583228 玖：發明說明 (發明說明驗明：翻觸之技術領域、先前技術、內容、麵方式細式簡單說明) 【發明所屬之技術領域】 本發明係關於一種持溫及散熱基材之製造與應用方 法，。尤其係關於一種利用相變物質，經由熔融、微膠囊化、 $蚝、混入接著劑或硬化劑、噴塗或含浸等步驟處理，以 製成一可持溫及散熱之基材，該持溫及散熱基材，係可使 用於任口何長時間使用之下，會持續產生熱能之電腦、電 子電器馬達、燈具及機械等產品，以達到加強該產品 之散熱及持溫效果者。 【先前技術】 -般電腦、電子、電器、馬達、燈具及機械等產品， 在經過一段時間之運轉過程後，會持續產生熱能，該熱能 對設備本身以及環境週遭的影響相當大，但是隨著產品效 月b及使用寺間上不斷地創新改進，相對地也造成所產生的 熱能更多，例如有許多λ型t器裝置或馬達之運轉，其所 產生皿度甚至高$ 1G(rc以上’然該等高溫若僅使用風 扇或是散熱片之單純散熱設計，往往無法有效的導出或散 出熱氣，而過高的操作溫度，容易造成該電器裝置中之電 子零件或是機械設備無法正常工作，同時也會造成產品的 哥命減短&高故障率等問㈣，又工作環境之溫度上升，亦 會對人體造成不舒適感甚至烫傷，嚴重影響工作安全及工 作效能。 i 以筆記型電腦（note b00k)為例，其散熱方式多將 ⑽之熱能傳導至機殼上，並藉由機殼進行散熱，故其機 殼之散熱效率即佔有相當程度之重要性。 0續次頁（發明說明頁不敷使用時，請註記並使用續頁） 583228583228 玖: Description of the invention (Invention verification: brief description of the technical field of touch, prior technology, content, and surface method) [Technical field to which the invention belongs] The present invention relates to the manufacture and Application method. In particular, it relates to a process that uses phase change substances through melting, microencapsulation, oysters, mixing of adhesives or hardeners, spraying or impregnation, etc. to make a substrate that can maintain temperature and dissipate heat. The heat-dissipating substrate can be used in computers, electronic appliances, motors, lamps and machinery and other products that can continue to generate heat under any long-term use, so as to enhance the heat dissipation and temperature holding effect of the product. [Previous technology] -General computers, electronics, electrical appliances, motors, lamps and machinery and other products will continue to generate thermal energy after a period of operation. This thermal energy has a considerable impact on the equipment itself and the surrounding environment. The continuous improvement and improvement of the product's effectiveness and the use of the temple have also caused more heat energy to be generated. For example, the operation of many λ-type t-devices or motors has a degree of production that is even higher than $ 1G (above rc) 'However, if these high temperatures use only the simple heat dissipation design of fans or heat sinks, they often cannot effectively dissipate or dissipate heat, and excessively high operating temperatures can easily cause electronic components or mechanical equipment in the electrical device to malfunction. At work, it will also cause problems such as reduced product life & high failure rate, and the temperature of the working environment will increase, which will also cause discomfort and even burns to the human body, which will seriously affect work safety and work efficiency. A notebook computer (note b00k) is taken as an example, and its heat dissipation method mostly transmits the heat energy of the radon to the case and dissipates heat through the case, so the case is scattered. That is the importance of efficiency plays a considerable degree of 0 continued overleaf (the description of the invention page is insufficient use, annotation and use continuation sheet) 583 228
【內容】 本發明係應用一種微膠囊化相變物 月心應用，：M：位 用微膠囊化相變物質其可持續吸熱及散熱之特性二’、 調節溫度之功能，其中該相變物質可以為直鏈院以= 丨 醉:有機酸等物質，而該微膠囊之外殼則為高分子材:、， 如：三聚氰胺甲搭、尿素甲路樹脂或聚氨基甲酸乙酿等。 藉由高分子材料包覆相變物質而成為微膠囊化曰之柏 變物質，該相變物質經微膠囊化後，藉由高分子材料之 用，可避免相變物質因吸熱使其變成液態而流失，因而 法重複使用，故相變物質經微膠囊化之最主要目的，仪“、、 相變物質可重複使用。 、係使 如第一圖所示，長久以來，微膠囊化物（11)皆是以 混摻的方式加入建築結構中，如：混凝土、石膏板 太1%能集熱板等以達到溫度控制的目的。[Content] The present invention applies a microencapsulated phase change material to the heart of the heart: M: microencapsulated phase change material with sustainable heat absorption and heat dissipation characteristics II ', the function of adjusting temperature, wherein the phase change material It can be used for straight chain hospitals: 丨 drunk: organic acids and other materials, and the shell of the microcapsule is made of polymer materials, such as: melamine, urea resin or polyurethane. The microencapsulated phase change substance is coated with a polymer material to cover the phase change substance. After the microencapsulation of the phase change substance, the use of the polymer material can prevent the phase change substance from becoming liquid due to heat absorption. But the loss, so the method is reused, so the most important purpose of phase change material microencapsulation, the phase change material can be reused. As shown in the first figure, for a long time, microencapsulation (11 ) Are added to the building structure in a mixed way, such as: concrete, gypsum board is too 1% can collect heat plate, etc. to achieve the purpose of temperature control.
如第二圖所示，近幾年來，亦有利用微膠囊化物（ 加工於布料纖維中，或是塗佈於布料（2 )上以調節溫度，’ 而使功能性織物更趨舒適性。 X 藉由本發明之實施，至少可達下列之目的： 目的一、係在於利用微膠囊化之相變物質，藉由喷塗 或含浸使其附著於基材表面，以製造出可加強散熱效果2 持溫及散熱基材。 目的二、將目的一所製成之持溫及散熱基材，使用於 會持續產生熱能之電腦、電子、t器、馬達、燈具及機械 專產αα ’製成該產品之外殼或散熱器，使其可快速將上述 產品其所產生之熱能，藉由微膠囊化相變物質與外界冷空 583228 發明說明續頁 氣作熱交換程序，藉以耑赦芬处^士 a 1---- 月文"、、及、、隹持其溫度，使產品工作之 溫度不致繼續上升，延具兮甚σ <長忒產品之使用壽命。 為達本發明上述目的， 本t月提供一持溫及散熱基材 之製造方法，係包括有下列步驟·· (a )相 < 物貝之選擇步驟，其為選擇的相變物 質。 溶融步驟，盆孫膝/ \ 八係將（a )所選定之相變物質相 互熔融。 微膠囊化步驟，其將步驟（b)已熔融之相變 物貝，使用咼分子材料製成微膠囊。 ⑷、乾燥步驟’將步驟（c)所製成之微膠囊，進 行乾燥處理。 混摻步驟，將步驟⑷所製成之微膠囊與接 著劑或硬化劑等相混摻； 塗震步驟，其將混摻步驟（〇所製得的物質， 經熱溶分散、冷卻、粉碎後以嘴塗或含浸等方 法，使附著於一基材表面。 【實施方式】 本發明之上述目的及所具功效， 一步說明如下： 見配合下列圖式作進 擇牛1 第二圖所顯示’為本發明之流程圖，相變物質之選 ==，係選擇適當的相變物質。炼融 ，係 將4⑴)的相變物質相互熔融。微膠囊化 將步驟（33)已炫融之相變物f，使用 j、 覆’並製成微膠囊。乾燥步驟(37)係將步 b) (c) (e ) f) 抖聊 發明說明續頁 成 仃乾燥處理。混摻步驟（39)，係將步驟（37)製 係 、"接者劑、硬化劑等相混摻。塗裝步驟（40)， 後j凡成此摻步驟（39)之物質，經熱溶分散、冷卻、粉碎 X噴塗或含浸等方法，使其附著於一基材表面。 依據本發明第四圖的流程，以一具體實施例作揭露說 樹。/乍為微膠囊之高分子材料其成分可為：三聚氰胺甲酸 ★月曰尿素甲醛樹脂或聚氨基甲酸乙酯及其他可包覆成為 勹i n为子材料。本發明所選擇使用的相變物質，其 έ有·直鏈燒、高級醇、有機酸等物質。 步驟1 ·係將三聚氰胺甲醛樹脂27份，加水73份溶解。 。ν驟2.係將pva ( 20。/。）2份，加水40份加熱至60 力入十四醇5份’以均質機6〇〇〇rpm乳化5分鐘。 步驟3·係將步驟2·所產生之乳液加入步驟丨·中，以in 鹽酸水溶液調酸鹼值至pH = 6，反應溫度為6(rc，反應時 間約為1小時。 步驟4·係為反應完成後加氨水調酸鹼值至pH=9，待 溫度到達室溫後過濾乾燥之。 步驟5.係取微膠囊3份環氧樹脂7份經過高溫熔融分 散後’冷卻、輾碎，經喷塗或含浸於例如為電腦外殼上。 為確認附著本發明所製得的微膠囊化相變物質於電 月甸外殼上能有效的將熱散去，茲進行下列測試： 模擬CPU加熱塊以12W加熱，加熱面積9mmx 11 mm ’模擬電腦所處環境溫度3 〇°c，試驗樣品如下： 經過加熱達熱平衡後，當加熱塊之溫度達平衡時，紀 錄溫度數據以確認散熱效率：As shown in the second figure, in recent years, microcapsules (processed in cloth fibers or coated on cloth (2) to adjust the temperature, have also been used to make functional fabrics more comfortable. X With the implementation of the present invention, at least the following objectives can be achieved: Objective 1. It is to use microencapsulated phase change materials to adhere to the surface of the substrate by spraying or impregnation to produce a heat dissipation effect that can be enhanced. Mild heat-dissipating substrate. Purpose 2. Use the heat-smoothing and heat-dissipating substrate made by Objective 1 for computers, electronics, appliances, motors, lamps, and machinery that will continue to generate heat. The casing or radiator makes it possible to quickly generate the thermal energy generated by the above products through microencapsulated phase change material and the cold air from outside. 1 ---- Yuewen " ,, and, and hold its temperature, so that the working temperature of the product will not continue to rise, extending the service life of σ < long 忒 products. In order to achieve the above purpose of the present invention, this Provide a temperature and cooling base The manufacturing method of the material includes the following steps: (a) phase < selection step of the shellfish, which is the selected phase change material. Melting step, the basin sun knee / eight series will (a) selected phase The variable substances are melted with each other. The microencapsulation step is to prepare the microencapsulated phase change shellfish in step (b) by using the rhenium molecular material. ⑷, the drying step 'the microcapsules made in step (c), Drying process. Mixing step, mixing the microcapsules prepared in step 与 with an adhesive or hardener, etc .; and a shaking step, which mixes the substance prepared in step (0, After cooling and smashing, it can be applied by mouth coating or impregnation to adhere to the surface of a substrate. [Embodiment] The above-mentioned purpose and effects of the present invention are explained in one step as follows: See the following figure for the selection of cattle 1 Second Shown in the figure is the flow chart of the present invention. The selection of phase change material ==, is to select the appropriate phase change material. Smelting, melting phase change material 4)). Microencapsulation will have step (33) Dazzling phase change f, use j, cover 'and make micro Capsules. The drying step (37) is a step b) (c) (e) f) of the chat. The mixing step (39) is a step of mixing the system of step (37), " receiver agent, hardener, and the like. After the coating step (40), the material that has been mixed into the step (39) is adhered to a substrate surface by means of hot-melt dispersing, cooling, pulverizing, spraying or impregnation. According to the process of the fourth figure of the present invention, a specific embodiment is used to disclose the tree. / The polymer material of microcapsules can be: melamine formic acid. ★ Urea formaldehyde resin or polyurethane and other materials that can be coated into 勹 i n as a sub-material. The phase change substances selected for use in the present invention include substances such as linear burners, higher alcohols, and organic acids. Step 1 · Dissolve 27 parts of melamine formaldehyde resin and 73 parts by adding water. . v Step 2. Two parts of pva (20%) were added, 40 parts of water was added to heat and 60 parts of tetradecanol was added, and emulsified for 5 minutes at 6,000 rpm in a homogenizer. Step 3: Add the emulsion produced in Step 2 · to Step 丨 ·, adjust the pH value to pH = 6 with aqueous hydrochloric acid solution, and the reaction temperature is 6 (rc, the reaction time is about 1 hour. Step 4 is After the reaction is completed, add ammonia water to adjust the pH value to pH = 9, and filter and dry it after the temperature reaches room temperature. Step 5. Take 3 parts of microcapsules and 7 parts of epoxy resin after high temperature melting and dispersing. Spraying or impregnating, for example, a computer casing. In order to confirm that the microencapsulated phase change material prepared by the present invention can effectively dissipate heat on the electric Yuedian casing, the following tests are performed: The CPU heating block is simulated to 12W heating, heating area 9mmx 11 mm 'Simulate the ambient temperature of the computer at 30 ° C. The test samples are as follows: After heating reaches thermal equilibrium, when the temperature of the heating block reaches equilibrium, record the temperature data to confirm the heat dissipation efficiency:
值付注思的是，佑械士 依據本务明其選擇的相變物質， 慮到電腦、電子、電考、H ^ 、 應考 ^ ώ 冤杰馬達、燈具及機械等產品之發埶 源溫度，以及其所處環境的溫度，即相變物質之 ; 應落於發熱源溫度及其所處環境的溫度區間’如此可= 收發熱源所放出之熱量’當所吸收之熱未達飽和時，亦即 溫度未達相變化溫度的同時，將 藉由與外界環境較冷的 :乳作熱父換，可將原本發熱源所產生的熱，#由相變物 貝的吸收使得溫度不致於上升過快，在藉由與外界環境之 冷空氣作熱父換’則可使附著有微膠囊相變物質之 維持在相變物質的相變溫度區間’甚或更低的溫度：\由 相變物質之熱交換達到散熱之功能。 、工 請參閱第四、五、六、七阁士义 七圖，本發明所製得之持溫及 ^ 發明說明續頁 政熱基材，包括有一基板（4 )及外 ~--— 、」及彳政膠囊相變化物質（4 1 )， ，、特別對於持續發熱的設備裝罟 y ^ W表置，例如電腦螢幕外殼 ⑴、電腦主機外殼（6)、筆記型電腦外殼⑺、電子、 馬達、燈具及機械等產品的機殼上，完全能夠達到加強散 :及持溫之效果，維持電器產品内部之電子零件的使用壽 vp 〇 經由上列的敘述，使本發明有更充分的瞭解，但其僅 為實例說明，並非企圖具以對本發明作任何形式上:限 制，是以，凡有在相同之創作精神下所作有關本發明之任 何t舞或變更，白仍應包括在本發明意圖保護之範,。 【圖式簡單說明】 第一圖所顯示為習知應用示意圖 第二圖所顯示為習知應用圖 第三圖所顯示為本發明之流程圖 第四圖所顯示為本發明之實施例 第五圖所顯示為本發明之應用實施例一 第六圖所顯示為本發明之應用實施例二 第七圖所顯示為本發明之應用實施例三 【元件說明】 石膏板 (1 ) 微膠囊化物 （11) 布料 （2 ) 基板 （4 ) 微膠囊相變化物質 （41) 583228What's worth noting is that, according to the phase change material selected by the medicare according to this matter, considering the computer, electronics, e-test, H ^, should ^ ^ the source temperature of products such as motors, lamps and machinery , And the temperature of the environment in which it is located, that is, the phase-change material; it should fall within the temperature range of the temperature of the heating source and its environment 'so can = the heat emitted by the receiving and sending heat source' when the absorbed heat is not saturated, That is, when the temperature does not reach the phase change temperature, the heat generated by the original heating source can be changed by using the milk that is colder with the external environment: #The absorption of the phase change material will not cause the temperature to rise. Too fast, by making a hot parent exchange with the cold air of the external environment, 'the microencapsulated phase change substance can be maintained in the phase change temperature interval of the phase change substance' or even lower temperature: \ by the phase change substance The heat exchange achieves the function of heat dissipation. For details, please refer to the fourth, fifth, sixth, and seventh courts, the seventh and seventh figures. The gentleness of the invention ^ Description of the invention The continuation of the political and thermal substrate includes a substrate (4) and the outer ~~-, And the phase change substance (4 1) of the Zhengzheng Capsule, especially for the installation of continuous heating equipment, such as computer screen casings, computer mainframe casings (6), notebook computer casings, electronics, Motors, lamps, machinery and other product housings can fully achieve the effect of heat dissipation and temperature maintenance, maintaining the life of electronic components in electrical products. Vp 〇 Through the above description, the present invention has a better understanding However, it is only an example, and is not intended to be any form of the present invention: the limitation is that any t dance or change related to the present invention made in the same creative spirit, Bai should still be included in the present invention A model of intent to protect. [Brief description of the drawings] The first picture shows a schematic diagram of a conventional application. The second picture shows a conventional application diagram. The third diagram shows a flowchart of the present invention. The fourth diagram shows a fifth embodiment of the present invention. The figure shows application example 1 of the present invention. The sixth figure shows application example 2 of the present invention. The seventh figure shows application example 3 of the present invention. [Element description] Gypsum board (1) Microencapsulation ( 11) Cloth (2) Substrate (4) Microencapsulated phase change substance (41) 583228
電腦螢幕外殼 (5 ) 電腦主機外殼 （6 ) 筆記型電腦外殼 （7 )Computer screen housings (5) Computer host housings (6) Notebook computer housings (7)