TW582083B - Fixture for die-pull test - Google Patents

Abstract

A fixture is used for the die-pull test of a flip chip package. The fixture for the die-pull test comprises a first platform and a second platform. The substrate of the flip chip package is plane-mount fixed on the first platform. The chip of the flip chip package is plane-mount fixed on the second platform. The second platform is connected to a testing head of an exterior universal test machine.

Description

582083

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a wafer bump force and a fixture for die-pull test of a flip-chip package structure, and more particularly to a shell] Face-fixed chip & stomach ^% -fer force test fixture in a flip-chip package structure. [Previous technology] Generally, a flip chip package includes a substrate, a wafer mounted on the substrate using flip-chip technology, and solder or gold bumps for the wafer. It is electrically connected to the substrate. An underfill (underf i 1 1) can be filled between the wafer and the substrate to encapsulate the substrate, the wafer and the bump. In order to understand the reliability of flip-chip bonding, a die puli test is required. Referring to FIG. 1, which shows a jig 18 for a wafer bump tensile test according to one of the prior arts, a flip-chip package structure 15 is firmly fixed thereto. The flip-chip package structure 15 has a substrate 14 and a wafer 12 disposed on the substrate 14 through bumps 16. The jig 18 for the wafer bump tensile test has two grooves 20 for clamping both sides of the substrate 14. An adhesive layer 24 is coated on the wafer 12 of the flip-chip package structure 15. The wafer 12 is adhered to a test head of a universal testing machine (not shown). (TestingHeadorJig) on 22. j Referring to FIG. 2, during the test, the test head 22 is driven upward for the universal material testing machine, so as to apply upward force to the wafer 12. As the test head 22 moves upward, the junction between the wafer and the substrate

00642.ptd Page 6 582083 V. Description of the invention (2) Structures, such as the bump 16 and the Under Bump Metallurgy (UBM) (not shown) are deformed under tensile stress And further break, so that the wafer 12 is separated from the substrate 14. However, the aforementioned fixture 18 for the wafer bump tensile test only fixes the edge of the substrate 14, so when the substrate 14 is a flexible substrate, such as FR-4 and BT resin substrate, during the test process In this case, the substrate 14 is bent. In this case, the bump 16 will not only withstand the tensile stress in the forward direction, but also with the shearing stress. Furthermore, the bending of the substrate 14 also causes stress to be concentrated on the peripheral bumps in the bumps 16. Therefore, the data obtained during this test are significantly lower than the actual forward force that the substrate 14 and the wafer 12 can withstand. Furthermore, in this configuration, the substrate 4 and the wafer 12 after the test or break are fixed on the jig 18, and usually through an optical microscope (OM) or an electron microscope. (Scanning electron microscope; SEM) Observe the failure mode of the bump 16. However, the operational height of the jig a often cannot be matched with the optical microscope or the electron microscope, and observation of the cracking mode cannot be performed. In view of this, there is a need for a jig for a wafer bump tensile test.

To overcome the aforementioned problems. [Summary of the Invention] An object of the present invention is to provide a method for fixing a semiconductor chip in a surface-fixed manner for a wafer bump tensile test to apply force to a semiconductor package structure so as to be correct.

Page 7 582083 V. Description of the invention (3) Measure the tensile strength of the semiconductor flip-chip package structure. To achieve the above object, the present invention provides a jig, which is applied to a wafer bump tensile test of a flip-chip package structure. The jig for pulling the wafer bump includes a first platform and a second platform. The first platform is fixedly supporting the substrate of the flip-chip package structure. The second platform fixedly supports the semiconductor wafer of the flip-chip package structure and is connected to a test head of an external universal testing machine. According to the jig for testing the tensile strength of the wafer bump according to the present invention, the semiconductor package structure substrate and the semiconductor wafer are fixedly supported by two platforms. The substrate and semiconductor wafer of the flip-chip package structure are fixed on the platform with the entire surface. Therefore, during the test, the substrate will not be bent or deformed, which will affect the test results. In order to make the above and other objects, features, and advantages of the present invention more obvious, the preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, as follows. [Embodiment] Please refer to FIG. 3 ′, which shows a jig 50 0 ′ for a wafer bump tensile test according to the present invention, to perform a wafer bump tensile test on a flip-chip package structure 55. The flip-chip package structure 55 has a substrate 54 and a semiconductor wafer 5 2 ′ connected to the substrate 54 by a flip-chip technology. The fixture 50 of the wafer bump tensile test includes a bracket 58 and a fixed platform 60. The jig for the wafer bump tensile test 50 also includes a test platform 64 ′ and one of the testing heads of a universal material testing machine (Testing Head or

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Jig) 62. The two thin plates 70 and 72 can be fixed on the bracket 58 and the fixed platform 60 by a fixing member (not shown) such as a bolt or a fixing device such as a chute. The thin plates 70, 72 are made of a rigid material, such as steel (stee 1). An adhesive layer 68 is coated on the thin plate 72 to adhere the substrate 54 of the flip-chip package structure 55 to the thin plate 72, so that the substrate 54 can be mounted on the fixed platform 60. . An adhesive layer 6 6 is coated on the thin plate 70 to adhere the semiconductor wafer 52 of the flip-chip package structure 55 to the thin plate 70, so that the semiconductor wafer 52 can be mounted on the test platform 6 4. on. Referring to FIG. 4, during the test, the test head 62 is driven upwards by the universal material testing machine, so as to apply upward force to the wafer 52. As the test head 62 moves upward, the components' between the wafer 52 and the substrate 54 are such as a plurality of solder bumps or gold bumps (solder bump or gold bump) 56 and an under bump metallurgy (Under Bump Metallurgy; UBM (not shown), deforms under tensile stress, and further breaks, so that the wafer 52 is separated from the substrate 54. During the test, the displacement and force of the test head 62 will be recorded, and the & wafer bump tensile test is completed. In addition, in this configuration, the wafer 52 and the substrate 54 are still adhered to the thin plate 70 and the thin plate 72 through the adhesive layer 6 6 and the adhesive layer 68 respectively. The substrate 54 and the wafer 52 may be placed together with the thin plate 70 and the thin plate 72 in an optical microscope (OM) or an scanning electron microscope (SEM).

00642.ptd Page 9 582083 V. In the description of the invention (5), ′ observe the failure mode of the flip-chip package structure 55. Please refer to FIGS. 5 and 6, which shows a jig 80 for a wafer bump tensile test according to another embodiment of the present invention, which is used to perform a wafer bump tensile test on a flip-chip package structure 85. The fixture 80 of the wafer bump tensile test is similar to the fixture 50 of the wafer bump tensile test, and similar components are marked with similar drawing numbers. The jig 80 for the wafer bump tensile test includes a fixed suction cup 90, which has a plurality of channels 98 connected to an external vacuum source (not shown), for the substrate 84 covering the θθ package structure 85 Suction on the fixed suction cup gQ. 8. The jig for testing the tensile strength of the wafer bump 80 includes a test chuck 94, which is connected to a Testing Head 〇r Jig 92, which is a universal material testing machine. The test chuck 94 has a plurality of channels 96 connected to an external vacuum source (not shown), and is used to suck the conductor wafer 8 2 of the flip-chip package structure onto the test chuck g 4. As mentioned above, in the jig for testing the tensile strength of the wafer bump of the present invention, the flip-chip package structure is “face-fixed”. That is, the flip chip substrate and the semiconductor wafer are fixed on the platform disk with the entire surface. Therefore, during the test, the substrate will not be damaged.

Deformation: The result of the loud test. Those skilled in this art will understand how to fix the surface between the U stage and the cover a. The packaging structure is limited by the adhesive layer and the suction cup. As mentioned just now, "Although the foregoing description and illustrations have revealed the invention of the invention, it must be understood that various additions, modifications and substitutions may be used in ::： 佳

00642.ptd Page 10 582083 V. Description of the invention = departure from the scope and scope of the embodiments of the invention as defined by the scope of the attached patent application. Those skilled in the art will appreciate that the present invention may make modifications in form, structure, scale, materials, components, and components. Therefore, the embodiments disclosed herein should, in all respects, be considered to illustrate the invention 'and not to limit the invention. The crime of this month shall be bounded by the scope of the attached patent application for X months and the offender is not limited to the previous description. And contains the eighth method equivalent,

582083 Schematic description [Schematic description] Figure 1: The side view of the jig for the wafer bump tensile test of the prior art. Figure 2: This is a side view of the jig for the wafer bump tensile test of the prior art during the test. FIG. 3 is a schematic side view of a jig for a wafer bump tensile test according to an embodiment of the present invention. Figure 4: This is the jig for the wafer bump tensile test in Figure 3. The side surface during the test is not intended. Fig. 5 is a schematic side view of a jig for testing tensile strength of a wafer bump according to another embodiment of the present invention. Fig. 6 is a schematic side view of the jig for the wafer bump tensile test in Fig. 5 during the test. Figure number description:

18 Jig for wafer bump tensile test 15 Flip-chip package structure 14 Substrate 12 Wafer 16 bump 2 0 groove

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Brief description of the drawing 24 Adhesive layer 22 Test head 50 Jig for wafer bump tensile test 52 Semiconductor wafer 54 Substrate 55 Flip-chip package structure 56 Bump 58 Bracket 60 Fixed platform 62 Test head 64 Test platform 66 Adhesive layer 68 Adhesive layer 70 thin plate 72 thin plate 80 wafer jig pull test fixture 82 semiconductor wafer 84 substrate 85 flip chip package structure 86 bump 88 bracket 90 fixed suction cup 92 test head 94 test suction cup 96 channel 98 channel 00642.ptd page 13

Claims (1)

582083 VI. Application for Patent Scope 1. A jig for wafer bump tensile test is applied to a flip-chip package structure having a substrate and a semiconductor wafer, which are arranged on the substrate by flip-chip technology The jig for testing the tensile strength of the wafer bump includes: a first platform; a first thin plate detachably disposed on the first platform for surface-supporting the substrate of the flip-chip package structure; a second The platform is connected to a test head of an external universal testing machine; and a second thin plate is removably disposed on the second platform to support the flip-chip package structure on a surface. The semiconductor wafer. 2 \ The jig for the wafer bump tensile test according to item 丨 of the patent application scope, in which 4th sheet and the first sheet are made of rigid materials. 3 \ The fixture according to the wafer bump tensile test item No. 丨 of the patent application scope, in which the ^ th / special plate and the -thin sheet steel (s t e e 1) are manufactured. / The application of the test piece for the wafer bump tensile test fixture in the first item of the patent claim, and another two first adhesive layers for adhering the substrate of the flip-chip package structure to the first thin plate. 5 scoops, jig for tensile testing of wafer bumps in item 1 of the patent application range, and a first adhesive layer for the semiconductor crystal of the flip-chip package structure 582083 6. The patent application sheet is adhered to the A method for testing the tensile strength of a wafer bump on the second sheet 6 includes the following steps: providing a flip-chip package structure with a substrate and a semiconductor wafer, which are arranged on the substrate by flip-chip technology; providing a first Platform: Provide a first thin plate detachably disposed on the first platform to support the substrate of the flip-chip package structure fixedly; provide a second platform; provide a second thin plate and detachably configure Applying a force to one of the first platform and the second platform on the second platform to support the semiconductor wafer of the flip-chip package structure in a fixed manner; and People move. 7. The method for testing the tensile strength of wafer bumps according to item 6 of the scope of patent application, further comprising the steps of: recording the force and the relative displacement between the first platform and the second platform 0 8, and according to the scope of patent application scope 6 The method for testing the tensile strength of a bump of a wafer, wherein the first sheet further has a first adhesive layer for adhering the substrate of the flip-chip package structure to the first platform. 9. According to the method of wafer bump tensile test according to item 6 of the patent application scope, which 00642.ptd Page 15 582083 6. In the scope of the patent application, the second sheet further has a second adhesive layer for adhering the semiconductor wafer constructed by the flip chip to the second platform. 10. The method for testing the tensile strength of a wafer bump according to item 6 of the patent application scope, further comprising the steps of: providing an optical microscope (0M) for observing the first thin plate and the substrate and the second thin plate And the same semiconductor wafer. 11. The method for testing the bump bump tensile force according to item 6 of the patent application, further comprising the steps of: providing a scanning electron microscope (SEM) for observing the first thin plate and the substrate and the second plate The thin plate is the same as the semiconductor wafer. 1 2. A jig for testing the tensile strength of a wafer bump, which is applied to a flip-chip package structure. The flip-chip package structure has a substrate and a semiconductor wafer. The test fixture kit includes: a first platform for surface-fixing a drum substrate supporting the flip-chip package structure; and a second platform for surface-fixing supporting the semiconductor of the flip-chip package structure. The chip is connected to a test head of an external universal testing machine. 00642.ptd 582083 6. Scope of patent application 1 3. According to the scope of the patent application, it also contains a first adhesive layer and a jig for testing the tensile strength of a wafer bump on the first platform. It is used to adhere the substrate of the flip-chip package structure. 14. According to the scope of the application for patent, it further includes a second adhesive layer, a jig for testing the tensile strength of the bumps of the wafer, and the wafer is adhered to the second flat A. The semiconductor of the flip-chip package structure is constructed. 15. According to the scope of the patent application, the first platform has a fixture for testing the tensile strength of a wafer bump, and the substrate. A suction cup is used to support the flip-chip package structure. 16. According to the scope of the patent application, the second platform has a jig for a wafer bump tensile test of the item, the semiconductor wafer. A suction cup for supporting the flip-chip package structure 1 7. A method for testing the strength of the wafer bumps 6M batch a # 日 # ## force test method, including the following steps: lifting the package structure, having a substrate and A semiconductor wafer is disposed on the substrate by flip-chip technology. That is, a first platform is provided to support the substrate of the flip-chip packaging structure fixedly; a second platform is provided to support the flip-chip packaging structure fixedly. The semiconductor wafer; and 00642.ptd Page 17 582083 6. Scope of patent application Apply a force to one of the first platform and the second platform to make it move relative to the other. 18. The method for testing the tensile force of a wafer bump according to item 17 of the scope of the patent application. 'The method further includes the steps of: recording the force and the relative displacement between the first platform and the second platform. 19. The method for testing the tensile strength of a bump of a wafer according to item 17 of the scope of patent application, wherein the first platform further has a first adhesive layer for adhering the substrate of the flip-chip package structure to the first platform. on. 20. The method for testing the tensile strength of a bump of a wafer according to item 17 of the scope of patent application, wherein the second platform further has a second adhesive layer for adhering the semiconductor wafer of the flip-chip package structure to the second on the platform. 2 1. The method for testing the tensile strength of a bump of a wafer according to item 17 of the patent application scope, wherein the first platform further has a suction cup for supporting the substrate of the flip-chip package structure. 2 2. According to the method for testing the bump bump tensile force according to item 17 of the patent application scope, wherein the second platform further has a suction cup for supporting the semiconductor wafer of the flip-chip package structure. 00642.ptd Page 18