KR20040105766A - Reinforced chemical mechanical planarization belt - Google Patents

Abstract

The present invention relates to work belts 150, 160 and 170 for use in chemical mechanical planarization (CMP), which work belts are reinforced by one of mesh core 154 and fabric 164. This working belt includes a polymer layer 152 that surrounds the mesh core to form the working belt. The fabrication belt is made such that the mesh core forms a continuous loop in the polymer layer, and the mesh core is made of a grid of grid members 174. This grid member is connected at a fixed connection 176 to form a rigid support structure for the work belt.

Description

Reinforced chemical mechanical planarization belt

In the manufacture of semiconductor equipment, a plurality of layers are generally disposed on a substrate, and a characteristic shape is formed in and through the plurality of layers. The surface shape of the substrate or wafer may become irregular during the manufacturing process, so that uncorrected irregularities increase as the layers increase. Chemical Mechanical Planarization (CMP) is used to planarize the surface of semiconductor wafers as well as to perform additional manufacturing processes including polishing, buffing, substrate cleaning, and etching processes. It has been developed as a manufacturing process used.

In general, the CMP process involves pressing the substrate or wafer to a controlled pressure in contact with the processing surface. The working surface and the wafer are designed to rotate or move independently of each other to generate frictional forces for planarization and to ensure that the entire surface of the wafer is treated consistently and controlably. A typical CMP apparatus includes a linear belt processing system, in which a belt with a processing surface is supported between two or more drums or rollers, where the drum or roller is a flat machining process in which the wafer is pressed. Move the belt in a pivot path that provides a surface. In general, the wafer is supported and rotated by a wafer carrier, and the polishing platen is disposed under the belt where the polishing platen is moved in the pivot path. The abrasive platen provides a stable surface on which the belt is moved, in contact with the stable surface provided by the platen and the wafer is pressed against the machined surface of the belt. In some applications, an abrasive in aqueous solution known as a slurry is injected to facilitate and reinforce planarization or other CMP processes.

Additional CMP devices include circular pad arrangements for machining surfaces, orbital CMP tools similar to circular CMP tools, sub-aperture CMP tools, and semiconductor wafers having formed integrated circuits or other structures. Swivel CMP machining with other CMP machining systems that provide multiple devices and batches that typically use chemical mechanical forces to planarize, rub, polish, buff, clean, or otherwise process the surface Includes an appliance.

In general, belts and machined surfaces are designed to provide a stable machined surface to withstand the stresses of belt and drum arrangements as well as a stable machined surface where precise and controllable planarization can be achieved in linear belt CMP systems. In addition to the stretching and contraction caused by belts and machined surfaces that move around the drum driving the system, belts and machined surfaces are generally applied to liquids by slurry and rinse operations. It is in a wet state by. In general, the belt and the working surface consist of a number of materials, for example a stainless steel support layer, a cushioning layer, and one or more working surface layers. In the CMP process, the wafer is pressurized with the working surface facing outward, and the multiple layers are joined by adhesive, bonding, stitching, and the like to form a continuous belt structure.

Making a linear belt with multiple layers as described above provides the necessary support to practically prevent elongation of the linear CMP machined belt, but adds extra cost to making the belt, which can be difficult to use, Structural failures occur in the openings for the end point detection system, due to breakage of interlayer bonds, caused by routine use and generally worsened by wet CMP environments.

Linear belts used in CMP systems can be expensive to manufacture and time consuming to replace. Replacement of linear belts requires downtime for the CMP system, which reduces material throughput and increases manufacturing costs. Linear belts may experience cracking or separation of layers due to factors such as elongation and contraction during use and breakdown over time of adhesion or other bonding methods, which are further accelerated in wet environments.

In view of the foregoing, what is needed is a method of making a linear CMP belt that is elastic to the stress in use, does not crack or separate, is inexpensive and easy to manufacture, and is easy to use in many CMP tools and environments. And a device.

FIELD OF THE INVENTION The present invention relates generally to wafer preparation belts, and more particularly to the manufacture of belt materials for use in chemical mechanical planarization apparatus.

1A is a perspective view of a typical linear belt CMP system,

Figure 1b is a side view of the linear belt CMP system shown in Figure 1a,

Figure 2a is a cross-sectional view of a typical linear CMP processing belt,

FIG. 2B is a cross sectional view of the typical linear CMP machining belt of FIG. 2A with an opening in the belt for use with an optical endpoint detection system; FIG.

Figure 3a is a cross-sectional view of the CMP processing belt according to an embodiment of the present invention,

Figure 3b is a cross-sectional view of the CMP processing belt according to another embodiment of the present invention,

Figure 3c is a cross-sectional view of a CMP processing belt according to another embodiment of the present invention,

Figure 4a is a cross-sectional view of the CMP processing belt according to an embodiment of the present invention,

Figure 4b is a cross-sectional view of the CMP processing belt according to another embodiment of the present invention,

5 is a detailed view of applying an additional polymer layer described with reference to FIGS. 4A and 4B in accordance with one embodiment of the present invention;

6 is a cross-sectional view of a CMP processing belt according to another embodiment of the present invention;

7 is a detailed view of a mesh core according to an embodiment of the present invention;

FIG. 8A shows an embodiment of a mesh core made of a grid or matrix pattern; FIG.

8b illustrates another embodiment of a mesh core made of a grid or matrix pattern;

9A is a detailed view of a mesh core according to an embodiment of the present invention;

9b is a detailed view of a mesh core according to another embodiment of the present invention;

Figure 10a is a view showing a method of making a CMP processing belt according to an embodiment of the present invention,

Fig. 10B shows another embodiment of the mold of the present invention;

Figure 11 is a flow chart showing a method of manufacturing a polymer linear CMP processing belt according to an embodiment of the present invention,

12A is a cross sectional view of a mesh core 154 positioned within a linear CMP machining belt;

12B illustrates a mesh core support for positioning a mesh core in accordance with one embodiment of the present invention;

Figure 13a is a view showing the mold of the polymer linear CMP processing belt according to an embodiment of the present invention,

Figure 13b is a view showing the mold of the polymer linear CMP processing belt according to another embodiment of the present invention,

14 is a flow chart illustrating a method of fabricating a reinforced polymeric linear CMP belt in accordance with another embodiment of the present invention.

The present invention provides a reinforced polymeric CMP processing belt to meet this need. The present invention can be implemented in a variety of ways, including processes, devices, systems, apparatus or methods. Some embodiments of the invention are described below.

In one embodiment, a belt for use in chemical mechanical planarization (CMP) processing is introduced, wherein the belt is cast into a continuous loop to form a belt, and a continuous mesh sandwiched therein. It includes a core (mesh core). The continuous mesh core is formed as a harder inner core of the polymer layer.

In another embodiment, a belt used for chemical mechanical planarization (CMP) processing is introduced, wherein the belt is cast in a continuous loop to form a belt, a reinforcing fabric sandwiched between the polymer layer, An additional polymer layer. The reinforcing fabric is formed as a continuous loop in the polymer layer and further polymer layers.

There are many advantages of the present invention. One prominent advantage and advantage of the present invention is that it significantly increases the life of the polymeric CMP processing belt in the CMP process. Unlike typical linear CMP processing belts of the prior art, the reinforcing core of the present invention provides the necessary strength, support and elasticity without the accumulation of bonded layers that undergo cracking or separation. In addition, the reinforcing core of the present invention is put into the structure of the processing belt, and thus becomes an integral part of the belt structure. The polymer layer is cast around and through the reinforcing core or sprayed over and through the reinforcing core to produce a CMP processing belt having a significantly increased lifetime in the CMP process.

Another advantage is lower production costs and ease of manufacture. Unlike typical prior art processing belts, one embodiment of the present invention comprises one inner mesh core and around which a polymer layer of abrasive belt is cast. In another embodiment, the present invention includes a supportive and dominant structure of a polymer layer. Multiple layers, adhesives, stitching sites or other joining materials between the multiple layers are removed without compromising strength, bearing capacity and elasticity.

A further advantage is that the embodiment of the present invention can be integrated with an optical endpoint detection apparatus. The reinforcing core of the present invention makes it easy to manufacture optical "windows" for use with an endpoint detection device without compromising the strength, support and elasticity necessary. In addition, such integration with the optical endpoint detection device does not increase the possibility of cracking or separation or decrease the usable life of the processing belt.

Another advantage and benefit lies in the many options provided by the present invention for special or professional use. Embodiments of the present invention may be readily implemented with preferential reinforcement depending on the particular environment or the desired use.

Other advantages of the present invention will become apparent from the following detailed description which illustrates, by way of example, the principles of the invention with reference to the accompanying drawings, wherein like reference numerals denote like elements.

Hereinafter, the invention for the CMP processing belt and a method for making the same are introduced. In a preferred embodiment, the CMP machined belt comprises a reinforcing mesh belt having a polymer layer which forms a machined belt by inserting a mesh belt, and a machined belt made of a polymer layer and used for CMP work. Includes work belts reinforced with fabric or artificial materials to form.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without some or all of these specific details. Well known process operations will not be described in detail in order not to unnecessarily obscure the present invention.

1A shows a typical linear belt CMP system 100. The linear CMP machining belt 102 is located around two drums 104. The wafer 106 to be processed is attached to the wafer carrier 108 above the linear belt CMP system 100. The wafer carrier 108 is rotated 110 to rotate the wafer 106, and the rotation of the drum 104 causes the linear CMP machining belt 102 to move in the direction of the arrow 112. The rotating wafer carrier 108, to which the wafer 106 is attached, is pressed by a linear CMP processing belt 102 that moves along the drum 104 in the direction of the arrow 112. The platen 114 is located below the linear CMP processing belt 102 on the opposite side of the wafer carrier 108 to which the wafer 106 is attached (eg, on the opposite side of the linear CMP processing belt 102). The platen 114 not only provides a flat surface for constant and measurable machining, but also adds the wafer 106 to the linear processing belt 102 with sufficient force to achieve the desired planarization or other CMP process. To provide support. 1B is a side view of the linear belt CMP system 100 described above.

As can be seen in FIGS. 1A and 1B, the linear CMP machining belt 102 is subjected to various stresses during the operation of the linear belt CMP system 100. For example, as a point on the linear CMP belt 102 moves along the periphery of the drum 104, this point is subjected to an extension force, at which point the outer region of the linear CMP belt is closed. Elongate more than the inner region. As the point on the linear CMP belt continues to move away from the drum 104, the belt is straightened and moved across the top or bottom of the linear belt CMP system 100 towards the next drum 104. The point is subjected to a contractive force. In addition, the linear belt CMP system 100 is a linear CMP processing belt 102 in contact with the machining surface, the downward force of the wafer, the frictional contact between the rotating wafer 106 and the linear CMP processing belt 102, Receive the same processing stress as other processing forces.

2A shows a cross section of a typical linear CMP machining belt 120. An exemplary linear CMP processing belt 120 includes three layers 122, 124, and 126. The top polymer layer 122 provides a processing surface on which the wafer 106 (shown in FIGS. 1A and 1B) is pressed during CMP processing. Generally, the impact absorbing layer 124 is made between the processed surface polymer layer 122 and the support or base layer 126, and the shock absorbing transition between the processed surface polymer layer 122 and the hard or rigid support or base layer 126. Provide a layer. Generally, the support or base layer 126 is a rigid stainless steel or other similar metal belt or band, on which an impact absorbing layer 124 and a work surface polymer layer 122 are made. In general, a plurality of layers are cast by an adhesive or in the presence of another layer on one layer, or similarly by a method of joining one layer to the next.

FIG. 2B shows a cross section of the typical linear CMP machining belt 102 of FIG. 2A with an opening 128 in the belt for use with an optical end point detection (EPD) system. As can be seen in FIG. 2B, a portion of the linear CMP processing belt 120 comprising the support or base layer 126, the impact absorbing layer 124, and the processing surface polymer layer 122 is removed. When the opening 128 is made in the linear CMP belt 120, an opening 128 of sufficient size for optical EPD performance is made in the linear CMP belt. In general, the sufficient size may be a circular shape of the linear CMP processing belt 120, which varies in size depending on a particular processing tool having a length of about 1.25 inches (3.175 cm) and a width of about 0.75 inches (1.905 cm). It includes a small portion of an oval or quadrangle and therefore does not include the overall width of the linear CMP machining belt 120 or the large size which significantly weakens the structural integrity of the linear CMP machining belt 120.

In general, making the opening 128 to use an EPD may be performed in the linear CMP processing belt 120 and through each of the processing surface polymer layer 122 and the impact absorbing layer 124 and the support or base layer 126. Forming holes or openings.

As described above, the stretching force and contraction force generated during normal use of the linear belt CMP system 100 (shown in FIGS. 1A and 1B) are separated by the linear CMP processing belt 120 such as the representative belt shown in FIG. 2A. Can be built or separated. The effects of stress due to normal wear are exacerbated by wet environments involving the use of slurries and cleaners and the like. The structure such as the opening 128 shown in FIG. 2A increases the surface area under which the linear CMP processing belt 120 is subjected to stress, exposure to wet environments of layered joints and adhesives or other joints, and openings or openings. Thereby, the increased likelihood of structural weakening of the support or base layer 126 may increase the likelihood of experiencing structural failure, including cracking or separation.

Figure 3a is a cross-sectional view of the CMP processing belt 150 in accordance with an embodiment of the present invention. In the CMP processing belt 150 of the present invention shown in FIG. 3A, the CMP processing belt 150 is a polymer layer 152 provided with a mesh core 154 of stainless steel or other suitable material; And polymer 152). In one embodiment, mesh core 154 almost forms a core or central layer, and polymer layer 152 is cast around and through mesh core 154. Examples of the polymeric material used to cast the polymer layer 152 of the CMP processing belt include polyurethane and polyester, PVC, polyacrylate and epoxy. The resulting structure is flexible and resilient to withstand elongation and contraction stress when used in a linear belt CMP system (100 (shown in FIGS. 1A and 1B), and is a single integrated structure, thereby eliminating the possibility of cracking or separation. It provides a stable surface for CMP processing, is easily integrated with optical EPD systems, is durable and long lasting, and offers numerous advantages over the prior art.

In one embodiment of the invention, the mesh core 154 supports the interior similarly to the support or base layer 126 described with reference to FIGS. 2A and 2B. As described herein, the mesh core of the CMP processing belt is formed of a continuous loop and a belt-shaped inner core. A continuous loop has neither a beginning nor an end, so it is a belt or band structure. Unlike the rigid support or base layer 126 of FIGS. 2A and 2B, the mesh core 154 of the present invention provides the required strength and support as an inner core, and is incorporated into the polymer layer 152 because it is meshed. And cast to substantially reduce or completely eliminate the possibility of cracking or other separation that may occur when the polymer is bonded or cast to the rigid support or base layer 126 shown in FIGS. 2A and 2B.

3B is a cross-sectional view of the CMP processing belt 150 according to another embodiment of the present invention. In the embodiment shown in FIG. 3B, the polymeric CMP processing belt 150 is reinforced with a mesh core 154. The mesh core 154 of FIG. 3B has the same structure as the mesh core 154 shown in FIG. 3A. Therefore, the mesh core 154 is a mesh layer of the CMP processing belt 150 having a continuous loop and belt-shaped structure. In one embodiment, the CMP processing belt 150 is primarily cast into the polymer layer 152 and the mesh core 154 is positioned in contact with the bottom surface of the polymer layer 152. The mesh core 154 is then sprayed 156 with additional polymer material and joined to the polymer layer 152 to form an additional polymer layer 153 completely, becoming the reinforcing mesh core 154. In one embodiment, the additional polymer layer 153 is the same material as the polymer layer 152. In other embodiments, the additional polymer layer 153 may be a different material from the polymer layer 152 depending on the needs or requirements of the process.

In one embodiment of the present invention, the applicator 158 is used to spray or apply polymer 156 to a mesh core 154 positioned in contact with the CMP processing belt 150 cast into the polymer layer 152. Used. The additional polymer layer 153 applied to the mesh core 154 and the polymer layer 152 is in one embodiment a polymeric material such as the polymer layer 152 and penetrates through the general porous grid pattern of the mesh core 154. Form a continuous structure flowing around.

3C is a cross-sectional view of the CMP processing belt 150 according to another embodiment of the present invention. In the embodiment shown in FIG. 3C, the polymeric CMP processing belt 150 is reinforced with a mesh core 154. The mesh core 154 of FIG. 3C has the same structure as the mesh core 154 shown in FIGS. 3A and 3B. In the embodiment shown in FIG. 3C, the CMP processing belt 150 is cast completely into a polymer layer 152 that surrounds the mesh core 154 similar to the CMP processing belt 150 shown in FIG. 3A. In one embodiment, the work surface layer 155 is then cast over the polymer layer 152 surrounding the mesh core 154. In another embodiment, the processing surface layer is sprayed using an applicator as described above with reference to FIG. 3B. The CMP processing belt 150 shown in FIG. 3C may be used where the processing conditions are optimized using a material whose hardness of the processing surface layer 155 is different from that of the polymer layer 152. Both the process surface layer 155 and the polymer layer 152 can be a polymer and are therefore tightly bonded. In addition, the processing surface layer 155 may be cast or applied and may include one or more individual layers if processing conditions are ensured, only one of which is shown in FIG. 3C. A work surface layer 155 consisting of one or more layers of polymeric material may be used to layer different hardnesses on the CMP work belt 150 to achieve the desired work surface properties, such as, for example, an impact absorbing layer below the work surface. have.

Figure 4a is a cross-sectional view of the CMP processing belt 160 in accordance with an embodiment of the present invention. In the CMP processing belt 160 of the present invention shown in FIG. 4A, the CMP processing belt 160 is sprayed or applied with a polymer layer 162 having a woven fabric or an artificial material reinforcement layer 164. Or an additional polymeric layer 166 that couples the artificial reinforcing layer 164 to the polymeric layer 162. Polymer layer 162 may include any of a number of polymeric materials suitable for making CMP processing belts and surfaces, including polyurethane and polyester, PVC, polyacrylates, multiple epoxies, and the like.

In one embodiment, the fabric or artificial material reinforcement layer 164 is a fabric of kevlar fibers. In other embodiments, the fabric is made of nylon and artificial materials, such as artificial fibers such as polyimide, polyester, and in some embodiments the fabric is a nylon material that forms, for example, a weave in one direction. It consists of a combination of artificial materials, such as polyester material forming the weave in the other direction. In this way, the most desirable properties of a particular composite, such as strength, stiffness, or elasticity, are selectively implemented along and across the CMP processing belt 160, depending on the needs of the particular processing.

In one embodiment shown in FIG. 4A, an additional polymer layer 166 is shown that couples the fabric or artificial material reinforcement layer 164 to the polymer layer 162. The additional polymer layer 166 may comprise any number of polymers suitable for use in making CMP processing belts comprising polyurethane and polyester, PVC, polyacrylates, multiple epoxies, and the like.

As shown in FIG. 4A, one embodiment of the present invention involves spraying 156 a desired polymer to apply an additional polymer layer 166 using a polymer spray applicator 158. The fabric or artificial material reinforcement layer 164 is temporarily placed in contact with the polymer layer 162 by being temporarily tightened, clamped, tacked, or glued (not shown in FIG. 4A). The polymer spray applicator 158 has an additional polymer layer 166 applied to the fabric or artificial reinforcement layer 164 and soaked into the fabric or artificial reinforcement layer 164 in one embodiment with the polymer layer 162. It is used to spray 156 additional polymer layers 166 to form chemical bonds between the polymer layers 166. In one embodiment, polymer layer 162 and additional polymer layer 166 are made of the same polymer. In other embodiments, polymer layer 162 and additional polymer layer 166 are made of different polymers. However, the properties of the polymer are strong and permanent between the layers and in some cases provide chemical bonding to actually surround the fabric or artificial reinforcement layer 164 within the bonded polymer 162, 166.

In one embodiment, the fabric or artificial reinforcement layer 164 forms a reinforcement layer of the CMP processing belt and therefore has a continuous loop and belt-like structure such as the polymer layer 162 of the CMP processing belt 160. As described above, in the manufacture of one embodiment of the present invention, the fabric or artificial material reinforcing layer 164 is formed by a method such as fastening or clamping, fixing with a tack, or bonding with an adhesive. Temporarily). As will be described in greater detail below with reference to FIG. 5, a fabric or artificial reinforcement layer 164 is made for and positioned in contact with the inner surface of the polymer layer 162, or the fabric or artificial reinforcement layer 164 is It may be made for and positioned in contact with the outer surface of polymer layer 162. As used herein, the inner surface of the polymer layer 162 coincides with the inner surface of the continuous loop and belt-shaped structure forming the CMP processing belt 160. The inner surface of the CMP processing belt 160 is in contact with the drum 104 (shown in FIGS. 1A and 1B) and the platen 114 (shown in FIGS. 1A and 1B). Therefore, the outer surface is a surface having a working surface and the wafer is pressed to this surface during processing.

Figure 4b is a cross-sectional view of the CMP processing belt 160 in accordance with an embodiment of the present invention. Similar to the CMP processing belt 160 shown in FIG. 4A, the CMP processing belt of FIG. 4B includes a polymer layer 162, a fabric or artificial material reinforcement layer 164, and an additional polymer layer 166. The fabric or artificial reinforcement layer 164 is positioned in contact with the polymer layer 162, and the applied polymer soaks into the fabric or artificial reinforcement layer 164 and between the polymeric layer 162 and the additional polymeric layer 166. Additional polymer layer 166 applies spray 156 or additional polymer layer 166 to form a strong, permanent bond that substantially surrounds the fabric or artificial reinforcement layer 164 within the CMP processing belt 160. Alternatively, it is applied to the fabric or artificial material reinforcement layer 164. In some embodiments, the bond formed is a chemical bond between polymer layer 162 and additional polymer layer 166. The embodiment shown in FIG. 4B includes an EPD opening 168 that functions as described above with reference to FIG. 2B.

In one embodiment, the EPD openings 168 are made in the fabric or artificial reinforcing layer 164 prior to placing the fabric or artificial reinforcing layer 164 in contact with the polymer layer 162. After the additional polymer layer 166 is applied, the additional polymer layer 166 is joined with the polymer layer 162 surrounding the fabric or artificial material reinforcement layer 164. In one embodiment, the EPD openings 168 are formed through the aligned additional polymer layer 166 and the polymer layer 162 and through the openings already made in the fabric or artificial reinforcement layer 164. 160). In some applications, the selected fabric or artificial material is rough, strong and durable, making it difficult to cut or drill to form the EPD openings. When the fabric or artificial material is wrapped in the polymer, it is extremely difficult to make an opening so that the opening is made before placing the fabric or artificial reinforcing layer 164 in contact with the polymer layer 162.

In another embodiment, polymer layer 162 and additional polymer layer 166 are thin in areas where EPD openings 168 are formed through fabric or artificial reinforcement layer 164 (not shown in FIG. 4B). . In some implementations, it is not necessary to completely penetrate through both the polymer layer 162 and the fabric or artificial material reinforcement layer 164 and the additional polymer layer 166. Since the fabric or artificial material reinforcement layer 166 has an EPD opening that allows optical transmission (transmission of light) through the reinforcement layer, the polymer layer 162 and the additional polymer layer 166 are optical transmission for the EPD. It just needs to be thin to allow.

In another embodiment, the EPD openings 168 are openings in the fabricated CMP processing belts 160 that penetrate each of the polymer layer 162 and the fabric or artificial material reinforcement layer 164 and all of the additional polymer layer 166. It is made by making. In another embodiment, the EPD opening 168 may be made in the polymer layer 162 during casting of a continuous loop and belt-like structure, and in contact with the polymer layer 162 while making the CMP processing belt 160. Openings may be made in the fabric or artificial reinforcing layer 164 prior to positioning. The openings in each layer are aligned when the fabric or artificial material reinforcement layer 164 is placed in contact with the polymer layer 162. Additional polymer layers 166 are applied to bond the layers together and surround the fabric or artificial reinforcement layer 164 to form the CMP processing belt 160. The EPD opening 168 is then made by drilling a hole through the additional polymer layer 166 into the opening already made in the polymer layer 162 and the fabric or artificial reinforcement layer 164.

5 is a detailed view illustrating the application of the additional polymer layer 166 described with reference to FIGS. 4A and 4B in accordance with one embodiment of the present invention. As described with reference to Figures 4A and 4B, the fabric or artificial material reinforcement layer 164 is made of a continuous loop and belt-like structure and is also provided in the polymer layer 162, which is also a continuous loop and belt-shaped structure. Is placed in contact. The fabric or artificial material reinforcement layer 164 may be placed in contact with the inner or outer surface of the polymer layer 162 depending on the desired implementation and the use of the CMP processing belt 160. In one embodiment, the fabric or artificial reinforcing layer 164 is made of Kevlar fiber. In other embodiments, the fabric or artificial reinforcement layer 164 is made of any number of fabrics, including artificial materials including polyester and rayon, nylon, polyimide, mixtures thereof, and the like. The selected fabric or artificial material is combined with the polymer of polymer layer 162 and additional polymer layer 166 to substantially surround the fabric or artificial material reinforcement layer within polymer layer 162 and additional polymer layer 166. This is generally porous to allow the additional polymer layer 166 to permeate to form the overall structure of the CMP processing belt 160. Therefore, the overall structure formed does not allow for cracking or separation of the layers commonly used in the fabrication of some prior art CMP processing belts and surfaces.

As shown in FIG. 5, one embodiment of the present invention includes spraying a polymer material 156 with a polymer spray applicator 158 to apply an additional polymer layer 166. The applied polymer or polymer material of the additional polymer layer 166 may be the same as the polymer or polymer material forming the polymer layer 162, or in some embodiments may be another polymer or polymer material. In a preferred embodiment, the selected polymer or polymeric material has the property of forming a strong, permanent bond. In some embodiments, the bond formed is a chemical bond. Representative polymeric materials include polyurethanes and polyesters, PVC, polyacrylates, epoxys, and the like. As can be seen in FIG. 5, the applied polymer soaks into the fabric or artificial reinforcing layer 164, forming a strong and permanent bond between the polymer layer 162 and the additional polymer layer 166, and The material reinforcement layer 164 is enclosed. The resulting structure forms a reinforced CMP belt as a unit of integrated structure.

6 is a cross-sectional view of the CMP processing belt 170 according to another embodiment of the present invention. In the embodiment shown in Figure 6, the CMP processing belt 170 is a polymer layer 162, fabric or artificial reinforcement layer 164 and as described with reference to Figures 4A, 4B and 5 and described above. An additional polymer layer 166. The processing surface layer 172 is cast, sprayed or applied to the CMP processing belt 170 shown in FIG. In the embodiment depicted and described in Figures 4A, 4B, and 5, the polymer layer 162 forms a processing surface. In the embodiment shown in Figure 6, a separate work surface layer 172 is cast, sprayed, or otherwise made on the polymer layer 162 to form a work surface for the CMP work belt 170.

The CMP processing belt 170 shown in FIG. 6 optimizes the processing surface in applications where it is desirable to have a processing surface layer 172 with a different hardness than the polymer layer 162 located below or the additional polymer layer 166. It is made to As described above with reference to FIG. 5, the fabric or artificial material reinforcement layer 164 may be positioned in contact with the inner surface of the polymer layer 162 or the outer surface of the polymer layer 162. In this way, varying the hardness of the layer can be combined to optimize the hardness of the processed surface layer 172 according to processing conditions and requirements. In one embodiment, the polymer layer 162 and the fabric or artificial material reinforcement layer 164 and the additional polymer layer 166 are made as described above with reference to FIGS. 4A, 4B, and 5, and then the processed surface layer. Reference numeral 172 is formed by casting on an already made layer to form a machining surface of the CMP processing belt 170. In another embodiment, the polymer layer 162 and the fabric or artificial material reinforcement layer 164 and additional polymer layer 166 are made, and the processing surface layer 172 is sprayed or applied onto the layer made of the CMP processing belt 170. To form.

In addition, the embodiment of the CMP processing belt 170 shown in FIG. 6 may be used to adjust the thickness of the CMP processing belt 170 to meet performance demands. As discussed above, typical CMP processing belts 170, 160, 150 in accordance with embodiments of the present invention have a thickness ranging from about 80 mils (2.032 mm) to about 100 mils (2.54 mm). In one embodiment of the CMP processing belt 170 in accordance with the present invention, the polymer layer 162 and the fabric or artificial material reinforcement layer 164 and additional polymer layers while maintaining the required strength and properties for structural support. The overall thickness of 166 may be minimized to range from about 20 mils (0.508 mm) to about 30 mils (0.762 mm). Therefore, the overall thickness of the CMP processing belt 170 depends on the shape and thickness of the processing surface layer 172. For example, if a thicker CMP processing belt 170 is required, any of the polymer layer 162 and the additional polymer layer 166 and the work surface layer 172 can be made to the required thickness to achieve the design goals. . In a similar manner, the thicknesses and configurations of the layers 172, 162, 166 can be adjusted to achieve the required strength and stiffness, etc., depending on the processing conditions and requirements.

Furthermore, in one embodiment of the CMP processing belt 150 according to the embodiment shown in FIGS. 3A, 3B and 3C, the required thickness is the polymer layer 152 and the additional polymer layer 154 as described above. And any of the processed surface layer 155 are obtained. Therefore, in one embodiment, the overall thickness of the CMP processing belt 150 depends on the shape and thickness of the processing surface layer 155. If a thicker CMP belt is required, the polymer layer 152 with the mesh core 154 fitted therein may be made to the thickness required to achieve the thickness required for the CMP belt.

In order to look more closely at the structure of the embodiment of the present invention shown in Figures 3A, 3B, and 3C, Figure 7 shows a mesh core 154 in detail in accordance with one embodiment of the present invention. In the illustrated embodiment, mesh core 154 is formed in a grid arrangement. As described herein, the grid forms a mesh structure of the inner mesh core 154, and the grid is formed of a matrix. Vertical member 174a and horizontal member 174b are arranged to form the vertical grid shown. In one embodiment, mesh core 154 is made by gluing or bonding, welding, soldering, or other method of attaching vertical member 174a and horizontal member 174b. As will be described in more detail with reference to FIGS. 8A and 8B, the mesh core 154 is not limited to the vertical member 174a and the horizontal member 174b, but is required according to the processing environment, requirements, and details. Grid members 174a and 174b, which can be in a direction or grid pattern.

As described in more detail below with reference to FIGS. 8A and 8B, each connection between grid members 174a and 174b is secured to allow discontinuity in the grid in one embodiment. In other embodiments, the grid or matrix is made by weaving, braiding, intertwining or other methods of forming a grid of nonwoven fabrics 174a and 174b.

In one embodiment, vertical member 174a and horizontal member 174b are a single strand of wire made of a cylindrical shaft or stainless steel. Other materials from which the mesh core 154 can be made include stainless steel alloys, aluminum, steel, copper, and the like to provide a strong internal skeleton for the linear CMP machining belt 150 (eg, shown in FIG. 3A). The material is resilient to the stresses generated by conventional linear CMP processing belts, is easily manufactured and is surrounded by a polymer that does not cut and has a rigid structure that adequately supports pressing the wafer for CMP processing. Provides a durable reinforced belt for the work of the provided and supported CMP instruments, and does not undergo elongation or other deformation. Similar to a strand of wire, axle or rod, the cylindrical soccer tub is selected to provide the most resilient, strong or durable structure for use in making the mesh core 154. In another embodiment of the present invention, a grid or matrix pattern of thin shapes or meshes is provided to provide a larger area for the use of a substantially rectangular axis with a flat surface and for coupling at the connection between the grid members 174a and 174b. Other structures that are easily formed.

8A and 8B illustrate embodiments of mesh cores 154 made of different grid or matrix patterns. 8A shows a mesh core 154 made of a simple cross or diagonal grid pattern. FIG. 8B shows a mesh core 154 made from a combination of a vertical grid as shown in FIG. 7 and a cross or diagonal grid as shown in FIG. 8A. 8A and 8B show only two embodiments of arrangement or arrangement of various grids. The grid member 174 of the mesh core 154 may be arranged and arranged for a particular use. For example, mesh core 154 may be special and concentrated to provide additional cross belt reinforcement, to provide additional belt reinforcement around the circumference of the linear CMP processing belt, to provide end reinforcement, or as required. It may be arranged to provide reinforcement or reinforcement. One example of special and concentrated reinforcement is further described with reference to FIG. 9B. Various grid or matrix patterns are provided in a number of embodiments of the present invention to meet the needs of many CMP processing applications.

9A is a detailed view of mesh core 154 in accordance with an embodiment of the present invention. In the embodiment shown in FIG. 9A, the EPD opening 178 has been removed from the mesh core 154. As described above with reference to Figure 7, embodiments of mesh core 154 are made by gluing, bonding, welding, soldering, or other methods of attaching vertical member 174a and horizontal member 174b. Each connection 176 between grid members 174a and 174b is fixed to allow discontinuity in the grid. 9A shows an example where the mesh core 154 is discontinuous in the grid. The grease member connection is secured by removing one axis from the fixed connection, leaving the other three axes and the fixed connection intact. As shown in FIG. 9A, the EPD opening 178 selectively cuts the plurality of vertical members 174a and the plurality of horizontal members 174b adjacent to the grid connection to form the EPD openings 178 to form the mesh core 154. Is created inside). Since the grid connection 176 is fixed, the mesh core 154 maintains the required strength, stiffness, flexibility, and elasticity provided by the mesh core 154 from scratch. EPD opening 178 allows optical EPD signals to be transmitted through linear CMP processing belt 150 (shown in FIG. 3A). EPD opening 178 is shown in FIG. 9A in a shape that can easily be made in the depicted grid of meshcore 154. In a typical CMP processing belt 150, the shape of the EPD opening 178 is round, oval or square, and can be modified appropriately to suit the particular processing requirements. The EPD openings 178 shown are representative of many possible shapes.

9B is a detailed view of mesh core 154 in accordance with another embodiment of the present invention. In FIG. 9B, an EPD opening 178 is made in mesh core 154. EPD opening 178 is reinforced with support member 180 in the illustrated embodiment. The support member 180 is made and attached as required to form the boundary of the EPD opening 178. In one embodiment of the mesh core 154 where the grid is made by weaving or braiding or other methods of weaving the grid member 174, the EPD opening 178 with the support member 180 is loosened or stretched or It is especially useful for preventing other deformations when the grid is discontinuous. In one embodiment, the support member is attached at least at each grid coupling around the boundary of the EPD opening. The illustrated embodiment is one of a number of arrangements and patterns for grid member 174. In another embodiment (not shown), one or more circular support members 180 are attached to the grid of the mesh core 154 at least at each adjacent grid coupling to form a boundary of the EPD opening 178.

10A illustrates a method of making a CMP processing belt in accordance with one embodiment of the present invention. 10A shows a cross section of a CMP processing belt formed in molds 182a and 182b and including an EPD opening 178 in mesh core 154. In one embodiment, mesh core 154 is positioned between first surface 182a and second surface 182b of the mold. In one embodiment, the EPD opening 178 is positioned adjacent to the shape surface 184 of the second surface 182b of the mold to make a thinner area of the CMP processing belt at the EPD opening 178. The polymer precursor or liquid polymer is injected into the mold and flows to form around the inner mesh core 154. The formation of a linear CMP processing belt using a polymer and a mold is described in more detail below with reference to FIG.

In one embodiment of the present invention, the feature surface 184 at the EPD opening 178 forms a thinner area of the polymer 152 surface at the EPD opening 178. In a linear belt CMP system 100 (shown in FIGS. 1A and 1B) implementing an optical EPD system, the optical beam is transmitted through a linear CMP processing belt. EPD opening 178 allows optical beams to be transmitted through mesh core 154. Many polymers allow limited optical transmission (transmission of light) through the polymer, and in one embodiment of the invention the thickness of the polymer layer 152 is minimized to allow optical transmission. The feature surface 184 allows casting a thinner area of the polymer layer 152 at the EPD opening 178. In another embodiment, the first face 182a and the second face 182b of the mold do not have a shape face 184 and the surface of the polymer layer 152 in the EPD opening 178 may have a surface of the CMP processing belt if necessary. It becomes thin after formation. In another embodiment, polymer layer 152 is locally processed at EPD opening 178 to make polymer layer 152 transparent. The area of the polymer layer 152 that has become locally transparent acts like a window through the EPD opening 178.

10B illustrates another embodiment of the molds 182a and 182b of the present invention. Each of the first face 182a and the second face 182b of the mold shown in FIG. 10B has a shape face 184 located in the EPD opening 178. The feature surface 184 forms a thinner region of the polymer layer 152 on both the top and bottom surfaces of the linear CMP processing belt. As described above with reference to FIG. 10A, the polymer layer 152 at the EPD opening 178 may be further processed to make the area of the polymer layer 152 forming the window transparent.

11 is a flow chart 200 illustrating a method for manufacturing a polymer linear CMP fabricated belt according to one embodiment of the present invention. The illustrated method begins at step 202 where a mesh core for a polymer linear CMP belt is placed in a mold for a linear CMP belt. The mold for the linear CMP machining belt is described in more detail below with reference to FIGS. 13A and 13B. In step 202, a mesh core of the polymer linear CMP fabrication belt, which may or may not include EPD openings as needed, is placed in the mold to enable casting of the polymer around and through the mesh core.

The method proceeds to step 204 of preparing a polymer to be cast into a linear CMP processed belt. In one embodiment, the polymeric material is prepared for casting a polymeric linear CMP processing belt using a complete polymeric mold container as described in more detail below with reference to Figures 13A and 13B. Any desired polymer can be used depending on the intended processing requirements. In general, flexible, durable and strong materials are desirable for linear CMP processing belts for effective wafer leveling without scratching. The polymer selected need not be fully elastic and need not be loose or flexible in use. Other polymers may be selected to achieve the particular characteristics of the intended process. In one embodiment, the polymer can be polyurethane. In another embodiment, the polymer is a urethane mixture that produces a processed surface of a complete linear CMP processed belt, which is a microporous polyurethane having a specific gravity of approximately 0.4 to 1.5 g / cm 2 and a hardness of approximately 2.5 to 90 Shore D. Can be. Generally, a liquid resin and a liquid curative are mixed to form a polyurethane mixture. In another embodiment, a polymer gel can be used to form the linear CMP processing belt.

After step 204, the method proceeds to step 206 where the prepared polymer is injected into a mold. In one embodiment, urethane or other polymer or polymeric material is introduced into a hot cylindrical mold. One embodiment of a cylindrical mold is described in more detail below with reference to FIGS. 10A and 10B. Other forms or shapes of molds may be used as appropriate.

Subsequently, in step 208, the prepared polymer is heated and cured. Any type of polymer can be heated and cured in any manner that produces the physical properties required in the final polymer linear CMP belt. In one embodiment, the urethane mixture is heated and cured at a predetermined temperature for a predetermined time to form a urethane working surface. There may be a curing time and temperature to achieve the appropriate or particularly desired properties of the selected polymer or polymeric material. For example, the thermoplastic material is hardened by cooling after being hotly processed.

After step 208, the method proceeds to step 210 where the polymeric linear CMP processing belt is removed from the mold by removing the belt from the mold. In one embodiment, the mold is a mold container for a polymer linear CMP processing belt as described in more detail with reference to FIGS. 13A and 13B.

Next, in step 212, the polymeric linear CMP belt is lathed to a predetermined size. In step 212, the polymeric linear CMP belt is cut to the thickness and size required for optimal linear CMP processing. If a polymeric linear CMP processing belt is implemented with the EPD openings, step 212 includes thinning and making the polymer regions in the EPD openings as described above. In one embodiment, the polymeric linear CMP belt is lathed to a thickness ranging from about 0.02 in (0.508 mm) to about 0.2 in (5.08 mm), preferably about CMP process in which the polymeric linear CMP belt is used. It is machined to a thickness of 0.09 in (2.286 mm).

After step 212, the method proceeds to step 214 where grooves are formed in the processing surface of the polymeric linear CMP processing belt according to one embodiment of the present invention. In other embodiments, the grooves may be formed by making an appropriate pattern on the inner surface of the mold during casting. In one embodiment, the raw casting is rotated and grooved in a lathe to produce a smooth abrasive surface with square grooves.

After step 214, the method proceeds to step 216 where the end of the polymer linear CMP belt is cut. Thereafter, in step 218 the polymeric linear CMP belt is washed and ready for use. In one embodiment, the polymeric linear CMP processing belt is 90-110 in. (228.6-279.4 cm) long, 8-16 in. (20.32-40.64 cm) wide, and 0.020-0.2 in (0.508-5.08 mm) thick. . Therefore, this belt is suitable for use in a linear polishing device under the trade name "Teres ^™ " made by Lam Research Corporation. The method ends when the polymer linear CMP processing belt is ready for use.

12A is a cross sectional view of a mesh core 154 positioned within a mold (not shown) of a linear CMP machining belt. In one embodiment, mesh core 154 is located within the mold of the track and on a support extending from the bottom track 220c of the mold. In another embodiment, the vertical member 174a of the mesh core 154 extends periodically to provide support for the mesh core 154. The support for the mesh core 154 is formed such that the end of the mesh core 154 and the end of the final polymer linear CMP processing belt are cast around and through the mesh core 154 with sufficient separation as required. Or not). The rigid structure of the mesh core 154 allows for placement and support of the mesh core 154 in a mold (not shown). The mesh core 154 is located in the support in one embodiment (shown in FIG. 12B), in which in this embodiment a vertical member 174a extending for supporting the mesh core 154 in the mold is located in the support. do. When positioned on the support, the properties of the mesh core 154 material are weakened, bent, folded, and the like. In one embodiment, for example, an internal positioning pin (not shown) adjacent the EPD opening is provided for precise placement of the mesh core 154 in the mold.

12B illustrates a mesh core support 230 for positioning mesh core 154 in accordance with one embodiment of the present invention. In one embodiment, mesh core support 230 extends from the bottom track of the mold (not shown) to position mesh core 154 at the required distance from the end of the final polymeric linear CMP processing belt. In one embodiment, the stem 230a of the mesh core support 230 is configured to support the mesh core 154 in place, to withstand any forces of heat or polymer casting, and to produce a polymer linear CMP processing belt. It is made of a material having sufficient strength so as to be easily separated from the lower track 220c later. Representative materials include flexible or brittle materials and the like.

13A and 13B illustrate a mold 220 of a polymer linear CMP processing belt according to one embodiment of the present invention. In FIG. 13A, the mold 220 is shown separately to show the lower track 220c, as well as the first face 220a and the second face 220b of the mold 220. In FIG. The mesh core placement track 220d is shown in the bottom track 220c. The first surface 220a and the second surface 220b have a first surface 220a forming the first surface of the final polymer linear CMP processing belt, and the second surface 220b is the first surface of the final polymer linear CMP processing belt. Forming two surfaces, the lower track 220c is assembled to be concentric to form the third surface of the final polymer linear CMP processing belt. In one embodiment, the first surface 220a forms an upper surface of the final polymeric linear CMP belt, the second surface 220b forms a lower surface of the final polymeric linear CMP belt and the lower track 220c The end of the final polymer linear CMP belt is formed. An internal mesh core 154 (shown in FIG. 12A) is positioned between the first surface 220a and the second surface 220b and supported above the lower track 220c.

FIG. 13B shows an assembled polymer linear CMP in which an inner mesh core 154 (shown in FIG. 12A) can be placed therein and then liquid polymer or polymer precursor can flow into the mold to form a polymer linear CMP processing belt. The processing belt is shown. As described with reference to Figure 13A, in one embodiment the lower track 220c forms the end of the final polymer linear CMP processing belt. In the formation of the polymer belt, the polymeric material flows into the mold 220 as a liquid polymer or polymer precursor in one embodiment. The liquid polymer or polymer precursor then fills the mold 220 and flows around and through the inner mesh core in accordance with one embodiment of the present invention. At the top of the mold, the surface of the liquid polymer or polymer precursor then forms the second end of the final polymer linear CMP belt.

14 is a flowchart 250 illustrating a method for making a reinforced polymeric CMP belt in accordance with another embodiment of the present invention. The illustrated method begins at step 252 where a fabric or artificial material reinforcement layer is made. In one embodiment, the fabric or artificial reinforcing layer is made of Kevlar fibers. In another embodiment, the fabric or artificial reinforcement layer may be made of nylon, rain-on, polyester, polyimide, blended artificial material, or any other desired fabric or artificial material to provide the required reinforcement of the made CMP processing belt. Is made. Examples of required reinforcing properties include strength and durability, reducing the tendency of the CMP belt to elongate with continued and continuous use, and flexibility for use in linear CMP machines or systems.

In one embodiment, the fabric or artificial reinforcing layer is made to be placed in contact with the inner surface of the polymeric material of the made CMP belt. In another embodiment, the fabric or artificial reinforcement layer is made to be placed in contact with the outer surface of the made CMP belt. In step 252, the fabric or artificial reinforcement layer is made according to the required size and placed in a structure such as a continuous loop and belt. In one embodiment, EPD openings are made in fabric or artificial reinforcement layers during layering according to processing requirements.

The method proceeds to step 254 of preparing a polymer to be cast into a CMP processed belt. In one embodiment, a polymer or polymeric material is prepared for casting into a polymeric CMP processing belt using a polymer mold. Generally, polymer molds are used to cast polymer CMP belts into continuous loops and belt-like structures by injecting the required polymer or polymer material into the mold or the shape and size desired. In one embodiment, step 254 includes preparing a polymer or polymer material for use in casting a polymer layer described above with reference to FIGS. 4A and 4B, 5 and 6 and indicated by reference numeral 162. do. In one embodiment, preparing the polymer or polymeric material in step 254 includes preparing the polymer or polymeric material for the additional polymeric layer described above and indicated by reference numeral 166.

Any desired polymer or polymeric material may be used in step 254 depending on the intended processing requirements. In general, flexible, durable and strong materials are desirable for linear CMP processing belts for effective wafer planarization without scratching. The polymer selected need not be fully elastic and need not be loosened or pliable in use. Other polymers may be selected to achieve the particular characteristics of the intended process. In one embodiment, the polymer may be polyurethane. In another embodiment, the polymer may be a urethane mixture that produces a processed surface of a complete polymeric CMP processing belt, which is a microporous polyurethane having a specific gravity of approximately 0.4-1.5 g / cm 2 and a hardness of approximately 2.5-90 Shore D. Generally, liquid resins and liquid curing agents are mixed to form a polyurethane mixture. In other embodiments, polymer gels can be used to form the polymer layer.

After step 254, the method proceeds to step 256 where the prepared polymer is injected into a mold. In one embodiment, urethane or other polymer or polymeric material is introduced into a hot cylindrical mold. In one embodiment, the injection of the prepared polymer into the mold is intended to form a polymer layer, indicated by reference numeral 162 in the preceding figures.

In step 258, the prepared polymer is heated and cured. Any type of polymer can be heated or cured in any way to create the physical properties required in the final polymer CMP belt. In one embodiment, the urethane mixture is heated and cured for a predetermined time at a predetermined temperature to form a urethane working surface. There may be curing time and temperature appropriate to the polymer or polymer material selected or to achieve the properties required in particular. In only one embodiment, the thermoplastic is hot processed and then hardened by cooling.

After step 258, the method proceeds to step 260 where the polymer layer is separated from the mold by removing the belt from the mold. In one embodiment, the mold is a polymer linear CMP processing belt used to form an additional polymer layer to surround the fabric or artificial reinforcement layer within the polymer layer reinforced with the fabric or artificial reinforcement layer and the CMP processing belt. It is a mold container.

Subsequently, in step 262, the polymer layer is made to the thickness and size desired according to the processing requirements. In one embodiment, the polymer layer is lathed to a desired size. In step 262, the polymer layer cast in continuous loop and belt form is cut to the thickness and size required for optimal linear CMP processing. In one embodiment, the polymeric CMP belt is lathed to a thickness in the range of about 0.02 in (0.508 mm) to about 0.2 in (5.08 mm), and preferably according to the CMP process in which the polymeric CMP belt is intended to be used. It is lathed from about 0.02 in (0.580 mm) to about 0.05 in (1.27 mm) thick.

The method proceeds to step 264 where a fabric or artificial material reinforcement layer is placed in contact with the polymer layer and temporarily attached. Temporary methods of attachment include methods such as fastening or clamping, fixing with tacks, gluing with an adhesive to precisely position the fabric or artificial material reinforcement layer in contact with the polymer layer. In one embodiment, the fabric or artificial material reinforcement layer is positioned in contact with the inner surface of the polymer layer. In another embodiment, the fabric or artificial material reinforcement layer is positioned in contact with the outer surface of the polymer layer according to processing or manufacturing requirements.

In step 266, additional polymer material is applied to form an additional polymer layer and surround the fabric or artificial material reinforcement layer within the polymer structure of the made CMP belt. In one embodiment, the additional polymer layer is applied by spraying additional polymer material onto the fabric or artificial material reinforcement layer. In another embodiment, a polymer layer temporarily attached to a fabric or artificial reinforcement layer is placed in the mold and an additional polymer layer is formed by casting over the fabric or artificial reinforcement layer. However, an additional polymer layer is applied and the polymer or polymer material is permeated into the fabric or artificial material to bond with the polymer layer and surround the fabric or artificial material reinforcement layer to form the overall structure of the reinforced CMP processing belt.

The method proceeds to step 268 where the reinforced polymer CMP belts, including the polymer layer and the fabric or artificial material reinforcement layer and the additional polymer layer as a whole structure, are made to the thickness and size required for the reinforced CMP belts. do. In one embodiment, the fabrication method includes turning, cutting, etc. to achieve the required thickness and surface properties. If a polymeric linear CMP processing belt is implemented with an EPD opening, one embodiment of step 268 is to drill, thin and transparent the polymer area in the EPD opening made from the fabric or artificial reinforcement layer described above. Includes letting In one embodiment of the manufacture of the CMP processing belt according to the present invention, the mold or shape used in step 256 includes the formation of structural EPD openings in the mold or shape. The fabric or artificial reinforcement layer is positioned at step 264 with the EPD openings made aligned with the structure formed in the polymer layer, and in step 268 final thinning or drilling of the EPD openings as necessary is achieved.

In one embodiment of step 268, the reinforced polymeric CMP processing belt is made to the thickness and size required according to the processing requirements. In one embodiment, the entire polymer layer is lathed to a desired size. In one embodiment, the reinforced polymer CMP belt is lathed to a thickness ranging from about 0.02 in (0.508 mm) to about 0.2 in (5.08 mm), and preferably the CMP process where the polymer CMP belt is intended to be used. Depending on the thickness, lathes are made from about 0.07 in (1.778 mm) to about 0.12 in (3.048 mm) thick.

In one embodiment of step 268, the ends of the reinforced polymeric CMP belts are cut, and the reinforced polymeric CMP belts are cleaned and ready for use. In one embodiment, the polymeric linear CMP processing belt is 90-110 in (228.6-279.4 cm) long, 8-16 in (20.32-40.64 cm) wide, and 0.020-0.2 in (0.508-5.08 mm) thick. . Therefore, this CMP processing belt is suitable for use in a linear polishing device under the trade name "Teres ^TM " made by Lam Research Corporation.

In one embodiment, fabricating the entire structure of the reinforced polymeric CMP belts to the required thickness and size completes the manufacture of the reinforced CMP belts, thereby ending the method. In another embodiment, the method includes an additional step 270 in which the required preparation surface is made. In step 270 of making the preparation surface, a groove is formed in the processing surface of the reinforced polymer CMP processing belt according to the invention. In another embodiment, the grooves may be formed during casting by making an appropriate pattern on the inner surface of the mold. In one embodiment, the raw casting is rotated and grooved in a lathe to produce a smooth abrasive surface with square grooves. In another embodiment, a separate polymer or polymer layer processing surface is applied to the reinforced CMP processing belt, and as a further overall structure, the polymer or polymer material is bonded to the reinforced CMP processing belt. Examples of additional processing surfaces include surfaces that provide a hardness different from the underlying layers of the reinforced polymeric CMP processing belt, and the required surface texture and the like. If an additional step 228 is achieved, the preparation of the reinforced polymeric CMP processing belt and the preparation of the working surface are completed, and the method is finished.

Although described in some detail for a clear understanding of the foregoing invention, it is obvious that any changes and modifications may be made within the scope of the appended claims. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalents of the appended claims.

Claims (15)

A polymer layer cast in a continuous loop to form a belt; A continuous mesh core embedded in the polymer layer and formed of the rigid inner core of the polymer layer; Belt used in chemical mechanical planarization (CMP) processing having a. The belt of claim 1 wherein the polymer layer comprises polyurethane, polyester, PVC, polyacrylate, and epoxy. The belt of claim 1 wherein the continuous mesh core is formed of a grid of intersecting members, the intersecting members being joined at a fixed connection to form a rigid support structure for the belt. The belt of claim 1 wherein said continuous mesh core is formed of a grid of intersecting members, said intersecting members being a woven fabric. 5. A belt as claimed in claim 4, further comprising a discontinuity in the grid of the mesh core, the discontinuity being adapted to provide an opening in the grid suitable for optical transmission through the grid. 6. The belt according to claim 5, wherein the opening in the grid of the continuous mesh core is formed of a reinforcing boundary member, which is attached to a connection around the boundary line of the opening in the grid. 7. The polymer layer of claim 6 wherein the polymer layer is made thinner at the opening of the grid of continuous mesh cores and the polymer layer is processed to allow optical transmission through the thinner polymer layer at the opening of the continuous mesh core. belt. The belt according to claim 1, further comprising a processing surface formed on the polymer layer, wherein the polymer layer is a first polymer layer and the processing surface is formed from a second polymer layer cast on the first polymer layer. . A polymer layer cast in a continuous loop to form a belt; A reinforcing fabric sandwiched between the polymer layer and the further polymer layer and formed into a continuous loop in the polymer layer and the further polymer layer; Belts used in chemical mechanical planarization (CMP) processing having a. The belt of claim 9 wherein the polymer layer comprises polyurethane, polyester, PVC, polyacrylate, and epoxy. 10. The belt of claim 9, wherein the additional polymer layer is formed by polyurethane and one of polyester, PVC, polyacrylate, and epoxy. 10. The belt of claim 9 further comprising an opening made in said reinforcing fabric, said opening being suitable for optical transmission through said reinforcing fabric. 13. The belt of claim 12 wherein the polymer layer and the additional polymer layer are made thinner in the openings of the reinforcing fabric. The belt of claim 9 wherein the reinforcing fabric is formed from one of kevlar fibers and artificial fibers including nylon and polyester, polyimide, rayon, and PVC. The belt of claim 9, further comprising a processing surface formed over the polymer layer, wherein the polymer layer is a first polymer layer and the processing surface is formed from a second polymer layer bonded to the first polymer layer. .