TW574283B - Super high thermal conductive polymer matrix composite and method for making the same. - Google Patents

Super high thermal conductive polymer matrix composite and method for making the same. Download PDF

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TW574283B
TW574283B TW90117647A TW90117647A TW574283B TW 574283 B TW574283 B TW 574283B TW 90117647 A TW90117647 A TW 90117647A TW 90117647 A TW90117647 A TW 90117647A TW 574283 B TW574283 B TW 574283B
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Taiwan
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grown carbon
polymer
carbon fiber
patent application
graphitized vapor
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TW90117647A
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Chinese (zh)
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Ming Ding Jr
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National Cheng Kung University
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574283 A7 B7 五、發明說明( 發明領域 本發明係關於可用於熱管理應用的一高分子聚合物 複合材料’並且係關於製造這種高分子聚合物複合材料 的方法 經濟部智慧財產局員工消費合作社印製 發明背景 複合材料過去以在結構上的應用而廣爲週知。近幾 年來’複合材料亦被使用於熱管理應用上。舉例來說, 複合材料可用於電子封裝的散熱上。一般典型用於電子 封裝的散熱材料會有熱膨脹係數匹配之問題,然而因爲 複合材料的熱膨脹係數可藉由改變強化材料的數量、種 類與結構而調整,所以便免了熱膨脹係數匹配之問題。 —般所使用強化材料傳統碳纖維、碳化矽顆粒〈silic〇n carbide particle〉、氮化硼顆粒〈boron nitride particle〉、 氣化鈦顆粒〈titanium nitride particle〉、以及鑽石顆粒 〈diamond particle〉。然而以這些強化材料所製造的複合 材料並未有太多實質的導熱率改善。因此近年來已經有 人硏究新的碳纖維,亦即氣相成長的碳纖維,在熱管理 上的應用。氣相成長碳纖維〈簡稱VGCF〉係透過碳氫化 合物氣體〈hydrocarbon gas〉在金屬觸媒〈metal catalyst〉 上裂解〈pyrolysis〉而成長出來。VGCF比任何其他的碳 纖維具有更高的導熱率,而且VGCF可以以較低的成本 生產。VGCF亦爲所有已知碳纖維中具有最高度石墨化 〈highest degree of graphitic perfection〉的碳纖維。574283 A7 B7 V. Description of the Invention (Field of the Invention The present invention relates to a polymer polymer composite material that can be used in thermal management applications' and to a method for manufacturing such a polymer polymer composite material. The Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Background of the printed invention Composite materials have been widely known in the past for structural applications. In recent years, 'composite materials have also been used in thermal management applications. For example, composite materials can be used for heat dissipation in electronic packaging. Typical The heat expansion material used for electronic packaging will have the problem of matching the coefficient of thermal expansion, but because the coefficient of thermal expansion of the composite material can be adjusted by changing the quantity, type and structure of the reinforcing material, the problem of matching the coefficient of thermal expansion is avoided. Conventional carbon fibers, silicon carbide particles, silicon carbide particles, boron nitride particles, titanium nitride particles, and diamond particles are used. However, these reinforcement materials are used. The composites made are not very solid Improved thermal conductivity. Therefore, in recent years, some people have studied the application of new carbon fibers, that is, vapor-grown carbon fibers, in thermal management. Vapor-grown carbon fibers (abbreviated as VGCF) are permeated with hydrocarbon gas (hydrocarbon gas). It grows by pyrolysis on metal catalyst. VGCF has higher thermal conductivity than any other carbon fiber, and VGCF can be produced at a lower cost. VGCF also has the highest of all known carbon fibers. Carbon fiber with the highest degree of graphitic perfection.

4NCKU/200101TW 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 2清先閱讀背面之注意事 I·填· -裝 at · · 574283 A7 -------- B7 五、發明說明(&gt;) 如美國專利案案號第5,8H,4〇8所揭露者,鋁基複合 材料〈aluminum matrix composite〉與一碳基複合材料 〈carbon matrix composite〉已經由此種碳纖維製作而 成’且所製成的複合材料具有高熱導熱率。然而,這兩 種複合材料均具導電性,這項特性是許多應用中所不允 許的。此外,鋁基複合材料的製造需要高於鋁固相線 〈aluminum solidus〉的溫度,約爲 660°C 或 1220°F,且 必須施加高壓以壓鑄熔融態的鋁。此外,必須提供〜充 滿鈍性氣體的保護環境,以防止鋁的氧化。碳基複合材 料的製造亦需要高於ll〇(TC或2〇l2°F的溫度,並需要 較低的壓力〈reduced pressure〉。同時鋁基複合材料或碳 基複合材料的製造都需要一預成形〈pref〇rm〉。另外鋁基 複合材料需要將鋁材與預成形分別加熱,碳基複合材料 亦常常需要碳材與預成形的分別加熱。這些都會加諸 成本中。 °」 因此熱管理用之複合材料技術仍然必須加以改 此外,改良之技術必須提供具有更高之導熱衣 ’ 緣面、低密度、低成本生產之一種複合材料。〜丨生絕 經濟部智慧財產局員工消費合作社印製 發明目的與槪述 —本發明的_目的是提供—高分子聚合物複 此咼分子聚合物複合材料具有高導熱率,且复口料, 表面與低密度的特性。 一有絕緣之4NCKU / 200101TW This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 2 Read the notes on the back of the paper I · Fill · ····· 574283 A7 -------- B7 V. Description of the invention (&gt;) As disclosed in U.S. Pat. No. 5,8H, 408, aluminum matrix composites (aluminum matrix composite) and a carbon matrix composite (carbon matrix composite) have been Made of carbon fiber, and the composite material has high thermal conductivity. However, both composites are conductive, a feature that is not allowed in many applications. In addition, the manufacture of aluminum-based composites requires a temperature above the aluminum solidus (aluminum solidus), approximately 660 ° C or 1220 ° F, and high pressure must be applied to die-cast aluminum in the molten state. In addition, a protective environment full of inert gas must be provided to prevent oxidation of aluminum. The manufacture of carbon-based composite materials also requires temperatures higher than 110 ° C or 201 ° F, and requires a lower pressure <reduced pressure>. At the same time, the manufacture of aluminum-based composite materials or carbon-based composite materials requires a preliminary Forming <pref〇rm>. In addition, aluminum-based composite materials need to be heated separately from aluminum and preforms, and carbon-based composite materials often need to be heated separately from carbon materials and preforms. These will be added to the cost. The composite material technology used must still be modified. In addition, the improved technology must provide a composite material with higher thermal conductivity, low-density, low-cost production. ~ 丨 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The purpose and description of the invention-the purpose of the present invention is to provide-a high molecular polymer compound, a molecular polymer composite material with high thermal conductivity, and complex characteristics, surface and low density characteristics.

本發明的另-目的是提供—適合__應用上的 4NCKU/200101TW 2 經濟部智慧財產局員工消費合作社印製 574283 A7 _ B7 五、發明說明(3)) 高分子聚合物複合材料之製備方法。 本發明藉由提供一高分子聚合物複合材料而滿足理 應用上的需要,這種高分子聚合物複合材料具有高導熱 率、低密度、與一電性絕緣表面。此高分子聚合物複合 材料的製備不需要預成型且只需大氣壓環境。本發明的 高分子聚合物複合材料特別可使用於各種需要電性絕緣 與低密度的熱管理應用中。 本發明之高分子聚合物複合材料係由現場(in-situ) 父織、石墨化的氣相成長碳纖維〈簡稱VGCF〉塾的堆疊 所構成’因此可以免除成長後(post growth )交織及預成 形的製造。Another object of the present invention is to provide 4NCKU / 200101TW 2 suitable for __ applications. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by 574283 A7 _ B7. 5. Description of the invention (3)) Preparation method of high molecular polymer composite material . The present invention satisfies the needs of applications by providing a high molecular polymer composite material, which has a high thermal conductivity, a low density, and an electrically insulating surface. The preparation of this high molecular polymer composite requires no pre-forming and requires only atmospheric pressure. The polymer composite material of the present invention is particularly useful in a variety of thermal management applications requiring electrical insulation and low density. The polymer polymer composite material of the present invention is composed of a stack of in-situ woven and graphitized vapor-grown carbon fibers (abbreviated as VGCF). Therefore, post growth interweaving and pre-forming can be avoided. Manufacturing.

依據本發明的一較佳實施例,提供一高分子聚合物 複合材料,此高分子聚合物複合材料包含石墨化之VGCF 父織墊的堆疊;並將高分子聚合物材料滲透入堆疊內含 之空隙。 此堆疊中的VGCF墊較佳係由半排列 〈semi-aligned〉、半連續〈semi-continuous〉的 vgCF 所 構成,這些VGCF係在生長過程中於現場〈in-shu〉交織 〈interwoven〉。這些纖維較佳係經過石墨化處理的,也 就是以約2600°C或更高的溫度下熱處理,以將此碳纖維 中所含碳的一部分轉換成石墨碳〈graphitic carbon〉。 本發明之VGCF墊的室溫導熱率較佳係高於woo W/m-K,如此所造成之高分子聚合物複合材料具有高於 400 W/m-K的導熱率。 4NCKU/200101TW . 本適用中國國家標準(CNS)A4規格(210 X 297公髮) (請先閱讀背面之注意事項#&lt;填寫本頁)According to a preferred embodiment of the present invention, a high molecular polymer composite material is provided. The high molecular polymer composite material includes a stack of graphitized VGCF parent woven mats; Void. The VGCF pads in this stack are preferably composed of semi-aligned and semi-continuous vgCF. These VGCFs are inter-woven in the field during the growth process. These fibers are preferably graphitized, that is, heat-treated at a temperature of about 2600 ° C or higher to convert a part of the carbon contained in this carbon fiber into graphitic carbon. The room temperature thermal conductivity of the VGCF pad of the present invention is preferably higher than woo W / m-K. The polymer composite material thus produced has a thermal conductivity higher than 400 W / m-K. 4NCKU / 200101TW. This applies to China National Standard (CNS) A4 specification (210 X 297 public) (Please read the precautions on the back first # &lt; Fill this page)

574283 A7 五、發明說明(+) 本發明亦提供製造此高分子聚合物複合材 法,此方法-般而言包含提供至少〜石墨化vgc 步驟,以遞滅_好聚合_料渗以此石勺 VGCF墊的空隙中。 此化574283 A7 V. Description of the invention (+) The present invention also provides a method for manufacturing the polymer polymer composite material. This method-generally includes the step of providing at least ~ graphitization vgc to degrade _ good polymerization _ material permeate this stone Spoon the VGCF pad into the gap. This

於-較佳實施例中,高分子聚合物材料係以熱壓技 術’滲透入石墨化VGCF墊中。在熱壓技術中,高分子 聚合物材_與5難VGCF _同_鳩到比高分 子聚合物材料之熔點更高的溫度。當高分子聚合物材料 與石墨化VGCF墊的堆疊到達所需要的狀態時,則在大 氣環境下對高分子聚合物材料與石墨化VGCF墊的堆疊In the preferred embodiment, the high-molecular polymer material is infiltrated into the graphitized VGCF pad by hot pressing technology '. In the hot-pressing technology, the high molecular polymer material is the same as the VGCF, and the temperature is higher than the melting point of the high molecular polymer material. When the stacking of the polymer material and the graphitized VGCF pad reaches the required state, the stacking of the polymer material and the graphitized VGCF pad is performed in an atmospheric environment.

施加壓力以起始滲透入程序。 I 訂 本發明的方法由於使用了高分子聚合物材料而符合 成本效益且具有高效率,而不需要高溫、預成形、保護 環境、較低的壓力或高壓力以及分別加熱。此外,VGCF 墊的使用免除了在使用VGCF於複合材料之前以機械方 式編織個別碳纖維以形成墊的必要性。 經濟部智慧財產局員工消費合作社印製 這樣的熱壓技術使得纖維體積百分比〈fiber loading〉落在有用範圍,也就是從1〇體積百分比〈v〇lume percent〉到60體積百分比,並允許單一方向 〈uni-directional〉或同平面正交〈in-piane orthogonal (two-directional)〉的纖維架構,而不會造成不均勻的滲 透入〈inhomogeneous infiltration〉。這也使得熱膨脹係數 與其他複合材料的特性可以在較大的範圍內進行控制, 因而增加可使用此複合材料應用端的種類數目。Pressure is applied to initiate the infiltration procedure. The method of the present invention is cost-effective and highly efficient due to the use of high-molecular polymer materials without the need for high temperature, pre-forming, environmental protection, lower pressure or high pressure, and separate heating. In addition, the use of VGCF mats eliminates the need to mechanically weave individual carbon fibers to form mats before using VGCF in composites. The printing of such hot-pressing technology by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs makes the fiber volume percentage <fiber loading> fall in a useful range, that is, from 10 volume percentage (v〇lume percent) to 60 volume percentage, and allows a single direction <Uni-directional> or in-piane orthogonal (two-directional) fiber structure without inhomogeneous infiltration. This also allows the thermal expansion coefficient and the characteristics of other composite materials to be controlled within a wide range, thereby increasing the number of types of applications where this composite material can be used.

4NCKU/200101TW 本紙張尺度適用中國國豕標準(CNS)A4規格(210 X 297公餐)4NCKU / 200101TW This paper size is applicable to China National Standard (CNS) A4 (210 X 297 meals)

574283 五、發明說明(5 ) 另外,則彡_砂子聚合物複合材mt以其他任 何碳纖維膽的複合材料顯觀高的導熱率。 此外’所迫蘭_分子聚合物複合簡比其他用於 熱管理的複合材料具有更低的密度。 此问为子尔口物複合材料可用於許多熱管理應用 上包Q舟几二器具、太空船、電子元件以及可攜式電子 產品。 基於此,本發明的一特徵是,提供由交織的VGCF 摘形細㈤分子聚合物複合材料,此高分子聚合物複 合材料浦高導_、_舰及可改__脹讎。 =發明^另-㈣是提供_符合成本效益的施,以生產 逍樣的问分子聚合物複合材料。熟悉本項技術者,在閱讀 以下詳細說明並參考_圖式與帽專利範醜,將淸楚 了解本發明的這些與其他特點與優點。 圖式之簡單說明 圖1A係爲一顯微照片,其例示本發明的 VGCF 墊, 以顯示VGCF的方向; 圖2A圖示具有單一方向纖維的堆疊架構; 圖2B圖示具有同平面正交纖維的堆疊架構; 圖3A係爲本發明之模具打開時的示意圖,高分子聚 合物材料放在模具的底部;574283 V. Description of the invention (5) In addition, the 砂 _sand polymer composite material mt has a significantly higher thermal conductivity than any other carbon fiber composite material. In addition, the forced blue molecular polymer composite has a lower density than other composite materials for thermal management. This composite material can be used in many thermal management applications, including Q-boat appliances, spacecraft, electronic components, and portable electronics. Based on this, a feature of the present invention is to provide a fine-molecular-molecular polymer composite material made of interlaced VGCF, and the polymer-polymer composite material is Pogoconductor, and can be modified. = Invention ^ Another-㈣ is a cost-effective application for the production of quasi-molecular polymer composites. Those familiar with this technology will have a clear understanding of these and other features and advantages of the present invention after reading the following detailed description and referring to the drawings and cap patents. Brief description of the drawings FIG. 1A is a photomicrograph illustrating the VGCF pad of the present invention to show the direction of the VGCF; FIG. 2A illustrates a stacking structure with unidirectional fibers; FIG. 2B illustrates an orthogonal fiber with the same plane Figure 3A is a schematic diagram when the mold of the present invention is opened, and the polymer material is placed on the bottom of the mold;

圖3B係爲本發明之模具打開時的示意圖,高分子聚 口物材料放在模具的底部,高分子聚合物材料上有VGCF 4NCKU/2〇〇i〇!xw ς 本紙張尺度適用中國國家標準(CNS)A4規格⑽χ 297公愛) 先 閱 讀 背 面 之 注 意 事 項遽 再I I i 頁 訂 線 經濟部智慧財產局員工消費合作社印製 574283 A7 五、發明說明(L) 墊的堆疊;以及 圖3C係爲本發明之模具打開時的示意圖,高分子聚 (請先閱讀背面之注意事項再填寫本頁)Figure 3B is a schematic diagram of the mold when the present invention is opened. The polymer aggregate material is placed on the bottom of the mold. The polymer material is VGCF 4NCKU / 2〇〇〇〇xw. The paper size is applicable to Chinese national standards. (CNS) A4 specification ⑽χ 297 public love) Read the precautions on the back first, and then ii. Page ii Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by employee consumer cooperatives 574283 A7 5. Description of the invention (L) Stacking of pads; and Figure 3C series This is a schematic diagram when the mold of the present invention is opened, polymer polymer (please read the precautions on the back before filling this page)

合物材料放在模具的底部,高分子聚合物材料上有VGCF 墊的堆疊,而VGCF墊的堆疊上還有另一層高分子聚合物 材料。 胃曰月之詳細說明 本發明之以氣相成長碳纖維加強的基體複合材料,相 較於使用其他基體材料,如鋁,或使用其他強化材料,如 傳統碳纖維的複合材料,可提供更多的有利條件。舉例來 說,處理高分子聚合物需要溫度很低,也不需要保護的環 境與較低的壓力或高壓力。此外,VGCF墊堆疊的使用免 $了預成形的製作。還有,VGCF墊具有所有碳纖維中最 高的導熱率,也使得所形成的複合材料具有高導熱率。此 外,其他的碳纖維在使用於複合材料之前,必須以機械方 式交織,而本發明的VGCF墊是由半連續的纖維所組成, 在現場成長時即已交織,不需成長後再另行交織。 經濟部智慧財產局員工消費合作社印製 據此,本發明的高分子聚合物複合材料的生產成本遠 低於傳統複合材料的成本生產。高分子聚合物複合材料包 含由石墨化VGCF交織墊所構成的堆疊。吾人應該了解此 複合材料可以依據其最後的用途而具有不同的形狀。 這些VGCF墊係由半排列、半連續的Vgcf構成,如 Ξ所7^在墊中,大部分的纖維具有相同的排列方向, 然而會有一些會呈現不同程度的方向排列性 4NCKU/2001 〇 1 xw 本紙張尺度適用中國國家標準(CNS)A4 ϋ〇 x 297公釐) 574283 A7 B7 五、發明說明(〇 〈mis-orientation or mis-aiignment〉。墊中纖維的排列方向 與編織可以藉由纖維成長時氣體流動條件而控制之。 吾人應當了解堆疊中之VGCF墊的數量可依照想要的 複合材料尺寸與最終用途而作改變。個別VGCF墊的尺寸 也可依照需要作修改。 VGCF塾較佳係成長於一基板上,此基板事先已經佈 好鐵顆粒〈iron particle〉所構成的晶種〈seed〉,或者基板 會放置於接近一佈滿鐵晶種的基板。此基板放置於一反應 器中,並在lGGGt:随度下,引人碳缝合物與氫氣的流 動氣體混合物。此職化合物雛是曱㉖〈編^〉。在 成長過程巾,__雜妓叉嶋顚線〈价議^〉 之方向成長而交織。結果_在成長過程中變厚,造成交 織纖維間相互連接,因而形成纖維墊。 種方=:鈍性氣氛中,以贿的溫度熱處理以此 VGC^馳’以將其石墨化。將碰化的交織 跑圖2Β所——料數量以形成—端®,如圖2Α 與圖2Β所不。其中圖2Δ阳 2八與2Β分別代袠單〜 架構與同平面正交纖維架樽。 力向的纖維 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 高分子聚合物複合材料的製作可 此程序包驗置想題_ j方式兀成 模具中,如圖3A所示。接::子:=物材料到-打開的 子聚合物材料的上方,數量纖維墊到高分 有適當尺寸且亘有L1 所示,其中所有纖維墊具 ====;纖維排列方向。然後再添加-次 抓口物材料到前述VGCF塾堆The composite material is placed on the bottom of the mold. There is a stack of VGCF pads on the polymer material, and there is another layer of polymer material on the stack of VGCF pads. Detailed description of the stomach month The matrix composite material reinforced with vapor-grown carbon fibers according to the present invention can provide more advantages than the use of other matrix materials, such as aluminum, or the use of other reinforcing materials, such as traditional carbon fiber composite materials condition. For example, processing polymers requires very low temperatures and does not require a protected environment and lower or high pressure. In addition, the use of VGCF pad stacks eliminates the need for preform fabrication. In addition, the VGCF pad has the highest thermal conductivity of all carbon fibers, which also results in a composite material with high thermal conductivity. In addition, other carbon fibers must be interwoven mechanically before being used in composite materials. The VGCF mat of the present invention is composed of semi-continuous fibers, which have been interwoven when growing on site, and do not need to be interwoven after growing. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs According to this, the production cost of the polymer composite material of the present invention is much lower than the cost production of traditional composite materials. The polymer composite contains a stack of graphitized VGCF interwoven mats. I should understand that this composite can have different shapes depending on its final use. These VGCF mats are composed of semi-aligned and semi-continuous Vgcf. As shown in Figure 7 ^ in the mat, most of the fibers have the same alignment direction, but some will show different degrees of alignment. 4NCKU / 2001 〇1 xw This paper size applies Chinese National Standard (CNS) A4 ϋ〇x 297 mm) 574283 A7 B7 V. Description of the invention (〇 <mis-orientation or mis-aiignment>. The arrangement direction and weaving of the fibers in the mat can be determined by the fibers The gas flow conditions are controlled during growth. I should understand that the number of VGCF pads in the stack can be changed according to the desired composite material size and end use. The size of individual VGCF pads can also be modified as needed. VGCF 塾 Better It is grown on a substrate, which has been seeded with seed particles composed of iron particles, or the substrate will be placed near a substrate full of iron seeds. The substrate is placed in a reactor. In, and under 1GGGt: the flowing gas mixture of carbon sutures and hydrogen attracts people with the degree of instability. The young compound of this post is 曱 ㉖ <Edit ^>. During the growth process, __ 杂 AKE The squall line <price bargaining> grows and interweaves. Result_ During the growth process, the intertwined fibers are thickened, which results in the formation of fiber mats. Seed prescription: In a blunt atmosphere, heat treatment with bribe temperature VGC is used to graphitize it. The interweaving will be run as shown in Figure 2B-the number of materials to form-end ®, as shown in Figure 2A and Figure 2B. Among them, Figure 2Δ Yang 28 and 2B respectively replace the list. ~ The structure and the same plane orthogonal fiber rack bottle. Lixiang's Ministry of Fiber Economy, Intellectual Property Bureau, employees, consumer cooperatives, printed polymer polymer composites can be tested with this package. As shown in Fig. 3A. Then :: Sub: = material material-to the top of the opened sub-polymer material, the number of fiber pads to the high score has the appropriate size and is indicated by L1, where all fiber pads ====; Fiber alignment direction. Then add the secondary gripper material to the aforementioned VGCF stack

4NCKU/200101TW 574283 A74NCKU / 200101TW 574283 A7

五、發明說明(g) 經濟部智慧財產局員工消費合作社印製 然後以一模具壓蓋,將具有三明治般高分子聚合物材料_ 堆疊··高分子聚合物材料的模具蓋上,並將其加熱到比此高 分子聚合物材料之熔點更高的溫度。當溫度到達時,對模 具壓蓋施加一正向力,使得熔融的高分子聚合物材料滲透 入VGCF墊的空隙中。此正向力較佳約在〗大氣壓到7〇 大氣壓的範圍內。吾人應該了解滲透入所需的壓力與溫 度,可以依照所使用的特定高分子聚合物材料與堆疊的特 性而改變。接著,將模具冷卻,高分子聚合物材料也隨之 再次固化〈re-solidifies〉。而後將高分子聚合物基體從模 具中取出。 吾人應該注意堆疊的順序是可以改變的。此高分子聚 合物材料與石墨化VGCF墊亦可以以每一 VGcf墊插入兩 層高分子聚合物材料的方式放入模具中。任何可以使高分 子聚合物材料在墊中均勻分佈的堆疊順序皆爲本發明所意 圖保護的範疇。 若欲生產較厚的高分子聚合物複合材料,在加熱並加 壓此模具與其內含物之前,此堆疊程序可以執行不只一次。 所造.成的高分子聚合物複合材料可具有約爲 400-700W/m-K之間的導熱率。本發明的高分子聚合物複 合材料特別適合使用於電子元件與封裝、航空器具、太空 船以及可攜式電子產品上。 以下例子係爲了例示本發明’不應當認爲有限制隨附 申請專利範圍的作用。 4NCKU/200101TW 8 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) (請先閱讀背面之注意事項再填寫本頁) -I ϋ n ϋ· ϋ 1 , ·ϋ —ϋ ϋ I * 574283 A7 B7 五、發明說明( 實施例1 現在依照本發明製備環氧樹酯〈Epoxy resin〉基體複 合材料。首先,成長VGCF墊並將其從反應器中移出。接 著以2600°C的溫度,在氬氣氣氛中熱處理〈石墨化〉此 VGCF墊。從已經石墨化的、大塊的VGCF墊上切出尺寸 較小之5公分乘10公分見方的的小VGCF墊,並以此小 VGCF墊形成堆疊。然後將此堆疊放入一模具中,而此模 具中已經預先裝載想要數量的環氧樹酯。接著於此VGCF 塾堆疊的上方再加上環氧樹酯,如圖3C所示。然後關閉 此此模具並將之加熱到l8〇°c。當溫度到達時,施加i大 氣壓到70大氣壓的壓力於模具,使得環氧樹酯開始滲透入 VGCF墊的空隙中。而後冷卻此模具,從模具中取出形成 的環氧樹酯基體複合材料。 根據此方法形成七種複合材料。結果表列於表1中。 由表1可見’ VGCF墊的使用大大地增加環氧樹酯的導熱 率’其中環氧樹酯原本的導熱率低於〇1 w/m_K。藉由使 用少於14纖維體積百分比的VGCF,環氧樹酯的導熱率相 較於純環氧樹酯增長了 200,000%。 (請先閱讀背面之注意事β 填寫本頁) -裝 訂: 經 濟 部 智 慧 財 產 局 消 費 合 作 社 印 製V. Description of the invention (g) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and then covered with a mold to cover the mold with sandwich-like polymer materials Heating to a temperature higher than the melting point of the polymer material. When the temperature is reached, a positive force is applied to the mold gland to allow the molten polymer material to penetrate into the voids of the VGCF pad. This forward force is preferably in the range of about atmospheric pressure to about 70 atmospheres. I should understand that the pressure and temperature required for infiltration can vary depending on the specific high-molecular polymer materials and stack characteristics used. Then, the mold is cooled, and the polymer material is re-solidified. The polymer matrix is then removed from the mold. I should note that the order of stacking can be changed. This polymer material and graphitized VGCF pad can also be inserted into the mold with each VGcf pad inserted into two layers of polymer material. Any stacking order that allows the high molecular polymer material to be evenly distributed in the mat is within the scope of the present invention. For thicker polymer composites, this stacking process can be performed more than once before heating and pressing the mold and its contents. The resulting polymer composite material may have a thermal conductivity between about 400-700 W / m-K. The polymer composite material of the present invention is particularly suitable for use in electronic components and packaging, aviation appliances, spacecraft, and portable electronic products. The following examples are intended to illustrate the invention &apos; and should not be considered as limiting the scope of the accompanying patent application. 4NCKU / 200101TW 8 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back before filling this page) -I ϋ n ϋ · ϋ 1 I * 574283 A7 B7 V. Description of the invention (Example 1 Now an epoxy resin (Epoxy resin) matrix composite is prepared in accordance with the present invention. First, a VGCF mat is grown and removed from the reactor. Then at 2600 ° C Temperature, heat treat <graphitization> this VGCF pad in an argon atmosphere. Cut a small VGCF pad with a size of 5 cm by 10 cm square from a graphitized, large VGCF pad, and use this small VGCF The mats form a stack. This stack is then placed in a mold that has been pre-loaded with the desired amount of epoxy resin. Then epoxy resin is added on top of this VGCF 塾 stack, as shown in Figure 3C The mold is then closed and heated to 180 ° C. When the temperature is reached, a pressure of i atmosphere to 70 atmospheres is applied to the mold, so that the epoxy resin begins to penetrate into the voids of the VGCF pad. Then cool this Mold, remove the shape from the mold Epoxy resin matrix composite material. Seven composite materials were formed according to this method. The results are listed in Table 1. It can be seen from Table 1 that the use of VGCF pads greatly increases the thermal conductivity of epoxy resins, among which epoxy resins The original thermal conductivity of the ester is lower than 〇1 w / m_K. By using less than 14 fiber volume percentage of VGCF, the thermal conductivity of epoxy resin has increased by 200,000% compared to pure epoxy resin. (Please read the back first Notes (Fill in this page)-Binding: Printed by Consumer Cooperatives, Bureau of Intellectual Property, Ministry of Economic Affairs

4NCKU/200101TW 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公釐) 574283 A7 B7 五、發明說明(\0 ) 架構 密度 (g/cc) &amp;隙度 導熱率 (W/m.K) -5^ 熱膨脹係數 (ppm/K)4NCKU / 200101TW This paper size is applicable to Chinese National Standard (CNS) A4 specification (21〇X 297 mm) 574283 A7 B7 V. Description of the invention (\ 0) Architecture density (g / cc) &amp; Gap thermal conductivity (W / mK) -5 ^ Thermal expansion coefficient (ppm / K)

(請先閲讀背面之注意事 經濟部智慧財產局員工消費合作社印製(Please read the notes on the back first, printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

.在表1中,X代表主要纖維方向〈the primary ―〉,而Y代表同平面上垂直X的方向。Vf代表 VG—CF的體積比率。1D與扣分別代表一維〈單一方向〉 與二維〈平面正交〉。 請注意此高分子聚合物複合材料的密度約在!·2到 其驗_職5,814,彻號中纏複合 低的密度意謂著較低的重量,這項特 徵對-般可_式赌皆較爲有利。 雖然在上述實施例中,我們採子聚合物材料,在 他古分子頭㈣亦會淸楚了解在本發明範疇中其 =:=Γ料的選用也是可行的。所有例示的實施 說明本發明。熟悉本項技術者將淸楚了 t在不脫離申請專利麵所界定範疇的前提下,可以對 本發明麵之方法簡料繼多轉_改與變化。 4NCKU/200101TW ^紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公釐 填寫本頁) -裝 · 10In Table 1, X represents the primary fiber direction <the primary ―>, and Y represents the direction perpendicular to X on the same plane. Vf represents the volume ratio of VG-CF. 1D and buckle respectively represent one-dimensional (single direction) and two-dimensional (plane orthogonal). Please note that the density of this polymer composite is about! · 2 to its inspection position 5,814, the number of medium-wound composite low density means lower weight, this feature is more favorable for -like-style gambling. Although in the above embodiments, we use sub-polymer materials, we will also understand that the selection of === Γ materials in the scope of the present invention is also feasible. All illustrated implementations illustrate the invention. Those skilled in the art will understand that without departing from the scope defined by the patent application, the method of the present invention can be modified and changed. 4NCKU / 200101TW ^ Paper size applies to China National Standard (CNS) A4 specification (21〇 X 297mm Fill out this page)-Pack · 10

Claims (1)

574283; X2 本 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 申請專利範圍 1. 一種高分子聚合物複合材料包含: 至少一石墨化氣相成長碳纖維墊,該石墨化氣相成長碳纖 維墊中具有空隙;以及 一高分子聚合物材料; 其中該高分子聚合物材料滲透入該石墨化氣相成長碳纖維 墊的該空隙中。 2. 如申請專利範圍第1項所述之高分子聚合物複合材 料,其中該石墨化氣相成長碳纖維係於成長中現場 〈in-situ〉交織。 3. 如申請專利範圍第1項所述之高分子聚合物複合材 料,其中該石墨化氣相成長碳纖維在室溫下具有高於 1500W/m-K的導熱率。 4. 如申請專利範圍第1項所述之高分子聚合物複合材料 具有高於400W/m-K的導熱率。 5. 如申請專利範圍第1項所述之高分子聚合物複合材 料,其中該石墨化氣相成長碳纖維至少部分是半排列、半 連續的以形成該石墨化氣相成長碳纖維墊。 6. 如申請專利範圍第1項所述之高分子聚合物複合材 料,其中該石墨化氣相成長碳纖維係以高於260(TC的溫度 熱處理而石墨化。 7. —種方法,供製造一種高分子聚合物複合材料,該方法 4NCKU/200101TW 11 請 先 閲 之 注 I 頁 裝 訂 線 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 574283 A8 B8 C8 D8 六、申請專利範圍 包含下列步驟: 提供至少一石墨化氣相成長碳纖維墊,該石墨化氣相成長 碳纖維墊中具有空隙;以及 於高於一高分子聚合物材料之熔點的溫度下,以該高分子 聚合物材料滲透入該空隙中。 8. 如申請專利範圍第7項所述之方法,其中該石墨化氣相 成長碳纖維係於成長中現場交織。 9. 如申請專利範圍第7項所述之方法,其中該石墨化氣相 成長碳纖維至少係部分半排列、半連續的。 10. 如申請專利範圍第7項所述之方法,其中以該高分子聚 合物材料滲透入該空隙中的步驟進一部包含下列步驟: 將該石墨化氣相成長碳纖維墊放置於預先裝載該高分子聚 合物材料的一模具中; 添加該高分子聚合物材料於該模具中的該石墨化氣相成長 碳纖維墊上; 以一模具壓蓋將該模具蓋上; 經濟部智慧財產局員工消費合作社印製 將該蓋上的模具加熱到高於該高分子聚合物材料熔點的溫 .度;以及 對該模具壓蓋施加以正向力。 4NCKU/200101TW 12 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)574283; X2 A8 B8 C8 D8 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to apply for patents 1. A polymer polymer composite material includes: at least one graphitized vapor-grown carbon fiber mat, the graphitized vapor-grown carbon fiber mat There are voids therein; and a high molecular polymer material; wherein the high molecular polymer material penetrates into the voids of the graphitized vapor-grown carbon fiber mat. 2. The high-molecular polymer composite material as described in item 1 of the scope of the patent application, wherein the graphitized vapor-grown carbon fibers are interwoven at the growing site <in-situ>. 3. The high-molecular polymer composite material according to item 1 of the scope of patent application, wherein the graphitized vapor-grown carbon fiber has a thermal conductivity higher than 1500 W / m-K at room temperature. 4. The high molecular polymer composite material described in item 1 of the patent application scope has a thermal conductivity higher than 400W / m-K. 5. The high-molecular polymer composite material according to item 1 of the patent application scope, wherein the graphitized vapor-grown carbon fiber is at least partially semi-aligned and semi-continuous to form the graphitized vapor-grown carbon fiber mat. 6. The high molecular polymer composite material according to item 1 of the scope of patent application, wherein the graphitized vapor-grown carbon fiber is graphitized at a temperature higher than 260 ° C. 7. A method for manufacturing a High polymer composite materials, this method 4NCKU / 200101TW 11 Please read the first note. I Page gutter. The paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) 574283 A8 B8 C8 D8. 6. The scope of patent application includes The following steps: Provide at least one graphitized vapor-grown carbon fiber mat with voids therein; and infiltrate with the polymer polymer material at a temperature higher than the melting point of a polymer polymer material Into the gap. 8. The method according to item 7 in the scope of the patent application, wherein the graphitized vapor-grown carbon fibers are interwoven in the field during growth. 9. The method according to item 7 in the scope of patent application, wherein the Graphitized vapor-grown carbon fibers are at least partially semi-aligned and semi-continuous. 10. The method as described in item 7 of the scope of patent application, wherein The step of infiltrating the macromolecular polymer material into the void further includes the following steps: placing the graphitized vapor-grown carbon fiber mat in a mold previously loaded with the macromolecular polymer material; adding the macromolecular polymer material On the graphitized vapor-grown carbon fiber mat in the mold; cover the mold with a mold gland; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the mold on the cover is heated higher than the polymer The temperature and temperature of the melting point of the material; and a positive force is applied to the mold gland. 4NCKU / 200101TW 12 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)
TW90117647A 2001-07-19 2001-07-19 Super high thermal conductive polymer matrix composite and method for making the same. TW574283B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10225953B2 (en) 2014-10-31 2019-03-05 Thermal Corp. Vehicle thermal management system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10225953B2 (en) 2014-10-31 2019-03-05 Thermal Corp. Vehicle thermal management system
US10932392B2 (en) 2014-10-31 2021-02-23 Aavid Thermal Corp. Vehicle thermal management system

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