CN1639034A

CN1639034A - Reinforced chemical mechanical planarization belt

Info

Publication number: CN1639034A
Application number: CNA038056542A
Authority: CN
Inventors: 林际兵; D·J·海姆斯
Original assignee: Lam Research Corp
Current assignee: Lam Research Corp
Priority date: 2002-03-12
Filing date: 2003-03-10
Publication date: 2005-07-13
Also published as: AU2003213823A8; TW586158B; JP2005520335A; TW200304180A; WO2003078859A2; EP1483182A2; AU2003213823A1; WO2003078859A3; KR20040105766A; EP1483182A4

Abstract

A processing belt (150, 160, 170) for use in chemical mechanical planarization (CMP), is provided. The processing belt is reinforced with one of a mesh belt (154) and a woven fabric (164). The processing belt includes a polymeric material (152) encasing the mesh belt to define the processing belt. The processing belt is fabricated so that the mesh belt forms a continuous loop within the polymeric material, and the mesh belt is constructed as a grid of intersecting members (174). The intersecting members are joined at fixed joints (176) to form a rigid support structure for the processing belt.

Description

The chemical mechanical planarization belt of strengthening

Technical field

The present invention relates generally to a kind of wafer preparation band, especially relate to the manufacturing of handling the carrying material that uses in (Chemical Mechanical Planarization) device at chemical mechanical planarization.

Relevant background technology is described

In the manufacturing of semiconductor devices, typically a plurality of layers are arranged on a substrate top, its architectural feature just is embodied within these layers and passes these layers.The surface configuration of substrate or wafer is possible unfairness in manufacturing process, and the irregularity degree that does not obtain correcting enlarges along with the additional of other layer of back.Chemical mechanical planarization is handled (CMP) and is developed as the manufacturing process that is used for the surface of semiconductor wafer is carried out smooth processing, and this smooth processing also is used to carry out other manufacturing process, comprises polishing, polishing, substrate cleaning, etching technics etc.

Usually, CMP technology comprises that the pressure with control is resisted against substrate or wafer on the finished surface.The two rotation of finished surface and wafer, rotation or move independently toward each other are used for the friction force of smooth processing with generation, and the whole surface that guarantees wafer is by consistent and processing controllably.Typical C MP device comprises linear tape handling system, the band that has a finished surface in this system is supported between two or more cylinders or the roller, cylinder or roller make band move by a rotate path, this rotate path presents a flat finished surface, and wafer is resisted against on this surface.Wafer typically supports by a wafer carrier and rotates, and makes up a polishing table top below the band of advancing with circular path.The polishing table top provides stable surface, band be traveling in it above, wafer is applied on the finished surface of band, and band abuts against by polishing the surface of stability that table top provided.In some applications, the lapping compound in the aqueous solution known as the slurry is introduced into, and handles to make things convenient for and to strengthen smooth processing or other CMP.

The CMP machining tool, one that other CMP device comprises the rotation with a circular pad structure that is applicable to described finished surface and the similar track CMP of circular CMP machining tool machining tool, a secondary hole CMP machining tool and other CMP system of processing that multiple arrangement and structure are provided, these systems and structure utilize chemistry and mechanical force to come the top surface of constructing the semiconductor wafer of integrated circuit or other structure is carried out smooth processing, purification, polishing, polished, polishes, cleans or other PROCESS FOR TREATMENT usually.

In linearity band CMP system, band and finished surface are typically made up, and resist the band and the tension force of cylindrical structure so that stable structure to be provided, and stable finished surface is provided, so that the accurate and smooth processing of controollable can occur on this surface.Except by the band of advancing round the cylinder of drive system and caused stretching of finished surface and the compression, band and finished surface generally are to work under the wet environment by the liquid generation of slurries and cleaning operation.Band and finished surface are typically formed by multiple material construction, for example are made of a corrosion-resistant steel supporting layer, a cushion layer and one or more machined surface layer.In the CMP treatment process, a plurality of layer couples together to form by bonding, bonding, stitching and similar approach has one towards outer finished surface, continuous band structure, and wafer just is provided with and is resisted against this on outer finished surface.

The structure of multi-ply linear band as described provides necessary support, to prevent the stretching of linear CMP band basically, but increased the productive costs of band structure, this band is difficult to work together with other device, because endpoint detection system, and owing to normal use bonding destruction between each layer that is produced and aggravated by the representative type wet environment, this band will suffer structural break at opening part.

It is very high that the linearity band that uses in linearity band CMP system manufactures cost, and will take a long time and replace it.The replacement of linear band needs the shutdown of CMP system, has caused the increase of productive capacity minimizing and manufacturing cost.Because compression as between used life and the factor the tensile force, and after long-time the use, bond or the destruction of other combined process, linear band may suffer as leafing with separate inefficacy, this inefficacy is accelerated under the CMP of humidity environment.

In view of the foregoing, needed is a kind of method, technology and device of making linear CMP processing belt, and this linearity CMP processing belt has elasticity to the tension force that uses, and is not easy leafing or separation, make economy and easy, and work together with a plurality of CMP machining tools and environment easily.

The invention brief introduction

More broadly, the present invention has satisfied these requirements by the poly-mer CMP processing belt that a kind of reinforcement is provided.The present invention can realize by some modes, comprises for example a kind of technology, a kind of device, a kind of system or a kind of method.Several embodiments of the present invention are described in detail in the following.

In one embodiment, a kind of band that chemical mechanical planarization (CMP) is handled that is used for is disclosed.Described band comprises and is cast into a continuous ring limiting a kind of polymeric material of described band, and embeds a continuous mesh core in the described polymeric material.What described continuous mesh core was defined as described polymeric material more has a rigid internal core body.

In another embodiment, a kind of band that chemical mechanical planarization (CMP) is handled that is used for is disclosed.Described band comprises and is cast into a continuous ring limiting a kind of polymeric material of described band, and embeds a kind of reinforcing fiber between described polymeric material and the additional polymeric material layer.Described reinforcing fiber forms a continuous ring at described polymeric material and described additional polymeric material layer inside.

Advantage of the present invention has a lot.A noticeable benefit of the present invention and advantage are that the described life-span of poly-mer CMP processing belt in described CMP technology significantly increases.With the linear CMP processing belt of representative type in prior art difference, described reinforcement core body of the present invention provides necessary strength, support, and it is stacked to have elasticity, situation that can the bonding coat occurrence of delamination or separation.Reinforcement core body of the present invention is enclosed in the inside configuration of described processing belt, and therefore forms a whole with described band structure.Polymeric material around and pass the casting of described reinforcement core body, perhaps be injected on the described reinforcement core body and pass described reinforcement core body, cause described CMP processing belt in the CMP treatment process, significantly to increase the life-span like this.

Another benefit is a lower manufacturing cost and easy to manufacture.Different with representative type processing belt in the prior art, one embodiment of the present of invention comprise an independent inner mesh core, and the described polymeric material of described sand belt is cast round described mesh core.In another embodiment, one that the present invention includes polymeric material is supported and predominate structure.Do not reducing under intensity, support and the elastomeric situation at other jointing material between described multilayer, glue, suture needle or the described multilayer and to be cancelled.

An additional advantage is the ability that embodiments of the invention easily are combined into one with optics end-point detection device.Reinforcement core body of the present invention provides the simple structure of optics " window ", be used for using together with the end-point detection device, and can not reduce necessary strength, support and elasticity.And the integration of the detection architecture of optical end point does not increase leafing and the possibility of separating, and perhaps reduces the service life of described processing belt.

Further advantages and benefits are at special or specific application and by a plurality of selections provided by the invention.According to the use of particular surroundings or expectation, embodiments of the invention can easily be implemented the reinforcement of needs.

Other advantage of the present invention will be in detailed explanation subsequently, and more obvious in conjunction with the accompanying drawing of illustrating the principle of the invention.

Brief description of drawings

The present invention will be easy to understand by subsequent binding of the detailed description of the drawings, and wherein same reference number refers to same structural constituent.

Figure 1A illustrates the linear band of representative type CMP system.

Figure 1B has showed the lateral plan of the described linearity band of Figure 1A CMP system.

Fig. 2 A has showed the cross-sectional plane of a linear CMP processing belt of representative type.

Fig. 2 B has showed the cross-sectional plane of the linear CMP processing belt of representative type of opening portion Fig. 2 A, that have the band that the optical end point checking system with the scene uses.

Fig. 3 A is the cross-sectional plane of CMP processing belt according to an embodiment of the invention.

Fig. 3 B is the cross-sectional plane of CMP processing belt according to another embodiment of the invention.

Fig. 3 C is the cross-sectional plane of CMP processing belt according to still a further embodiment.

Fig. 4 A is the cross-sectional plane of CMP processing belt according to an embodiment of the invention.

Fig. 4 B is the cross-sectional plane of CMP processing belt according to an embodiment of the invention.

Fig. 5 has showed according to one embodiment of present invention the detailed view with reference to the described additional polymeric material layer of figure 4A and 4B.

Fig. 6 has showed the cross-sectional plane of CMP processing belt according to another embodiment of the invention.

Fig. 7 is the detailed view of mesh core according to an embodiment of the invention.

Fig. 8 A has showed a mesh core that makes up in as selectable grid or matrix pattern

Embodiment.

Fig. 8 B has showed an embodiment a mesh core that makes up in as grid of selecting or matrix pattern.

Fig. 9 A illustrates the detailed view of mesh core according to an embodiment of the invention.

Fig. 9 B illustrates the detailed view of mesh core according to another embodiment of the invention.

Figure 10 A has showed a kind of method of making CMP processing belt according to an embodiment of the invention.

Figure 10 B has showed another embodiment of mold of the present invention.

Figure 11 is a diagram of circuit, has showed the method operation of making polymeric linear CMP processing belt according to an embodiment of the invention.

Figure 12 A illustrates the section that is arranged on linear CMP processing belt mold in-to-in mesh core 154.

Figure 12 B illustrates the mesh core support that mesh core according to an embodiment of the invention is set.

Figure 13 A illustrates polymeric linear CMP processing belt mold according to an embodiment of the invention.

Figure 13 B illustrates polymeric linear CMP processing belt mold according to an embodiment of the invention.

Figure 14 is a diagram of circuit, has showed the method operation of making polymeric linear CMP processing belt according to another embodiment of the invention.

Detailed description preferred embodiment

The invention discloses the method for a kind of CMP processing belt and this processing belt of manufacturing.In a preferred embodiment, thereby the CMP processing belt comprises comprising and surrounds the reinforcing mat pore area that the mesh band limits the polymeric material of described processing belt, thereby and by the polymeric material structure and strengthen being formed for the described processing belt of CMP operation by braided fiber or synthetic material.

In description subsequently, some specific detail will be proposed so that thorough understanding of the present invention to be provided.Yet, should be understood that for those skilled in the art the present invention still can realize under some in not having these specific detail or the whole situations.In other example, unnecessarily hard to understand in order not make the present invention, well-known processing operation is not described.

Figure 1A is depicted as the linear band of representative type CMP system 100.A linear CMP processing belt 102 is provided with round two cylinders 104.A wafer that is used to process 106 is attached to a wafer carrier 108 of linearity band CMP system 100 tops.Make wafer carrier rotation 110, rotation 110 causes wafer 106 rotations, and cylinder 104 rotations cause that linear CMP processing belt 102 moves on direction 112.Rotating wafer vehicle 108 with wafer 106 that is attached thereto is resisted against on the linear CMP processing belt 102, and linear CMP processing belt 102 moves on direction 112 round cylinder 104.Pressing plate 114 is arranged on linear CMP processing belt 102 belows, 108 relative with the wafer carrier with wafer 106 that is attached thereto (for instance, linear CMP processing belt 102 that side relative with wafer carrier).Pressing plate 114 provides additional support, so that wafer 106 can be resisted against on the linear CMP processing belt 102, and have that enough power is finished the smooth processing of expection or other CMP handles, also provide a plane to be used to carry out consistent and measurable processing simultaneously.Figure 1B has showed a lateral plan of the linearity band CMP system of just having described 100.

As what can see from Figure 1A and 1B, linear CMP processing belt 102 suffers multiple stress in 100 operating process of linearity band CMP system.Give an example, in the time of a bit advancing around cylinder 104 on the linear CMP processing belt 102, it bears tensile force, and bigger stretching is born than its interior zone in the perimeter of linear CMP processing belt 102.When a bit continuing on the linear CMP processing belt advanced and leave cylinder 104, it was stretched along with band and advances and bear compressive force towards next cylinder through the top of linear band CMP system 100 or bottom.And linear band CMP system 100 makes linear CMP processing belt 102 bear processing tension force, such as wafer against wipe contact power between downward power, rotating wafer 106 and the linear CMP processing belt 102 of finished surface and other this processing power.

Fig. 2 A has showed a cross-sectional plane of the linear CMP processing belt 120 of representative type.Exemplary linear CMP processing belt 120 comprises three layer 122,124 and 126.Top polymeric layer 122 provides finished surface, and wafer 106 abuts against this finished surface (seeing Figure 1A, 1B) and is used to the CMP processing.A cushion layer 124 typically is structured between finished surface polymeric layer 122 and supporting layer or the bottom 126, and provides a buffer transition layer between the supporting layer of finished surface polymeric layer 122 and rigid hard or bottom 126.Typically, supporting layer or bottom 126 are a solid corrosion-resistant steel or other metalloid band or bar, and cushion layer 124 and Polymer Processing superficial layer 122 are housed in the above.A plurality of layers typically are cast on another layer by bonding, one deck or other similar methods is connected to each other the method that one deck is connected in another layer.

Fig. 2 B showed Fig. 2 A, have a cross-sectional plane that is used for detecting the linear CMP processing belt 120 of representative type of the open section 128 that (EPD) system uses with an on-the-spot optical end point.As Fig. 2 B as can be seen, the part of linear CMP processing belt 120 has been removed, and comprises supporting layer or bottom 126, cushion layer 124 and finished surface polymeric layer 122.When an open section 128 was built on the linear CMP processing belt 120, the open section with sufficient size 128 that is used for optics EPD instrument just was created in linear CMP processing belt 120.Typically, enough sizes comprise little circle, ellipse or a projected square part of linear CMP processing belt 120, the size of these parts changes according to having about 1.25 inches long, the concrete machining tool of 0.75 inch wide typical sizes, and the whole width of of course not linear CMP processing belt 120, perhaps size does not have big to the globality that enough weakens linear CMP processing belt 120 structures.The structure that is used for the opening portion 128 of EPD typically is included in linear CMP processing belt 120 and passes each finished surface polymeric layer 122, cushion layer 124 and supporting layer or bottom hole of 126 formation or opening.

As described above, can cause the leafing of the linear CMP processing belt 120 as the exemplary band as shown in Fig. 2 A or separate at stretching that causes in the normal use of linear CMP disposal system 100 (seeing Figure 1A and 1B) and compressive force.The moist environment of use, rinsing and the analogue of the stress influence of normal wear by comprising mixed liquor has been exacerbated.Open section 128 such structures shown in Fig. 2 B can increase linear CMP processing belt 120 because the skin area that meets with stresses increases and suffer structural failure, the possibility that comprises leafing or separation, increased the possibility that layer connection and bonding or other binding are exposed to moist environment, bottom or supporting layer 126 are owing to structure reduction and analogue have taken place the opening that produces.

Fig. 3 A is the cross-sectional plane of CMP processing belt 150 according to an embodiment of the invention.In the CMP processing belt 150 of the present invention shown in Fig. 3 A, it mainly is made of polymeric material 152 (being also referred to as polymeric layer 152 and poly-mer 152 here), has the mesh core 154 of a corrosion-resistant steel or other suitable material.In one embodiment, mesh core 154 forms a layer near core or central authorities, and poly-mer 152 is round mesh core 154 and pass its casting.The example of polymeric material that is used to cast the poly-mer 152 of CMP processing belt comprises polyurethane, polyester, polyvinylchloride, polyacrylates and epoxy resin.The structure of gained is flexible and is resilient, with stretching and the compressive force of opposing in linear CMP disposal system 100 (seeing Figure 1A and 1B) is used, this structure is cast and does not therefore bear the high likelihood of leafing or separation as an independent single-piece structure, provide and be used for the stable surface that CMP handles, be easy to system integration with optics EPD, durable and lasting, and the many advantages that are better than prior art are provided.

In one embodiment of the invention, mesh core 154 provides one and Fig. 2 A and described bottom of Fig. 2 B or supporting layer 126 similar inner support.As the described herein, the mesh core of CMP processing belt forms a continuous endless belt-shaped inner core-body.Continuous ring does not have top and terminal, and therefore is a band or list structure.Do not resemble solid bottom or the supporting layer 126 of Fig. 2 A and 2B, mesh core 154 of the present invention provides the intensity and the support of expection as an inner core-body, and because its mesh design, mesh core bonded and be cast in poly-mer 152 inside with abundant minimizing in fact eliminating layer from or the possibility of other separation, and bonded or when being cast on solid bottom shown in Fig. 2 A and 2B or the supporting layer 126 on the contrary when poly-mer, will cause leafing or separation.

Fig. 3 B is a cross-sectional plane of CMP processing belt 150 according to another implementation of the invention.In the embodiment shown in Fig. 3 B, poly-mer CMP processing belt 150 is reinforced by a strengthening layer 154.The grid strengthening layer 154 of Fig. 3 B is same structures with the mesh core 154 shown in Fig. 3 A.Therefore grid strengthening layer 154 is the clathrum with CMP processing belt 150 of a continuous loop, banded structure.In one embodiment, CMP processing belt 150 comes down to be formed by poly-mer 152 castings, and strengthens the basal surface setting that clathrum 154 abuts against poly-mer 152 materials.Strengthen clathrum 154 then and be adhered on the polymeric layer 152 by spraying 156 additional polymeric materials 153, forming an additional polymeric layer 153 in fact and causing strengthening clathrum 154 becomes a mesh core 154.In one embodiment, the material of additional polymer 153 is the same with polymeric layer 152.In another embodiment, the material of additional polymer 153 is different with polymeric layer 152, decide according to processing request and needs.

In one embodiment of the invention, an applicator 158 is used for polymeric spray 156 or is coated to abutting against a CMP processing belt 150 that is cast with poly-mer 152 and the strengthening layer 154 that is provided with.Additional poly-mer 153 is coated to be strengthened on clathrum 154 and the poly-mer 152, in one embodiment, form a continuous continuous structure that has with polymeric layer 152 the same polymeric materials, and flow through and around the reinforcement clathrum 154 of common porous form.

Fig. 3 C is the cross-sectional plane according to another CMP processing belt 150 of the present invention.In the embodiment shown in Fig. 3 C, poly-mer CMP processing belt 150 is reinforced by a grid strengthening layer 154.The grid strengthening layer 154 of Fig. 3 C is identical with mesh core 154 structures shown in Fig. 3 A and the 3B.In the embodiment shown in Fig. 3 C, CMP processing belt 150 is cast by poly-mer 152 in fact, with the CMP processing belt 150 the same mesh core 154 that surrounded shown in Fig. 3 A.A machined surface layer 155 is cast then, in one embodiment, casts above the poly-mer 152 that surrounds mesh core 154.In another embodiment, machined surface layer uses the applicator of Fig. 3 B recited above to spray.CMP processing belt 150 shown in Fig. 3 C can be come optimization of treatment conditions by the material that uses the machined surface layer 155 different with polymeric layer 152 hardness.Machined surface layer 155 and polymeric layer 152 can be polymeric materials, and therefore can be bonding safely.In addition, when treatment conditions guaranteed, machined surface layer 155 can be cast or be coated, and comprised one or more individual courses, wherein had only a layer to illustrate in Fig. 3 C.By surpassing the different rigidity layer that machined surface layer 155 that an independent polymeric material layer forms can be used for being implemented in CMP processing belt 150,, give an example a cushion layer below finished surface with the finished surface characteristic that obtains to expect.

Fig. 4 A is the cross-sectional plane of CMP processing belt 160 according to an embodiment of the invention.In the CMP processing belt 160 of the present invention shown in Fig. 4 A, CMP processing belt 160 is mainly by polymeric material 162 structures with a braided fiber or synthetic material strengthening layer 164, and an additional polymeric material layer 166 is sprayed or coated, and braided fiber or synthetic material strengthening layer 164 are adhered on the polymeric material 162.Polymeric material 162 can comprise any one of some polymeric materials of the structure that is suitable for CMP processing belt and surface, as a kind of and analogue in polyurethane, polyester, polyvinylchloride, polyacrylates, the multiple epoxy resin.

In one embodiment, braided fiber or synthetic material strengthening layer 164 are poly P phenylene terephathalamide fiber (kevlar) fibers.In some embodiments, fiber is made of synthetic material, such as nylon syntheticfibres, polyimide, polyester and analogue, in certain embodiments, fiber is the combination of synthetic material, give an example, form a direction that weaves such as nylon material, polyester material forms another direction of braiding.In this way, according to concrete processing needs,,, just can be selected and be achieved such as intensity, rigidity or elasticity along the characteristic of expecting most of CMP processing belt 160 and concrete complex transversely thereof.

In the embodiment shown in Fig. 4 A, showed that additional polymeric material layer 166 is adhered to braided fiber or synthetic material strengthening layer 164 on the polymeric material 162.Additional polymeric material layer 166 can comprise any one of some polymeric materials of being suitable for use in CMP processing belt structure, a kind of as in polyurethane, polyester, polyvinylchloride, polyacrylates, the multiple epoxy resin, and analogue.

Shown in Fig. 4 A, one embodiment of the present of invention comprise uses polymeric spray applicator 158 by spraying 156 poly-mers of expecting in order to apply additional polymeric material layer 166.Braided fiber or synthetic material strengthening layer 164 clamped temporarily, bookbinding, thick nail, bonding or other abut against polymeric material 162 temporarily and position (not shown among Fig. 4 A).Polymeric spray applicator 158 is used to spray additional polymeric material layer 166, Fu Jia polymeric material layer 166 just is applied on braided fiber or the synthetic material strengthening layer 164 like this, and also infiltrate in braided fiber or the synthetic material strengthening layer 164 and form a kind of chemical bonding, in one embodiment, this chemical bonding is to form between polymeric material 162 and additional polymeric material layer 166.In one embodiment, polymeric material 162 and the additional same material structure of polymeric material layer 166 usefulness.In as an embodiment who selects, the material structure that polymeric material 162 is different with additional polymeric material layer 166 usefulness.Yet the characteristic of poly-mer can both guarantee the chemical bonding between firm, durable and some situation lower floor and the layer, and effectively braided fiber or synthetic material strengthening layer 164 is trapped among poly-mer 162,166 inside that are bonded together.

In one embodiment, braided fiber or synthetic material strengthening layer 164 form a strengthening layer of CMP processing belt, and therefore have with the same ring of the polymeric material of CMP processing belt 160, banded structure.As described above, the making of one embodiment of the present of invention comprises by clamp, bind, slightly follow closely, use adhesives and similar method that braided fiber or synthetic material strengthening layer 164 are applied on the polymeric material 162 temporarily.As describing in detail more with reference to 5 in figure below, braided fiber or synthetic material strengthening layer 164 can be configured and abut against the inside face setting of polymeric material 162, and perhaps braided fiber or synthetic material strengthening layer 164 can be configured and abut against the outside face setting of polymeric material 162.As used herein, the inside face of polymeric material 162 is corresponding to the continuous ring that defines CMP processing belt 160, the inside face of banded structure.The inside face of CMP processing belt 160 is and cylinder 104 (seeing Figure 1A, 1B) and the contacted surface of pressing plate 114 (seeing Figure 1A, 1B).Therefore, outside face is to have finished surface and wafer surface of handling placed on it.

Fig. 4 B is the cross-sectional plane of CMP processing belt 160 according to an embodiment of the invention.Similar to the CMP processing belt 160 shown in Fig. 4 A, the CMP processing belt 160 among Fig. 4 B comprises a kind of polymeric material 162, a kind of braided fiber or synthetic material strengthening layer 164 and a kind of additional polymeric material layer 166.Braided fiber or synthetic material strengthening layer 164 are abutted against polymeric material 162 and are provided with, and additional polymeric material layer 166 by spray 156 or the additional polymeric material layer 166 of coating be applied on braided fiber or the synthetic material strengthening layer 164, make the poly-mer of coating infiltrate braided fiber or synthetic material strengthening layer 164, and between polymeric material 162 and additional polymeric material layer 166, form robust and durable bondingly, effectively braided fiber or synthetic material strengthening layer 164 are trapped among CMP processing belt 160 inside.In certain embodiments, formed bonding be chemical adhesion between polymeric material 162 and additional polymeric material layer 166.Embodiment shown in Fig. 4 B comprises an EPD opening, and its function is as described with reference to figure 2B.

In one embodiment, EPD opening 168 is abutted against polymeric material 162 at braided fiber or synthetic material strengthening layer 164 and just is built in braided fiber or the synthetic material strengthening layer 164 before being provided with.After additional polymeric material layer 166 was coated, polymeric material 162 and additional polymeric material layer 166 were bonded encasing braided fiber or synthetic material strengthening layer 164.In one embodiment, thereby the opening that EPD opening 168 passes additional polymeric material layer 166 and polymeric material 162 by generation is structured in the CMP processing belt 160, and this opening is with the register that has produced in braided fiber or synthetic material strengthening layer 164 and pass it.In some applications, a kind of braided fiber of selection or synthetic material are flexibles, firm, durable, perhaps are very difficult to cut or penetrate to form an EPD opening.When braided fiber or synthetic material were enclosed in the polymeric material, it was just extremely difficult to produce opening, therefore was abutted against before polymeric material 162 is provided with at braided fiber or synthetic material strengthening layer 164, and opening just is fabricated.

In another embodiment, polymeric material 162 and additional polymeric material layer 166 are passing braided fiber with EPD opening 168 or synthetic material layer 164 cooresponding zone are configured to thin (not shown among Fig. 4 B).In certain embodiments, it is optional to penetrate all polymeric materials 162, braided fiber or synthetic material strengthening layer 164 and additional polymeric material layer 166 fully.Because braided fiber or synthetic material strengthening layer 164 have an EPD opening that allows to pass the optical delivery of this strengthening layer, thereby polymeric material 162 and additional 166 needs of polymeric material layer are thinned to satisfy the optical delivery that is used for EPD and get final product.

In other embodiments, EPD opening 168 is that polymeric material 162, braided fiber or synthetic material strengthening layer 164 by passing integration in the CMP processing belt of having made at 160 and in the additional polymeric material layer 166 each produce an opening and makes.In a embodiment as selection, an EPD opening 168 can be structured in the casting process of continuous ring, banded structure in the polymeric material 162, and an opening can be during GMP processing belt 160 be made, structure before abutting against polymeric material 162 settings and in braided fiber or synthetic material strengthening layer 164.When braided fiber or synthetic material strengthening layer 164 abut against polymeric material 162 and be provided with, will form register in the layer at each.Additional polymeric material layer 166 is coated, each layer is bonded together and surrounds braided fiber or synthetic material strengthening layer 164, formation CMP processing belt 160.Produce EPD opening 168 by punching in additional polymeric material layer 166 then, above the opening that punching position has existed in polymeric material 162 and braided fiber or synthetic material strengthening layer 164.

Fig. 5 has showed the detailed view with reference to the additional polymeric material layer 166 of figure 4A and the described coating of 4B according to an embodiment of the invention.As described with reference to figure 4A and 4B, braided fiber or synthetic material strengthening layer 164 are configured to a continuous ring, banded structure, and abut against polymeric material 162 and be provided with, and polymeric material 162 also is a continuous ring, banded structure.According to the manufacturing and the condition of service of the expection of CMP processing belt, braided fiber or synthetic material strengthening layer 164 can abut against the inside face or the outside face setting of polymeric material 162.In one embodiment, braided fiber or synthetic material strengthening layer 164 can make up with poly P phenylene terephathalamide fiber (kevlar).In other embodiments, braided fiber or synthetic material strengthening layer 164 are by any manufacturing the in multiple fiber or the synthetic material, as polyester, regenerated fiber, nylon, polyimide, syntheticfibres compound and analogue thereof.Braided fiber or the synthetic material selected are normally pory, infiltrate braided fiber or synthetic material with the polymeric material layer 166 that allows to add, so just make the poly-mer of polymeric material 162 and additional polymeric material strengthening layer 166 form combination, effectively braided fiber or synthetic material strengthening layer are trapped among polymeric material 162 and additional polymeric material layer 166 inside, form an integrally-built CMP processing belt 160.So the integral structure that forms be not easy in fact that the typical case of institute uses in the CMP processing belt that resembles in some prior aries and the surface texture layer delamination occurs or separate.

As shown in Figure 5, thus one embodiment of the present of invention comprise by spray 156 polymeric materials with a polymeric spray applicator 158 and form additional polymeric material layer 166.The poly-mer or the polymeric material of the additional polymeric material layer 166 of coating can be poly-mer or the polymeric materials same with the material that limits polymeric material 162, perhaps can be different poly-mer or polymeric materials in certain embodiments.In a preferred embodiment, the poly-mer of selection or polymeric material have and can be formed with intensity and lasting bonding characteristic.In certain embodiments, the bonding of formation is chemical adhesion.Exemplary polymeric material comprises any one and the analogue in polyurethane, polyester, PVC, polyacrylates, the multiple epoxy resin.As Fig. 5 as can be seen, the poly-mer of coating has infiltrated braided fiber or synthetic material strengthening layer 164, between polymeric material 162 and additional polymeric material layer 166, be formed with intensity and lasting bonding, and surround braided fiber or synthetic material strengthening layer 164.The structure of Xing Chenging will form the CMP processing belt of the reinforcement of a structural unit as a whole like this.

Fig. 6 has showed the cross-sectional plane of a CMP processing belt 170 according to another embodiment of the invention.In the embodiment shown in fig. 6, CMP processing belt 170 comprises as top with reference to figure 4A, 4B and shown in Figure 5 and described polymeric material 162, braided fiber or synthetic material strengthening layer 164 and additional polymeric material layer 166.Shown in Fig. 6, a machined surface layer 172 is cast, sprays or is coated on the CMP processing belt 170.In Fig. 4 A, 4B and shown in Figure 5 and described embodiment, polymeric material 162 defines finished surface.In the embodiment shown in fig. 6, one independently machined surface layer 172 be cast, spray or be applied on the polymeric material 162 to form the finished surface of CMP processing belt 170.

CMP processing belt 170 shown in Figure 6 is manufactured to optimize the finished surface in application, and expectation has one with following polymeric material 162 or the additional different machined surface layer 172 of polymeric material layer 166 hardness in application.As top described with reference to figure 5, an inside face or an outside face that braided fiber or synthetic material strengthening layer 164 can abut against polymeric material 162 are provided with.In this way, the difference of each layer hardness can be combined to optimize the hardness of machined surface layer 172 according to treatment conditions and expectation.In one embodiment, polymeric material 162, braided fiber or synthetic material strengthening layer 164 and additional polymeric material layer 166 are as top manufactured described with reference to figure 4A, 4B and Fig. 5, machined surface layer 172 is cast on the multilayer that has formed then, to limit the finished surface of CMP processing belt 170.In other embodiments, polymeric material 162, braided fiber or synthetic material strengthening layer 164 and the polymeric material layer 166 that adds are manufactured, and machined surface layer 172 is sprayed or coated on the multilayer that has formed then, and then form CMP processing belt 170.

The embodiment of the CMP processing belt 170 shown in Fig. 6 also can be used for controlling the thickness of CMP processing belt 170 to satisfy performance requriements.The thickness range of a typical C MP processing belt 170,160,150 according to an embodiment of the invention as described above in about 80 mils (mils) between 100 mils.In an embodiment of CMP processing belt 170 according to the present invention, the thickness of polymeric material 162, braided fiber or synthetic material strengthening layer of integrating 164 and additional polymeric material layer 166 can minimize to scope from about 20 mils to about 30 mils, keep desired intensity and support structure characteristic simultaneously.The whole thickness of CMP processing belt 170 then depends on the type and the thickness of machined surface layer 172.Give an example, if expect a thicker CMP processing belt 170, any one thickness that can be configured to expect of polymeric material 162, the polymeric material layer 166 that adds and machined surface layer 172 is to obtain design objective so.Use similar mode, can adjust, with the hardness that obtains expectation, rigidity and according to treatment conditions with handle desired characteristics the thickness and the composition of layer 172,162,166.

And, in embodiment, by adjusting any one thickness that can obtain to expect in 155 layers of polymeric material as described above 152, additional poly-mer 153 and the finished surfaces according to the CMP processing belt 150 of the embodiment shown in Fig. 3 A, 3B, the 3C.In one embodiment, the whole thickness of CMP processing belt depends on the type and the thickness of machined surface layer 155.If expect a thicker CMP processing belt, the polymeric layer 152 that has the mesh core 154 of embedding so can be made thick as expected, thereby obtains CMP processing belt desirable thickness.

The embodiments of the invention of Fig. 3 A, 3B, 3C are done more low coverage is liftoff watches, Fig. 7 has showed the detailed view of mesh core 154 according to an embodiment of the invention.In an illustrated embodiment, mesh core 154 is constructed with grid arrangement.As the described herein, a grid defines the cellular structure of inner mesh core 154, and a grid is as selecting to be defined by a matrix.Vertical member 174a and horizontal element 174b are arranged an orthogonal grid shown in the formation.In one embodiment, thus by with vertical member 174a and horizontal element 174b bonding, combination, welding, soft soldering or be attached to and be built into mesh core 154 together.As will be with reference to figure 8A and 8B described in detail, mesh core 154 is not limited in vertical member 174a and horizontal element 174b, also has grid member 174 (being shown 174a and 174b in Fig. 7) can form the direction or the grid style of any desired according to processing environment, expectation, standard and similar requirement.

Junction between grid member 174a, the 174b 176 is fixed in one embodiment, allowing the interruption in grid, as will be below with reference to figure 8A and 8B described in detail.In another embodiment, grid or matrix are by weaving, weave, twine or other mode forming the grid that is made of

braided part

174a, 174b.

In one embodiment, vertical member 174a and horizontal element 174b are cylindrical bar or the sub-thread twisted cables of being made by corrosion-resistant steel.Other material that can make up mesh core 154 comprises stainless steel alloy, aluminium, steel, copper and materials similar, with thinking that linear CMP processing belt 150 (seeing Fig. 3 A for instance) provides crash-resistant inner frame, it is elastomeric that described material is handled the pressure that is produced at the linear CMP by routine, described material is made easily and is enclosed in the poly-mer, therefore can leafing, and described material also provides rigid construction, support is used for the operation of the wafer of CMP processing fully, the durable reinforcement processing belt of the CMP tool operation that is used to continue is provided, and can not have been stretched or other distortion.Cylindrical shaft structure and sub-thread twisted cable, bar, rod are the same, and elasticity that is selected to provide maximum and intensity or durable structure are so that use when making up mesh core 154.Other embodiments of the invention comprise the bar that is essentially rectangle of the profile that has flat surface and approach, so that the point of connection place that provides bigger surf zone to be used between grid member 174a, 174b is bonding, perhaps comprise any other structure of easy formation grid or grid matrix pattern.

Fig. 8 A and 8B have showed the embodiment that constitutes as the mesh core 154 of grid of selecting or matrix pattern.In Fig. 8 A, shown mesh core 154 is simple intersections or oblique mesh pattern.In Fig. 8 B, shown mesh core 154 is orthogonal grid and the simple intersection shown in Fig. 8 A or tiltedly combinations of grid as shown in Figure 7.Fig. 8 A and 8B have showed the only embodiment of two kinds of alternative of multiple grid arrangement or structure.The grid member 174 that should be understood that mesh core 154 can be arranged for special application and be shaped.Give an example, mesh core 154 can be formed, and strengthens so that additional chiastron to be provided, and provides around the additional band of linear CMP processing belt girth and strengthens, and provides the edge to strengthen, and the reinforcement or the reinforcing of special part perhaps are provided according to expectation.The example that special part is strengthened will further be described in detail with reference to figure 9B.The selection of grid or matrix pattern provides a plurality of embodiment of the present invention, handles the requirement of using in order to satisfy a plurality of CMP.

Fig. 9 A illustrates the detailed view of mesh core 154 according to an embodiment of the invention.In the embodiment shown in Fig. 9 A, an EPD opening 178 forms in mesh core 154.As top described with reference to figure 7, thereby the embodiment of mesh core 154 is by with vertical member 174a and horizontal element 174b bonding, combination, welding, soft soldering or be attached to together and be fabricated.Each junction 176 between grid member 174a, the 174b is fixed, to allow the interruption in grid.Fig. 9 A has showed an example of the interruption in the grid of mesh core 154.The point of connection of grid member is fixed and still can keeps intact so that remove remaining three bars and the fixing junction that stay behind the bar from fixing binding site.Shown in Fig. 9 A, a plurality of vertical member 174a by optionally cutting off next-door neighbour's grid and a plurality of horizontal element 174b to be forming EPD opening 178, thereby construct an EPD opening 178.Because grid joints 176 is fixed, so mesh core 154 keeps by the mesh core 154 initial desired intensity that provide, rigidity, flexibility and elasticity.EPD opening 178 allows optics EPD signal to pass linear CMP processing belt 150 (seeing Fig. 3 A) and transmits.Shape at the EPD opening 178 shown in Fig. 9 A makes up from grid shown in the mesh core 154 easily.In a typical C MP processing belt 150, the shape of EPD opening 178 is circular, ellipse or square, and can suitably be modified to satisfy the particular processing needs.Shown EPD opening 178 can be any possible shape.

Fig. 9 B illustrates the detailed view of mesh core 154 according to another embodiment of the invention.In Fig. 9 B, an EPD opening builds in mesh core 154.EPD opening 178 is reinforced by the strut member 180 of illustrated embodiment.Strut member 180 can be configured and is connected to limit the girth of EPD opening 178 according to expectation.In an embodiment by mesh core 154 that grid member 174 is woven, weaves or twines, an EPD opening 178 with strut member 180 is particularly useful, and is used for preventing breaking, stretching or other distortion in the grid discontinuities.In one embodiment, strut member is fixed at each grid joints place round the girth of EPD opening at least.Illustrated embodiment is be used for a plurality of structures of grid member 174 and style a kind of.(do not draw) in another embodiment, one or more circular support parts 180 define the girth of EPD opening 178, are connected on the grid of mesh core 154 at each adjacent mesh junction point at least.

Figure 10 A has showed a kind of method of making CMP processing belt according to an embodiment of the invention.Figure 10 A has showed the section that is formed at a

mold

182a, 182b in-to-in CMP processing belt, and is included in an EPD opening in the mesh core 154.In one embodiment, mesh core 154 is set between the first side 182a and second side 182b of a mold.In one embodiment, the EPD opening is set at structure 184 places among the second side 182b that closes on mold, produces a thinner zone with the EPD opening part in linear CMP processing belt.Polymer precursor (precurser) or liquid polymers are introduced in the mold, to flow and moulding round inner mesh core 154.Use being formed on of linear CMP processing belt of poly-mer and mold to be described in further detail below with reference to Figure 11.

In one embodiment of the invention, the structure 184 at EPD opening 178 places forms thin zone on poly-mer 152 surfaces that are positioned at EPD opening 178 places.In optics EPD system linearity band CMP system 100 (seeing Figure 1A and 1B) were arranged, light beam passed linear CMP processing belt and is transmitted.EPD opening 178 allows a light beam to pass mesh core 154 and is transmitted.A plurality of poly-mers allow limited optical delivery to pass polymer blocks, and in an embodiment of present invention, the thickness that poly-mer is 152 is minimized, to allow optical delivery.Provide structure 184 so that in the thin zone of EPD opening 178 places casting.In an embodiment as alternative, the first side 182a and the second side 182b of mold do not have structure 184, and if necessary, after linear CMP processing belt formed, poly-mer 152 was thinned on the surface at EPD opening 178 places.In another embodiment, 152 of poly-mers at EPD opening 178 places by Local treatment, so that poly-mer 152 is removed.The zone of the local poly-mer of removing 152 is as a window that passes EPD opening 178.

Figure 10 B has showed another embodiment of mold 182a of the present invention, 182b.In the first side of the mold shown in Figure 10 B 182a and second side 182b each all has a structure 184 that is arranged on EPD opening 178 places.Structure 184 is the upper surface in linear CMP processing belt but also form a thinner zone on its lower surface not only.As described with reference to figure 10A, can be processed further at the poly-mer 152 at EPD opening 178 places, to remove the zone of poly-mer 152, form a window.

Figure 11 is a flow process Figure 200, has showed the manufacture method of polymeric linear CMP processing belt according to an embodiment of the invention.Shown method starts from operating 202, and the mesh core that wherein is used for polymeric linear CMP processing belt is positioned to straight line processing belt mold.With reference to figure 13A and 13B a linear CMP processing belt mold is done to describe in further detail below.In operation 202, can comprise the EPD opening or not comprise that the mesh core of the polymeric linear CMP processing belt of EPD opening is positioned to mold inside according to expectation, center on and infiltrate the casting of mesh core to realize poly-mer.

Method proceeds to operation 204, and prepares to be cast into the poly-mer of a linear CMP processing belt.In one embodiment, prepare polymeric material be used to use as following with reference to figure 13A and 13B more one of detailed description completely the forming polymer container be cast into a polymeric linear CMP processing belt.Any desired poly-mer can use according to special processing needs.Normally, a flexibility, durable be supposed to be used for linear CMP processing belt, under the situation that does not have scraping, to carry out the smooth processing of wafer effectively with tough and tensile material.The poly-mer of selecting does not need to have sufficient elasticity, and should not be in the use lax.Can select different poly-mers to enhance certain features of the intended process.In one embodiment, poly-mer can be a polyurethane.In another embodiment, poly-mer can be a polyurethane mixture, a finished surface of the linear CMP processing belt of finishing in order to generation, this surface is a microvoid polyurethane, has the proportion of about 0.4-1.5 gram/sq cm and about Shore D (share D) hardness of 2.5-90.Typically, a kind of liquid resin and a kind of LCM are mixed to form polyurethane mixture.In another embodiment, can use a kind of polymer gel to form linear CMP processing belt.

After operation 204, this method advances to operation 206, and wherein ready poly-mer is injected in the mold.In one embodiment, polyurethane or other poly-mer or polymeric material are assigned in the hot cylindrical mold.An embodiment of cylindrical mold is described in further detail with reference to figure 10A and 10B below.Should be appreciated that the mold that also can use other type and shape.

Then, in operation 208, with ready poly-mer heating and curing.Should be appreciated that the poly-mer of any kind can heat and solidify with any way of the physical property that can produce expectation in final linear CMP processing belt.In one embodiment, a kind of polyurethane mixture is heated under predetermined temperature and solidifies one section preset time, to form a polyurethane finished surface.Be suitable for selected poly-mer or polymeric material, the cure time and the temperature that perhaps are suitable for obtaining specific desired characteristic can be carried out subsequently.Only in one embodiment, thermoplastic material is heated and is finalized by cooling subsequently.

After operation 208, method advances to operation 210, and is shifted out from mold and with the demoulding of polymeric linear CMP processing belt by being with.In one embodiment, mold is a polymeric linear CMP processing belt container molding, as describing in further detail with reference to figure 13A and 13B.

Then, in operation 212, polymeric linear CMP processing belt is lathed to predetermined size.In operation 212, polymeric linear CMP processing belt is cut into the thickness and the size of the expectation that is used for optimum linear CMP processing.If polymeric linear CMP processing belt is the embodiment with EPD opening, operation 212 comprises as described above at EPD opening part attenuate with remove polymer areas.In one embodiment, according to the CMP treatment process of wanting to use polymeric linear CMP processing belt, polymeric linear CMP processing belt is lathed thickness range between about 0.02 inch to about 0.2 inch, its preferred thickness is about 0.9 inch.

After operation 212, method advances to operation 214, and has formed groove on the finished surface of polymeric linear CMP processing belt according to an embodiment of the invention.In another embodiment, can be by suitable pattern being provided and between shaping period, forming groove in mold inside.In one embodiment, the smooth polishing surface that raw casting rotary cutting and grooving on lathe is had square groove with generation.

After operation 214, method advances to operation 216, and wherein the edge of polymeric linear CMP processing belt is sheared.Then, in operation 218, polymeric linear CMP processing belt cleaning and preparation are used.In one embodiment, polymeric linear CMP processing belt length is the 90-110 inch, and width is the 8-16 inch, and thickness is the 0.020-0.2 inch.Therefore it is suitable for use in the Teres that is produced by Lam research company ^TMIn the straight line polissoir.In case polymeric linear CMP processing belt is got ready for using, described method has just been finished.

Figure 12 A has showed a cross section that is arranged on a mesh core 154 in the linear CMP processing belt mold (not shown).In one embodiment, it is inner and above the upholder that the end track 220c of mold extends out that mesh core 154 is positioned to mold in the track.In another embodiment, the vertical member 174a of mesh core 154 periodically extends provide support for mesh core 154.For mesh core 154 provides support so that mesh core 154 location are arranged on mold (not shown) inside, so that polymeric linear CMP processing belt around and pass mesh core 154 and be cast, the edge of mesh core 154 and the edge branch of polymeric linear CMP processing belt have enough desired distances simultaneously.The rigid construction that should be understood that mesh core 154 allows in inner placement of mold (not shown) and support mesh core 154.In one embodiment, mesh core 154 is positioned on the bearing (sees Figure 12 B), and is positioned to those in one embodiment on the vertical member 174a that extends in mold inner support mesh core 154.When having set, the material behavior of mesh core 154 can prevent to relax, crooked, folding and analogue.In one embodiment, provide in-to-in locating dowel pin (not shown) to be used for mesh core 154 accurately is arranged on mold inside in the location, given an example, be arranged on and close on the EPD opening part.

Figure 12 B illustrates a mesh core support 230 of settling mesh core 154 according to an embodiment of the invention.In one embodiment, mesh core bearing 230 extends out from the end track of mold (not shown), so that mesh core 154 is positioned to from the edge of final polymeric linear CMP processing belt one section predetermined distance is arranged.In one embodiment, the handle 230a of grid bearing 230 is by the material with sufficient intensity, so that mesh core 154 is supported on the appropriate location, in order to opposing poly-mer as cast heat or any power, and in the easy later on and end track 220c disengaging of casting polymeric linear CMP processing belt.Exemplary material comprises soft metal or brittle metal and analogue thereof.

Figure 13 A and 13B illustrate the mold 220 of the polymeric linear CMP processing belt in according to one embodiment of present invention.In Figure 13 A, mold 220 is separated to show, with first side 220a and second side 220b and the end track 220c that shows mold 220.Settle the track 220d of mesh core to be illustrated in the end track 220c for one.First side 220a and second side 220b shown in arrow 222 by concentric fits, like this, first side 220a just defines the first surface of final polymeric linear CMP processing belt, second side 220b just defines the second surface of final polymeric linear CMP processing belt, and end track 220c just defines the 3rd surface of final polymeric linear CMP processing belt.In one embodiment, first side 220a defines the top surface of final band, and second side 220b defines the basal surface of final band, and end track 220c defines an edge of final band.Inner mesh core 154 (seeing Figure 12 A) is set between first side 220a and the second side 220b, and is supported on the top of end track 220c.

Figure 13 B has showed the mold 220 of a polymeric linear CMP processing belt that assembles, an inner mesh core 154 (the seeing Figure 12 A) portion that can set within it, and liquid polymer or polymer precursor can flow in the mold to form polymeric linear CMP processing belt subsequently.As described with reference to figure 13A, in one embodiment, end track 220c defines an edge of final polymeric linear CMP processing belt.In one embodiment, in the formation of polymer belt, polymeric material flow in the mold 220 with the form of liquid polymer or polymer precursor.Liquid polymer or polymer precursor are filled mold 220 then, center on and pass inner mesh core according to an embodiment of the invention to flow.At the mold top, the surface of liquid polymer or polymer precursor defines second edge of the final polymeric linear CMP processing belt of gained then.

Figure 14 is a diagram of circuit 250, has showed the manufacture method of polymeric linear CMP processing belt according to another embodiment of the invention.Shown method starts from operating 252, and wherein braided fiber or synthetic material strengthening layer are fabricated.In one embodiment, braided fiber or synthetic material strengthening layer are made up by the poly P phenylene terephathalamide fiber.In other embodiments, braided fiber or synthetic material strengthening layer are formed by the synthetic material structure of nylon, regenerated fiber, polyester, polyimide, synthetic material compound or other expectation, are used for providing the invigoration effect of expectation to constructed CMP processing belt.The example of reinforcement qualities of expectation comprises: the minimizing of the trend that intensity, durability, CMP processing belt are stretched through sustained use continuously, flexibility and the similar performance when using in linear CMP machining tool or system.

In one embodiment, braided fiber or synthetic material strengthening layer are fabricated, with an inside face setting of the polymeric material of the CMP processing belt that abuts against structure.In another embodiment, braided fiber or synthetic material strengthening layer are fabricated, with an outside face setting of the polymeric material of the CMP processing belt that abuts against structure.In operation 252, braided fiber or synthetic material strengthening layer are fabricated according to desired size, and are arranged in a continuous ring, the banded structure.In one embodiment, according to the processing needs, during the structure of braided fiber or synthetic material strengthening layer, the EPD opening is structured in this layer.

Method proceeds to operation 254, and prepares to cast in a poly-mer in the CMP processing belt.In one embodiment, preparing polymeric material is used for using a poly-mer mold to cast in a poly-mer CMP processing belt.Typically use a poly-mer mold, poly-mer or polymeric material by will expectation be injected in the mold and a poly-mer CMP processing belt are cast as continuous ring, banded structure or form desired size and shape.In one embodiment, method operation 254 comprises prepares poly-mer or polymeric material, is used for casting as top with reference to figure 4A, Fig. 4 B, Fig. 5 with Fig. 6 is described and by reference number 162 determined polymeric materials.In one embodiment, the preparation of poly-mer in method operation 254 or polymeric material comprises to the preparation of described polymeric material with to being used for by the poly-mer of the determined additional polymeric material layer of top reference number 166 or the preparation of polymeric material.

Any desired poly-mer or polymeric material can use according to special processing needs in operation 254.Normally, expectation is used for linear CMP processing belt with a kind of flexibility, durable with tough and tensile material, so that carry out the smooth processing of wafer effectively under the situation that does not have scraping.The poly-mer of selecting does not need to have sufficient elasticity, and should not be in the use and become slack.Can select different poly-mers to strengthen some characteristic of desired processing operation.In one embodiment, poly-mer can be a polyurethane.In another embodiment, poly-mer can be a polyurethane mixture, it forms a finished surface of completed linear CMP processing belt, and this surface is a microvoid polyurethane, has Shore D (share D) hardness of proportion and about 2.5-90 of about 0.4-1.5 gram/sq cm.Typically, a kind of liquid resin and a kind of LCM are mixed to form polyurethane mixture.In another embodiment, can use a kind of polymer gel to form polymeric material.

After operation 254, method advances to operation 256, wherein ready poly-mer is injected mold.In one embodiment, polyurethane or other poly-mer or polymeric material are assigned in the cylindrical mold of a heat.In one embodiment, ready poly-mer is injected in the mold to be formed on the polymeric material that is identified by reference number 162 in the top accompanying drawing.

In operation 258, with ready poly-mer heating and curing.Should be appreciated that the poly-mer of any kind can heat and solidify with any way that can produce the physical property of expectation in final poly-mer CMP processing belt.In one embodiment, a kind of polyurethane mixture is heated and solidifies one section preset time under predetermined temperature, to form a polyurethane finished surface.The cure time and the temperature that are suitable for selected poly-mer or polymeric material or are suitable for obtaining special desired characteristic can be carried out subsequently.Only in one embodiment, thermoplastic material is heated and is finalized by cooling subsequently.

After operation 258, method advances to operation 260, and is shifted out from mold and with the demoulding of polymeric linear CMP processing belt by being with.In one embodiment, mold is the container molding of a polymeric linear CMP processing belt, be used to form the polymeric material of strengthening by braided fiber or other synthetic material strengthening layer and additional polymeric material, so that braided fiber or synthetic material strengthening layer are trapped among in the polymer architecture of CMP processing belt.

Then, in operation 262, polymeric material is built into the thickness and the size of expectation according to the processing needs.In one embodiment, polymeric material is lathed predetermined size.In operation 262, the polymeric material of as cast continuous loop, belt-like form is cut into thickness and the size that is used for the expectation that optimum linear CMP handles.In one embodiment, according to the CMP treatment process that will use polymeric linear CMP processing belt, polymeric linear CMP processing belt is lathed thickness range between about 0.02 inch to about 0.2 inch, and preferred thickness is between about 0.02 inch to 0.05 inch.

Method advances to operation 264, and wherein braided fiber or synthetic material strengthening layer abut against polymeric material setting and interim the connection.Interim bonded assembly method comprises clampings, bookbinding, slightly follows closely, use adhesives and similar approach accurately abut against polymeric material with braided fiber or synthetic material strengthening layer and position setting.In one embodiment, braided fiber or synthetic material strengthening layer abut against an inside face location setting of polymeric layer.In another embodiment, according to handling or make up needs, the outside face location that braided fiber or synthetic material strengthening layer abut against polymeric material is provided with.

In method operation 266, the additional polymeric material of coating to be forming additional polymeric material layer, and braided fiber or synthetic material strengthening layer is trapped among the inside of the polymer architecture of the CMP processing belt that has made up.In one embodiment, above being ejected into braided fiber or synthetic material strengthening layer, additional polymeric material applies additional polymeric material.In another embodiment, the polymeric material that temporarily is connected on braided fiber or the synthetic material strengthening layer is positioned in the mold, and additional polymeric material is cast in braided fiber or synthetic material strengthening layer top.Yet the polymeric material layer that coating is additional, poly-mer or polymeric material infiltrate braided fiber or synthetic material and bonding with polymeric material, surround braided fiber or synthetic material strengthening layer, thereby limit the integral structure of strengthening the CMP processing belt.

Method proceeds to operation 268, wherein, will comprise that polymeric material, braided fiber or synthetic material strengthening layer as component part and the reinforcing copolymer CMP processing belt of additional polymeric material layer are built into desirable thickness and size.In one embodiment, described structure comprises that turning, shearing and similar operations are to obtain the thickness and the character of surface of expectation.If polymeric linear CMP processing belt is the embodiment with EPD opening, an embodiment of operation 268 just comprises that constructed EPD opening part in braided fiber or synthetic material strengthening layer as described above penetrates operations such as (piercing), attenuate and removing polymer areas.In the constructed embodiment according to a CMP processing belt of the present invention, employed mold or model are included in its in-to-in, are used to form the version of EPD opening in the method operation 256.In method operation 264, braided fiber or synthetic material strengthening layer are set, the EPD opening of its structure and the structure alignment that in polymeric material, limits.In operation 268, the final attenuate of EPD opening or penetrate according to expectation is finished.

In an embodiment of method operation 268, reinforcing copolymer CMP processing belt is according to handling thickness and the size that needs are built into expectation.In one embodiment, the single-piece polymeric material is lathed to predetermined size.In one embodiment, according to the CMP treatment process that uses poly-mer CMP processing belt, the polymeric material of reinforcement is lathed to thickness range between about 0.02 inch to about 0.2 inch, and preferred thickness is about 0.07 inch to 0.12 inch.

In an operation embodiment of 268, the edge of reinforcing copolymer CMP processing belt is sheared, and reinforcing copolymer CMP processing belt is cleaned and prepares and uses.In one embodiment, polymeric linear CMP processing belt length is the 90-110 inch, and width is the 8-16 inch, and thickness is the 0.020-0.2 inch.Therefore it is suitable for use in the Teres that is produced by Lam research company ^TMIn the straight line polissoir.

In one embodiment, the poly-mer CMP processing belt that integral structure is strengthened has just been finished a making of strengthening the CMP processing belt after being built into the thickness of expectation and size, and described method has also just been finished simultaneously.In one embodiment, described method comprises additional method operation 270, and wherein Qi Wang preparation of surfaces is fabricated.In the structure of the preparation of surfaces of method operation 270, on a finished surface of reinforcing copolymer CMP processing belt according to an embodiment of the invention, form groove.In another embodiment, can be by suitable pattern being provided and between shaping period, forming groove in mold inside.In one embodiment, raw casting is rotated on lathe and grooving has the smooth polishing surface of square groove with generation.In another embodiment, on the CMP processing belt that a kind of independent poly-mer or polymeric material finished surface are coated to reinforcement, poly-mer or polymeric material are bonded on the CMP processing belt of reinforcement and form an additional all-in-one-piece structure.Different hardness, the superficial makings of expectation and the surfaces of similar characteristics of hardness that provides with the basal layer of reinforcing copolymer CMP processing belt is provided the embodiment of additional finished surface.If additional method operation 228 has been finished, then the poly-mer CMP processing belt of Qiang Huaing has just been finished the structure and the preparation of finished surface, and described method has also been finished.

Although aforementioned invention is described in detail for the clear purpose of understanding, should be clear, can in the scope of appended claim, make certain changes and modifications.Therefore, it is indicative rather than restrictive that these embodiment are considered to, and the present invention is not limited to details given herein, but can make amendment in the scope of appended claim and equivalent.

Claims

1. one kind is used for handling the band that uses at chemical mechanical planarization (CMP), comprising:

Be cast into a continuous ring to limit a kind of polymeric material of described band; And

A continuous mesh core that embeds in the described polymeric material, described continuous mesh core is defined as the rigid internal core body of described polymeric material.

2. band as claimed in claim 1, wherein said polymeric material comprises polyurethane, polyester, PVC, polyacrylates and epoxy resin.

3. band as claimed in claim 1, wherein said continuous mesh core are defined as a grid being made of Crossware, and described Crossware connects at attachment point, with thinking that described band forms a rigidity supporting structure.

4. band as claimed in claim 1, wherein said continuous mesh core are defined as a kind of grid of being made of Crossware, and described Crossware defines a kind of braiding structure.

5. band as claimed in claim 4, it further is included in the interruption in the described grid of described continuous grids core body, constructs described interruption so that an opening to be provided in described grid, is applicable to the optical delivery of passing described grid.

6. band as claimed in claim 5 wherein limits opening in the grid of described continuous grids core body with the peripheral element of strengthening, and described peripheral element is fixed to the described parameatal described junction point that is centered around in the described grid.

7. band as claimed in claim 6, wherein make the opening part of described polymeric material in the grid of described continuous grids core body thinner, and process described polymeric material, so that the opening part in the grid of described continuous grids core body makes optical delivery can pass described thin polymeric material.

8. band as claimed in claim 1, it further comprises:

Limit a finished surface above described polymeric material, described polymeric material is one first polymeric material, and the finished surface that is limited by one second polymeric material is cast on described first polymeric material.

9. one kind is used for handling the band that uses at chemical mechanical planarization (CMP), comprising:

Embed a kind of reinforcing fiber between described polymeric material and the additional polymeric material layer, described reinforcing fiber is defined as at described polymeric material and continuous ring of described additional polymeric material layer in-to-in.

10. band as claimed in claim 9, wherein said polymeric material comprises polyurethane, polyester, PVC, polyacrylates and epoxy resin.

11. band as claimed in claim 9, wherein said additional polymeric material layer is by a kind of qualification the in polyurethane, polyester, PVC, polyacrylates and the epoxy resin.

12. band as claimed in claim 9, it further is included in the opening that makes up in the described reinforcing fiber, and described opening is applicable to the optical delivery of passing described reinforcing fiber.

13. band as claimed in claim 12 wherein makes thinner at the opening part of described reinforcing fiber described polymeric material and described additional polymeric material.

14. band as claimed in claim 9, wherein said reinforcing fiber is limited by poly P phenylene terephathalamide fiber and a kind of syntheticfibres, and described syntheticfibres comprises nylon, polyester, polyimide, regenerated fiber and PVC.

15. band as claimed in claim 9, it further comprises:

Limit a finished surface above described polymeric material, described polymeric material is a kind of first polymeric material, and the described finished surface that is limited by a kind of second polymeric material is adhered on described first polymeric material.