed on the poly crystalline material and temporarily fixed on the material. Temporary fixing methods include clamping, pinning, gluing, and other methods to accurately place the braid or synthetic material on the polymer material. In one embodiment, a braid or synthetic material reinforcement layer is positioned against the inner surface of the polymer layer. In another embodiment, the 'knitted or synthetic material reinforcing layer is placed on the surface of the polymer material' depends on the needs of the process. In operation 2 6 ', an additional polymer material is applied to form an additional polymer layer, and a braid or synthetic material reinforcement layer is enclosed in the polymer structure of the manufactured CMP operation belt. In one embodiment, the additional polymer layer is applied to the braid or synthetic reinforcement layer by spraying additional polymer material. In another embodiment, the 'polymer material and the temporarily fixed woven or synthetic material reinforcement layer are placed in a model, and the additional polymer layer is molded on the woven or synthetic material reinforcement layer. When additional polymers

586158 五、發明說明(30) 層被施加時,聚合物或聚 而與聚合物材質姓人,=物材負穿過編織物或合成材質 來決定強化C Μ P操作帶之整i體圍纟/構編織物或合成材質強化層 在操作2 6 8中,強化聚人a 質、編織物或合成材質強化° ΜΡ才呆作帶,包含聚合物材 構,被製造成一所欲之厚声^:;附加聚合物層之整體結 造包含車床加I、修整等3寸。在-實施例,,此製 L Ά . 寺來達到所欲之厚度斑表面性質。 如果聚e物線性CMP操作帶為具有 ^ 、 則操作268之-實施{列“空、泰有開放£域之實加例’ 之綮人铷π β ^ 匕3穿透、削薄與清理EPD開放區域 合= 2上所述,EPD開放區域形成於編織物或 田 層中。依據一本發明之CMP操作帶製作的實 =之二:操:25 6中的模型包含在該模型中決定EpD開放 2 °構。在操作264中,編織物或合成材質強化層被 ^奸哲t具有所製造之EPD開放區域,其對準定義於聚合586158 V. Description of the invention (30) When the layer is applied, the polymer or polymer is the same as the polymer material, = the material passes through the knitted fabric or the synthetic material to decide to strengthen the entire body of the CMP operation belt. / Weaving fabric or synthetic material reinforcement layer In operation 268, we strengthened the a-type material, knit fabric or synthetic material to strengthen the ° MP. It stayed as a band, including polymer material structure, and was made into a thick voice. :; The overall construction of the additional polymer layer includes a lathe plus I, trimming, etc. 3 inches. In the-embodiment, this system L Ά. Temple to achieve the desired thickness spot surface properties. If the polymer linear CMP operation band has ^, then operation 268 of-implementation of {Column "empty, Thai has open domain real examples" of the person 铷 π β ^ 3 penetration, thinning and cleaning EPD Open area combination = 2 As described above, the EPD open area is formed in the braid or field layer. The actual production according to a CMP operation zone of the present invention = two: operation: 25 6 The model included in this model determines the EpD Open 2 ° structure. In operation 264, the braid or synthetic material reinforced layer has an open area of EPD that is manufactured, the alignment of which is defined in the aggregation

中之結構,^操作268中,最後完成對E 域所欲之削薄與穿透。 』机匕 在操作2 68之一實施例中,強化聚合物CMP操作帶依昭 製程要求被製造成一所欲之厚度與尺寸。在一實施例中了 整體聚合物材質被車床加工至一預定尺寸。在一實施例 中’強化聚合物CMP操作帶被車床加工至厚度範圍約為 〇· 02-0· 2吁,較佳厚度約為〇· 〇7_〇· 12吋,依據聚合 操作帶所採用之CMP製程而定。 在操作2 68之一實施例中,修整強化聚合物CMp操作帶 之邊緣’且清理強化聚合物CMP操作帶以預備使用。在一 第34頁 586158 、發明說明(31) 實施例中,聚合物線性CMP操作帶之長度為90 —丨1〇吋,寬 度為8-16忖,厚度為0·02一〇·2吋。因此其適合用於 Research公司所製造之TeresTM線性拋光裝置。 在一實施例中,製造整體結構強化聚合物CMp操 至所欲之厚度與尺寸便完成了強化CMp操作帶之製作, 此”整個製#呈。在一實施例中 強化取人私PMD夺溝槽依據本發明一實施例被形成於 溝槽;成Λ帶之操作表面上。在另-實施例中: 時。Hi :藉f提供—合適圖案於模型内部來塑造 溝槽以Li加工之鑄造物於車床上車削及晝出 產生具有方形溝槽之平港;《力虫主&amp; -b 施例中,一不同之 一實 帶結合為一附加整體結構。接物作材矣質與該強化cmp操作 強化聚合物CMP操作帶便隨著―旦額外之操作㈣完成’ 成,如此完成整個製程。知作表面之製造與準備而完 雖然本發明為了提供 :細之說明,惟其應不被切解,已參照實施例做了 者參考本發明之敘述,其係限制性者。熟悉本技藝 種修改。因此任何未脫二】易的對所揭露的實施例作各 改或變更’均應包含於後附之巾2 _,而對其進行之修 586158 圖式簡單說明 五、【圖式簡單說明】 本發明藉著參考上述的詳細說明並配合附 易瞭解,其中相同的符號代表相同的結構元件。』更谷 圖1A顯示一典型線性帶C Μ P系統; 圖1Β為圖1Α所述之線性帶CMP系統之側視圖; 圖2Α為一典型線性CMP操作帶之橫剖面圖; 區域 用; 圖; 圖; 圖; 圖; 圖; 圖2Β為圖2Α中之典型線性CMP操作帶具有一 * 之橫剖面圖’其配合一現場光學終點偵測系▼統之二放 圖3Α為依據本發明一實施例之CMp操作帶之橫剖面 圖3B為依據本發明另一實施例之CMp操作帶 k剖面 圖3C為依據本發明再一實施例之CMp操作 刮面 圖4A為依據本發明一實施例之CMp操作帶 圖4B為依據本發明一實施例之CMp操作帶 TK o'J 面 為依據本發明之例,在圖4a 中二,加聚合物層的細部圖; 6所不之結構 之橫剖面 圖;° 6為依據本發明另一實施例之CMP操作帶 之細部圖; 圖7為依據本發明一實施例之篩孔核心 586158In the structure, in operation 268, the desired thinning and penetration of the E domain is finally completed. In one embodiment of Operation 2 68, the reinforced polymer CMP operation belt is manufactured to a desired thickness and size according to the process requirements. In one embodiment, the monolithic polymer material is processed to a predetermined size by a lathe. In one embodiment, the 'reinforced polymer CMP operation belt is processed by a lathe to a thickness range of about 0.02-0.2, preferably a thickness of about 0.07_〇. 12 inches, depending on the polymerization operation belt used. Depending on the CMP process. In one embodiment of operation 2 68, the edges of the reinforced polymer CMP operating belt are trimmed and the reinforced polymer CMP operating belt is cleaned for use. In an embodiment on page 34, 586158, description of the invention (31), the length of the polymer linear CMP operation belt is 90-10 inches, the width is 8-16 inches, and the thickness is 0.02-0.2 inches. It is therefore suitable for use in TeresTM linear polishing devices manufactured by Research. In one embodiment, the manufacturing of the reinforced polymer CMP to the desired thickness and size is completed, and the production of the reinforced CMP operation belt is completed. The groove is formed on the groove according to an embodiment of the present invention; on the operating surface forming a Λ band. In another embodiment: when. Hi: provided by f-suitable pattern inside the model to shape the groove to be cast by Li machining Turning and turning out on a lathe produces a square port with square grooves. In the example of "Power Worm Master &amp; -b", a different solid belt is combined into an additional overall structure. Strengthening the cmp operation Strengthening the polymer CMP operation belt is completed with the "additional operation", thus completing the entire process. Known as the manufacture and preparation of the surface Although the present invention is provided to provide: a detailed description, it should not be It is understood that those who have made reference to the embodiments of the present invention refer to the description of the present invention, which is a restrictive person. They are familiar with the modifications of this technology. Therefore, any changes or modifications to the disclosed embodiments that are easy to understand should be made. Contained in the attached towel 2 _ 586158 Brief description of the drawings V. [Simplified description of the drawings] The present invention can be easily understood by referring to the above detailed description and accompanying drawings, in which the same symbols represent the same structural elements. "Genggu Figure 1A Shows a typical linear belt CMP system; Figure 1B is a side view of the linear belt CMP system described in Figure 1A; Figure 2A is a cross-sectional view of a typical linear CMP operating belt; regional; Figure; Figure; Figure; Figure Figure 2B is a cross-sectional view of the typical linear CMP operation belt in FIG. 2A with a * 'which is used in conjunction with an on-site optical end point detection system ▼ system 2 FIG. 3A is a CMP operation belt according to an embodiment of the present invention A cross-sectional view of FIG. 3B is a CMP operation belt according to another embodiment of the present invention. A cross-sectional view of FIG. 3C is a Cmp operation belt according to another embodiment of the present invention. FIG. 4A is a CMP operation belt according to an embodiment of the present invention. The CMP operation band TK o'J plane according to an embodiment of the present invention is an example according to the present invention. In FIG. 4a, a detailed view of a polymer layer is added; a cross-sectional view of the structure shown in FIG. 6; CMP of another embodiment of the present invention FIG detail for the band; FIG. 7 is a mesh core according to an embodiment of the present invention is 586158

圖8八顯示以一替代性之格子或陣列型態 核心之實施例; 战之師孔 圖式簡單說明 圖8β顯示以一替代性之格子或陣列型態所構成之_丨 核心之實施例; 風之師孔 圖9Α為依據本發明一實施例之篩孔核心之細部圖; 圖9Β為依據本發明另一實施例之篩孔核心之細部圖; 圖10Α顯示依據本發明一實施例之製作CMP操作帶之方 法; 圖1 0B顯示本發明之鑄造模型之另一實施例; 圖11為依據本發明一實施例,製造一聚合物線性CMP 操作帶之方法的流程圖; 圖12A顯示篩孔核心154位於線性CMP操作帶模型之中 的部分; 圖1 2 B顯示依據本發明一實施例,一篩孔核心支持器 支撐一篩孔核心之情形; 圖1 3 A顯示依據本發明一實施例之聚合物線性CMP操作 帶模型; 圖1 3B顯示依據本發明一實施例之聚合物線性cMP操作 帶模型;及 圖1 4為依據本發明另一實施例,製造一強化聚合物 CMP操作帶之方法的流程圖。 元件符號說明^ 100線性帶c μ P系統FIG. 8 shows an embodiment with an alternative grid or array type core; FIG. 8B shows a simple illustration of a warrior hole pattern. FIG. 8β shows an embodiment with an alternative grid or array type core. Figure 9A is a detailed view of a sieve core according to an embodiment of the present invention; FIG. 9B is a detailed view of a sieve core according to another embodiment of the present invention; and FIG. 10A is a view showing the fabrication according to an embodiment of the present invention Method of CMP operation belt; FIG. 10B shows another embodiment of the casting model of the present invention; FIG. 11 is a flowchart of a method of manufacturing a polymer linear CMP operation belt according to an embodiment of the present invention; FIG. 12A shows a screen hole The core 154 is located in the linear CMP operation belt model. FIG. 12B shows a case where a sieve core supporter supports a sieve core according to an embodiment of the present invention. FIG. 1A shows an embodiment according to the present invention. A polymer linear CMP operation belt model; FIG. 1B shows a polymer linear cMP operation belt model according to an embodiment of the present invention; and FIG. 14 is a step of manufacturing a reinforced polymer CMP operation according to another embodiment of the present invention. Flow chart of the method of making belt. Component symbol description ^ 100 linear with c μ P system

第37頁 586158 圖式簡單說明 102 線性C Μ P操作帶 104 滾輪 106 晶圓 108 晶圓運送器 110 旋轉裝置 112 方向 114 平台 120 線性C Μ Ρ操作帶 122 聚合物層 124 緩衝層 126 支持層或基層 128 EPD開放區域 150 CMP操作帶 152 聚合物層(聚合物材質) 15 3 附加聚合物層 154 篩孔核心 15 5 操作表面層 156 喷灑 158 喷灑器 160 CMP操作帶 162 聚合物材質 164 編織物或合成材質強化層 16 6 附加聚合物層 168 EPD開放區域Page 586158 Simple illustration of the diagram 102 Linear C MP operation belt 104 Roller 106 Wafer 108 Wafer carrier 110 Rotating device 112 Direction 114 Platform 120 Linear C MP operation belt 122 Polymer layer 124 Buffer layer 126 Support layer or Base layer 128 EPD open area 150 CMP operation zone 152 polymer layer (polymer material) 15 3 additional polymer layer 154 mesh core 15 5 operating surface layer 156 spray 158 sprayer 160 CMP operation zone 162 polymer material 164 Fabric or synthetic reinforced layer 16 6 additional polymer layer 168 EPD open area

第38頁 586158 圖式簡單說明 170 CMP操作帶 172 操作表面層 174a 垂直部分 174b 水平部分 176 連接點 178 EPD開放區域 180 支持部分 182a 鑄造模型之第一側 182b 鑄造模型之第二側 184 特徵部分 220a 第一側 220b 第二側 220c 底部軌道 220d 篩孔核心位置軌道 222 方向 230 篩孔核心支持器 230a 師孔核心支持裔之枝幹 _P.38 586158 Schematic description 170 CMP operating belt 172 Operating surface layer 174a Vertical portion 174b Horizontal portion 176 Connection point 178 EPD open area 180 Supporting portion 182a First side of the casting model 182b Second side of the casting model 184 Feature portion 220a First side 220b Second side 220c Bottom rail 220d Sieve core position track 222 Orientation 230 Sieve core support 230a Teacher hole core support branch _

第39頁Page 39

Claims (1)

586158 六、申請專利範圍 1· 一種化學機械平坦化(CMP,Chemical Mechanical P 1 anar i za i ton )操作用帶,包含: 一聚合物材質,被塑造為一連續環路來決定該CMP操 作用帶;以及 一連續篩孔核心,嵌入該聚合物材質中,且該連續篩 孔核心被定義為該聚合物材質之一堅固内核心。 2 ·根據申请專利範圍第1項之C Μ P操作用帶,其中該 聚合物材質包含聚氨酯、聚酯、聚氯乙烯、聚丙烯酸酯與 環氧樹脂。586158 6. Scope of patent application 1. A chemical mechanical planarization (CMP) chemical mechanical planarization (CMP) operation belt includes: a polymer material, which is shaped into a continuous loop to determine the CMP operation. A belt; and a continuous mesh core embedded in the polymer material, and the continuous mesh core is defined as a solid inner core of the polymer material. 2. The CMP operating belt according to item 1 of the scope of patent application, wherein the polymer material comprises polyurethane, polyester, polyvinyl chloride, polyacrylate, and epoxy resin. 3·根據申請專利範圍第1項之CMP操作用帶,其中該 連續篩孔核心被定義為具有相交部分之格子,且該相交部 分被結合至固定之連接點,來為該CMp操作用帶形成一堅 固支撐結構。 、4·根據申請專利範圍第1項之CMP操作用帶,其中該 連續篩孔核心被定義為具有相交部分之袼子,且該相交部 分定義一編織物結構。 交 5·根據申請專利範圍第4項之CMP操作用帶,更包含3. The CMP operation belt according to item 1 of the scope of patent application, wherein the continuous sieve core is defined as a grid with intersecting portions, and the intersecting portions are bonded to fixed connection points to form the CMP operation belt. A sturdy support structure. 4. The CMP operation belt according to item 1 of the scope of patent application, wherein the continuous sieve core is defined as a gardenia having intersecting portions, and the intersecting portions define a knitted structure. Submit 5 · The CMP operation belt according to item 4 of the scope of patent application, including 以::域5 ί 3二2核心之格子中,該中斷區域被設· ^供一開放&amp;域於该格子中’其適合光學傳送穿過該彳 ,其中該 圍部分來 區域周圍 6.根據申請專利範圍第5項之CMp操作月 連續篩孔核心之格子中的開放區域藉著強化 決定,該周圍部分被固定在環繞在該袼子 之連接點。 586158To :: domain 5 ί 3 2 2 core grid, the interruption area is set up ^ for an open &amp; domain in the grid 'it is suitable for optical transmission through the ridge, where the surrounding part comes around the area 6. The open area in the grid of the continuous sieve core of the CMP operation month according to item 5 of the patent application scope is determined by strengthening, and the surrounding portion is fixed at the connection point surrounding the mule. 586158 取Ί·根據申請專利範圍第6項之CMP操作用帶,其中該 2 ^ ^材質在該連續篩孔核心之格子中的開放區域被製作 =較薄,且該聚合物材質被處理,以允許 J薄之聚合物材質,在該連續筛孔核心之格子^以 人· 8·根據申請專利範圍第丄項之CMp操作用帶,更包 —於該聚合物材質上定義一操作表面,該聚人从从激炎 :第1合物材質’且由—第二聚合物材質^材二為 作表面塑造至該第一聚合物材質。 、疋義之該刼 9· 一種CMP操作用帶,包含: 一聚合物材質,被塑造為一 作用帶;以及 運、、、貝衣路來決疋該CMP操 难化編織物 夤與该附加聚合物層之間。 、、、貝衣 ;5亥聚合物材 1 0 ·根據申請專利範圍第9 聚合物材質包含聚氨酯、聚酯、' 1作用I’其中該 環氧樹脂。 歎氣乙烯、聚丙烯酸酯與 1 1 ·根據申請專利範圍第g垣 〇 附加聚合物層由聚氨酯、聚酯、、之JMP操作用帶,其中該 環氧樹脂之其中之一所形成。a氯乙烯、聚丙烯酸酯與 12·根據申請專利範圍第9 形成於該強化編織物中之開故、之CMP操作用帶,更包含 ΰσ域,该開放區域適合光學Take the CMP operation belt according to item 6 of the scope of the patent application, where the 2 ^^ material is made in the open area in the grid of the continuous sieve core = thinner, and the polymer material is processed to allow J thin polymer material, the grid at the core of the continuous sieve ^ by people · 8 · According to the CMP operation belt of the patent application scope item 更, more package-define an operating surface on the polymer material, the polymer People from the irritation: the first composition material 'and from-the second polymer material ^ material two as the surface molding to the first polymer material.疋, 之 之 刼 9 · A CMP operation belt, comprising: a polymer material, which is shaped as an action belt; and transporting to determine the CMP operation-resistant fabric and the additional polymerization Between layers. 5 、 Polymer material; 5 Hai polymer material 10 · According to the scope of the patent application, the 9th polymer material includes polyurethane, polyester, '1 action I', where the epoxy resin. Sigh ethylene, polyacrylate and 1 1 According to the scope of the patent application, the additional polymer layer is made of polyurethane, polyester, or JMP operating tape, one of which is epoxy resin. a Vinyl chloride, polyacrylate, and 12 · According to the ninth scope of the patent application, the CMP operation belt formed in the reinforced braid further includes a ΰσ domain, which is suitable for optical 586158 六、申請專利範圍 傳送穿過該強化編織物。 13. 根據申請專利範圍第12項之CMP操作用帶,其中 該聚合物材質與該附加聚合物層在該強化編織物中之開放 區域被製作得較薄。 14. 根據申請專利範圍第9項之CMP操作用帶,其中該 強化編織物由聚對苯甲醯胺(kevlar )與一合成纖維之其 中之一所形成,該合成纖維包含尼龍、聚酯、聚亞醯胺、 人造纖維與聚氯乙烯。 15. 根據申請專利範圍第9項之CMP操作用帶,更包586158 VI. Scope of patent application Pass through the reinforced braid. 13. The CMP operating belt according to item 12 of the patent application scope, wherein the polymer material and the additional polymer layer are made thinner in the open area of the reinforced braid. 14. The CMP operation belt according to item 9 of the scope of the patent application, wherein the reinforcing braid is formed of one of poly-kevlar and a synthetic fiber, the synthetic fiber comprising nylon, polyester, Polyamide, rayon and polyvinyl chloride. 15. According to the scope of patent application No. 9 CMP operation belt, more package 含: 於該聚合物材質上定義一操作表面,該聚合物材質為 一第一聚合物材質,且由一第二聚合物材質所定義之該操 作表面結合至該第一聚合物材質。Including: Defining an operation surface on the polymer material, the polymer material is a first polymer material, and the operation surface defined by a second polymer material is bonded to the first polymer material. 第42頁Page 42
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US10/097,337 US6666326B2 (en) 2002-03-12 2002-03-12 Reinforced chemical mechanical planarization belt
US10/112,447 US20030186630A1 (en) 2002-03-29 2002-03-29 Reinforced chemical mechanical planarization belt
PCT/US2003/007389 WO2003078859A2 (en) 2002-03-12 2003-03-10 Reinforced chemical mechanical planarization belt

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