TW577641U - Ball grid array connection device - Google Patents

Ball grid array connection device

Info

Publication number
TW577641U
TW577641U TW092201720U TW92201720U TW577641U TW 577641 U TW577641 U TW 577641U TW 092201720 U TW092201720 U TW 092201720U TW 92201720 U TW92201720 U TW 92201720U TW 577641 U TW577641 U TW 577641U
Authority
TW
Taiwan
Prior art keywords
grid array
ball grid
connection device
interposer
contacts
Prior art date
Application number
TW092201720U
Other languages
English (en)
Inventor
Rex W Keller
Original Assignee
Fci Americas Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci Americas Technology Inc filed Critical Fci Americas Technology Inc
Publication of TW577641U publication Critical patent/TW577641U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Pens And Brushes (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW092201720U 2002-01-29 2003-01-29 Ball grid array connection device TW577641U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/059,461 US6830463B2 (en) 2002-01-29 2002-01-29 Ball grid array connection device

Publications (1)

Publication Number Publication Date
TW577641U true TW577641U (en) 2004-02-21

Family

ID=22023094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092201720U TW577641U (en) 2002-01-29 2003-01-29 Ball grid array connection device

Country Status (8)

Country Link
US (1) US6830463B2 (zh)
EP (1) EP1331707B1 (zh)
JP (1) JP2003234377A (zh)
KR (1) KR20030065351A (zh)
CN (2) CN1808769A (zh)
AT (1) ATE324687T1 (zh)
DE (1) DE60304749T2 (zh)
TW (1) TW577641U (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538440B2 (en) * 2003-04-30 2009-05-26 Intel Corporation Method for improved high current component interconnections
TW595290B (en) * 2003-10-27 2004-06-21 Benq Corp Electronic device having connection structure and connection method thereof
US7258549B2 (en) * 2004-02-20 2007-08-21 Matsushita Electric Industrial Co., Ltd. Connection member and mount assembly and production method of the same
JP4413680B2 (ja) * 2004-04-16 2010-02-10 株式会社フジクラ 電気コネクタ
US7217151B2 (en) * 2004-11-12 2007-05-15 Fci Americas Technology, Inc. Electrical connector with strain relief features
US7135771B1 (en) * 2005-06-23 2006-11-14 Intel Corporation Self alignment features for an electronic assembly
KR100810349B1 (ko) * 2006-08-04 2008-03-04 삼성전자주식회사 인터포저와 그를 이용한 반도체 패키지
US7799267B2 (en) * 2007-09-14 2010-09-21 The Penn State Research Foundation Method for manufacture of transparent ceramics
US8487428B2 (en) * 2007-11-20 2013-07-16 Fujitsu Limited Method and system for providing a reliable semiconductor assembly
US8237274B1 (en) * 2010-05-13 2012-08-07 Xilinx, Inc. Integrated circuit package with redundant micro-bumps
CN101859749A (zh) * 2010-06-07 2010-10-13 中国航天科技集团公司第九研究院第七七一研究所 一种球栅阵列器件功能转换模板焊接结构及其制备方法
US8167644B2 (en) * 2010-06-30 2012-05-01 Tyco Electronics Corporation Electrical connector for an electronic module
JP2012164654A (ja) * 2011-02-04 2012-08-30 Tyco Electronics Corp 電気コネクタ
US9773724B2 (en) * 2013-01-29 2017-09-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
US20140262467A1 (en) * 2013-03-15 2014-09-18 Lantek Electronics Inc. Contact surface for a pin hole
US9726691B2 (en) 2014-01-07 2017-08-08 International Business Machines Corporation 3D chip testing through micro-C4 interface
CN105486333B (zh) * 2015-11-19 2018-08-24 业成光电（深圳）有限公司 改善窄线距接合垫压合错位之感测器结构
US9947634B1 (en) * 2017-06-13 2018-04-17 Northrop Grumman Systems Corporation Robust mezzanine BGA connector

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836435A (en) * 1986-05-12 1989-06-06 International Business Machines Corporation Component self alignment
US4774632A (en) 1987-07-06 1988-09-27 General Electric Company Hybrid integrated circuit chip package
US4912545A (en) 1987-09-16 1990-03-27 Irvine Sensors Corporation Bonding of aligned conductive bumps on adjacent surfaces
DE69312411T2 (de) 1992-09-15 1997-11-27 Texas Instruments Inc Ballkontaktierung für Flip-Chip-Anordnungen
US5329423A (en) 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
US5435733A (en) 1993-11-12 1995-07-25 Hughes Aircraft Company Connector assembly for microelectronic multi-chip-module
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
JPH0845445A (ja) 1994-04-29 1996-02-16 Texas Instr Inc <Ti> フラット・パネル・ディスプレイ装置及びその製造方法
US5477933A (en) 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5593322A (en) * 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
US6024584A (en) 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US5738531A (en) 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
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US6084782A (en) * 1997-06-02 2000-07-04 Motorola, Inc. Electronic device having self-aligning solder pad design
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Also Published As

Publication number Publication date
US20030143872A1 (en) 2003-07-31
EP1331707B1 (en) 2006-04-26
JP2003234377A (ja) 2003-08-22
CN1808769A (zh) 2006-07-26
KR20030065351A (ko) 2003-08-06
DE60304749T2 (de) 2006-11-16
US6830463B2 (en) 2004-12-14
ATE324687T1 (de) 2006-05-15
EP1331707A1 (en) 2003-07-30
DE60304749D1 (de) 2006-06-01
CN1435915A (zh) 2003-08-13
CN1299391C (zh) 2007-02-07

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees